13. SPARE PARTS LIST..................................................................................
13. SPARE PARTS LIST..................................................................................
……………. 13
49
50
54
Page 2
1.SAFETY PRICAUTIONS
1.1 GENERAL GUIDELINES
1.When servicing,observe the original lead dress.ifa short circuit is found,replace all parts which have
been overheated or damaged by the short circuit.
2.After servicing,see to it that all the protective devices such as insulation bamiers,insulation papers
shields are properly installed.
3.After servicing,make the following leakage current checks to prevent the customer from being exposed
to thock hazards.
2.PREVENTION OF ELECTRO STATIC DISCHARGE(ESD) TO ELECTROSTATECALLY
SENSITIVE(ES) DEVICES
Some semiconductor(solid state)devices can be damaged easily by static electricity.Such components
commonly are called Electrostatically Sensitive(ES)Devices.Examples of typical ES devices are integrated
circuits and some field-effect transistorsand semiconductor chip components.The following techniques
should be used to help reduce the incidence of component damage caused by electro static discharge(ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly,drain
off any ESDon your body by touching a known earth ground.Alteatively,obtain and wear a commercially
availabel discharging ESD wrist strap,which should be removed for potential shock reasons prior to
applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices,place the assembly on a conductive
surface such as alminum foil,to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder removal device.Some solder removal devices not classified as anti-static
(ESD protected)can generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals.These can generate electrical charges sufficient to damage ES
devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are
ready to install if.(Most replacement ES devices are packaged with leads electrically shorted together by
conductive foam,alminum foil or comparable conductive material).
7.Immediately before removing the protective material from the leads of a aeplacement ES device,touch
the protective material to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit,and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices.(Otherwise hamless motion
such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can
generate static electricity(ESD)
notice (1885x323x2 tiff)
1
Page 3
3. Precaution of L aster Diode
2
Page 4
4.General Description
4.1 Compatible Disc Types
S
Page 5
4.2
Page 6
5.PREVERTION OF STATIC ELECTRICITY DISCHARGE
The laser diode in the traverse unit (optical pickup)may brake down due to static electricity of clothes or human body.
Some devices such as the DVD player use the optical pickup(laser diode)and the optical pickup will be damaged by
static electricity in the working environment.Proceed servicing works under the working environment where grounding
1.Put a conductive material(sheet)or iron sheet on the area where the optical pickup is placed,and ground the sheeet.
3.The flexible cable may be cut off if an excessive force is applied to it.Use caution when handling the cable.
Use due caution to electrostatic breakdown when servicing and handling the laser diode.
5.1.Grounding for electrostatic breakdown prevention
works is completed.
5.1.1. Worktable grounding
5.1.2.Human body grounding
1 Use the anti-static wrist strap to discharge the static electricity form your body.
safety_3 (1577x409x2 tiff)
5.1.3.Handing of optical pickup
1.To keep the good quality of the optical pickup maintenance parts during transportation and before
installation,the both ends of the laser diode are short-circuited.After replacing the parts with new ones,
remove the short circuit according to the correct procedure.(See this Technical Guide).
2.Do not use a tester to check the laser diode for the optical pickup .Failure to do so willdamage the laser
diode due to the power supply in the tester.
5.2.Handing precautions for Traverse Unit (Optical Pickup)
1.Do not give a considerable shock to the traverse unit(optical pickup)as it has an extremely high-precise
structure.
2.When replacing the optical pickup,install the flexible cable and cut is short land with a nipper.See the
optical pickup replacement procedure in this Technical Guide.Before replacing the traverse unit,remove
the short pin for preventingstatic electricity and install a new unit.Connect the connector as short times as
possible.
4.The half-fixed resistor for laser power adjustment cannot be adjusted.Do not turn the resistor.
5
Page 7
6.ASSEMBLING AND DISASSENBLING THE MECHANISM UNIT
6
6.1Disassembly Procedure
6.2 Terminal P.C.B.
1.Unscrew the screws.
2.Remove the solders.
3.Remove the connectors
5
Page 8
6.3 Clamp Plate Unit
7
1.Spread the stopper with hand to silde the tabs and remove the clamp plate unit.
6.4 Tray
1.Lift the tray.
6
Page 9
6.5 Traverse Block
8
1.Lift the traverse block while spreading the hook of the mechanical chassis chassis unit.
2.Disengage the tabs from the holes of the mechanical chassis unit.
6.6. Traverse Gear
1.Disengage the tabs from the traverse gear
2.Remove the traverse gears B and C.
7
Page 10
5.6 Mechanism Unit
9
1.Unscrew the screws.
2.Remove the connectors.
6.7. Optical Pickup Unit
1. Unscrew the screws.
5.7 Terninal P.C.B.
2.Remove the spring holders and the springs.
3.Pull out of the drive shaft and guide shaft.
1.Unscrew the screws
2.Remove the solders.
3.Remove the connectors.
6.7.1. Precautions in optical pickup replacement
Page 11
The optical pickup can be damaged by static electricity from you body.Be sure to take static electricity countermeasures
when working around the optical pickup.(Refer to the related page in this Manual about the countermeasures.
3.The use of soldering iron with anti-static feature is recommended when providing short-circuit to laser diode or when
-When using the soldering iron without anti-static feature,short-circuit the flexible cable terminal with a clip before
-After intended repair is finished.remove the solder for short-circuit of laser diode in a correct way following the
procedures described in this Manual.
short-circuiting the land.
10
1.Do not touch laser diode,actuator and their peripheries.
2.Do not use tester to check laser diode.(Laser diode can be damaged easily.)
removing it.
4.Solder the land on flexible cable of optical pickup unit.
Page 12
6.8. Disassenbling the Middle Chassis
11
1.Remove the holders pins.
2.Remove the tab.
3.It lifts while pulling it in the direction of the arrow.
6.9. Disassenbling the Traverse Gear A
1.Remove the traverse gear A.
Page 13
7. Electrical Confirmation
6.10. Disassembling the Sprindle Motor Unit
1.Remove the floating rubbers.
7.1. Video Output (Luminance Signal) Confirmation
DO this confirmation after replacing a P.C.B.
Measurement point
ModeDisc
Color bar 75%
Video output terminal
PLAY(Title 46):DVDT-S15
PLAY(Title 12):DVDT-S01
Measuring equipment,tools
200mV/dir,10sec/dir
Confirmation value
1000mVp-p±30mV
Purpose:To maintain video signal output compatibility.
1.Connect the oscilloscope to the video output terminal and terminate at 75 ohms.
2.Confirm that luminance signal(Y+S)level is 1000mVp-p±30mV
DVDT-S15
or
DVDT-S01
12
Page 14
7.2. Video Output (Chrominance Signal) Confirmation
Screwdriver,Oscilloscope
13
Do the confirmation after replacing P.C.B.
Measurement point
ModeDisc
Color bar 75%
Video output terminal
PLAY(Title 46):DVDT-S15
PLAY(Title 12):DVDT-S01
Measuring equipment,toolsConfirmation value
200mV/dir,10sec/dir
621mVp-p±30mV
Purpose:To maintain video signal output compatibility.
1.Connect the oscilloscope to the video output terminal and terminate at 75 ohme.
2.Confirm that the chrominance signal(C)level is 621 mVp-p±30mV
DVDT-S15
or
DVDT-S01
Page 15
8. MPEG BOARD CHECK WAVEFORM
1.X204 WAVEFORM DIAGRAM
2.ZIVA-4.1 PIN.173/STRMCS WAVEFORM
14
Page 16
3.IC5L0380R PIN.2 WAVEFORM DIAGRAM
4.VIDEO OUPUT WAVEFORM DIAGRAM
15
Page 17
5.ZIVA-4.1PIN.172/DVDREQ WAVEFORM DIAGRAM
16
Page 18
Loader
IC U217 ZIVA-4.1
1 Typical ZiVA-4.1 DVD Decoder Application
9. IC BLOCK DIAGRAM & DESCRIPTION
17
SDRAM
Video Out
Front-End
Chip Set
ZiVA-4.1
ROM
Host
RAM
2General Description
The ZiVA-4.1 DVD Decoder is the fourth generation in
C-Cube’s ZiVA family of highly integrated, high-performance
DVD decoders for the consumer DVD player market.
The ZiVA-4.1 maintains the same high-level application program interface (API) as earlier decoders. Therefore, system
host code developed for previous products is fully compatible with the ZiVA-4.1 API. This compatibility preserves software investment in designs and will be maintained in future
generations of the decoder family. Figure 2 shows the data
flow of the ZiVA-4.1 Decoder.
Digital Audio Input
2/6/2+6 Channel
Audio DAC
2/6/2+6
Channel
Out
0220c
SDRAM
Interface
Host
Interface
DVD/CD
Interface
Memory
Controller
Host
Interface
Control Logic
SecureView
CSS
Descrambling
Bus Key
Authentication
(optional)
Program
Stream
Decoder
OSD
Decoder
Subpicture
Decoder
MPEG Video
Decoder
CD-DA and LPCM
Decoder
Dolby Digital Audio
Decoder
MPEG Audio
Decoder
Figure 2ZiVA-4.1 DVD Decoder Data Flow Diagram
Video
Mixer
Audio
DSP
Digital Audio Input
Digital
Video
Encoder
Digital
Audio
Interface
Video
Out
Audio
Interface
0221d
Page 19
A_VSS
3 Pin Descriptions
The ZiVA-4.1 decoder is packaged in a 208-pin Plastic Quad Flat Pack (PQFP) package. Figure 3 shows the
lists the pin number, pin name, and I/O voltage and I/O type.
Note: The ZiVA-4.1 core operates at 2.5V ± 10%. Most I/O interface pins can be interfa ced with 3.3-V or 5-V devices depending on the voltage appli ed to the VDD pins associated
with them. Refer to the Application Note for more information.
Table 2 provides the pin name, pin number, type, and description of each signal.
Table 2ZiVA-4.1 DVD Pin Descriptions
NamePin No. Ty p e
RESET5IActive Low Reset. Assert for at least 5-milliseconds in the presence of clock to
SYSCLK158IOptional System Clock. Tie to A_VDD through a 1K Ohm resistor
CLKSEL79ISelects SYSCLK or VCLK as clock source. Normal operation is to tie HIGH.
VCLK159ISystem clock that drives internal PLLs and internal DENC. ZiVA-4 requires an
123, 167, 175, 177, 192, 204
VDD_2.513, 36, 67, 87, 128, 189Power2.5-V supply voltage for core logic
VDD_VIDEO135, 141, 147, 153Power3.3-V Analog Video Power
VDD_DAC134, 140, 146, 152PowerAnalog Video DAC Power
A_VDD160Power3.3-V Analog PLL Power
VDD_RREF156Power3.3V Analog Video Power
VSS6, 14, 19, 31, 37, 44, 56, 65, 68, 75, 83, 88,
Power and Grounds
VSS_VIDEO132, 138, 144, 150GroundAnalog Video Ground
VSS_DAC149, 143, 137, 131GroundAnalog Video DAC Ground
A_VSS157GroundAnalog PLL Ground
VSS_RREF154GroundVideo Analog Ground
93, 101, 116, 124, 129, 166, 178, 188, 191,
ADV
198, 205
1
reset the entire chip
Description
NCE
A
external 27-MHz TTL oscillator.
ONo connect.
ITie to VSS or VDD_3.3 as specified in Table 1.
Power3.3-V supply voltage for I/O signals.
GroundGround for core logic and I/O signals
Page 23
Table 2ZiVA-4.1 DVD Pin Descriptions (Continued)
IC BLOCK DIAGRAM & DESCRIPTION
22
NamePin No. Ty p e
CS 208IHost chip select. Host asserts CS to select the decoder for a read or write oper-
HADDR[2:0]184-182IHost addr ess bus. 3-bit address bus selects one of eight host interface registers.
HDATA[7:0]197, 199-203, 206, 207I/OHDATA[7:0] is the 8-bit bi-directional host data bus through which the host
8 O, OD, PUHost interrupt. Open drain signal, must be pulled-up via 4.7kΩ to 3.3 volts.
INT
1IRead strobe in I mode. Must be held HIGH in M Mode.
RD
Host Interface
2IRead/write strobe in M mode. Write strobe in I mode. Host asserts R/W LOW
R/W
WAIT
DVD-DATA7/CDG-SCLK170IDVD parallel compressed da ta from DVD DSP. Or CD+G (Subcode) Clock indicat-
DVD-DATA6/CDG-S0S1169DVD pa rallel compressed data from DVD DSP. Or CD+G (Subcode) Block Sync
DVD-DATA5/CDG-VFSY168DVD parallel compressed dat a from DVD DSP. Or CD+G (Subcode) Frame Sync
DVD-DATA4/CDG-SDATA165DVD parallel compressed data from DVD DSP. Or CD+G (Subcode) data indicat-
DVD-DATA3/CD-C2P0164IAsserted HIGH indicates a corrupted byte. Decoder keeps the previous valid pic-
DVD-DATA2/CD-BCK163ICD bit clock. Decoder accept multiple BCK rates. This pin is shared with DVD
DVD-DATA1/CD-LRCK162IProgrammable polarity 16-bit word synchronization to the decoder (right chan-
DVD-DATA0/CD-DATA161ISerial CD data. This pin is shared with DVD compressed data DVD-DATA0.
ERROR 174IError in input data. If ERROR signal is not available from the DSP it must be
Parallel DVD/CD or Serial CD Interface
VDACK171I In synchr onous mode, bitstream data ackn owledge. Asserted when DVD dat a is
VREQUEST172O Bitstream request. Decoder asserts VREQUEST to indicate that the bitstream
VSTROBE173I Bitstream strobe. Programmable dual mode pulse. Asynchronous and synchro-
ation. The falling edge of this signal triggers the read or write operation.
writes data to the decoder Code FIFO. MSB of the 32-bit word is written first.
The host also reads and writes the decoder internal registers and local
SDRAM/ROM via HDATA[7:0].
Driven high for 10 ns before tristate.
to select Write and LOW to select Read for M Mode only.
transfer is not complete. WAIT
serted when decoder is ready to complete transfer cycle. Open drain signal,
must be pulled-up via 1kΩ to 3.3 volts. Driven high for 10 ns before tristate.
ing subcode data clock input or output.
indicating block-start synchronization input.
indicating frame-start or composite synchronization input.
ing serial subcode data input.
NCE
ture on-screen until the next valid picture is decoded. This pin is shared with
A
DVD compressed data DVD-DATA3.
compressed data DVD-DATA2.
nel HIGH). This pin is shared with DVD compressed data DVD-DATA1.
grounded.
valid. Polarity is programmable.
input buffer has available space. Polarity is programmable.
nous. In Asynchronous mode, an external source pulses VSTROBE to indicate
data is ready for transfer. In synchronous mode, VSTROBE clocks da ta.
(64 Mbits).
Description
is asserted after the falling edge of CS and reas-
Page 24
Table 2ZiVA-4.1 DVD Pin Descriptions (Continued)
IC BLOCK DIAGRAM & DESCRIPTION
23
NamePin No. Ty p e
C/R/V151Analog ODAC video output format. Macrovision encoded.
Y/B/U145Analog ODAC video output format. Macrovision encoded.
CVBS/G/Y139Analog ODAC video output format. Macrovision encoded.
CVBS + sync133Analog ODAC video output format: Composite + sync. Macrovision encoded.
RREF155Analog OReference Resistor. Connecting to pin 154 through a 1.18K+/- 1% resistor is rec-
Analog Video Output
VCLK159ISystem clock that drives internal PLLs. ZiVA-4 requires an external 27-MHz TTL
HSYNC 30I/OHorizontal sync. The decoder begins outputting pixel data for a new horizontal
VCLK159IVideo clock. Clocks out data on input. VDATA[7:0]. Clock is typically 27 MHz.
VDATA[7:0]28-21OVideo data bus. Byte serial CbYCrY data synchronous with VCLK. At power-up,
29I/OVertical sync. Bi-directional, the decoder outputs the top border of a new field
VSYNC
Digital Video Output
DA-DATA[3:0]118, 119, 120, 121OPCM Data Out. Eight channels. Serial audio samples relative to DA_BCK and
DA-BCK126OPCM Bit Clock. Divided by 8 from DA_XCK. DA_BCK can be either 48 or 32 times
DA-LRCK122OPCM Left Clock. Identifies the channel for each sample. The polarity is program-
DA-XCK125I/OAudio External Frequency Clock input or output. DA_BCK and DA_LRCK are
Audio Interface
DA-IEC127OPCM data out in IEC-958 format or compressed data out in IEC-1937 format.
DAI-DATA117IPCM data input.
DAI-BCK114IPCM input bit clock.
DAI-LRCK113IPCM left/right clock.
Digital Mic In
1. I - input, O - output, OD - open drain, PU - requires external pull-up resistor.
ADV
1
ommended
oscillator.
line after the falling (active) edge of HSYNC
the decoder does not drive VDATA. During boot-up, the decoder uses configuration parameters to drive or 3-state VDATA.
on the first HSYNC
synchronization or top/bottom field notification from an external source.
(VSYNC
DA_LRCK.
the sampling frequency
mable
NCE
derived from this clock. DA_XCK can be 384 or 256 times the sampling fre-
A
quency
Description
.
after the falling edge of VSYNC. VSYNC can accept vertical
HIGH = bottom field. VSYNC LOW = Top field)
Table 3 lists the pins that have Schmitt Trigger inputs when programmed as inputs.
—Design changes don’t cause pinout changes
—Design changes don’t cause timing changes
•Up to 32 I/Os
—Plus 5 dedicated inputs including 4 clock inputs
• High speed
= 222 MHz
—f
MAX
= 5.0 ns
—t
PD
—t
S
—t
CO
• Product-term clocking
• IEEE 1149.1 JTAG boundary scan
• Programmable slew rate control on individual I/Os
• Low power option on individual logic block basis
• 5V and 3.3V I/O capability
• User-Programmable Bus Hold capabilities on all I/Os
• Simple Timing Model
• PCI compl iant
• Available in 44-Lead TQFP and PLCC pack ages
• Pinout compatible with the CY37032V, CY37064/
CY37064V, CY7C371i
= 3.0 ns
= 4.0 ns
Logic Block Diagram
−
I/O
I/O
0
Pin Configurations
I/O
/TCLK
5
I/O
6
I/O
7
CLK2/I
0
JTAG
EN
GND
CLK0/I
1
I/O
8
I/O
9
I/O
10
I/O
11
44-Lead PLCC (J67)
65 342
7
8
9
10
11
12
13
14
15
16
17
18
19 20222123 2427262825
12
I/O
/TMS
I/O
Clock/
Input
Input
1
4
4
16 I/Os16 I/Os
15
LOGIC
BLOCK
A
36
16
PIM
16
36
LOGIC
BLOCK
16
B
16
Top View
0
31
I/O2GND
I/O3I/O4I/O1I/O
14
CC
V
I/O15I/O
13
CCO
V
1
44
43 424041
16
GND
28
I/O29I/O30I/O
I/O
I/O27/TDI
39
I/O
38
26
I/O
25
37
I/O
24
36
CLK1/I
35
34
33
32
31
30
29
20
I/O
I/O18I/O17I/O
/TDO
19
I/O
GND
I
3
CLK3/I
I/O
23
I/O
22
I/O
21
37032-2
4
2
I/O5/TCLK
I/O
I/O
CLK2/I
JTAG
GND
CLK
I/O
I/O
I/O
I/O
0
44 43 424041 39 38 37353634
1
6
2
3
7
4
0
5
EN
6
/I
7
1
8
8
9
9
10
10
11
11
12
I/O
TDI
TCLK
TMS
4
44-Lead TQFP (A44)
Top
View
0
I/O2GND
I/O3I/O4I/O1I/O
18 19 20222113 14 15171612
14
CC
V
GND
I/O15I/O
/TMS
13
I/O
JTAG Tap
Controller
JTAG
EN
−
I/O
I/O
16
31
CCO
V
16
28
I/O29I/O30I/O31I/O
33
32
31
30
29
28
27
26
25
24
23
37032–3
20
I/O
I/O18I/O17I/O
/TDO
19
I/O
I/O27/TDI
I/O
26
I/O
25
I/O
24
CLK1/I
GND
I
3
CLK3/I
I/O
23
I/O
22
I/O
21
TDO
37032-1
4
2
Selection Guide
CY37032-222CY37032-200CY37032-154CY37032-125
Maximum Propagation Delay, tPD (ns)5.06.07.510
Minimum Set-Up, tS (ns)3.0455.5
Maximu m Cl o ck to O u tp u t, t
T ypic al Supply Current, ICC (mA) in Low Power Mode15151515
Shaded areas contain advance information.
(ns)4.044.56.5
CO
Page 26
Electrical Characteristics
IC BLOCK DIAGRAM & DESCRIPTION
25
Over the Ope rating Range
ParameterDescriptionTes t Condi tionsMin.Typ.Max.Unit
V
V
V
V
V
I
I
OH
OHZ
OL
IH
IL
IX
OZ
Output HIGH VoltageVCC = Min. IOH = –3.2 mA
(Com’l/Ind)
Output HIGH Voltage with Output Disabled
[6]
VCC = Max. IOH = 0 µA (Com’l)
IOH = 0 µA (Ind)
IOH = –50 µA (Com’l)
IOH = –100 µA (Ind)
Output LOW VoltageVCC = Min. IOL = 16 mA (Com’l/Ind)
Input HIGH VoltageGuaranteed Input Logical HI GH v oltage
for all input s
Input LOW VoltageGuaranteed In put Logical LOW voltage
for all input s
[4]
[4]
[2]
[3]
[3]
[3]
[3]
[2]
Input Load CurrentVI = GND OR VCC, Bushold Disabled
Output Leakage CurrentVO = GND or VCC, Output Disabled,
2.4V
4.0V
4.3V
3.6V
3.6V
0.5V
2.0V
−0.5
−10
−50
CCmax
0.8V
10
50
Bushold Disabl ed
I
OZBH
I
OS
I
BHL
Output Leakage CurrentVCC = Max., VO = 3.3V, Output
LMaximum Pin InductanceVIN = 5.0V at f = 1 MHz25nH
Capacitance
[6]
ParameterDescriptionTest ConditionsMax.Unit
C
I/O
C
CLK
Endurance Characteristics
Input/Output Capacit anceVIN = 5.0V at f = 1 MHz at TA = 25°C 8pF
Clock Signal CapacitanceVIN = 5.0V at f = 1 MHz at TA = 25°C12pF
[6]
ParameterDescriptionT est ConditionsMin.Typ.Unit
NMinimum Reprogramm ing CyclesNormal Programming Conditions
Notes:
2. I
= –2 mA, IOL = 2 mA for TDO.
OH
3. When the I/O is output disabled, the bus-hold circuit can weakly pull the I/O to a maximum of 4.0V if no leakage current is allowed. This voltage is lowered
significantly by a small leakage current. Note that all I/Os are output disabled during ISR programming. Refer to the application note “Unde r sta ndi ng B u s Ho ld”
for additional information.
4. These are absolute values with respect to device ground. All overshoots due to system or tester noise are included.
5. Not more than one output should be tested at a time. Duration of the short circuit should not exceed 1 second. V
problems caused by tester ground degradation.
6. Tested initially and after any design or process changes that may aff ect these parameters.
[1]
1,00010,000Cycles
= 0.5V has been chosen to avoid test
OUT
Page 27
2 Megabit (256 K x 8-Bit)
IC BLOCK DIAGRAM & DESCRIPTION
IC U214 Am29F002B/Am29F002NB
26
CMOS 5.0 Volt-only Boot Sector Flash Memory
DISTINCTIVE CHARACTERISTICS
■ Single power supply operation
— 5.0 Volt-only operation for read, erase, and
program operations
— Minimizes system level requirements
■ Manufactured on 0.32 µm process technology
— Compatible with 0.5 µm Am29F002 device
■ High performance
— Access times as fast as 55 ns
■ Low power consumption (typical values at
5 MHz)
— 1 µA standby mode current
— 20 mA read current
— 30 mA program/erase current
■ Flexible sector architecture
— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and
three 64 Kbyte sectors
— Supports full chip erase
— Sector Protecti on features:
A hardware method of locking a sector to
prevent any program or erase operations within
that sector
Sectors can be loc k ed v ia pr ogr ammi ng eq uipme nt
T emporary Sector Unprotect feat ure allows code
changes in previously locked sectors
■ Top or bottom boot block configurations a vaila ble
■ Embe dded Algorithms
— Embedded Erase algorithm automatically
preprograms and erases the entire chip or any
combination of designated sectors
— Embedded Progr am algorithm automatically
writes and verifies data at specified addresses
■ Minimum 1,000,000 write cycle guarantee per
sector
■ 20-year data retention at 125°C
— Reliable operation for the life of the system
■ Package option
— 32-pin PDIP
— 32-pin TSOP
— 32-pin PLCC
■ Compatibility with JEDEC standards
— Pinout and software compatible with
single-power supply Flash
— Superior inadver tent write protection
■ Data# Polling and toggle bits
— Provides a software method of detecting
program or erase operation completion
■ Erase Suspend/Erase Resume
— Suspends an erase oper ation to read data from,
or program data to, a sector that is not being
erased, then resumes the erase operation
■ Hardware reset pin (RESET#)
— Hardw are method to reset the device to reading
array data (not available on Am29F002NB)
Page 28
PRODUCT SELECTOR GUIDE
IC BLOCK DIAGRAM & DESCRIPTION
27
Family Part NumberAm29F002B/Am29F002NB
= 5.0 V ± 5%-55
V
Speed Option
Max access time, ns (t
Max CE# access time, ns (t
Max OE# access time, ns (t
CC
= 5.0 V ± 10%-70-90-120
V
CC
)557090120
ACC
)557090120
CE
)30303550
OE
Note: See “AC Characteristics” for full specifications.
WE#= Write enable
RESET#= Hardware reset pin, active low
(not available on Am29F002NB)
= +5.0 V single power supply
V
CC
(see Product Selector Guide for
device speed ratings and voltage
supply tolerances)
V
SS
= Device ground
NC= Pin not connected internally
CE#
OE#
WE#
RESET#
N/C on Am29F002NB
Page 31
4 Banks x 1M x 16Bit Synchronous DRAM
IC BLOCK DIAGRAM & DESCRIPTION
IC U206 SDRAM-HY57V65162B
30
DESCRIPTION
The Hyundai HY57V651620B is a 67,108,864-bit CMOS Synchronous DRAM, ideally suited for the Mobile applications which require low power consumption and extended temperature range. HY57V651620B is organized as 4banks
of 1,048,576x16.
HY57V651620B is offering fully synchronous operation referenced to a positive edge of the clock. All inputs and outputs are synchronized with the rising edge of the clock input. The data paths are internally pipelined to achieve very
high bandwidth. All input and output voltage levels are compatible with LVTTL.
Programmable options include the length of pipeline (Read latency of 2 or 3), the number of consecutive read or write
cycles initiated by a single control command (Burst length of 1,2,4,8 or Full page), and the burst count
sequence(sequential or interleave). A burst of read or write cycles in progress can be terminated by a burst terminate
command or can be interrupted and replaced by a new burst read or write command on any cycle. (This pipelined
design is not restricted by a `2N` rule.)
FEATURES
•Single 3.3V ± 10% power supply
•All device pins are compatible with LVTTL interface
•JEDEC standard 400mil 54pin TSOP-II with 0.8mm
of pin pitch
•All inputs and outputs referenced to positive edge of
system clock
•Data mask function by UDQM or LDQM
•Internal four banks operation
ORDERING INFORMATION
Part No.Clock FrequencyPowerOrganizationInterfacePackage
HY57V651620BTC-7I143MHz
HY57V651620BTC-75I133MHz
HY57V651620BTC-10SI100MHz
HY57V651620BLTC-7I143MHz
HY57V651620BLTC-75I133MHz
HY57V651620BLTC-10SI100Mhz
Normal
Power
•Auto refresh and self refresh
•4096 refresh cycles / 64ms
•Programmable Burst Length and Burst Type
- 1, 2, 4, 8 or Full page for Sequential Burst
- 1, 2, 4 or 8 for Interleave Burst
•Programmable CAS Latency ; 2, 3 Clocks
power
4Banks x 1Mbits
x16
Lower
LVTTL400mil 54pin TSOP II
This document is a general product description and is subject to change without notice. Hyundai Electronics does not assume any
responsibility for use of circuits described. No patent licenses are implied.
RAS, CAS and WE define the operation
Refer function truth table for details
Page 33
FUNCTIONAL BLOCK DIAGRAM
I/O Buffer & Logic
IC BLOCK DIAGRAM & DESCRIPTION
32
1Mbit x 4banks x 16 I/O Synchronous DRAM
Self refresh logic
CLK
CKE
CS
RAS
CAS
WE
UDQM
LDQM
& timer
Row active
State Machine
refresh
Column
Active
Internal Row
counter
Row
Pre
Decoders
Column
Pre
Decoders
1Mx16 Bank 3
X decoders
1Mx16 Bank 2
X decoders
X decoders
1Mx16 Bank 1
1Mx16 Bank 0
X decoders
Y decoders
Memory
Cell
Array
Sense AMP & I/O Gate
DQ0
DQ1
DQ14
DQ15
Bank Select
A0
A1
A11
BA0
BA1
Address buffers
Address
Registers
Mode Registers
Column Add
Counter
Burst
Counter
CAS Latency
Data Out Control
Pipe Line Control
Page 34
ABSOLUTE MAXIMUM RATINGS
IC BLOCK DIAGRAM & DESCRIPTION
33
ParameterSymbolRatingUnit
Ambient TemperatureTA-40 ~ 85°C
Storage TemperatureTSTG-55 ~ 125°C
Voltage on Any Pin relative to VSSVIN, VOUT-1.0 ~ 4.6V
Voltage on VDD relative to VSSVDD, VDDQ-1.0 ~ 4.6V
Short Circuit Output CurrentIOS50mA
Power DissipationPD1W
Soldering Temperature ⋅ TimeTSOLDER260 ⋅ 10°C⋅ Sec
Note : Operation at above absolute maximum rating can adversely affect device reliability
DC OPERATING CONDITION (TA= -40 to 85°C)
ParameterSymbolMinTyp.MaxUnitNote
Power Supply VoltageVDD, VDDQ3.03.33.6V1
Input High VoltageVIH2.03.0VDDQ + 2.0V1,2
Input Low VoltageVILVSSQ - 2.000.8V1,3
Note :
1.All voltages are referenced to VSS = 0V
2.VIH (max) is acceptable 4.7V AC pulse width with ≤3ns of duration
3.VIL (min) is acceptable -2.0V AC pulse width with ≤3ns of duration
AC OPERATING CONDITION (TA= -40 to 85°C, VDD=3.3V ± 0.3V, VSS=0V)
ParameterSymbolValueUnitNote
AC Input High / Low Level VoltageVIH / VIL2.4/0.4V
Input Timing Measurement Reference Level VoltageVtrip1.4V
Input Rise / Fall TimetR / tF1ns
Output Timing Measurement Reference LevelVoutref1.4V
Output Load Capacitance for Access Time MeasurementCL50pF1
Note :
1. Output load to measure access time is equivalent to two TTL gates and one capacitor (50pF)
For details, refer to AC/DC output circuit
Page 35
! 3-Termainal Regulators
IC WS7805
POSITIVE-VOLTAGE REGULATORS
25
V
)
WS7805DP
TO-220
WS7805CV
O
C
I
TO-252
IC BLOCK DIAGRAM & DESCRIPTION
34
! Output Current Up to 1.5 A
! No External Components
! Internal Thermal Overload Protection
! High Power Dissipation Capability
! Internal Shot-Circuit Current Limiting
! Output Transistor Safe-Area
Compensation
DESCRIPTION
This series of fixed-voltage monolithic integrated-circuit
voltage regulators designed for a wide range of
applications. These applications include on-card
regulation for elimination of noise and distribution
problems associated with single-point regulation. Each
of these regulators can deliver up to 1.5 amperes of
output current. The internal current limiting and thermal
shutdown features of these regulators make them
O
C
I
(TO-252)
essentially immune to overload.
ABSOLUTE MAXIMUM RATINGS OVER OPERATING TENPERATURE
RANGE (UNLESS OTHERWISE NOTE
WS7805PARAMETERUNIT
Input voltage, V
Continuous total dissipati on at 25℃ free-air temperature
Lead temperature 1.6mm (1/16 inch) from case 10 seconds260
Storage temperature range, T
I
stg
RECOMMEMDED OPERATING CONDITIONS
Input voltage, V
Output current, I
Operating virtual junction temperature, T
ComponentsSpecificationPositionComponentsSpecificationPosition
Carbon film
resitor
Carbon film
resitor
Carbon film
resitor
Carbon film
resitor
Metal film
resistor
Metal film
resistor
Metal film
resistor
Metal film
resistor
Metal film
resistor
High tension
resistor
Ceramic
capacitor
Ceramic
capacitor
Ceramic
capacitor
Ceramic
capacitor
Ceramic
capacitor
Ceramic
capacitor
Terylene
capacitor
Terylene
capacitor
Terylene
capacitor
head
Carbon film
resistor
Carbon film
resistor
Carbon film
resistor
Carbon film
resistor
Carbon film
resistor
Carbon film
resistor
Carbon film
resistor
Carbon film
resistor
Ceramic disc
capacitor
Ceramic disc
capacitor
Ceramic disc
capacitor
resistor
Carbon film
resistor
Carbon film
resistor
Carbon film
resistor
Carbon film
resistor
Carbon film
resistor
Carbon film
resistor
Carbon film
resistor
Carbon film
resistor
Carbon film
resistor
Carbon film
resistor
Rotatable
electrograph
Rotatable
electrograph
Rotatable
electrograph
MIC socket CK3-6.35-106MIC601,MIC602ICKA4558 DIPU601,U602
Wire0.6 figuration7.5mmJ601~J603PCB6921-0
Power PCB