ASRock H570M-ITX User Manual

Version 1.0
Published January 2021
Copyright©2021 ASRock INC. All rights reserved.
Copyright Notice:
No part of this documentation may be reproduced, transcribed, transmitted, or translated in any language, in any form or by any means, except duplication of documentation by the purchaser for backup purpose, without written consent of ASRock Inc.
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for informational use only and subject to change without notice, and should not be constructed as a commitment by ASRock. ASRock assumes no responsibility for any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide warranty of any kind, either expressed or implied, including but not limited to the implied warranties or conditions of merchantability or tness for a particular purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for any indirect, special, incidental, or consequential damages (including damages for loss of prots, loss of business, loss of data, interruption of business and the like), even if ASRock has been advised of the possibility of such damages arising from any defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance controlled in Perchlorate Best Management Practices (BMP) regulations passed by the California Legislature. When you discard the Lithium battery in California, USA, please follow the related regulations in advance. “Perchlorate Material-special handling may apply, see ww w.dtsc.ca.gov/hazardouswaste/ perchlorate”
ASRock Website: http://www.asrock.com
AUSTRALIA ONLY
Our goods come with guarantees that cannot be excluded under the Australian Consumer Law. You are entitled to a replacement or refund for a major failure and compensation for any other reasonably foreseeable loss or damage caused by our goods. You are also entitled to have the goods repaired or replaced if the goods fail to be of acceptable quality and the failure does not amount to a major failure. If you require assistance please call ASRock Tel
: +886-2-28965588 ext.123 (Standard International call charges apply)
e terms HDMI® and HDMI High-Denition Multimedia Interface, and the HDMI
logo are trademarks or registered trademarks of HDMI Licensing LLC in the United States and other countries.
INTEL END USER SOFTWARE LICENSE AGREEMENT
IMPORTANT - READ BEFORE COPYING, INSTALLING OR USING.
LICENSE. Licensee has a license under Intel’s copyrights to reproduce Intel’s Soware only in its unmodied and binar y form, (with the accompanying documentation, the “Soware”) for Licensee’s personal use only, and not commercial use, in connection with Intel-based products for which the Soware has been provided, subject to the following conditions:
(a) Licensee may not disclose, distribute or transfer any part of the Soware, and You agree to prevent unauthorized copying of the Soware.
(b) Licensee may not reverse engineer, decompile, or disassemble the Soware.
(c) Licensee may not sublicense the Soware.
(d) e Soware may contain the soware and other intellectual property of third party suppliers, some of which may be identied in, and licensed in accordance with, an enclosed license.txt le or other text or le.
(e) Intel has no obligation to provide any support, technical assistance or updates for the Soware.
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ES OF ANY KIND WHETHER UNDER THIS AGREEMENT OR OTHERWISE, EVEN IF INTEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
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U.S. GOVERNMENT RESTRICTED RIGHTS. e Soware is a commercial item (as dened in 48 C.F.R. 2.101) consisting of commercial computer soware and commercial computer soware documentation (as those terms are used in 48 C.F.R. 12.212), consistent with 48 C.F.R. 12.212 and 48 C.F.R 227.7202-1 through 227.7202-4. You will not provide the Soware to the U.S. Government. Contractor or Manufacturer is Intel Corporation, 2200 Mission College Blvd., Santa Clara, CA 95054.
EXPORT LAWS. Licensee agrees that neither Licensee nor Licensee’s subsidiaries will export/re-export the Soware, directly or indirectly, to any country for which the U.S. Department of Commerce or any other agency or department of the U.S. Government or the foreign government from where it is shipping requires an export license, or other governmental approval, without rst obtaining any such required license or approval. In the event the Soware is exported from the U.S.A. or re-exported from a foreign destina­tion by Licensee, Licensee will ensure that the distribution and export/re-export or import of the Soware complies with all laws, regulations, orders, or other restrictions of the U.S. Export Administration Regulations and the appropriate foreign government.
APPLICABLE LAWS. is Agreement and any dispute arising out of or relating to it will be governed by the laws of the U.S.A. and Delaware, without regard to conict of laws principles. e Parties to this Agreement exclude the application of the United Nations Convention on Contracts for the International Sale of Goods (1980). e state and federal courts sitting in Delaware, U.S.A. will have exclusive jurisdiction over any dispute arising out of or relating to this Agreement. e Parties consent to persona l jurisdiction and venue in those courts. A Party that obtains a judgment against the other Party in the courts iden­tied in this section may enforce that judgment in any court that has jurisdiction over the Parties.
Licensee’s specic rights may vary from country to country.
CE Warning
is device complies with directive 2014/53/EU issued by the Commision of the European Community.
is equipment complies with EU radiation exposure limits set forth for an uncontrolled environment. is equipment should be installed and operated with minimum distance 20cm between the radiator & your body.
Operations in the 5.15-5.35GHz band are restricted to indoor usage only.
Radio transmit power per transceiver ty pe
Function Frequency Maximum Output Power (EIRP)
2400-2483.5 MHz 18.5 + / -1.5 dbm
5150-5250 MHz 21.5 + / -1.5 dbm
WiFi
Bluetooth 2400-2483.5 MHz 8.5 + / -1.5 dbm
5250-5350 MHz
5470-5725 MHz
18.5 + / -1.5 dbm (no TPC)
21.5 + / -1.5 dbm (TPC)
25.5 + / -1.5 dbm (no TPC)
28.5 + / -1.5 dbm (TPC)
Contents
Chapter 1 Introduction 1
1.1 Package Contents 1
1.2 Specications 2
1.3 Motherboard Layout 7
1.4 I/O Panel 9
1.5 WiFi-802.11ac Module and ASRock WiFi 2.4/5 GHz Antennas 11
Chapter 2 Installation 13
2.1 Installing the CPU 14
2.2 Installing the CPU Fan and Heatsink 17
2.3 Installing Memory Modules (DIMM) 18
2.4 Expansion Slots (PCI Express Slot) 20
2.5 Jumpers Setup 21
2.6 Onboard Headers and Connectors 22
2.7 M.2_SSD (NGFF) Module Installation Guide (M2_1 and M2_2) 27
Chapter 3 Software and Utilities Operation 32
3.1 Installing Drivers 32
3.2 ASRock Motherboard Utility (A-Tuning) 33
3.2.1 Installing ASRock Motherboard Utility (A-Tuning) 33
3.2.2 Using ASRock Motherboard Utility (A-Tuning) 33
3.3 ASRock Live Update & APP Shop 36
3.3.1 UI Overview 36
3.3.2 Apps 37
3.3.3 BIOS & Drivers 40
3.3.4 Setting 41
3.4 Nahimic Audio 42
3.5 ASRock Polychrome SYNC 43
Chapter 4 UEFI SETUP UTILITY 46
4.1 Introduction 46
4.2 EZ Mode 47
4.3 Advanced Mode 48
4.3.1 UEFI Menu Bar 48
4.3.2 Navigation Keys 49
4.4 Main Screen 50
4.5 OC Tweaker Screen 51
4.6 Advanced Screen 63
4.6.1 CPU Conguration 64
4.6.2 Chipset Conguration 66
4.6.3 Storage Conguration 69
4.6.4 ACPI Conguration 70
4.6.5 USB Conguration 71
4.6.6 Trusted Computing 72
4.7 Tools 73
4.8 Hardware Health Event Monitoring Screen 75
4.9 Security Screen 77
4.10 Boot Screen 78
4.11 Exit Screen 81
H570M-ITX/ac
Chapter 1 Introduction
ank you for purchasing ASRock H570M-ITX/ac motherboard, a reliable
motherboard produced under ASRock’s consistently stringent quality control.
It delivers excellent performance with robust design conforming to ASRock’s
commitment to quality and endurance.
In this documentation, Chapter 1 and 2 contains the introduction of the
motherboard and step-by-step installation guides. Chapter 3 contains the operation
guide of the soware and utilities. Chapter 4 contains the conguration guide of
the BIOS setup.
Becau se the motherboard specications and the BIOS soware might be updated, the content of this documentation will be subject to change without notice. In case any modications of this documentation occur, the updated version will be available on ASRock’s website w ithout f urther notice. If you require technical support relate d to this motherboard, please vi sit our website for s pecic information about the model you are using. You may nd the l atest VGA cards and CPU suppor t list on ASRock’s website a s well. ASRock website ht tp://www.a srock.com.

1.1 Package Contents

ASRock H570M-ITX/ac Motherboard (Mini-ITX Form Factor)
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ASRock H570M-ITX/ac Quick Installation Guide
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ASRock H570M-ITX/ac Support CD
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2 x Serial ATA (SATA) Data Cables (Optional)
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1 x I/O Panel Shield
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2 x ASRock WiFi 2.4/5 GHz Antennas (Optional)
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2 x Screws for M.2 Sockets (Optional)
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1.2 Specications
Platform
CPU
Chipset
Memory
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* 11th Gen Intel® CoreTM (i9/i7/i5) support DDR4 up to 3200;
CoreTM (i3), Pentium® and Celeron® support DDR4 up to 2666.
* 10th Gen Intel® CoreTM (i9/i7) support DDR4 up to 2933; CoreTM
(i5/i3), Pentium® and Celeron® support DDR4 up to 2666.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
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Mini-ITX Form Factor
8 Layer PCB
Supports 10th Gen Intel® CoreTM Processors and 11th Gen
Intel® CoreTM Processors (LGA1200)
Digi Power design
8 Power Phase design
Supports Intel® Turbo Boost Max 3.0 Technology
Intel® H570
Dual Channel DDR4 Memory Technology
2 x DDR4 DIMM Slots
11th Gen Intel® CoreTM Processors support DDR4 non-ECC,
un-buered memory up to 5066+(OC)*
10th Gen Intel® CoreTM Processors support DDR4 non-ECC,
un-buered memory up to 4600+(OC)*
Supports ECC UDIMM memory modules (operate in non-
ECC mode)
Max. capacity of system memory: 64GB
Supports Intel® Extreme Memory Prole (XMP) 2.0
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Expansion Slot
11th Gen Intel® CoreTM Processors
1 x PCI Express 4.0 x16 Slot*
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10th Gen Intel® CoreTM Processors
1 x PCI Express 3.0 x16 Slot*
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* Supports NVMe SSD as boot disks
1 x Vertical M.2 Socket (Key E) with the bundled WiFi-
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802.11ac module (on the rear I/O)
Graphics
H570M-ITX/ac
Intel® UHD Graphics Built-in Visuals and the VGA outputs
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can be supported only with processors which are GPU
integrated.
11th Gen Intel® CoreTM Processors support Intel® Xe Graphics
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Architecture (Gen 12). 10th Gen Intel® CoreTM Processors
support Gen 9 Graphics
Graphics, Media & Compute: Microso DirectX 12, OpenGL
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4.5, Intel® Built In Visuals, Intel® Quick Sync Video, Hybrid /
Switchable Graphics, OpenCL 2.1
Display & Content Security: Rec. 2020 (Wide Color Gamut),
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Microso PlayReady 3.0, UHD/HDR Blu-ray Disc
Dual graphics output: support HDMI and DisplayPort 1.4
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ports by independent display controllers
Supports HDMI 2.0 with ma x. resolution up to 4K x 2K
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(4096x2160) @ 60Hz
Supports DisplayPort 1.4 with max. resolution up to 4K x 2K
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(4096x2304) @ 60Hz
Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and
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HBR (High Bit Rate Audio) with HDMI 2.0 Port (Compliant
HDMI monitor is required)
Supports HDCP 2.3 with HDMI 2.0 and DisplayPort 1.4
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Ports
Supports 4K Ultra HD (UHD) playback with HDMI 2.0 and
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DisplayPort 1.4 Ports
* 11th Gen Intel® CoreTM Processors support HDMI 2.0. 10th Gen
Intel® CoreTM Processors support HDMI 1.4.
Audio
7.1 CH HD Audio (Realtek ALC897 Audio Codec)
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Supports Surge Protection
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Nahimic Audio
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LAN
Wireless LAN
1 x 2.5 Gigabit LAN 10/100/1000/250 0 Mb/s (Dragon RTL-
8125BG):
Supports Dragon 2.5G LAN Soware
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- Smart Auto Adjust Bandwidth Control
- Visual User Friendly UI
- Visual Network Usage Statistics
- Optimized Default Setting for Game, Browser, and
Streaming Modes
- User Customized Priority Control
Supports Wake-On-LAN
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Supports Lightning/ESD Protection
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Supports Energy Ecient Ethernet 802.3az
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Supports PXE
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1 x Gigabit LAN 10/100/1000 Mb/s (Intel® I219V):
Supports Wake-On-LAN
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Supports Lightning/ESD Protection
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Supports Energy Ecient Ethernet 802.3az
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Supports PXE
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Intel® 802.11ac WiFi Module
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Supports IEEE 802.11a/b/g/n/ac
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Supports Dual-Band (2.4/5 GHz)
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Supports high speed wireless connections up to 433Mbps
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Supports Bluetooth 4.2 / 3.0 + High speed class II
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Rear Panel I/O
2 x Antenna Ports
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1 x HDMI Port
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1 x DisplayPort 1.4
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1 x USB 3.2 Gen2x2 Type-C Port (20 Gb/s) (Supports ESD
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Protection)
2 x USB 3.2 Gen2 Type-A Ports (10 Gb/s) (Supports ESD
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Protection)
3 x USB 2.0 Ports (Supports ESD Protection)
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2 x RJ-45 LAN Ports with LED (ACT/LINK LED and SPEED
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LED)
HD Audio Jacks: Line in / Front Speaker / Microphone
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Storage
Connector
H570M-ITX/ac
4 x SATA3 6.0 Gb/s Connectors, support RAID (RAID 0,
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RAID 1, RAID 5, RAID 10, Intel Rapid Storage Technology
18), NCQ, AHCI and Hot Plug
1 x Hyper M.2 Socket (M2_1), supports M Key ty pe 2280
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M.2 PCI Express module up to Gen4x4 (64 Gb/s) (Only sup-
ported with 11th Gen Intel® CoreTM Processors)*
1 x Ultra M.2 Socket (M2_2), supports M Key type 2280 M.2
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SATA3 6.0 Gb/s module and M.2 PCI Express module up to
Gen3 x4 (32 Gb/s)*
* Supports Intel® OptaneTM Technology
* Supports NVMe SSD as boot disks
* Supports ASRock U.2 Kit
1 x RGB LED Header
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* Support in total up to 12V/3A, 36W LED Strip
1 x Addressable LED Header
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* Support in total up to 5V/3A, 15W LED Strip
1 x CPU Fan Connector (4-pin)
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* e CPU Fan Connector supports the CPU fan of ma ximum
1A (12W) fan power.
1 x Chassis Fan Connector (4-pin)
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* e Chassis Fan Connector supports the chassis fan of maxi-
mum 1A (12W) fan power.
1 x Chassis/Water Pump Fan Connector (4-pin) (Smart Fan
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Speed Control)
* e Chassis/Water Pump Fan supports the water cooler fan of
maximum 2A (24W) fan power.
* CHA_FAN1/WP can auto detect if 3-pin or 4-pin fan is in use.
1 x 24 pin ATX Power Connector
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1 x 8 pin 12V Power Connector (Hi-Density Power Connec-
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tor)
1 x Front Panel Audio Connector
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1 x USB 2.0 Header (Supports 2 USB 2.0 ports) (Supports
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ESD Protection)
1 x USB 3.2 Gen1 Header (Supports 2 USB 3.2 Gen1 ports)
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(Supports ESD Protection)
1 x Front Panel Type C USB 3.2 Gen1 Header (Supports ESD
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Protection)
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AMI UEFI Legal BIOS with multilingual GUI support
BIOS Feature
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ACPI 6.0 Compliant wake up events
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SMBIOS 2.7 Support
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CPU, CPU GT, VCCSA, DRAM, VPPM, VCCIN AUX, VC-
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CIO, VCCST Voltage Multi-adjustment
Fan Tachometer: CPU, Chassis, Chassis/Water Pump Fans
Hardware Monitor
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Quiet Fan (Auto adjust chassis fan speed by CPU tempera-
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ture): CPU, Chassis, Chassis/Water Pump Fans
Fan Multi-Speed Control: CPU, Chassis, Chassis/Water
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Pump Fans
Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore
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Microso® Windows® 10 64-bit
OS
Certica­tions
* For detailed product information, please visit our website: http://ww w.asrock.com
Please realize that the re is a certain r isk involved with overclo cking, including adjusting the setting in the BIOS, applying Untied Overclocking Technol ogy, or using third-party overclocking tool s. Overclocking may aect your system’s stability, or even cause dam age to the components and devices of your system. It should be done at your own risk and expense. We are not responsible for poss ible damage caused by overclocking.
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FCC, CE
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ErP/EuP ready (ErP/EuP ready power supply is required)
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1.3 Motherboard Layout

H570M-ITX/ac
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No. Description
1 Chassis/Waterpump Fan Connector (CHA_FAN1/WP)
2 CPU Fan Connector (CPU_FAN1)
3 ATX 12V Power Connector (ATX12V1)
4 2 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)
5 ATX Power Connector (ATXPWR1)
6 USB 2.0 Header (USB_56)
7 USB 3.2 Gen1 Header (USB3_12)
8 SATA3 Connector (SATA3_1)
9 SATA3 Connector (SATA3_0)
10 SATA3 Connector (SATA3_3)
11 SATA3 Connector (SATA3_2)
12 Front Panel Type C USB 3.2 Gen1 Header (F_USB3_TC_1)
13 System Panel Header (PANEL1)
14 Chassis Speaker Header (SPEAKER1)
15 Chassis Fan Connector (CHA_FAN2)
16 Front Panel Audio Header (HD_AUDIO1)
17 Clear CMOS Jumper (CLRMOS1)
18 RGB LED Header (RGB_LED1)
19 Addressable LED Header (ADDR_LED1)
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1.4 I/O Panel

H570M-ITX/ac
4
1
2 3
5
13 810
12
7
6
11 9
No. Description No. Description
1 DisplayPort 1.4 8 USB 3.2 Gen2 Type-A Port (USB31_TA_1)
2 LAN RJ-45 Port (Intel® I219V)* 9 USB 3.2 Gen2x2 Type-C Port (USB31_TC_1)
3 2.5G LAN RJ-45 Port (Dragon RTL8125BG)** 10 USB 2.0 Port (USB_3)
4 Line In (Light Blue)*** 11 USB 3.2 Gen2 Type-A Port (USB_4)
5 Front Speaker (Lime)*** 12 USB 2.0 Ports (USB_12)
6 Antenna Ports 13 HDMI Port
7 Microphone (Pink)***
* ere are two LEDs on each LAN port. Please refer to the table below for the LAN port LED indications .
ACT/LINK L ED
SPEED LE D
LAN Por t
Activity / Link LED Speed LED
Status Description Status Description
O No Link O 10Mbps connection Blinking Data Activity Orange 100Mbps connection On Link Green 1Gbps connection
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** ere are two LEDs on each LAN port. Please refer to the table below for the LAN port LED indications.
ACT/LINK L ED
SPEED LE D
LAN Por t
Activity / Link LED Speed LED
Status Description Status Description
O No Link O 10Mbps connection Blinking Data Activity Orange 100Mbps/1Gbps connection
On Link Green 2.5Gbps connection
*** Functi on of the Audio Por ts in 7.1-channel Con guration:
Port Function
Light Blue (Rear panel) Rear Speaker Out Lime (Rear panel) Front Speaker Out Pink (Rear panel) Central /Subwoofer Speaker Out Lime (Front panel) Side Speaker Out
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H570M-ITX/ac

1.5 WiFi-802.11ac Module and ASRock WiFi 2.4/5 GHz Antennas

WiFi-802.11ac + BT Module
is motherboard comes with an exclusive WiFi 802.11 a/b/g/n/ac + BT v4.2
module (pre-installed on the rear I/O panel) that oers support for WiFi 802.11 a/b/
g/n/ac connectivity standards and Bluetooth v4.2. WiFi + BT module is an easy-to-
use wireless local area network (WLAN) adapter to support WiFi + BT. Bluetooth
v4.2 standard features Smart Ready technology that adds a whole new class of
functionality into the mobile devices. BT 4.2 also includes Low Energy Technolog y
and ensures extraordinary low power consumption for PCs.
* e transmission speed may vary according to the environment.
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English
WiFi Antennas Installation Guide
Step 1
Prepare the WiFi 2.4/5 GHz Antennas that come
with the package.
Step 2
Connect the two WiFi 2.4/5 GHz Antennas to
the antenna connectors. Turn the antenna clock-
wise until it is securely connected.
Step 3
Set the WiFi 2.4/5 GHz Antenna as shown in the
illustration.
*You may need to adjust the direction of
the antenna for a stronger signal.
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H570M-ITX/ac

Chapter 2 Installation

is is a Mini-ITX form factor motherboard. Before you install the motherboard,
study the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components
or change any motherboard settings.
Make sure to unplug the power cord before installing or removing the motherboard
•
components. Failure to do so may cause physical injuries and damages to motherboard
components.
In order to avoid damage from static electricity to the motherboard’s components,
•
NEVER place your motherboard directly on a carpet. Also remember to use a grounded
wrist strap or touch a safety grounded object before you handle the components.
Hold components by the edges and do not touch the ICs.
•
Whenever you uninstall any components, place them on a grounded anti-static pad or
•
in the bag that comes with the components.
When placing screws to secure the motherboard to the chassis, please do not over-
•
tighten the screws! Doing so may damage the motherboard.
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English

2.1 Installing the CPU

1. Before you insert the 120 0-Pin CPU into the socket, please check if the PnP ca p is on the socket, if the CPU sur face is unclean, or if th ere are any b ent pins in the socket. Do not force to insert the CPU into the socket if above situ ation is found. Other wise, the CPU wil l be seriously d amaged.
2. Unplug all power cables be fore installing the CPU.
1
A
B
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2
H570M-ITX/ac
3
5
4
15
English
Please save and replace the cover if the processor i s removed. e cover must be placed if you wish to return the motherboard for aer service.
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2.2 Installing the CPU Fan and Heatsink

1 2
H570M-ITX/ac
CPU_FAN
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2.3 Installing Memory Modules (DIMM)

is motherboard provides two 288-pin DDR4 (Double Data Rate 4) DIMM slots,
and supports Dual Channel Memory Technology.
1. For dual channel conguration, you always need to install identica l (the same
brand, speed , size and chip-type) DDR4 DIMM pairs.
2. It is unable to activate Dual Channel Memor y Technology with only one memory module instal led.
3. It is not allowed to install a DDR, DDR2 or DDR3 memory module into a DDR4 slot; otherwise, this motherboard and DIMM may be damaged.
e DIMM only ts in one correct orie ntation. It will cause permanent dam age to the mothe rboard and the DIMM if you force the DIMM into the slot at incor rect orientation .
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H570M-ITX/ac
1
2
3
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2.4 Expansion Slots (PCI Express Slot)

ere is 1 PCI Express slot slot on the motherboard.
Before installing an ex pansion card, please make sure that the power supply is switched o or the power cord is unplugged. Plea se read the documentation of the expan sion card and mak e necessary hardware settings for the card before you start the installation.
PCIe slots:
11th Gen Intel® CoreTM Processors:
PCIE1 (PCIe 4.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
10th Gen Intel® CoreTM Processors:
PCIE1 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
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