Asrock H610M-HDV User Manual

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Version 1.0
Published December 2021
Copyright©2021 ASRock INC. All rights reserved.
Copyright Notice:
No part of this documentation may be reproduced, transcribed, transmitted, or translated in any language, in any form or by any means, except duplication of documentation by the purchaser for backup purpose, without written consent of ASRock Inc.
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for informational use only and subject to change without notice, and should not be constructed as a commitment by ASRock. ASRock assumes no responsibility for any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide warranty of any kind, either expressed or implied, including but not limited to the implied warranties or conditions of merchantability or tness for a particular purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for any indirect, special, incidental, or consequential damages (including damages for loss of prots, loss of business, loss of data, interruption of business and the like), even if ASRock has been advised of the possibility of such damages arising from any defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance controlled in Perchlorate Best Management Practices (BMP) regulations passed by the California Legislature. When you discard the Lithium battery in California, USA, please follow the related regulations in advance. “Perchlorate Material-special handling may apply, see ww w.dtsc.ca.gov/hazardouswaste/ perchlorate”
ASRock Website: http://www.asrock.com
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AUSTRALIA ONLY
Our goods come with guarantees that cannot be excluded under the Australian Consumer Law. You are entitled to a replacement or refund for a major failure and compensation for any other reasonably foreseeable loss or damage caused by our goods. You are also entitled to have the goods repaired or replaced if the goods fail to be of acceptable quality and the failure does not amount to a major failure. If you require assistance please call ASRock Tel
: +886-2-28965588 ext.123 (Standard International call charges apply)
e terms HDMI® and HDMI High-Denition Multimedia Interface, and the HDMI
logo are trademarks or registered trademarks of HDMI Licensing LLC in the United States and other countries.
INTEL END USER SOFTWARE LICENSE AGREEMENT
IMPORTANT - READ BEFORE COPYING, INSTALLING OR USING.
LICENSE. Licensee has a license under Intel’s copyrights to reproduce Intel’s Soware only in its unmodied and binar y form, (with the accompanying documentation, the “Soware”) for Licensee’s personal use only, and not commercial use, in connection with Intel-based products for which the Soware has been provided, subject to the following conditions:
(a) Licensee may not disclose, distribute or transfer any part of the Soware, and You agree to prevent unauthorized copying of the Soware.
(b) Licensee may not reverse engineer, decompile, or disassemble the Soware.
(c) Licensee may not sublicense the Soware.
(d) e Soware may contain the soware and other intellectual property of third party suppliers, some of which may be identied in, and licensed in accordance with, an enclosed license.txt le or other text or le.
(e) Intel has no obligation to provide any support, technical assistance or updates for the Soware.
OWNERSHIP OF SOFTWARE AND COPYRIGHTS. Title to all copies of the Soware remains with Intel or its licensors or suppliers. e Soware is copyrighted and protected by the laws of the United States and other countries, and international treaty provisions. Licensee may not remove any copyright notices from the Soware. Except as other wise expressly provided above, Intel grants no express or implied right under Intel patents, copyrights, trademarks, or other intellectual property rights. Transfer of the license termi­nates Licensee’s right to use the Soware.
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ES OF ANY KIND WHETHER UNDER THIS AGREEMENT OR OTHERWISE, EVEN IF INTEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
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TERMINATION OF THIS LICENSE. Intel or the sublicensor may terminate this license at any time if Licensee is in breach of any of its terms or conditions. Upon termination, Licensee will immediately destroy or return to Intel all copies of the Soware.
THIRD PARTY BENEFICIARY. Intel is an intended beneciary of the End User License Agreement and has the right to enforce all of its terms.
U.S. GOVERNMENT RESTRICTED RIGHTS. e Soware is a commercial item (as dened in 48 C.F.R. 2.101) consisting of commercial computer soware and commercial computer soware documentation (as those terms are used in 48 C.F.R. 12.212), consistent with 48 C.F.R. 12.212 and 48 C.F.R 227.7202-1 through 227.7202-4. You will not provide the Soware to the U.S. Government. Contractor or Manufacturer is Intel Corporation, 2200 Mission College Blvd., Santa Clara, CA 95054.
EXPORT LAWS. Licensee agrees that neither Licensee nor Licensee’s subsidiaries will export/re-export the Soware, directly or indirectly, to any country for which the U.S. Department of Commerce or any other agency or department of the U.S. Government or the foreign government from where it is shipping requires an export license, or other governmental approval, without rst obtaining any such required license or approval. In the event the Soware is exported from the U.S.A. or re-exported from a foreign destina­tion by Licensee, Licensee will ensure that the distribution and export/re-export or import of the Soware complies with all laws, regulations, orders, or other restrictions of the U.S. Export Administration Regulations and the appropriate foreign government.
APPLICABLE LAWS. is Agreement and any dispute arising out of or relating to it will be governed by the laws of the U.S.A. and Delaware, without regard to conict of laws principles. e Parties to this Agreement exclude the application of the United Nations Convention on Contracts for the International Sale of Goods (1980). e state and federal courts sitting in Delaware, U.S.A. will have exclusive jurisdiction over any dispute arising out of or relating to this Agreement. e Parties consent to persona l jurisdiction and venue in those courts. A Party that obtains a judgment against the other Party in the courts iden­tied in this section may enforce that judgment in any court that has jurisdiction over the Parties.
Licensee’s specic rights may vary from country to country.
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Contents
Chapter 1 Introduction 1
1.1 Package Contents 1
1.2 Specications 2
1.3 Motherboard Layout 6
1.4 I/O Panel 9
Chapter 2 Installation 11
2.1 Installing the CPU 12
2.2 Installing the CPU Fan and Heatsink 15
2.3 Installing Memory Modules (DIMM) 16
2.4 Expansion Slots (PCIe Slots) 18
2.5 Jumpers Setup 19
2.6 Onboard Headers and Connectors 20
Chapter 3 Software and Utilities Operation 24
3.1 Installing Drivers 24
3.2 ASRock Motherboard Utility (A-Tuning) 25
3.2.1 Installing ASRock Motherboard Utility (A-Tuning) 25
3.2.2 Using ASRock Motherboard Utility (A-Tuning) 25
3.3 ASRock Live Update & APP Shop 28
3.3.1 UI Overview 28
3.3.2 Apps 29
3.3.3 BIOS & Drivers 32
3.3.4 Setting 33
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Chapter 4 UEFI SETUP UTILITY 34
4.1 Introduction 34
4.2 EZ Mode 35
4.3 Advanced Mode 36
4.3.1 UEFI Menu Bar 36
4.3.2 Navigation Keys 37
4.4 Main Screen 38
4.5 OC Tweaker Screen 39
4.6 Advanced Screen 53
4.6.1 CPU Conguration 54
4.6.2 Chipset Conguration 57
4.6.3 Storage Conguration 60
4.6.4 Super IO Conguration 61
4.6.5 ACPI Conguration 62
4.6.6 USB Conguration 63
4.6.7 Trusted Computing 64
4.7 Tools 66
4.8 Hardware Health Event Monitoring Screen 68
4.9 Security Screen 70
4.10 Boot Screen 71
4.11 Exit Screen 74
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Chapter 1 Introduction
ank you for purchasing ASRock H610M-HDV / H610M-HVS motherboard,
a reliable motherboard produced under ASRock ’s consistently stringent quality
control. It delivers excellent performance with robust design conforming to
ASRock’s commitment to quality and endurance.
In this documentation, Chapter 1 and 2 contains the introduction of the
motherboard and step-by-step installation guides. Chapter 3 contains the operation
guide of the soware and utilities. Chapter 4 contains the conguration guide of
the BIOS setup.
Becau se the motherboard specications and the BIOS soware might be updated, the content of this documentation will be subject to change without notice. In case any modications of this documentation occur, the updated version will be available on ASRock’s website w ithout f urther notice. If you require technical support relate d to this motherboard, please vi sit our website for s pecic information about the model you are using. You may nd the l atest VGA cards and CPU suppor t list on ASRock’s website a s well. ASRock website ht tp://www.a srock.com.

1.1 Package Contents

ASRock H610M-HDV / H610M-HVS Motherboard (Micro ATX Form Factor)
•
ASRock H610M-HDV / H610M-HVS Quick Installation Guide
•
ASRock H610M-HDV / H610M-HVS Support CD
•
2 x Serial ATA (SATA) Data Cables (Optional)
•
1 x I/O Panel Shield
•
H610M-HDV H610M-HVS
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1.2 Specications
Platform
CPU
Chipset
Memory
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
Expansion Slot
* Supports NVMe SSD as boot disks
Micro ATX Form Factor
•
Solid Capacitor design
•
Supports 12th Gen Intel® CoreTM Processors (LGA1700)
•
5 Power Phase design
•
Supports Intel® Hybrid Technolog y
•
Supports Intel® Turbo Boost Max 3.0 Technology
•
Intel® H610
•
Dual Channel DDR4 Memory Technology
•
2 x DDR4 DIMM Slots
•
Supports DDR4 non-ECC, un-buered memory up to 3200*
•
Supports ECC UDIMM memory modules (operate in non-
•
ECC mode)
Max. capacity of system memory: 64GB
•
Supports Intel® Extreme Memory Prole (XMP) 2.0
•
1 x PCIe Gen4x16 Slot*
•
1 x PCIe Gen3x1 Slot
•
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Graphics
Intel® UHD Graphics Built-in Visuals and the VGA outputs
•
can be supported only with processors which are GPU
integrated.
Intel® Xe Graphics Architecture (Gen 12)
•
H610M-HDV:
ree graphics output options: D-Sub, HDMI and
•
DisplayPort 1.4
Supports HDMI 2.1 TMDS Compatible with max. resolution
•
up to 4K x 2K (4096x2160) @ 60Hz
Supports DisplayPort 1.4 with DSC (compressed) max.
•
resolution up to 8K (7680x4320) @ 60Hz / 5K (5120x3200) @
120Hz
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Audio
LAN
Supports D-Sub with max. resolution up to 1920x1200 @
•
60Hz
Supports HDCP 2.3 with HDMI 2.1 TMDS Compatible and
•
DisplayPort 1.4 Ports
H610M-HVS:
Dual graphics output: support HDMI and D-Sub ports by
•
independent display controllers
Supports HDMI 2.1 TMDS Compatible with max. resolution
•
up to 4K x 2K (4096x2160) @ 60Hz
Supports D-Sub with max. resolution up to 1920x1200 @
•
60Hz
Supports HDCP 2.3 with HDMI 2.1 TMDS Compatible Port
•
7.1 CH HD Audio (Realtek ALC897/887 Audio Codec)
•
Supports Surge Protection
•
PCIE x1 Gigabit LAN 10/100/1000 Mb/s
•
1 x Realtek RTL8111H
•
Supports Wake-On-LAN
•
Supports Lightning/ESD Protection
•
Supports Energy Ecient Ethernet 802.3az
•
Supports PXE
•
H610M-HDV H610M-HVS
Rear Panel I/O
Storage
1 x PS/2 Mouse/Keyboard Port
•
2 x USB 3.2 Gen1 Ports (Supports ESD Protection)
•
4 x USB 2.0 Ports (Supports ESD Protection)
•
1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED
•
LED)
HD Audio Jacks: Line in / Front Speaker / Microphone
•
H610M-HDV:
1 x D-Sub Port
•
1 x HDMI Port
•
1 x DisplayPort 1.4
•
H610M-HVS:
1 x D-Sub Port
•
1 x HDMI Port
•
4 x SATA3 6.0 Gb/s Connectors
•
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Connector
BIOS Feature
1 x SPI TPM Header
•
1 x Chassis Intrusion and Speaker Header
•
1 x CPU Fan Connector (4-pin)
•
* e CPU Fan Connector supports the CPU fan of ma ximum
1A (12W) fan power.
1 x Chassis/Water Pump Fan Connector (4-pin) (Smart Fan
•
Speed Control)
* e Chassis/Water Pump Fan supports the water cooler fan of
maximum 2A (24W) fan power.
* CHA_FAN1/WP can auto detect if 3-pin or 4-pin fan is in use.
1 x 24 pin ATX Power Connector
•
1 x 8 pin 12V Power Connector
•
1 x Front Panel Audio Connector
•
1 x USB 2.0 Header (Supports 2 USB 2.0 ports) (Supports
•
ESD Protection)
1 x USB 3.2 Gen1 Header (Supports 2 USB 3.2 Gen1 ports)
•
(Supports ESD Protection)
AMI UEFI Legal BIOS with multilingual GUI support
•
ACPI 6.0 Compliant wake up events
•
SMBIOS 2.7 Support
•
CPU Core/Cache, CPU Core/Cache Load-Line, CPU GT,
•
CPU GT Load-Line, DRAM, +0.82V PCH, +1.05V PCH,
VCCIN AUX, +1.8V PROC, +1.05V PROC Voltage Multi-
adjustment
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Hardware Monitor
OS
Certica­tions
Fan Tachometer: CPU, Chassis/Water Pump Fans
•
Quiet Fan (Auto adjust chassis fan speed by CPU tempera-
•
ture): CPU, Chassis/Water Pump Fans
Fan Multi-Speed Control: CPU, Chassis/Water Pump Fans
•
CASE OPEN detection
•
Voltage monitoring: CPU Vcore, DRAM, +0.82V PCH,
•
+1.05V PCH, VCCIN AUX, VCCSA, +1.05V PROC, +12V,
+5V, +3.3V
Microso® Windows® 10 64-bit / 11 64-bit
•
FCC, CE
•
ErP/EuP ready (ErP/EuP ready power supply is required)
•
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* For detailed product information, please visit our website: http://ww w.asrock.com
Please realize that the re is a certain r isk involved with overclo cking, including adjusting the setting in the BIOS, applying Untied Overclocking Technol ogy, or using third-party overclocking tool s. Overclocking may aect your system’s stability, or even cause dam age to the components and devices of your system. It should be done at your own risk and expense. We are not responsible for poss ible damage caused by overclocking.
H610M-HDV H610M-HVS
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1.3 Motherboard Layout

H610M-HDV:
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H610M-HVS:
H610M-HDV H610M-HVS
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No. Description
1 ATX 12V Power Connector (ATX12V1)
2 CPU Fan Connector (CPU_FAN1)
3 2 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)
4 Chassis/Water Pump Fan Connector (CHA_FAN1/WP)
5 ATX Power Connector (ATXPWR1)
6 USB 3.2 Gen1 Header (USB3_ 3_4)
7 USB 2.0 Header (USB_5_6)
8 SATA3 Connector (SATA3_2) (Upper), SATA3 Connector (SATA3_3) (Lower)
9 SATA3 Connector (SATA3_0)
10 SATA3 Connector (SATA3_1)
11 System Panel Header (PANEL1)
12 Chassis Intrusion and Speaker Header (SPK_CI1)
13 SPI TPM Header (SPI_TPM_J1)
14 Clear CMOS Jumper (CLRMOS1)
15 Front Panel Audio Header (HD_AUDIO1)
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1.4 I/O Panel

H610M-HDV:
H610M-HDV H610M-HVS
3
1
2
4
11 6
No. Description No. Description
1 USB 2.0 Ports (USB_1_2) 7 USB 3.2 Gen1 Ports (USB3_1_2)
2 LAN RJ-45 Port* 8 PS/2 Mouse/Keyboard Port
3 Line In (Light Blue)** 9 HDMI Port
4 Front Speaker (Lime)** 10 D-Sub Port
5 Microphone (Pink)** 11 DisplayPort 1.4
6 USB 2.0 Ports (USB_3_4)
10
9
8
7
H610M-HVS:
1
10
No. Description No. Description
1 USB 2.0 Ports (USB_1_2) 6 USB 2.0 Ports (USB_3_4)
2 LAN RJ-45 Port* 7 USB 3.2 Gen1 Ports (USB3_1_2)
3 Line In (Light Blue)** 8 PS/2 Mouse/Keyboard Port
4 Front Speaker (Lime)** 9 HDMI Port
5 Microphone (Pink)** 10 D-Sub Port
9
8
7
2
6
5
3
4
5
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* ere are two LEDs on each LAN port. Please refer to the table below for the LAN port LED indications .
ACT/LINK L ED
SPEED LE D
LAN Por t
Activity / Link LED Speed LED
Status Description Status Description
O No Link O 10Mbps connection Blinking Data Activity Orange 100Mbps connection On Link Green 1Gbps connection
** Function of the Au dio Ports in 7.1-channel Con guration:
Port Function
Light Blue (Rear panel) Rear Speaker Out Lime (Rear panel) Front Speaker Out Pink (Rear panel) Central /Subwoofer Speaker Out Lime (Front panel) Side Speaker Out
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Chapter 2 Installation

is is a Micro ATX form factor motherboard. Before you install the motherboard,
study the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components
or change any motherboard settings.
Make sure to unplug the power cord before installing or removing the motherboard
•
components. Failure to do so may cause physical injuries and damages to motherboard
components.
In order to avoid damage from static electricity to the motherboard’s components,
•
NEVER place your motherboard directly on a carpet. Also remember to use a grounded
wrist strap or touch a safety grounded object before you handle the components.
Hold components by the edges and do not touch the ICs.
•
Whenever you uninstall any components, place them on a grounded anti-static pad or
•
in the bag that comes with the components.
When placing screws to secure the motherboard to the chassis, please do not over-
•
tighten the screws! Doing so may damage the motherboard.
H610M-HDV H610M-HVS
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2.1 Installing the CPU

1. Before you insert the 1700-Pin CPU into the socket, ple ase check if the P nP cap is on the socket, if the CPU sur face is unclean, or if th ere are any b ent pins in the socket. Do not force to insert the CPU into the socket if above situ ation is found. Other wise, the CPU wil l be seriously d amaged.
2. Unplug all power cables be fore installing the CPU.
1
A
B
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H610M-HDV H610M-HVS
4
76
5
13
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Please save and replace the cover if the processor i s removed. e cover must be placed if you wish to return the motherboard for aer service.
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2.2 Installing the CPU Fan and Heatsink

1 2
H610M-HDV H610M-HVS
CPU_FAN
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2.3 Installing Memory Modules (DIMM)

is motherboard provides two 288-pin DDR4 (Double Data Rate 4) DIMM slots,
and supports Dual Channel Memory Technology.
1. For dual channel conguration, you always need to install identica l (the same
brand, speed , size and chip-type) DDR4 DIMM pairs.
2. It is unable to activate Dual Channel Memor y Technology with only one memory module instal led.
3. It is not allowed to install a DDR, DDR2 or DDR3 memory module into a DDR4 slot; otherwise, this motherboard and DIMM may be damaged.
e DIMM only ts in one correct orie ntation. It will cause permanent dam age to the mothe rboard and the DIMM if you force the DIMM into the slot at incor rect orientation .
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H610M-HDV H610M-HVS
1
2
3
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2.4 Expansion Slots (PCIe Slots)

ere are 2 PCIe slots on the motherboard.
Before installing an ex pansion card, please make sure that the power supply is switched o or the power cord is unplugged. Plea se read the documentation of the expan sion card and mak e necessary hardware settings for the card before you start the installation.
PCIe slots:
PCIE1 (PCIe 3.0 x1 slot) is used for PCIe x1 lane width cards.
PCIE2 (PCIe 4.0 x16 slot) is used for PCIe x16 lane width graphics cards.
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2.5 Jumpers Setup

e illustration shows how jumpers are setup. When the jumper cap is placed on
the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper is
“Open”.
Clear CMOS Jumper
(CLRMOS1)
(see p.6, 7, No. 14)
CLRMOS1 allows you to clear the data in CMOS. To clear and reset the system
parameters to default setup, please turn o the computer and unplug the power
cord from the power supply. Aer waiting for 15 seconds, use a jumper cap to
short the pins on CLR MOS1 for 5 seconds. However, please do not clear the
CMOS right aer you update the BIOS. If you need to clear the CMOS when you
just nish updating the BIOS, you must boot up the system rst, and then shut it
down before you do the clear-CMOS action. Please be noted that the password,
date, time, and user default prole will be cleared only if the CMOS battery is
removed. Please remember toremove the jumper cap aer clearing the CMOS.
2-pin Jumper
H610M-HDV H610M-HVS
If you clear the CMOS, the case open may be detec ted. Please adjust the BIOS option “Clear Status” to clear the record of previou s chassis intrusion status.
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2.6 Onboard Headers and Connectors

SPE AKE R
Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over these header s and connectors. Placing jumper caps over the headers and connectors will cause permanent damage to the motherboard.
System Panel Header
(9-pin PANEL1)
(see p.6, 7, No. 11)
PWRBTN (Power Button):
Connec t to the power button on the chassi s front panel. You may congure the way to turn o your system using the powe r button.
RESET (Reset Button):
Connec t to the reset button on the chassi s front panel. Press the reset button to restar t the computer if the computer freezes and fails to perform a nor mal restart.
PLED (Syste m Power LED):
Connec t to the power status indicator on the chassis front panel. e LED i s on when the system is ope rating. e LED keeps blinking when the system i s in S1/S3 sleep state. e LED is o when the system is in S4 sleep state or powered o (S5).
HDLED (Ha rd Drive Activity LED):
Connec t to the hard drive ac tivity LED on the chassis front panel. e LED is on when the hard drive i s reading or writing data.
e front panel de sign may dier by chassis. A front pane l module mainly consists of power button , reset button, power LED, hard dr ive activity LED, speaker and etc. When connecting your chassis front panel module to this head er, make sure the wire assig nments and the pin assig nments are matched correctly.
1
PLE D+
PLE D-
HDL ED-
HDL ED+
PWR BTN #
GND
RES ET#
GND
GND
Connect the power button,
reset button and system
status indicator on the
chassis to this header
according to the pin
assignments below. Note the
positive and negative pins
before connecting the cables.
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20
Chassis Intrusion and
Speaker Header
(7-pin SPK_CI1)
(see p.6, 7, No. 12)
DUM MY +5V
1
SIG NAL
DUM MY
GND
DUM MY
Please connect the
chassis intrusion and the
chassis speaker to this
header.
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H610M-HDV H610M-HVS
Serial ATA3 Connectors
Right Angle:
(SATA3_2:
see p.6, 7, No. 8) (Upper)
(SATA3_3:
see p.6, 7, No. 8) (Lower)
Vertical:
(SATA3_0:
see p.6, 7, No. 9)
(SATA3_1:
see p.6, 7, No. 10)
USB 2.0 Header
(9-pin USB_5_6)
(see p.6, 7, No. 7)
USB 3.2 Gen1 Header
(19-pin USB3_3_4)
(see p.6, 7, No. 6)
SATA3_2
SATA3_1
DUM MY
GND GND
+B
-B
USB _PW R
Vbus
IntA _PA_S SRX-
IntA _PA_S SRX+
GND
IntA _PA_S STX-
IntA _PA_S STX+
GND
IntA _PA_D -
IntA _PA_D +
SATA3_3
SATA3_0
+A
-A
USB _PW R
1
VbusVbus
IntA _PB_ SSRX -
IntA _PB_ SSRX +
GND
IntA _PB_ SSTX -
IntA _PB_ SSTX +
GND
IntA _PB_ D-
IntA _PB_ D+
Dumm y
1
ese four SATA3
connectors support SATA
data cables for internal
storage devices with up to 6.0
Gb/s data transfer rate.
ere is one header on this
motherboard. is USB
2.0 header can support two
ports.
ere is one header on this
motherboard. is USB 3.2
Gen1 header can support
two ports.
Front Panel Audio Header
(9-pin HD_AUDIO1)
(see p.6, 7, No. 15)
1. High Denition Audio supports Jack Sensing, but the panel wire on the chassis must support HDA to function correctly. Please follow the instructions in our manual and chassis manual to install your system.
2. If you use an AC’97 audio panel, please install it to the front panel audio heade r by the steps below: A. Connect Mic_IN (MIC) to MIC2_ L. B. Conne ct Audio_R (RIN) to OUT2_R and Audio_ L (LIN) to OUT2_ L. C. Connect Ground (GND) to Ground (GND). D. MIC_ RET and OUT_RET are for the HD audio panel only. You don’t need to connec t them for the AC’97 audio panel. E. To activate the front mic, go to the “FrontMic” Tab in the Realtek Control panel and adju st “Recording Volume”.
PRE SEN CE #
MIC _RE T
OUT _RET
GN D
OUT 2_L
J_S ENS E
1
is header is for connecting
audio devices to the front
OUT 2_R
audio panel.
MIC 2_R
MIC 2_L
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Chassis/Water Pump Fan
4
1
8 5
CPU_ FAN_SP EED
FAN_S PEED_ CONTR OL
4 3 2 1
Connector
(4-pin CHA_FAN1/WP)
(see p.6, 7, No. 4)
FAN _SP EED _CO NTR OL
CHA _FA N_S PEE D
FAN _VO LTA GE
4 3 2 1
is motherboard provides
a 4-Pin water cooling chassis
fan connector. If you plan to
connect a 3-Pin chassis water
GND
cooler fan, please connect it
to Pin 1-3.
CPU Fan Connector
(4-pin CPU_FAN1)
(see p.6, 7, No. 2)
ATX Power Connector
(24-pin ATXPWR1)
(see p.6, 7, No. 5)
ATX 12V Power
Connector
(8-pin ATX12V1)
(see p.6, 7, No. 1)
is motherboard provides
a 4-Pin CPU fan (Quiet Fan)
connector. If you plan to
connect a 3-Pin CPU fan,
please connect it to Pin 1-3.
12
24
is motherboard provides
a 24-pin ATX power con-
nector. To use a 20-pin ATX
power supply, please plug it
1
13
along Pin 1 and Pin 13.
is motherboard
provides a 8-pin ATX 12V
power connector. To use a
4-pin ATX power supply,
please plug it along Pin 1 and
Pin 5.
*Warning: Please make
sure that the power cable
connected is for the CPU
and not the graphics card.
Do not plug the PCIe power
cable to this
connector.
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H610M-HDV
SPI_ DQ3
H610M-HVS
SPI TPM Header
(13-pin SPI_TPM_J1)
(see p.6, 7, No. 13)
1
SPI_ PWR
SPI_ CS0
SPI_ DQ2
Dumm y
CLK
RSMR ST#
SPI_ MIS O
SPI_ MOS I
RST#
TPM_ PIR Q
SPI_ TPM _CS#
GND
is connector supports SPI
Trusted Platform Module (TPM)
system, which can securely store
keys, digital certicates, passwords,
and data. A TPM system also helps
enhance network security, protects
digital identities, and ensures
platform integrity.
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Chapter 3 Software and Utilities Operation

3.1 Installing Drivers

e Support CD that comes with the motherboard contains necessary drivers and
useful utilities that enhance the motherboard’s features.
Running The Support CD
To begin using the support CD, insert the CD into your CD-ROM drive. e CD
automatically displays the Main Menu if “AUTORUN” is enabled in your computer.
If the Main Menu does not appear automatically, locate and double click on the le
“ASRSETUP.EXE” in the Support CD to display the menu.
Drivers Menu
e drivers compatible to your system will be auto-detected and listed on the
support CD driver page. Please click Instal l All or follow the order from top to
bottom to install those required drivers. erefore, the drivers you install can work
properly.
Utilities Menu
e Utilities Menu shows the application soware that the motherboard supports.
Click on a specic item then follow the installation wizard to insta ll it.
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3.2 ASRock Motherboard Utility (A-Tuning)

ASRock Motherboard Utilit y (A-Tuning) is ASRock’s multi purpose soware suite
with a new interface, more new features and improved utilities.

3.2.1 Installing ASRock Motherboard Utility (A-Tuning)

ASRock Motherboard Utilit y (A-Tuning) can be downloaded from ASRock Live
Update & APP Shop. Aer the installation, you will nd the icon “ASRock Mother-
board Utility (A-Tuning)“ on your desktop. Double-click the
“ASRock Motherboard Utility (A-Tuning)“ icon, ASRock Motherboard Utility
(A-Tuning) main menu will pop up.

3.2.2 Using ASRock Motherboard Utility (A-Tuning)

ere are ve sections in ASRock Motherboard Utility (A-Tuning) main menu:
Operation Mode, OC Tweaker, System Info, FAN-Tastic Tuning and Settings.
Operation Mode
Choose an operation mode for your computer.
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OC Tweaker
Congurations for overclocking the system.
System Info
View information about the system.
*e System Browser tab may not appear for certain models.
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FAN-Tastic Tuning
Congure up to ve dierent fan speeds using the graph. e fans will automatically shi
to the next speed level when the assigned temperature is met.
H610M-HDV H610M-HVS
Settings
Congure ASRock ASRock Motherboard Utility (A-Tuning). Click to select "Auto
run at Windows Startup" if you want ASRock Motherboard Utility (A-Tuning) to
be launched when you start up the Windows operating system.
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3.3 ASRock Live Update & APP Shop

e ASRock Live Update & APP Shop is an online store for purchasing and
downloading soware applications for your ASRock computer. You can quick ly and
easily insta ll various apps and support utilities. With ASRock Live Update & APP
Shop, you can optimize your system and keep your motherboard up to date simply
with a few clicks.
Double-click on your desktop to access ASRock Live Update & APP Shop utility.
*You need to be connected to the Internet to download apps f rom the ASRock Live Update & APP Shop.

3.3.1 UI Overview

Category Panel
Hot News
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28
Information Panel
Category Panel: e category panel contains several category tabs or buttons that
when selected the information panel below displays the relative information.
Information Panel: e information panel in the center displays data about the
currently selected category and allows users to perform job-related tasks.
Hot News: e hot news section displays the various latest news. Click on the image
to visit the website of the selected news and know more.
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3.3.2 Apps

When the "Apps" tab is selected, you will see all the available apps on screen for you
to download.
Installing an App
Step 1
Find the app you want to install.
H610M-HDV H610M-HVS
e most recommended app appears on the le side of the screen. e other various
apps are shown on the right. Please scroll up and down to see more apps listed.
You can check the price of the app and whether you have already intalled it or not.
- e red icon displays the price or "Free" if the app is free of charge.
- e green "Installed" icon means the app is installed on your computer.
Step 2
Click on the app icon to see more details about the selected app.
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Step 3
If you want to install the app, click on the red icon to start downloading.
Step 4
When installation completes, you can nd the green "Installed " icon appears on the
upper right corner.
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30
To uninstall it, simply click on the trash can icon . *e trash icon may not appear for certain apps.
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Upgrading an App
You can only upgrade the apps you have already installed. When there is an
available new version for your app, you will nd the mark of "New Version"
appears below the installed app icon.
Step 1
Click on the app icon to see more details.
H610M-HDV H610M-HVS
Step 2
Click on the yellow icon to start upgrading.
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3.3.3 BIOS & Drivers

Installing BIOS or Drivers
When the "BIOS & Drivers" tab is selected, you will see a list of recommended or
critical updates for the BIOS or drivers. Please update them all soon.
Step 1
Please check the item information before update. Click on to see more details.
Step 2
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32
Click to select one or more items you want to update.
Step 3
Click Update to start the update process.
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3.3.4 Setting

In the "Setting" page, you can change the language, select the server location, and
determine if you want to automatically run the ASRock Live Update & APP Shop
on Windows startup.
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Page 40

Chapter 4 UEFI SETUP UTILITY

4.1 Introduction

is section explains how to use the UEFI SETUP UTILITY to congure your
system. You may run the UEFI SETUP UTILITY by pressing <F2> or <Del> right
aer you power on the computer, other wise, the Power-On-Self-Test (POST) will
continue with its test routines. If you wish to enter the UEFI SETUP UTILITY aer
POST, restart the system by pressing <Ctl> + <Alt> + <Delete>, or by pressing the
reset button on the system chassis. You may also restart by turning the system o
and then back on.
Becau se the UEFI soware is constantly being upd ated, the following UEFI setup screens and de scriptions are for reference purpose only, and they may not exactly match what you see on your scre en.
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4.2 EZ Mode

e EZ Mode screen appears when you enter the BIOS setup program by default. EZ
mode is a dashboard which contains multiple readings of the system’s current status.
You can check the most crucial information of your system, such as CPU speed,
DRAM frequency, SATA information, fan speed, etc.
Press <F6> or click the "Advanced Mode" button at the upper right corner of the
screen to switch to "Advanced Mode" for more options.
1 2 3 4 5 6
H610M-HDV H610M-HVS
No. Function
Help
1
Load UEFI Defaults
2
Save Changes and Exit
3
Discard Changes
4
Change Language
5
Switch to Advanced Mode
6
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4.3 Advanced Mode

e Advanced Mode provides more options to congure the BIOS settings. Refer to
the following sections for the detailed congurations.
To access the EZ Mode, press <F6> or click the "EZ Mode" button at the upper right
corner of the screen.

4.3.1 UEFI Menu Bar

e top of the screen has a menu bar with the following selections:
Main
OC Tweaker
Advanced
Tool
H/W Monitor
Security
Boot
Exit
For setting system time/date information
For overclocking congurations
For advanced system congurations
Useful tools
Displays current hardware status
For security settings
For conguring boot settings and boot priority
Exit the current screen or the UEFI Setup Utility
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4.3.2 Navigation Keys

Use < > key or < > key to choose among the selections on the menu bar, and
use < > key or < > key to move the cursor up or down to select items, then
press <Enter> to get into the sub screen. You can also use the mouse to click your
required item.
Please check the following table for the descriptions of each navigation key.
Navigation Key(s) Description
H610M-HDV H610M-HVS
+ / -
<Tab>
<PGUP>
<PGDN>
<HOME>
<END>
<F1>
<F5>
<F7>
<F9>
<F10>
<F12>
<ESC>
To change option for the selected items
Switch to next function
Go to the previous page
Go to the next page
Go to the top of the screen
Go to the bottom of the screen
To display the General Help Screen
Add / Remove Favorite
Discard changes and exit the SETUP UTILITY
Load optimal default values for all the settings
Save changes and exit the SETUP UTILITY
Print screen
Jump to the Exit Screen or exit the current screen
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Page 44

4.4 Main Screen

When you enter the UEFI SETUP UTILITY, the Main screen will appear and
display the system overview.
e availability and location of BIOS settings can be dierent for dierent models and BIOS versions .
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38
My Favorite
Display your collection of BIOS items. Press F5 to add/remove your favorite items.
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4.5 OC Tweaker Screen

In the OC Tweaker screen, you can set up overclocking features.
H610M-HDV H610M-HVS
Becau se the UEFI soware is constantly being upd ated, the following UEFI setup screens and de scriptions are for reference purpose only, and they may not exactly match what you see on your scre en.
CPU Vcore Compensation
is option will make cpu to run at higher vcore as default. Please try to adjust
this option when your cpu is not stable at default setting. Higher level will provide
higher vcore.
Base Frequency Boost
Enjoy the base frequency boost with the hidden power of processors immediately.
CPU Conguration
CPU Turbo Ratio Information
is item allows users to browse the CPU Turbo Ratio information.
CPU Conguration
CPU P-Core Ratio
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e CPU speed is determined by the CPU P-Core Ratio multiplied with the BCLK.
Increasing the CPU P-Core Ratio will increase the internal CPU clock speed
without aecting the clock speed of other components.
AVX2 Ratio Oset
AVX2 Ratio Oset species a negative oset from the CPU Ratio for AVX
workloads. AVX is a more stressful workload that lower the AVX ratio to ensure
maximum possible ratio for SSE workloads.
CPU E-Core Ratio
e E-Core speed is determined by the E-Core Ratio multiplied with the BCLK.
Increasing the E-Core Ratio will increase the internal E-Core clock speed without
aecting the clock speed of other components.
CPU Cache Ratio
e CPU Interna l Bus Speed Ratio. e maximum should be the same as the CPU
Ratio.
GT Frequency
Congure the frequency of the integrated GPU.
BCLK Aware Adaptive Voltage
BCLK Aware Adaptive Voltage enable/disable. When enabled, pcode will be aware
of the BCLK frequency when calculating the CPU V/F curves. is is ideal for
BCLK OC to avoid high voltage overrides.
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Boot Performance Mode
Select the performance state that the BIOS will set before OS hando.
Ring to Core Ratio Oset
Disable Ring to Core Ratio Oset so the ring and core can run at the same fre-
quency.
SA PLL Frequency Override
Congure SA PLL Frequency.
BCLK TSC HW Fixup
BCLK TSC HW Fixup disable during TSC copy from PMA to APIC.
FLL Overclock Mode
Nominal is good for normal core ratio overclocking. Elevated and Extremely
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El¬evated are good for high BCLK OC.
Intel SpeedStep Technology
Intel SpeedStep technology allows processors to switch between multiple frequen-
cies and voltage points for better power saving and heat dissipation.
Intel Turbo Boost Technology
Intel Turbo Boost Technology enables the processor to run above its base operating
frequency when the operating system requests the highest performance state.
Intel Speed Shift Technology
Enable/Disable Intel Speed Shi Technology support. Enabling will expose the
CPPC v2 interface to allow for hardware controlled P-sates.
Intel Turbo Boost Max Technology 3.0
Intel Turbo Boost Technology enables the processor to run above its base operating
frequency when the operating system requests the highest performance state.
Intel Thermal Velocity Boost Voltage Optimizations
is service controls thermal based voltage optimizations for processors that
implment the Intel ermal Velocity Boost (TVB) feature.
H610M-HDV H610M-HVS
Dual Tau Boost
Enable Dual Tau Boost feature. is is only applicable for CMLS 35W/65W/125W
skus. is item is only supported with processors with Cong TDP support.
Long Duration Power Limit
Congure Package Power Limit 1 in watts. When the limit is exceeded, the CPU
ratio will be lowered aer a period of time. A lower limit can protect the CPU and
save power, while a higher limit may improve performance.
Long Duration Maintained
Congure the period of time until the CPU ratio is lowered when the Long
Duration Power Limit is exceeded.
Short Duration Power Limit
Congure Package Power Limit 2 in watts. When the limit is exceeded, the CPU
ratio will be lowered immediately. A lower limit can protect the CPU and save
power, while a higher limit may improve performance.
CPU Core Current Limit
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Congure the current limit of the CPU core. A lower limit can protect the CPU and
save power, while a higher limit may improve performance.
GT Unlimited Current Limit
To unlock voltage regulator current limit completely, you can set this option to
Enabled.
GT Current Limit
Congure the current limit of the GT slice. A lower limit can protect the CPU and
save power, while a higher limit may improve performance.
DRAM Conguration
Memory Information
Allows users to browse the serial presence detect (SPD) and Intel extreme memory prole
(XMP) for DDR4 modules.
DRAM Timing Conguration
Load XMP Setting
Load XMP settings to overclock the memory and perform beyond standard
specications.
DRAM Frequency
If [Auto] is selected, the motherboard will detect the memory module(s) inserted
and assign the appropriate frequency automatically.
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DRAM Gear Mode
High gear is good for high frequency.
Primary Timing
CAS# Latency (tCL)
e time between sending a column address to the memory and the beginning of the data
in response.
RAS# to CAS# Delay (tRCD)
e number of clock cycles required between the opening of a row of memory and
accessing columns within it.
Row Precharge (tRP)
e number of clock cycles required between the issuing of the precharge command and
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H610M-HDV H610M-HVS
opening the next row.
RAS# Active Time (tRAS)
e number of clock cycles required between a bank active command and issuing the
precharge command.
Command Rate (CR)
e delay between when a memor y chip is selected and when the rst active command can
be issued.
Secondary Timing
Write Recovery Time (tWR)
e amount of delay that must elapse aer the completion of a valid write operation,
before an active bank can be precharged.
Refresh Cycle Time (tRFC)
e number of clocks from a Refresh command until the rst Activate command to
the same rank.
RAS to RAS Delay (tRRD_L)
e number of clocks between two rows activated in dierent banks of the same
rank.
RAS to RAS Delay (tRRD_S)
e number of clocks between two rows activated in dierent banks of the same
rank.
Write to Read Delay (tWTR_L)
e number of clocks between the last valid write operation and the next read
command to the same internal bank.
Write to Read Delay (tWTR_S)
e number of clocks between the last valid write operation and the next read
command to the same internal bank.
Read to Precharge (tRTP)
e number of clocks that are inserted between a read command to a row pre-
charge command to the same rank.
Four Activate Window (tFAW)
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e time window in which four activates are allowed the same rank.
CAS Write Latency (tCWL)
Congure CAS Write Latency.
Third Timing
tREFI
Congure refresh cycles at an average periodic interval.
tCKE
Congure the period of time the DDR4 initiates a minimum of one refresh
command internally once it enters Self-Refresh mode.
Turn Around Timing
Turn Around Timing Optimization
Auto is enabled in general case.
TAT Training Value
tRDRD_sg
Congure between module read to read delay.
tRDRD_dg
Congure between module read to read delay.
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tRDRD_dr
Congure between module read to read delay.
tRDRD_dd
Congure between module read to read delay.
tRDWR_sg
Congure between module read to write delay.
tRDWR_dg
Congure between module read to write delay.
tRDWR_dr
Congure between module read to write delay.
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tRDWR_dd
Congure between module read to write delay.
tWRRD_sg
Congure between module write to read delay.
tWRRD_dg
Congure between module write to read delay.
tWRRD_dr
Congure between module write to read delay.
tWRRD_dd
Congure between module write to read delay.
tWRWR_sg
Congure between module write to write delay.
tWRWR_dg
Congure between module write to write delay.
H610M-HDV H610M-HVS
tWRWR_dr
Congure between module write to write delay.
tWRWR_dd
Congure between module write to write delay.
TAT Runtime Value
tRDRD_sg
Congure between module read to read delay.
tRDRD_dg
Congure between module read to read delay.
tRDRD_dr
Congure between module read to read delay.
tRDRD_dd
Congure between module read to read delay.
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tRDWR_sg
Congure between module read to write delay.
tRDWR_dg
Congure between module read to write delay.
tRDWR_dr
Congure between module read to write delay.
tRDWR_dd
Congure between module read to write delay.
tWRRD_sg
Congure between module write to read delay.
tWRRD_dg
Congure between module write to read delay.
tWRRD_dr
Congure between module write to read delay.
tWRRD_dd
Congure between module write to read delay.
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tWRWR_sg
Congure between module write to write delay.
tWRWR_dg
Congure between module write to write delay.
tWRWR_dr
Congure between module write to write delay.
tWRWR_dd
Congure between module write to write delay.
Round Trip Timing
Round Trip Timing Optimization
Auto is enabled in general case.
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Round Trip Level
Congure round trip level.
Initial RTL IO Delay Oset
Congure round trip latency IO delay initial oset.
Initial RTL FIF0 Delay Oset
Congure round trip latency FIF0 delay initial oset.
Initial RTL (MC0 C0 A1)
Congure round trip latency initial value.
Initial RTL (MC0 C1 A1)
Congure round trip latency initial value.
Initial RTL (MC1 C0 B1)
Congure round trip latency initial value.
Initial RTL (MC1 C1 B1)
Congure round trip latency initial value.
H610M-HDV H610M-HVS
RTL (MC0 C0 A1)
Congure round trip latency value.
RTL (MC0 C1 A1)
Congure round trip latency value.
RTL (MC1 C0 B1)
Congure round trip latency value.
RTL (MC1 C1 B1)
Congure round trip latency value.
ODT Setting
Dimm ODT Training
ODT values will be optimized by Dimm On-Die Termination Training.
ODT WR (A1)
Congure the memory on die termination resistors' WR for channel A1.
ODT WR (B1)
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Congure the memory on die termination resistors' WR for channel B1.
ODT NOM (A1)
Use this to change ODT (CH A1) Auto/Manual settings. e default is [Auto].
ODT NOM (B1)
Use this to change ODT (CH B1) Auto/Manual settings. e default is [Auto].
ODT PARK (A1)
Congure the memory on die termination resistors' PARK for channel A1.
ODT PARK (B1)
Congure the memory on die termination resistors' PARK for channel B1.
Advanced Setting
ASRock Timing Optimization
Congure the fast path through the MRC.
ASRock Second Timing Optimization
Congure the second fast path through the MRC.
MRC Training Respond Time
Try Slowest MRC Training.
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Realtime Memory Timing
Congure the realtime memory timings.
[Enabled] e system will allow performing realtime memory timing changes aer
MRC_DONE.
Reset for MRC Failed
Reset system aer MRC training is failed.
MRC Training on Warm Boot
When enabled, memory training will be executed when warm boot.
MRC Fast Boot
Enable Memory Fast Boot to skip DRAM memory training for booting faster.
Voltage Conguration
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Voltage Mode
[OC]: Larger range voltage for overclocking.
[STABLE]: Smaller range voltage for stable system.
CPU Core/Cache Voltage
Input voltage for the processor by the external voltage regulator.
CPU Core/Cache Load-Line Calibration
CPU Core/Cache Load-Line Calibration helps prevent CPU Core/Cache voltage
droop when the system is under heavy loading.
CPU GT Voltage
Congure the voltage for the integrated GPU.
CPU GT Load-Line Calibration
GT Load-Line Calibration helps prevent integrated GPU voltage droop when the
system is under heav y load.
DRAM Voltage
Use this to congure DRAM Voltage. e default value is [Auto].
H610M-HDV H610M-HVS
VCCIN AUX Voltage
Congure the voltage for the VCCIN AUX.
+1.05V PROC Voltage
Congure the CPU voltage (1.05V).
+0.82V PCH Voltage
Congure the chipset voltage (0.82V).
+1.05V PCH Voltage
Congure the chipset voltage (1.05V).
AVX Conguration
AVX2 Voltage Guardband Scale Factor
AVX2 Voltage Guardband Scale Factor controls the voltage guardband applied to
AVX2 workloads. A value > 1.00 will increase the voltage guardband, and < 1.00
will decrease the voltage guardband.
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FIVR Conguration
P-Core Voltage Mode
Selects between Adaptive and Override Voltage modes. In Override Mode, the
voltage selected will be applied over all operating frequencies. In Adaptive mode,
the voltage is interpolated only in turbo mode.
Extra Turbo Voltage
Species the extra turbo voltage applied while the IA Core is operating in turbo
mode.
VF Oset Mode
Selects between Legacy and Selection modes. Need Reset System aer enabling
OverClocking Feature to initialize the default value. In Legacy Mode, setting a
global oset for the entire VF curve. In Selection modes, setting a selected VF point.
VF Conguration Scope
Allows all cores VF curve or per-core VF curve conguration.
Core Voltage Oset
Species the oset voltage applied to the IA Core domain. is voltage is specied
in millivolts.
Oset Prex
Sets the oset value as positive or negative.
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E-Core L2 Voltage Mode
Selects between adaptive and Override Voltage modes. In Override Mode the
voltage selected will be applied over all operating frequencies. In Adaptive Mode
the voltage is interpolated only in turbo mode. Uses Mailbox 0SR 0x150, cmd 0x10,
0x11.
Extra Turbo Voltage
Species the extra turbo voltage applied while Atom L2 is operating in turbo mode.
Uses Mailbox MSR 0x150, cmd 0x10, 0x11. Range 0-2000 mV.
E-Core L2 Voltage Oset
Species the Oset Voltage applied to the Atom L2 domain. is voltage is specied
in millivolts. Uses Mailbox MSR 0x150, cmd 0x11. Range -500 to 500 mV.
Oset Prex
Sets the oset value as positive or negative.
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Ring Voltage Mode
Selects between adaptive and Override Voltage modes. In Override Mode the
voltage selected will be applied over all operating frequencies. In Adaptive Mode
the voltage is interpolated only in turbo mode. Uses Mailbox 0SR 0x150, cmd 0x10,
0x11.
Extra Turbo Voltage
Species the extra turbo voltage applied while ring is operating in turbo mode. Uses
Mailbox MSR 0x150, cmd 0x10, 0x11. Range 0-2000 mV.
VF Oset Mode
Selects between Legacy and Selection modes. Need Reset System aer enabling
OverClocking Feature to initialize the default value. In Legacy Mode, setting a
global oset for the entire VF curve. In Selection modes, setting a selected VF point.
Ring Voltage Oset
Species the Oset Voltage applied to the Ring domain. is voltage is specied in
millivolts. Uses Mailbox MSR 0x150, cmd 0x11. Range -500 to 500 mV.
Oset Prex
Sets the oset value as positive or negative.
H610M-HDV H610M-HVS
GT Voltage Mode
Selects between adaptive and Override Voltage modes. In Override Mode the
voltage selected will be applied over all operating frequencies. In Adaptive Mode
the voltage is interpolated only in turbo mode. Uses Mailbox 0SR 0x150, cmd 0x10,
0x11.
Extra Turbo Voltage
Species the extra turbo voltage applied while GT is operating in turbo mode. Uses
Mailbox MSR 0x150, cmd 0x10, 0x11. Range 0-2000 mV.
GT Voltage Oset
Species the Oset Voltage applied to the GT domain. is voltage is specied in
millivolts. Uses Mailbox MSR 0x150, cmd 0x11. Range -500 to 500 mV.
Oset Prex
Sets the oset value as positive or negative.
System Agent Voltage Mode
Selects between adaptive and Override Voltage modes. In Override Mode the
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voltage selected will be applied over all operating frequencies. In Adaptive Mode
the voltage is interpolated only in turbo mode.
Extra Turbo Voltage
Species the extra turbo voltage applied while SA Uncore is operating in turbo
mode. Uses Mailbox MSR 0x150, cmd 0x10, 0x11. Range 0-2000 mV.
System Agent Voltage Oset
Species the Oset Voltage applied to the Uncore domain. is voltage is specied
in millivolts.
Oset Prex
Sets the oset value as positive or negative.
Save User Default
Type a prole name and press enter to save your settings as user default.
Load User Default
Load previously saved user defaults.
Save User UEFI Setup Prole to Disk
It helps you to save current UEFI settings as an user prole to disk.
Load User UEFI Setup Prole from Disk
You can load previous saved prole from the disk.
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4.6 Advanced Screen

In this section, you may set the congurations for the following items: CPU
Conguration, Chipset Conguration, Storage Conguration, Super IO Conguration,
ACPI Conguration, USB Conguration and Trusted Computing.
H610M-HDV H610M-HVS
Setting wrong values in this sec tion may cause the system to malfunction.
UEFI Conguration
UEFI Setup Style
Select the default mode when entering the UEFI setup utility.
Active Page on Entry
Select the default page when entering the UEFI setup utility.
Full HD UEFI
When [Auto] is selected, the resolution will be set to 1920 x 1080 if the monitor
supports Full HD resolution. If the monitor does not support Full HD resolution,
then the resolution will be set to 1024 x 768. When [Disable] is selected, the
resolution will be set to 1024 x 768 directly.
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4.6.1 CPU Conguration
Processor E-Core Information
is item displays the E-Core Information.
Processor P-Core Information
is item displays the P-Core Information.
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Intel Hyper Threading Technology
Intel Hyper reading Technology allows multiple threads to run on each core, so
that the overall performance on threaded soware is improved.
Active Processor P-Cores
Select the number of cores to enable in each processor package.
Active Processor E-Cores
Select the number of E-Cores to enable in each processor package.
CPU C States Support
Enable CPU C States Support for power saving. It is recommended to keep C6 and
C7 enabled for better power saving.
Enhanced Halt State (C1E)
Enable Enhanced Halt State (C1E) for lower power consumption.
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CPU C6 State Support
Enable C6 deep sleep state for lower power consumption.
CPU C7 State Support
Enable C7 deep sleep state for lower power consumption.
Package C State Support
Enable CPU, PCIe, Memory, Graphics C State Support for power saving.
CFG Lock
is item allows you to disable or enable the CFG Lock.
C6DRAM
Enable/Disable moving of DRAM contents to PRM memory when CPU is in C6
state.
CPU Thermal Throttling
Enable CPU internal thermal control mechanisms to keep the CPU from overheat-
ing.
Intel AVX/AVX2
Enable/Disable the Intel AVX and AVX2 Instructions. is is applicable for Big
Core only.
H610M-HDV H610M-HVS
Intel AVX-512
Enable/Disable the Intel AVX-512 (a.k.a. AVX3) Instructions. is is applicable for
Big Core only.
Intel Virtualization Technology
Intel Virtualization Technology allows a platform to run multiple operating systems
and applications in independent partitions, so that one computer system can
function as multiple virtual systems.
Hardware Prefetcher
Automatically prefetch data and code for the processor. Enable for better
performance.
Adjacent Cache Line Prefetch
Automatically prefetch the subsequent cache line while retrieving the currently
requested cache line. Enable for better performance.
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Legacy Game Compatibility Mode
When enabled, pressing the scroll lock key will toggle the Ecient cores between
being parked when Scroll Lock LED is on and un-parked when LED is o.
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4.6.2 Chipset Conguration
Primary Graphics Adapter
Select a primary VGA.
H610M-HDV H610M-HVS
Above 4G Decoding
Enable or disable 64bit capable Devices to be decoded in Above 4G Address Space
(only if the system supports 64 bit PCI decoding).
C.A.M (Clever Access Memory)
If system has Resizable BAR capable PCIe Devices, use this option to enable or
disable Resizable BAR support (only of the system supports 64-bit PCI decoding).
VT-d
Intel® Virtualization Technology for Directed I/O helps your virtual machine
monitor better utilize hardware by improving application compatibility and
reliability, and providing additional levels of manageability, security, isolation, and
I/O performance.
SR-IOV Support
If system has SR-IOV capable PCIe Devices, this option Enables or Disables Single
Root IO Virtualization Support.
DMI Link Speed
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Congure DMI Slot Link Speed. Auto mode is optimizing for overclocking.
PCIE1 Link Speed
Select the link speed for PCIE1.
PCIE2 Link Speed
Select the link speed for PCIE2.
PCI Express Native Control
Select Enable for enhanced PCI Express power saving in OS.
PCIE ASPM Support
is option enables/disables the ASPM support for all CPU downstream devices.
PCH PCIE ASPM Support
is option enables/disables the ASPM support for all PCH PCIE devices.
DMI ASPM Support
is option enables/disables the control of ASPM on CPU side of the DMI Link.
PCH DMI ASPM Support
is option enables/disables the ASPM support for all PCH DMI devices.
Share Memory
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Congure the size of memory that is allocated to the integrated graphics processor when
the system boots up.
IGPU Multi-Monitor
Select disable to disable the integrated graphics when an external graphics card is installed.
Select enable to keep the integrated graphics enabled at all times.
Onboard LAN
Enable or disable the onboard network interface controller.
Onboard HD Audio
Enable/disable onboard HD audio. Set to Auto to enable onboard HD audio and
automatically disable it when a sound card is installed.
Front Panel
Enable/disable front panel HD audio.
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Onboard HDMI HD Audio
Enable audio for the onboard digital outputs.
Deep Sleep
Congure deep sleep mode for power saving when the computer is shut down.
Restore on AC/Power Loss
Select the power state aer a power failure. If [Power O] is selected, the power will
remain o when the power recovers. If [Power On] is selected, the system will start
to boot up when the power recovers.
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4.6.3 Storage Conguration
SATA Controller(s)
Enable/disable the SATA controllers.
Hybrid Storage Detection and Conguration Mode
is item allows you select Hybrid Storage Detection and Conguration Mode.
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SATA Aggressive Link Power Management
SATA Aggressive Link Power Management allows SATA devices to enter a low
power state during periods of inactivity to save power. It is only supported by AHCI
mode.
Hard Disk S.M.A.R.T.
S.M.A.R.T stands for Self-Monitoring, Analysis, and Reporting Technolog y. It is a
monitoring system for computer hard disk drives to detect and report on various
indicators of reliability.
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4.6.4 Super IO Conguration
PS2 Y-Cable
Enable the PS2 Y-Cable or set this option to Auto.
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4.6.5 ACPI Conguration
Suspend to RAM
Select disable for ACPI suspend type S1. It is recommended to select auto for ACPI
S3 power saving.
PS/2 Keyboard S4/S5 Wakeup Support
Allow the system to be waked up by a PS/2 Keyboard in S4/S5.
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PCIE Devices Power On
Allow the system to be waked up by a PCIE device and enable wake on LAN.
RTC Alarm Power On
Allow the system to be waked up by the rea l time clock alarm. Set it to By OS to let
it be handled by your operating system.
USB Keyboard/Remote Power On
Allow the system to be waked up by an USB keyboard or remote controller.
USB Mouse Power On
Allow the system to be waked up by an USB mouse.
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4.6.6 USB Conguration
Legacy USB Support
Enable or disable Legacy OS Support for USB 2.0 devices. If you encounter USB
compatibility issues it is recommended to disable legacy USB support. Select UEFI
Setup Only to support USB devices under the UEFI setup and Windows/Linux
operating systems only.
H610M-HDV H610M-HVS
XHCI Hand-o
is is a workaround for OSes without XHCI hand-o support. e XHCI
ownership change should be claimed by XHCI driver.
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4.6.7 Trusted Computing

NOTE: Options var y depending on the version of your connected TPM module.
Security Device Support
Use this item to enable or disable BIOS support for security device. O.S. will not
show Security Device. TCG EFI protocol and INT1A interface will not be available.
Active PCR banks
is item displays active PCR Banks.
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Available PCR Banks
is item displays available PCR Banks.
SHA256 PCR Bank
Use this item to enable or disable SHA256 PCR Bank.
SHA384 PCR Bank
Use this item to enable or disable SHA384 PCR Bank.
SM3_256 PCR Bank
Use this item to enable or disable SM3_256 PCR Bank.
Pending Operation
Schedule an Operation for the Security Device.
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NOTE: Your computer will reboot during restart in order to change State of the
Device.
Platform Hierarchy
Use this item to enable or disable Platform Hierarchy.
Storage Hierarchy
Use this item to enable or disable Storage Hierarchy.
Endorsement Hierarchy
Use this item to enable or disable Endorsement Hierarchy.
Physical Presence Spec version
Select this item to tell OS to support PPI spec version 1.2 or 1.3. Please note that
some HCK tests might not support version 1.3.
TPM 2.0 InterfaceType (CRB)
Select the Communication Interface to TPM 2.0 Device
Device Select
Use this item to select the TPM device to be supported. TPM 1.2 will restrict
support to TPM 1.2 devices. TPM 2.0 will restrict support to TPM 2.0 devices. Auto
will support both with the default set to TPM 2.0 devices. If TPM 2.0 devices are
not found, TPM 1.2 devices will be enumerated.
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4.7 Tools

UEFI Tech Service
Contact ASRock Tech Service if you are having trouble with your PC. Please setup
network conguration before using UEFI Tech Service.
SSD Secure Erase Tool
All the SSD's listed that supports Secure Erase function.
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Instant Flash
Save UEFI les in your USB storage device and run Instant Flash to update your
UEFI.
Internet Flash - DHCP (Auto IP), Auto
ASRock Internet Flash downloads and updates the latest UEFI rmware version
from our servers for you. Please setup network conguration before using Internet
Flash.
*For BIOS backup and recovery purpose, it is recommended to plug in your USB
pen drive before using this function.
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Network Conguration
Use this to congure internet connection settings for Internet Flash.
Internet Setting
Enable or disable sound eects in the setup utility.
H610M-HDV H610M-HVS
UEFI Download Server
Select a server to download the UEFI rmware.
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4.8 Hardware Health Event Monitoring Screen

is section allows you to monitor the status of the hardware on your system,
including the parameters of the CPU temperature, motherboard temperature, fan
speed and voltage.
Fan Tuning
Measure Fan Min Duty Cycle.
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Fan-Tastic Tuning
Select a fan mode for CPU Fan, or choose Customize to set 5 CPU temperatures and
assign a respective fan speed for each temperature.
CPU Fan 1 Setting
Select a fan mode for CPU Fan 1, or choose Customize to set 5 CPU temperatures
and assign a respective fan speed for each temperature.
CPU Fan 1 Step Up
Set the value of CPU Fan 1 Step Up.
CPU Fan 1 Step Down
Set the value of CPU Fan 1 Step Down.
CHA_FAN1 / W_PUMP Switch
Select Chassis Fan 1 or Water Pump mode.
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Chassis Fan 1 Control Mode
Select PWM mode or DC mode for Chassis Fan 1.
Chassis Fan 1 Setting
Select a fan mode for Chassis Fan 1, or choose Customize to set 5 CPU temperatures
and assign a respective fan speed for each temperature.
Chassis Fan 1 Temp Source
Select a fan temperature source for Chassis Fan 1.
Chassis Fan 1 Step Up
Set the value of Chassis Fan 1 Step Up.
Chassis Fan 1 Step Down
Set the value of Chassis Fan 1 Step Down.
Case Open Feature
Enable or disable Case Open Feature to detect whether the chassis cover has been
removed.
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4.9 Security Screen

In this section you may set or change the supervisor/user password for the system.
You may also clear the user password.
Supervisor Password
Set or change the password for the administrator account. Only the administrator
has authority to change the settings in the UEFI Setup Utility. Leave it blank and
press enter to remove the password.
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User Password
Set or change the password for the user account. Users are unable to change the
settings in the UEFI Setup Utility. Leave it blank and press enter to remove the
password.
Secure Boot
Use this item to enable or disable support for Secure Boot.
Intel(R) Platform Trust Technology
Enable/disable Intel PTT in ME. Disable this option to use discrete TPM Module.
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4.10 Boot Screen

is section displays the available devices on your system for you to congure the
boot settings and the boot priority.
Fast Boot
Fast Boot minimizes your computer's boot time. In fast mode you may not boot
from an USB storage device. e VBIOS must support UEFI GOP if you are using
an external graphics card. Please notice that Ultra Fast mode will boot so fast that
the only way to enter this UEFI Setup Utility is to Clear CMOS or run the Restart to
UEFI utility in Windows.
H610M-HDV H610M-HVS
Boot From Onboard LAN
Allow the system to be waked up by the onboard LAN.
Setup Prompt Timeout
Congure the number of seconds to wait for the setup hot key.
Bootup Num-Lock
Select whether Num Lock should be turned on or o when the system boots up.
Boot Beep
Select whether the Boot Beep should be turned on or o when the system boots up. Please
note that a buzzer is needed.
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Full Screen Logo
Enable to display the boot logo or disable to show normal POST messages.
AddOn ROM Display
Enable AddOn ROM Display to see the AddOn ROM messages or congure the
AddOn ROM if you've enabled Full Screen Logo. Disable for faster boot speed.
Boot Failure Guard Message
If the computer fails to boot for a number of times the system automatically restores
the default settings.
CSM (Compatibility Support Module)
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CSM
Enable to launch the Compatibility Support Module. Please do not disable unless
you’re running a WHCK test.
Launch PXE OpROM Policy
Select UEFI only to run those that support UEFI option ROM only. Select Legacy
only to run those that support legacy option ROM only. Select Do not launch to not
execute both legacy and UEFI option ROM.
Launch Storage OpROM Policy
Select UEFI only to run those that support UEFI option ROM only. Select Legacy
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only to run those that support legacy option ROM only. Select Do not launch to not
execute both legacy and UEFI option ROM.
Other PCI Device ROM Priority
For PCI devices other than Network. Mass storage or Video denes which OpROM
to launch.
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4.11 Exit Screen

Save Changes and Exit
When you select this option the following message, “Save conguration changes
and exit setup?” will pop out. Select [OK] to save changes and exit the UEFI SETUP
UTILITY.
Discard Changes and Exit
When you select this option the following message, “Discard changes and exit
setup?” will pop out. Select [OK] to exit the UEFI SETUP UTILITY without saving
any changes.
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Discard Changes
When you select this option the following message, “Discard changes?” will pop
out. Select [OK] to discard all changes.
Load UEFI Defaults
Load UEFI default values for a ll options. e F9 key can be used for this operation.
Launch EFI Shell from lesystem device
Copy shellx64.e to the root directory to launch EFI Shell.
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Contact Information
If you need to contact ASRock or want to know more about ASRock, you’re welcome
to visit ASRock’s website at http://ww w.asrock.com; or you may contact your dealer
for further information. For technical questions, please submit a support request
form at http://www.asrock.com/support/tsd.asp
ASRock Incorporation
2F., No.37, Sec. 2, Jhongyang S. Rd., Beitou District,
Taipei City 112, Taiwan (R.O.C.)
ASRock EUROPE B.V.
Bijsterhuizen 11-11
6546 AR Nijmegen
e Netherlands
Phone: +31-24-345-44-33
Fax: +31-24-345-44-38
ASRock America, Inc.
13848 Magnolia Ave, Chino, CA91710
U.S.A.
Phone: +1-909-590-8308
Fax: +1-909-590-1026
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DECLARATION OF CONFORMITY
Per FCC Part 2 Section 2.1077(a)
Responsible Party Name: ASRock Incorporation
Address:
Phone/Fax No:
hereby declares that the product
Product Name : Motherboard
13848 Magnolia Ave, Chino, CA91710
+1-909-590-8308/+1-909-590-1026
Model Number :
Conforms to the following specications:
FCC Part 15, Subpart B, Unintentional Radiators
Supplementary Information:
H610M-HDV / H610M-HVS
is device complies with part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) is device may not cause harmful interference,
and (2) this device must accept any interference received, including interference
that may cause undesired operation.
James
Representative Person’s Name:
Signature :
Date :
May 12, 2017
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EU Declaration of Conformity
EMC Directive - 2014/30/EU
For the following equipment:
Motherboard
(Product Name)
H610M-HDV / H610M-HVS / ASRock
(Model Designation / Trade Name)
ASRock Incorporation
(Manufacturer Name)
2F., No.37, Sec. 2, Jhongyang S. Rd., Beitou District, Taipei City 112, Taiwan (R.O.C.)
(Manufacturer Address)
EN 55032:2015/A11:2020
EN 61000-3-2:2014
EN 61000-3-3:2013
Low Voltage Directive - 2014/35/EU
EN 62368-1:2014 EN 62368-1:2014/A11:2017
RoHS Directive - 2011/65/EU
(EU) 2015/863EN 50581:2012
CE marking
ASRock EUROPE B.V.
(Company Name)
Bijsterhuizen 1111 6546 AR Nijmegen e Netherlands
(Company Address)
Person responsible for making this declaration:
EN 55024:2010/A1:2015EN 55035:2017/A11:2020
EN 61000-4-2:2009
EN 61000-4-3:2006/A1:2008/A2:2010
EN 61000-4-4:2012
EN 61000-4-5:2014/A1:2017
EN 61000-4-6:2014/AC:2015
EN 61000-4-8:2010
EN 61000-4-11:2004/A1:2017
(EU conformity marking)
(Name, Surname)
A.V.P
(Position / Title)
December 24, 2021
(Date)
P/N: 15G062339000AK V1.0
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