No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.
Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see ww w.dtsc.ca.gov/hazardouswaste/
perchlorate”
ASRock Website: http://www.asrock.com
AUSTRALIA ONLY
Our goods come with guarantees that cannot be excluded under the Australian
Consumer Law. You are entitled to a replacement or refund for a major failure and
compensation for any other reasonably foreseeable loss or damage caused by our
goods. You are also entitled to have the goods repaired or replaced if the goods fail
to be of acceptable quality and the failure does not amount to a major failure. If
you require assistance please call ASRock Tel : +886-2-28965588 ext.123 (Standard
International call charges apply)
e terms HDMI™ and HDMI High-Denition Multimedia Interface, and the HDMI
logo are trademarks or registered trademarks of HDMI Licensing LLC in the United
States and other countries.
Contents
Chapter 1 Introduction 1
1.1 Package Contents 1
1.2 Specications 2
1.3 Motherboard Layout 6
1.4 I/O Panel 8
Chapter 2 Installation 10
2.1 Installing the CPU 11
2.2 Installing the CPU Fan and Heatsink 14
2.3 Installing Memory Modules (DIMM) 15
2.4 Expansion Slots (PCI Express Slots) 17
2.5 Jumpers Setup 18
2.6 Onboard Headers and Connectors 19
Chapter 3 Software and Utilities Operation 26
3.1 Installing Drivers 26
3.2 A-Tuning 27
3.3 ASRock Live Update & APP Shop 30
3.3.1 UI Overview 30
3.3.2 Apps 31
3.3.3 BIOS & Drivers 34
3.3.4 Setting 35
Chapter 4 UEFI SETUP UTILITY 36
4.1 Introduction 36
4.2 EZ Mode 37
4.3 Advanced Mode 38
4.3.1 UEFI Menu Bar 38
4.3.2 Navigation Keys 39
4.4 Main Screen 40
4.5 OC Tweaker Screen 41
4.6 Advanced Screen 49
4.6.1 CPU Conguration 50
4.6.2 Chipset Conguration 52
4.6.3 Storage Conguration 54
4.6.4 Super IO Conguration 55
4.6.5 ACPI Conguration 56
4.6.6 USB Conguration 58
4.6.7 Trusted Computing 59
4.7 Tools 60
4.8 Hardware Health Event Monitoring Screen 62
4.9 Security Screen 64
4.10 Boot Screen 65
4.11 Exit Screen 68
H310CM-HDV/M.2
Chapter 1 Introduction
ank you for purchasing ASRock H310CM-HDV/M.2 motherboard, a reliable
motherboard produced under ASRock’s consistently stringent quality control.
It delivers excellent performance with robust design conforming to ASRock’s
commitment to quality and endurance.
In this documentation, Chapter 1 and 2 contains the introduction of the
motherboard and step-by-step installation guides. Chapter 3 contains the operation
guide of the soware and utilities. Chapter 4 contains the conguration guide of
the BIOS setup.
Becau se the motherboard specications and the BIOS soware might be updated, the
content of this documentation will be subject to change without notice. In case any modications of this documentation occur, the updated version will be available on ASRock’s
website w ithout further notice. If you require technical support related to this motherboard, please visit our website for specic information about the model you are using. You
may nd the l atest VGA cards and CPU suppor t list on ASRock’s website a s well. ASRock
website http://www.asrock.com.
1.1 Package Contents
• ASRock H310CM-HDV/M.2 Motherboard (Micro ATX Form Factor)
Please realiz e that the re is a certain r isk involved with o verclocking, including adjusting
the setting in the BIOS, applying Untied Overclocking Technolog y, or using third-party
overclocking to ols. O verclocking may aect your system’s stability, or even c ause damage to
the components and devices of your system. It should be don e at your ow n risk and expense.
We are not responsibl e for possible damage caused by overclo cking.
• Microso® Windows® 10 64-bit
• FCC, CE
• ErP/EuP ready (ErP/EuP ready power supply is required)
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5
Intel
H310
DDR 4_B1 (6 4 bit, 28 8-pin m odule )
DDR 4_A1 (6 4 bit, 28 8-pin m odule )
ATXPWR1
PCIE2
Top:
RJ-45
HDLED RESET
PLED PWRBTN
PANEL1
1
1
SPK_CI1
COM1
1
H310CM-HDV/M.2
11
8
9
14
15
18
USB 2.0
T: USB5
B: USB6
1
3
2
CMOS
Battery
5
CPU_FAN1
12
1
TPMS1
Top:
LINE I N
Cent er:
FRON T
Bott om:
MIC IN
PCIE3
DVI1
VGA1
HDMI1
1
LPT1
BIOS
ROM
19
17
RoHS
ATX12V1
6
PCIE1
4
13
1
HD_AUDIO1
20
USB 3.1 Gen1
T: USB3
B: USB4
LAN
AUDIO
CODEC
USB 2. 0
T: USB1
B: USB 2
PS2
Keyb oard
/Mou se
M2_ 1
CT2CT3CT4CT1
10
16
USB_7_8
1
7
CLRMOS1
1
CHA_FAN2/WP
CHA_FAN1/WP
SATA3_0
SATA3_1
SATA3_2
SATA3_3
USB_9 _10
1
1
USB_11_ 12
1.3 Motherboard Layout
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6
No. Description
1ATX 12V Power Connector (ATX12V1)
2CPU Fan Connector (CPU_FAN1)
32 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)
4Chassis/Water Pump Fan Connector (CHA_FAN1/WP)
5ATX Power Connector (ATXPWR1)
6USB 2.0 Header (USB_9_10)
7USB 3.1 Gen1 Header (USB_11_12)
8SATA3 Connector (SATA3_2)
9SATA3 Connector (SATA3_3)
10 Clear CMOS Jumper (CLR MOS1)
11 SATA3 Connector (SATA3_0)
12 SATA3 Connector (SATA3_1)
13 Chassis/Water Pump Fan Connector (CHA_FAN2/WP)
14 System Panel Header (PANEL1)
15 Chassis Intrusion and Speaker Header (SPK_CI1)
16 USB 2.0 Header (USB_7_8)
17 COM Port Header (COM1)
18 Print Port Header (LPT1)
19 TPM Header (TPMS1)
20 Front Panel Audio Header (HD_AUDIO1)
H310CM-HDV/M.2
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7
1.4 I/O Panel
1235
4
11
10
8
769
No. DescriptionNo. Description
1USB 2.0 Ports (USB12)7USB 2.0 Ports (USB5_6)
2D-Sub Port8USB 3.1 Gen1 Ports (USB_3_4)
3LAN RJ-45 Port* 9HDMI Port
4Line In (Light Blue)**10DVI-D Port
5Front Speaker (Lime)**11PS/2 Keyboard/Mouse Port
6Microphone (Pink)**
* ere are two LEDs on each LAN port. Please refer to the table below for the LAN port LED indications.
** To congure 7.1 CH HD Audio, it i s required to use an HD front panel audio module and enable the multichannel audio feature through the audio driver.
Please set Speaker Conguration to “7.1 Speaker”in the Realtek HD Audio Manager.
Function of the Audio Ports in 7.1-channel Conguration:
PortFunction
Light Blue (Rear panel)Rear Speaker Out
Lime (Rear panel)Front Speaker Out
Pink (Rear panel)Central /Subwoofer Speaker Out
Lime (Front panel)Side Speaker Out
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Chapter 2 Installation
is is a Micro ATX form factor motherboard. Before you install the motherboard,
study the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components
or change any motherboard settings.
• Make sure to unplug the power cord before installing or removing the motherboard
components. Failure to do so may cause physical injuries and damages to motherboard
components.
• In order to avoid damage from static electricity to the motherboard’s components,
NEVER place your motherboard directly on a carpet. Also remember to use a grounded
wrist strap or touch a safety grounded object before you handle the components.
• Hold components by the edges and do not touch the ICs.
• Whenever you uninstall any components, place them on a grounded anti-static pad or
in the bag that comes with the components.
• When placing screws to secure the motherboard to the chassis, please do not over-
tighten the screws! Doing so may damage the motherboard.
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10
2.1 Installing the CPU
1. Before you insert the 1151-Pin CPU into the socket, please check if the P nP cap is on the
socket, if the CPU surface is unclean, or if there are any bent pins in the sock et. Do not
force to in sert the CPU into the socket if above situation is found . Otherwise, the CPU
will be seriously damaged.
2. Unplug all power c ables before in stalling the CPU.
1
H310CM-HDV/M.2
A
B
2
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11
3
4
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12
5
H310CM-HDV/M.2
Please save and replace the cover if the processor i s removed. e cover must be placed if
you wish to return the motherboard for aer service.
13
English
2.2 Installing the CPU Fan and Heatsink
12
English
14
FAN
CPU_
H310CM-HDV/M.2
2.3 Installing Memory Modules (DIMM)
is motherboard provides two 288-pin DDR4 (Double Data Rate 4) DIMM slots,
and supports Dual Channel Memory Technology.
1. For dual channel cong uration , you always need to in stall identical (the same
brand, speed , size and chip-type) DDR4 DIMM pairs.
2. It is unable to activate Du al Channel Memory Technology with only one memory
module installed.
3. It is not allowed to install a DDR, DDR2 or DDR3 memory module into a DDR4
slot; otherwise, this motherboard and DIMM may be damaged.
e DIMM only ts in one correct orie ntation. It will cause permanent dam age to
the motherboard and the DIMM if you force the DIMM into the slot at incor rect
orientation.
15
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1
2
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16
3
H310CM-HDV/M.2
2.4 Expansion Slots (PCI Express Slots)
ere are 3 PCI Express slots on the motherboard.
Before installing an ex pansion card, please make sure that the power supply is
switched o or the power cord is unplugged. Plea se read the documentation of the
expan sion card and mak e necessary h ardware settings for the card before you start
the installation.
PCIe slots:
PCIE1 (PCIe 2.0 x1 slot) is used for PCI Express x1 lane width cards.
PCIE2 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
PCIE3 (PCIe 2.0 x1 slot) is used for PCI Express x1 lane width cards.
17
English
2.5 Jumpers Setup
e illustration shows how jumpers are setup. When the jumper cap is placed on
the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper is
“O pen”.
English
Clear CMOS Jumper
(CLRCMO S1)
(see p.6, No. 10)
CLRCMOS1 allows you to clear the data in CMOS. e data in CMOS includes
system setup information such as system password, date, time, and system setup
parameters. To clear and reset the system parameters to default setup, please
turn o the computer and unplug the power cord, then use a jumper cap to short
the pins on CLRCMOS1 for 3 seconds. Please remember to remove the jumper
cap aer clearing the CMOS. If you need to clear the CMOS when you just nish
updating the BIOS, you must boot up the system rst, and then shut it down
before you do the clear-CMOS action.
If you clear the CMOS, the case open may be detec ted. Please a djust the BIOS option
“Clear Status” to clear the record of previou s chassis int rusion status.
2-pin Jumper
Short: Clear CMOS
Open: Default
18
2.6 Onboard Headers and Connectors
1
Onboard headers and connectors are NOT jump ers. Do NOT place jumper caps over
these headers and connectors. Placing jumper caps over the headers and connectors
will cause permanent damage to the motherboard.
H310CM-HDV/M.2
System Panel Header
(9-pi n PANEL1)
(see p.6, No. 14)
PWRBTN (Power Button):
Connec t to the power button on the ch assi s front panel. You may congure the way to tur n
o your system using the power button.
RESET (Reset B utton):
Connec t to the reset button on the ch assi s front panel. P ress the reset button to re start the
computer if the computer f reezes and fails to per form a normal restar t.
PLED (Syste m Power LED):
Connec t to the power status indicator on the chas sis front panel. e LED i s on when the
system is operating. e LED keeps blinking when the system is in S1/S3 sleep state. e
LED is o when the system is in S4 slee p state or powered o (S5).
HDLED (Ha rd Drive Activity LED):
Connec t to the hard drive ac tivity LED on the chassis front panel. e LED is on when the
hard drive is reading or wr iting data.
e front panel de sign may dier by chassis. A front panel module mainly consists of powe r
button, reset button , power LED, hard dr ive activity LED, speaker and etc. When connecting your ch assi s front panel module to thi s header, make sure the wire a ssignments and the
pin assignments are matched correctly.
PLED+
PLED-
HDLED-
HDLED+
PWRBTN#
GND
RESET#
GND
GND
Connect the power
button, reset button and
system status indicator on
the chassis to this header
according to the pin
assignments below. Note
the positive and negative
pins before connecting
the cables.
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19
Chassis Intrusion and
1
IntA_PB_SSRX+
A_SSRX+
DUMMY
GND
GND
P+
P-
USB_PWR
P+
P-
USB_PWR
1
DUMMY
GNDGND
P+
P-
P+
P-
USB_PWR
USB_PWR
1
1
+5V
DUMMY
SIGNAL
GND
DUMMY
SPEAKER
DUMMY
Speaker Header
(7-pi n SPK _CI1)
(see p.6, No. 15)
Please connect the
chassis intrusion and the
chassis speaker to this
header.
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20
Serial ATA3 Connectors
(SATA3_0:
see p.6, No. 11)
(SATA3_1:
see p.6, No. 12)
(SATA3_ 2:
see p.6, No. 8)
(SATA3_ 3:
see p.6, No. 9)
USB 2.0 Headers
(9-pin USB_7_8)
(see p.6, No. 16)
(9-pin USB_9_10)
(see p.6, No. 6)
USB 3.1 Gen1 Header
(19-pin USB_11_12)
(see p.6, No. 7)
Dummy
IntA_PB_D+
IntA_PB_D-
GND
IntA_PB_SSTX+
IntA_PB_SSTX-
GND
IntA_PB_SSRX-
VbusV
SATA3_2
SATA3_0
SATA3_3
SATA3_1
IntA_PA_D+
IntA_PA_D-
GND
IntA_PA_SSTX+
IntA_PA_SSTX-
GND
IntA_P
IntA_PA_SSRX-
V
bus
ese four SATA3
connectors support SATA
data cables for internal
storage devices with up to
6.0 Gb/s data transfer rate.
* If M2_1 is occupied by
a SATA-type M.2 device,
SATA3_3 will be disabled.
ere are two USB
2.0 headers on this
motherboard. Each USB
2.0 header can support
two ports.
ere is one header on
this motherboard. is
USB 3.1 Gen1 header can
support two ports.
* USB_11_12 is shared
with USB_9_10.
H310CM-HDV/M.2
J_SENSE
OUT2_L
1
MIC_RET
PRESENCE#
GND
OUT2_R
MIC2_R
MIC2_L
OUT_RET
F
4
FAN_SPEED_CONTROL
1 2 3 4
GND
1 2 3 4
Front Panel Audio Header
(9-pin HD_ AUDIO1)
(see p.6, No. 20)
1. High Denition Audio support s Jack Sensing, but the panel wire on the cha ssis
must support HDA to function cor rectly. Please follow the instr uctions in our
manual and chassis manual to in stall your system.
2. If you use an AC’97 audio panel , please install it to th e front panel audio header by
the steps below:
A. Connect Mic_IN (MIC) to MIC2_ L.
B. Conne ct Audio_R (RIN) to OUT2_R and Audio_ L (LIN) to OUT2_ L.
C. Connect Ground (GND) to Ground (GND).
D. MIC_ RET and OUT_RET are for the HD audio panel only. You don’t ne ed to
connec t them for the AC’97 audio panel.
E. To activate the front mic, go to the “FrontMic” Tab in the Realtek Control panel
and adjust “Recording Volume”.
Chassis/Water Pump Fan
Connectors
(4-pin CHA_FAN1/WP)
(see p.6, No. 4)
(4-pin CHA_FAN2/WP)
(see p.6, No. 13)
FAN_VOLTAGE
FAN_SPEED
FAN_SPEED_CONTROL
AN_SPEED_CONTROL
CHA_FAN_SPEED
FAN_VOLTAGE
GND
is header is for
connecting audio devices
to the front audio panel.
is motherboard
provides two 4-Pin water
cooling
connectors. If you plan to
connect a 3-Pin
water cooler fan, please
3
2
connect it to Pin 1-3.
1
chassis
fan
chassis
CPU Fan Connector
(4-pin CPU_FAN1)
(see p.6, No. 2)
CPU_FAN_SPEED
FAN_VOLTAGE
GND
is motherboard
provides a 4-Pin CPU fan
(Quiet Fan) connector.
If you plan to connect a
3-Pin CPU fan, please
connect it to Pin 1-3.
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21
ATX Power Connector
1
#
5
1
8
1
1
AFD#
SLCT
(24-p i n ATX PWR1)
(see p.6, No. 5)
12
24
is motherboard
provides a 24-pin ATX
power connector. To use a
20-pin ATX power supply,
please plug it along Pin 1
1
13
and Pin 13.
English
ATX 12V Power
Connector
(8-pin ATX12V1)
(see p.6, No. 1)
Serial Port Header
(9-p in CO M1)
(see p.6, No. 17)
TPM Header
(17-pi n TP MS1)
(see p.6, No. 19)
Print Port Header
(25-pin LPT1)
(see p.6, No. 18)
STB#
ERROR#
PINIT#
SPD1
SPD0
GN D
D
GN
SLIN#
SPD2
+3V S B
SER IRQ #
SPD3
RRXD1
DDTR#1
TTXD1
DDCD#1
S_P WRDW N #
SPD5
SPD4
DDSR#1
GND
LAD 0
GN D
SPD6
CCTS#1
RRTS#1
+3 V
LAD 1
GND
SPD7
LAD 3
LAD 2
RRI#1
ACK#
is motherboard
provides an 8-pin ATX
12V power connector. To
use a 4-pin ATX power
supply, please plug it along
Pin 1 and Pin 5.
is COM1 header
supports a serial port
module.
is connector supports Trusted
Platform Module (TPM) system,
PC ICL K
PC IRS T
FRA M E
which can securely store keys,
GN D
digital certicates, passwords,
and data. A TPM system also
helps enhance network security,
SMB _CLK _MA IN
SMB _DAT A_M AIN
protects digital identities, and
ensures platform integrity.
is is an interface
for print port cable
that allows convenient
BUSY
PE
connection of printer
devices.
22
H310CM-HDV/M.2
4
2.7 M.2_SSD (NGFF) Module Installation Guide
The M.2, a lso known as the Next Generation Form Factor (NGFF), is a sma ll size a nd
versatile card edge connector that aims to replace mPCIe and mSATA. e M.2 Socket
(M2_1) supports SATA3 6.0 Gb/s module and M.2 PCI Express module up to Gen2 x4
(20 Gb/s).
* If M2_1 is occupied by a SATA-type M.2 device, SATA3_3 will be disabled.
Installing the M.2_SSD (NGFF) Module
Step 1
Prepare a M.2_SSD (NGFF) module
and the screw.
Step 2
3
2
1
Depending on the PCB type and
length of your M.2_SSD (NGFF)
module, nd the corresponding nut
location to be used.
A
BCD
No.1234
Nut LocationABCD
PCB Length3cm4.2cm6cm8cm
Module TypeType223 0Ty pe 224 2Type2 260Ty pe 2280
For the latest updates of M.2_SSD (NFGG) module support list, please visit our website for
details: http://www.asrock.com
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25
Chapter 3 Software and Utilities Operation
3.1 Installing Drivers
e Support CD that comes with the motherboard contains necessary drivers and
useful utilities that enhance the motherboard’s features.
Running The Support CD
To begin using the support CD, insert the CD into your CD-ROM drive. e CD
automatically displays the Main Menu if “AUTORUN” is enabled in your computer.
If the Main Menu does not appear automatically, locate and double click on the le
“ASRSETUP.EXE” in the Support CD to display the menu.
Drivers Menu
e drivers compatible to your system will be auto-detected and listed on the
support CD driver page. Please click Install All or follow the order from top to
bottom to install those required drivers. erefore, the drivers you install can work
properly.
Utilities Menu
e Utilities Menu shows the application soware that the motherboard supports.
Click on a specic item then follow the installation wizard to install it.
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26
H310CM-HDV/M.2
3.2 A-Tuning
A-Tuning is ASRock’s multi purpose soware suite with a new interface, more new
features and improved utilities.
3.2.1 Installing A-Tuning
A-Tu ni n g can be downloaded from ASRock Live Update & APP Shop. Aer the
installation, you will nd the icon “A-Tu n i ng“ on your desktop. Double-click the
“A-Tu ni n g“ icon, A-Tu n i n g main menu will pop up.
3.2.2 Using A-Tuning
ere are four sections in A-Tuning main menu: Operation Mode, System Info,
FAN-Tastic Tuning and Settings.
Operation Mode
Choose an operation mode for your computer.
27
English
System Info
View information about the system.
*e System Browser tab may not appear for certain models.
FAN-Tastic Tuning
Congure up to ve dierent fan speeds using the graph. e fans will automatically shi
to the next speed level when the assigned temperature is met.
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28
H310CM-HDV/M.2
Settings
Congure ASRock A-Tuning. Click to select "Auto run at Windows Startup" if you
want A-Tuning to be launched when you start up the Windows operating system.
29
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3.3 ASRock Live Update & APP Shop
e ASRock Live Update & APP Shop is an online store for purchasing and
downloading soware applications for your ASRock computer. You can quickly and
easily install various apps and support utilities. With ASRock Live Update & APP
Shop, you can optimize your system and keep your motherboard up to date simply
with a few clicks.
Double-click on your desktop to access ASRock Live Update & APP Shop
utility.
*You need to be connected to the Internet to download apps f rom the ASRock Live Update & APP Shop.
3.3.1 UI Overview
Category Panel
Hot News
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Information Panel
Category Panel: e category panel contains several category tabs or buttons that
when selected the information panel below displays the relative information.
Information Panel: e information panel in the center displays data about the
currently selected category and allows users to perform job-related tasks.
Hot News: e hot news section displays the various latest news. Click on the image
to visit the website of the selected news and know more.
H310CM-HDV/M.2
3.3.2 Apps
When the "Apps" tab is selected, you will see all the available apps on screen for you
to download.
Installing an App
Step 1
Find the app you want to install.
e most recommended app appears on the le side of the screen. e other various
apps are shown on the right. Please scroll up and down to see more apps listed.
You can check the price of the app and whether you have already intalled it or not.
- e red icon displays the price or "Free" if the app is free of charge.
- e green "Installed" icon means the app is installed on your computer.
Step 2
Click on the app icon to see more details about the selected app.
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31
Step 3
If you want to install the app, click on the red icon to start downloading.
Step 4
When installation completes, you can nd the green "Installed " icon appears on the
upper right corner.
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To uninstall it, simply click on the trash can icon .
*e trash icon may not appear for certain apps.
H310CM-HDV/M.2
Upgrading an App
You can only upgrade the apps you have already installed. When there is an
available new version for your app, you will nd the mark of "New Version"
appears below the installed app icon.
Step 1
Click on the app icon to see more details.
Step 2
Click on the yellow icon to start upgrading.
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3.3.3 BIOS & Drivers
Installing BIOS or Drivers
When the "BIOS & Drivers" tab is selected, you will see a list of recommended or
critical updates for the BIOS or drivers. Please update them all soon.
Step 1
Please check the item information before update. Click on to see more details.
Step 2
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34
Click to select one or more items you want to update.
Step 3
Click Update to start the update process.
H310CM-HDV/M.2
3.3.4 Setting
In the "Setting" page, you can change the language, select the server location, and
determine if you want to automatically run the ASRock Live Update & APP Shop
on Windows startup.
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Chapter 4 UEFI SETUP UTILITY
4.1 Introduction
is section explains how to use the UEFI SETUP UTILITY to congure your
system. You may run the UEFI SETUP UTILITY by pressing <F2> or <Del> right
aer you power on the computer, other wise, the Power-On-Self-Test (POST) will
continue with its test routines. If you wish to enter the UEFI SETUP UTILITY aer
POST, restart the system by pressing <Ctl> + <Alt> + <Delete>, or by pressing the
reset button on the system chassis. You may also restart by turning the system o
and then back on.
Becau se the UEFI soware is constantly being upd ated, the following UEFI setup screens
and descriptions are for reference pur pose only, and they may not exactly match what you
see on your screen.
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H310CM-HDV/M.2
4.2 EZ Mode
e EZ Mode screen appears when you enter the BIOS setup program by default. EZ
mode is a dashboard which contains multiple readings of the system’s current status.
You can check the most crucial information of your system, such as CPU speed,
DRAM frequency, SATA information, fan speed, etc.
Press <F6> or click the "Advanced Mode" button at the upper right corner of the
screen to switch to "Advanced Mode" for more options.
No.Function
Help
1
Load UEFI Defaults
2
Save Changes and Exit
3
Discard Changes
4
Change Language
5
Switch to Advanced Mode
6
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4.3 Advanced Mode
e Advanced Mode provides more options to congure the BIOS settings. Refer to
the following sections for the detailed congurations.
To access the EZ Mode, press <F6> or click the "EZ Mode" button at the upper right
corner of the screen.
4.3.1 UEFI Menu Bar
e top of the screen has a menu bar with the following selections:
Main
OC Tweaker
Advanced
Tool
H/W Monitor
Security
Boot
Exit
For setting system time/date information
For overclocking congurations
For advanced system congurations
Useful tools
Displays current hardware status
For security settings
For conguring boot settings and boot priority
Exit the current screen or the UEFI Setup Utility
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H310CM-HDV/M.2
4.3.2 Navigation Keys
Use < > key or < > key to choose among the selections on the menu bar, and
use < > key or < > key to move the cursor up or down to select items, then
press <Enter> to get into the sub screen. You can also use the mouse to click your
required item.
Please check the following table for the descriptions of each navigation key.
Navigation Key(s) Description
+ / -
<Tab>
<PGUP>
<PGDN>
<HOME>
<END>
<F1>
<F5>
<F7>
<F9>
<F10>
<F12>
<ESC>
To change option for the selected items
Switch to next function
Go to the previous page
Go to the next page
Go to the top of the screen
Go to the bottom of the screen
To display the General Help Screen
Add / Remove Favorite
Discard changes and exit the SETUP UTILITY
Load optimal default values for all the settings
Save changes and exit the SETUP UTILITY
Print screen
Jump to the Exit Screen or exit the current screen
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4.4 Main Screen
When you enter the UEFI SETUP UTILITY, the Main screen will appear and
display the system overview.
My Favorite
Display your collection of BIOS items. Press F5 to add/remove your favorite items.
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4.5 OC Tweaker Screen
In the OC Tweaker screen, you can set up overclocking features.
H310CM-HDV/M.2
Becau se the UEFI soware is constantly being upd ated, the following UEFI setup screens
and descriptions are for reference pur pose only, and they may not exactly match what you
see on your screen.
CPU Conguration
Boot Performance Mode
Default is Max Non-Turbo performance mode. It will keep cpu Flex-ratio till OS
hando. Max Battery mode will set CPU ratio as x8 till OS hando. is option is
suggested for BCLK overclocking.
FCLK Frequency
Congure the FCLK Frequency.
AVX Ratio Oset
AVX Ratio Oset species a negative oset from the CPU Ratio for AVX workloads.
AVX is a more stressful workload that lowers the AVX ratio to ensure maximum
possible ratio for SSE workloads.
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BCLK Aware Adaptive Voltage
Congure the BCLK Aware Adaptive Voltage. When enabled, pcode will be aware
of the BCLK frequency when calculating the CPU V/F curves. is is ideal for
BCLK OC to avoid high voltage overrides.
Ring to Core Ratio Oset
Disable Ring to Core Ratio Oset so the ring and core can run at the same
freq ue ncy.
Intel SpeedStep Technology
Intel SpeedStep technology allows processors to switch between multiple frequen-
cies and voltage points for better power saving and heat dissipation.
Intel Turbo Boost Technology
Intel Turbo Boost Technolog y enables the processor to run above its base operating
frequency when the operating system requests the highest performance state.
Intel Speed Shift Technology
Enable/Disable Intel Speed Shi Technology support. Enabling will expose the
CPPC v2 interface to allow for hardware controlled P-sates.
Long Duration Power Limit
Congure Package Power Limit 1 in watts. When the limit is exceeded, the CPU
ratio will be lowered aer a period of time. A lower limit can protect the CPU and
save power, while a higher limit may improve performance.
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Long Duration Maintained
Congure the period of time until the CPU ratio is lowered when the Long
Duration Power Limit is exceeded.
Short Duration Power Limit
Congure Package Power Limit 2 in watts. When the limit is exceeded, the CPU
ratio will be lowered immediately. A lower limit can protect the CPU and save
power, while a higher limit may improve performance.
CPU Core Current Limit
Congure the current limit of the CPU core. A lower limit can protect the CPU and
save power, while a higher limit may improve performance.
H310CM-HDV/M.2
GT Current Limit
Congure the current limit of the GT slice. A lower limit can protect the CPU and
save power, while a higher limit may improve performance.
GT Frequency
Conigure the frequency of the integrated GPU.
DRAM Conguration
DRAM Tweaker
Fine tune the DRAM settings by leaving marks in checkboxes. Click OK to conrm and
apply your new settings.
DRAM Timing Conguration
Load XMP Setting
Load XMP settings to overclock the memory and perform beyond standard
specications.
DRAM Reference Clock
Select Auto for optimized settings.
DRAM Frequency
If [Auto] is selected, the motherboard will detect the memory module(s) inserted
and assign the appropriate frequency automatically.
DRAM Clock
Choose a frequency to override to clock delay for memory training. DRAM Clock
controls memor y training only if ASRock Timing Optimization is disabled.
Primary Timing
CAS# Latency (tCL)
e time between sending a column address to the memory and the beginning of the data
in response.
RAS# to CAS# Delay and Row Precharge (tRCDtRP)
RAS# to CAS# Delay : e number of clock cycles required between the opening of
a row of memory and accessing columns within it.
Row Precharge: e number of clock cycles required between the issuing of the
precharge command and opening the next row.
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RAS# Active Time (tRAS)
e number of clock cycles required between a bank active command and issuing the
precharge command.
Command Rate (CR)
e delay between when a memor y chip is selected and when the rst active command can
be issued.
Secondary Timing
Write Recovery Time (tWR)
e amount of delay that must elapse aer the completion of a valid write operation,
before an active bank can be precharged.
Refresh Cycle Time (tRFC)
e number of clocks from a Refresh command until the rst Activate command to
the same rank.
RAS to RAS Delay (tRRD_L)
e number of clocks between two rows activated in dierent banks of the same
rank.
RAS to RAS Delay (tRRD_S)
e number of clocks between two rows activated in dierent banks of the same
rank.
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Write to Read Delay (tWTR_L)
e number of clocks between the last valid write operation and the next read command to
the same interna l bank.
Write to Read Delay (tWTR_S)
e number of clocks between the last valid write operation and the next read command to
the same interna l bank.
Read to Precharge (tRTP)
e number of clocks that are inserted between a read command to a row pre-
charge command to the same rank.
H310CM-HDV/M.2
Four Activate Window (tFAW)
e time window in which four activates are allowed the same rank.
CAS Write Latency (tCWL)
Congure CAS Write Latency.
Third Timing
tREFI
Congure refresh cycles at an average periodic interval.
tCKE
Congure the period of time the DDR4 initiates a minimum of one refresh
command internally once it enters Self-Refresh mode.
Turn Around Timing
tRDRD_sg
Congure between module read to read delay.
tRDRD_dg
Congure between module read to read delay.
tRDRD_dr
Congure between module read to read delay.
tRDRD_dd
Congure between module read to read delay.
tRDWR_sg
Congure between module read to write delay.
tRDWR_dg
Congure between module read to write delay.
tRDWR_dr
Congure between module read to write delay.
tRDWR_dd
Congure between module read to write delay.
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tWRRD_sg
Congure between module write to read delay.
tWRRD_dg
Congure between module write to read delay.
tWRRD_dr
Congure between module write to read delay.
tWRRD_dd
Congure between module write to read delay.
tWRWR_sg
Congure between module write to write delay.
tWRWR_dg
Congure between module write to write delay.
tWRWR_dr
Congure between module write to write delay.
tWRWR_dd
Congure between module write to write delay.
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Round Trip Timing
RTL Init Value
Congure round trip latency init value for round trip latency training.
IO-L Init Value
Congure IO latency init value for IO latency training.
RTL (CH A)
Congure round trip latency for channel A.
RTL (CH B)
Congure round trip latency for channel B.
IO-L (CH A)
Congure IO latency for channel A.
IO-L (CH B)
Congure IO latency for channel B.
IO-L Oset (CH A)
Congure IO latency oset for channel A.
IO-L Oset (CH B)
Congure IO latency oset for channel B.
RFR Delay (CH A)
Congure RFR Delay for Channel A.
RFR Delay (CH B)
Congure RFR Delay for Channel B.
Advanced Setting
ODT WR (CH A)
Congure the memory on die termination resistors' WR for channel A.
ODT PARK (CH A)
Congure the memory on die termination resistors' PARK for channel A.
H310CM-HDV/M.2
ODT NOM (CH A)
Use this to change ODT (CH A) Auto/Manual settings. e default is [Auto].
Dll Bandwidth 0
Congure the Dll Bandwidth 0.
Dll Bandwidth 1
Congure the Dll Bandwidth 1.
Dll Bandwidth 2
Congure the Dll Bandwidth 2.
Dll Bandwidth 3
Congure the Dll Bandwidth 3.
Command Tristate
Congure the Command Tristate Support.
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Realtime Memory Timing
Congure the realtime memory timings.
[Enabled] e system will allow performing realtime memory timing changes aer
MRC_DONE.
MRC Fast Boot
Enable Memory Fast Boot to skip DRAM memory training for booting faster.
Voltage Conguration
Vcore Oset Voltage
Use this to congure Vcore Oset Voltage. e default value is [Auto].
GT Oset Voltage
Use this to congure GT Oset Voltage. e default value is [Auto].
DRAM Voltage
Use this to congure DRAM Voltage. e default value is [Auto].
PCH +1.0 Voltage
Congure the chipset voltage (1.0V).
Save User Default
Type a prole name and press enter to save your settings as user default.
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Load User Default
Load previously saved user defaults.
Save User UEFI Setup Prole to Disk
Save current UEFI settings as an user default prole to disk.
Load User UEFI Setup Prole to Disk
Load previously saved user defaults from the disk.
H310CM-HDV/M.2
4.6 Advanced Screen
In this section, you may set the congurations for the following items: CPU
Conguration, Chipset Conguration, Storage Conguration, Super IO Congura-
tion, ACPI Conguration, USB Conguration and Trusted Computing.
Setting wrong values in this sec tion may cause the system to malfunction.
UEFI Conguration
UEFI Setup Style
Select the default mode when entering the UEFI setup utility.
Active Page on Entry
Select the default page when entering the UEFI setup utility.
Full HD UEFI
When [Auto] is selected, the resolution will be set to 1920 x 1080 if the monitor
supports Full HD resolution. If the monitor does not support Full HD resolution,
then the resolution will be set to 1024 x 768. When [Disable] is selected, the
resolution will be set to 1024 x 768 directly.
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4.6.1 CPU Conguration
Intel Hyper Threading Technology
Intel Hyper reading Technology allows multiple threads to run on each core, so that the
overall performance on threaded soware is improved.
Active Processor Cores
Select the number of cores to enable in each processor package.
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CPU C States Support
Enable CPU C States Support for power saving. It is recommended to keep C3, C6
and C7 all enabled for better power saving.
Enhanced Halt State (C1E)
Enable Enhanced Halt State (C1E) for lower power consumption.
CPU C3 State Support
Enable C3 sleep state for lower power consumption.
CPU C6 State Support
Enable C6 sleep state for lower power consumption.
CPU C7 State Support
Enable C7 sleep state for lower power consumption.
H310CM-HDV/M.2
Package C State Support
Enable CPU, PCIe, Memor y, Graphics C State Support for power saving.
CFG Lock
is item allows you to disable or enable the CFG Lock.
CPU Thermal Throttling
Enable CPU internal thermal control mechanisms to keep the CPU from
overheating.
Intel Virtualization Technology
Intel Virtualization Technology allows a platform to run multiple operating systems
and applications in independent partitions, so that one computer system can
function as multiple virtual systems.
Hardware Prefetcher
Automatically prefetch data and code for the processor. Enable for better
performance.
Adjacent Cache Line Prefetch
Automatically prefetch the subsequent cache line while retrieving the currently
requested cache line. Enable for better performance.
Software Guard Extensions (SGX)
Use this item to enable or disable So ware Controlled Soware Guard Extensions
(SGX).
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4.6.2 Chipset Conguration
Primary Graphics Adapter
Select a primary VGA.
Above 4G Decoding
Enable or disable 64bit capable Devices to be decoded in Above 4G Address Space
(only if the system supports 64 bit PCI decoding).
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VT-d
Intel® Virtualization Technology for Directed I/O helps your virtual machine
monitor better utilize hardware by improving application compatibility and
reliability, and providing additional levels of manageability, security, isolation, and
I/O performance.
PCIE1 Link Speed
Select the link speed for PCIE1.
PCIE2 Link Speed
Select the link speed for PCIE2.
PCIE3 Link Speed
Select the link speed for PCIE3.
PCI Express Native Control
Select Enable for enhanced PCI Express power saving in OS.
H310CM-HDV/M.2
PCIE ASPM Support
is option enables/disables the ASPM support for all CPU downstream devices.
PCH PCIE ASPM Support
is option enables/disables the ASPM support for all PCH PCIE devices.
DMI ASPM Support
is option enables/disables the control of ASPM on CPU side of the DMI Link.
PCH DMI ASPM Support
is option enables/disables the ASPM support for all PCH DMI devices.
Share Memory
Congure the size of memory that is allocated to the integrated graphics processor when
the system boots up.
IGPU Multi-Monitor
Select disable to disable the integrated graphics when an external graphics card is installed.
Select enable to keep the integrated graphics enabled at all times.
Inte(R) Ethernet Connection I219-V
Enable or disable the onboard network interface controller (Intel® I219V).
Onboard HD Audio
Enable/disable onboard HD audio. Set to Auto to enable onboard HD audio and
automatically disable it when a sound card is installed.
Front Panel
Enable/disable front panel HD audio.
Onboard HDMI HD Audio
Enable audio for the onboard digital outputs.
Deep Sleep
Congure deep sleep mode for power saving when the computer is shut down.
Restore on AC/Power Loss
Select the power state aer a power failure. If [Power O] is selected, the power will
remain o when the power recovers. If [Power On] is selected, the system will start
to boot up when the power recovers.
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4.6.3 Storage Conguration
SATA Controller(s)
Enable/disable the SATA controllers.
SATA Controller Speed
Indicates the maximum speed the SATA controller can support.
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SATA Aggressive Link Power Management
SATA Aggressive Link Power Management allows SATA devices to enter a low
power state during periods of inactivity to save power. It is only supported by AHCI
mode.
Hard Disk S.M.A.R.T.
S.M.A.R.T stands for Self-Monitoring, Analysis, and Reporting Technology. It is a
monitoring system for computer hard disk drives to detect and report on various
indicators of reliability.
4.6.4 Super IO Conguration
Serial Port
Enable or disable the Serial port.
H310CM-HDV/M.2
Serial Port Address
Select the address of the Serial port.
Parallel Port
Enable or disable the Parallel port.
Change Settings
Select the address of the Parallel port.
Device Mode
Select the device mode according to your connected device.
PS2 Y- Cable
Enable the PS2 Y-Cable or set this option to Auto.
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4.6.5 ACPI Conguration
Suspend to RAM
Select disable for ACPI suspend type S1. It is recommended to select auto for ACPI
S3 power saving.
PS/2 Keyboard Power On
Allow the system to be waked up by a PS/2 Keyboard.
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PCIE Devices Power On
Allow the system to be waked up by a PCIE device and enable wake on LAN.
I219 LAN Power On
Allow the system to be waked up by I219 LAN.
Ring-In Power On
Allow the system to be waked up by onboard COM port modem Ring-In signals.
RTC Alarm Power On
Allow the system to be waked up by the real time clock alarm. Set it to By OS to let
it be handled by your operating system.
USB Keyboard/Remote Power On
Allow the system to be waked up by an USB keyboard or remote controller.
USB Mouse Power On
Allow the system to be waked up by an USB mouse.
H310CM-HDV/M.2
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4.6.6 USB Conguration
Legacy USB Support
Enable or disable Legacy OS Support for USB 2.0 devices. If you encounter USB
compatibility issues it is recommended to disable legacy USB support. Select UEFI
Setup Only to support USB devices under the UEFI setup and Windows/Linux
operating systems only.
PS/2 Simulator
Enable the support of I/O port 60h/64h emulation. is should be enabled for the
complete USB keyboard legacy support for non-USB aware OSes.
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XHCI Hand-o
is is a workaround for OSes without XHCI hand-o support. e XHCI
ownership change should be claimed by XHCI driver.
4.6.7 Trusted Computing
Security Device Support
Enable or disable BIOS support for security device.
H310CM-HDV/M.2
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4.7 Tools
UEFI Tech Service
Contact ASRock Tech Service if you are having trouble with your PC. Please setup
network conguration before using UEFI Tech Service.
Instant Flash
Save UEFI les in your USB storage device and run Instant Flash to update your
UEFI.
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Internet Flash - DHCP (Auto IP), Auto
ASRock Internet Flash downloads and updates the latest UEFI rmware version
from our servers for you. Please setup network conguration before using Internet
Flash.
*For BIOS backup and recovery purpose, it is recommended to plug in your USB
pen drive before using this function.
Network Conguration
Use this to congure internet connection settings for Internet Flash.
Internet Setting
Enable or disable sound eects in the setup utility.
H310CM-HDV/M.2
UEFI Download Server
Select a server to download the UEFI rmware.
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4.8 Hardware Health Event Monitoring Screen
is section allows you to monitor the status of the hardware on your system,
including the parameters of the CPU temperature, motherboard temperature, fan
speed and voltage.
Fan Tuning
Measure Fan Min Duty Cycle.
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Fan-Tastic Tuning
Select a fan mode for CPU Fans 1&2, or choose Customize to set 5 CPU
temperatures and assign a respective fan speed for each temperature.
CPU Fan 1 Setting
Select a fan mode for CPU Fans 1, or choose Customize to set 5 CPU temperatures and
assign a respective fan speed for each temperature.
CPU Fan Step Up
Set the value of CPU Fan Step Up.
CPU Fan Step Down
Set the value of CPU Fan Step Down.
CHA_FAN1 / W_Pump Switch
Select CHA_FAN1 / W_Pump mode.
H310CM-HDV/M.2
CHA_FAN1 Control Mode
Select PWM mode or DC mode for CHA_FAN1.
Chassis Fan 1 Setting
Select a fan mode for Chassis Fan 1, or choose Customize to set 5 CPU temperatures
and assign a respective fan speed for each temperature.
Chassis Fan 1 Temp Source
Select a fan temperature source for Chassis Fan 1.
Chassis Fan 1 Step Up
Set the value of Chassis Fan 1 Step Up.
Chassis Fan 1 Step Down
Set the value of Chassis Fan 1 Step Down.
CHA_FAN2 / W_Pump Switch
Select CHA_FAN2 / W_Pump mode.
CHA_FAN2 Control Mode
Select PWM mode or DC mode for CHA_FAN2.
CHA_FAN2 Setting
Select a fan mode for CHA_FAN2, or choose Customize to set 5 CPU temperatures
and assign a respective fan speed for each temperature.
Chassis Fan 2 Temp Source
Select a fan temperature source for Chassis Fan 2.
Chassis Fan 2 Step Up
Set the value of Chassis Fan 2 Step Up.
Chassis Fan 2 Step Down
Set the value of Chassis Fan 2 Step Down.
Over Temperature Protection
When Over Temperature Protection is enabled, the system automatically shuts
down when the motherboard is overheated.
Case Open Feature
Enable or disable Case Open Feature to detect whether the chassis cover has been
removed.
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4.9 Security Screen
In this section you may set or change the supervisor/user password for the system.
You may also clear the user password.
Supervisor Password
Set or change the password for the administrator account. Only the administrator
has authority to change the settings in the UEFI Setup Utility. Leave it blank and
press enter to remove the password.
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User Password
Set or change the password for the user account. Users are unable to change the
settings in the UEFI Setup Utility. Leave it blank and press enter to remove the
password.
Secure Boot
Use this item to enable or disable support for Secure Boot.
Intel(R) Platform Trust Technology
Enable/disable Intel PTT in ME. Disable this option to use discrete TPM Module.
H310CM-HDV/M.2
4.10 Boot Screen
is section displays the available devices on your system for you to congure the
boot settings and the boot priority.
Fast Boot
Fast Boot minimizes your computer's boot time. In fast mode you may not boot
from an USB storage device. e VBIOS must support UEFI GOP if you are using
an external graphics card. Please notice that Ultra Fast mode will boot so fast that
the only way to enter this UEFI Setup Utility is to Clear CMOS or run the Restart to
UEFI utility in Windows.
Boot From Onboard LAN
Allow the system to be waked up by the onboard LAN.
Setup Prompt Timeout
Congure the number of seconds to wait for the setup hot key.
Bootup Num-Lock
Select whether Num Lock should be turned on or o when the system boots up.
Boot Beep
Select whether the Boot Beep should be turned on or o when the system boots up. Please
note that a buzzer is needed.
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Full Screen Logo
Enable to display the boot logo or disable to show normal POST messages.
AddOn ROM Display
Enable AddOn ROM Display to see the AddOn ROM messages or congure the
AddOn ROM if you've enabled Full Screen Logo. Disable for faster boot speed.
Boot Failure Guard Message
If the computer fails to boot for a number of times the system automatically restores
the default settings.
CSM (Compatibility Support Module)
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66
CSM
Enable to launch the Compatibility Support Module. Please do not disable unless
you’re running a WHCK test.
Launch PXE OpROM Policy
Select UEFI only to run those that support UEFI option ROM only. Select Legacy
only to run those that support legacy option ROM only. Select Do not launch to not
execute both legacy and UEFI option ROM.
H310CM-HDV/M.2
Launch Storage OpROM Policy
Select UEFI only to run those that support UEFI option ROM only. Select Legacy
only to run those that support legacy option ROM only. Select Do not launch to not
execute both legacy and UEFI option ROM.
Other PCI Device ROM Priority
For PCI devices other than Network. Mass storage or Video denes which OpROM
to launch.
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4.11 Exit Screen
Save Changes and Exit
When you select this option the following message, “Save conguration changes
and exit setup?” will pop out. Select [OK] to save changes and exit the UEFI SETUP
UTILITY.
Discard Changes and Exit
When you select this option the following message, “Discard changes and exit
setup?” will pop out. Select [OK] to exit the UEFI SETUP UTILITY without saving
any changes.
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Discard Changes
When you select this option the following message, “Discard changes?” will pop
out. Select [OK] to discard all changes.
Load UEFI Defaults
Load UEFI default values for a ll options. e F9 key can be used for this operation.
Launch EFI Shell from lesystem device
Copy shellx64.e to the root directory to launch EFI Shell.
Contact Information
If you need to contact ASRock or want to know more about ASRock, you’re welcome
to visit ASRock’s website at http://ww w.asrock.com; or you may contact your dealer
for further information. For technical questions, please submit a support request
form at https://event.asrock.com/tsd.asp
ASRock Incorporation
2F., No.37, Sec. 2, Jhongyang S. Rd., Beitou District,
Taipei City 112, Taiwan (R.O.C.)
ASRock EUROPE B.V.
Bijsterhuizen 11-11
6546 AR Nijmegen
e Netherlands
Phone: +31-24-345-44-33
Fax: +31-24-345-44-38
ASRock America, Inc.
13848 Magnolia Ave, Chino, CA91710
U.S.A.
Phone: +1-909-590-8308
Fax: +1-909-590-1026
DECLARATION OF CONFORMITY
Responsible Party Name:
Phone/FaxNo:
hereby declares that the product
Product Name : Motherboard
Per FCC Part 2 Section 2.1077(a)
ASRock Incorporation
Address:
13848 Magnolia Ave, Chino, CA91710
+1-909-590-8308/+1-909-590-1026
Model Number :
Conforms to the following specications:
FCC Part 15, Subpart B, Unintentional Radiators
Supplementary Information:
H310CM-HDV/M.2
is device complies with part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) is device may not cause harmful interference,
and (2) this device must accept any interference received, including interference
that may cause undesired operation.
James
Representative Person’s Name:
Signature :
Date :
May 12, 2017
EU Declaration of Conformity
EMC —Directive 2014/30/EU (from April 20th, 2016)
ڛ
☐
For the following equipment:
Motherboard
(Product Name)
H310CM-HDV/M.2 / ASRock
(Model Designation / Trade Name)
ASRock Incorporation
(Manufacturer Name)
2F., No.37, Sec. 2, Jhongyang S. Rd., Beitou District, Taipei City 112, Taiwan (R.O.C.)
(Manufacturer Address)
☐ EN 55022:2010/AC:2011 Class B EN 55024:2010/A1:2015
ڛ EN 55032:2012+AC:2013 Class B ڛڛ EN 61000-3-3:2013
ڛ EN 61000-3-2:2014
☐
LVD —Directive 2014/35/EU (from April 20th, 2016)
EN 60950-1 : 2011+ A2: 2013 ☐
ڛ RoHS — Directive 2011/65/EU
ڛ CE marking
EN 60950-1 : 2006/A12: 2011
(EU conformity marking)
ASRock EUROPE B.V.
(Company Name)
Bijsterhuizen 1111 6546 AR Nijmegen e Netherlands
(Company Address)
Person responsible for making this declaration:
(Name, Surname)
A.V.P
(Position / Title)
July 20, 2018
(Date)
P/N: 15G062111000AK V1.0
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