Asrock H170 Pro4/D3 User Manual

H170 Pro4/D3

User Manual

Version 1.0

Published July 2015

Copyright©2015 ASRock INC. All rights reserved.

Version 1.0

Published July 2015

Copyright©2015 ASRock INC. All rights reserved.

Copyright Notice:

No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.

Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to

infringe.

Disclaimer:

Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.

With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.

In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.

is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that

may cause undesired operation.

CALIFORNIA, USA ONLY

e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/
perchlorate”

ASRock Website: http://www.asrock.com

e terms HDMI™ and HDMI High-Denition Multimedia Interface, and the HDMI
logo are trademarks or registered trademarks of HDMI Licensing LLC in the United
States and other countries.

Contents

Chapter 1 Introduction 1

1.1 Package Contents 1

1.2 Specications 2

1.3 Motherboard Layout 6

1.4 I/O Panel 8

Chapter 2 Installation 10

2.1 Installing the CPU 11

2.2 Installing the CPU Fan and Heatsink 14

2.3 Installing Memory Modules (DIMM) 15

2.4 Expansion Slots (PCI Express Slots) 17

2.5 Jumpers Setup 18

2.6 Onboard Headers and Connectors 19

2.7 CrossFireXTM and Quad CrossFireXTM Operation Guide 24

2.7.1 Installing Two CrossFireXTM-Ready Graphics Cards 24

2.7.2 Driver Installation and Setup 26

Chapter 3 Software and Utilities Operation 27

3.1 Installing Drivers 27

3.2 A-Tuning 28

3.2.1 Installing A-Tuning 28

3.2.2 Using A-Tuning 28

3.3 ASRock Live Update & APP Shop 32

3.3.1 UI Overview 32

3.3.2 Apps 33

3.3.3 BIOS & Drivers 36

3.3.4 Setting 37

3.4 Enabling USB Ports for Windows® 7 Installation 38

Chapter 4 UEFI SETUP UTILITY 41

4.1 Introd ucti on 41

4.1.1 UEFI Menu Bar 41

4.1.2 Navigation Keys 42

4.2 Main Screen 43

4.3 OC Tweaker Screen 44

4.4 Advanced Screen 52

4.4.1 CPU Conguration 53

4.4.2 Chipset Conguration 55

4.4.3 Storage Conguration 57

4.4.4 Super IO Conguration 58

4.4.5 ACPI Conguration 59

4.4.6 USB Conguration 61

4.4.7 Trusted Computing 62

4.5 Tools 63

4.6 Hardware Health Event Monitoring Screen 67

4.7 Security Screen 68

4.8 Boot Screen 69

4.9 Exit Screen 72

H170 Pro4/D3

Chapter 1 Introduction

ank you for purchasing ASRock H170 Pro4/D3 motherboard, a reliable

motherboard produced under ASRock ’s consistently stringent qualit y control.

It delivers excellent performance with robust design conforming to ASRock’s

commitment to quality and endurance.

In this documentation, Chapter 1 and 2 contains the introduction of the

motherboard and step-by-step installation guides. Chapter 3 contains the operation

guide of the soware and utilities. Chapter 4 contains the conguration guide of

the BIOS setup.

Becau se the motherboard speci cations and the BIOS soware might be updated, the
content of this doc umentation will be subject to change without notice. In case any modi­cations of this documentation occur, the updated version will be available on ASRock’s
website w ithout further notice . If you require technical suppor t related to this mother­board, please v isit our website for specic information about the model you are using. You
may nd the l atest VGA cards and CPU support list on ASRock’s website as well. ASRock
website http://www.asrock.com.

1.1 Package Contents

• ASRock H170 Pro4/D3 Motherboard (ATX Form Factor)

• ASRock H170 Pro4/D3 Quick Installation Guide

• ASRock H170 Pro4/D3 Support CD

• 2 x Serial ATA (SATA) Data Cables (Optional)

• 1 x I/O Panel Shield

English

1.2 Specications

Platform

CPU

Chipset

Memory

Expansion
Slot

• ATX Form Factor

• Solid Capacitor design

• High Density Glass Fabric PCB

• Supports 6th Generation Intel® CoreTM i7/i5/i3/Pentium®/

Celeron® Processors (Socket 1151)

• Supports Intel® Turbo Boost 2.0 Technology

• Intel® H170

• Supports Intel® Small Business Advantage 4.0

• Dual Channel DDR3/DDR3L Memory Technology

• 4 x DDR3/DDR3L DIMM Slots

• Supports DDR3/DDR3L 1600/1333/1066 non-ECC, un-

buered memory

• Supports ECC UDIMM memory modules (operate in non-

ECC mo de)

• Max. capacity of system memory: 64GB

• Supports Intel® Extreme Memory Prole (XMP) 1.3 / 1.2

• 2 x PCI Express 3.0 x16 Slots (PCIE2: x16 mode; PCIE4: x4

mode)

• 3 x PCI Express 3.0 x1 Slots (Flexible PCIe)

• Supports AMD Quad CrossFireXTM and CrossFireXTM

Graphics

English

* Intel® HD Graphics Built-in Visuals and the VGA outputs can

be supported only with processors which are GPU integrated.

• - Supports Intel® HD Graphics Built-in Visuals : Intel®

Quick Sync Video with AVC, MVC (S3D) and MPEG-2 Full

HW Encode1, Intel® InTruTM 3D, Intel® Clear Video HD

Technology, Intel® InsiderTM, Intel® HD Graphics 510/530

• Pixel Shader 5.0, DirectX 12

• Max. shared memory 1792MB

• Dual graphics output: Support DVI-D and HDMI ports by

independent display controllers

2 3

H170 Pro4/D3

• Supports HDMI with max. resolution up to 4K x 2K

(4096x2304) @ 24Hz

• Supports DVI-D with max. resolution up to 1920x1200 @

60Hz

• Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and

HBR (High Bit Rate Audio) with HDMI Port

(Compliant HDMI monitor is required)

• Supports Accelerated Media Codecs: HEVC, VP8, VP9

• Supports HDCP with DVI-D and HDMI Ports

• Supports Full HD 1080p Blu-ray (BD) playback with DVI-D

and HDMI Ports

Audio

LAN

Rear Panel
I/O

• 7.1 CH HD Audio with Content Protection (Realtek ALC892

Audio Codec)

* To congure 7.1 CH HD Audio, it is required to use an HD

front panel audio module and enable the multi-channel audio

feature through the audio driver.

• Premium Blu-ray Audio support

• Supports Surge Protection (ASRock Full Spike Protection)

• ELNA Audio Caps

• PCIE x1 Gigabit LAN 10/100/1000 Mb/s

• R ea ltek RTL8111GR

• S uppo rt s Wa ke-On-WAN

• Supports Wake-On-LAN

• Supports Lightning/ESD Protection (ASRock Full Spike

Protection)

• Supports LAN Cable Detection

• Supports Energy Ecient Ethernet 802.3az

• Supports PXE

• 1 x PS/2 Mouse Port

• 1 x PS/2 Keyboard Port

• 1 x DVI-D Port

• 1 x HDMI Port

English

• 6 x USB 3.0 Ports (Supports ESD Protection (ASRock Full

Spike Protection))

• 1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED

LED)

• HD Audio Jacks: Line in / Front Speaker / Microphone

Storage

Connector

BIOS
Feature

• 6 x SATA3 6.0 Gb/s Connectors, support RAID (RAID 0,

RAID 1, RAID 5, RAID 10, Intel Rapid Storage Technology

14 and Intel Smart Response Technology), NCQ, AHCI and

Hot Plug

• 2 x SATA Express 10 Gb/s Connectors*

* Support to be announced

• 1 x COM Port Header

• 1 x TPM Header

• 1 x Power LED and Speaker Header

• 1 x CPU Fan Connector (4-pin)

• 2 x Chassis Fan Connectors (1 x 4-pin, 1 x 3-pin)

* e CPU Fan Connector supports the CPU fan of maxi-

mum 1A (12W) fan power.

• 1 x 24 pin ATX Power Connector

• 1 x 8 pin 12V Power Connector

• 1 x Front Panel Audio Connector

• 2 x USB 2.0 Headers (Support 4 USB 2.0 ports) (Supports

ESD Protection (ASRock Full Spike Protection))

• 1 x USB 3.0 Header (Supports 2 USB 3.0 ports) (Supports

ESD Protection (ASRock Full Spike Protection))

• 128Mb AMI UEFI Legal BIOS with multilingua l GUI sup-

port

• ACPI 1.1 Compliant wake up events

• SMBIOS 2.3.1 Support

• CPU, GT_CPU, DRAM, VPPM, PCH 1.0V, VCCIO, VCCSA

Voltage Multi-adjustment

English

4 5

H170 Pro4/D3

Hardware
Monitor

• CPU/Chassis temperature sensing

• CPU/Chassis Fan Tachometer

• CPU/Chassis Quiet Fan (Auto adjust chassis fan speed by

CPU temperature)

• CPU/Chassis Fan multi-speed control

• Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore

OS

• Microso® Windows® 10 64-bit / 8.1 64-bit / 7 32-bit / 7 64-

bit

* To install Windows® 7 OS, a modied installation disk with

xHCI drivers packed into the ISO le is required. Please refer to

page 38 for more detailed instructions.

* For the updated Windows® 10 driver, please visit ASRock's

website for details: http://www.asrock.com

Certica­tions

* For detailed product information, please visit our website: http://www.asrock .com

Please realize that there i s a certain risk involved with overclocking, including adjusting
the setting in the BIOS , applying Untied Overclocking Technology, or using third-party
overclocking tools. Ove rclocking may aect your system’s stabilit y, or even cau se damage to
the components and devices of your system. It should be done at your own r isk and expense.
We are not responsible for possible damage caused b y overclocking.

• FCC, CE, WHQL

• ErP/EuP ready (ErP/EuP ready power supply is required)

English

Intel

H170

DDR 3_A2 (6 4 bit, 24 0-pin m odule )

DDR 3_A1 (6 4 bit, 24 0-pin m odule )

DDR 3_B2 (6 4 bit, 24 0-pin m odule )

DDR 3_B1 (6 4 bit, 24 0-pin m odule )

ATX12V1

CMOS

Battery

Supe r

I/O

ATXPWR1

1

USB3_4_5

LAN

Top:
RJ-45

USB 3.0
T: USB4
B: USB5

CLRCMOS1

1

HDLED RESET

PLED PWRBTN

PANEL1

1

USB2_3

1

COM1

1

1

HD_AUDIO1

H170 Pro4/D3

SATA3_1_ 3 SATA3_0_2

PCIE5

RoHS

7

8

9

10

17

19

11

12

15

20

18

2

CPU_FAN1

3

4

6

5

1

128Mb

BIOS

USB 3.0
T: USB0
B: USB1

Audio

CODEC

PCIE2

PCI Express 3.0

Front USB 3.0

CHA_FAN2

HDM I1

DVI 1

USB 3.0
T: USB2
B: USB3

CHA_FAN1

SATA3_5

USB4_5

1

TPMS1

1

SATA3_4

14

16

Top:

LINE IN

Center :

FRONT

Bottom :

MIC IN

PS2

Keyb oard

PS2

Mous e

PCIE1

PCIE4

PCIE3

1

SPK_PLED1

21

SATA_E_1 2

13

1.3 Motherboard Layout

English

6 7

No. Description

1 ATX 12V Power Connector (ATX12V1)

2 CPU Fan Connector (CPU_FAN1)

3 Chassis Fan Connector (CHA_FAN2)

4 2 x 240-pin DDR3/DDR3L DIMM Slots (DDR3_A1, DDR3_B1)

5 2 x 240-pin DDR3/DDR3L DIMM Slots (DDR3_A2, DDR3_B2)

6 ATX Power Connector (ATXPWR1)

7 USB 3.0 Header (USB3_4_5)

8 Clear CMOS Jumper (CLRMOS1)

9 Chassis Fan Connector (CHA_FAN1)

10 SATA3 Connectors (SATA3_0_2)

11 SATA3 Connectors (SATA3_1_3)

12 SATA Express Connectors (SATA_E_12)

13 System Panel Header (PANEL1)

14 SATA3 C onnec tor (SATA3_4)

15 SATA3 Connector (SATA3_5)

16 Power LED and Speaker Header (SPK_PLED1)

17 USB 2.0 Header (USB2_3)

18 USB 2.0 Header (USB4_5)

19 COM Port Header (COM1)

20 TPM Header (TPMS1)

21 Front Panel Audio Header (HD_AUDIO1)

H170 Pro4/D3

English

1.4 I/O Panel

2

3

1

4

11

10

9

8

7

6

No. Description No. Description

1 PS/2 Mouse Port (Green) 7 USB 3.0 Ports (USB3_23)

2 LAN RJ-45 Port* 8 USB 3.0 Ports (USB3_01)

3 Line In (Light Blue)** 9 HDMI Port

4 Front Speaker (Lime)** 10 DVI-D Port

5 Microphone (Pink)** 11 PS/2 Keyboard Port (Purple)

6 USB 3.0 Ports (USB3_45)

* ere are two LEDs on each LAN port. Plea se refer to the table below for the LAN port LED indications.

ACT/LINK LED

SPEED LED

LAN Por t

Activity / Link LED Speed LED

Status Description Status Description

O No Link O 10Mbps connection
Blinking Data Activity Orange 100Mbps connection
On Link Green 1Gbps connection

5

English

8 9

H170 Pro4/D3

** To congure 7.1 CH HD Audio, it i s required to use an HD front panel audio module and enable the multi­channel audio feature through the audio driver.

Please set Speaker Cong uration to “7.1 Speaker” in the Realte k HD Audio Manager.

Function of the Audio Ports in 7.1-channel Conguration:

Port Function

Light Blue (Rear panel) Rear Speaker Out
Lime (Rear panel) Front Speaker Out
Pink (Rear panel) Central /Subwoofer Speaker Out
Lime (Front panel) Side Speaker Out

English

Chapter 2 Installation

is is an ATX form factor motherboard. Before you install the motherboard, study

the conguration of your chassis to ensure that the motherboard ts into it.

Pre-installation Precautions

Take note of the following precautions before you install motherboard components

or change any motherboard settings.

• Make sure to unplug the power cord before installing or removing the motherboard

components. Failure to do so may cause physical injuries and damages to motherboard

components.

• In order to avoid damage from static electricity to the motherboard’s components,

NEVER place your motherboard directly on a carpet. Also remember to use a grounded

wrist strap or touch a safety grounded object before you handle the components.

• Hold components by the edges and do not touch the ICs.

• Whenever you uninstall any components, place them on a grounded anti-static pad or

in the bag that comes with the components.

• When placing screws to secure the motherboard to the chassis, please do not over-

tighten the screws! Doing so may damage the motherboard.

English

10 11

2.1 Installing the CPU

1. Before you insert the 1151-Pin CPU into the socket , please check if the PnP cap is on the
socket, if the CPU sur face is unclean, or if the re are any bent pins in the socket . Do not
force to in sert the CPU into the socket if above situation is found. Otherwise, the CPU
will be seriously damaged.

2. Unplug all power c ables be fore installing the CPU.

1

H170 Pro4/D3

A

B

2

English

3

4

5

English

12 13

Please save and replace the cover if the processor is remove d. e cove r must be placed if
you wish to return the motherboard for ae r service.

H170 Pro4/D3

English

2.2 Installing the CPU Fan and Heatsink

1 2

FAN

CPU_

English

14 15

H170 Pro4/D3

2.3 Installing Memory Modules (DIMM)

is motherboard provides four 240-pin DDR3/DDR3L (Double Data Rate 3)

DIMM slots, and supports Dual Channel Memory Technology.

1. For dual channel conguration, you always need to install identical (the same brand,
speed , size and chip-type) DDR3/DDR3L DIMM pairs.

2. It is unable to activate Dual Channel Memory Technology with only one memory module
installed.

3. It is not allowed to install a DDR or DDR2 memory module into a DDR3/DDR 3L slot;
otherwise, this mothe rboard and DI MM may be damaged..

Dual Channel Memory Conguration

Priority DDR3_A1 DDR3_A2 DDR3_B1 DDR3_B2

1 Populated Populated
2 Populated Populated
3 Populated Populated Populated Populated

e DIMM only ts in one correct orientation. It wil l cause permane nt damage to the
motherboard and the DIMM if you force the DIMM into the slot at incorrect orie ntation.

English

1

2

3

English

16 17

2.4 Expansion Slots (PCI Express Slots)

ere are 5 PCI Express slots on the motherboard.

Before installing an expansion card, plea se make sure that the power supply is sw itched o
or the power cord is unplugged. Please read the d ocumentation of the expansion card and
make necessary hardware settings for the card before you start the installation.

PCIe slots:

PCIE1 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.

PCIE2 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards.

PCIE3 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.

PCIE4 (PCIe 3.0 x16 slot) is used for PCI Express x4 lane width graphics cards.

PCIE5 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards.

H170 Pro4/D3

English

2.5 Jumpers Setup

e illustration shows how jumpers are setup. When the jumper cap is placed on

the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper

is “Open”. e illustration shows a 3-pin jumper whose pin1 and pin2 are “Short”

when a jumper cap is placed on these 2 pins.

Clear CMOS Jumper

(CLR MOS1)

(see p.6, No. 8)

CLRMOS1 allows you to clear the data in CMOS. To clear and reset the system

parameters to default setup, please turn o the computer and unplug the power

cord from the power supply. Aer waiting for 15 seconds, use a jumper cap to

short pin2 and pin3 on CLRMOS1 for 5 seconds. However, please do not clear the

CMOS right aer you update the BIOS. If you need to clear the CMOS when you

just nish updating the BIOS, you must boot up the system rst, and then shut it

down before you do the clear-CMOS action. Please be noted that the password,

date, time, and user default prole will be cleared only if the CMOS batter y is

removed.

Clear CMOSDefault

English

18 19

2.6 Onboard Headers and Connectors

Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over these
heade rs and connectors. Placing jumper caps over the heade rs and connectors will cause
permanent damage to the motherboard.

H170 Pro4/D3

System Panel Header

(9-p i n PA NE L1)

(see p.6, No. 13)

PWRBTN (Power Switch):

Connec t to the power switch on the cha ssis front panel. You may congure the way to turn
o your system using the power switch.

RESET (Reset Sw itch):
Connec t to the reset switch on the cha ssis front panel. Press the reset switch to restart the
computer if the computer freezes and fails to pe rform a normal restar t.

PLED (Syste m Power LED):
Connec t to the power status indicator on the ch assis front panel. e LED i s on when the
system is operating. e LED keeps blinking when the system is in S1/S3 sleep state. e
LED is o when the system is in S4 sleep state or powered o (S5).

HDLED (Ha rd Drive Activity LED):
Connec t to the hard drive ac tivity LED on the cha ssis front panel. e LED is on when the
hard drive is reading or writing data.

e front panel des ign may dier by cha ssis. A f ront panel modul e mainly consists of power
switch, reset switch, power LED, hard drive ac tivity LED, speak er and etc . When connect­ing your ch assis front panel module to this header, make sure the wire assignments and the
pin assignment s are matched cor rectly.

1

PLED+

PLED-

HDLED-

HDLED+

PWRBTN#

GND

RESET#

GND

GND

Connect the power

switch, reset switch and

system status indicator on

the chassis to this header

according to the pin

assignments below. Note

the positive and negative

pins before connecting

the cables.

English