Asrock H610M-ITX/eDP Quick Installation Guide

Version 1.0 Published May 2022
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Copyright Notice:
No part of this documentation may be reproduced, transcribed, transmitted, or translated in any language, in any form or by any means, except duplication of documentation by the purchaser for backup purpose, without written consent of ASRock Inc.
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for informational use only and subject to change without notice, and should not be constructed as a commitment by ASRock. ASRock assumes no responsibility for any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide warranty of any kind, either expressed or implied, including but not limited to the implied warranties or conditions of merchantability or tness for a particular purpose.
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is device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that
may cause undesired operation. is equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. ese limits are designed to provide reasonable protection against harmful interference in a residential installation. is equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment o and on, the user is encouraged to try to correct the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit dierent from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
e terms HDMI® and HDMI High-Denition Multimedia Interface, and the HDMI logo are trademarks or registered trademarks of HDMI Licensing LLC in the United
States and other countries.
INTEL END USER SOFTWARE LICENSE AGREEMENT
IMPORTANT - READ BEFORE COPYING, INSTALLING OR USING.
LICENSE. Licensee has a license under Intel’s copyrights to reproduce Intel’s Soware only in its unmodied and binary form, (with the accompanying documentation, the “Soware”) for Licensee’s personal use only, and not commercial use, in connection with Intel-based products for which the Soware has been provided, subject to the following conditions:
(a) Licensee may not disclose, distribute or transfer any part of the Soware, and You agree to prevent unauthorized copying of the Soware.
(b) Licensee may not reverse engineer, decompile, or disassemble the Soware.
(c) Licensee may not sublicense the Soware.
(d) e Soware may contain the soware and other intellectual property of third party suppliers, some of which may be identied in, and licensed in accordance with, an enclosed license.txt le or other text or le.
(e) Intel has no obligation to provide any support, technical assistance or updates for the Soware.
OWNERSHIP OF SOFTWARE AND COPYRIGHTS. Title to all copies of the Soware remains with Intel or its licensors or suppliers. e Soware is copyrighted and protected by the laws of the United States and other countries, and international treaty provisions. Licensee may not remove any copyright notices from the Soware. Except as otherwise expressly provided above, Intel grants no express or implied right under Intel patents, copyrights, trademarks, or other intellectual property rights. Transfer of the license termi­nates Licensee’s right to use the Soware.
DISCLAIMER OF WARRANTY. e Soware is provided “AS IS” without warranty of any kind, EITHER EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION, WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PUR­POSE.
LIMITATION OF LIABILITY. NEITHER INTEL NOR ITS LICENSORS OR SUPPLIERS WILL BE LIABLE FOR ANY LOSS OF PROFITS, LOSS OF USE, INTERRUPTION OF BUSINESS, OR INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAG­ES OF ANY KIND WHETHER UNDER THIS AGREEMENT OR OTHERWISE, EVEN IF INTEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
LICENSE TO USE COMMENTS AND SUGGESTIONS. is Agreement does NOT obligate Licensee to provide Intel with comments or suggestions regarding the Soware. However, if Licensee provides Intel with comments or suggestions for the modication, correction, improvement or enhancement of (a) the Soware or (b) Intel products or processes that work with the Soware, Licensee grants to Intel a non-exclusive, worldwide, perpetual, irrevocable, transferable, royalty-free license, with the right to sublicense, under
Licensee’s intellectual property rights, to incorporate or otherwise utilize those comments and suggestions.
TERMINATION OF THIS LICENSE. Intel or the sublicensor may terminate this license at any time if Licensee is in breach of any of its terms or conditions. Upon termination, Licensee will immediately destroy or return to Intel all copies of the Soware.
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U.S. GOVERNMENT RESTRICTED RIGHTS. e Soware is a commercial item (as dened in 48 C.F.R. 2.101) consisting of commercial computer soware and commercial computer soware documentation (as those terms are used in 48 C.F.R. 12.212), consistent with 48 C.F.R. 12.212 and 48 C.F.R 227.7202-1 through 227.7202-4. You will not provide the Soware to the U.S. Government. Contractor or Manufacturer is Intel Corporation, 2200 Mission College Blvd., Santa Clara, CA 95054.
EXPORT LAWS. Licensee agrees that neither Licensee nor Licensee’s subsidiaries will export/re-export the Soware, directly or indirectly, to any country for which the U.S. Department of Commerce or any other agency or department of the U.S. Government or the foreign government from where it is shipping requires an export license, or other governmental approval, without rst obtaining any such required license or approval. In the event the Soware is exported from the U.S.A. or re-exported from a foreign destina­tion by Licensee, Licensee will ensure that the distribution and export/re-export or import of the Soware complies with all laws, regulations, orders, or other restrictions of the U.S. Export Administration Regulations and the appropriate foreign government.
APPLICABLE LAWS. is Agreement and any dispute arising out of or relating to it will be governed by the laws of the U.S.A. and Delaware, without regard to conict of laws principles. e Parties to this Agreement exclude the application of the United Nations Convention on Contracts for the International Sale of Goods (1980). e state and federal courts sitting in Delaware, U.S.A. will have exclusive jurisdiction over any dispute arising out of or relating to this Agreement. e Parties consent to personal jurisdiction and venue in those courts. A Party that obtains a judgment against the other Party in the courts iden­tied in this section may enforce that judgment in any court that has jurisdiction over the Parties.
Licensee’s specic rights may vary from country to country.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance controlled in Perchlorate Best Management Practices (BMP) regulations passed by the California Legislature. When you discard the Lithium battery in California, USA, please follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/ perchlorate”
AUSTRALIA ONLY
Our goods come with guarantees that cannot be excluded under the Australian Consumer Law. You are entitled to a replacement or refund for a major failure and compensation for any other reasonably foreseeable loss or damage caused by our goods. You are also entitled to have the goods repaired or replaced if the goods fail to be of acceptable quality and the failure does not amount to a major failure. If you require assistance please call ASRock Tel : +886-2-28965588 ext.123 (Standard International call charges apply)
ASRock INC. hereby declares that this device is in compliance with the essential require­ments and other relevant provisions of related UKCA Directives. Full text of UKCA decla­ration of conformity is available at: http://www.asrock.com
ASRock INC. hereby declares that this device is in compliance with the essential require­ments and other relevant provisions of related Directives. Full text of EU declaration of conformity is available at: http://www.asrock.com
ASRock follows the green design concept to design and manufacture our products, and makes sure that each stage of the product life cycle of ASRock product is in line with global environmental regulations. In addition, ASRock disclose the relevant information based on regulation requirements.
Please refer to https://www.asrock.com/general/about.asp?cat=Responsibility for informa­tion disclosure based on regulation requirements ASRock is complied with:
DO NOT throw the motherboard in municipal waste. is product has been designed to enable proper reuse of parts and recycling. is symbol of the crossed out wheeled bin indicates that the product (electrical and electronic equipment) should not be placed in municipal waste. Check local regulations for disposal of electronic products.
CE Warning
is device complies with directive 2014/53/EU issued by the Commision of the European Community.
is equipment complies with EU radiation exposure limits set forth for an uncontrolled environment. is equipment should be installed and operated with minimum distance 20cm between the radiator & your body.
Operations in the 5.15-5.35GHz band are restricted to indoor usage only.
Radio transmit power per transceiver type
Function Frequency Maximum Output Power (EIRP)
2400-2483.5 MHz 18.5 + / -1.5 dbm
5150-5250 MHz 21.5 + / -1.5 dbm
WiFi
Bluetooth 2400-2483.5 MHz 8.5 + / -1.5 dbm
5250-5350 MHz
5470-5725 MHz
18.5 + / -1.5 dbm (no TPC)
21.5 + / -1.5 dbm (TPC)
25.5 + / -1.5 dbm (no TPC)
28.5 + / -1.5 dbm (TPC)
Motherboard Layout
Top Side View
H610M-ITX/eDP
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Back Side View
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No. Description
1 Chassis Fan Connector (CHA_FAN2)
2 ATX 12V Power Connector (ATX12V1)
3 CPU Fan Connector (CPU_FAN1)
4 Chassis/Water Pump Fan Connector (CHA_FAN1/WP)
5 2 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)
6 ATX Power Connector (ATXPWR1)
7 USB 2.0 Header (USB_5_6)
8 USB 3.2 Gen1 Header (USB32_3_4)
9 SATA3 Connector (SATA3_0)
10 SATA3 Connector (SATA3_1)
11 SATA3 Connector (SATA3_2)
12 SATA3 Connector (SATA3_3)
13 System Panel Header (PANEL1)
14 Clear CMOS Jumper (CLRMOS1)
15 Chassis Speaker Header (SPEAKER1)
16 Front Panel Audio Header (HD_AUDIO1)
17 eDP Signal Connector (EDP1)
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I/O Panel
2
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3
9 467
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No. Description No. Description
1 LAN RJ-45 Port* 6 USB 3.2 Gen1 Ports (USB32_12)
2 Line In (Light Blue)** 7 USB 2.0 Ports (USB_1234)***
3 Front Speaker (Lime)** 8 DisplayPort 1.4
4 Microphone (Pink)** 9 HDMI Port
5 Antenna Ports
* ere are two LEDs on each LAN port. Please refer to the table below for the LAN port LED indications.
ACT/LINK L ED
SPEED LE D
LAN Por t
Activity / Link LED Speed LED
Status Description Status Description
O No Link O 10Mbps connection Blinking Data Activity Orange 100Mbps connection On Link Green 1Gbps connection
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** Function of the Au dio Ports in 7.1-channel Con guration:
Port Function
Light Blue (Rear panel) Rear Speaker Out Lime (Rear panel) Front Speaker Out Pink (Rear panel) Central /Subwoofer Speaker Out Lime (Front panel) Side Speaker Out
*** CNVi BT shares bandwidth with the top USB 2.0 por t (USB_1). When CNVi BT is used, USB_1 becomes unavailable.
H610M-ITX/eDP
WiFi-802.11ac Module and ASRock WiFi 2.4/5 GHz Antennas
WiFi-802.11ac + BT Module
is motherboard comes with an exclusive WiFi 802.11 a/b/g/n/ac + BT v5.1 module (pre-installed on the rear I/O panel) that oers support for WiFi 802.11 a/b/ g/n/ac connectivity standards and Bluetooth v5.1. WiFi + BT module is an easy-to­use wireless local area network (WLAN) adapter to support WiFi + BT. Bluetooth v5.1 standard features Smart Ready technology that adds a whole new class of functionality into the mobile devices. BT 5.1 also includes Low Energy Technology and ensures extraordinary low power consumption for PCs.
* e transmission speed may vary according to the environment.
* CNVi BT shares bandwidth with the top USB 2.0 port (USB_1) on the rear I/O. When CNVi BT is used, USB_1 becomes unavailable.
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WiFi Antennas Installation Guide
Step 1
Prepare the WiFi 2.4/5 GHz Antennas that come with the package.
Step 2
Connect the two WiFi 2.4/5 GHz Antennas to the antenna connectors. Turn the antenna clock­wise until it is securely connected.
Step 3
Set the WiFi 2.4/5 GHz Antenna as shown in the illustration.
*You may need to adjust the direction of the antenna for a stronger signal.
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Chapter 1 Introduction
ank you for purchasing ASRock H610M-ITX/eDP motherboard, a reliable motherboard produced under ASRock’s consistently stringent quality control. It delivers excellent performance with robust design conforming to ASRock’s commitment to quality and endurance.
Becau se the motherboard specications and the BIOS soware might be updated, the content of this documentation will be subject to change without notice. In case any modications of this documentation occur, the updated version will be available on ASRock’s website without further notice. If you require technical support related to this motherboard, please vi sit our website for s pecic information about the model you are using. You may nd the l atest VGA cards and CPU suppor t list on ASRock’s website a s well. ASRock website http://www.a srock.com.
1.1 Package Contents
ASRock H610M-ITX/eDP Motherboard (Mini-ITX Form Factor)
•
ASRock H610M-ITX/eDP Quick Installation Guide
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ASRock H610M-ITX/eDP Support CD
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2 x Serial ATA (SATA) Data Cables (Optional)
•
2 x ASRock WiFi 2.4/5 GHz Antennas (Optional)
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1 x Screw for M.2 Socket (Optional)
•
1 x I/O Panel Shield
•
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1.2 Specications
Platform
CPU
Chipset
Memory
* Please refer to Memory Support List on ASRock's website for more information. (http://www.asrock.com/)
Mini-ITX Form Factor
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Solid Capacitor design
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Supports 12th Gen Intel® CoreTM Processors (LGA1700)
•
Digi Power design
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6 Power Phase design
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Supports Intel® Hybrid Technology
•
Supports Intel® Turbo Boost Max 3.0 Technology
•
Intel® H610
•
Dual Channel DDR4 Memory Technology
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2 x DDR4 DIMM Slots
•
Supports DDR4 non-ECC, un-buered memory up to 3200*
•
Supports ECC UDIMM memory modules (operate in non-
•
ECC mode) Max. capacity of system memory: 64GB
•
Supports Intel® Extreme Memory Prole (XMP) 2.0
•
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Expansion
Slot
Graphics
CPU:
1 x PCIe 4.0 x16 Slot (PCIE1), supports x16 mode*
•
Chipset:
1 x Vertical M.2 Socket (Key E), supports type 2230 Intel®
•
CNVi (Integrated WiFi/BT)**
* Supports NVMe SSD as boot disks ** CNVi BT shares bandwidth with the top USB 2.0 port (USB_1) on the rear I/O. When CNVi BT is used, USB_1 becomes unavailable.
Intel® UHD Graphics Built-in Visuals and the VGA outputs
•
can be supported only with processors which are GPU integrated. Intel® Xe Graphics Architecture (Gen 12)
•
ree graphics output options: eDP 1.4, HDMI and
•
DisplayPort 1.4
Audio
LAN
Supports Triple Monitor
•
Supports eDP 1.4 with max. resolution up to Full HD
•
(1920x1080) @ 60Hz Supports HDMI 2.1 TMDS Compatible with max. resolution
•
up to 4K x 2K (4096x2160) @ 60Hz Supports DisplayPort 1.4 with DSC (compressed) max.
•
resolution up to 8K (7680x4320) @ 60Hz / 5K (5120x3200) @ 120Hz Supports HDCP 2.3 with eDP 1.4, HDMI 2.1 TMDS
•
Compatible and DisplayPort 1.4 Ports
7.1 CH HD Audio (Realtek ALC897 Audio Codec)
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Supports Surge Protection
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Gigabit LAN 10/100/1000 Mb/s
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Giga PHY Intel® I219V
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Supports Wake-On-LAN
•
Supports Lightning/ESD Protection
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Supports Energy Ecient Ethernet 802.3az
•
Supports UEFI PXE
•
H610M-ITX/eDP
Wireless LAN
Rear Panel I/O
802.11ac WiFi Module
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Supports IEEE 802.11a/b/g/n/ac
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Supports Dual-Band (2.4/5 GHz)
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Supports high speed wireless connections up to 433Mbps
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Supports Bluetooth 5.1 + High speed class II
•
2 x Antenna Ports
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1 x HDMI Port
•
1 x DisplayPort 1.4
•
2 x USB 3.2 Gen1 Ports (Supports ESD Protection)
•
4 x USB 2.0 Ports (Supports ESD Protection)*
•
* CNVi BT shares bandwidth with the top USB 2.0 port (USB_1). When CNVi BT is used, USB_1 becomes unavailable.
1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED
•
LED) HD Audio Jacks: Line in / Front Speaker / Microphone
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Storage
Connector
Chipset:
1 x Ultra M.2 Socket (M2_1, Key M), supports type 2280
•
SATA3 6.0 Gb/s & PCIe Gen3x4 (32 Gb/s) modes* 4 x SATA3 6.0 Gb/s Connectors**
•
* Supports NVMe SSD as boot disks * Supports ASRock U.2 Kit ** If M2_1 is occupied by a SATA-type M.2 device, SATA3_0 will be disabled.
1 x eDP Signal Connector
•
1 x CPU Fan Connector (4-pin)
•
* e CPU Fan Connector supports the CPU fan of maximum 1A (12W) fan power.
1 x Chassis Fan Connector (4-pin)
•
* e Chassis Fan Connector supports the chassis fan of maxi­mum 1A (12W) fan power.
1 x Chassis/Water Pump Fan Connector (4-pin) (Smart Fan
•
Speed Control) * e Chassis/Water Pump Fan supports the water cooler fan of maximum 2A (24W) fan power. * CHA_FAN1/WP can auto detect if 3-pin or 4-pin fan is in use.
1 x 24 pin ATX Power Connector
•
1 x 8 pin 12V Power Connector
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1 x Front Panel Audio Connector
•
1 x USB 2.0 Header (Supports 2 USB 2.0 ports) (Supports
•
ESD Protection)
1 x USB 3.2 Gen1 Header (Supports 2 USB 3.2 Gen1 ports)
•
(Supports ESD Protection)
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BIOS Feature
AMI UEFI Legal BIOS with multilingual GUI support
•
ACPI 6.0 Compliant wake up events
•
SMBIOS 2.7 Support
•
CPU Core/Cache, CPU GT, DRAM, VCCIN AUX, +1.05V
•
PROC, +1.8V PROC, +0.82V PCH, +1.05V PCH Voltage
Multi-adjustment
Fan Tachometer: CPU, Chassis, Chassis/Water Pump Fans
Hardware Monitor
•
Quiet Fan (Auto adjust chassis fan speed by CPU tempera-
•
ture): CPU, Chassis, Chassis/Water Pump Fans Fan Multi-Speed Control: CPU, Chassis, Chassis/Water
•
Pump Fans Voltage monitoring: CPU Vcore, +12V, +5V, +3.3V, +1.05V
•
PCH
Microso® Windows® 10 64-bit / 11 64-bit
OS
Certica­tions
* For detailed product information, please visit our website: http://ww w.asrock.com
Please realize that the re is a certain risk involved with overclocking, including adjusting the setting in the BIOS, applying Untied Overclocking Technology, or using third-party overclocking tool s. Overclocking may aect your system’s stability, or even cause damage to the components and devices of your system. It should be done at your own risk and expense. We are not responsible for possible damage caused by overclocking.
•
FCC, CE
•
ErP/EuP ready (ErP/EuP ready power supply is required)
•
H610M-ITX/eDP
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Chapter 2 Installation
is is a Mini-ITX form factor motherboard. Before you install the motherboard, study the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components or change any motherboard settings.
Make sure to unplug the power cord before installing or removing the motherboard
•
components. Failure to do so may cause physical injuries and damages to motherboard components. In order to avoid damage from static electricity to the motherboard’s components,
•
NEVER place your motherboard directly on a carpet. Also remember to use a grounded wrist strap or touch a safety grounded object before you handle the components. Hold components by the edges and do not touch the ICs.
•
Whenever you uninstall any components, place them on a grounded anti-static pad or
•
in the bag that comes with the components. When placing screws to secure the motherboard to the chassis, please do not over-
•
tighten the screws! Doing so may damage the motherboard.
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2.1 Installing the CPU
1. Before you insert the 1700-Pin CPU into the socket, please check if the P nP cap is on the socket, if the CPU sur face is unclean, or if there are any b ent pins in the socket. Do not force to insert the CPU into the socket if above situation is found. Other wise, the CPU will be seriously d amaged.
2. Unplug all power cables be fore installing the CPU.
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H610M-ITX/eDP
A
B
2 3
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4
76
5
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Please save and replace the cover if the processor i s removed. e cover must be placed if you wish to return the motherboard for aer service.
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2.2 Installing the CPU Fan and Heatsink
1 2
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CPU_FAN
2.3 Installing Memory Modules (DIMM)
is motherboard provides two 288-pin DDR4 (Double Data Rate 4) DIMM slots, and supports Dual Channel Memory Technology.
1. For dual channel conguration, you always need to install identical (the same brand, speed , size and chip-type) DDR4 DIMM pairs.
2. It is unable to activate Dual Channel Memor y Technology with only one memory module installed.
3. It is not allowed to install a DDR, DDR2 or DDR3 memory module into a DDR4 slot; otherwise, this motherboard and DIMM may be damaged.
e DIMM only ts in one correct orientation. It will cause permanent damage to the mothe rboard and the DIMM if you force the DIMM into the slot at incor rect orientation.
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2.4 Expansion Slots (PCIe Slot)
ere is 1 PCIe slot on the motherboard.
Before installing an ex pansion card, please make sure that the power supply is switched o or the power cord is unplugged. Plea se read the documentation of the expan sion card and make necessary hardware settings for the card before you start the installation.
PCIe slots: PCIE1 (PCIe 4.0 x16 slot) is used for PCIe x16 lane width graphics cards.
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2.5 Jumpers Setup
e illustration shows how jumpers are setup. When the jumper cap is placed on the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper is
“Open”.
Clear CMOS Jumper (CLRMOS1) (see p.1, No. 14)
CLRMOS1 allows you to clear the data in CMOS. To clear and reset the system parameters to default setup, please turn o the computer and unplug the power cord from the power supply. Aer waiting for 15 seconds, use a jumper cap to short the pins on CLRMOS1 for 5 seconds. However, please do not clear the CMOS right aer you update the BIOS. If you need to clear the CMOS when you just nish updating the BIOS, you must boot up the system rst, and then shut it down before you do the clear-CMOS action. Please be noted that the password, date, time, and user default prole will be cleared only if the CMOS battery is removed. Please remember toremove the jumper cap aer clearing the CMOS.
2-pin Jumper
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2.6 Onboard Headers and Connectors
Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over these headers and connectors. Placing jumper caps over the headers and connectors will cause permanent damage to the motherboard.
H610M-ITX/eDP
System Panel Header (9-pin PANEL1) (see p.1, No. 13)
PWRBTN (Power Button):
Connec t to the power button on the chassi s front panel. You may congure the way to turn o your system using the powe r button.
RESET (Reset Button):
Connec t to the reset button on the chassi s front panel. Press the reset button to restar t the computer if the computer freezes and fails to perform a nor mal restart.
PLED (Syste m Power LED):
Connec t to the power status indicator on the chassis front panel. e LED i s on when the system is ope rating. e LED keeps blinking when the system i s in S1/S3 sleep state. e LED is o when the system is in S4 sleep state or powered o (S5).
HDLED (Ha rd Drive Activity LED):
Connec t to the hard drive activity LED on the chassis front panel. e LED is on when the hard drive i s reading or writing data.
e front panel design may dier by chassis. A front panel module mainly consists of power button, reset button, power LED, hard drive activity LED, speaker and etc. When connecting your chassis front panel module to this head er, make sure the wire assig nments and the pin assig nments are matched correctly.
GND
PWR BT N #
PLE D-
PLE D+
GND
RES ET#
GND
HDL ED -
HDL ED +
1
Connect the power button, reset button and system status indicator on the chassis to this header according to the pin assignments below. Note the positive and negative pins before connecting the cables.
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Serial ATA3 Connectors
1
(SATA3_0: see p.1, No. 9) (SATA3_1: see p.1, No. 10) (SATA3_2: see p.1, No. 11) (SATA3_3: see p.1, No. 12)
SATA3_1
SATA3_3
ese four SATA3 connectors support SATA data cables for internal
SATA3_0
storage devices with up to
6.0 Gb/s data transfer rate.
SATA3_2
* If M2_1 is occupied by a SATA-type M.2 device, SATA3_0 will be disabled.
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USB 2.0 Header (9-pin USB_5_6) (see p.1, No. 7)
USB 3.2 Gen1 Header (19-pin USB32_3_4) (see p.1, No. 8)
Front Panel Audio Header (9-pin HD_AUDIO1) (see p.1, No. 16)
1. High Denition Audio supports Jack Sensing, but the panel wire on the chassis
2. If you use an AC’97 audio panel, please install it to the front panel audio heade r by
MIC 2_L
MIC 2_R
must support HDA to function correctly. Please follow the instructions in our manual and chassis manual to install your system.
the steps below: A. Connect Mic_IN (MIC) to MIC2_ L. B. Conne ct Audio_R (RIN) to OUT2_R and Audio_ L (LIN) to OUT2_ L. C. Connect Ground (GND) to Ground (GND). D. MIC_ RET and OUT_RET are for the HD audio panel only. You don’t need to connect them for the AC’97 audio panel. E. To activate the front mic, go to the “FrontMic” Tab in the Realtek Control panel and adju st “Recording Volume”.
OUT 2_R
J_S ENS
USB _PW R
IntA _PA_S SRX-
IntA _PA_S SRX+
IntA _PA_S STX-
IntA _PA_S STX+
IntA _PA_D -
IntA _PA_D +
E
OUT 2_L
USB _PW R
P-
P-
P+
Vbus
GND
GND
P+
DUM MY
VbusVbus
IntA _PB_ SSRX -
IntA _PB_ SSRX +
GND
IntA _PB_ SSTX -
IntA _PB_ SSTX +
GND
IntA _PB_ D-
IntA _PB_ D+
Dumm y
1
OUT _RE T
GND GND
GND
PRE SEN CE #
MIC _RE T
ere is one USB
2.0 header on this motherboard. is USB
2.0 header can support two ports.
ere is one header on this motherboard. is USB 3.2 Gen1 header can support two ports.
is header is for connecting audio devices to the front audio panel.
22
H610M-ITX/eDP
CPU_ FAN_SP EED
FAN_S PEED_ CONTR OL
4 3 2 1
Chassis Speaker Header (4-pin SPEAKER1) (see p.1, No. 15)
Chassis/Water Pump Fan Connector (4-pin CHA_FAN1/WP) (see p.1, No. 4)
Chassis Fan Connector (4-pin CHA_FAN2) (see p.1, No. 1)
CPU Fan Connector (4-pin CPU_FAN1) (see p.1, No. 3)
SPE AKE R
DUM MY
DUM MY
+5V
FAN _SP EED _CO NTR OL
CHA _FA N_S PEE D
FAN _VO LTA GE
FAN _SP EED _C ONT ROL
CHA _FA N_S PE ED
1
4 3 2 1
GND
4 3 2 1
+12 V
Please connect the chassis speaker to this header.
is motherboard provides a 4-Pin water cooling chassis fan connector. If you plan to connect a 3-Pin chassis water cooler fan, please connect it to Pin 1-3.
Please connect fan cables to the fan connector and match the black wire to the ground pin.
GND
is motherboard pro­vides a 4-Pin CPU fan (Quiet Fan) connector. If you plan to connect a 3-Pin CPU fan, please connect it to Pin 1-3.
ATX Power Connector (24-pin ATXPWR1) (see p.1, No. 6)
12
24
is motherboard pro­vides a 24-pin ATX power connector. To use a 20-pin ATX power supply, please plug it along Pin 1 and Pin
1
13
13.
English
23
ATX 12V Power
8 5
Connector (8-pin ATX12V1) (see p.1, No. 2)
4
is motherboard provides a 8-pin ATX 12V
1
power connector. To use a 4-pin ATX power supply, please plug it along Pin 1 and Pin 5.
*Warning: Please make
sure that the power cable
connected is for the CPU
and not the graphics
card. Do not plug the
PCIe power cable to this
connector.
English
24
eDP Signal Connector (40-pin EDP1) (see p.2, No. 17)
PIN SIGNAL
N/A
1
LCD_BLT_VCC
2
LCD_BLT_VCC
3
LCD_BLT_VCC
4
LCD_BLT_VCC
5
N/A
6
N/A
7
eDP_VARY_BL
8
eDP_BLON
9
BKT_GND
10
BKT_GND
11
BKT_GND
12
BKT_GND
13
eDP_HPD_CON
14
PNL_GND
15
PNL_GND
16
PNL_GND
17
PNL_GND
18
N/A
19
+LVDD
20
+LVDD
21
+LVDD
22
+LVDD
23
GND
24
eDP_AUX#_CON
25
eDP_AUX_CON
26
GND
27
eDP_TX0_CON
28
eDP_TX#0_CON
29
GND
30
eDP_TX1_CON
31
eDP_TX#1_CON
32
GND
33
N/A
34
N/A
35
GND
36
N/A
37
N/A
38
GND
39
N/A
40
is connector is for an LCD monitor that sup­ports an internal embed­ded DisplayPort (eDP).
*Please refer to page 29 for further instructions on how to adjust the brightness.
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