No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.
Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see ww w.dtsc.ca.gov/hazardouswaste/
perchlorate”
ASRock Website: http://www.asrock.com
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Our goods come with guarantees that cannot be excluded under the Australian Consumer
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failure does not amount to a major failure. If you require assistance please call ASRock Tel
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e terms HDMI® and HDMI High-Denition Multimedia Interface, and the HDMI
logo are trademarks or registered trademarks of HDMI Licensing LLC in the United
States and other countries.
INTEL END USER SOFTWARE LICENSE AGREEMENT
IMPORTANT - READ BEFORE COPYING, INSTALLING OR USING.
LICENSE. Licensee has a license under Intel’s copyrights to reproduce Intel’s Soware
only in its unmodied and binar y form, (with the accompanying documentation, the
“Soware”) for Licensee’s personal use only, and not commercial use, in connection with
Intel-based products for which the Soware has been provided, subject to the following
conditions:
(a) Licensee may not disclose, distribute or transfer any part of the Soware, and You agree
to prevent unauthorized copying of the Soware.
(b) Licensee may not reverse engineer, decompile, or disassemble the Soware.
(c) Licensee may not sublicense the Soware.
(d) e Soware may contain the soware and other intellectual property of third party
suppliers, some of which may be identied in, and licensed in accordance with, an enclosed
license.txt le or other text or le.
(e) Intel has no obligation to provide any support, technical assistance or updates for the
Soware.
OWNERSHIP OF SOFTWARE AND COPYRIGHTS. Title to all copies of the Soware
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DISCLAIMER OF WARRANTY. e Soware is provided “AS IS” without warranty of
any kind, EITHER EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION,
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LIMITATION OF LIABILITY. NEITHER INTEL NOR ITS LICENSORS OR SUPPLIERS
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ES OF ANY KIND WHETHER UNDER THIS AGREEMENT OR OTHERWISE, EVEN
IF INTEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
LICENSE TO USE COMMENTS AND SUGGESTIONS. is Agreement does NOT
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TERMINATION OF THIS LICENSE. Intel or the sublicensor may terminate this license
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THIRD PARTY BENEFICIARY. Intel is an intended beneciary of the End User License
Agreement and has the right to enforce all of its terms.
U.S. GOVERNMENT RESTRICTED RIGHTS. e Soware is a commercial item (as
dened in 48 C.F.R. 2.101) consisting of commercial computer soware and commercial
computer soware documentation (as those terms are used in 48 C.F.R. 12.212), consistent
with 48 C.F.R. 12.212 and 48 C.F.R 227.7202-1 through 227.7202-4. You will not provide
the Soware to the U.S. Government. Contractor or Manufacturer is Intel Corporation,
2200 Mission College Blvd., Santa Clara, CA 95054.
EXPORT LAWS. Licensee agrees that neither Licensee nor Licensee’s subsidiaries will
export/re-export the Soware, directly or indirectly, to any country for which the U.S.
Department of Commerce or any other agency or department of the U.S. Government
or the foreign government from where it is shipping requires an export license, or other
governmental approval, without rst obtaining any such required license or approval. In
the event the Soware is exported from the U.S.A. or re-exported from a foreign destination by Licensee, Licensee will ensure that the distribution and export/re-export or import
of the Soware complies with all laws, regulations, orders, or other restrictions of the U.S.
Export Administration Regulations and the appropriate foreign government.
APPLICABLE LAWS. is Agreement and any dispute arising out of or relating to it will
be governed by the laws of the U.S.A. and Delaware, without regard to conict of laws
principles. e Parties to this Agreement exclude the application of the United Nations
Convention on Contracts for the International Sale of Goods (1980). e state and federal
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in those courts. A Party that obtains a judgment against the other Party in the courts identied in this section may enforce that judgment in any court that has jurisdiction over the
Parties.
Licensee’s specic rights may vary from country to country.
CE Warning
is device complies with directive 2014/53/EU issued by the Commision of the European
Community.
is equipment complies with EU radiation exposure limits set forth for an uncontrolled
environment.
is equipment should be installed and operated with minimum distance 20cm between
the radiator & your body.
Operations in the 5.15-5.35GHz band are restricted to indoor usage only.
Radio transmit power per transceiver ty pe
FunctionFrequencyMaximum Output Power (EIRP)
2400-2483.5 MHz18.5 + / -1.5 dbm
5150-5250 MHz21.5 + / -1.5 dbm
WiFi
Bluetooth2400-2483.5 MHz8.5 + / -1.5 dbm
5250-5350 MHz
5470-5725 MHz
18.5 + / -1.5 dbm (no TPC)
21.5 + / -1.5 dbm (TPC)
25.5 + / -1.5 dbm (no TPC)
28.5 + / -1.5 dbm (TPC)
Contents
Chapter 1 Introduction 1
1.1 Package Contents 1
1.2 Specications 2
1.3 Motherboard Layout 7
1.4 I/O Panel 9
1.5 WiFi-802.11ac Module and ASRock WiFi 2.4/5 GHz
Antennas 11
Chapter 2 Installation 13
2.1 Installing the CPU 14
2.2 Installing the CPU Fan and Heatsink 17
2.3 Installing Memory Modules (DIMM) 18
2.4 Expansion Slots (PCI Express Slot) 20
2.5 Jumpers Setup 21
2.6 Onboard Headers and Connectors 22
2.7 M.2_SSD (NGFF) Module Installation Guide (M2_1 and M2_2) 27
3.2.2 Using ASRock Motherboard Utility (A-Tuning) 33
3.3 ASRock Live Update & APP Shop 36
3.3.1 UI Overview 36
3.3.2 Apps 37
3.3.3 BIOS & Drivers 40
3.3.4 Setting 41
3.4 Nahimic Audio 42
3.5 ASRock Polychrome SYNC 43
Chapter 4 UEFI SETUP UTILITY 46
4.1 Introduction 46
4.2 EZ Mode 47
4.3 Advanced Mode 48
4.3.1 UEFI Menu Bar 48
4.3.2 Navigation Keys 49
4.4 Main Screen 50
4.5 OC Tweaker Screen 51
4.6 Advanced Screen 63
4.6.1 CPU Conguration 64
4.6.2 Chipset Conguration 66
4.6.3 Storage Conguration 69
4.6.4 ACPI Conguration 70
4.6.5 USB Conguration 71
4.6.6 Trusted Computing 72
4.7 Tools 73
4.8 Hardware Health Event Monitoring Screen 75
4.9 Security Screen 77
4.10 Boot Screen 78
4.11 Exit Screen 81
H570M-ITX/ac
Chapter 1 Introduction
ank you for purchasing ASRock H570M-ITX/ac motherboard, a reliable
motherboard produced under ASRock’s consistently stringent quality control.
It delivers excellent performance with robust design conforming to ASRock’s
commitment to quality and endurance.
In this documentation, Chapter 1 and 2 contains the introduction of the
motherboard and step-by-step installation guides. Chapter 3 contains the operation
guide of the soware and utilities. Chapter 4 contains the conguration guide of
the BIOS setup.
Becau se the motherboard specications and the BIOS soware might be updated, the
content of this documentation will be subject to change without notice. In case any
modications of this documentation occur, the updated version will be available on
ASRock’s website w ithout f urther notice. If you require technical support relate d to
this motherboard, please vi sit our website for s pecic information about the model
you are using. You may nd the l atest VGA cards and CPU suppor t list on ASRock’s
website a s well. ASRock website ht tp://www.a srock.com.
1.1 Package Contents
ASRock H570M-ITX/ac Motherboard (Mini-ITX Form Factor)
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ASRock H570M-ITX/ac Quick Installation Guide
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ASRock H570M-ITX/ac Support CD
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2 x Serial ATA (SATA) Data Cables (Optional)
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1 x I/O Panel Shield
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2 x ASRock WiFi 2.4/5 GHz Antennas (Optional)
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2 x Screws for M.2 Sockets (Optional)
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1.2 Specications
Platform
CPU
Chipset
Memory
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* 11th Gen Intel® CoreTM (i9/i7/i5) support DDR4 up to 3200;
CoreTM (i3), Pentium® and Celeron® support DDR4 up to 2666.
* 10th Gen Intel® CoreTM (i9/i7) support DDR4 up to 2933; CoreTM
(i5/i3), Pentium® and Celeron® support DDR4 up to 2666.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
•
•
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Mini-ITX Form Factor
8 Layer PCB
Supports 10th Gen Intel® CoreTM Processors and 11th Gen
Intel® CoreTM Processors (LGA1200)
Digi Power design
8 Power Phase design
Supports Intel® Turbo Boost Max 3.0 Technology
Intel® H570
Dual Channel DDR4 Memory Technology
2 x DDR4 DIMM Slots
11th Gen Intel® CoreTM Processors support DDR4 non-ECC,
un-buered memory up to 5066+(OC)*
10th Gen Intel® CoreTM Processors support DDR4 non-ECC,
un-buered memory up to 4600+(OC)*
Supports ECC UDIMM memory modules (operate in non-
ECC mode)
Max. capacity of system memory: 64GB
Supports Intel® Extreme Memory Prole (XMP) 2.0
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Expansion
Slot
11th Gen Intel® CoreTM Processors
1 x PCI Express 4.0 x16 Slot*
•
10th Gen Intel® CoreTM Processors
1 x PCI Express 3.0 x16 Slot*
•
* Supports NVMe SSD as boot disks
1 x Vertical M.2 Socket (Key E) with the bundled WiFi-
•
802.11ac module (on the rear I/O)
Graphics
H570M-ITX/ac
Intel® UHD Graphics Built-in Visuals and the VGA outputs
•
can be supported only with processors which are GPU
integrated.
11th Gen Intel® CoreTM Processors support Intel® Xe Graphics
•
Architecture (Gen 12). 10th Gen Intel® CoreTM Processors
support Gen 9 Graphics
Graphics, Media & Compute: Microso DirectX 12, OpenGL
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4.5, Intel® Built In Visuals, Intel® Quick Sync Video, Hybrid /
Switchable Graphics, OpenCL 2.1
Display & Content Security: Rec. 2020 (Wide Color Gamut),
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Microso PlayReady 3.0, UHD/HDR Blu-ray Disc
Dual graphics output: support HDMI and DisplayPort 1.4
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ports by independent display controllers
Supports HDMI 2.0 with ma x. resolution up to 4K x 2K
•
(4096x2160) @ 60Hz
Supports DisplayPort 1.4 with max. resolution up to 4K x 2K
•
(4096x2304) @ 60Hz
Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and
•
HBR (High Bit Rate Audio) with HDMI 2.0 Port (Compliant
HDMI monitor is required)
Supports HDCP 2.3 with HDMI 2.0 and DisplayPort 1.4
•
Ports
Supports 4K Ultra HD (UHD) playback with HDMI 2.0 and
•
DisplayPort 1.4 Ports
* 11th Gen Intel® CoreTM Processors support HDMI 2.0. 10th Gen
Intel® CoreTM Processors support HDMI 1.4.
Audio
7.1 CH HD Audio (Realtek ALC897 Audio Codec)
•
Supports Surge Protection
•
Nahimic Audio
•
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3
LAN
Wireless
LAN
1 x 2.5 Gigabit LAN 10/100/1000/250 0 Mb/s (Dragon RTL-
8125BG):
Supports Dragon 2.5G LAN Soware
•
- Smart Auto Adjust Bandwidth Control
- Visual User Friendly UI
- Visual Network Usage Statistics
- Optimized Default Setting for Game, Browser, and
Streaming Modes
- User Customized Priority Control
Supports Wake-On-LAN
•
Supports Lightning/ESD Protection
•
Supports Energy Ecient Ethernet 802.3az
•
Supports PXE
•
1 x Gigabit LAN 10/100/1000 Mb/s (Intel® I219V):
Supports Wake-On-LAN
•
Supports Lightning/ESD Protection
•
Supports Energy Ecient Ethernet 802.3az
•
Supports PXE
•
Intel® 802.11ac WiFi Module
•
Supports IEEE 802.11a/b/g/n/ac
•
Supports Dual-Band (2.4/5 GHz)
•
Supports high speed wireless connections up to 433Mbps
•
Supports Bluetooth 4.2 / 3.0 + High speed class II
•
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Rear Panel
I/O
2 x Antenna Ports
•
1 x HDMI Port
•
1 x DisplayPort 1.4
•
1 x USB 3.2 Gen2x2 Type-C Port (20 Gb/s) (Supports ESD
•
Protection)
2 x USB 3.2 Gen2 Type-A Ports (10 Gb/s) (Supports ESD
•
Protection)
3 x USB 2.0 Ports (Supports ESD Protection)
•
2 x RJ-45 LAN Ports with LED (ACT/LINK LED and SPEED
•
LED)
HD Audio Jacks: Line in / Front Speaker / Microphone
•
Storage
Connector
H570M-ITX/ac
4 x SATA3 6.0 Gb/s Connectors, support RAID (RAID 0,
Please realize that the re is a certain r isk involved with overclo cking, including
adjusting the setting in the BIOS, applying Untied Overclocking Technol ogy, or using
third-party overclocking tool s. Overclocking may aect your system’s stability, or
even cause dam age to the components and devices of your system. It should be done
at your own risk and expense. We are not responsible for poss ible damage caused by
overclocking.
•
FCC, CE
•
ErP/EuP ready (ErP/EuP ready power supply is required)
•
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1.3 Motherboard Layout
H570M-ITX/ac
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7
No. Description
1Chassis/Waterpump Fan Connector (CHA_FAN1/WP)
2CPU Fan Connector (CPU_FAN1)
3ATX 12V Power Connector (ATX12V1)
42 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)
5ATX Power Connector (ATXPWR1)
6USB 2.0 Header (USB_56)
7USB 3.2 Gen1 Header (USB3_12)
8SATA3 Connector (SATA3_1)
9SATA3 Connector (SATA3_0)
10 SATA3 Connector (SATA3_3)
11 SATA3 Connector (SATA3_2)
12 Front Panel Type C USB 3.2 Gen1 Header (F_USB3_TC_1)
13 System Panel Header (PANEL1)
14 Chassis Speaker Header (SPEAKER1)
15 Chassis Fan Connector (CHA_FAN2)
16 Front Panel Audio Header (HD_AUDIO1)
17 Clear CMOS Jumper (CLRMOS1)
18 RGB LED Header (RGB_LED1)
19 Addressable LED Header (ADDR_LED1)
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1.4 I/O Panel
H570M-ITX/ac
4
1
23
5
13810
12
7
6
119
No. DescriptionNo. Description
1DisplayPort 1.48USB 3.2 Gen2 Type-A Port (USB31_TA_1)
2LAN RJ-45 Port (Intel® I219V)*9USB 3.2 Gen2x2 Type-C Port (USB31_TC_1)
32.5G LAN RJ-45 Port (Dragon RTL8125BG)** 10USB 2.0 Port (USB_3)
4Line In (Light Blue)***11USB 3.2 Gen2 Type-A Port (USB_4)
5Front Speaker (Lime)***12USB 2.0 Ports (USB_12)
6Antenna Ports13HDMI Port
7Microphone (Pink)***
* ere are two LEDs on each LAN port. Please refer to the table below for the LAN port LED indications .
*** Functi on of the Audio Por ts in 7.1-channel Con guration:
PortFunction
Light Blue (Rear panel)Rear Speaker Out
Lime (Rear panel)Front Speaker Out
Pink (Rear panel)Central /Subwoofer Speaker Out
Lime (Front panel)Side Speaker Out
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H570M-ITX/ac
1.5 WiFi-802.11ac Module and ASRock WiFi 2.4/5 GHz
Antennas
WiFi-802.11ac + BT Module
is motherboard comes with an exclusive WiFi 802.11 a/b/g/n/ac + BT v4.2
module (pre-installed on the rear I/O panel) that oers support for WiFi 802.11 a/b/
g/n/ac connectivity standards and Bluetooth v4.2. WiFi + BT module is an easy-to-
use wireless local area network (WLAN) adapter to support WiFi + BT. Bluetooth
v4.2 standard features Smart Ready technology that adds a whole new class of
functionality into the mobile devices. BT 4.2 also includes Low Energy Technolog y
and ensures extraordinary low power consumption for PCs.
* e transmission speed may vary according to the environment.
11
English
WiFi Antennas Installation Guide
Step 1
Prepare the WiFi 2.4/5 GHz Antennas that come
with the package.
Step 2
Connect the two WiFi 2.4/5 GHz Antennas to
the antenna connectors. Turn the antenna clock-
wise until it is securely connected.
Step 3
Set the WiFi 2.4/5 GHz Antenna as shown in the
illustration.
*You may need to adjust the direction of
the antenna for a stronger signal.
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12
H570M-ITX/ac
Chapter 2 Installation
is is a Mini-ITX form factor motherboard. Before you install the motherboard,
study the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components
or change any motherboard settings.
Make sure to unplug the power cord before installing or removing the motherboard
•
components. Failure to do so may cause physical injuries and damages to motherboard
components.
In order to avoid damage from static electricity to the motherboard’s components,
•
NEVER place your motherboard directly on a carpet. Also remember to use a grounded
wrist strap or touch a safety grounded object before you handle the components.
Hold components by the edges and do not touch the ICs.
•
Whenever you uninstall any components, place them on a grounded anti-static pad or
•
in the bag that comes with the components.
When placing screws to secure the motherboard to the chassis, please do not over-
•
tighten the screws! Doing so may damage the motherboard.
13
English
2.1 Installing the CPU
1. Before you insert the 120 0-Pin CPU into the socket, please check if the PnP ca p
is on the socket, if the CPU sur face is unclean, or if th ere are any b ent pins in the
socket. Do not force to insert the CPU into the socket if above situ ation is found.
Other wise, the CPU wil l be seriously d amaged.
2. Unplug all power cables be fore installing the CPU.
1
A
B
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14
2
H570M-ITX/ac
3
5
4
15
English
Please save and replace the cover if the processor i s removed. e cover must be
placed if you wish to return the motherboard for aer service.
English
16
2.2 Installing the CPU Fan and Heatsink
12
H570M-ITX/ac
CPU_FAN
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17
2.3 Installing Memory Modules (DIMM)
is motherboard provides two 288-pin DDR4 (Double Data Rate 4) DIMM slots,
and supports Dual Channel Memory Technology.
1. For dual channel conguration, you always need to install identica l (the same
brand, speed , size and chip-type) DDR4 DIMM pairs.
2. It is unable to activate Dual Channel Memor y Technology with only one memory
module instal led.
3. It is not allowed to install a DDR, DDR2 or DDR3 memory module into a DDR4
slot; otherwise, this motherboard and DIMM may be damaged.
e DIMM only ts in one correct orie ntation. It will cause permanent dam age to
the mothe rboard and the DIMM if you force the DIMM into the slot at incor rect
orientation .
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18
H570M-ITX/ac
1
2
3
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19
2.4 Expansion Slots (PCI Express Slot)
ere is 1 PCI Express slot slot on the motherboard.
Before installing an ex pansion card, please make sure that the power supply is
switched o or the power cord is unplugged. Plea se read the documentation of the
expan sion card and mak e necessary hardware settings for the card before you start
the installation.
PCIe slots:
11th Gen Intel® CoreTM Processors:
PCIE1 (PCIe 4.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
10th Gen Intel® CoreTM Processors:
PCIE1 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
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