Asrock H110M-GL/D3 User Manual

Version 1.1
Published September 2015
Copyright©2015 ASRock INC. All rights reserved.
Copyright Notice:
No part of this documentation may be reproduced, transcribed, transmitted, or translated in any language, in any form or by any means, except duplication of documentation by the purchaser for backup purpose, without written consent of ASRock Inc.
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for informational use only and subject to change without notice, and should not be constructed as a commitment by ASRock. ASRock assumes no responsibility for any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide warranty of any kind, either expressed or implied, including but not limited to the implied warranties or conditions of merchantability or tness for a particular purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for any indirect, special, incidenta l, or consequential damages (including damages for loss of prots, loss of business, loss of data, interruption of business and the like), even if ASRock has been advised of the possibility of such damages arising from any defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance controlled in Perchlorate Best Management Practices (BMP) regulations passed by the California Legislature. When you discard the Lithium battery in California, USA, please follow the related regulations in advance. “Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/ perchlorate”
ASRock Website: http://www.asrock.com
Contents
Chapter 1 Introduction 1
1.1 Package Contents 1
1.2 Specications 2
1.3 Motherboard Layout 5
1.4 I/O Panel 7
Chapter 2 Installation 9
2.1 Installing the CPU 10
2.2 Installing the CPU Fan and Heatsink 13
2.3 Installing Memory Modules (DIMM) 14
2.4 Expansion Slots (PCI Express Slots) 16
2.5 Jumpers Setup 17
2.6 Onboard Headers and Connectors 18
Chapter 3 Software and Utilities Operation 22
3.1 Installing Drivers 22
3.2 ASRock Live Update & APP Shop 23
3.2.1 UI Overview 23
3.2.2 Apps 24
3.2.3 BIOS & Drivers 27
3.2.4 Setting 28
3.3 Enabling USB Ports for Windows® 7 Installation 29
Chapter 4 UEFI SETUP UTILITY 32
4.1 Introduction 32
4.1.1 UEFI Menu Bar 32
4.1.2 Navigation Keys 33
4.2 Main Screen 34
4.3 OC Tweaker Screen 35
4.4 Advanced Screen 43
4.4.1 CPU Conguration 44
4.4.2 Chipset Conguration 46
4.4.3 Storage Conguration 48
4.4.4 Super IO Conguration 49
4.4.5 ACPI Conguration 51
4.4.6 USB Conguration 53
4.4.7 Trusted Computing 54
4.5 Tools 55
4.6 Hardware Health Event Monitoring Screen 58
4.7 Security Screen 60
4.8 Boot Screen 61
4.9 Exit Screen 64
H110M-GL/D3

Chapter 1 Introduction

ank you for purchasing ASRock H110M-GL/D3 motherboard, a reliable
motherboard produced under ASRock ’s consistently stringent quality control.
It delivers excellent performance with robust design conforming to ASRock ’s
commitment to quality and endurance.
In this documentation, Chapter 1 and 2 contains the introduction of the
motherboard and step-by-step installation guides. Chapter 3 contains the operation
guide of the soware and utilities. Chapter 4 contains the conguration guide of
the BIOS setup.
Becau se the motherboard specication s and the BIOS soware might be updated, the content of this doc umentation will be subject to change without notice. In case any modi­cations of this d ocumentation occur, the updated version will be available on ASRock’s website w ithout further notice . If you require technical support rel ated to this mothe r­board, please v isit our website for specic information about the model you are using. You may nd the l atest VGA cards and CPU suppor t list on ASRock’s website as well. ASRock website http://www.asrock.com.

1.1 Package Contents

•ASRock H110M-GL/D3 Motherboard (Micro ATX Form Factor)
•ASRock H110M-GL/D3 Quick Installation Guide
•ASRock H110M-GL/D3 Support CD
•2 x Serial ATA (SATA) Data Cables (Optional)
•1 x I/O Panel Shield
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1
1.2 Specications
Platform
CPU
Chipset
Memory
Expansion Slot
Graphics
•Micro ATX Form Factor
•Solid Capacitor design
•Supports 6
Celeron® Processors (Socket 1151)
•Supports Intel® Turbo Boost 2.0 Technology
•Intel® H110
•Dual Channel DDR3/DDR3L Memory Technology
•2 x DDR3/DDR3L DIMM Slots
•Supports DDR3/DDR3L 1600/1333/1066 non-ECC, un-
buered memory
•Max. capacity of system memory: 32GB
•Supports Intel® Extreme Memory Prole (XMP) 1.3 / 1.2
•1 x PCI Express 3.0 x16 Slot (PCIE1: x16 mode)
•2 x PCI Express 2.0 x1 Slots
* Intel® HD Graphics Built-in Visuals and the VGA outputs can
be supported only with processors which are GPU integrated.
•Supports Intel® HD Graphics Built-in Visuals : Intel® Quick
Sync Video with AVC, MVC (S3D) and MPEG-2 Full
HW Encode1, Intel® InTruTM 3D, Intel® Clear Video HD
Technology, Intel® InsiderTM, Intel® HD Graphics 510/530
•Pixel Shader 5.0, DirectX 12
•Max. shared memory 1792MB
•Supports D-Sub with max. resolution up to 1920x1200 @
60Hz
•Supports Accelerated Media Codecs: HEVC, VP8, VP9
th
Generation Intel® CoreTM i7/i5/i3/Pentium®/
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Audio
•7.1 CH HD Audio (Realtek ALC887 Audio Codec)
* To congure 7.1 CH HD Audio, it is required to use an HD
front panel audio module and enable the multi-channel audio
feature through the audio driver.
•Supports Surge Protection (ASRock Full Spike Protection)
•ELNA Audio Caps
H110M-GL/D3
LAN
Rear Panel I/O
Storage
•PCIE x1 Gigabit LAN 10/100/1000 Mb/s
•R ea ltek RTL8111E
•Supports Wake-On-LAN
•Supports Lightning/ESD Protection (ASRock Full Spike
Protection)
•Supports LAN Cable Detection
•Supports Energy Ecient Ethernet 802.3az
•Supports PXE
•1 x PS/2 Mouse/Keyboard Port
•1 x Parallel Port (ECP/EPP Support)
•1 x Serial Port: COM1
•1 x D-Sub Port
•4 x USB 2.0 Ports (Supports ESD Protection (ASRock Full
Spike Protection))
•2 x USB 3.0 Ports (Supports ESD Protection (ASRock Full
Spike Protection))
•1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED
LE D)
•HD Audio Jacks: Line in / Front Speaker / Microphone
4 x SATA3 6.0 Gb/s Connectors, support NCQ, AHCI and Hot
Plug
Connector
•1 x COM Port Header
•1 x TPM Header
•1 x Chassis Intrusion and Speaker Header
•1 x CPU Fan Connector (4-pin) (Smart Fan Speed Control)
•2 x Chassis Fan Connector (4-pin) (Smart Fan Speed Con-
trol)
•1 x 24 pin ATX Power Connector
•1 x 4 pin 12V Power Connector
•1 x Front Panel Audio Connector
•2 x USB 2.0 Headers (Support 4 USB 2.0 ports) (Supports
ESD Protection (ASRock Full Spike Protection))
•1 x USB 3.0 Header (Supports 2 USB 3.0 ports) (Supports
ESD Protection (ASRock Full Spike Protection))
*USB3_2_3 is shared with USB4_5.
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BIOS Feature
•AMI UEFI Legal BIOS with multilingual GUI support
•ACPI 1.1 Compliant wake up events
•SMBIOS 2.3.1 Support
•CPU, GT_CPU, DRAM, PCH 1.0V, VCCSA Voltage Multi-
adjustment
Hardware Monitor
•CPU/Chassis temperature sensing
•CPU/Chassis Fan Tachometer
•CPU/Chassis Quiet Fan (Auto adjust chassis fan speed by
CPU temperature)
•CPU/Chassis Fan multi-speed control
•CASE OPEN detection
•Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore
OS
•Microso® Windows® 10 64-bit / 8.1 64-bit / 7 32-bit / 7 64-
bit
* To install Windows® 7 OS, a modied installation disk with
xHCI drivers packed into the ISO le is required. Please refer to
page 29 for more detailed instructions.
* For the updated Windows® 10 driver, please visit ASRock's
website for details: http://www.asrock.com
Certica­tions
* For detailed product infor mation, please visit our website: http://www.asrock .com
Please realize that there is a certain risk involved with overcl ocking, including adjusting the setting in the BIOS, applying Untied Overclocking Technology, or using third-party overclocking tools. Overclocking may aect your system’s stability, or even cause damage to the components an d devices of your system. It should be done at your own risk and expense. We are not responsible for possible damage cause d by overclocking.
•FCC, CE, WHQL
•ErP/EuP ready (ErP/EuP ready power supply is required)
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Intel
H110
DDR 3_B1 (6 4 bit, 24 0-pin m odule )
DDR 3_A1 (6 4 bit, 24 0-pin m odule )
CMOS
Battery
Sup er
I/O
ATXPWR 1
Top: RJ-45
USB 3.0 T: USB0 B: USB1
CLRCMOS1
1
HDLED RESET
PLED PWRBTN
PANEL1
1
USB0_1
COM2
1
1
HD_AUDIO1
H110M-GL/D3
CHA_FAN1
RoHS
8
10
13
18
16
2
CPU_FAN1
3
4
7
5
1
BIOS ROM
Audio
CODEC
PCIE1
PCI Express 3.0
TPMS1
1
1
USB3_2_3
PCIE3
USB 2.0 T: USB2 B: USB3
Top:
LINE IN
Cente r:
FRONT
Botto m:
MIC IN
1
ATX12V1
USB 2. 0
T: USB0
B: USB 1
PS2
Keyb oard
/Mous e
SPK_CI1
1
PCIE2
Front USB 3.0
9
11
12
14
15
SATA3_0 SATA3 _2
SATA3_1 SATA3 _3
PARA LLE L POR T
COM1
VGA1
USB4_5
1
CHA_FAN2
6
19
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1.3 Motherboard Layout

H110M-GL/D3
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5
No. Description
1 ATX 12V Power Connector (ATX12V1)
2 CPU Fan Connector (CPU_FAN1)
3 2 x 240-pin DDR3/DDR3L DIMM Slots (DDR3_A1, DDR3_B1)
4 ATX Power Connector (ATXPWR1)
5 USB 3.0 Header (USB3_2 _3)
6 USB 2.0 Header (USB4_5)
7 SATA3 Connector (SATA3_2)
8 SATA3 Connector (SATA3_3)
9 SATA3 Connector (SATA3_1)
10 SATA3 Connector (SATA3_0)
11 Chassis Fan Connector (CHA_FAN2)
12 System Panel Header (PANEL1)
13 USB 2.0 Header (USB0_1)
14 Chassis Intrusion and Speaker Header (SPK_CI1)
15 TPM Header (TPMS1)
16 COM Port Header (COM2)
17 Clear CMOS Jumper (CLRMOS1)
18 Chassis Fan Connector (CHA_FAN1)
19 Front Panel Audio Header (HD_AUDIO1)
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1.4 I/O Panel

3
4
1
2
H110M-GL/D3
5
11
10
9
8
7
No. Description No. Description
1 USB 2.0 Ports (USB01) 7 USB 3.0 Ports (USB3_01)
2 Parallel Port 8 USB 2.0 Ports (USB23)
3 LAN RJ-45 Port* 9 D-Sub Port
4 Line In (Light Blue)** 10 COM Port
5 Front Speaker (Lime)** 11 PS/2 Mouse/Keyboard Port
6 Microphone (Pink)**
* ere are two LEDs on ea ch LAN port. Pl ease refer to the table below for the LA N port LED indic ations .
ACT/LINK LED
SPEED LED
LAN Por t
Activity / Link LED Speed LED
Status Description Status Description
O No Link O 10Mbps connection Blinking Data Activity Orange 100Mbps connection On Link Green 1Gbps connection
6
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** To congure 7.1 CH HD Audio, it i s required to use an HD front panel audio module and enable the multi­channel audio feature through the audio driver.
Please set Speaker Conguration to “7.1 Speaker” in the Realtek HD Audio Man ager.
Function of the Audio Ports in 7.1-channel Conguration:
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Port Function
Light Blue (Rear panel) Rear Speaker Out Lime (Rear panel) Front Speaker Out Pink (Rear panel) Central /Subwoofer Speaker Out Lime (Front panel) Side Speaker Out
H110M-GL/D3

Chapter 2 Installation

is is a Micro ATX form factor motherboard. Before you install the motherboard,
study the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components
or change any motherboard settings.
•Make sure to unplug the power cord before installing or removing the motherboard
components. Failure to do so may cause physical injuries and damages to motherboard
components.
•In order to avoid damage from static electricity to the motherboard’s components,
NEVER place your motherboard directly on a carpet. Also remember to use a grounded
wrist strap or touch a safety grounded object before you handle the components.
•Hold components by the edges and do not touch the ICs.
•Whenever you uninstall any components, place them on a grounded anti-static pad or
in the bag that comes with the components.
•When placing screws to secure the motherboard to the chassis, please do not over-
tighten the screws! Doing so may damage the motherboard.
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2.1 Installing the CPU

1. Before you insert the 1151-Pin CPU into the socket, please check if the PnP cap is on the socket, if the CPU surface is unclean, or if there are any bent pins in the socket. Do not force to in sert the CPU into the socket if above situation is found. Otherwise, the CPU will be seriously damaged.
2. Unplug all power c ables before ins talling the CPU.
1
2
A
B
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H110M-GL/D3
3
4
5
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11
Please save and replace the cover if the processor is removed. e cover mus t be placed if you wish to return the motherboard for a er service.
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12

2.2 Installing the CPU Fan and Heatsink

1 2
H110M-GL/D3
FAN
CPU_
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13

2.3 Installing Memory Modules (DIMM)

is motherboard provides two 240-pin DDR3/DDR3L (Double Data Rate 3)
DIMM slots, and supports Dual Channel Memory Technology.
1. For dual channel conguration, you always need to install identical (the same brand, speed , size and chip-type) DDR3/DDR 3L DIMM pairs.
2. It is unable to activate Dual Channel Memory Technology w ith only one memor y module installed.
3. It is not allowed to install a DDR or DDR2 memory module into a DDR3/DDR3L slot; otherwise, this motherboard an d DIMM may be damaged..
e DIMM only ts in one correct orientation. It will cause permanent dam age to the motherboard and the DIMM if you force the DIM M into the slot at incorrect orientation.
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H110M-GL/D3
1
2
3
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15

2.4 Expansion Slots (PCI Express Slots)

ere are 3 PCI Express slots on the motherboard.
Before installing an expansion c ard, ple ase make sure that the power supply is switched o or the power cord is unplugged. Please read the documentation of the expansion card and make necessary hardware settings for the card before you start the installation.
PCIe slots:
PCIE1 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
PCIE2 (PCIe 2.0 x1 slot) is used for PCI Express x1 lane width cards
PCIE3 (PCIe 2.0 x1 slot) is used for PCI Express x1 lane width cards.
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H110M-GL/D3

2.5 Jumpers Setup

e illustration shows how jumpers are setup. When the jumper cap is placed on
the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper
is “Open”. e illustration shows a 3-pin jumper whose pin1 and pin2 are “Short”
when a jumper cap is placed on these 2 pins.
Clear CMOS Jumper
(C LR MOS 1)
(see p.5, No. 17)
CLRMOS1 allows you to clear the data in CMOS. To clear and reset the system
parameters to default setup, please turn o the computer and unplug the power
cord from the power supply. Aer waiting for 15 seconds, use a jumper cap to
short pin2 and pin3 on CLRMOS1 for 5 seconds. However, please do not clear the
CMOS right aer you update the BIOS. If you need to clear the CMOS when you
just nish updating the BIOS, you must boot up the system rst, and then shut it
down before you do the clear-CMOS action. Please be noted that the password,
date, time, and user default prole will be cleared only if the CMOS battery is
removed.
Clear CMOSDefault
If you clear the CMOS, the case open may be detected. Please adjust the BIOS option “Clear Status” to clear the record of pre vious chassi s intrusion status.
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