Asrock H170 Pro4/D3 Quick Installation Guide

Version 1.0 Published July 2015 Copyright©2015 ASRock INC. All rights reserved.
Copyright Notice:
No part of this documentation may be reproduced, transcribed, transmitted, or translated in any language, in any form or by any means, except duplication of documentation by the purchaser for backup purpose, without written consent of ASRock Inc.
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for informational use only and subject to change without notice, and should not be constructed as a commitment by ASRock. ASRock assumes no responsibility for any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide warranty of any kind, either expressed or implied, including but not limited to the implied warranties or conditions of merchantability or tness for a particular purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for any indirect, special, incidental, or consequential damages (including damages for loss of prots, loss of business, loss of data, interruption of business and the like), even if ASRock has been advised of the possibility of such damages arising from any defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance controlled in Perchlorate Best Management Practices (BMP) regulations passed by the California Legislature. When you discard the Lithium battery in California, USA, please follow the related regulations in advance. “Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/ perchlorate”
ASRock Website: http://www.asrock.com
e terms HDMI™ and HDMI High-Denition Multimedia Interface, and the HDMI logo are trademarks or registered trademarks of HDMI Licensing LLC in the United States and other countries.
Intel
H170
DDR 3_A2 (6 4 bit, 24 0-pin m odule )
DDR 3_A1 (6 4 bit, 24 0-pin m odule )
DDR 3_B2 (6 4 bit, 24 0-pin m odule )
DDR 3_B1 (6 4 bit, 24 0-pin m odule )
ATX12V1
CMOS
Battery
Supe r
I/O
ATXPWR1
1
USB3_4_5
LAN
Top: RJ-45
USB 3.0 T: USB4 B: USB5
CLRCMOS1
1
HDLED RESET
PLED PWRBTN
PANEL1
1
USB2_3
1
COM1
1
1
HD_AUDIO1
H170 Pro4/D3
SATA3_1_ 3 SATA3_0_ 2
PCIE5
RoHS
7
8
9
10
17
19
11
12
15
20
18
2
CPU_FAN1
3
4
6
5
1
128Mb
BIOS
USB 3.0 T: USB0 B: USB1
Audio
CODEC
PCIE2
PCI Express 3.0
Front USB 3.0
CHA_FAN2
HDM I1
DVI 1
USB 3.0 T: USB2 B: USB3
CHA_FAN1
SATA3_5
USB4_5
1
TPMS1
1
SATA3_4
14
16
Top:
LINE IN
Center :
FRONT
Bottom :
MIC IN
PS2
Keyb oard
PS2
Mous e
PCIE1
PCIE4
PCIE3
1
SPK_PLED1
21
SATA_E_1 2
13
Motherboard Layout
H170 Pro4/D3
English
1
No. Description
1 ATX 12V Power Connector (ATX12V1)
2 CPU Fan Connector (CPU_FAN1)
3 Chassis Fan Connector (CHA_FAN2)
4 2 x 240-pin DDR3/DDR3L DIMM Slots (DDR3_A1, DDR3_B1)
5 2 x 240-pin DDR3/DDR3L DIMM Slots (DDR3_A2, DDR3_B2)
6 ATX Power Connector (ATXPWR1)
7 USB 3.0 Header (USB3_4_5)
8 Clear CMOS Jumper (CLRMOS1)
9 Chassis Fan Connector (CHA_FAN1)
10 SATA3 Connectors (SATA3_0_2)
11 SATA3 Connectors (SATA3_1_3)
12 SATA Express Connectors (SATA_E_12)
13 System Panel Header (PANEL1)
14 SATA3 Connector (SATA3_4)
15 SATA3 Connector (SATA3_5)
16 Power LED and Speaker Header (SPK_PLED1)
17 USB 2.0 Header (USB2_3)
18 USB 2.0 Header (USB4_5)
19 COM Port Header (COM1)
20 TPM Header (TPMS1)
21 Front Panel Audio Header (HD_AUDIO1)
English
2
I/O Panel
2
3
1
H170 Pro4/D3
4
11
10
9
8
7
6
No. Description No. Description
1 PS/2 Mouse Port (Green) 7 USB 3.0 Ports (USB3_23)
2 LAN RJ-45 Port* 8 USB 3.0 Ports (USB3_01)
3 Line In (Light Blue)** 9 HDMI Port
4 Front Speaker (Lime)** 10 DVI-D Por t
5 Microphone (Pink)** 11 PS/2 Keyboard Port (Purple)
6 USB 3.0 Ports (USB3_45)
* ere are two LEDs on each LAN port. Plea se refer to the table below for the LAN port LED indications.
ACT/LINK LED
SPEED LED
LAN Por t
Activity / Link LED Speed LED
Status Description Status Description
O No Link O 10Mbps connection Blinking Data Activity Orange 100Mbps connection On Link Green 1Gbps connection
5
English
3
** To congure 7.1 CH HD Audio, it i s required to use an HD front panel audio module and enable the multi­channel audio feature through the audio driver.
Please set Speaker Cong uration to “7.1 Speaker” in the Realtek HD Audio Manager.
Function of the Audio Ports in 7.1-channel Conguration:
English
4
Port Function
Light Blue (Rear panel) Rear Speaker Out Lime (Rear panel) Front Speaker Out Pink (Rear panel) Central /Subwoofer Speaker Out Lime (Front panel) Side Speaker Out
Chapter 1 Introduction
ank you for purchasing ASRock H170 Pro4/D3 motherboard, a reliable motherboard produced under ASRock’s consistently stringent quality control. It delivers excellent performance with robust design conforming to ASRock’s commitment to quality and endurance.
Becau se the motherboard specications and the BIOS soware might be updated, the content of this documentation will be subject to change without notice. In case any modi­cations of this documentation occur, the updated version will be available on ASRock’s website w ithout further notice. If you require technical suppor t related to this mother­board, please visit our website for specic information about the model you are using. You may nd the l atest VGA cards and CPU support list on ASRock’s website as well. ASRock website http://www.asrock.com.
1.1 Package Contents
•ASRock H170 Pro4/D3 Motherboard (ATX Form Factor)
•ASRock H170 Pro4/D3 Quick Installation Guide
•ASRock H170 Pro4/D3 Support CD
•2 x Serial ATA (SATA) Data Cables (Optional)
•1 x I/O Panel Shield
H170 Pro4/D3
English
5
1.2 Specications
Platform
CPU
Chipset
Memory
Expansion Slot
•ATX Form Factor
•Solid Capacitor design
•High Density Glass Fabric PCB
•Supports 6
Celeron® Processors (Socket 1151)
•Supports Intel® Turbo Boost 2.0 Technology
•Intel® H170
•Supports Intel® Small Business Advantage 4.0
•Dual Channel DDR3/DDR3L Memory Technology
•4 x DDR3/DDR3L DIMM Slots
•Supports DDR3/DDR3L 1600/1333/1066 non-ECC, un-
buered memory
•Max. capacity of system memory: 64GB
•Supports Intel® Extreme Memory Prole (XMP) 1.3 / 1.2
•2 x PCI Express 3.0 x16 Slots (PCIE2: x16 mode; PCIE4: x4
mode)
•3 x PCI Express 3.0 x1 Slots (Flexible PCIe)
•Supports AMD Quad CrossFireX
th
Generation Intel® CoreTM i7/i5/i3/Pentium®/
TM
and CrossFireXTM
English
6
Graphics
* Intel® HD Graphics Built-in Visuals and the VGA outputs can be supported only with processors which are GPU integrated.
•- Supports Intel® HD Graphics Built-in Visuals : Intel®
Quick Sync Video with AVC, MVC (S3D) and MPEG-2 Full HW Encode1, Intel® InTruTM 3D, Intel® Clear Video HD Technology, Intel® InsiderTM, Intel® HD Graphics 510/530
•Pixel Shader 5.0, DirectX 12
•Max. shared memory 1792MB
•Dual graphics output: Support DVI-D and HDMI ports by
independent display controllers
•Supports HDMI with max. resolution up to 4K x 2K
(4096x2304) @ 24Hz
H170 Pro4/D3
•Supports DVI-D with max. resolution up to 1920x1200 @
60Hz
•Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and
HBR (High Bit Rate Audio) with HDMI Port (Compliant HDMI monitor is required)
•Supports Accelerated Media Codecs: HEVC, VP8, VP9
•Supports HDCP with DVI-D and HDMI Ports
•Supports Full HD 1080p Blu-ray (BD) playback with DVI-D
and HDMI Ports
Audio
LAN
Rear Panel I/O
•7.1 CH HD Audio with Content Protection (Realtek ALC892
Audio Codec) * To congure 7.1 CH HD Audio, it is required to use an HD front panel audio module and enable the multi-channel audio feature through the audio driver.
•Premium Blu-ray Audio support
•Supports Surge Protection (ASRock Full Spike Protection)
•ELNA Audio Caps
•PCIE x1 Gigabit LAN 10/100/1000 Mb/s
•Rea ltek RTL8111GR
•S uppo rt s Wa ke-On-WAN
•Supports Wake-On-LAN
•Supports Lightning/ESD Protection (ASRock Full Spike
Protection)
•Supports LAN Cable Detection
•Supports Energy Ecient Ethernet 802.3az
•Supports PXE
•1 x PS/2 Mouse Port
•1 x PS/2 Keyboard Port
•1 x DVI-D Port
•1 x HDMI Port
•6 x USB 3.0 Ports (Supports ESD Protection (ASRock Full
Spike Protection))
•1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED
LE D)
English
7
•HD Audio Jacks: Line in / Front Speaker / Microphone
Storage
Connector
BIOS Feature
•6 x SATA3 6.0 Gb/s Connectors, support RAID (RAID 0,
RAID 1, RAID 5, RAID 10, Intel Rapid Storage Technology 14 and Intel Smart Response Technology), NCQ, AHCI and Hot Plug
•2 x SATA Express 10 Gb/s Connector
* Support to be announced*
•1 x COM Port Header
•1 x TPM Header
•1 x Power LED and Speaker Header
•1 x CPU Fan Connector (4-pin) (Smart Fan Speed Control)
•2 x Chassis Fan Connectors (1 x 4-pin, 1 x 3-pin) (Smart Fan
Speed Control)
•1 x 24 pin ATX Power Connector
•1 x 8 pin 12V Power Connector
•1 x Front Panel Audio Connector
•2 x USB 2.0 Headers (Support 4 USB 2.0 ports) (Supports
ESD Protection (ASRock Full Spike Protection))
•1 x USB 3.0 Header (Supports 2 USB 3.0 ports) (Supports
ESD Protection (ASRock Full Spike Protection))
•128Mb AMI UEFI Legal BIOS with multilingual GUI sup-
port
•ACPI 1.1 Compliant wake up events
•SMBIOS 2.3.1 Support
•CPU, GT_CPU, DRAM, VPPM, PCH 1.0V, VCCIO, VCCSA
Voltage Multi-adjustment
English
8
Hardware Monitor
•CPU/Chassis temperature sensing
•CPU/Chassis Fan Tachometer
•CPU/Chassis Quiet Fan (Auto adjust chassis fan speed by
CPU temperature)
•CPU/Chassis Fan multi-speed control
•Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore
H170 Pro4/D3
OS
•Microso® Windows® 10 64-bit / 8.1 64-bit / 7 32-bit / 7 64-
bit * To install Windows® 7 OS, a modied installation disk with xHCI drivers packed into the ISO le is required. Please refer to page 137 for more detailed instructions. * For the updated Windows® 10 driver, please visit ASRock's website for details: http://www.asrock.com
Certica­tions
* For detailed product information, please visit our website: http://www.asrock.com
Please realize that there is a certain risk involved with overclocking, including adjusting the setting in the BIOS , applying Untied Overclocking Technology, or using third-party overclocking tools. Overclocking may aect your system’s stability, or even cau se damage to the components and devices of your system. It should be done at your own r isk and expense. We are not responsible for possible damage caused by overclocking.
•FCC, CE, WHQL
•ErP/EuP ready (ErP/EuP ready power supply is required)
English
9
Chapter 2 Installation
is is an ATX form factor motherboard. Before you install the motherboard, study the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components or change any motherboard settings.
•Make sure to unplug the power cord before installing or removing the motherboard
components. Failure to do so may cause physical injuries and damages to motherboard components.
•In order to avoid damage from static electricity to the motherboard’s components,
NEVER place your motherboard directly on a carpet. Also remember to use a grounded wrist strap or touch a safety grounded object before you handle the components.
•Hold components by the edges and do not touch the ICs.
•Whenever you uninstall any components, place them on a grounded anti-static pad or
in the bag that comes with the components.
•When placing screws to secure the motherboard to the chassis, please do not over-
tighten the screws! Doing so may damage the motherboard.
English
10
2.1 Installing the CPU
1. Before you insert the 1151-Pin CPU into the socket, please check if the PnP cap is on the socket, if the CPU sur face is unclean, or if the re are any bent pins in the socket. Do not force to in sert the CPU into the socket if above situation is found. Otherwise, the CPU will be seriously damaged.
2. Unplug all power cables be fore installing the CPU.
1
H170 Pro4/D3
A
B
2
English
11
3
4
English
12
5
H170 Pro4/D3
Please save and replace the cover if the processor is removed. e cove r must be placed if you wish to return the motherboard for ae r service.
13
English
2.2 Installing the CPU Fan and Heatsink
1 2
English
14
FAN
CPU_
H170 Pro4/D3
2.3 Installing Memory Modules (DIMM)
is motherboard provides four 240-pin DDR3/DDR3L (Double Data Rate 3) DIMM slots, and supports Dual Channel Memory Technology.
1. For dual channel conguration, you always need to install identical (the same brand, speed , size and chip-type) DDR3/DDR3L DIMM pairs.
2. It is unable to activate Dual Channel Memory Technology with only one memory module installed.
3. It is not allowed to install a DDR or DDR2 memory module into a DDR3/DDR3L slot; otherwise, this motherboard and DI MM may be damaged..
Dual Channel Memory Conguration
Priority DDR3_A1 DDR3_A2 DDR3_B1 DDR3_B2
1 Populated Populated 2 Populated Populated 3 Populated Populated Populated Populated
e DIMM only ts in one correct orientation. It will cause permanent damage to the motherboard and the DIMM if you force the DIMM into the slot at incorrect orie ntation.
English
15
1
2
English
16
3
H170 Pro4/D3
2.4 Expansion Slots (PCI Express Slots)
ere are 5 PCI Express slots on the motherboard.
Before installing an expansion card, plea se make sure that the power supply is switched o or the power cord is unplugged. Please read the documentation of the expansion card and make necessary hardware settings for the card before you start the installation.
PCIe slots:
PCIE1 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards. PCIE2 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards. PCIE3 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards. PCIE4 (PCIe 3.0 x16 slot) is used for PCI Express x4 lane width graphics cards. PCIE5 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.
17
English
2.5 Jumpers Setup
e illustration shows how jumpers are setup. When the jumper cap is placed on the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper is “Open”. e illustration shows a 3-pin jumper whose pin1 and pin2 are “Short”
when a jumper cap is placed on these 2 pins.
Clear CMOS Jumper (C LR MOS 1) (see p.1, No. 8)
CLRMOS1 allows you to clear the data in CMOS. To clear and reset the system parameters to default setup, please turn o the computer and unplug the power cord from the power supply. Aer waiting for 15 seconds, use a jumper cap to short pin2 and pin3 on CLRMOS1 for 5 seconds. However, please do not clear the CMOS right aer you update the BIOS. If you need to clear the CMOS when you just nish updating the BIOS, you must boot up the system rst, and then shut it down before you do the clear-CMOS action. Please be noted that the password, date, time, and user default prole will be cleared only if the CMOS battery is removed.
Clear CMOSDefault
English
18
2.6 Onboard Headers and Connectors
Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over these heade rs and connectors. Placing jumper caps over the heade rs and connectors will cause permanent damage to the motherboard.
H170 Pro4/D3
System Panel Header (9-p in PA NEL1) (see p.1, No. 13)
PWRBTN (Power Switch):
Connec t to the power switch on the cha ssis front panel. You may congure the way to turn o your system using the power switch.
RESET (Reset Sw itch): Connec t to the reset switch on the cha ssis front panel. Press the reset switch to restart the computer if the computer freezes and fails to pe rform a normal restar t.
PLED (Syste m Power LED): Connec t to the power status indicator on the chassis front panel. e LED i s on when the system is operating. e LED keeps blinking when the system is in S1/S3 sleep state. e LED is o when the system is in S4 sleep state or powered o (S5).
HDLED (Ha rd Drive Activity LED): Connec t to the hard drive activity LED on the cha ssis front panel. e LED is on when the hard drive is reading or writing data.
e front panel design may dier by chassis. A f ront panel module mainly consists of power switch, reset switch, power LED, hard drive activity LED, speaker and etc . When connect­ing your chassis front panel module to this header, make sure the wire assignments and the pin assignment s are matched cor rectly.
1
PLED+
PLED-
HDLED-
HDLED+
PWRBTN#
GND
RESET#
GND
GND
Connect the power switch, reset switch and system status indicator on the chassis to this header according to the pin assignments below. Note the positive and negative pins before connecting the cables.
19
English
Power LED and Speaker
PLED-
Header (7-pin SPK_PLED1) (see p.1, No. 16)
DUMMY +5V
1
PLED+
SPEAKER
DUMMY
PLED+
Please connect the chassis power LED and the chassis speaker to this header.
English
Serial ATA3 Connectors (SATA3_0_ 2) (see p.1, No. 10) (SATA 3_1_3) (see p.1, No. 11)
(SATA3_4) (see p.1, No. 14) (SATA3_5) (see p.1, No. 15)
Serial ATA Express Connectors (SATA_E _12: see p.1, No. 12)
USB 2.0 Headers (9-pin USB2_3) (see p.1, No. 17) (9-pin USB4_5) (see p.1, No. 18)
USB_PWR
1
USB_PWR
SATA3_2
SATA3_3
SATA3_4
SATA3_5
SATA3_0
SATA3_1
SATA_E_1
-B +B
+A
-A
GND
GND
SATA3_2
SATA3_3
SATA_E_2
DUMMY
ese six SATA3 connectors support SATA data cables for internal
SATA3_0
storage devices with up to
6.0 Gb/s data transfer rate.
SATA3_1
Please connect either SATA or PCIe storage devices to these connectors.
ere are two headers on this motherboard. Each USB 2.0 header can support two ports.
20
H170 Pro4/D3
GND
GND
USB 3.0 Header (19-pin USB3_4_5) (see p.1, No. 7)
Front Panel Audio Header (9-pin HD_AU DIO1) (see p.1, No. 21)
1. High Denition Audio supports Jack Sensing, but the panel wire on the chas sis must sup­port HDA to function correctly. Please follow the instructions in our manual and chassis manual to install your system.
2. If you use an AC’97 audio panel, please install it to the front panel audio heade r by the steps below: A. Connect Mic_ IN (MIC) to MIC2_L. B. Conne ct Audio_R (RIN) to OUT2_R and Audio_L (LIN) to OUT2_L. C. Connect Ground (GND) to Ground (GND). D. MIC_ RET and OUT_RET are for the HD audio panel only. You don’t need to connect them for the AC’97 audio panel. E. To activate the front mic, go to the “FrontMic” Tab in the Realtek Control panel and adjust “Recording Volume”.
IntA_PA_D+
1
IntA_PB_D+
Dummy
IntA_PA_D-
GND
IntA_PA_SSTX+
GND
IntA_PB_D-
GND
1
MIC2_L
IntA_PA_SSTX-
GND
IntA_PA_SSRX+
IntA_PA_SSRX-
IntA_PB_SSRX+
GND
IntA_PB_SSTX-
IntA_PBA_SSTX+
PRESENCE#
MIC_RET
OUT_RET
OUT2_L
J_SENSE
OUT2_R
MIC2_R
Vbus
Vbus
IntA_PB_SSRX-
Besides four USB 3.0 ports on the I/O panel, there is one header on this motherboard. Each USB
3.0 header can support two ports.
is header is for connecting audio devices to the front audio panel.
Chassis Fan Connectors (4-pin CHA_FAN1) (see p.1, No. 9)
(3-pin CHA_ FAN2) (see p.1, No. 3)
FAN_VOLTAGE
CHA_FAN_SPEED
FAN_SPEED_CONTROL
FAN_VOLTAGE
CHA_FAN_SPEED
Please connect fan cables to the fan connector and match the black wire to the ground pin.
English
21
CPU Fan Connector
FAN_VOLTAGE
(4-pin CPU_FAN1) (see p.1, No. 2)
GND
1 2 3 4
CPU_FAN_SPEED
FAN_SPEED_CONTROL
is motherboard pro­vides a 4-Pin CPU fan (Quiet Fan) connector. If you plan to connect a 3-Pin CPU fan, please connect it to Pin 1-3.
English
ATX Power Connector (24-pin AT XPW R1) (see p.1, No. 6)
ATX 12V Power Connector (8-pin ATX12V1) (see p.1, No. 1)
Serial Port Header (9-pin COM1) (see p.1, No. 19)
TPM Header (17-pi n TPMS1) (see p.1, No. 20)
GN D
D
GN
1
+3V S B
SER IRQ #
S_P WRD WN #
1
12
8 5
4 1
RRXD1
DDTR#1
DDSR#1
CCTS#1
RRTS#1
GND
TTXD1
DDCD#1
LAD 0
LAD 3
+3 V
GN D
LAD 1
LAD 2
13
24
RRI#1
PC IRS T #
SMB _DA TA_ MAI N
is motherboard pro­vides a 24-pin ATX power connector. To use a 20-pin ATX power supply, please plug it along Pin 1 and Pin
13.
is motherboard pro­vides a 8-pin ATX 12V power connector.
e COM1 header supports a serial port module.
is connector supports Trusted
PC ICL K
FRA M E
Platform Module (TPM) system, which can securely store keys,
1
digital certicates, passwords,
GN D
and data. A TPM system also helps enhance network security, protects digital identities, and
SMB _CL K_M AIN
ensures platform integrity.
22
H170 Pro4/D3
1 Einleitung
Vielen Dank, dass Sie sich für das H170 Pro4/D3 von ASRock entschieden haben – ein zuverlässiges Motherboard, das konsequent unter der strengen Qualitätskontrolle von ASRock hergestellt wurde. Es liefert ausgezeichnete Leistung mit robustem Design, das ASRocks Streben nach Qualität und Beständigkeit erfüllt.
Da die technischen Daten des Motherboards sowie die BIOS-Soware aktualisiert werden können, kann der Inhalt dieser Dokumentation ohne Ankündigung geändert werden. Falls diese Dokumentation irgendwelchen Änderungen unterliegt, wird die aktualisierte Version ohne weitere Hinweise auf der ASRock-Webseite zur Verfügung gestellt. Sollten Sie technische Hilfe in Bezug auf dieses Motherboard benötigen, erhalten Sie auf unserer Webseite spezischen Informationen über das von Ihnen verwendete Modell. Auch nden Sie eine aktuelle Liste unterstützter VGA-Karten und Prozessoren auf der ASRock-Webseite: ASRock-Website http://www.asrock.com.
1.1 Lieferumfang
•ASRock H170 Pro4/D3-Motherboard (ATX-Formfaktor)
•ASRock H170 Pro4/D3-Schnellinstallationsanleitung
•ASRock H170 Pro4/D3-Support-CD
•2 x Serial-ATA- (SATA) Datenkabel (optional)
•1 x E/A-Blendenabschirmung
23
Deutsch
1.2 Technische Daten
Plattform
Prozessor
Chipsatz
Speicher
Erweiter­ungssteck­platz
•ATX-Formfaktor
•Feststoondensator-Design
•Leiterplatte mit hochdichtem Glasgewebe
•Unterstützt die Prozessoren Intel® Core
Celeron® der 6. Generation (Sockel 1151)
•Unterstützt Intel® Turbo Boost 2.0-Technologie
•Intel® H170
•Unterstützt Intel® Small Business Advantage 4.0
•Dualkanal-DDR3/DDR3L-Speichertechnologie
•4 x DDR3/DDR3L-DIMM-Steckplätze
•Unterstützt DDR3/DDR3L 1600/1333/1066 non-ECC,
ungepuerter Speicher
•Systemspeicher, max. Kapazität: 64GB
•Unterstützt Intel® Extreme Memory Prole (XMP) 1.3/1.2
•2 x PCI-Express 3.0-x16-Steckplätze (PCIE2:x16-Modus;
PCIE4:x4-Modus)
•3 x PCI-Express 3.0-x1-Steckplätze (Flexible PCIe)
•Unterstützt AMD Quad CrossFireX
TM
i7/i5/i3/Pentium®/
TM
und CrossFireXTM
Deutsch
24
Grakkarte
* Integrierte Intel® HD Graphics-Visualisierung und VGA­Ausgänge können nur mit Prozessoren unterstützt werden, die GPU-integriert sind.
•- Unterstützt integrierte Intel® HD Graphics-Visualisierung:
Intel® Quick Sync Video mit AVC, MVC (S3D) und MPEG­2 Full HW Encode1, Intel® InTruTM 3D, Intel® Clear Video HD Technology, Intel® InsiderTM, Intel® HD Graphics 510/530
•Pixel Shader 5.0, DirectX 12
•Max. geteilter Speicher: 1792 MB
•Dualer Grakkartenausgang Unterstützt DVI-D- und HDMI-
Ports durch unabhängige Monitor-Controller
•Unterstützt HDMI mit maximaler Auösung von 4K x 2K
(4096 x 2304) bei 24 Hz
H170 Pro4/D3
•Unterstützt DVI-D mit maximaler Auösung von 1920 x 1200
bei 60 Hz
•Unterstützt Auto-Lippensynchronizität, hohe Farbtiefe (12
bpc), xvYCC und HBR (Audio mit hoher Bitrate) mit HDMI­Port (konformer HDMI-Monitor erforderlich)
•Unterstützt beschleunigte Mediencodecs: HEVC, VP8, VP9
•Unterstützt HDCP mit DVI-D- und HDMI-Ports
•Unterstützt Blu-ray- (BD) Wiedergabe (Full HD/1080p) mit
DVI-D- und HDMI-Ports
Audio
LAN
Rückblende, E/A
•7.1-Kanal-HD-Audio mit Inhaltsschutz (Realtek
ALC892-Audiocodec) *Zur Konguration von 7.1-Kanal-HD-Audio müssen Sie ein HD-Frontblenden-Audiomodul nutzen und den Mehrkanalton über den Audiotreiber aktivieren.
•Erstklassige Blu-ray-Audiounterstützung
•Unterstützt Überspannungsschutz (ASRock Full Spike
Protection)
•ELNA-Audiokondensatoren
•PCIE x1 Gigabit LAN 10/100/1000 Mb/s
•Realtek RTL8111GR
•Unterstützt Wake-On-WAN
•Unterstützt Wake-On-LAN
•Unterstützt Blitzschutz/Schutz gegen elektrostatische
Entladung (ASRock Full Spike Protection)
•Unterstützt LAN-Kabelerkennung
•Unterstützt energieezientes Ethernet 802.3az
•Unterstützt PXE
•1 x PS/2-Mausanschluss
•1 x PS/2-Tastaturanschluss
•1 x DVI-D-Port
•1 x HDMI-Port
•6 x USB 3.0-Ports (unterstützt Schutz gegen elektrostatische
Entladung (ASRock Full Spike Protection))
Deutsch
25
•1 x RJ-45-LAN-Port mit LED (Aktivität/Verbindung-LED und
Geschwindigkeit-LED)
•HD-Audioanschlüsse: Line-in / Vorderer Lautsprecher /
Mikrofon
Deutsch
Speicher
Anschluss
BIOS­Funktion
•6 x SATA-III-6,0-Gb/s-Anschlüsse, unterstützt RAID (RAID 0,
RAID 1, RAID 5, RAID 10, Intel Rapid Storage Technology 14 und Intel Smart Response Technology), NCQ, AHCI und Hot­Plugging
•2 x SATA-Express-10-Gb/s-Anschluss*
* Anzukündigende Unterstützung
•1 x COM-Anschluss-Stileiste
•1 x TPM-Stileiste
•1 x Betrieb-LED- und Lautsprecher-Stileiste
•1 x CPU-Lüeranschluss (4-polig) (intelligente
Lüergeschwindigkeitssteuerung)
•2 x Gehäuselüeranschlüsse (1 x 4-polig, 1 x 3-polig)
(intelligente Lüergeschwindigkeitssteuerung)
•1 x 24-poliger ATX-Netzanschluss
•1 x 8-poliger 12-V-Netzanschluss
•1 x Audioanschluss an Frontblende
•2 x USB 2.0-Stileisten (unterstützen 4 USB 2.0-Ports)
(unterstützt Schutz gegen elektrostatische Entladung (ASRock Full Spike Protection))
•1 x USB 3.0-Stileiste (unterstützt 2 USB 3.0-Ports)
(unterstützt Schutz gegen elektrostatische Entladung (ASRock Full Spike Protection))
•128-Mb-AMI-UEFI-Legal-BIOS mit Unterstützung
mehrsprachiger grascher Benutzerschnittstellen
•ACPI 1.1-konforme Aufweckereignisse
•SMBIOS 2.3.1-Unterstützung
•CPU, GT_CPU, DRAM, VPPM, PCH 1,0V, VCCIO, VCCSA
Mehrfachspannungsanpassung
26
H170 Pro4/D3
Hard­wareüberwa­chung
•CPU-/Gehäusetemperaturerkennung
•CPU-/Gehäuselüertachometer
•Lautloser CPU-/Gehäuselüer (automatische Anpassung der
Gehäuselüergeschwindigkeit durch CPU-Temperatur)
•CPU-/Gehäuselüer-Mehrfachgeschwindigkeitssteuerung
•Spannungsüberwachung: +12 V, +5 V, +3,3 V, CPU Vcore
Betriebssys­tem
•Microso® Windows® 10, 64 Bit / 8.1, 64 Bit / 7, 32 Bit / 7, 64
Bit * Zur Installation des Windows® 7-Betriebssystems wird ein modiziertes Installationslaufwerk mit xHCI-Treibern in der ISO­Datei benötigt. Detaillierte Anweisungen nden Sie auf Seite 137. * Einzelheiten zum aktualisierten Windows® 10-Treiber entnehmen Sie bitte der ASRock-Webseite: http://www.asrock.com
Zerti­zierungen
* Detaillierte Produktinformationen nden Sie auf unserer Webseite: http://www.asrock.com
Bitte beachten Sie, dass mit einer Übertaktung, zu der die Anpassung von BIOS-Einstellungen, die Anwendung der Untied Overclocking Technology oder die Nutzung von Übertaktung­swerkzeugen von Drittanbietern zählen, bestimmte Risiken verbunden sind. Eine Übertaktung kann sich auf die Stabilität Ihres Systems auswirken und sogar Komponenten und Geräte Ihres Systems beschädigen. Sie sollte auf eigene Gefahr und eigene Kosten durchgeführt werden. Wir übernehmen keine Verantwortung für mögliche Schäden, die durch eine Übertaktung verur­sacht wurden.
•FCC, CE, WHQL
•ErP/EuP ready (ErP/EuP ready-Netzteil erforderlich)
27
Deutsch
1.3 Jumpereinstellung
Die Abbildung zeigt, wie die Jumper eingestellt werden. Wenn die Jumper-Kappe auf den Kontakten angebracht ist, ist der Jumper „kurzgeschlossen“. Wenn keine Jumper­Kappe auf den Kontakten angebracht ist, ist der Jumper „oen“. Die Abbildung zeigt einen 3-poligen Jumper, dessen Kontakt 1 und Kontakt 2 „kurzgeschlossen“ sind, wenn eine Jumper-Kappe auf diesen 2 Kontakten angebracht ist.
CMOS-löschen-Jumper (CLRMOS1) (siehe S. 1, Nr. 8)
CLRMOS1 ermöglicht Ihnen die Löschung der Daten im CMOS. Zum Löschen und Rücksetzen der Systemparameter auf die Standardeinrichtung schalten Sie den Computer bitte ab und ziehen das Netzkabel aus der Steckdose. Warten Sie 15 Sekunde, schließen Sie dann Kontakt 2 und Kontakt 3 an CLRMOS1 5 Sekunden lang mit einer Jumper-Kappe kurz. Löschen Sie den CMOS jedoch nicht direkt nach der BIOS-Aktualisierung. Falls Sie den CMOS direkt nach Abschluss der BIOS­Aktualisierung löschen müssen, starten Sie das System zunächst; fahren Sie es dann vor der CMOS-Löschung herunter. Bitte beachten Sie, dass Kennwort, Datum, Zeit und Benutzerstandardprol nur gelöscht werden, wenn die CMOS-Batterie entfernt wird.
CMOS löschenStandard
Deutsch
28
Loading...
+ 112 hidden pages