No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.
Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see ww w.dtsc.ca.gov/hazardouswaste/
perchlorate”
ASRock Website: http://www.asrock.com
Page 3
AUSTRALIA ONLY
Our goods come with guarantees that cannot be excluded under the Australian
Consumer Law. You are entitled to a replacement or refund for a major failure and
compensation for any other reasonably foreseeable loss or damage caused by our
goods. You are also entitled to have the goods repaired or replaced if the goods fail
to be of acceptable quality and the failure does not amount to a major failure. If
you require assistance please call ASRock Tel : +886-2-28965588 ext.123 (Standard
International call charges apply)
e terms HDMI® and HDMI High-Denition Multimedia Interface, and the
HDMI logo are trademarks or registered trademarks of HDMI Licensing LLC in the
United States and other countries.
3.2.2 Using ASRock Motherboard Utility (A-Tuning) 31
3.3 ASRock Live Update & APP Shop 34
3.3.1 UI Overview 34
3.3.2 Apps 35
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3.3.3 BIOS & Drivers 38
3.3.4 Setting 39
Chapter 4 UEFI SETUP UTILITY 40
4.1 Introduction 40
4.2 EZ Mode 41
4.3 Advanced Mode 42
4.3.1 UEFI Menu Bar 42
4.3.2 Navigation Keys 43
4.4 Main Screen 44
4.5 OC Tweaker Screen 45
4.6 Advanced Screen 53
4.6.1 CPU Conguration 54
4.6.2 Chipset Conguration 56
4.6.3 Storage Conguration 59
4.6.4 Super IO Conguration 60
4.6.5 ACPI Conguration 61
4.6.6 USB Conguration 63
4.6.7 Trusted Computing 64
4.7 Tools 65
4.8 Hardware Health Event Monitoring Screen 67
4.9 Security Screen 70
4.10 Boot Screen 71
4.11 Exit Screen 74
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H470M-HDV/M.2
Chapter 1 Introduction
ank you for purchasing ASRock H470M-HDV/M.2 motherboard, a reliable
motherboard produced under ASRock’s consistently stringent quality control.
It delivers excellent performance with robust design conforming to ASRock’s
commitment to quality and endurance.
In this documentation, Chapter 1 and 2 contains the introduction of the
motherboard and step-by-step installation guides. Chapter 3 contains the operation
guide of the soware and utilities. Chapter 4 contains the conguration guide of
the BIOS setup.
Becau se the motherboard specications and the BIOS soware might be updated, the
content of this documentation will be subject to change without notice. In case any
modications of this documentation occur, the updated version will be available on
ASRock’s website w ithout f urther notice. If you require technical support relate d to
this motherboard, please vi sit our website for s pecic information about the model
you are using. You may nd the l atest VGA cards and CPU suppor t list on ASRock’s
website a s well. ASRock website ht tp://www.a srock.com.
1.1 Package Contents
ASRock H470M-HDV/M.2 Motherboard (Micro ATX Form Factor)
•
ASRock H470M-HDV/M.2 Quick Insta llation Guide
•
ASRock H470M-HDV/M.2 Support CD
•
2 x Serial ATA (SATA) Data Cables (Optional)
•
2 x Screws for M.2 Sockets (Optional)
•
1 x I/O Panel Shield
•
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1.2 Specications
Platform
CPU
Chipset
Memory
•
•
•
•
•
•
•
•
•
•
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
* CoreTM (i9/i7) support DDR4 up to 2933; CoreTM (i5/i3),
Pentium® and Celeron® support DDR4 up to 2666.
•
•
•
•
Micro ATX Form Factor
Solid Capacitor design
Supports 10th Gen Intel® CoreTM Processors (Socket 1200)
Please realize that the re is a certain r isk involved with overclo cking, including
adjusting the setting in the BIOS, applying Untied Overclocking Technol ogy, or using
third-party overclocking tool s. Overclocking may aect your system’s stability, or
even cause dam age to the components and devices of your system. It should be done
at your own risk and expense. We are not responsible for poss ible damage caused by
overclocking.
•
FCC, CE
•
ErP/EuP ready (ErP/EuP ready power supply is required)
•
H470M-HDV/M.2
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1.3 Motherboard Layout
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No. Description
1ATX 12V Power Connector (ATX12V1)
2CPU Fan Connector (CPU_FAN1)
32 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)
4Chassis/Water Pump Fan Connector (CHA_FAN1/WP)
5ATX Power Connector (ATXPWR1)
6USB 3.2 Gen1 Header (USB3_1_2)
7SATA3 Connector (SATA3_0) (Upper)
8SATA3 Connector (SATA3_1) (Lower)
9SATA3 Connector (SATA3_2) (Upper)
10 SATA3 Connector (SATA3_3) (Lower)
11 SPI TPM Header (SPI_TPM_J1)
12 System Panel Header (PANEL1)
13 Chassis Intrusion and Speaker Header (SPK_CI1)
14 Chassis/Water Pump Fan Connector (CHA_FAN2/WP)
15 USB 2.0 Header (USB_5)
16 USB 2.0 Header (USB3_4)
17 USB 3.2 Gen1 Header (USB3_5_6)
18 COM Port Header (COM1)
19 Print Port Header (LPT1)
20 Front Panel Audio Header (HD_AUDIO1)
21 Clear CMOS Jumper (CLRMOS1)
22 CPU/Water Pump Fan Connector (CPU_FAN2/WP)
H470M-HDV/M.2
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1.4 I/O Panel
1
126710
11
2
9
8
3
No. DescriptionNo. Description
1D-Sub Port7USB 3.2 Gen1 Ports (USB3_3_4)
2PS/2 Mouse/Keyboard Port 8USB 2.0 Ports (USB1_2)
3LAN RJ-45 Port* 9Antenna Bracket
4Line In (Light Blue)**10USB 3.2 Gen1 Ports (USB3_7_8)
5Front Speaker (Lime)**11DVI-D Port
6Microphone (Pink)**12HDMI Port
* ere are two LEDs on each LAN port. Please refer to the table below for the LAN port LED indications .
** Function of the Au dio Ports in 7.1-channel Con guration:
PortFunction
Light Blue (Rear panel)Rear Speaker Out
Lime (Rear panel)Front Speaker Out
Pink (Rear panel)Central /Subwoofer Speaker Out
Lime (Front panel)Side Speaker Out
H470M-HDV/M.2
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Chapter 2 Installation
is is a Micro ATX form factor motherboard. Before you install the motherboard,
study the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components
or change any motherboard settings.
Make sure to unplug the power cord before installing or removing the motherboard
•
components. Failure to do so may cause physical injuries and damages to motherboard
components.
In order to avoid damage from static electricity to the motherboard’s components,
•
NEVER place your motherboard directly on a carpet. Also remember to use a grounded
wrist strap or touch a safety grounded object before you handle the components.
Hold components by the edges and do not touch the ICs.
•
Whenever you uninstall any components, place them on a grounded anti-static pad or
•
in the bag that comes with the components.
When placing screws to secure the motherboard to the chassis, please do not over-
•
tighten the screws! Doing so may damage the motherboard.
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2.1 Installing the CPU
1. Before you insert the 120 0-Pin CPU into the socket, please check if the PnP ca p
is on the socket, if the CPU sur face is unclean, or if th ere are any b ent pins in the
socket. Do not force to insert the CPU into the socket if above situ ation is found.
Other wise, the CPU wil l be seriously d amaged.
2. Unplug all power cables be fore installing the CPU.
1
H470M-HDV/M.2
A
B
2
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3
5
4
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Please save and replace the cover if the processor i s removed. e cover must be
placed if you wish to return the motherboard for aer service.
H470M-HDV/M.2
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2.2 Installing the CPU Fan and Heatsink
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CPU_FAN
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2.3 Installing Memory Modules (DIMM)
is motherboard provides two 288-pin DDR4 (Double Data Rate 4) DIMM slots,
and supports Dual Channel Memory Technology.
1. For dual channel conguration, you always need to install identica l (the same
brand, speed , size and chip-type) DDR4 DIMM pairs.
2. It is unable to activate Dual Channel Memor y Technology with only one memory
module instal led.
3. It is not allowed to install a DDR, DDR2 or DDR3 memory module into a DDR4
slot; otherwise, this motherboard and DIMM may be damaged.
e DIMM only ts in one correct orientation. It will cause permanent dam age to
the mothe rboard and the DIMM if you force the DIMM into the slot at incor rect
orientation .
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1
2
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3
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2.4 Expansion Slots (PCI Express Slots)
ere are 3 PCI Express slots on the motherboard.
Before installing an ex pansion card, please make sure that the power supply is
switched o or the power cord is unplugged. Plea se read the documentation of the
expan sion card and mak e necessary hardware settings for the card before you start
the installation.
PCIe slots:
PCIE1 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
PCIE2 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.
PCIE3 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.
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2.5 Jumpers Setup
e illustration shows how jumpers are setup. When the jumper cap is placed on
the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper is
“Open”.
English
Clear CMOS Jumper
(CLRMOS1)
(see p.6, No. 21)
CLRMOS1 allows you to clear the data in CMOS. e data in CMOS includes
system setup information such as system password, date, time, and system setup
parameters. To clear and reset the system parameters to default setup, please turn
o the computer and unplug the power cord, then use a jumper cap to short the
pins on CLR MOS1 for 3 seconds. Please remember to remove the jumper cap aer
clearing the CMOS. If you need to clear the CMOS when you just nish updating
the BIOS, you must boot up the system rst, and then shut it down before you do
the clear-CMOS action.
If you clear the CMOS, the case open may be detec ted. Please adjust the BIOS option
“Clear Status” to clear the record of previou s chassis intrusion status.
2-pin Jumper
Short: Clear CMOS
Open: Default
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2.6 Onboard Headers and Connectors
SPE AKE R
Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over
these header s and connectors. Placing jumper caps over the headers and connectors
will cause permanent damage to the motherboard.
H470M-HDV/M.2
System Panel Header
(9-pin PANEL1)
(see p.6, No. 12)
PWRBTN (Power Button):
Connec t to the power button on the chassi s front panel. You may congure the way
to turn o your system using the powe r button.
RESET (Reset Button):
Connec t to the reset button on the chassi s front panel. Press the reset button to
restar t the computer if the computer freezes and fails to perform a nor mal restart.
PLED (Syste m Power LED):
Connec t to the power status indicator on the chassis front panel. e LED i s on when
the system is ope rating. e LED keeps blinking when the system i s in S1/S3 sleep
state. e LED is o when the system is in S4 sleep state or powered o (S5).
HDLED (Ha rd Drive Activity LED):
Connec t to the hard drive ac tivity LED on the chassis front panel. e LED is on
when the hard drive i s reading or writing data.
e front panel de sign may dier by chassis. A front pane l module mainly consists
of power button , reset button, power LED, hard dr ive activity LED, speaker and etc.
When connecting your chassis front panel module to this head er, make sure the wire
assig nments and the pin assig nments are matched correctly.
1
PLE D+
PLE D-
HDL ED-
HDL ED+
PWR BTN #
GND
RES ET#
GND
GND
Connect the power
button, reset button and
system status indicator on
the chassis to this header
according to the pin
assignments below. Note
the positive and negative
pins before connecting
the cables.
Chassis Intrusion and
Speaker Header
(7-pin SPK_CI1)
(see p.6, No. 13)
DUM MY
+5V
1
SIG NAL
DUM MY
GND
DUM MY
Please connect the
chassis intrusion and the
chassis speaker to this
header.
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Serial ATA3 Connectors
IntA _P_D+
Right Angle:
(SATA3_0:
see p.6, No. 7) (Upeper)
(SATA3_1:
see p.6, No. 8) (Lower)
(SATA3_2:
see p.6, No. 9) (Upper)
(SATA3_3:
see p.6, No. 10) (Lower)
SATA3_0
SATA3_2
ese four SATA3
connectors support SATA
data cables for internal
SATA3_1
storage devices with up to
6.0 Gb/s data transfer rate.
SATA3_3
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USB 2.0 Headers
(9-pin USB3_4)
(see p.6, No. 16)
(4-pin USB_5)
(see p.6, No. 15)
USB 3.2 Gen1 Headers
(19-pin USB3_1_2)
(see p.6, No. 6)
(19-pin USB3_5_6)
(see p.6, No. 17)
Front Panel Audio Header
(9-pin HD_AUDIO1)
(see p.6, No. 20)
USB _PW R
1
USB _PW R
1
USB_ PWR
Vbus
IntA _PA_S SRX-
IntA _PA_S SRX+
GND
IntA _PA_S STX-
IntA _PA_S STX+
GND
IntA _PA_D -
IntA _PA_D +
IntA _P_D-
1
IntA _P_D+
ID
GND
1
MIC 2_L
P-
P+
P+
P-
P-
P+
GND
IntA _P_SS TX+
IntA _P_SS TX-
IntA _P_SS TX+
GND
IntA _P_D-
PRE SEN CE#
MIC _RE T
OUT 2_R
MIC 2_R
GND
DUM MY
GND
GND
VbusVbus
IntA _PB_ SSRX -
IntA _PB_ SSRX +
GND
IntA _PB_ SSTX -
IntA _PB_ SSTX +
GND
IntA _PB_ D-
IntA _PB_ D+
Dumm y
1
GND
IntA _P_SS RX+
IntA _P_SS RX-
IntA _P_SS RX+
GND
IntA _P_SS TX-
OUT _RE T
OUT 2_L
J_S ENS E
Vbus
Vbus
IntA _P_SS RX-
ere are two headers on
this motherboard.
ere are two headers on
this motherboard. Each
USB 3.2 Gen1 header can
support two ports.
is header is for
connecting audio devices
to the front audio panel.
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1. High Denition Audio supports Jack Sensing, but the panel wire on the chassis
GND
FAN_V OLTAGE _CO NTRO L
FAN_S PEE D
FAN_S PEE D_CO NTR OL
4 3 2 1
must support HDA to function correctly. Please follow the instructions in our
manual and chassis manual to install your system.
2. If you use an AC’97 audio panel, please install it to the front panel audio heade r by
the steps below:
A. Connect Mic_IN (MIC) to MIC2_ L.
B. Conne ct Audio_R (RIN) to OUT2_R and Audio_ L (LIN) to OUT2_ L.
C. Connect Ground (GND) to Ground (GND).
D. MIC_ RET and OUT_RET are for the HD audio panel only. You don’t need to
connec t them for the AC’97 audio panel.
E. To activate the front mic, go to the “FrontMic” Tab in the Realtek Control panel
and adju st “Recording Volume”.
ere are four sections in ASRock Motherboard Utility (A-Tuning) main menu:
Operation Mode, System Info, FAN-Tastic Tuning and Settings.
Operation Mode
Choose an operation mode for your computer.
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System Info
View information about the system.
*e System Browser tab may not appear for certain models.
FAN-Tastic Tuning
Congure up to ve dierent fan speeds using the graph. e fans will automatically shi
to the next speed level when the assigned temperature is met.
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Settings
Congure ASRock ASRock Motherboard Utility (A-Tuning). Click to select "Auto
run at Windows Startup" if you want ASRock Motherboard Utility (A-Tuning) to
be launched when you start up the Windows operating system.
H470M-HDV/M.2
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3.3 ASRock Live Update & APP Shop
e ASRock Live Update & APP Shop is an online store for purchasing and
downloading soware applications for your ASRock computer. You can quick ly and
easily insta ll various apps and support utilities. With ASRock Live Update & APP
Shop, you can optimize your system and keep your motherboard up to date simply
with a few clicks.
Double-click on your desktop to access ASRock Live Update & APP Shop
utility.
*You need to be connected to the Internet to download apps f rom the ASRock Live Update & APP Shop.
3.3.1 UI Overview
Category Panel
Hot News
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Information Panel
Category Panel: e category panel contains several category tabs or buttons that
when selected the information panel below displays the relative information.
Information Panel: e information panel in the center displays data about the
currently selected category and allows users to perform job-related tasks.
Hot News: e hot news section displays the various latest news. Click on the image
to visit the website of the selected news and know more.
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H470M-HDV/M.2
3.3.2 Apps
When the "Apps" tab is selected, you will see all the available apps on screen for you
to download.
Installing an App
Step 1
Find the app you want to install.
e most recommended app appears on the le side of the screen. e other various
apps are shown on the right. Please scroll up and down to see more apps listed.
You can check the price of the app and whether you have already intalled it or not.
- e red icon displays the price or "Free" if the app is free of charge.
- e green "Installed" icon means the app is installed on your computer.
Step 2
Click on the app icon to see more details about the selected app.
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Step 3
If you want to install the app, click on the red icon to start downloading.
Step 4
When installation completes, you can nd the green "Installed " icon appears on the
upper right corner.
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To uninstall it, simply click on the trash can icon .
*e trash icon may not appear for certain apps.
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Upgrading an App
You can only upgrade the apps you have already installed. When there is an
available new version for your app, you will nd the mark of "New Version"
appears below the installed app icon.
Step 1
Click on the app icon to see more details.
H470M-HDV/M.2
Step 2
Click on the yellow icon to start upgrading.
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3.3.3 BIOS & Drivers
Installing BIOS or Drivers
When the "BIOS & Drivers" tab is selected, you will see a list of recommended or
critical updates for the BIOS or drivers. Please update them all soon.
Step 1
Please check the item information before update. Click on to see more details.
Step 2
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Click to select one or more items you want to update.
Step 3
Click Update to start the update process.
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3.3.4 Setting
In the "Setting" page, you can change the language, select the server location, and
determine if you want to automatically run the ASRock Live Update & APP Shop
on Windows startup.
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Chapter 4 UEFI SETUP UTILITY
4.1 Introduction
is section explains how to use the UEFI SETUP UTILITY to congure your
system. You may run the UEFI SETUP UTILITY by pressing <F2> or <Del> right
aer you power on the computer, other wise, the Power-On-Self-Test (POST) will
continue with its test routines. If you wish to enter the UEFI SETUP UTILITY aer
POST, restart the system by pressing <Ctl> + <Alt> + <Delete>, or by pressing the
reset button on the system chassis. You may also restart by turning the system o
and then back on.
Becau se the UEFI soware is constantly being upd ated, the following UEFI setup
screens and de scriptions are for reference purpose only, and they may not exactly
match what you see on your scre en.
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H470M-HDV/M.2
4.2 EZ Mode
e EZ Mode screen appears when you enter the BIOS setup program by default. EZ
mode is a dashboard which contains multiple readings of the system’s current status.
You can check the most crucial information of your system, such as CPU speed,
DRAM frequency, SATA information, fan speed, etc.
Press <F6> or click the "Advanced Mode" button at the upper right corner of the
screen to switch to "Advanced Mode" for more options.
1 2 3 456
No.Function
Help
1
Load UEFI Defaults
2
Save Changes and Exit
3
Discard Changes
4
Change Language
5
Switch to Advanced Mode
6
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4.3 Advanced Mode
e Advanced Mode provides more options to congure the BIOS settings. Refer to
the following sections for the detailed congurations.
To access the EZ Mode, press <F6> or click the "EZ Mode" button at the upper right
corner of the screen.
4.3.1 UEFI Menu Bar
e top of the screen has a menu bar with the following selections:
Main
OC Tweaker
Advanced
Tool
H/W Monitor
Security
Boot
Exit
For setting system time/date information
For overclocking congurations
For advanced system congurations
Useful tools
Displays current hardware status
For security settings
For conguring boot settings and boot priority
Exit the current screen or the UEFI Setup Utility
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4.3.2 Navigation Keys
Use < > key or < > key to choose among the selections on the menu bar, and
use < > key or < > key to move the cursor up or down to select items, then
press <Enter> to get into the sub screen. You can also use the mouse to click your
required item.
Please check the following table for the descriptions of each navigation key.
Navigation Key(s) Description
H470M-HDV/M.2
+ / -
<Tab>
<PGUP>
<PGDN>
<HOME>
<END>
<F1>
<F5>
<F7>
<F9>
<F10>
<F12>
<ESC>
To change option for the selected items
Switch to next function
Go to the previous page
Go to the next page
Go to the top of the screen
Go to the bottom of the screen
To display the General Help Screen
Add / Remove Favorite
Discard changes and exit the SETUP UTILITY
Load optimal default values for all the settings
Save changes and exit the SETUP UTILITY
Print screen
Jump to the Exit Screen or exit the current screen
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4.4 Main Screen
When you enter the UEFI SETUP UTILITY, the Main screen will appear and
display the system overview.
e availability and location of BIOS settings can be dierent for dierent models
and BIOS versions .
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My Favorite
Display your collection of BIOS items. Press F5 to add/remove your favorite items.
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4.5 OC Tweaker Screen
In the OC Tweaker screen, you can set up overclocking features.
H470M-HDV/M.2
Becau se the UEFI soware is constantly being upd ated, the following UEFI setup
screens and de scriptions are for reference purpose only, and they may not exactly
match what you see on your scre en.
CPU Conguration
AVX2 Ratio Oset
AVX2 Ratio Oset species a negative oset from the CPU Ratio for AVX work-
loads. AVX is a more stressful workload that lower the AVX ratio to ensure maxi-
mum possible ratio for SSE work loads.
GT Frequency
Congure the frequency of the integrated GPU.
BCLK Spread Spectrum
Enable BCLK Spread Spectrum to reduce electromagnetic interference for passing
EMI tests. Disable to achieve higher clock speeds when overclocking.
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BCLK Aware Adaptive Voltage
BCLK Aware Adaptive Voltage enable/disable. When enabled, pcode will be aware
of the BCLK frequency when calculating the CPU V/F curves. is is ideal for
BCLK OC to avoid high voltage overrides.
Boot Performance Mode
Select the performance state that the BIOS will set before OS hando.
FCLK Frequency
Congure the FCLK Frequency.
Ring to Core Ratio Oset
Disable Ring to Core Ratio Oset so the ring and core can run at the same fre-
quency.
Intel SpeedStep Technology
Intel SpeedStep technology allows processors to switch between multiple frequen-
cies and voltage points for better power saving and heat dissipation.
Intel Turbo Boost Technology
Intel Turbo Boost Technology enables the processor to run above its base operating
frequency when the operating system requests the highest performance state.
Intel Speed Shift Technology
Enable/Disable Intel Speed Shi Technology support. Enabling will expose the
CPPC v2 interface to allow for hardware controlled P-states.
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Intel Thermal Velocity Boost Voltage Optimizations
is service controls thermal based voltage optimizations for processors that
implment the Intel ermal Velocity Boost (TVB) feature.
DRAM Conguration
Memory Information
Allows users to browse the serial presence detect (SPD) and Intel extreme memory prole
(XMP) for DDR4 modules.
DRAM Timing Conguration
Load XMP Setting
Load XMP settings to overclock the memory and perform beyond standard specications.
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H470M-HDV/M.2
DRAM Reference Clock
Select Auto for optimized settings.
DRAM Frequency
If [Auto] is selected, the motherboard will detect the memory module(s) inserted
and assign the appropriate frequency automatically.
Primary Timing
CAS# Latency (tCL)
e time between sending a column address to the memory and the beginning of the data
in response.
RAS# to CAS# Delay and Row Precharge (tRCDtRP)
RAS# to CAS# Delay : e number of clock cycles required between the opening of a row
of memory and accessing columns within it.
Row Precharge: e number of clock cycles required between the issuing of the precharge
command and opening the next row.
RAS# Active Time (tRAS)
e number of clock cycles required between a bank active command and issuing the
precharge command.
Command Rate (CR)
e delay between when a memor y chip is selected and when the rst active command can
be issued.
Secondary Timing
Write Recovery Time (tWR)
e amount of delay that must elapse aer the completion of a valid write operation,
before an active bank can be precharged.
Refresh Cycle Time (tRFC)
e number of clocks from a Refresh command until the rst Activate command to
the same rank.
RAS to RAS Delay (tRRD_L)
e number of clocks between two rows activated in dierent banks of the same
rank.
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RAS to RAS Delay (tRRD_S)
e number of clocks between two rows activated in dierent banks of the same
rank.
Write to Read Delay (tWTR_L)
e number of clocks between the last valid write operation and the next read command to
the same interna l bank.
Write to Read Delay (tWTR_S)
e number of clocks between the last valid write operation and the next read command to
the same interna l bank.
Read to Precharge (tRTP)
e number of clocks that are inserted between a read command to a row pre-
charge command to the same rank.
Four Activate Window (tFAW)
e time window in which four activates are allowed the same rank.
CAS Write Latency (tCWL)
Congure CAS Write Latency.
Third Timing
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tREFI
Congure refresh cycles at an average periodic interval.
tCKE
Congure the period of time the DDR4 initiates a minimum of one refresh
command internally once it enters Self-Refresh mode.
Turn Around Timing
tRDRD_sg
Congure between module read to read delay.
tRDRD_dg
Congure between module read to read delay.
tRDRD_dr
Congure between module read to read delay.
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tRDRD_dd
Congure between module read to read delay.
tRDWR_sg
Congure between module read to write delay.
tRDWR_dg
Congure between module read to write delay.
tRDWR_dr
Congure between module read to write delay.
tRDWR_dd
Congure between module read to write delay.
tWRRD_sg
Congure between module write to read delay.
tWRRD_dg
Congure between module write to read delay.
H470M-HDV/M.2
tWRRD_dr
Congure between module write to read delay.
tWRRD_dd
Congure between module write to read delay.
tWRWR_sg
Congure between module write to write delay.
tWRWR_dg
Congure between module write to write delay.
tWRWR_dr
Congure between module write to write delay.
tWRWR_dd
Congure between module write to write delay.
Round Trip Timing
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RTL Init Value
Congure round trip latency init value for round trip latency training.
IO-L Init Value
Congure IO latency init value for IO latency training.
RTL (CH A)
Congure round trip latency for channel A.
RTL (CH B)
Congure round trip latency for channel B.
IO-L (CH A)
Congure IO latency for channel A.
IO-L (CH B)
Congure IO latency for channel B.
IO-L Oset (CH A)
Congure IO latency oset for channel A.
IO-L Oset (CH B)
Congure IO latency oset for channel B.
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RFR Delay (CH A)
Congure RFR Delay for Channel A.
RFR Delay (CH B)
Congure RFR Delay for Channel B.
ODT Setting
ODT WR (A1)
Congure the memory on die termination resistors' WR for channel A1.
ODT WR (B1)
Congure the memory on die termination resistors' WR for channel B1.
ODT NOM (A1)
Use this to change ODT (CH A1) Auto/Manual settings. e default is [Auto].
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H470M-HDV/M.2
ODT NOM (B1)
Use this to change ODT (CH B1) Auto/Manual settings. e default is [Auto].
ODT PARK (A1)
Congure the memory on die termination resistors' PARK for channel A1.
ODT PARK (B1)
Congure the memory on die termination resistors' PARK for channel B1.
Advanced Setting
ASRock Timing Optimization
Congure the fast path through the MRC.
Realtime Memory Timing
Congure the realtime memory timings.
[Enabled] e system will allow performing realtime memory timing changes aer
MRC_DONE.
Command Tristate
Congure the Command Tristate Support.
Exit On Failure
Congure the Exit On Failure for MRC training steps.
Reset On Training Fail
Reset system if the MRC training fails.
MRC Fast Boot
Enable Memory Fast Boot to skip DRAM memory training for booting faster.
Voltage Conguration
CPU Core/Cache Voltage
Input voltage for the processor by the external voltage refulator.
CPU GT Voltage
Congure the voltage for the integrated GPU.
DRAM Voltage
Use this to congure DRAM Voltage. e default value is [Auto].
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VCCSA Voltage
Congure the voltage for the VCCSA.
PCH Voltage
Congure the chipset voltage.
VCCST Voltage
Congure the voltage for the VCCST.
Save User Default
Type a prole name and press enter to save your settings as user default.
Load User Default
Load previously saved user defaults.
Save User UEFI Setup Prole to Disk
It helps you to save current UEFI settings as an user prole to disk.
Load User UEFI Setup Prole from Disk
You can load previous saved prole from the disk.
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H470M-HDV/M.2
4.6 Advanced Screen
In this section, you may set the congurations for the following items: CPU
Conguration, Chipset Conguration, Storage Conguration, Super IO Congura-
tion, ACPI Conguration, USB Conguration and Trusted Computing.
Setting wrong values in this sec tion may cause the system to malfunction.
UEFI Conguration
UEFI Setup Style
Select the default mode when entering the UEFI setup utility.
Active Page on Entry
Select the default page when entering the UEFI setup utility.
Full HD UEFI
When [Auto] is selected, the resolution will be set to 1920 x 1080 if the monitor
supports Full HD resolution. If the monitor does not support Full HD resolution,
then the resolution will be set to 1024 x 768. When [Disable] is selected, the
resolution will be set to 1024 x 768 directly.
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4.6.1 CPU Conguration
Intel Hyper Threading Technology
Intel Hyper reading Technology allows multiple threads to run on each core, so
that the overall performance on threaded soware is improved.
Active Processor Cores
Select the number of cores to enable in each processor package.
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CPU C States Support
Enable CPU C States Support for power saving. It is recommended to keep C3, C6
and C7 all enabled for better power saving.
Enhanced Halt State (C1E)
Enable Enhanced Halt State (C1E) for lower power consumption.
CPU C3 State Support
Enable C3 deep sleep state for lower power consumption.
CPU C6 State Support
Enable C6 deep sleep state for lower power consumption.
CPU C7 State Support
Enable C7 deep sleep state for lower power consumption.
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H470M-HDV/M.2
Package C State Support
Enable CPU, PCIe, Memory, Graphics C State Support for power saving.
CFG Lock
is item allows you to disable or enable the CFG Lock.
C6DRAM
Enable/Disable moving of DRAM contents to PRM memory when CPU is in C6
state.
CPU Thermal Throttling
Enable CPU internal thermal control mechanisms to keep the CPU from overheat-
ing.
Intel Virtualization Technology
Intel Virtualization Technology allows a platform to run multiple operating systems
and applications in independent partitions, so that one computer system can
function as multiple virtual systems.
Hardware Prefetcher
Automatically prefetch data and code for the processor. Enable for better
performance.
Adjacent Cache Line Prefetch
Automatically prefetch the subsequent cache line while retrieving the currently
requested cache line. Enable for better performance.
Software Guard Extensions (SGX)
Intel SGX is a set of new CPU instructions that can be used by applications to set
aside private regions of code and data.
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4.6.2 Chipset Conguration
Primary Graphics Adapter
Select a primary VGA.
Above 4G Decoding
Enable or disable 64bit capable Devices to be decoded in Above 4G Address Space
(only if the system supports 64 bit PCI decoding).
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VT-d
Intel® Virtualization Technology for Directed I/O helps your virtual machine
monitor better utilize hardware by improving application compatibility and
reliability, and providing additional levels of manageability, security, isolation, and
I/O performance.
SR-IOV Support
If system has SR-IOV capable PCIe Devices, this option Enables or Disables Single
Root IO Virtualization Support.
DMI Link Speed
Congure DMI Slot Link Speed. Auto mode is optimizing for overclocking.
PCIE1 Link Speed
Select the link speed for PCIE1.
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PCIE2 Link Speed
Select the link speed for PCIE2.
PCIE3 Link Speed
Select the link speed for PCIE3.
PCI Express Native Control
Select Enable for enhanced PCI Express power saving in OS.
PCIE ASPM Support
is option enables/disables the ASPM support for all CPU downstream devices.
PCH PCIE ASPM Support
is option enables/disables the ASPM support for all PCH PCIE devices.
DMI ASPM Support
is option enables/disables the control of ASPM on CPU side of the DMI Link.
PCH DMI ASPM Support
is option enables/disables the ASPM support for all PCH DMI devices.
H470M-HDV/M.2
Share Memory
Congure the size of memory that is allocated to the integrated graphics processor when
the system boots up.
IGPU Multi-Monitor
Select disable to disable the integrated graphics when an external graphics card is installed.
Select enable to keep the integrated graphics enabled at all times.
Inte(R) Ethernet Connection I219-V
Enable or disable the onboard network interface controller (Intel® I219V).
Onboard HD Audio
Enable/disable onboard HD audio. Set to Auto to enable onboard HD audio and
automatically disable it when a sound card is installed.
Front Panel
Enable/disable front panel HD audio.
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Onboard HDMI HD Audio
Enable audio for the onboard digital outputs.
Onboard WAN Device
Enable/disable the onboard WAN device.
WAN Radio
Enable/disable the WiFi module's connectivity.
Bluetooth
Enable/disable the Bluetooth's connectivity.
Deep Sleep
Congure deep sleep mode for power saving when the computer is shut down.
Restore on AC/Power Loss
Select the power state aer a power failure. If [Power O] is selected, the power will
remain o when the power recovers. If [Power On] is selected, the system will start
to boot up when the power recovers.
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4.6.3 Storage Conguration
SATA Controller(s)
Enable/disable the SATA controllers.
H470M-HDV/M.2
SATA Mode Selection
AHCI: Supports new features that improve performance.
RAID: Combine multiple disk drives into a logical unit.
SATA Aggressive Link Power Management
SATA Aggressive Link Power Management allows SATA devices to enter a low
power state during periods of inactivity to save power. It is only supported by AHCI
mode.
Hard Disk S.M.A.R.T.
S.M.A.R.T stands for Self-Monitoring, Analysis, and Reporting Technolog y. It is a
monitoring system for computer hard disk drives to detect and report on various
indicators of reliability.
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4.6.4 Super IO Conguration
Serial Port
Enable or disable the Serial port.
Serial Port Address
Select the address of the Serial port.
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Parallel Port
Enable or disable the Parallel port.
Change Settings
Select the address of the Parallel port.
Device Mode
Select the device mode according to your connected device.
PS2 Y-Cable
Enable the PS2 Y-Cable or set this option to Auto.
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4.6.5 ACPI Conguration
Suspend to RAM
Select disable for ACPI suspend type S1. It is recommended to select auto for ACPI
S3 power saving.
H470M-HDV/M.2
PS/2 Keyboard S4/S5 Wakeup Support
Allow the system to be waked up by a PS/2 Keyboard in S4/S5.
PCIE Devices Power On
Allow the system to be waked up by a PCIE device and enable wake on LAN.
I219 LAN Power On
Allow the system to be waked up by the Onboard Intel LAN.
Ring-In Power On
Allow the system to be waked up by onboard COM port modem Ring-In signals.
RTC Alarm Power On
Allow the system to be waked up by the rea l time clock alarm. Set it to By OS to let
it be handled by your operating system.
USB Keyboard/Remote Power On
Allow the system to be waked up by an USB keyboard or remote controller.
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USB Mouse Power On
Allow the system to be waked up by an USB mouse.
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4.6.6 USB Conguration
Legacy USB Support
Enable or disable Legacy OS Support for USB 2.0 devices. If you encounter USB
compatibility issues it is recommended to disable legacy USB support. Select UEFI
Setup Only to support USB devices under the UEFI setup and Windows/Linux
operating systems only.
H470M-HDV/M.2
XHCI Hand-o
is is a workaround for OSes without XHCI hand-o support. e XHCI
ownership change should be claimed by XHCI driver.
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4.6.7 Trusted Computing
Security Device Support
Enable or disable BIOS support for security device.
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4.7 Tools
UEFI Tech Service
Contact ASRock Tech Service if you are having trouble with your PC. Please setup
network conguration before using UEFI Tech Service.
H470M-HDV/M.2
Easy RAID Installer
Easy R AID Installer helps you to copy the R AID driver from the support CD to
your USB storage device. Aer copying the drivers please change the SATA mode to
RAID, then you can start installing the operating system in RAID mode.
SSD Secure Erase Tool
All the SSD's listed that supports Secure Erase function.
NVME Sanitization Tool
Aer you Sanitize SSD, all user data will be permanently destroyed on the SSD and
cannot be recovered.
Instant Flash
Save UEFI les in your USB storage device and run Instant Flash to update your
UEFI.
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Internet Flash - DHCP (Auto IP), Auto
ASRock Internet Flash downloads and updates the latest UEFI rmware version
from our servers for you. Please setup network conguration before using Internet
Flash.
*For BIOS backup and recovery purpose, it is recommended to plug in your USB
pen drive before using this function.
Network Conguration
Use this to congure internet connection settings for Internet Flash.
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Internet Setting
Enable or disable sound eects in the setup utility.
UEFI Download Server
Select a server to download the UEFI rmware.
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4.8 Hardware Health Event Monitoring Screen
is section allows you to monitor the status of the hardware on your system,
including the parameters of the CPU temperature, motherboard temperature, fan
speed and voltage.
H470M-HDV/M.2
Fan Tuning
Measure Fan Min Duty Cycle.
Fan-Tastic Tuning
Select a fan mode for CPU Fan, or choose Customize to set 5 CPU temperatures and
assign a respective fan speed for each temperature.
CPU Fan 1 Setting
Select a fan mode for CPU Fan 1, or choose Customize to set 5 CPU temperatures and
assign a respective fan speed for each temperature.
CPU Fan 1 Step Up
Set the value of CPU Fan Step Up.
CPU Fan 1 Step Down
Set the value of CPU Fan Step Down.
CPU_FAN2 / W_Pump Switch
Select CPU or Water Pump mode.
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CPU Fan 2 Control Mode
Select PWM mode or DC mode for CPU_FAN2.
CPU Fan 2 Setting
Select a fan mode for CPU_FAN2, or choose Customize to set 5 CPU temperatures
and assign a respective fan speed for each temperature.
CPU Fan 2 Temp Source
Select a fan temperature source for CPU_FAN2.
CPU Fan 2 Step Up
Set the value of CPU_FAN2 Step Up.
CPU Fan 2 Step Down
Set the value of CPU_FAN2 Step Down.
CHA_FAN1 / W_Pump Switch
Select CHA_FAN1 / W_Pump mode.
Chassis Fan 1 Control Mode
Select PWM mode or DC mode for CHA_FAN1.
Chassis Fan 1 Setting
Select a fan mode for CHA_FAN1, or choose Customize to set 5 CPU temperatures
and assign a respective fan speed for each temperature.
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Chassis Fan 1 Temp Source
Select a fan temperature source for Chassis Fan 1.
Chassis Fan 1 Step Up
Set the value of Chassis Fan 1 Step Up.
Chassis Fan 1 Step Down
Set the value of Chassis Fan 1 Step Down.
CHA_FAN2 / W_Pump Switch
Select CHA_FAN2 / W_Pump mode.
Chassis Fan 2 Control Mode
Select PWM mode or DC mode for CHA_FAN2.
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H470M-HDV/M.2
Chassis Fan 2 Setting
Select a fan mode for CHA_FAN2, or choose Customize to set 5 CPU temperatures
and assign a respective fan speed for each temperature.
Chassis Fan 2 Temp Source
Select a fan temperature source for Chassis Fan 2.
Chassis Fan 2 Step Up
Set the value of Chassis Fan 2 Step Up.
Chassis Fan 2 Step Down
Set the value of Chassis Fan 2 Step Down.
Case Open Feature
Enable or disable Case Open Feature to detect whether the chassis cover has been
removed.
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4.9 Security Screen
In this section you may set or change the supervisor/user password for the system.
You may also clear the user password.
Supervisor Password
Set or change the password for the administrator account. Only the administrator
has authority to change the settings in the UEFI Setup Utility. Leave it blank and
press enter to remove the password.
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User Password
Set or change the password for the user account. Users are unable to change the
settings in the UEFI Setup Utility. Leave it blank and press enter to remove the
password.
Secure Boot
Use this item to enable or disable support for Secure Boot.
Intel(R) Platform Trust Technology
Enable/disable Intel PTT in ME. Disable this option to use discrete TPM Module.
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H470M-HDV/M.2
4.10 Boot Screen
is section displays the available devices on your system for you to congure the
boot settings and the boot priority.
Fast Boot
Fast Boot minimizes your computer's boot time. In fast mode you may not boot
from an USB storage device. e VBIOS must support UEFI GOP if you are using
an external graphics card. Please notice that Ultra Fast mode will boot so fast that
the only way to enter this UEFI Setup Utility is to Clear CMOS or run the Restart to
UEFI utility in Windows.
Boot From Onboard LAN
Allow the system to be waked up by the onboard LAN.
Setup Prompt Timeout
Congure the number of seconds to wait for the setup hot key.
Bootup Num-Lock
Select whether Num Lock should be turned on or o when the system boots up.
Boot Beep
Select whether the Boot Beep should be turned on or o when the system boots up. Please
note that a buzzer is needed.
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Full Screen Logo
Enable to display the boot logo or disable to show normal POST messages.
AddOn ROM Display
Enable AddOn ROM Display to see the AddOn ROM messages or congure the
AddOn ROM if you've enabled Full Screen Logo. Disable for faster boot speed.
Boot Failure Guard Message
If the computer fails to boot for a number of times the system automatically restores
the default settings.
CSM (Compatibility Support Module)
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CSM
Enable to launch the Compatibility Support Module. Please do not disable unless
you’re running a WHCK test.
Launch PXE OpROM Policy
Select UEFI only to run those that support UEFI option ROM only. Select Legacy
only to run those that support legacy option ROM only. Select Do not launch to not
execute both legacy and UEFI option ROM.
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H470M-HDV/M.2
Launch Storage OpROM Policy
Select UEFI only to run those that support UEFI option ROM only. Select Legacy
only to run those that support legacy option ROM only. Select Do not launch to not
execute both legacy and UEFI option ROM.
Other PCI Device ROM Priority
For PCI devices other than Network. Mass storage or Video denes which OpROM
to launch.
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4.11 Exit Screen
Save Changes and Exit
When you select this option the following message, “Save conguration changes
and exit setup?” will pop out. Select [OK] to save changes and exit the UEFI SETUP
UTILITY.
Discard Changes and Exit
When you select this option the following message, “Discard changes and exit
setup?” will pop out. Select [OK] to exit the UEFI SETUP UTILITY without saving
any changes.
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Discard Changes
When you select this option the following message, “Discard changes?” will pop
out. Select [OK] to discard all changes.
Load UEFI Defaults
Load UEFI default values for a ll options. e F9 key can be used for this operation.
Launch EFI Shell from lesystem device
Copy shellx64.e to the root directory to launch EFI Shell.
Page 80
Contact Information
If you need to contact ASRock or want to know more about ASRock, you’re welcome
to visit ASRock’s website at http://ww w.asrock.com; or you may contact your dealer
for further information. For technical questions, please submit a support request
form at http://www.asrock.com/support/tsd.asp
ASRock Incorporation
2F., No.37, Sec. 2, Jhongyang S. Rd., Beitou District,
Taipei City 112, Taiwan (R.O.C.)
ASRock EUROPE B.V.
Bijsterhuizen 11-11
6546 AR Nijmegen
e Netherlands
Phone: +31-24-345-44-33
Fax: +31-24-345-44-38
ASRock America, Inc.
13848 Magnolia Ave, Chino, CA91710
U.S.A.
Phone: +1-909-590-8308
Fax: +1-909-590-1026
Page 81
DECLARATION OF CONFORMITY
Per FCC Part 2 Section 2.1077(a)
Responsible Party Name: ASRock Incorporation
Address:
Phone/Fax No:
hereby declares that the product
Product Name : Motherboard
13848 Magnolia Ave, Chino, CA91710
+1-909-590-8308/+1-909-590-1026
Model Number :
Conforms to the following specications:
FCC Part 15, Subpart B, Unintentional Radiators
Supplementary Information:
H470M-HDV/M.2
is device complies with part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) is device may not cause harmful interference,
and (2) this device must accept any interference received, including interference
that may cause undesired operation.
James
Representative Person’s Name:
Signature :
Date :
May 12, 2017
Page 82
EU Declaration of Conformity
EMC —Directive 2014/30/EU (from April 20th, 2016)
☐
For the following equipment:
Motherboard
(Product Name)
H470M-HDV/M.2 / ASRock
(Model Designation / Trade Name)
ASRock Incorporation
(Manufacturer Name)
2F., No.37, Sec. 2, Jhongyang S. Rd., Beitou District, Taipei City 112, Taiwan (R.O.C.)
(Manufacturer Address)
ڛ
☐ EN 55022:2010/AC:2011 Class B EN 55024:2010/A1:2015
ڛ EN 55032:2012+AC:2013 Class B ڛڛ EN 61000-3-3:2013
ڛ EN 61000-3-2:2014
☐
LVD —Directive 2014/35/EU (from April 20th, 2016)
EN 60950-1 : 2011+ A2: 2013 ☐
ڛ RoHS — Directive 2011/65/EU
ڛ CE marking
EN 60950-1 : 2006/A12: 2011
(EU conformity marking)
ASRock EUROPE B.V.
(Company Name)
Bijsterhuizen 1111 6546 AR Nijmegen e Netherlands
(Company Address)
Person responsible for making this declaration:
(Name, Surname)
A.V.P
(Position / Title)
January 29, 2021
(Date)
P/N: 15G062284000AK V1.0
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