ATMEL ATtiny24, ATtiny44, ATtiny84 User Manual

BDTIC www.bdtic.com/ATMEL

Features

High Performance, Low Power AVR
Advanced RISC Architecture
– 120 Powe rful Instructions – Most Single Clock Cy cle Execution – 32 x 8 General Purpose Working Registers – Fully Static Operation
– 2/4/8K Bytes of In-System Programmable Program Memory Flash
• Endurance: 10,000 Write/Erase Cycles
– 128/256/512 Bytes of In-System Programmable EEPROM
• Endurance: 100,000 Write/Erase Cycles – 128/256/512 Bytes of Internal SRAM – Data retention: 20 years at 85°C / 100 years at 25°C – Programming Lock for Self-Programming Flash & EEPROM Data Security
Peripheral Features
– One 8-Bit and One 16-Bit Timer/Counter with Two PWM Channels, Each – 10-bit ADC
• 8 Single-Ended Channels
• 12 Differential ADC Channel Pairs with Programmable Gain (1x / 20x) – Programmable Watchdog Timer with Separate On-chip Oscillator – On-Chip Analog Comparator – Universal Serial Interface
Special Microcontroller Features
– debugWIRE On-chip Debug System – In-System Programmable via SPI Port – Internal and External Interrupt Sources: Pin Change Interrupt on 12 Pins – Low Power Idle, ADC Noise Reduction, Standby and Power-Do wn Modes – Enhanced Power-on Reset Circuit – Programmable Brown-Out Detection Circuit – Internal Calibrated Oscillator – On-Chip Temperat ure Sensor
I/O and Pac kages
– Available in 20-Pin QFN/MLF & 14-Pin SOIC and PDIP – Twelve Programmable I/O Lines
Operating Voltage:
– 1.8 – 5.5V for ATtiny24V/44V/84V – 2.7 – 5.5V for ATtiny24/44/84
Speed Grade
– ATtiny24V/44V/84V
• 0 – 4 MHz @ 1.8 – 5.5V
• 0 – 10 MHz @ 2.7 – 5.5V – ATtiny24/44/84
• 0 – 10 MHz @ 2.7 – 5.5V
• 0 – 20 MHz @ 4.5 – 5.5V
Industrial Temperature Range: -40°C to +85°C
Low Power Consumption
– Active Mode (1 MHz System Clock): 300 µA @ 1.8V – Power-down Mode: 0.1 µA @ 1.8V
®
8-Bit Microcontroller
8-bit
Microcontroller with 2/4/8K Bytes In-System Programmable Flash
ATtiny24/44/84
Preliminary Summary
Rev. 8006GS–AVR–01/08
ATtiny24/44/84

1. Pin Configurations

Figure 1-1. Pinout ATt i ny 24 /4 4/ 84
PDIP/SOIC
VCC
(PCINT8/XTAL1/CLKI) PB0
(PCINT9/XTAL2) PB1
(PCINT11/RESET/dW) PB3
(PCINT10/INT0/OC0A/CKOUT) PB2
(PCINT7/ICP/OC0B/ADC7) PA7
(PCINT6/OC1A/SDA/MOSI/DI/ADC6) PA6
(ADC4/USCK/SCL/T1/PCINT4) PA4
(ADC3/T0/PCINT3) PA3 (ADC2/AIN1/PCINT2) PA2 (ADC1/AIN0/PCINT1) PA1
(ADC0/AREF/PCINT0) PA0
NOTE Bottom pad should be soldered to ground. DNC: Do Not Connect
1 2 3 4 5 6 7
QFN/MLF
PA 5
DNC
2019181716
1 2 3 4 5
6
7
DNC
DNC
14 13 12 11 10
DNC
8
GND
GND PA0 (ADC0/AREF/PCINT0) PA1 (ADC1/AIN0/PCINT1) PA2 (ADC2/AIN1/PCINT2) PA3 (ADC3/T0/PCINT3)
9
PA4 (ADC4/USCK/SCL/T1/PCINT4)
8
PA5 (ADC5/DO/MISO/OC1B/PCINT5)
Pin 16: PA6 (PCINT6/OC1A/SDA/MOSI/DI/ADC6) Pin 20: PA5 (ADC5/DO/MISO/OC1B/PCINT5)
DNC
PA 6
15
PA7 (PCINT7/ICP/OC0B/ADC7)
14
PB2 (PCINT10/INT0/OC0A/CKOUT)
13
PB3 (PCINT11/RESET/dW)
12
PB1 (PCINT9/XTAL2)
11
PB0 (PCINT8/XTAL1/CLKI)
9
10
VCC
DNC

1.1 Pin Descriptions

1.1.1 VCC

1.1.2 GND

1.1.3 Port B (PB3...PB0)

2
Supply voltage.
Ground.
Port B is a 4-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port B output buffers have symmetrical drive characteristics with both high sink and source capability except PB3 which has the RESET RESET pin, program (‘0’) RSTDISBL fuse. As inputs, Port B pins that are externally pulled low will source current if the pull-up resistors are activated. The Port B pins are tri-stated when a reset condition becomes active, even if the cloc k is not ru nn in g.
capability. To use pin PB3 as an I/O pin, instead of
8006GS–AVR–01/08
Port B also serves the functions of various special features.

1.1.4 RESET

Reset input. A low level on this pin for longer than the minimum pulse length will generate a reset, even if the clock is not running and provided the reset pin has not been disabled. Shorter pulses are not guaranteed to generate a reset.
The reset pin can also be used as a (weak) I/O pin.

1.1.5 Port A (PA7...PA0)

Port A is a 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port A output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port A pins that are externally pulled low will source current if the pull-up resistors are activated. The Port A pins are tri-stated when a reset co ndition becomes active, even if the clock is not running.
Port A has alternate functions as analog inputs for the ADC, analog comparator, timer/counter, SPI and pin change interrupt.
ATtiny24/44/84
8006GS–AVR–01/08
3
ATtiny24/44/84

2. Overview

The ATtiny24/44/84 is a low-power CMOS 8-bit microcontroller based on the AVR enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the ATt iny24/ 44/ 84 achieves throughputs approaching 1 MIPS per MHz allowing the system designer to optimize power consumption versus processing speed.
Figure 2-1. Block Diagram
VCC
GND
PROGRAM COUNTER
PROGRAM
FLASH
INSTRUCTION
REGISTER
INSTRUCTION
DECODER
CONTROL
LINES
PROGRAMMING
LOGIC
STACK
POINTER
SRAM
GENERAL PURPOSE
REGISTERS
X Y Z
ALU
STATUS
REGISTER
ISP INTERFACE
8-BIT DATABUS
INTERNAL
OSCILLATOR
WATCHDOG
TIMER
MCU CONTROL
REGISTER
MCU STATUS
REGISTER
TIMER/
COUNTER0
TIMER/
COUNTER1
INTERRUPT
UNIT
EEPROM
INTERNAL CALIBRATED OSCILLATOR
TIMING AND
CONTROL
OSCILLATORS
4
DATA REGISTER
+
-
PORT A
ANALOG
COMPARATOR
PORT A DRIVERS
PA7-PA0
DATA DIR.
REG.PORT A
ADC
DATA REGISTER
PORT B
PORT B DRIVERS
PB3-PB0
DATA DIR.
REG.PORT B
The AVR core combines a rich instruction set with 32 general purpose working registers. All 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent registers to be accessed in one single instruction executed in one clock cycle. The resulting architecture is more code efficient while achieving throughputs up to ten times faster than con­ventional CISC microcontrollers.
8006GS–AVR–01/08
ATtiny24/44/84
The ATtiny24/44/84 provides the following features: 2/4/8K byte of In-System Programmable Flash, 128/256/512 bytes EEPROM, 128/256/512 bytes SRAM, 12 general purpose I/ O lines, 32 general purpose working registers, a 8-bit Timer/Counter with two PWM channels, a 16-bit timer/counter with two PWM channels, Internal and External Interrupts, a 8-channel 10-bit ADC, programmable gain stage (1x, 20x) for 12 differential ADC channel pairs, a programmable Watchdog Timer with internal Oscillator, internal calibrated oscillator, and four software select­able power saving modes. Idle mode stops the CPU while allowing the SRAM, Timer/Counter, ADC, Analog Comparator, and Interrupt system to continue functioning. ADC Noise Reduction mode minimizes switching noise during ADC conversions by stopping the CPU and all I/O mod­ules except the ADC. In Power-down mode registers keep their contents and all chip functions are disbaled until the next interrupt or hardware reset. In Standby mode, the crystal/resonator oscillator is running while the rest of the device is sleeping, allowing very fast start-up combined with low power consumption.
The device is manufactured using Atmel’s high density no n-volat ile mem ory tech nology. The on­chip ISP Flash allows the Program memory to be re-programmed in-system through an SPI serial interface, by a conventional non-volatile memory programmer or by an on-chip boot code running on the AVR core.
The ATtiny24/44/84 AVR is supported with a full suite of pr ogram and system d evelopment tools including: C Compilers, Macro Assemblers, Program Debugger/Simulators and Evaluation kits.
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ATtiny24/44/84

3. About

3.1 Resources

A comprehensive set of drivers, application notes, data sheet s and descr iption s on development tools are available for download at http://www.atmel.com/avr.

3.2 Code Examples

This documentation contains simple code examples t hat brief ly show h ow to us e various parts of the device. These code examples assume that the part specific header file is included b efore compilation. Be aware that not all C compiler vendors include bit definitions in the header files and interrupt handling in C is compiler dependent . Please con firm wit h the C com piler d ocume n­tation for more details.
For I/O Registers located in the extended I/O map, “IN”, “OUT”, “SBIS”, “SBIC”, “CBI”, and “SBI” instructions must be replaced with instructions that allow access to extended I/O. Typically, this means “LDS” and “STS” combined with “SBRS”, “SBRC”, “SBR”, and “CBR”. Note that not all AVR devices include an extended I/O map.

3.3 Data Retention

3.4 Disclaimer

Reliability Qualification results show that the projected data retention failure rate is much less than 1 PPM over 20 years at 85°C or 100 years at 25°C.
Typical values contained in this datasheet are based on simulations and characterization of other AVR microcontrollers manufactured o n th e same proce ss te ch nolo gy. Min a nd Ma x valu es will be available after the device is characterized.
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ATtiny24/44/84

4. Register Summary

Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page
0x3F (0x5F) SREG I T H S V N Z C
0x3E (0x5E) SPH SP9 SP8 0x3D (0x5D) SPL SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 0x3C (0x5C) OCR0B 0x3B (0x5B) GIMSK INT0 PCIE1
0x3A (0x5A GIFR INTF0 PCIF1
0x39 (0x59) TIMSK0 OCIE0B OCIE0A TOIE0
0x38 (0x58) TIFR0 OCF0B OCF0A TOV0
0x37 (0x57) SPMCSR CTPB RFLB PGWRT PGERS SPMEN
0x36 (0x56) OCR0A
0x35 (0x55) MCUCR BODS PUD SE SM1 SM0 BODSE ISC01 ISC00
0x34 (0x54) MCUSR WDRF BORF EXTRF PORF
0x33 (0x53) TCCR0B FOC0A FOC0B WGM02 CS02 CS01 CS00
0x32 (0x52) TCNT0 Timer/Counter0
0x31 (0x51) OSCCALCAL7CAL6CAL5CAL4CAL3CAL2CAL1CAL0
0x30 (0x50) TCCR0A COM0A1 COM0A0 COM0B1 COM0B0 WGM01 WGM00 0x2F (0x4F) TCCR1A COM1A1 COM1A0 COM1B1 COM1B0 WGM11 WGM10 0x2E (0x4E) TCCR1B ICNC1 ICES1 WGM13 WGM12 CS12 CS11 CS10 0x2D (0x4D) TCNT1H Timer/Counter1 – Counter Register High Byte 0x2C (0x4C) TCNT1L Timer/Counter1 – Counter Register Low Byte 0x2B (0x4B) OCR1AH Timer/Counter1 – Compare Register A High Byte 0x2A (0x4A) OCR1AL Timer/Counter1 – Compare Register A Low Byte
0x29 (0x49) OCR1BH Timer/Counter1 – Compare Register B High Byte
0x28 (0x48) OCR1BL Timer/Counter1 – Compare Register B Low Byte
0x27 (0x47) DWDR DWDR[7:0]
0x26 (0x46) CLKPR CLKPCE CLKPS3 CLKPS2 CLKPS1 CLKPS0
0x25 (0x45) ICR1H Timer/Counter1 - Input Capture Register High Byte
0x24 (0x44) ICR1L Timer/Counter1 - Input Capture Register Low Byte
0x23 (0x43) GTCCR TSM PSR10
0x22 (0x42) TCCR1C FOC1A FOC1B
0x21 (0x41) WDTCSR WDIF WDIE WDP3 WDCE WDE WDP2 WDP1 WDP0
0x20 (0x40) PCMSK1 PCINT11 PCINT10 PCINT9 PCINT8 0x1F (0x3F) EEARH –EEAR8 0x1E (0x3E) EEARL EEAR7 EEAR6 EEAR5 EEAR4 EEAR3 EEAR2 EEAR1 EEAR0 0x1D (0x3D) EEDR EEPROM Data Register 0x1C (0x3C) EECR EEPM1 EEPM0 EERIE EEMPE EEPE EERE 0x1B (0x3B) PORTA PORTA7 PORTA6 PORTA5 PORTA4 PORTA3 PORTA2 PORTA1 PORTA0 0x1A (0x3A) DDRA DDA7 DDA6 DDA5 DDA4 DDA3 DDA2 DDA1 DDA0
0x19 (0x39) PINA PINA7 PINA6 PINA5 PINA4 PINA3 PINA2 PINA1 PINA0
0x18 (0x38) PORTB PORTB3 PORTB2 PORTB1 PORTB0
0x17 (0x37) DDRB DDB3 DDB2 DDB1 DDB0
0x16 (0x36) PINB
0x15 (0x35) GPIOR2 General Purpose I/O Register 2
0x14 (0x34) GPIOR1 General Purpose I/O Register 1
0x13 (0x33) GPIOR0 General Purpose I/O Register 0
0x12 (0x32) PCMSK0 PCINT7 PCINT6 PCINT5 PCINT4 PCINT3 PCINT2 PCINT1 PCINT0 0x11 (0x31)) Reserved
0x10 (0x30) USIBR USI Buffer Register 0x0F (0x2F) USIDR USI Data Register 0x0E (0x2E) USISR USISIF USIOIF USIPF USIDC USICNT3 USICNT2 USICNT1 USICNT0 0x0D (0x2D) USICR USISIE USIOIE USIWM1 USIWM0 USICS1 USICS0 USICLK USITC 0x0C (0x2C) TIMSK1 –ICIE1– OCIE1B OCIE1A TOIE1 0x0B (0x2B) TIFR1 –ICF1– OCF1B OCF1A TOV1 0x0A (0x2A) Reserved
0x09 (0x29) Reserved
0x08 (0x28) ACSR ACD ACBG
0x07 (0x27) ADMUX REFS1 REFS0 MUX5 MUX4 MUX3 MUX2 MUX1 MUX0
0x06 (0x26) ADCSRA ADEN ADSC
0x05 (0x25) ADCH ADC Data Register High Byte
0x04 (0x24) ADCL ADC Data Register Low Byte
0x03 (0x23) ADCSRB BIN ACME –ADLAR– ADTS2 ADTS1 ADTS0
0x02 (0x22) Reserved
0x01 (0x21) DIDR0 ADC7D ADC6D ADC5D ADC4D ADC3D ADC2D ADC1D ADC0D
0x00 (0x20) PRR
PINB3 PINB2 PINB1 PINB0
PRTIM1 PRTIM0 PRUSI PRADC
Timer/Counter0 – Output Compare Regist er B
Timer/Counter0 – Output Compare Regist er A
ACO ACI ACIE ACIC ACIS1 ACIS0
ADATE ADIF ADIE ADPS2 ADPS1 ADPS0
PCIE0 PCIF0
– –
– –
8006GS–AVR–01/08
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ATtiny24/44/84
Note: 1. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses
should never be written.
2. I/O Registers within the address range 0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. In these registers, the value of single bits can be checked by using the SBIS and SBIC instructions.
3. Some of the Status Flags are cleared by writing a logical one to them. Note that, unlike most other AVRs, the CBI and SBI instructions will only operation the specified bit, and can therefore be used on registers containing such Status Flags. The CBI and SBI instructions work with registers 0x00 to 0x1F only.
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8006GS–AVR–01/08
ATtiny24/44/84

5. Instruction Set Summary

Mnemonics Operands Description Operation Flags #Clocks
ARITHMETIC AND LOGIC INSTRUCTIONS
ADD Rd, Rr Add two Registers Rd ← Rd + Rr Z,C,N,V,H 1 ADC Rd, Rr Add with Carry two Registers Rd Rd + Rr + C Z,C,N,V,H 1 ADIW Rdl,K Add Immediate to Word Rd h:Rdl Rdh:Rdl + K Z,C,N,V,S 2 SUB Rd, Rr Subtract two Registers Rd ← Rd - Rr Z,C,N,V,H 1 SUBI Rd, K Subtract Constant from Register Rd Rd - K Z,C,N,V,H 1 SBC Rd, Rr Subtract with Carry two Registers Rd Rd - Rr - C Z,C,N,V,H 1 SBCI Rd, K Subtract with Carry Constant from Reg. Rd Rd - K - C Z,C,N,V,H 1 SBIW Rdl,K Subtract Immediate from Word Rdh:Rdl Rdh:Rdl - K Z,C,N,V,S 2 AND Rd, Rr Logical AND Registers Rd Rd Rr Z,N,V 1 ANDI Rd, K Logical AND Register and Constant Rd Rd • K Z,N,V 1 OR Rd, Rr Logical OR Registers Rd Rd v Rr Z,N,V 1 ORI Rd, K Logical OR Register and Constant Rd Rd v K Z,N,V 1 EOR Rd, Rr Exclusive OR Registers Rd Rd Rr Z,N,V 1 COM Rd One’s Complement Rd 0xFF Rd Z,C,N,V 1 NEG Rd Two’s Complement Rd 0x00 Rd Z,C,N,V,H 1 SBR Rd,K Set Bit(s) in Register Rd Rd v K Z,N,V 1 CBR Rd,K Clear Bit(s) in Register Rd Rd • (0xFF - K) Z,N,V 1 INC Rd Increment Rd Rd + 1 Z,N,V 1 DEC Rd Decrement Rd Rd 1 Z,N,V 1 TST Rd Test for Zero or Minus Rd Rd Rd Z,N,V 1 CLR Rd Clear Register Rd Rd Rd Z,N,V 1 SER Rd Set Register Rd 0xFF None 1
BRANCH INSTRUCTIONS
RJMP k Relative Jump PC PC + k + 1 None 2 IJMP Indirect Jump to (Z) PC Z None 2 RCALL k Relative Subroutine Call PC PC + k + 1 None 3 ICALL Indirect Call to (Z) PC ZNone3 RET Subroutine Return PC STACK None 4 RETI Interrupt Return PC STACK I 4 CPSE Rd,Rr Compare, Skip if Equal if (Rd = Rr) PC PC + 2 or 3 None 1/2/3 CP Rd,Rr Compare Rd Rr Z, N,V,C,H 1 CPC Rd,Rr Compare with Carry Rd Rr C Z, N,V,C,H 1 CPI Rd,K Compare Register with Immediate Rd K Z, N,V,C,H 1 SBRC Rr, b Skip if Bit in Register Cleared if (Rr(b)=0) PC PC + 2 or 3 None 1/2/3 SBRS Rr, b Skip if Bit in Register is Set if (Rr(b)=1) PC PC + 2 or 3 None 1/2/3 SBIC P, b Skip if Bit in I/O Register Cleared if (P(b)=0) PC PC + 2 or 3 None 1/2/3 SBIS P, b Skip if Bit in I/O Register is Set if (P(b)=1) PC PC + 2 or 3 None 1/2/3 BRBS s, k Branch if Status Flag Set if (SREG(s) = 1) then PCPC+k + 1 None 1/2 BRBC s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PCPC+k + 1 None 1/2 BREQ k Branch if Equal if (Z = 1) then PC PC + k + 1 None 1/2 BRNE k Branch if Not Equal if (Z = 0) then PC PC + k + 1 None 1/2 BRCS k Branch if Carry Set if (C = 1) then PC PC + k + 1 None 1/2 BRCC k Branch if Carry Cleared if (C = 0) then PC PC + k + 1 None 1/2 BRSH k Branch if Same or Higher if (C = 0) then PC PC + k + 1 None 1/2 BRLO k Branch if Lower if (C = 1) then PC PC + k + 1 Non e 1/2 BRMI k Branch if Minus if (N = 1) then PC PC + k + 1 None 1 /2 BRPL k Branch if Plus if (N = 0) then PC PC + k + 1 None 1/2 BRGE k Branch if Greater or Equal, Signed if (N V= 0) then PC PC + k + 1 None 1/2 BRLT k Branch if Less Than Zero, Signed if (N V= 1) then PC PC + k + 1 None 1/2 BRHS k Branch if Half Carry Flag Set if (H = 1) then PC PC + k + 1 None 1/2 BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC PC + k + 1 None 1/2 BRTS k Branch if T Flag Set if (T = 1) then PC PC + k + 1 None 1/2 BRTC k Branch if T Flag Cleared if (T = 0) then PC PC + k + 1 None 1/2 BRVS k Branch if Overflow Flag is Set if (V = 1) then PC PC + k + 1 None 1/2 BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC PC + k + 1 None 1/2 BRIE k Branch if Interrupt Enabled if ( I = 1) then PC PC + k + 1 None 1/2 BRID k Branch if Interrupt Disabled if ( I = 0) then PC PC + k + 1 None 1/2
BIT AND BIT-TEST INSTRUCTIONS
SBI P,b Set Bit in I/O Register I/O(P,b) 1None2 CBI P,b Clear Bit in I/O Register I/O(P,b) 0None2 LSL Rd Logical Shift Left Rd(n+1) Rd(n), Rd(0) LSR Rd Logical Shift Right Rd(n) Rd(n+1), Rd(7) 0 Z,C,N,V 1 ROL Rd Rotate Left Through Carry Rd(0)←C,Rd(n+1)← Rd(n),C←Rd(7) Z,C,N,V 1
0 Z,C,N,V 1
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ATtiny24/44/84
Mnemonics Operands Description Operation Flags #Clocks
ROR Rd Ro ta te Right Through Carry Rd(7)←C,Rd(n)← Rd(n+1),C←Rd(0) Z,C,N,V 1 ASR Rd Arithmetic Shift Right Rd(n) Rd(n+1), n=0..6 Z,C,N,V 1 SWAP Rd Swap Nibbles Rd(3..0)←Rd(7..4),Rd(7..4)←Rd(3..0) None 1 BSET s Flag Set SREG(s) 1 SREG(s) 1 BCLR s Flag Clear SREG(s) 0 SREG(s) 1 BST Rr, b Bit Store from Register to T T Rr(b) T 1 BLD Rd, b Bit load from T to Register Rd(b) TNone1 SEC Set Carry C 1C1 CLC Clear Carry C 0 C 1 SEN Set Negative Flag N 1N1 CLN Clear Negative Flag N 0 N 1 SEZ Set Zero Flag Z 1Z1 CLZ Clear Zero Flag Z 0 Z 1 SEI Global Interrupt Enable I 1I1 CLI Global Interrupt Disable I 0 I 1 SES Set Signed Test Flag S 1S1 CLS Clear Signed Test Flag S 0 S 1 SEV Set Twos Complement Overflow. V 1V1 CLV Clear Twos Complement Overflow V 0 V 1 SET Set T in SREG T 1T1 CLT Clear T in SREG T 0 T 1 SEH Set Half Carry Flag in SREG H 1H1 CLH Clear Half Carry Flag in SREG H 0 H
DATA TRANSFER INSTRUCTIONS
MOV Rd, Rr Move Between Registers Rd Rr None 1 MOVW Rd, Rr Copy Register Word LDI Rd, K Load Immediate Rd KNone1 LD Rd, X Load Indirect Rd (X) None 2 LD Rd, X+ Load Indirect and Post-Inc. Rd (X), X X + 1 None 2 LD Rd, - X Load Indirect and Pre-Dec. X X - 1, Rd (X) None 2 LD Rd, Y Load Indirect Rd (Y) None 2 LD Rd, Y+ Load Indirect and Post-Inc. Rd (Y), Y Y + 1 None 2 LD Rd, - Y Load Indirect and Pre-Dec. Y Y - 1, Rd (Y) None 2 LDD Rd,Y+q Load Indirect with Displacement Rd (Y + q) None 2 LD Rd, Z Load Indirect Rd (Z) None 2 LD Rd, Z+ Load Indirect and Post-Inc. Rd (Z), Z Z+1 None 2 LD Rd, -Z Load Indirect and Pre-Dec. Z ← Z - 1, Rd ← (Z) None 2 LDD Rd, Z+q Load Indirect with Displacement Rd (Z + q) None 2 LDS Rd, k Load Direct from SRAM Rd (k) None 2 ST X, Rr Store Indirect (X) Rr None 2 ST X+, Rr Store Indirect and Post-Inc. (X) Rr, X X + 1 None 2 ST - X, Rr Store Indirect and Pre-Dec. X X - 1, (X) Rr None 2 ST Y, Rr Store Indirect (Y) Rr None 2 ST Y+, Rr Store Indirect and Post-Inc. (Y) Rr, Y Y + 1 None 2 ST - Y, Rr Store Indirect and Pre-Dec. Y Y - 1, (Y) Rr None 2 STD Y+q,Rr Store Indirect with Displacement (Y + q) Rr None 2 ST Z, Rr Store Indirect (Z) Rr None 2 ST Z+, Rr Store Indirect and Post-Inc. (Z) Rr, Z Z + 1 None 2 ST -Z, Rr Store Indirect and Pre-Dec. Z Z - 1, (Z) Rr None 2 STD Z+q,Rr Store Indirect with Displacement (Z + q) Rr None 2 STS k, Rr Store Direct to SRAM (k) Rr None 2 LPM Load P rogram Memory R0 (Z) None 3 LPM Rd, Z Load Program Memory Rd (Z) None 3 LPM Rd, Z+ Load Program Memory and Post-Inc Rd (Z), Z Z+1 None 3 SPM Store Program Memory (z) R1:R0 None IN Rd, P In Port Rd PNone1 OUT P, Rr Out Port P Rr None 1 PUSH Rr Push Register on Stack STACK Rr None 2 POP Rd Pop Register from Stack Rd STACK None 2
MCU CONTROL INSTRUCTIONS
NOP No Operation None 1 SLEEP Sleep (see specific descr. for Sleep function) None 1 WDR Watchdog Reset (see specific descr. for WDR/Timer) None 1 BREAK Break For On-chip Debug Only None N/A
Rd+1:Rd Rr+1:Rr
None 1
1
10
8006GS–AVR–01/08
ATtiny24/44/84

6. Ordering Information

6.1 ATtiny24

Speed (MHz) Power Supply Ordering Code
ATtiny24V-10SSU
10 1.8 - 5.5V
20 2.7 - 5.5V
Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information
and minimum quantities.
2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green.
ATtiny24V-10PU ATtiny24V-10MU
ATtiny24-20SSU ATtiny24-20PU ATtiny24-20MU
(1)
Package
14S1 14P3 20M1
14S1 14P3 20M1
(2)
Operational Range
Industrial
(-40°C to 85°C)
Industrial
(-40°C to 85°C)
Package Type 14S1 14P3 20M1 20-pad, 4 x 4 x 0.8 mm Body, Quad Flat No-Lead/Micro Lead Frame Package (QFN/MLF)
8006GS–AVR–01/08
14-lead, 0.150" Wide Body, Plastic Gull Wing Small Outline Package (SOIC) 14-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
11
ATtiny24/44/84

6.2 ATtiny44

Speed (MHz) Power Supply Ordering Code
ATtiny44V-10SSU
10 1.8 - 5.5V
ATtiny44V-10PU ATtiny44V-10MU
(1)
Package
14S1 14P3 20M1
(2)
Operational Range
Industrial
(-40°C to 85°C)
ATtiny44-20SSU
20 2.7 - 5.5V
Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information
and minimum quantities.
2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green.
ATtiny44-20PU ATtiny44-20MU
14S1 14P3 20M1
Industrial
(-40°C to 85°C)
14S1 14P3 20M1 20-pad, 4 x 4 x 0.8 mm Body, Quad Flat No-Lead/Micro Lead Frame Package (QFN/MLF)
12
Package Type
14-lead, 0.150" Wide Body, Plastic Gull Wing Small Outline Package (SOIC) 14-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8006GS–AVR–01/08

6.3 ATtiny84

Speed (MHz) Power Supply Ordering Code
ATtiny84V-10SSU
10 1.8 - 5.5V
ATtiny84V-10PU ATtiny84V-10MU
ATtiny24/44/84
(1)
Package
14S1 14P3 20M1
(2)
Operational Range
Industrial
(-40°C to 85°C)
ATtiny84-20SSU
20 2.7 - 5.5V
Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information
and minimum quantities.
2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green.
ATtiny84-20PU ATtiny84-20MU
14S1 14P3 20M1
Industrial
(-40°C to 85°C)
Package Type 14S1 14P3 20M1 20-pad, 4 x 4 x 0.8 mm Body, Quad Flat No-Lead/Micro Lead Frame Package (QFN/MLF)
8006GS–AVR–01/08
14-lead, 0.150" Wide Body, Plastic Gull Wing Small Outline Package (SOIC) 14-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
13
ATtiny24/44/84

7. Packaging Information

7.1 20M1

D
1
2
Pin 1 ID
3
E
TOP VIEW
D2
1
Pin #1
Notch
(0.20 R)
2
3
E2
b
L
e
BOTTOM VIEW
Reference JEDEC Standard MO-220, Fig. 1 (SAW Singulation) WGGD-5.
Note:
SIDE VIEW
A2
A1
A
0.08
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
A 0.70 0.75 0.80
A1 – 0.01 0.05
A2 0.20 REF
b 0.18 0.23 0.30
D 4.00 BSC
D2 2.45 2.60 2.75
E 4.00 BSC
E2 2.45 2.60 2.75
e 0.50 BSC
L 0.35 0.40 0.55
MIN
NOM
C
MAX
NOTE
2325 Orchard Parkway
R
San Jose, CA 95131
14
TITLE
20M1, 20-pad, 4 x 4 x 0.8 mm Body, Lead Pitch 0.50 mm,
2.6 mm Exposed Pad, Micro Lead Frame Package (MLF)
DRAWING NO.
20M1
8006GS–AVR–01/08
10/27/04
REV.
A

7.2 14P3

PIN
1
E1
A1
B
E
B1
C
L
SEATING PLANE
A
ATtiny24/44/84
D
e
eC
eB
Notes: 1. This package conforms to JEDEC reference MS-001, Variation AA.
2. Dimensions D and E1 do not include mold Flash or Protrusion. Mold Flash or Protrusion shall not exceed 0.25 mm (0.010").
TITLE
2325 Orchard Parkway
R
San Jose, CA 95131
14P3, 14-lead (0.300"/7.62 mm Wide) Plastic Dual Inline Package (PDIP)
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
A 5.334
A1 0.381
D 18.669 19.685 Note 2
E 7.620 8.255
E1 6.096 7.112 Note 2
B 0.356 0.559
B1 1.143 1.778
L 2.921 3.810
C 0.203 0.356
eB 10.922
eC 0.000 1.524
e 2.540 TYP
MIN
NOM
MAX
DRAWING NO.
14P3
NOTE
11/02/05
REV.
A
8006GS–AVR–01/08
15
ATtiny24/44/84

7.3 14S1

1
E
H
E
N
L
Top View
COMMON DIMENSIONS
e
A1
D
Side View
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-012, Variation AB for additional information.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusion and gate burrs shall not exceed 0.15 mm (0.006") per side.
3. Dimension E does not include inter-lead Flash or protrusion. Inter-lead flash and protrusions shall not exceed 0.25 mm (0.010") per side.
4. L is the length of the terminal for soldering to a substrate.
5. The lead width B, as measured 0.36 mm (0.014") or greater above the seating plane, shall not exceed a maximum value of 0.61 mm (0.024") per side.
b
SYMBOL
A 1.35/0.0532 1.75/0.0688
A
A1 0.1/.0040 0.25/0.0098
b 0.33/0.0130 0.5/0.0200 5
D 8.55/0.3367 8.74/0.3444 2
E3.8/0.1497 3.99/0.1574 3
H5.8/0.2284 6.19/0.2440
L 0.41/0.0160 1.27/0.0500 4
e 1.27/0.050 BSC
TITLE
2325 Orchard Parkway San Jose, CA 95131
R
14S1, 14-lead, 0.150" Wide Body, Plastic Gull Wing Small Outline Package (SOIC)
(Unit of Measure = mm/inches)
MIN
End View
NOM
MAX
DRAWING NO.
14S1
NOTE
2/5/02
REV.
A
16
8006GS–AVR–01/08

8. Errata

8.1 ATtiny24

8.1.1 Rev. E

8.1.2 Rev. D

8.1.3 Rev. C

ATtiny24/44/84
The revision letters in this section refer to the revision of the corresponding ATtiny24/44/84 device.
No known errata.
No known errata.
Reading EEPROM when system clock frequency is below 900 kHz may not work
1. Reading EEPROM when s ystem clock frequency is below 900 kHz may not work
Reading data from the EEPROM at system clock frequency below 900 kHz may result in wrong data read.
Problem Fix/Work around
Avoid using the EEPROM at clock frequency below 900 kHz.

8.1.4 Rev. B

8.1.5 Rev. A

EEPROM read from application code does not work in Lock Bit Mode 3
Reading EEPROM when system clock frequency is below 900 kHz may not work
1. EEPROM read from application code does not work in Lock Bit Mode 3
When the Memory Lock Bits LB2 and LB1 are programmed to mode 3, EEPROM read does not work from the application code.
Problem Fix/Work around
Do not set Lock Bit Protection Mode 3 when the application code needs to rea d from EEPROM.
2. Reading EEPROM when s ystem clock frequency is below 900 kHz may not work
Reading data from the EEPROM at system clock frequency below 900 kHz may result in wrong data read.
Problem Fix/Work around
Avoid using the EEPROM at clock frequency below 900 kHz.
Not sampled.
8006GS–AVR–01/08
17
ATtiny24/44/84

8.2 ATtiny44

8.2.1 Rev. D

8.2.2 Rev. C

8.2.3 Rev. B

8.2.4 Rev. A

No known errata.
No known errata.
No known errata.
Reading EEPROM when system clock frequency is below 900 kHz may not work
1. Reading EEPROM when s ystem clock frequency is below 900 kHz may not work
Reading data from the EEPROM at system clock frequency below 900 kHz may result in wrong data read.
Problem Fix/Work around
Avoid using the EEPROM at clock frequency below 900 kHz.
18
8006GS–AVR–01/08

8.3 ATtiny84

8.3.1 Rev. B

8.3.2 Rev. A

ATtiny24/44/84
No known errata.
No known errata.
8006GS–AVR–01/08
19
ATtiny24/44/84

9. Datasheet Revision History

9.1 Rev G. 01/08

1. Updated sections: – “Features” on page 1
– “RESET” on page 3 – “Overview” on page 4 – “About” on page 6 – “SPH and SPL — Stack Pointer Register” on page 11 – “Atomic Byte Programming” on page 17 – “Write” on pa ge 17 – “Clock Sources” on page 24 – “Default Clock Source” on page 28 – “Sleep Modes” on page 32 – “So ftware BOD Disable” on page 33 – “External Interrupts” on page 48 – “USIBR – USI Data Buffer” on page 124 – “USIDR – USI Data Register” on page 124 – “DIDR0 – Digital Input Disable Register 0” on page 131 – “Features” on page 132 – “Prescaling and Conversion Timing” on page 135 – “Temperature Measurement” on page 144 – “ADMUX – ADC Multiplexer Selection Register” on page 145 – “Limitations of debugWIRE” on page 152 – “Reading Lock, Fuse and Signature Data from Software” on page 155 – “Device Signature Imprint Table” on page 161 – “Enter High-voltage Serial Programming Mode” on page 168 – “Absolute Maximum Ratings*” on page 175 – “DC Characteristics” on page 175 – “Speed Grades” on page 177 – “Clock Characteristics” on page 177 – “Calibrated Internal RC Oscillator Accuracy” on page 177 – “System and Reset Characteristics” on page 179 – “Supply Current of I/O Modules” on page 186 – “ATtiny24” on page 17 – “ATtiny44” on page 18 – “ATtiny84” on page 19
2. Updated bit defin itions in sections: – “MCUCR – MCU Control Register” on page 35
– “MCUCR – MCU Control Register” on page 50 – “MCUCR – MCU Control Register” on page 66
20
8006GS–AVR–01/08
ATtiny24/44/84
– “PINA – Port A Input Pins” on page 67 – “SPMCSR – Store Program Memory Control and Status Register” on page 157 – “Register Summary” on page 7
3. Updated Figures: – “Reset Logic” on page 38
– “Watchdog Reset During Operation” on page 41 – “Compare Match Output Unit, Schematic (non-PWM Mode)” on page 97 – “Analog to Digital Converter Block Schematic” on page 133 – “ADC Timing Diagram, Free Running Conversion” on page 13 7 – “Analog Input Circuitry” on page 140 – “High-voltage Serial Programming” on page 167 – “Serial Programming Timing” on page 184 – “High-voltage Serial Programming Timing” on page 185 – “Active Supply Current vs. Lo w Frequency (0.1 - 1.0 MHz)” on page 187 – “Active Supply Current vs. frequency (1 - 20 MHz)” on page 188 – “Active Supply Current vs. VCC (Internal RC Oscillator, 8 MHz)” on page 188 – “Active Supply Current vs. VCC (Internal RC Oscillator, 1 MHz)” on page 189 – “Active Supply Current vs. VCC (Internal RC Oscillator, 128 kHz)” on page 189 – “Idle Supply Current vs. Low Frequency (0.1 - 1.0 MHz)” on page 190 – “Idle Supply Current vs. Frequency (1 - 20 MHz)” on page 190 – “Idle Supply Current vs. VCC (Internal RC Oscillator, 8 MHz)” on page 191 – “Idle Supply Current vs. VCC (Internal RC Oscillator, 1 MHz)” on page 191 – “Idle Supply Current vs. VCC (Internal RC Oscillator, 128 MHz)” on page 192 – “Power-down Supply Current vs. VCC (Watchdog Timer Disabled)” on page 192 – “Power-down Supply Current vs. VCC (Watchdog Timer Enabled)” on page 193 – “Reset Pin Input Hysteresis vs. VCC” on page 203 – “Reset Pin Input Hysteresis vs. VCC (Reset Pin Used as I/O)” on page 204 – “Watchdog Oscillator Frequency vs . VCC” on page 206 – “Watchdog Oscillator Frequency vs. Temperature” on page 206 – “Calibrated 8 MHz RC Oscillator Frequency vs. VCC” on page 207 – “Calibrated 8 MHz RC oscillator Frequency vs. Temperature” on page 207 – “ADC Current vs. VCC” on page 208 – “Programming Current vs. VCC (ATtiny24)” on page 210 – “Programming Current vs. VCC (ATtiny44)” on page 210 – “Programming Current vs. VCC (ATtiny84)” on page 211
4. Added Figures: – “Re set Pin Output Voltage vs. Sink Current (VCC = 3V)” on page 199
– “Re set Pin Output Voltage vs. Sink Current (VCC = 5V)” on page 199 – “Reset Pin Output Voltage vs. Source Current (VCC = 3V)” on page 20 0 – “Reset Pin Output Voltage vs. Source Current (VCC = 5V)” on page 20 0
5. Updated Tables:
8006GS–AVR–01/08
21
ATtiny24/44/84
– “Device Clocking Options Select” on page 24 – “Start-up Times for the Crystal Oscillator Clock Selection” on page 28 – “Start-up Times for the Internal Calibrated RC Oscillator Clock Selection” on page 26 – “Start-up Times for the External Clock Selection” on page 25 – “Start-up Times for the 128 kHz Internal Oscillator” on page 26 – “Activ e Cloc k Domains and W a ke-up Sou rces in the Diff erent Sleep Modes” on page
32 – “Watchdog Timer Prescale Select” on page 46 – “Reset and Interrupt Vectors” on page 47 – “Overriding Signals for Alternate Functions in PA7..PA5” on page 62 – “Overriding Signals for Alternate Functions in PA4..PA2” on page 63 – “Overriding Signals for Alternate Functions in PA1..PA0” on page 63 – “Port B Pins Alternate Functions” on page 64 – “Overriding Signals for Alternate Functions in PB3..PB2” on page 65 – “Overriding Signals for Alternate Functions in PB1..PB0” on page 66 – “Waveform Generation Modes” on page 109 – “ADC Conversion Time” on page 138 – “Temperature vs. Sensor Output Voltage (Typical Case)” on page 144 – “DC Characteristics. TA = -40×C to +85×C (1)” on page 175 – “Calibration Accuracy of Internal RC Oscillator” on page 178 – “Reset, Brown-out, and Internal Voltage Characteristics” on page 179 – “VBOT vs. BODLEVEL Fuse Coding” on page 180 – “ADC Characteristics, Single Ended Channels. -40×C - 85×C” on page 181 – “ADC Characteristics, Diff erential Channels (B ipolar Mode) , TA = -40×C to 85×C” on
page 183 – “Serial Prog ramming Characteristics , TA = -40×C to 85×C, VCC = 1.8 - 5.5V (Unless
Otherwise Noted)” on page 184 – “High-voltage Serial Programming Characteristics TA = 25×C, VCC = 5V (Unless
otherwise noted)” on page 185
6. Updated code examples in sections: – “Write” on pa ge 17 – “SPI Master Operation Example” on page 119
7. Updated “Ordering Information” in – “ATtiny84” on page 13

9.2 Rev F. 02/07

22
1. Updated Figure 1-1 on page 2, Figure 8-7 on page 42, Figure 20-6 on page 185.
2. Updated Table 9-1 on page 47, Table 10-7 on page 64, Table 11-2 on page 79, Table
11-3 on page 80, Table 11-5 on page 80, Ta ble 11-6 on page 81, T able 11-7 on page 81, Table 11-8 on page 82, Table 20-10 on page 183, Table 20-12 on page 185.
3. Updated table references in “TCCR0A – Timer/Counter Control Register A” on page 79.
8006GS–AVR–01/08

9.3 Rev E. 09/06

ATtiny24/44/84
4. Updated Port B, Bit 0 functions in “Alternate Functions of Port B” on page 64.
5. Updated WDTCR bit name to WDTCSR in assembly code examples.
6. Updated bit5 name in “TIFR1 – Timer/Counter Interrupt Flag Register 1” on page 113.
7. Updated bit5 in “TIFR1 – Timer/Counter Interrupt Flag Register 1” on page 113.
8. Updated “SPI Master Operation Example” on page 119.
9. Updated step 5 in “Enter High-voltage Serial Programming Mode” on page 168.
1. All characterization data moved to “Electrical Characteristics” on page 175.
2. All Register Descriptions gathered up in separate sections at the end of each chapter.
3. Updated “System Control and Reset” on page 38.
4. Updated Table 11-3 on page 80, Table 11-6 on page 81, Table 11-8 on page 82, Table
12-3 on page 108 and Table 12-5 on page 109.
5. Updated “Fast PWM Mode” on page 99.
6. Updated Figure 12-7 on page 100 and Figure 16-1 on page 133.
7. Updated “Analog Comparator Multiplexed Input” on page 129.
8. Added note in Table 19-12 on page 165.
9. Updated “Electrical Characteristics” on page 175.
10. Updated “Typical Characteristics” on page 186.

9.4 Rev D. 08/06

9.5 Rev C. 07/06

9.6 Rev B. 05/06

1. Updated “Calibrated Internal 8 MHz Oscillator” on page 25.
2. Updated “OSCCAL – Oscillator Calibration Register” on page 29.
3. Added Table 20-2 on page 178.
4. Updated code examples in “SPI Master Operation Example” on page 119.
5. Updated code examples in “SPI Slave Operation Example” on page 120.
6. Updated “Signature Bytes” on page 162.
1. Updated Features in “USI – Universal Serial Interface” on page 117.
2. Added “Clock speed considerations” on page 123.
3. Updated Bit description in “ADMUX – ADC Multiplexer Selection Register” on page 145.
4. Added note to Table 18-1 on page 157.
1. Updated “Default Clock Source” on page 28
2. Updated “Power Reduction Register” on page 34.
3. Updated Table 20-4 on page 179, Table 9-4 on page 42, Table 16-3 on page 145,
Table 19-5 on page 161, Tab le 19-12 on page 165 10 on page 183.
4. Updated Features in “Analog to Digital Converter” on page 132.
, Table 19-16 on page 172, Table 20-
8006GS–AVR–01/08
23
ATtiny24/44/84

9.7 Rev A. 12/05

5. Updated Operation in “Analog to Digital Converter” on page 132.
6. Updated “Temperature Measurement” on page 144.
7. Updated DC Characteristics in “Electrical Characteristics” on page 175.
8. Updated “Typical Characteristics” on page 186.
9. Updated “Errata” on pa g e 17.
Initial revision.
24
8006GS–AVR–01/08
ATtiny24/44/84
8006GS–AVR–01/08
25
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8006GS–AVR–01/08
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