No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.
Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see ww w.dtsc.ca.gov/hazardouswaste/
perchlorate”
ASRock Website: http://www.asrock.com
AUSTRALIA ONLY
Our goods come with guarantees that cannot be excluded under the Australian Consumer
Law. You are entitled to a replacement or refund for a major failure and compensation for
any other reasonably foreseeable loss or damage caused by our goods. You are also entitled
to have the goods repaired or replaced if the goods fail to be of acceptable quality and the
failure does not amount to a major failure. If you require assistance please call ASRock Tel
: +886-2-28965588 ext.123 (Standard International call charges apply)
Manufactured under license under U.S. Patent Nos: 5,956,674; 5,974,380; 6,487,535;
7,003,467 & other U.S. and worldwide patents issued & pending. DTS, the Symbol, &
DTS and the Symbol together is a registered trademark & DTS Connect, DTS Interactive,
DTS Neo:PC are trademarks of DTS, Inc. Product includes soware.
2.8 M.2_SSD (NGFF) Module Installation Guide (M2_2 and M2_3) 31
Chapter 3 Software and Utilities Operation 33
3.1 Installing Drivers 33
3.2 A-Tuning 34
3.2.1 Installing A-Tuning 34
3.2.2 Using A-Tuning 34
3.3 ASRock Live Update & APP Shop 37
3.3.1 UI Overview 37
3.3.2 Apps 38
3.3.3 BIOS & Drivers 41
3.3.4 Setting 42
3.4 ASRock RGB LED 43
Chapter 4 UEFI SETUP UTILITY 45
4.1 Introduction 45
4.2 EZ Mode 46
4.3 Advanced Mode 47
4.3.1 UEFI Menu Bar 47
4.3.2 Navigation Keys 48
4.4 Main Screen 49
4.5 OC Tweaker Screen 50
4.6 Advanced Screen 63
4.6.1 CPU Conguration 64
4.6.2 Chipset Conguration 66
4.6.3 Storage Conguration 68
4.6.4 ACPI Conguration 70
4.6.5 USB Conguration 71
4.6.6 Trusted Computing 72
4.7 Tools 73
4.8 Hardware Health Event Monitoring Screen 75
4.9 Security Screen 77
4.10 Boot Screen 78
4.11 Exit Screen 81
Chapter 1 Introduction
ank you for purchasing ASRock X 299E-ITX/ac motherboard, a reliable
motherboard produced under ASRock’s consistently stringent quality control.
It delivers excellent performance with robust design conforming to ASRock’s
commitment to quality and endurance.
In this documentation, Chapter 1 and 2 contains the introduction of the
motherboard and step-by-step installation guides. Chapter 3 contains the operation
guide of the soware and utilities. Chapter 4 contains the conguration guide of
the BIOS setup.
Becau se the motherboard specications and the BIOS soware might be updated, the
content of this documentation will be subject to change without notice. In case any
modications of this documentation occur, the updated version will be available on
ASRock’s website w ithout f urther notice. If you require technical support relate d to
this motherboard, please vi sit our website for s pecic information about the model
you are using. You may nd the l atest VGA cards and CPU suppor t list on ASRock’s
website a s well. ASRock website ht tp://www.a srock.com.
X299E-ITX/ac
1.1 Package Contents
ASRock X299E-ITX/ac Motherboard (Mini-ITX Form Factor)
•
ASRock X299E-ITX/ac Quick Installation Guide
•
ASRock X299E-ITX/ac Support CD
•
1 x I/O Panel Shield
•
2 x Serial ATA (SATA) Data Cables (Optional)
•
1 x ASRock WiFi 2.4/5 GHz Antenna (Optional)
•
3 x Screws for Ultra M.2 Sockets (Optional)
•
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1
1.2 Specications
Platform
CPU
Chipset
Memory
•
•
•
* Supports 28 and 44 PCIe lane processors (6-core and above)
only. 16 PCIe lane processors (4-core) are not supported. Please
refer to CPU Support List on ASRock’s website for more infor-
mation. (http://www.asrock.com/)
•
•
•
•
•
•
•
•
* e maximum memor y frequency supported may vary by
processor type.
* Please refer to Memory Support List on ASRock’s website for
more information. (http://www.asrock.com/)
•
•
Mini-ITX Form Factor
10 Layer PCB
Supports Intel® CoreTM X-Series Processor Family (79xx,
78xx Series) for the LGA 2066 Socket
Digi Power design
7 Power Phase design
Supports Intel® Turbo Boost Max Technology 3.0
Supports ASRock Hyper BCLK Engine III
Intel® X299
Quad Channel DDR4 Memory Technology
4 x DDR4 SO-DIMM Slots
Supports DDR4 4000+(OC)*/3866(OC)/ 3800(OC)/3733
(OC)/3600(OC)/3200(OC)/2933(OC)/2800
(OC)/2666/2400/2133 non-ECC, un-buered memory
Max. capacity of system memory: 64GB
Supports Intel® Extreme Memory Prole (XMP) 2.0
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2
Expansion
Slot
Audio
1 x PCI Express 3.0 x16 Slot (PCIE1: x16 mode)
•
1 x Vertical M.2 Socket (Key E) with the bundled WiFi-
•
802.11ac module (on the rear I/O)
15μ Gold Contact in VGA PCIe Slot (PCIE1)
•
7.1 CH HD Audio with Content Protection (Realtek
•
ALC1220 Audio Codec)
Premium Blu-ray Audio support
•
Supports Surge Protection
•
LAN
Supports Purity SoundTM 4
•
- Nichicon Fine Gold Series Audio Caps
- 120dB SNR DAC with Dierential Amplier
- NE5532 Premium Headset Amplier for Front Panel
Audio Connector (Supports up to 600 Ohm headsets)
- Pure Power-In
- Direct Drive Technology
- Impedance Sensing on Front Out port
-
Gold Audio Jacks
-
15μ Gold Audio Connector
Supports DTS Connect
•
Gigabit LAN 10/100/1000 Mb/s
•
1 x Giga PHY Intel® I219V, 1 x GigaLAN Intel® I211AT
•
Supports Wake-On-LAN
•
Supports Lightning/ESD Protection
•
Supports Dual LAN with Teaming*
•
* Teaming is supported on Windows® 10 RS2 and above.
Supports Energy Ecient Ethernet 802.3az
•
Supports PXE
•
X299E-ITX/ac
Wireless
LAN
Rear Panel
I/O
Intel® Dual Band Wireless-AC 8265
•
Supports IEEE 802.11a/b/g/n/ac
•
Supports Dual-Band (2.4/5 GHz with 80Mhz bandwidth and
•
MU-MIMO)
Supports high speed wireless connections up to 867Mbps
•
2 antennas to support 2 (Transmit) x 2 (Receive) diversity
•
technolog y
Supports Bluetooth 4.2 / 3.0 + High speed class II
•
2 x Antenna Ports
•
1 x Optica l SPDIF Out Port
•
1 x USB 3.1 Gen2 Type-A Port (10 Gb/s) (ASMedia ASM3142)
•
(Supports ESD Protection)
1 x USB 3.1 Gen2 Type-C Port (10 Gb/s) (ASMedia ASM3142)
•
(Supports ESD Protection)
4 x USB 3.1 Gen1 Ports (ASMedia ASM1074 Hub) (Supports
•
ESD Protection)*
2 x RJ-45 LAN Ports with LED (ACT/LINK LED and SPEED
•
LED)*
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3
English
4
Storage
Connector
* If you remove X299E-ITX REAR card, USB 3.1 Gen1 ports and
RJ-45 LAN Ports will not work.
1 x Clear CMOS Button / Power Button
•
HD Audio Jacks: Rear Speaker / Central / Bass / Line in /
•
Front Speaker / Microphone (Gold Audio Jacks)
6 x SATA3 6.0 Gb/s Connectors, support RAID (RAID 0,
Please realize that the re is a certain r isk involved with overclocking, including
adjusting the setting in the BIOS, applying Untied Overclocking Technol ogy, or using
third-party overclocking tool s. Overclocking may aect your system’s stability, or
even cause dam age to the components and devices of your system. It should be done
at your own risk and expense. We are not responsible for poss ible damage caused by
overclocking.
•
FCC, CE, WHQL
•
ErP/EuP ready (ErP/EuP ready power supply is required)
•
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5
1.3 Motherboard Layout
2066 Socke t
Intel
X299
X2 9 9E-I T X/ a c
Ro HS
CHA_FAN1 /W_PUM P
VROC1
1
M2_ WI FI_ 1
REAR_BT N
USB 3.1 Gen2
T:US B31_TA_ 1
B: USB31_ TC_1
Top:
LAN2
USB 3 .1 G en1
T: USB3
B: US B4
Top:
LAN1
USB 3 .1 G en1
T: USB1
B: US B2
Top:
Central/Bass
Cente r:
REAR SPK
Top:
LINE IN
Cente r:
FRONT
Botto m:
Optic al
SPDIF
Botto m:
MIC IN
1
HD_AU DIO1
ATX12V1
ATXP WR 1
FSB800
DDR4_A1 (64 bit, 260 -p in module)
FSB800
DDR4_B1 (64 bit, 260 -p in module)
FSB800
DDR4_D1 (64 bit, 260 -p in module)
FSB800
DDR4_C1 (64 bit, 260 -p in module)
RGB_LED 1
1
1
SPK_PLE D1
HDLED RESET
PLED PWRB TN
PANEL1
1
CPU_FAN1
CPU_OPT /W_PUM P
PC I E1
REA R_I O
FRON T_IO 1
1
TPMS1
A
B
REAR_ BTN_SE L1
Top Side View
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6
M2_2
M2_3
Back Side View
X299E-ITX/ac
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7
Rear Card (For Rear Socket)
1
USB _5_ 6
USB _7_ 8
SATA3_ 6_7SATA3_ 4_5SATA3_ 2_3
X299E-ITX REAR
Front Card (For Front Socket)
X29 9E -I TX FRO NT
RoH S
CT11CT1 2CT1 3CT1 4
M2_1
Ro H S
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8
No. Description
1Chassis Fan / Waterpump Fan Connector (CHA_FAN1/W_PUMP)
2Virtual RAID On CPU Header (VROC1)
32 x 260-pin DDR4 SO-DIMM Slots (DDR4_A1, DDR4_B1)
4RGB LED Header (RGB_LED1)
5System Panel Header (PANEL1)
6ATX 12V Power Connector (ATX12V1)
7Front Socket (FRONTI_IO1)
8CPU Fan Connector (CPU_FAN1)
9CPU Fan / Waterpump Fan Connector (CPU_OPT/W_PUMP)
10 Power LED and Speaker Header (SPK_PLED1)
11 ATX Power Connector (ATXPWR1)
12 2 x 260-pin DDR4 SO-DIMM Slots (DDR4_C1, DDR4_D1)
13 Rear Button Switch (R EAR_BTN_SEL1)
14 Front Panel Audio Header (HD_AUDIO1)
15 Rear Socket (REAR _IO)
16 TPM Header (TPMS1)
17 Ultra M.2 Socket (M2_3)
18 Ultra M.2 Socket (M2_2)
19 Ultra M.2 Socket (M2_1)
20 USB 2.0 Header (USB_5_6)
21 SATA3 Connectors (SATA3_2_3)
22 SATA3 Connectors (SATA3_4_5)
23 SATA3 Connectors (SATA3_6_7)
24 USB 3.1 Gen1 Header (USB_7_8)
X299E-ITX/ac
English
9
1.4 I/O Panel
6
21
3
547
English
13
No. DescriptionNo. Description
1USB 3.1 Gen2 Type-A Port (USB31_TA_1)8Microphone (Pink)
2LAN RJ-45 Port (Intel® I211AT)*9Optical SPDIF Out Port
3LAN RJ-45 Port (Intel® I219V)*10USB 3.1 Gen1 Ports (USB_34)
** If you use a 2- channel speaker, plea se connect the speake r’s plug into “Front Speaker Jack”. See the table below
for connection d etails in accordance w ith the type of speaker you use.
Audio Output
Channels
Front Speaker
(No. 7)
Rear Speaker
(No. 5)
Central / Bass
(No. 4)
2V------
4VV----
6VVV--
8VVVV
To enable Multi-Streaming, you need to connect a front panel audio cable to the
front panel audio header. Aer restarting your computer, you will nd the “Mixer”
tool on your system. Plea se select “Mixe r ToolBox” , click “Enabl e playba ck
multi-streaming”, and click “ok”. Choose “2CH”, “4CH”, “6CH”, or “8CH” and then
you are all owed to select “Realtek HDA Primary out put” to u se the Rear Speak er,
Central/Bas s, and Front Speaker, or select “Realtek HDA Audio 2nd output” to u se
the front panel au dio.
*** Use the Rear Button Switch to adjust th e function of thi s switch.
A: Clear CMOS Button (default); B: Power But ton.
B
A
Line In
(No. 6)
11
English
1.5 Intel® Dual Band Wireless-AC 8265 (AC Wave 2 + BLE BT4.2)
and ASRock WiFi 2.4/5 GHz Antenna
WiFi-802.11ac + BT Module
is motherboard comes with an exclusive WiFi 802.11 a/b/g/n/ac + BT v4.2
module (pre-installed on the rear I/O panel) that oers support for WiFi 802.11 a/b/
g/n/ac connectivity standards and Bluetooth v4.2. WiFi + BT module is an easy-to-
use wireless local area network (WLAN) adapter to support WiFi + BT. Bluetooth
v4.2 standard features Smart Ready technology that adds a whole new class of
functionality into the mobile devices. BT 4.2 also includes Low Energy Technolog y
and ensures extraordinary low power consumption for PCs. e 2T2R WiFi
solution sets a WiFi high speed standard and oers max link rate up to 867Mbps.
* e transmission speed may vary according to the environment.
ASRock WiFi 2.4/5 GHz Antenna
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12
Chapter 2 Installation
is is a Mini-ITX form factor motherboard. Before you install the motherboard,
study the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components
or change any motherboard settings.
Make sure to unplug the power cord before installing or removing the motherboard
•
components. Failure to do so may cause physical injuries and damages to motherboard
components.
In order to avoid damage from static electricity to the motherboard’s components,
•
NEVER place your motherboard directly on a carpet. Also remember to use a grounded
wrist strap or touch a safety grounded object before you handle the components.
Hold components by the edges and do not touch the ICs.
•
Whenever you uninstall any components, place them on a grounded anti-static pad or
•
in the bag that comes with the components.
When placing screws to secure the motherboard to the chassis, please do not over-
•
tighten the screws! Doing so may damage the motherboard.
X299E-ITX/ac
13
English
2.1 Installing the CPU
1. Before you insert the 2066-Pin CPU into the socket, please check if the PnP ca p
is on the socket, if the CPU sur face is unclean, or if th ere are any b ent pins in the
socket. Do not force to insert the CPU into the socket if above situ ation is found.
Other wise, the CPU wil l be seriously d amaged.
2. Unplug all power cable s before instal ling the CPU.
CAUTION:
Please note that X299 platform is only compatible with the LGA 2066 socket, which is
incompatible with the LGA 2011-3 socket (for X99 platform).
1
A
B
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14
A
2
B
X299E-ITX/ac
3
4
A
B
5
English
15
6
A
B
7
A
B
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16
8
Please save and replace the cover if the processor i s removed. e cover must be
placed if you wish to return the motherboard for aer service.
2.2 Installing the CPU Fan and Heatsink
12
X299E-ITX/ac
FAN
CPU_
English
17
2.3 Installation of Memory Modules (SO-DIMM)
is motherboard provides four 260-pin DDR4 (Double Data Rate 4) SO-DIMM slots, and
supports Quad Channel Memory Technology.
1. For quad channel cong uration, you always need to install identical (the same
brand, speed , size and chip-type) DDR4 SO-DIMM pairs.
2. It is not allowed to install a DDR, DDR 2 or DDR3 memory module into a DDR4
slot; otherwise, this motherboard and SO-DIMM may be d amaged.
3. e SO-DIMM only ts in one correct orientation. It w ill cau se permanent damage
to the motherboard and the SO -DIMM if you force the SO-DIM M into the slot at
incorrect orientation.
Quad Channel Memory Conguration
English
DDR4_ A1
DDR4_B1
DDR4_D1
DDR4_C1
If only two memory modules are installed in the DDR4 SO-DIMM slots, then Dual
•
Populated
Populated
Populated
Populated
Channel Memory Technology is activated. If three memory modules are installed, then
Triple Channel Memory Technology is activated.
18
X299E-ITX/ac
1
2
3
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19
2.4 Expansion Slot (PCI Express Slot)
ere is 1 PCI Express slot on the motherboard.
Before installing an ex pansion card, please make sure that the power supply is
switched o or the power cord is unplugged. Plea se read the documentation of the
expan sion card and mak e necessary hardware settings for the card before you start
the installation.
PCIe slot:
PCIE1 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
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20
2.5 Onboard Headers and Connectors
Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over
these header s and connectors. Placing jumper caps over the headers and connectors
will cause permanent damage to the motherboard.
X299E-ITX/ac
System Panel Header
(9-pin PANEL1)
(see p.6, No. 5)
PWRBTN (Power Switch):
Connec t to the power switch on the chassi s front panel. You may congure the way to
turn o your system using the power switch.
RESET (Reset Switch):
Connec t to the reset switch on the chassi s front panel. P ress the reset sw itch to restart
the computer if the compute r freezes and fails to perform a normal restart.
PLED (Syste m Power LED):
Connec t to the power status indicator on the chassis front panel. e LED i s on when
the system is ope rating. e LED keeps blinking when the system i s in S1/S3 sleep
state. e LED is o when the system is in S4 sleep state or powered o (S5).
HDLED (Ha rd Drive Activity LED):
Connec t to the hard drive ac tivity LED on the chassis front panel. e LED is on
when the hard drive i s reading or writing data.
e front panel de sign may dier by chassis. A front pane l module mainly consists
of power switch , reset switch, power LED, hard dr ive activity LED, speak er and etc.
When connecting your chassis front panel module to this head er, make sure the wire
assig nments and the pin assig nments are matched correctly.
1
PLE D+
PLE D-
HDL ED-
HDL ED+
PWR BTN #
GND
GND
RES ET#
GND
Connect the power
switch, reset switch and
system status indicator on
the chassis to this header
according to the pin
assignments below. Note
the positive and negative
pins before connecting
the cables.
21
English
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