ASRock H270M Pro4 Service Manual

Version 1.0
Published October 2016
Copyright©2016 ASRock INC. All rights reserved.
Copyright Notice:
No part of this documentation may be reproduced, transcribed, transmitted, or translated in any language, in any form or by any means, except duplication of documentation by the purchaser for backup purpose, without written consent of ASRock Inc.
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for informational use only and subject to change without notice, and should not be constructed as a commitment by ASRock. ASRock assumes no responsibility for any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide warranty of any kind, either expressed or implied, including but not limited to the implied warranties or conditions of merchantability or tness for a particular purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for any indirect, special, incidental, or consequential damages (including damages for loss of prots, loss of business, loss of data, interruption of business and the like), even if ASRock has been advised of the possibility of such damages arising from any defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance controlled in Perchlorate Best Management Practices (BMP) regulations passed by the California Legislature. When you discard the Lithium battery in California, USA, please follow the related regulations in advance. “Perchlorate Material-special handling may apply, see ww w.dtsc.ca.gov/hazardouswaste/ perchlorate”
ASRock Website: http://www.asrock.com
AUSTRALIA ONLY
Our goods come with guarantees that cannot be excluded under the Australian Consumer Law. You are entitled to a replacement or refund for a major failure and compensation for any other reasonably foreseeable loss or damage caused by our goods. You are also entitled to have the goods repaired or replaced if the goods fail to be of acceptable quality and the failure does not amount to a major failure. If you require assistance please call ASRock Tel : +886-2-28965588 ext.123 (Standard International call charges apply)
e terms HDMI™ and HDMI High-Denition Multimedia Interface, and the HDMI logo are trademarks or registered trademarks of HDMI Licensing LLC in the United States and other countries.
Contents
Chapter 1 Introduction 1
1.1 Package Contents 1
1.2 Specications 2
1.3 Motherboard Layout 7
1.4 I/O Panel 9
Chapter 2 Installation 11
2.1 Installing the CPU 12
2.2 Installing the CPU Fan and Heatsink 15
2.3 Installing Memory Modules (DIMM) 16
2.4 Expansion Slots (PCI Express Slots) 18
2.5 Onboard Headers and Connectors 19
2.6 CrossFireXTM and Quad CrossFireXTM Operation Guide 23
2.6.1 Installing Two CrossFireXTM-Ready Graphics Cards 23
2.6.2 Driver Installation and Setup 25
2.7 M.2_SSD (NGFF) Module Installation Guide 26
Chapter 3 Software and Utilities Operation 29
3.1 Installing Drivers 29
3.2 A-Tuning 30
3.3 ASRock Live Update & APP Shop 33
3.3.1 UI Overview 33
3.3.2 Apps 34
3.3.3 BIOS & Drivers 37
3.3.4 Setting 38
3.4 Enabling USB Ports for Windows® 7 Installation 39
Chapter 4 UEFI SETUP UTILITY 42
4.1 Introduction 42
4.2 EZ Mode 43
4.3 Advanced Mode 44
4.3.1 UEFI Menu Bar 44
4.3.2 Navigation Keys 45
4.4 Main Screen 46
4.5 OC Tweaker Screen 47
4.6 Advanced Screen 53
4.6.1 CPU Conguration 54
4.6.2 Chipset Conguration 56
4.6.3 Storage Conguration 59
4.6.4 Super IO Conguration 60
4.6.5 ACPI Conguration 61
4.6.6 USB Conguration 63
4.6.7 Trusted Computing 64
4.7 Tools 65
4.8 Hardware Health Event Monitoring Screen 68
4.9 Security Screen 70
4.10 Boot Screen 71
4.11 Exit Screen 74
Chapter 1 Introduction
ank you for purchasing ASRock H270M Pro4 motherboard, a reliable
motherboard produced under ASRock’s consistently stringent quality control.
It delivers excellent performance with robust design conforming to ASRock’s
commitment to quality and endurance.
In this documentation, Chapter 1 and 2 contains the introduction of the
motherboard and step-by-step installation guides. Chapter 3 contains the operation
guide of the soware and utilities. Chapter 4 contains the conguration guide of
the BIOS setup.
Becau se the motherboard specications and the BIOS soware might be updated, the content of this documentation will be subject to change without notice. In case any modications of this documentation occur, the updated version will be available on ASRock’s website w ithout f urther notice. If you require technical support relate d to this motherboard, please vi sit our website for s pecic information about the model you are using. You may nd the l atest VGA cards and CPU suppor t list on ASRock’s website a s well. ASRock website ht tp://www.a srock.com.

1.1 Package Contents

ASRock H270M Pro4 Motherboard (Micro ATX Form Factor)
•
ASRock H270M Pro4 Quick Installation Guide
•
ASRock H270M Pro4 Support CD
•
2 x Serial ATA (SATA) Data Cables (Optional)
•
2 x Screws for M.2 Sockets (Optional)
•
1 x I/O Panel Shield
•
H270M Pro4
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1.2 Specications
Platform
CPU
Chipset
Memory
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•
•
•
•
•
•
•
•
* 7th Gen Intel® CPU supports DDR4 up to 2400; 6th Gen Intel®
CPU supports DDR4 up to 2133.
•
•
•
•
Micro ATX Form Factor
Solid Capacitor design
Supports 7th and 6th Generation Intel® CoreTM i7/i5/i3/
Pentium®/Celeron® Processors (Socket 1151)
Digi Power design
6 Power Phase design
Supports Intel® Turbo Boost 2.0 Technology
Intel® H270
Dual Channel DDR4 Memory Technology
4 x DDR4 DIMM Slots
Supports DDR4 2400/2133 non-ECC, un-buered memory*
Supports ECC UDIMM memory modules (operate in non-
ECC mode)
Max. capacity of system memory: 64GB
Supports Intel® Extreme Memory Prole (XMP) 2.0
15μ Gold Contact in DIMM Slots
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Expansion Slot
Graphics
2 x PCI Express 3.0 x16 Slots (PCIE1: x16 mode; PCIE4: x4
•
mode)*
* Supports NVMe SSD as boot disks
2 x PCI Express 3.0 x1 Slots (Flexible PCIe)
•
Supports AMD Quad CrossFireXTM and CrossFireX
•
Intel® HD Graphics Built-in Visuals and the VGA outputs
•
can be supported only with processors which are GPU
integrated.
Supports Intel® HD Graphics Built-in Visuals : Intel® Quick
•
Sync Video with AVC, MVC (S3D) and MPEG-2 Full
HW Encode1, Intel® InTruTM 3D, Intel® Clear Video HD
Technology, Intel® InsiderTM, Intel® HD Graphics
Gen9 LP, DX11.3, DX12
•
TM
H270M Pro4
HWAEncode/Decode: VP8, HEVC 8b, VP9, HEVC 10b (For
•
7th Gen Intel® CPU)
HWA Encode/Decode: VP8 , HEVC 8b; GPU/SWEncode/
•
Decode: VP9, HEVC 10b (For 6th Gen Intel® CPU)
Max. shared memory 1024MB
•
* e size of ma ximum shared memory may vary from dierent
operating systems.
ree graphics output options: D-Sub, DVI-D and HDMI
•
Supports Triple Monitor
•
Supports HDMI with max. resolution up to 4K x 2K
•
(4096x2160) @ 24Hz / (3840x2160) @ 30Hz
Supports DVI-D with ma x. resolution up to 1920x1200 @
•
60Hz
Supports D-Sub with max. resolution up to 1920x1200 @
•
60Hz
Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and
•
HBR (High Bit Rate Audio) with HDMI Port (Compliant
HDMI monitor is required)
Supports HDCP with DVI-D and HDMI Ports
•
Supports Full HD 1080p Blu-ray (BD) playback with DVI-D
•
and HDMI Ports
Audio
LAN
7.1 CH HD Audio with Content Protection (Realtek ALC892
•
Audio Codec)
* To congure 7.1 CH HD Audio, it is required to use an HD
front panel audio module and enable the multi-channel audio
feature through the audio driver.
Premium Blu-ray Audio support
•
Supports Surge Protection (ASRock Full Spike Protection)
•
ELNA Audio Caps
•
Gigabit LAN 10/100/1000 Mb/s
•
Giga PHY Intel® I219V
•
Supports Wake-On-LAN
•
Supports Lightning/ESD Protection (ASRock Full Spike
•
Protection)
Supports Energy Ecient Ethernet 802.3az
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Supports PXE
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Rear Panel I/O
Storage
1 x PS/2 Mouse Port
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1 x PS/2 Keyboard Port
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1 x D-Sub Port
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1 x DVI-D Port
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1 x HDMI Port
•
2 x USB 2.0 Ports (Supports ESD Protection (ASRock Full
•
Spike Protection))
3 x USB 3.0 Type-A Ports (Supports ESD Protection (ASRock
•
Full Spike Protection))
1 x USB 3.0 Type-C Port (Supports ESD Protection (ASRock
•
Full Spike Protection))
1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED
•
LED)
HD Audio Jacks: Line in / Front Speaker / Microphone
•
6 x SATA3 6.0 Gb/s Connectors, support RAID (RAID 0,
•
RAID 1, RAID 5, RAID 10, Intel Rapid Storage Technology
15 and Intel Smart Response Technology), NCQ, AHCI and
Hot Plug*
* If M2_1 is occupied by a SATA-type M.2 device, SATA3_0 will
be disabled.
1 x Ultra M.2 Socket (M2_1), supports ty pe
•
2230/2242/2260/2280 M.2 SATA3 6.0 Gb/s module and M.2
PCI Express module up to Gen3 x4 (32 Gb/s)**
1 x Ultra M.2 Socket (M2_2), supports type
•
2230/2242/2260/2280 M.2 PCI Express module up to Gen3
x4 (32 Gb/s)**
** Supports Intel® OptaneTM Technology
** Supports NVMe SSD as boot disks
** Supports ASRock U.2 Kit
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Connector
1 x Print Port Header
•
1 x COM Port Header
•
1 x TPM Header
•
1 x Chassis Intrusion and Speaker Header
•
2 x CPU Fan Connectors (1 x 4-pin, 1 x 3-pin)
•
* e CPU Fan Connector supports the CPU fan of ma ximum
1A (12W) fan power.
2 x Chassis Fan Connectors (4-pin) (Smart Fan Speed Con-
•
trol)
BIOS Feature
Hardware Monitor
H270M Pro4
* CHA_FAN1 and CHA _FAN2 can auto detect if 3-pin or 4-pin
fan is in use.
1 x 24 pin ATX Power Connector
•
1 x 8 pin 12V Power Connector
•
1 x Front Panel Audio Connector
•
2 x USB 2.0 Headers (Support 4 USB 2.0 ports) (Supports
•
ESD Protection (ASRock Full Spike Protection))
2 x USB 3.0 Headers (Support 4 USB 3.0 ports) (Supports
•
ESD Protection (ASRock Full Spike Protection))
AMI UEFI Legal BIOS with multilingual GUI support
•
ACPI 6.0 Compliant wake up events
•
SMBIOS 2.7 Support
•
CPU, GT_CPU, DRAM, PCH 1.0V, VCCIO, VCCSA, VCCST
•
Voltage Multi-adjustment
CPU/Chassis temperature sensing
•
CPU/Chassis Fan Tachometer
•
CPU/Chassis Quiet Fan (Auto adjust chassis fan speed by
•
CPU temperature)
CPU/Chassis Fan multi-speed control
•
CASE OPEN detection
•
Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore, DRAM,
•
PCH 1.0V
Microso® Windows® 10 64-bit (For 7th Gen Intel® CPU)
OS
Certica­tions
* For detailed product information, please visit our website: http://ww w.asrock.com
•
Microso® Windows® 10 64-bit / 8.1 64-bit / 7 32-bit / 7 64-
•
bit (For 6th Gen Intel® CPU)
* To install Windows® 7 OS, a modied installation disk with
xHCI drivers packed into the ISO le is required. Please refer to
page 39 for more detailed instructions.
* For the updated Windows® 10 driver, please visit ASRock ’s
website for details: http://ww w.asrock.com
FCC, CE, WHQL, RCM, BSMI
•
ErP/EuP Ready (ErP/EuP ready power supply is required)
•
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Please realize that the re is a certain r isk involved with overclo cking, including adjusting the setting in the BIOS, applying Untied Overclocking Technol ogy, or using third-party overclocking tool s. Overclocking may aect your system’s stability, or even cause dam age to the components and devices of your system. It should be done at your own risk and expense. We are not responsible for poss ible damage caused by overclocking.
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1.3 Motherboard Layout

Intel
H270
ATXP WR 1
HDLED RE SET
PLED PWRBTN
PANEL1
1
COM1
1
H270M Pro4
RoH S
2
CPU_FAN1
5
1
PCI E1
TPMS1
1
1
USB3_4
SPK_CI1
1
PCI E2
Fro nt USB 3. 0
14 15
16
17
18
19
20
CMO S
Bat ter y
DDR4 _A2 (64 b it, 288- pin modu le)
DDR4 _A1 (64 b it, 288- pin modu le)
DDR4 _B2 (64 b it, 288- pin modu le)
DDR4 _B1 (64 b it, 288- pin modu le)
4
3
ATX12V1
11
SATA3_2
SATA3_3
USB3_5_ 6
12
13
SATA3_4
SATA3_5
10
CLRMOS1
1
1
HD_AUDIO1
M2_1
CT3CT4 CT2
Top: RJ-4 5
HDMI 1
CHA_FAN1
Top:
LINE I N
Center:
FRONT
Bottom:
MIC IN
USB 3.0 T:USB 3_TA_1 B:U SB3_TC_ 1
PCI E4
PCI Ex pre ss 3.0
7
8
6
9
SATA3_1
CHA_FAN2
Ultr a M.2
PCIe Gen3 x4
PS2
Keybo ard
PS2
Mouse
DVI 1
VGA 1
USB 3.0 T:U SB3 B: USB4
CPU_FAN2
Ct1
1
LPT1
1
USB5_6
1
BIOS ROM
M2_2
CT3CT4 CT2 Ct1
SATA3_0
21
22
23
24
Opt an e Re ady
PCI E3
1
USB3_7_ 8
25
USB 2 .0 T: USB1 B: US B2
H270M Pro4
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No. Description
1 ATX 12V Power Connector (ATX12V1)
2 Chassis Fan Connector (CHA_FAN1)
3 CPU Fan Connector (CPU_FAN1)
4 CPU Fan Connector (CPU_FAN2)
5 2 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)
6 2 x 288-pin DDR4 DIMM Slots (DDR4_A2, DDR4_B2)
7 ATX Power Connector (ATXPWR1)
8 USB 3.0 Header (USB3_5_6)
9 SATA3 Connector (SATA3_0)
10 SATA3 Connector (SATA3_1)
11 Chassis Fan Connector (CHA_FAN2)
12 USB 3.0 Header (USB3_7_8)
13 SATA3 Connector (SATA3_2)
14 SATA3 Connector (SATA3_3)
15 SATA3 Connector (SATA3_5)
16 SATA3 Connector (SATA3_4)
17 Clear CMOS Jumper (CLRMOS1)
18 Chassis Intrusion and Speaker Header (SPK_CI1)
19 System Panel Header (PANEL1)
20 USB 2.0 Header (USB5_6)
21 USB 2.0 Header (USB3_4)
22 TPM Header (TPMS1)
23 Print Port Header (LPT1)
24 COM Port Header (COM1)
25 Front Panel Audio Header (HD_AUDIO1)
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8

1.4 I/O Panel

1 3
2
H270M Pro4
4
5
13 6711
12
9
10
8
No. Description No. Description
1 PS/2 Mouse Port 8 USB 3.0 Ports (USB3_3_4)
2 D-Sub Port 9 USB 3.0 Type-A Port (USB3_TA_1)
3 LAN RJ-45 Port* 10 USB 3.0 Type-C Port (USB3_TC_1)
4 Line In (Light Blue)** 11 HDMI Port
5 Front Speaker (Lime)** 12 DVI-D Port
6 Microphone (Pink)** 13 PS/2 Keyboard Port
7 USB 2.0 Ports (USB12)
* ere are two LEDs on the LAN port. Please refer to the table below for the LAN port LED indications.
ACT/LINK L ED
SPEED LE D
LAN Por t
Activity / Link LED Speed LED
Status Description Status Description
O No Link O 10Mbps connection Blinking Data Activity Orange 100Mbps connection On Link Green 1Gbps connection
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** To congure 7.1 CH HD Audio, it i s required to use an HD front panel audio module and enable the multi­channel audio feature through the audio driver.
Please set Speaker Conguration to “7.1 Speaker”in the Realtek HD Audio Manager.
Function of the Audio Por ts in 7.1-channel Con guration:
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Port Function
Light Blue (Rear panel) Rear Speaker Out Lime (Rear panel) Front Speaker Out Pink (Rear panel) Central /Subwoofer Speaker Out Lime (Front panel) Side Speaker Out

Chapter 2 Installation

is is a Micro ATX form factor motherboard. Before you install the motherboard,
study the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components
or change any motherboard settings.
Make sure to unplug the power cord before installing or removing the motherboard
•
components. Failure to do so may cause physical injuries and damages to motherboard
components.
In order to avoid damage from static electricity to the motherboard’s components,
•
NEVER place your motherboard directly on a carpet. Also remember to use a grounded
wrist strap or touch a safety grounded object before you handle the components.
Hold components by the edges and do not touch the ICs.
•
Whenever you uninstall any components, place them on a grounded anti-static pad or
•
in the bag that comes with the components.
When placing screws to secure the motherboard to the chassis, please do not over-
•
tighten the screws! Doing so may damage the motherboard.
H270M Pro4
11
English

2.1 Installing the CPU

1. Before you insert the 1151-Pin CPU into the socket , please check if the PnP c ap is on the socket, if the CPU sur face is unclean, or if th ere are any b ent pins in the socket. Do not force to insert the CPU into the socket if above situ ation is found. Other wise, the CPU wil l be seriously d amaged.
2. Unplug all power cables be fore installing the CPU.
1
2
A
B
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H270M Pro4
3
4
5
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13
Please save and replace the cover if the processor i s removed. e cover must be placed if you wish to return the motherboard for aer service.
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14

2.2 Installing the CPU Fan and Heatsink

1 2
H270M Pro4
FAN
CPU_
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15

2.3 Installing Memory Modules (DIMM)

is motherboard provides four 288-pin DDR4 (Double Data Rate 4) DIMM slots,
and supports Dual Channel Memory Technology.
1. For dual channel conguration, you always need to install identical (the same
brand, speed , size and chip-type) DDR4 DIMM pairs.
2. It is unable to activate Dual Channel Memor y Technology with only one or three memor y module installed.
3. It is not allowed to install a DDR, DDR2 or DDR3 memory module into a DDR4 slot; otherwise, this motherboard and DIMM may be damaged.
Dual Channel Memory Conguration
Priority DDR4_ A1 DDR4_ A2 DDR4_B1 DDR4_B2
1 Populated Populated 2 Populated Populated 3 Populated Populated Populated Populated
e DIMM only ts in one correct orientation. It will cause permanent dam age to the mothe rboard and the DIMM if you force the DIMM into the slot at incor rect orientation .
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H270M Pro4
1
2
3
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17

2.4 Expansion Slots (PCI Express Slots)

ere are 4 PCI Express slots on the motherboard.
Before installing an ex pansion card, please make sure that the power supply is switched o or the power cord is unplugged. Plea se read the documentation of the expan sion card and mak e necessary hardware settings for the card before you start the installation.
PCIe slots:
PCIE1 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
PCIE2 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.
PCIE3 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.
PCIE4 (PCIe 3.0 x16 slot) is used for PCI Express x4 lane width graphics cards.
PCIe Slot Congurations
PCIE1 PCIE4
Single Graphics Card x16 N/A
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Two Graphics Cards in
CrossFireXTM Mode
For a better ther mal environment, ple ase connect a ch assi s fan to the motherboard’s chassis fan connector (CHA_ FAN1 or CHA_ FAN2) when using multiple graphics cards.
x16 x4

2.5 Onboard Headers and Connectors

Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over these header s and connectors. Placing jumper caps over the headers and connectors will cause permanent damage to the motherboard.
H270M Pro4
System Panel Header
(9-pin PANEL1)
(see p.7, No. 19)
PWRBTN (Power Switch):
Connec t to the power switch on the chassi s front panel. You may congure the way to turn o your system using the power switch.
RESET (Reset Switch):
Connec t to the reset switch on the chassi s front panel. P ress the reset sw itch to restart the computer if the compute r freezes and fails to perform a normal restart.
PLED (Syste m Power LED):
Connec t to the power status indicator on the chassis front panel. e LED i s on when the system is ope rating. e LED keeps blinking when the system i s in S1/S3 sleep state. e LED is o when the system is in S4 sleep state or powered o (S5).
HDLED (Ha rd Drive Activity LED):
Connec t to the hard drive ac tivity LED on the chassis front panel. e LED is on when the hard drive i s reading or writing data.
e front panel de sign may dier by chassis. A front pane l module mainly consists of power switch , reset switch, power LED, hard dr ive activity LED, speak er and etc. When connecting your chassis front panel module to this head er, make sure the wire assig nments and the pin assig nments are matched correctly.
1
PLE D+
PLE D-
HDL ED-
HDL ED+
PWR BTN #
GND
RES ET#
GND
GND
Connect the power
switch, reset switch and
system status indicator on
the chassis to this header
according to the pin
assignments below. Note
the positive and negative
pins before connecting
the cables.
19
English
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