No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.
Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see ww w.dtsc.ca.gov/hazardouswaste/
perchlorate”
ASRock Website: http://www.asrock.com
Page 3
AUSTRALIA ONLY
Our goods come with guarantees that cannot be excluded under the Australian Consumer
Law. You are entitled to a replacement or refund for a major failure and compensation for
any other reasonably foreseeable loss or damage caused by our goods. You are also entitled
to have the goods repaired or replaced if the goods fail to be of acceptable quality and the
failure does not amount to a major failure. If you require assistance please call ASRock Tel
: +886-2-28965588 ext.123 (Standard International call charges apply)
e terms HDMI® and HDMI High-Denition Multimedia Interface, and the HDMI
logo are trademarks or registered trademarks of HDMI Licensing LLC in the United
States and other countries.
INTEL END USER SOFTWARE LICENSE AGREEMENT
IMPORTANT - READ BEFORE COPYING, INSTALLING OR USING.
LICENSE. Licensee has a license under Intel’s copyrights to reproduce Intel’s Soware
only in its unmodied and binar y form, (with the accompanying documentation, the
“Soware”) for Licensee’s personal use only, and not commercial use, in connection with
Intel-based products for which the Soware has been provided, subject to the following
conditions:
(a) Licensee may not disclose, distribute or transfer any part of the Soware, and You agree
to prevent unauthorized copying of the Soware.
(b) Licensee may not reverse engineer, decompile, or disassemble the Soware.
(c) Licensee may not sublicense the Soware.
(d) e Soware may contain the soware and other intellectual property of third party
suppliers, some of which may be identied in, and licensed in accordance with, an enclosed
license.txt le or other text or le.
(e) Intel has no obligation to provide any support, technical assistance or updates for the
Soware.
OWNERSHIP OF SOFTWARE AND COPYRIGHTS. Title to all copies of the Soware
remains with Intel or its licensors or suppliers. e Soware is copyrighted and protected
by the laws of the United States and other countries, and international treaty provisions.
Licensee may not remove any copyright notices from the Soware. Except as other wise
expressly provided above, Intel grants no express or implied right under Intel patents,
copyrights, trademarks, or other intellectual property rights. Transfer of the license terminates Licensee’s right to use the Soware.
DISCLAIMER OF WARRANTY. e Soware is provided “AS IS” without warranty of
any kind, EITHER EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION,
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.
LIMITATION OF LIABILITY. NEITHER INTEL NOR ITS LICENSORS OR SUPPLIERS
WILL BE LIABLE FOR ANY LOSS OF PROFITS, LOSS OF USE, INTERRUPTION OF
BUSINESS, OR INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAG
Page 4
ES OF ANY KIND WHETHER UNDER THIS AGREEMENT OR OTHERWISE, EVEN
IF INTEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
LICENSE TO USE COMMENTS AND SUGGESTIONS. is Agreement does NOT
obligate Licensee to provide Intel with comments or suggestions regarding the Soware.
However, if Licensee provides Intel with comments or suggestions for the modication,
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perpetual, irrevocable, transferable, royalty-free license, with the right to sublicense, under
Licensee’s intellectual property rights, to incorporate or otherwise utilize those comments
and suggestions.
TERMINATION OF THIS LICENSE. Intel or the sublicensor may terminate this license
at any time if Licensee is in breach of any of its terms or conditions. Upon termination,
Licensee will immediately destroy or return to Intel all copies of the Soware.
THIRD PARTY BENEFICIARY. Intel is an intended beneciary of the End User License
Agreement and has the right to enforce all of its terms.
U.S. GOVERNMENT RESTRICTED RIGHTS. e Soware is a commercial item (as
dened in 48 C.F.R. 2.101) consisting of commercial computer soware and commercial
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with 48 C.F.R. 12.212 and 48 C.F.R 227.7202-1 through 227.7202-4. You will not provide
the Soware to the U.S. Government. Contractor or Manufacturer is Intel Corporation,
2200 Mission College Blvd., Santa Clara, CA 95054.
EXPORT LAWS. Licensee agrees that neither Licensee nor Licensee’s subsidiaries will
export/re-export the Soware, directly or indirectly, to any country for which the U.S.
Department of Commerce or any other agency or department of the U.S. Government
or the foreign government from where it is shipping requires an export license, or other
governmental approval, without rst obtaining any such required license or approval. In
the event the Soware is exported from the U.S.A. or re-exported from a foreign destination by Licensee, Licensee will ensure that the distribution and export/re-export or import
of the Soware complies with all laws, regulations, orders, or other restrictions of the U.S.
Export Administration Regulations and the appropriate foreign government.
APPLICABLE LAWS. is Agreement and any dispute arising out of or relating to it will
be governed by the laws of the U.S.A. and Delaware, without regard to conict of laws
principles. e Parties to this Agreement exclude the application of the United Nations
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Parties.
Licensee’s specic rights may vary from country to country.
3.2.2 Using ASRock Motherboard Utility (A-Tuning) 25
3.3 ASRock Live Update & APP Shop 28
3.3.1 UI Overview 28
3.3.2 Apps 29
3.3.3 BIOS & Drivers 32
3.3.4 Setting 33
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Chapter 4 UEFI SETUP UTILITY 34
4.1 Introduction 34
4.2 EZ Mode 35
4.3 Advanced Mode 36
4.3.1 UEFI Menu Bar 36
4.3.2 Navigation Keys 37
4.4 Main Screen 38
4.5 OC Tweaker Screen 39
4.6 Advanced Screen 53
4.6.1 CPU Conguration 54
4.6.2 Chipset Conguration 57
4.6.3 Storage Conguration 60
4.6.4 Super IO Conguration 61
4.6.5 ACPI Conguration 62
4.6.6 USB Conguration 63
4.6.7 Trusted Computing 64
4.7 Tools 66
4.8 Hardware Health Event Monitoring Screen 68
4.9 Security Screen 70
4.10 Boot Screen 71
4.11 Exit Screen 74
Page 7
Chapter 1 Introduction
ank you for purchasing ASRock H610M-HDV / H610M-HVS motherboard,
a reliable motherboard produced under ASRock ’s consistently stringent quality
control. It delivers excellent performance with robust design conforming to
ASRock’s commitment to quality and endurance.
In this documentation, Chapter 1 and 2 contains the introduction of the
motherboard and step-by-step installation guides. Chapter 3 contains the operation
guide of the soware and utilities. Chapter 4 contains the conguration guide of
the BIOS setup.
Becau se the motherboard specications and the BIOS soware might be updated, the
content of this documentation will be subject to change without notice. In case any
modications of this documentation occur, the updated version will be available on
ASRock’s website w ithout f urther notice. If you require technical support relate d to
this motherboard, please vi sit our website for s pecic information about the model
you are using. You may nd the l atest VGA cards and CPU suppor t list on ASRock’s
website a s well. ASRock website ht tp://www.a srock.com.
1.1 Package Contents
ASRock H610M-HDV / H610M-HVS Motherboard (Micro ATX Form Factor)
Please realize that the re is a certain r isk involved with overclo cking, including
adjusting the setting in the BIOS, applying Untied Overclocking Technol ogy, or using
third-party overclocking tool s. Overclocking may aect your system’s stability, or
even cause dam age to the components and devices of your system. It should be done
at your own risk and expense. We are not responsible for poss ible damage caused by
overclocking.
** Function of the Au dio Ports in 7.1-channel Con guration:
PortFunction
Light Blue (Rear panel)Rear Speaker Out
Lime (Rear panel)Front Speaker Out
Pink (Rear panel)Central /Subwoofer Speaker Out
Lime (Front panel)Side Speaker Out
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Chapter 2 Installation
is is a Micro ATX form factor motherboard. Before you install the motherboard,
study the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components
or change any motherboard settings.
Make sure to unplug the power cord before installing or removing the motherboard
•
components. Failure to do so may cause physical injuries and damages to motherboard
components.
In order to avoid damage from static electricity to the motherboard’s components,
•
NEVER place your motherboard directly on a carpet. Also remember to use a grounded
wrist strap or touch a safety grounded object before you handle the components.
Hold components by the edges and do not touch the ICs.
•
Whenever you uninstall any components, place them on a grounded anti-static pad or
•
in the bag that comes with the components.
When placing screws to secure the motherboard to the chassis, please do not over-
•
tighten the screws! Doing so may damage the motherboard.
H610M-HDV
H610M-HVS
11
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2.1 Installing the CPU
1. Before you insert the 1700-Pin CPU into the socket, ple ase check if the P nP cap
is on the socket, if the CPU sur face is unclean, or if th ere are any b ent pins in the
socket. Do not force to insert the CPU into the socket if above situ ation is found.
Other wise, the CPU wil l be seriously d amaged.
2. Unplug all power cables be fore installing the CPU.
1
A
B
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H610M-HDV
H610M-HVS
4
76
5
13
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Please save and replace the cover if the processor i s removed. e cover must be
placed if you wish to return the motherboard for aer service.
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2.2 Installing the CPU Fan and Heatsink
12
H610M-HDV
H610M-HVS
CPU_FAN
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2.3 Installing Memory Modules (DIMM)
is motherboard provides two 288-pin DDR4 (Double Data Rate 4) DIMM slots,
and supports Dual Channel Memory Technology.
1. For dual channel conguration, you always need to install identica l (the same
brand, speed , size and chip-type) DDR4 DIMM pairs.
2. It is unable to activate Dual Channel Memor y Technology with only one memory
module instal led.
3. It is not allowed to install a DDR, DDR2 or DDR3 memory module into a DDR4
slot; otherwise, this motherboard and DIMM may be damaged.
e DIMM only ts in one correct orie ntation. It will cause permanent dam age to
the mothe rboard and the DIMM if you force the DIMM into the slot at incor rect
orientation .
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H610M-HDV
H610M-HVS
1
2
3
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2.4 Expansion Slots (PCIe Slots)
ere are 2 PCIe slots on the motherboard.
Before installing an ex pansion card, please make sure that the power supply is
switched o or the power cord is unplugged. Plea se read the documentation of the
expan sion card and mak e necessary hardware settings for the card before you start
the installation.
PCIe slots:
PCIE1 (PCIe 3.0 x1 slot) is used for PCIe x1 lane width cards.
PCIE2 (PCIe 4.0 x16 slot) is used for PCIe x16 lane width graphics cards.
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2.5 Jumpers Setup
e illustration shows how jumpers are setup. When the jumper cap is placed on
the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper is
“Open”.
Clear CMOS Jumper
(CLRMOS1)
(see p.6, 7, No. 14)
CLRMOS1 allows you to clear the data in CMOS. To clear and reset the system
parameters to default setup, please turn o the computer and unplug the power
cord from the power supply. Aer waiting for 15 seconds, use a jumper cap to
short the pins on CLR MOS1 for 5 seconds. However, please do not clear the
CMOS right aer you update the BIOS. If you need to clear the CMOS when you
just nish updating the BIOS, you must boot up the system rst, and then shut it
down before you do the clear-CMOS action. Please be noted that the password,
date, time, and user default prole will be cleared only if the CMOS battery is
removed. Please remember toremove the jumper cap aer clearing the CMOS.
2-pin Jumper
H610M-HDV
H610M-HVS
If you clear the CMOS, the case open may be detec ted. Please adjust the BIOS option
“Clear Status” to clear the record of previou s chassis intrusion status.
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2.6 Onboard Headers and Connectors
SPE AKE R
Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over
these header s and connectors. Placing jumper caps over the headers and connectors
will cause permanent damage to the motherboard.
System Panel Header
(9-pin PANEL1)
(see p.6, 7, No. 11)
PWRBTN (Power Button):
Connec t to the power button on the chassi s front panel. You may congure the way
to turn o your system using the powe r button.
RESET (Reset Button):
Connec t to the reset button on the chassi s front panel. Press the reset button to
restar t the computer if the computer freezes and fails to perform a nor mal restart.
PLED (Syste m Power LED):
Connec t to the power status indicator on the chassis front panel. e LED i s on when
the system is ope rating. e LED keeps blinking when the system i s in S1/S3 sleep
state. e LED is o when the system is in S4 sleep state or powered o (S5).
HDLED (Ha rd Drive Activity LED):
Connec t to the hard drive ac tivity LED on the chassis front panel. e LED is on
when the hard drive i s reading or writing data.
e front panel de sign may dier by chassis. A front pane l module mainly consists
of power button , reset button, power LED, hard dr ive activity LED, speaker and etc.
When connecting your chassis front panel module to this head er, make sure the wire
assig nments and the pin assig nments are matched correctly.
1
PLE D+
PLE D-
HDL ED-
HDL ED+
PWR BTN #
GND
RES ET#
GND
GND
Connect the power button,
reset button and system
status indicator on the
chassis to this header
according to the pin
assignments below. Note the
positive and negative pins
before connecting the cables.
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20
Chassis Intrusion and
Speaker Header
(7-pin SPK_CI1)
(see p.6, 7, No. 12)
DUM MY
+5V
1
SIG NAL
DUM MY
GND
DUM MY
Please connect the
chassis intrusion and the
chassis speaker to this
header.
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H610M-HDV
H610M-HVS
Serial ATA3 Connectors
Right Angle:
(SATA3_2:
see p.6, 7, No. 8) (Upper)
(SATA3_3:
see p.6, 7, No. 8) (Lower)
Vertical:
(SATA3_0:
see p.6, 7, No. 9)
(SATA3_1:
see p.6, 7, No. 10)
USB 2.0 Header
(9-pin USB_5_6)
(see p.6, 7, No. 7)
USB 3.2 Gen1 Header
(19-pin USB3_3_4)
(see p.6, 7, No. 6)
SATA3_2
SATA3_1
DUM MY
GNDGND
+B
-B
USB _PW R
Vbus
IntA _PA_S SRX-
IntA _PA_S SRX+
GND
IntA _PA_S STX-
IntA _PA_S STX+
GND
IntA _PA_D -
IntA _PA_D +
SATA3_3
SATA3_0
+A
-A
USB _PW R
1
VbusVbus
IntA _PB_ SSRX -
IntA _PB_ SSRX +
GND
IntA _PB_ SSTX -
IntA _PB_ SSTX +
GND
IntA _PB_ D-
IntA _PB_ D+
Dumm y
1
ese four SATA3
connectors support SATA
data cables for internal
storage devices with up to 6.0
Gb/s data transfer rate.
ere is one header on this
motherboard. is USB
2.0 header can support two
ports.
ere is one header on this
motherboard. is USB 3.2
Gen1 header can support
two ports.
Front Panel Audio Header
(9-pin HD_AUDIO1)
(see p.6, 7, No. 15)
1. High Denition Audio supports Jack Sensing, but the panel wire on the chassis
must support HDA to function correctly. Please follow the instructions in our
manual and chassis manual to install your system.
2. If you use an AC’97 audio panel, please install it to the front panel audio heade r by
the steps below:
A. Connect Mic_IN (MIC) to MIC2_ L.
B. Conne ct Audio_R (RIN) to OUT2_R and Audio_ L (LIN) to OUT2_ L.
C. Connect Ground (GND) to Ground (GND).
D. MIC_ RET and OUT_RET are for the HD audio panel only. You don’t need to
connec t them for the AC’97 audio panel.
E. To activate the front mic, go to the “FrontMic” Tab in the Realtek Control panel
and adju st “Recording Volume”.
PRE SEN CE #
MIC _RE T
OUT _RET
GN D
OUT 2_L
J_S ENS E
1
is header is for connecting
audio devices to the front
OUT 2_R
audio panel.
MIC 2_R
MIC 2_L
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Chassis/Water Pump Fan
4
1
8 5
CPU_ FAN_SP EED
FAN_S PEED_ CONTR OL
4 3 2 1
Connector
(4-pin CHA_FAN1/WP)
(see p.6, 7, No. 4)
FAN _SP EED _CO NTR OL
CHA _FA N_S PEE D
FAN _VO LTA GE
4 3 2 1
is motherboard provides
a 4-Pin water cooling chassis
fan connector. If you plan to
connect a 3-Pin chassis water
GND
cooler fan, please connect it
to Pin 1-3.
CPU Fan Connector
(4-pin CPU_FAN1)
(see p.6, 7, No. 2)
ATX Power Connector
(24-pin ATXPWR1)
(see p.6, 7, No. 5)
ATX 12V Power
Connector
(8-pin ATX12V1)
(see p.6, 7, No. 1)
is motherboard provides
a 4-Pin CPU fan (Quiet Fan)
connector. If you plan to
connect a 3-Pin CPU fan,
please connect it to Pin 1-3.
12
24
is motherboard provides
a 24-pin ATX power con-
nector. To use a 20-pin ATX
power supply, please plug it
1
13
along Pin 1 and Pin 13.
is motherboard
provides a 8-pin ATX 12V
power connector. To use a
4-pin ATX power supply,
please plug it along Pin 1 and
Pin 5.
*Warning: Please make
sure that the power cable
connected is for the CPU
and not the graphics card.
Do not plug the PCIe power
cable to this
connector.
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H610M-HDV
SPI_ DQ3
H610M-HVS
SPI TPM Header
(13-pin SPI_TPM_J1)
(see p.6, 7, No. 13)
1
SPI_ PWR
SPI_ CS0
SPI_ DQ2
Dumm y
CLK
RSMR ST#
SPI_ MIS O
SPI_ MOS I
RST#
TPM_ PIR Q
SPI_ TPM _CS#
GND
is connector supports SPI
Trusted Platform Module (TPM)
system, which can securely store
keys, digital certicates, passwords,
and data. A TPM system also helps
enhance network security, protects
digital identities, and ensures
platform integrity.
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Chapter 3 Software and Utilities Operation
3.1 Installing Drivers
e Support CD that comes with the motherboard contains necessary drivers and
useful utilities that enhance the motherboard’s features.
Running The Support CD
To begin using the support CD, insert the CD into your CD-ROM drive. e CD
automatically displays the Main Menu if “AUTORUN” is enabled in your computer.
If the Main Menu does not appear automatically, locate and double click on the le
“ASRSETUP.EXE” in the Support CD to display the menu.
Drivers Menu
e drivers compatible to your system will be auto-detected and listed on the
support CD driver page. Please click Instal l All or follow the order from top to
bottom to install those required drivers. erefore, the drivers you install can work
properly.
Utilities Menu
e Utilities Menu shows the application soware that the motherboard supports.
Click on a specic item then follow the installation wizard to insta ll it.
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3.2 ASRock Motherboard Utility (A-Tuning)
ASRock Motherboard Utilit y (A-Tuning) is ASRock’s multi purpose soware suite
with a new interface, more new features and improved utilities.
ere are ve sections in ASRock Motherboard Utility (A-Tuning) main menu:
Operation Mode, OC Tweaker, System Info, FAN-Tastic Tuning and Settings.
Operation Mode
Choose an operation mode for your computer.
H610M-HDV
H610M-HVS
25
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OC Tweaker
Congurations for overclocking the system.
System Info
View information about the system.
*e System Browser tab may not appear for certain models.
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FAN-Tastic Tuning
Congure up to ve dierent fan speeds using the graph. e fans will automatically shi
to the next speed level when the assigned temperature is met.
H610M-HDV
H610M-HVS
Settings
Congure ASRock ASRock Motherboard Utility (A-Tuning). Click to select "Auto
run at Windows Startup" if you want ASRock Motherboard Utility (A-Tuning) to
be launched when you start up the Windows operating system.
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3.3 ASRock Live Update & APP Shop
e ASRock Live Update & APP Shop is an online store for purchasing and
downloading soware applications for your ASRock computer. You can quick ly and
easily insta ll various apps and support utilities. With ASRock Live Update & APP
Shop, you can optimize your system and keep your motherboard up to date simply
with a few clicks.
Double-click on your desktop to access ASRock Live Update & APP Shop
utility.
*You need to be connected to the Internet to download apps f rom the ASRock Live Update & APP Shop.
3.3.1 UI Overview
Category Panel
Hot News
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Information Panel
Category Panel: e category panel contains several category tabs or buttons that
when selected the information panel below displays the relative information.
Information Panel: e information panel in the center displays data about the
currently selected category and allows users to perform job-related tasks.
Hot News: e hot news section displays the various latest news. Click on the image
to visit the website of the selected news and know more.
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3.3.2 Apps
When the "Apps" tab is selected, you will see all the available apps on screen for you
to download.
Installing an App
Step 1
Find the app you want to install.
H610M-HDV
H610M-HVS
e most recommended app appears on the le side of the screen. e other various
apps are shown on the right. Please scroll up and down to see more apps listed.
You can check the price of the app and whether you have already intalled it or not.
- e red icon displays the price or "Free" if the app is free of charge.
- e green "Installed" icon means the app is installed on your computer.
Step 2
Click on the app icon to see more details about the selected app.
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Step 3
If you want to install the app, click on the red icon to start downloading.
Step 4
When installation completes, you can nd the green "Installed " icon appears on the
upper right corner.
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To uninstall it, simply click on the trash can icon .
*e trash icon may not appear for certain apps.
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Upgrading an App
You can only upgrade the apps you have already installed. When there is an
available new version for your app, you will nd the mark of "New Version"
appears below the installed app icon.
Step 1
Click on the app icon to see more details.
H610M-HDV
H610M-HVS
Step 2
Click on the yellow icon to start upgrading.
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3.3.3 BIOS & Drivers
Installing BIOS or Drivers
When the "BIOS & Drivers" tab is selected, you will see a list of recommended or
critical updates for the BIOS or drivers. Please update them all soon.
Step 1
Please check the item information before update. Click on to see more details.
Step 2
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32
Click to select one or more items you want to update.
Step 3
Click Update to start the update process.
Page 39
3.3.4 Setting
In the "Setting" page, you can change the language, select the server location, and
determine if you want to automatically run the ASRock Live Update & APP Shop
on Windows startup.
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H610M-HVS
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Chapter 4 UEFI SETUP UTILITY
4.1 Introduction
is section explains how to use the UEFI SETUP UTILITY to congure your
system. You may run the UEFI SETUP UTILITY by pressing <F2> or <Del> right
aer you power on the computer, other wise, the Power-On-Self-Test (POST) will
continue with its test routines. If you wish to enter the UEFI SETUP UTILITY aer
POST, restart the system by pressing <Ctl> + <Alt> + <Delete>, or by pressing the
reset button on the system chassis. You may also restart by turning the system o
and then back on.
Becau se the UEFI soware is constantly being upd ated, the following UEFI setup
screens and de scriptions are for reference purpose only, and they may not exactly
match what you see on your scre en.
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4.2 EZ Mode
e EZ Mode screen appears when you enter the BIOS setup program by default. EZ
mode is a dashboard which contains multiple readings of the system’s current status.
You can check the most crucial information of your system, such as CPU speed,
DRAM frequency, SATA information, fan speed, etc.
Press <F6> or click the "Advanced Mode" button at the upper right corner of the
screen to switch to "Advanced Mode" for more options.
1 2 3 456
H610M-HDV
H610M-HVS
No.Function
Help
1
Load UEFI Defaults
2
Save Changes and Exit
3
Discard Changes
4
Change Language
5
Switch to Advanced Mode
6
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4.3 Advanced Mode
e Advanced Mode provides more options to congure the BIOS settings. Refer to
the following sections for the detailed congurations.
To access the EZ Mode, press <F6> or click the "EZ Mode" button at the upper right
corner of the screen.
4.3.1 UEFI Menu Bar
e top of the screen has a menu bar with the following selections:
Main
OC Tweaker
Advanced
Tool
H/W Monitor
Security
Boot
Exit
For setting system time/date information
For overclocking congurations
For advanced system congurations
Useful tools
Displays current hardware status
For security settings
For conguring boot settings and boot priority
Exit the current screen or the UEFI Setup Utility
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4.3.2 Navigation Keys
Use < > key or < > key to choose among the selections on the menu bar, and
use < > key or < > key to move the cursor up or down to select items, then
press <Enter> to get into the sub screen. You can also use the mouse to click your
required item.
Please check the following table for the descriptions of each navigation key.
Navigation Key(s) Description
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+ / -
<Tab>
<PGUP>
<PGDN>
<HOME>
<END>
<F1>
<F5>
<F7>
<F9>
<F10>
<F12>
<ESC>
To change option for the selected items
Switch to next function
Go to the previous page
Go to the next page
Go to the top of the screen
Go to the bottom of the screen
To display the General Help Screen
Add / Remove Favorite
Discard changes and exit the SETUP UTILITY
Load optimal default values for all the settings
Save changes and exit the SETUP UTILITY
Print screen
Jump to the Exit Screen or exit the current screen
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4.4 Main Screen
When you enter the UEFI SETUP UTILITY, the Main screen will appear and
display the system overview.
e availability and location of BIOS settings can be dierent for dierent models
and BIOS versions .
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My Favorite
Display your collection of BIOS items. Press F5 to add/remove your favorite items.
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4.5 OC Tweaker Screen
In the OC Tweaker screen, you can set up overclocking features.
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Becau se the UEFI soware is constantly being upd ated, the following UEFI setup
screens and de scriptions are for reference purpose only, and they may not exactly
match what you see on your scre en.
CPU Vcore Compensation
is option will make cpu to run at higher vcore as default. Please try to adjust
this option when your cpu is not stable at default setting. Higher level will provide
higher vcore.
Base Frequency Boost
Enjoy the base frequency boost with the hidden power of processors immediately.
CPU Conguration
CPU Turbo Ratio Information
is item allows users to browse the CPU Turbo Ratio information.
CPU Conguration
CPU P-Core Ratio
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e CPU speed is determined by the CPU P-Core Ratio multiplied with the BCLK.
Increasing the CPU P-Core Ratio will increase the internal CPU clock speed
without aecting the clock speed of other components.
AVX2 Ratio Oset
AVX2 Ratio Oset species a negative oset from the CPU Ratio for AVX
workloads. AVX is a more stressful workload that lower the AVX ratio to ensure
maximum possible ratio for SSE workloads.
CPU E-Core Ratio
e E-Core speed is determined by the E-Core Ratio multiplied with the BCLK.
Increasing the E-Core Ratio will increase the internal E-Core clock speed without
aecting the clock speed of other components.
CPU Cache Ratio
e CPU Interna l Bus Speed Ratio. e maximum should be the same as the CPU
Ratio.
GT Frequency
Congure the frequency of the integrated GPU.
BCLK Aware Adaptive Voltage
BCLK Aware Adaptive Voltage enable/disable. When enabled, pcode will be aware
of the BCLK frequency when calculating the CPU V/F curves. is is ideal for
BCLK OC to avoid high voltage overrides.
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Boot Performance Mode
Select the performance state that the BIOS will set before OS hando.
Ring to Core Ratio Oset
Disable Ring to Core Ratio Oset so the ring and core can run at the same fre-
quency.
SA PLL Frequency Override
Congure SA PLL Frequency.
BCLK TSC HW Fixup
BCLK TSC HW Fixup disable during TSC copy from PMA to APIC.
FLL Overclock Mode
Nominal is good for normal core ratio overclocking. Elevated and Extremely
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El¬evated are good for high BCLK OC.
Intel SpeedStep Technology
Intel SpeedStep technology allows processors to switch between multiple frequen-
cies and voltage points for better power saving and heat dissipation.
Intel Turbo Boost Technology
Intel Turbo Boost Technology enables the processor to run above its base operating
frequency when the operating system requests the highest performance state.
Intel Speed Shift Technology
Enable/Disable Intel Speed Shi Technology support. Enabling will expose the
CPPC v2 interface to allow for hardware controlled P-sates.
Intel Turbo Boost Max Technology 3.0
Intel Turbo Boost Technology enables the processor to run above its base operating
frequency when the operating system requests the highest performance state.
Intel Thermal Velocity Boost Voltage Optimizations
is service controls thermal based voltage optimizations for processors that
implment the Intel ermal Velocity Boost (TVB) feature.
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Dual Tau Boost
Enable Dual Tau Boost feature. is is only applicable for CMLS 35W/65W/125W
skus. is item is only supported with processors with Cong TDP support.
Long Duration Power Limit
Congure Package Power Limit 1 in watts. When the limit is exceeded, the CPU
ratio will be lowered aer a period of time. A lower limit can protect the CPU and
save power, while a higher limit may improve performance.
Long Duration Maintained
Congure the period of time until the CPU ratio is lowered when the Long
Duration Power Limit is exceeded.
Short Duration Power Limit
Congure Package Power Limit 2 in watts. When the limit is exceeded, the CPU
ratio will be lowered immediately. A lower limit can protect the CPU and save
power, while a higher limit may improve performance.
CPU Core Current Limit
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Congure the current limit of the CPU core. A lower limit can protect the CPU and
save power, while a higher limit may improve performance.
GT Unlimited Current Limit
To unlock voltage regulator current limit completely, you can set this option to
Enabled.
GT Current Limit
Congure the current limit of the GT slice. A lower limit can protect the CPU and
save power, while a higher limit may improve performance.
DRAM Conguration
Memory Information
Allows users to browse the serial presence detect (SPD) and Intel extreme memory prole
(XMP) for DDR4 modules.
DRAM Timing Conguration
Load XMP Setting
Load XMP settings to overclock the memory and perform beyond standard
specications.
DRAM Frequency
If [Auto] is selected, the motherboard will detect the memory module(s) inserted
and assign the appropriate frequency automatically.
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DRAM Gear Mode
High gear is good for high frequency.
Primary Timing
CAS# Latency (tCL)
e time between sending a column address to the memory and the beginning of the data
in response.
RAS# to CAS# Delay (tRCD)
e number of clock cycles required between the opening of a row of memory and
accessing columns within it.
Row Precharge (tRP)
e number of clock cycles required between the issuing of the precharge command and
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opening the next row.
RAS# Active Time (tRAS)
e number of clock cycles required between a bank active command and issuing the
precharge command.
Command Rate (CR)
e delay between when a memor y chip is selected and when the rst active command can
be issued.
Secondary Timing
Write Recovery Time (tWR)
e amount of delay that must elapse aer the completion of a valid write operation,
before an active bank can be precharged.
Refresh Cycle Time (tRFC)
e number of clocks from a Refresh command until the rst Activate command to
the same rank.
RAS to RAS Delay (tRRD_L)
e number of clocks between two rows activated in dierent banks of the same
rank.
RAS to RAS Delay (tRRD_S)
e number of clocks between two rows activated in dierent banks of the same
rank.
Write to Read Delay (tWTR_L)
e number of clocks between the last valid write operation and the next read
command to the same internal bank.
Write to Read Delay (tWTR_S)
e number of clocks between the last valid write operation and the next read
command to the same internal bank.
Read to Precharge (tRTP)
e number of clocks that are inserted between a read command to a row pre-
charge command to the same rank.
Four Activate Window (tFAW)
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e time window in which four activates are allowed the same rank.
CAS Write Latency (tCWL)
Congure CAS Write Latency.
Third Timing
tREFI
Congure refresh cycles at an average periodic interval.
tCKE
Congure the period of time the DDR4 initiates a minimum of one refresh
command internally once it enters Self-Refresh mode.