ASRock H110M-DVS R3.0 Service Manual

Version 1.0

Published August 2016

Copyright©2016 ASRock INC. All rights reserved.

Copyright Notice:

No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.

Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to

infringe.

Disclaimer:

Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.

With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.

In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.

is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that

may cause undesired operation.

CALIFORNIA, USA ONLY

e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see ww w.dtsc.ca.gov/hazardouswaste/
perchlorate”

ASRock Website: http://www.asrock.com

AUSTRALIA ONLY

Our goods come with guarantees that cannot be excluded under the Australian Consumer
Law. You are entitled to a replacement or refund for a major failure and compensation for
any other reasonably foreseeable loss or damage caused by our goods. You are also entitled
to have the goods repaired or replaced if the goods fail to be of acceptable quality and the
failure does not amount to a major failure. If you require assistance please call ASRock Tel
: [phone] ext.123 (Standard International call charges apply)

e terms HDMI™ and HDMI High-Denition Multimedia Interface, and the HDMI
logo are trademarks or registered trademarks of HDMI Licensing LLC in the United
States and other countries.

Contents

Chapter 1 Introduction 1

1.1 Package Contents 1

1.2 Specications 2

1.3 Motherboard Layout 6

1.4 I/O Panel 10

Chapter 2 Installation 14

2.1 Installing the CPU 15

2.2 Installing the CPU Fan and Heatsink 18

2.3 Installing Memory Modules (DIMM) 19

2.4 Expansion Slots (PCI Express Slots) 21

2.5 Onboard Headers and Connectors 22

Chapter 3 Software and Utilities Operation 26

3.1 Installing Drivers 26

3.2 ASRock Live Update & APP Shop 27

3.2.1 UI Overview 27

3.2.2 Apps 28

3.2.3 BIOS & Drivers 31

3.2.4 Setting 32

3.3 Enabling USB Ports for Windows® 7 Installation 33

Chapter 4 UEFI SETUP UTILITY 36

4.1 Introduction 36

4.2 EZ Mode 37

4.3 Advanced Mode 38

4.3.1 UEFI Menu Bar 38

4.3.2 Navigation Keys 39

4.4 Main Screen 40

4.5 OC Tweaker Screen 41

4.6 Advanced Screen 49

4.6.1 CPU Conguration 50

4.6.2 Chipset Conguration 52

4.6.3 Storage Conguration 54

4.6.4 ACPI Conguration 55

4.6.5 USB Conguration 56

4.6.6 Trusted Computing 57

4.7 Tools 58

4.8 Hardware Health Event Monitoring Screen 61

4.9 Security Screen 63

4.10 Boot Screen 64

4.11 Exit Screen 67

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

Chapter 1 Introduction

ank you for purchasing ASRock H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-

DGS R3.0 motherboard, a reliable motherboard produced under ASRock’s

consistently stringent quality control. It delivers excellent performance with robust

design conforming to ASRock ’s commitment to quality and endurance.

In this documentation, Chapter 1 and 2 contains the introduction of the

motherboard and step-by-step installation guides. Chapter 3 contains the operation

guide of the soware and utilities. Chapter 4 contains the conguration guide of

the BIOS setup.

Becau se the motherboard specications and the BIOS soware might be updated, the
content of this documentation will be subject to change without notice. In case any
modications of this documentation occur, the updated version will be available on
ASRock’s website w ithout f urther notice. If you require technical support relate d to
this motherboard, please vi sit our website for s pecic information about the model
you are using. You may nd the l atest VGA cards and CPU suppor t list on ASRock’s
website a s well. ASRock website ht tp://www.a srock.com.

1.1 Package Contents

ASRock H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0 Motherboard (Micro

•

ATX Form Factor)

ASRock H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0 Quick Installation

•

Guide

ASRock H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0 Support CD

•

2 x Serial ATA (SATA) Data Cables (Optional)

•

1 x I/O Panel Shield

•

English

1

1.2 Specications

Platform

CPU

Chipset

Memory

Expansion
Slot

•

•

•

•

•

•

•

•

•

•

•

•

•

•

* Supports NVMe SSD as boot disks

•

Micro ATX Form Factor

Solid Capacitor design

Supports 6th Generation Intel® CoreTM i7/i5/i3/Pentium®/

Celeron® Processors (Socket 1151)

4 Power Phase design

Supports CPU up to 95W

Supports Intel® Turbo Boost 2.0 Technology

Intel® H110

Dual Channel DDR4 Memory Technology

2 x DDR4 DIMM Slots

Supports DDR4 2133 non-ECC, un-buered memory

Supports ECC UDIMM memory modules (operate in non-

ECC mode)

Max. capacity of system memory: 32GB

Supports Intel® Extreme Memory Prole (XMP) 2.0

1 x PCI Express 3.0 x16 Slot (PCIE2: x16 mode)*

1 x PCI Express 2.0 x1 Slot

English

2

Graphics

Intel® HD Graphics Built-in Visuals and the VGA outputs

•

can be supported only with processors which are GPU

integrated.

Supports Intel® HD Graphics Built-in Visuals : Intel® Quick

•

Sync Video with AVC, MVC (S3D) and MPEG-2 Full

HW Encode1, Intel® InTruTM 3D, Intel® Clear Video HD

Technology, Intel® InsiderTM, Intel® HD Graphics 510/530

Pixel Shader 5.0, DirectX 12

•

Max. shared memory 1024MB

•

* e size of ma ximum shared memory may vary from dierent

operating systems.

H110M-HDS R3.0:

Dual graphics output: Support DVI-D and HDMI ports by

•

independent display controllers

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

Supports HDMI with max. resolution up to 4K x 2K

•

(4096x2160) @ 24Hz / (3840x2160) @ 30Hz

Supports DVI-D with ma x. resolution up to 1920x1200 @

•

60Hz

Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and

•

HBR (High Bit Rate Audio) with HDMI Port (Compliant

HDMI monitor is required)

Supports Accelerated Media Codecs: HEVC, VP8, VP9

•

Supports HDCP with DVI-D and HDMI Ports

•

Supports Full HD 1080p Blu-ray (BD) playback with DVI-D

•

and HDMI Ports

H110M-DVS R3.0:

Dual graphics output: Support DVI-D and D-Sub ports by

•

independent display controllers

Supports DVI-D with ma x. resolution up to 1920x1200 @

•

60Hz

Supports D-Sub with max. resolution up to 1920x1200 @

•

60Hz

Supports Accelerated Media Codecs: HEVC, VP8, VP9

•

Supports HDCP with DVI-D Port

•

Supports Full HD 1080p Blu-ray (BD) playback with DVI-D

•

Port

H110M-DGS R3.0:

Supports DVI-D with ma x. resolution up to 1920x1200 @

•

60Hz

Supports Accelerated Media Codecs: HEVC, VP8, VP9

•

Supports HDCP with DVI-D Port

•

Supports Full HD 1080p Blu-ray (BD) playback with DVI-D

•

Port

Audio

7.1 CH HD Audio (Realtek ALC887 Audio Codec)

•

* To congure 7.1 CH HD Audio, it is required to use an HD

front panel audio module and enable the multi-channel audio

feature through the audio driver.

Supports Surge Protection (ASRock Full Spike Protection)

•

ELNA Audio Caps

•

English

3

LAN

Rear Panel
I/O

PCIE x1 Gigabit LAN 10/100/1000 Mb/s

•

Realtek RTL8111C

•

Supports Wake-On-LAN

•

Supports Lightning/ESD Protection (ASRock Full Spike

•

Protection)

Supports LAN Cable Detection

•

Supports PXE

•

1 x PS/2 Mouse Port

•

1 x PS/2 Keyboard Port

•

4 x USB 2.0 Ports (Supports ESD Protection (ASRock Full

•

Spike Protection))*

* ACPI wake-up function is supported on USB01 ports only.

2 x USB 3.0 Ports (Supports ESD Protection (ASRock Full

•

Spike Protection))

1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED

•

LED)

HD Audio Jacks: Line in / Front Speaker / Microphone

•

H110M-HDS R3.0:

1 x DVI-D Port

•

1 x HDMI Port

•

H110M-DVS R3.0:

1 x D-Sub Port

•

1 x DVI-D Port

•

H110M-DGS R3.0:

1 x DVI-D Port

•

English

4

Storage

Connector

4 x SATA3 6.0 Gb/s Connectors, support NCQ, AHCI and

•

Hot Plug

1 x TPM Header

•

1 x Chassis Intrusion and Speaker Header

•

1 x CPU Fan Connector (4-pin)

•

1 x Chassis Fan Connector (4-pin)

•

* e CPU Fan Connector supports the CPU fan of ma ximum

1A (12W) fan power.

1 x 24 pin ATX Power Connector

•

1 x 8 pin 12V Power Connector

•

1 x Front Panel Audio Connector

•

BIOS
Feature

Hardware
Monitor

OS

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

1 x USB 2.0 Header (Supports 2 USB 2.0 ports) (Supports

•

ESD Protection (ASRock Full Spike Protection))

1 x USB 3.0 Header (Supports 2 USB 3.0 ports) (Supports

•

ESD Protection (ASRock Full Spike Protection))

AMI UEFI Legal BIOS with multilingual GUI support

•

ACPI 5.0 Compliant wake up events

•

SMBIOS 2.7 Support

•

DRAM, PCH 1.0V Voltage Multi-adjustment

•

CPU/Chassis temperature sensing

•

CPU/Chassis Fan Tachometer

•

CPU/Chassis Quiet Fan (Auto adjust chassis fan speed by

•

CPU temperature)

CPU/Chassis Fan multi-speed control

•

CASE OPEN detection

•

Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore

•

Microso® Windows® 10 64-bit / 8.1 64-bit / 7 32-bit / 7 64-

•

bit

* To install Windows® 7 OS, a modied installation disk with

xHCI drivers packed into the ISO le is required. Please refer to

page 33 for more detailed instructions.

* For the updated Windows® 10 driver, please visit ASRock ’s

website for details: http://ww w.asrock.com

FCC, CE, WHQL

Certica-

•

tions

* For detailed product information, please visit our website: http://ww w.asrock.com

Please realize that the re is a certain r isk involved with overclo cking, including
adjusting the setting in the BIOS, applying Untied Overclocking Technol ogy, or using
third-party overclocking tool s. Overclocking may aect your system’s stability, or
even cause dam age to the components and devices of your system. It should be done
at your own risk and expense. We are not responsible for poss ible damage caused by
overclocking.

English

5

1.3 Motherboard Layout

Intel

H110

DDR 4_B 1 (64 bi t, 28 8-p in mo dul e)

DDR 4_A 1 (64 bi t, 28 8-p in mo dul e)

ATXP WR1

PCIE 2

Top:
RJ- 45

USB 2. 0
T: US B0
B: USB 1

HDLED RESET

PLED PWR BTN

PANEL1

1

1

SPK_CI1

1

HD_AUD IO1

H110M-H DS

RoHS

USB 3.0
T: USB 1
B: U SB2

CMO S

Bat te ry

USB3_3_ 4

1

CPU_FAN 1

1

TPMS1

PCI E xp re ss 3.0

Front U SB 3.0

Top:

LINE IN

Cent er:

FRON T

Bott om:

MIC I N

SATA3_0_ 1

SATA3_2_ 3

BIOS
ROM

CLRMOS1

ATX12V 1

DVI 1

PCIE 1

PS2

Keyb oard

PS2

Mous e

HDM I1

USB 2.0
T: USB 2
B: U SB3

CHA_FAN 1

USB_4_ 5

1

H110M-HDS R3.0:

English

6

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

Intel

H110

DDR 4_B 1 (64 bi t, 28 8-p in mo dul e)

DDR 4_A 1 (64 bi t, 28 8-p in mo dul e)

ATXP WR1

PCIE 2

Top:
RJ- 45

USB 2. 0
T: US B0
B: USB 1

HDLED RESET

PLED PWR BTN

PANEL1

1

1

SPK_CI1

1

HD_AUD IO1

H110M-D VS

RoHS

USB 3.0
T: USB 1
B: U SB2

CMO S

Bat te ry

USB3_3_ 4

1

CPU_FAN 1

1

TPMS1

PCI E xp re ss 3.0

Front U SB 3. 0

Top:

LINE IN

Cent er:

FRON T

Bott om:

MIC I N

SATA3_0_ 1

SATA3_2_ 3

BIOS
ROM

CLRMOS1

ATX12V 1

DVI 1

PCIE 1

PS2

Keyb oard

PS2

Mous e

USB 2.0
T: USB 2
B: U SB3

CHA_FAN 1

USB_4_ 5

1

VGA 1

H110M-DVS R3.0:

English

7

Intel

H110

DDR 4_B 1 (64 bi t, 28 8-p in mo dul e)

DDR 4_A 1 (64 bi t, 28 8-p in mo dul e)

ATXP WR1

PCIE 2

Top:
RJ- 45

USB 2. 0
T: US B0
B: USB 1

HDLED RESET

PLED PWR BTN

PANEL1

1

1

SPK_CI1

1

HD_AUD IO1

H110M-D GS

RoHS

USB 3.0
T: USB 1
B: U SB2

CMO S

Bat te ry

USB3_3_ 4

1

CPU_FAN 1

1

TPMS1

PCI E xp re ss 3.0

Front U SB 3. 0

Top:

LINE IN

Cent er:

FRON T

Bott om:

MIC I N

SATA3_0_ 1

SATA3_2_ 3

BIOS
ROM

CLRMOS1

ATX12V 1

DVI 1

PCIE 1

PS2

Keyb oard

PS2

Mous e

USB 2.0
T: USB 2
B: U SB3

CHA_FAN 1

USB_4_ 5

1

H110M-DGS R3.0:

English

8

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

No. Description

1 ATX 12V Power Connector (ATX12V1)

2 CPU Fan Connector (CPU_FAN1)

3 2 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)

4 Chassis Fan Connector (CHA_FAN1)

5 ATX Power Connector (ATXPWR1)

6 SATA3 Connectors (SATA3_2_3)

7 SATA3 Connectors (SATA3_0_1)

8 USB 3.0 Header (USB3_3_4)

9 USB 2.0 Header (USB_4_5)

10 System Panel Header (PANEL1)

11 Chassis Intrusion and Speaker Header (SPK_CI1)

12 TPM Header (TPMS1)

13 Front Panel Audio Header (HD_AUDIO1)

English

9

1.4 I/O Panel

H110M-HDS R3.0:

1 2

3

4

11 56

No. Description No. Description

1 PS/2 Mouse Port 7 USB 2.0 Ports (USB_23)

2 LAN RJ-45 Port* 8 USB 3.0 Ports (USB3_12)

3 Line In (Light Blue)** 9 HDMI Port

4 Front Speaker (Lime)** 10 DVI-D Port

5 Microphone (Pink)** 11 PS/2 Keyboard Port

6 USB 2.0 Ports (USB01)***

10

789

English

10

H110M-DVS R3.0:

1 3

2

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

4

5

11 67

No. Description No. Description

1 PS/2 Mouse Port 7 USB 2.0 Ports (USB01)***

2 D-Sub Port 8 USB 2.0 Ports (USB_23)

3 LAN RJ-45 Port* 9 USB 3.0 Ports (USB3_12)

4 Line In (Light Blue)** 10 DVI-D Port

5 Front Speaker (Lime)** 11 PS/2 Keyboard Port

6 Microphone (Pink)**

10

89

11

English

H110M-DGS R3.0:

1 2

3

4

English

10

9

78

No. Description No. Description

1 PS/2 Mouse Port 6 USB 2.0 Ports (USB01)***

2 LAN RJ-45 Port* 7 USB 2.0 Ports (USB_23)

3 Line In (Light Blue)** 8 USB 3.0 Ports (USB3_12)

4 Front Speaker (Lime)** 9 DVI-D Port

5 Microphone (Pink)** 10 PS/2 Keyboard Port

* ere are two LEDs on the LAN port. Please refer to the table below for the LAN port LED indications.

ACT/LINK L ED

SPEED LE D

LAN Por t

Activity / Link LED Speed LED

Status Description Status Description

O No Link O 10Mbps connection
Blinking Data Activity Orange 100Mbps connection
On Link Green 1Gbps connection

56

12

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

** To congure 7.1 CH HD Audio, it i s required to use an HD front panel audio module and enable the multi­channel audio feature through the audio driver.

Please set Speaker Conguration to “7.1 Speaker”in the Realtek HD Audio Manager.

Function of the Audio Por ts in 7.1-channel Con guration:

Port Function

Light Blue (Rear panel) Rear Speaker Out
Lime (Rear panel) Front Speaker Out
Pink (Rear panel) Central /Subwoofer Speaker Out
Lime (Front panel) Side Speaker Out

*** ACPI wake-up function is supported on USB01 por ts only.

English

13

Chapter 2 Installation

is is a Micro ATX form factor motherboard. Before you install the motherboard,

study the conguration of your chassis to ensure that the motherboard ts into it.

Pre-installation Precautions

Take note of the following precautions before you install motherboard components

or change any motherboard settings.

Make sure to unplug the power cord before installing or removing the motherboard

•

components. Failure to do so may cause physical injuries and damages to motherboard

components.

In order to avoid damage from static electricity to the motherboard’s components,

•

NEVER place your motherboard directly on a carpet. Also remember to use a grounded

wrist strap or touch a safety grounded object before you handle the components.

Hold components by the edges and do not touch the ICs.

•

Whenever you uninstall any components, place them on a grounded anti-static pad or

•

in the bag that comes with the components.

When placing screws to secure the motherboard to the chassis, please do not over-

•

tighten the screws! Doing so may damage the motherboard.

English

14

2.1 Installing the CPU

1. Before you inse rt the 1151-Pin CPU into the socket, plea se check if the PnP cap
is on the socket, if the CPU sur face is unclean, or if th ere are any b ent pins in the
socket. Do not force to insert the CPU into the socket if above situ ation is found.
Other wise, the CPU wil l be seriously d amaged.

2. Unplug all power cables before in stalling the CPU.

1

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

A

B

2

English

15

3

4

English

16

5

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

Please save and replace the cover if the processor i s removed. e cover must be
placed if you wish to return the motherboard for aer service.

17

English

2.2 Installing the CPU Fan and Heatsink

1 2

English

18

FAN

CPU_

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

2.3 Installing Memory Modules (DIMM)

is motherboard provides two 288-pin DDR4 (Double Data Rate 4) DIMM slots,

and supports Dual Channel Memory Technology.

1. For dual channel conguration, you always need to install id entical (the same

brand, speed , size and chip-type) DDR4 DIMM pairs.

2. It is unable to activate Dual Channel Memory Technology with only one memory
module instal led.

3. It is not allowed to install a DDR, DDR2 or DDR3 memory module into a DDR4
slot; otherwise, this motherboard and DIMM may be damaged.

e DIMM only ts in one correct orientation. It will cause permanent dam age to
the mothe rboard and the DIMM if you force the DIMM into the slot at incor rect
orientation .

19

English

1

2

English

20

3

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

2.4 Expansion Slots (PCI Express Slots)

ere are 2 PCI Express slots on the motherboard.

Before installing an ex pansion card, please make sure that the power supply is
switched o or the power cord is unplugged. Plea se read the documentation of the
expan sion card and mak e necessary hardware settings for the card before you start
the installation.

PCIe slots:

PCIE1 (PCIe 2.0 x1 slot) is used for PCI Express x1 lane width cards.

PCIE2 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards.

21

English

2.5 Onboard Headers and Connectors

Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over
these header s and connectors. Placing jumper caps over the headers and connectors
will cause permanent damage to the motherboard.

System Panel Header

(9-pin PANEL1)

(see p.6, 7, 8, No. 10)

PWRBTN (Power Switch):

Connec t to the power switch on the chassi s front panel. You may congure the way to
turn o your system using the power switch.

RESET (Reset Switch):

Connec t to the reset switch on the chassi s front panel. P ress the reset sw itch to restart
the computer if the compute r freezes and fails to perform a normal restart.

PLED (Syste m Power LED):

Connec t to the power status indicator on the chassis front panel. e LED i s on when
the system is ope rating. e LED keeps blinking when the system i s in S1/S3 sleep
state. e LED is o when the system is in S4 sleep state or powered o (S5).

HDLED (Ha rd Drive Activity LED):

Connec t to the hard drive ac tivity LED on the chassis front panel. e LED is on
when the hard drive i s reading or writing data.

e front panel de sign may dier by chassis. A front pane l module mainly consists
of power switch , reset switch, power LED, hard dr ive activity LED, speak er and etc.
When connecting your chassis front panel module to this head er, make sure the wire
assig nments and the pin assig nments are matched correctly.

1

PLE D+

PLE D-

HDL ED-

HDL ED+

PWR BTN #

GND

RES ET#

GND

GND

Connect the power

switch, reset switch and

system status indicator on

the chassis to this header

according to the pin

assignments below. Note

the positive and negative

pins before connecting

the cables.

English

22

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

Chassis Intrusion and

Speaker Header

(7-pin SPK_CI1)

(see p.6, 7, 8, No. 11)

Serial ATA3 Connectors

(SATA3_0_1:

see p.6, 7, 8, No. 7)

(SATA3_2_3:

see p.6, 7, 8, No. 6)

USB 2.0 Header

(9-pin USB_4_5)

(see p.6, 7, 8, No. 9)

USB 3.0 Header

(19-pin USB3_3_4)

(see p.6, 7, 8, No. 8)

DUM MY
+5V

1

SIG NA L

USB _PW R

1

USB _PW R

Vbus

IntA _P0 _SSR X-

IntA _P0 _SSR X+

GND

IntA _P0 _SST X-

IntA _P0 _SST X+

GND

IntA _P0 _D-

IntA _P0 _D+

SPE AK ER

DUM MY

GND

SATA3_0_1 SATA3_2_3

P-

P+

P+

P-

DUM MY

GND

DUM MY

GND

VbusVbus

IntA _P1 _SSR X-

IntA _P1 _SSR X+

GND

IntA _P1 _SST X-

IntA _P1 _SST X+

GND

IntA _P1 _D-

IntA _P1 _D+

ID

1

Please connect the

chassis intrusion and the

chassis speaker to this

header.

ese four SATA3

connectors support SATA

data cables for internal

storage devices with up to

6.0 Gb/s data transfer rate.

ere is one header on

this motherboard. Each

USB 2.0 header can

support two ports.

Besides two USB 3.0 ports

on the I/O panel, there

is one header on this

motherboard. Each USB

3.0 header can support

two ports.

23

English

Front Panel Audio Header

GND

FAN_V OLTAGE _CON TRO L

FAN_S PEE D

FAN_S PEE D_CO NTR OL

GND

FAN_V OLTAGE _CON TRO L

FAN_S PEE D

FAN_S PEE D_CO NTR OL

(9-pin HD_AUDIO1)

(see p.6, 7, 8, No. 13)

1. High Denition Audio supports Jack Sensing, but the panel wire on the chas sis
must support HDA to function correctly. Please follow the instructions in our
manual and chassis manual to install your system.

2. If you use an AC’97 audio panel , please install it to the front panel audio header by
the steps below:
A. Connect Mic_IN (MIC) to MIC2_ L.
B. Conne ct Audio_R (RIN) to OUT2_R and Audio_ L (LIN) to OUT2_ L.
C. Connect Ground (GND) to Ground (GND).
D. MIC_ RET and OUT_RET are for the HD audio panel only. You don’t need to
connec t them for the AC’97 audio panel.
E. To activate the front mic, go to the “FrontMic” Tab in the Realtek Control panel
and adju st “Recording Volume”.

OUT _R ET

MIC _R ET

PRE SE NCE #

GN D

1

OUT 2_ L

J_S EN SE
OUT 2_ R

MIC 2_ R

MIC 2_ L

is header is for

connecting audio devices

to the front audio panel.

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24

Chassis Fan Connector

(4-pin CHA_FAN1)

(see p.6, 7, 8, No. 4)

CPU Fan Connector

(4-pin CPU_FAN1)

(see p.6, 7, 8, No. 2)

ATX Power Connector

(24-pin ATXPWR1)

(see p.6, 7, 8, No. 5)

Please connect fan cables

to the fan connector and

match the black wire to

the ground pin.

is motherboard pro-

vides a 4-Pin CPU fan

(Quiet Fan) connector.

If you plan to connect a

3-Pin CPU fan, please

connect it to Pin 1-3.

12

24

is motherboard pro-

vides a 24-pin ATX power

connector. To use a 20-pin

ATX power supply, please

plug it along Pin 1 and Pin

1

13

13.

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

5

1

8

ATX 12V Power

Connector

(8-pin ATX12V1)

(see p.6, 7, 8, No. 1)

TPM Header

(17-pin TPMS1)

(see p.6, 7, 8, No. 12)

is motherboard pro-

vides a 8-pin ATX 12V

power connector. To use a

4-pin ATX power supply,

please plug it along Pin 1

and Pin 5.

is connector supports Trusted

GN D

LAD 0

+3 V

+3V S B

D

GN

GN D

LAD 1

SER IRQ #

S_P WRD WN #

PC ICL K

LAD 3

PC IRS T #

FRA M E

Platform Module (TPM) system,

1

which can securely store keys,

digital certicates, passwords,

GN D

LAD 2

and data. A TPM system also

helps enhance network security,

SMB _CL K_M AIN

SMB _DA TA_ MAI N

protects digital identities, and

ensures platform integrity.

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25

Chapter 3 Software and Utilities Operation

3.1 Installing Drivers

e Support CD that comes with the motherboard contains necessary drivers and

useful utilities that enhance the motherboard’s features.

Running The Support CD

To begin using the support CD, insert the CD into your CD-ROM drive. e CD

automatically displays the Main Menu if “AUTORUN” is enabled in your computer.

If the Main Menu does not appear automatically, locate and double click on the le

“ASRSETUP.EXE” in the Support CD to display the menu.

Drivers Menu

e drivers compatible to your system will be auto-detected and listed on the

support CD driver page. Please click Instal l All or follow the order from top to

bottom to install those required drivers. erefore, the drivers you install can work

properly.

Utilities Menu

e Utilities Menu shows the application soware that the motherboard supports.

Click on a specic item then follow the installation wizard to insta ll it.

To improve Windows 7 compatibility, please download and install the following hot
x provided by Microso.
“KB2720599”: http://support.microso.com/ kb/2720599/en-us

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26

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

3.2 ASRock Live Update & APP Shop

e ASRock Live Update & APP Shop is an online store for purchasing and

downloading soware applications for your ASRock computer. You can quick ly and

easily insta ll various apps and support utilities, such as USB Key, XFast LAN, XFast

RAM and more. With ASRock Live Update & APP Shop, you can optimize your

system and keep your motherboard up to date simply with a few clicks.

Double-click on your desktop to access ASRock Live Update & APP Shop
utility.

*You need to be connected to the Internet to download apps f rom the ASRock Live Update & APP Shop.

3.2.1 UI Overview

Category Panel

Hot News

Information Panel

Category Panel: e category panel contains several category tabs or buttons that

when selected the information panel below displays the relative information.

Information Panel: e information panel in the center displays data about the

currently selected category and allows users to perform job-related tasks.

Hot News: e hot news section displays the various latest news. Click on the image

to visit the website of the selected news and know more.

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27

3.2.2 Apps

When the "Apps" tab is selected, you will see all the available apps on screen for you

to download.

Installing an App

Step 1

Find the app you want to install.

e most recommended app appears on the le side of the screen. e other various

apps are shown on the right. Please scroll up and down to see more apps listed.

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28

You can check the price of the app and whether you have already intalled it or not.

- e red icon displays the price or "Free" if the app is free of charge.

- e green "Installed" icon means the app is installed on your computer.

Step 2

Click on the app icon to see more details about the selected app.

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

Step 3

If you want to install the app, click on the red icon to start downloading.

Step 4

When installation completes, you can nd the green "Installed " icon appears on the

upper right corner.

To uninstall it, simply click on the trash can icon .
*e trash icon may not appear for certain apps.

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29

Upgrading an App

You can only upgrade the apps you have already installed. When there is an

available new version for your app, you will nd the mark of "New Version"

appears below the installed app icon.

Step 1

Click on the app icon to see more details.

Step 2

Click on the yellow icon to start upgrading.

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30

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

3.2.3 BIOS & Drivers

Installing BIOS or Drivers

When the "BIOS & Drivers" tab is selected, you will see a list of recommended or

critical updates for the BIOS or drivers. Please update them all soon.

Step 1

Please check the item information before update. Click on to see more details.

Step 2

Click to select one or more items you want to update.

Step 3

Click Update to start the update process.

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31

3.2.4 Setting

In the "Setting" page, you can change the language, select the server location, and

determine if you want to automatically run the ASRock Live Update & APP Shop

on Windows startup.

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32

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

3.3 Enabling USB Ports for Windows® 7 Installation

Intel® Braswell and Skylake has removed their support for the Enhanced Host

Controller Interface (EHCI – USB2.0) and only kept the eXtensible Host Controller

Interface (XHCI – USB3.0). Due to that fact that XHCI is not included in the

Windows 7 inbox drivers, users may nd it dicult to install Windows 7 operating

system because the USB ports on their motherboard won’t work. In order for the

USB ports to function properly, please create a Windows® 7 installation disk with

the Intel® USB 3.0 eXtensible Host Controller (xHCI) drivers packed into the ISO

le.

Requirements

A Windows® 7 installation disk or USB drive

•

USB 3.0 drivers (included in the ASRock Support CD or website)

•

A Windows® PC

•

Win7 USB Patcher (included in the ASRock Support CD or website)

•

Scenarios

You have an ODD and PS/2 ports:

If there is an optical disc drive, PS/2 ports and PS/2 Keyboard or mouse on your computer,

you can skip the instructions below and go ahead to install Windows® 7 OS.

You only have an ODD (For Intel Skylake platforms only):

If there is an optical disc drive but no PS/2 ports on your computer, please enable the “PS/2

Simulator” option in UEFI SETUP UTILITY > Advanced > USB Conguration, which

allows the USB port to function as a PS/2 port, and then you can install the Windows® 7

OS. Please set PS/S Simulator back to disabled aer the installation.

You’ve got nothing:

If you do not have an optical disc drive, please nd another computer and follow the

instructions below to create a new ISO le with the “Win7 USB Patcher”. en use the new

patched Windows® 7 installation USB drive to install Windows® 7 OS.

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33

Instructions

Step 1

Insert the Windows® 7 installation disk or USB drive to your system.

Step 2

Extract the tool (Win7 USB Patcher) and launch it.

Step 3

Select the “Win7 Folder” from Step1 by clicking the red circle as shown as the picture

below.

Step 4

Select the “USB Driver Folder” by clicking the red circle as shown as the picture below.

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34

If you are using ASRock’s Support CD for the USB 3.0 driver, please select your CD-ROM.

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

Step 5

Select where to save the ISO le by pressing the red circle as shown as the picture below.

Step 6

If you want to burn the patched image to a CD, please check “Burn Image” and select “Target

Device to Burn”. If not, the patched ISO image will be exported to the destination selected

in Step5. en Press “Start” to proceed.

Step 7

Now you are able to install Windows® 7 on Braswell or Skylake with the new burned CD.

Or please use the patched ISO image to make an OS USB drive to install the OS.

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35

Chapter 4 UEFI SETUP UTILITY

4.1 Introduction

is section explains how to use the UEFI SETUP UTILITY to congure your

system. You may run the UEFI SETUP UTILITY by pressing <F2> or <Del> right

aer you power on the computer, other wise, the Power-On-Self-Test (POST) will

continue with its test routines. If you wish to enter the UEFI SETUP UTILITY aer

POST, restart the system by pressing <Ctl> + <Alt> + <Delete>, or by pressing the

reset button on the system chassis. You may also restart by turning the system o

and then back on.

Becau se the UEFI soware is constantly being upd ated, the following UEFI setup
screens and de scriptions are for reference purpose only, and they may not exactly
match what you see on your scre en.

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36

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

4.2 EZ Mode

e EZ Mode screen appears when you enter the BIOS setup program by default. EZ

mode is a dashboard which contains multiple readings of the system’s current status.

You can check the most crucial information of your system, such as CPU speed,

DRAM frequency, SATA information, fan speed, etc.

Press <F6> or click the "Advanced Mode" button at the upper right corner of the

screen to switch to "Advanced Mode" for more options.

1 2 3 4 5 6

No. Function

Help

1

Load UEFI Defaults

2

Save Changes and Exit

3

Discard Changes

4

Change Language

5

Switch to Advanced Mode

6

English

37

4.3 Advanced Mode

e Advanced Mode provides more options to congure the BIOS settings. Refer to

the following sections for the detailed congurations.

To access the EZ Mode, press <F6> or click the "EZ Mode" button at the upper right

corner of the screen.

4.3.1 UEFI Menu Bar

e top of the screen has a menu bar with the following selections:

Main

OC Tweaker

Advanced

Tool

H/W Monitor

Boot

Security

Exit

For setting system time/date information

For overclocking congurations

For advanced system congurations

Useful tools

Displays current hardware status

For conguring boot settings and boot priority

For security settings

Exit the current screen or the UEFI Setup Utility

English

38

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

4.3.2 Navigation Keys

Use < > key or < > key to choose among the selections on the menu bar, and

use < > key or < > key to move the cursor up or down to select items, then

press <Enter> to get into the sub screen. You can also use the mouse to click your

required item.

Please check the following table for the descriptions of each navigation key.

Navigation Key(s) Description

+ / -

<Tab>

<PGUP>

<PGDN>

<HOME>

<END>

<F1>

<F5>

<F7>

<F9>

<F10>

<F12>

<ESC>

To change option for the selected items

Switch to next function

Go to the previous page

Go to the next page

Go to the top of the screen

Go to the bottom of the screen

To display the General Help Screen

Add / Remove Favorite

Discard changes and exit the SETUP UTILITY

Load optimal default values for all the settings

Save changes and exit the SETUP UTILITY

Print screen

Jump to the Exit Screen or exit the current screen

39

English

4.4 Main Screen

When you enter the UEFI SETUP UTILITY, the Main screen will appear and

display the system overview.

My Favorite

Display your collection of BIOS items. Press F5 to add/remove your favorite items.

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40

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

4.5 OC Tweaker Screen

In the OC Tweaker screen, you can set up overclocking features.

Becau se the UEFI soware is constantly being upd ated, the following UEFI setup
screens and de scriptions are for reference purpose only, and they may not exactly
match what you see on your scre en.

CPU Conguration

Intel SpeedStep Technology

Intel SpeedStep technology allows processors to switch between multiple frequen-

cies and voltage points for better power saving and heat dissipation.

Intel Turbo Boost Technology

Intel Turbo Boost Technology enables the processor to run above its base operating

frequency when the operating system requests the highest performance state.

Long Duration Power Limit

Congure Package Power Limit 1 in watts. When the limit is exceeded, the CPU

ratio will be lowered aer a period of time. A lower limit can protect the CPU and

save power, while a higher limit may improve performance.

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41

Long Duration Maintained

Congure the period of time until the CPU ratio is lowered when the Long

Duration Power Limit is exceeded.

Short Duration Power Limit

Congure Package Power Limit 2 in watts. When the limit is exceeded, the CPU

ratio will be lowered immediately. A lower limit can protect the CPU and save

power, while a higher limit may improve performance.

GT Frequency

Congure the frequency of the integrated GPU.

DRAM Conguration

DRAM Tweaker

Fine tune the DRAM settings by leaving marks in checkboxes. Click OK to conrm and

apply your new settings.

DRAM Timing Conguration

DRAM Reference Clock

Select Auto for optimized settings.

DRAM Frequency

If [Auto] is selected, the motherboard will detect the memory module(s) inserted

and assign the appropriate frequency automatically.

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42

Primary Timing

CAS# Latency (tCL)

e time between sending a column address to the memory and the beginning of the data

in response.

RAS# to CAS# Delay and Row Precharge (tRCDtRP)

RAS# to CAS# Delay : e number of clock cycles required between the opening of a row

of memory and accessing columns within it.

Row Precharge: e number of clock cycles required between the issuing of the precharge

command and opening the next row.

RAS# Active Time (tRAS)

e number of clock cycles required between a bank active command and issuing the

precharge command.

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

Command Rate (CR)

e delay between when a memor y chip is selected and when the rst active command can

be issued.

Secondary Timing

Write Recovery Time (tWR)

e amount of delay that must elapse aer the completion of a valid write operation,

before an active bank can be precharged.

Refresh Cycle Time (tRFC)

e number of clocks from a Refresh command until the rst Activate command to

the same rank.

RAS to RAS Delay (tRRD_L)

e number of clocks between two rows activated in dierent banks of the same

rank.

RAS to RAS Delay (tRRD_S)

e number of clocks between two rows activated in dierent banks of the same

rank.

Write to Read Delay (tWTR_L)

e number of clocks between the last valid write operation and the next read command to

the same interna l bank.

Write to Read Delay (tWTR_S)

e number of clocks between the last valid write operation and the next read command to

the same interna l bank.

Read to Precharge (tRTP)

e number of clocks that are inserted between a read command to a row pre-

charge command to the same rank.

Four Activate Window (tFAW)

e time window in which four activates are allowed the same rank.

CAS Write Latency (tCWL)

Congure CAS Write Latency.

Third Timing

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43

tREFI

Congure refresh cycles at an average periodic interval.

tCKE

Congure the period of time the DDR4 initiates a minimum of one refresh

command internally once it enters Self-Refresh mode.

tRDRD_sg

Congure between module read to read delay.

tRDRD_dg

Congure between module read to read delay.

tRDRD_dr

Congure between module read to read delay.

tRDRD_dd

Congure between module read to read delay.

tRDWR_sg

Congure between module read to write delay.

tRDWR_dg

Congure between module read to write delay.

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44

tRDWR_dr

Congure between module read to write delay.

tRDWR_dd

Congure between module read to write delay.

tWRRD_sg

Congure between module write to read delay.

tWRRD_dg

Congure between module write to read delay.

tWRRD_dr

Congure between module write to read delay.

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

tWRRD_dd

Congure between module write to read delay.

tWRWR_sg

Congure between module write to write delay.

tWRWR_dg

Congure between module write to write delay.

tWRWR_dr

Congure between module write to write delay.

tWRWR_dd

Congure between module write to write delay.

RTL Init Value

Congure round trip latency init value for round trip latency training.

IO-L Init Value

Congure IO latency init value for IO latency traning.

RTL (CH A)

Congure round trip latency for channel A.

RTL (CH B)

Congure round trip latency for channel B.

IO-L (CH A)

Congure IO latency for channel A.

IO-L (CH B)

Congure IO latency for channel B.

IO-L Oset (CH A)

Congure IO latency oset for channel A.

IO-L Oset (CH B)

Congure IO latency oset for channel B.

RFR Delay (CH A)

Congure RFR Delay for Channel A.

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45

RFR Delay (CH B)

Congure RFR Delay for Channel B.

Fourth Timing

twRPRE

Congure twR PRE.

Write_Early_ODT

Congure Write_Early_ODT.

tAONPD

Congure tAONPD.

tXP

Congure tXP.

tXPDLL

Congure tXPDLL.

tPRPDEN

Congure tPRPDEN.

tRDPDEN

Congure tR DPDEN.

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46

twRPDEN

Congure twR PDEN.

OREF_RI

Congure OREF_RI.

tREFIx9

Congure tR EFIx9.

txSDLL

Congure txSDLL.

txs_oset

Congure txs_oset.

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

tZQOPER

Congure tZQOPER.

tMOD

Congure tMOD.

ZQCS_period

Congure ZQCS_period.

tZQCS

Congure tZQCS.

Advanced Setting

ODT WR (CH A)

Congure the memory on die termination resistors' WR for channel A.

ODT WR (CH B)

Congure the memory on die termination resistors' WR for channel B.

ODT PARK (CH A)

Congure the memory on die termination resistors' PARK for channel A.

ODT PARK (CH B)

Congure the memory on die termination resistors' PARK for channel B.

ODT NOM (CH A)

Use this to change ODT (CH A) Auto/Manual settings. e default is [Auto].

ODT NOM (CH B)

Use this to change ODT (CH B) Auto/Manual settings. e default is [Auto].

MRC Fast Boot

Enable Memory Fast Boot to skip DRAM memory training for booting faster.

Dll Bandwidth 0

Congure the Dll Bandwidth 0.

Dll Bandwidth 1

Congure the Dll Bandwidth 1.

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47

Dll Bandwidth 2

Congure the Dll Bandwidth 2.

Dll Bandwidth 3

Congure the Dll Bandwidth 3.

Margin Limit

Adjust Margin Limit to get better memory margin.

Voltage Conguration

DRAM Voltage

Use this to congure DRAM Voltage. e default value is [Auto].

PCH +1.0V Voltage

Chipset 1.05V Voltage. Use default settings for best performance.

Save User Default

Type a prole name and press enter to save your settings as user default.

Load User Default

Load previously saved user defaults.

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48

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

4.6 Advanced Screen

In this section, you may set the congurations for the following items: CPU

Conguration, Chipset Conguration, Storage Conguration, ACPI Conguration,

USB Conguration and Trusted Computing.

Setting wrong values in this sec tion may cause the system to malfunction.

UEFI Conguration

UEFI Setup Style

Select the default mode when entering the UEFI setup utility.

Active Page on Entry

Select the default page when entering the UEFI setup utility.

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49

4.6.1 CPU Conguration

Intel Hyper Threading Technology

Intel Hyper reading Technology allows multiple threads to run on each core, so

that the overall performance on threaded soware is improved.

Active Processor Cores

Select the number of cores to enable in each processor package.

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50

CPU C States Support

Enable CPU C States Support for power saving. It is recommended to keep C3, C6

and C7 all enabled for better power saving.

Enhanced Halt State (C1E)

Enable Enhanced Halt State (C1E) for lower power consumption.

CPU C3 State Support

Enable C3 sleep state for lower power consumption.

CPU C6 State Support

Enable C6 deep sleep state for lower power consumption.

CPU C7 State Support

Enable C7 deep sleep state for lower power consumption.

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

Package C State Support

Enable CPU, PCIe, Memory, Graphics C State Support for power saving.

CPU Thermal Throttling

Enable CPU internal thermal control mechanisms to keep the CPU from overheat-

ing.

No-Execute Memory Protection

Processors with No-Execution Memory Protection Technology may prevent certain

classes of malicious buer overow attacks.

Intel Virtualization Technology

Intel Virtualization Technology allows a platform to run multiple operating systems

and applications in independent partitions, so that one computer system can

function as multiple virtual systems.

Hardware Prefetcher

Automatically prefetch data and code for the processor. Enable for better

performance.

Adjacent Cache Line Prefetch

Automatically prefetch the subsequent cache line while retrieving the currently

requested cache line. Enable for better performance.

SW Guard Extensions (SGX)

Intel SGX is a set of new CPU instructions that can be used by applications to set

aside private regions of code and data.

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4.6.2 Chipset Conguration

Primary Graphics Adapter

Select a primary VGA.

Top Of Lower Usable Dram

Maximum Value of TOLUD. Dynamic assignment would adjust TOLUD

automatically based on largest MMIO length of installed graphic controller.

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52

VT-d

Intel® Virtualization Technology for Directed I/O helps your virtual machine

monitor better utilize hardware by improving application compatibility and

reliability, and providing additional levels of manageability, security, isolation, and

I/O performance.

PCIE1 Link Speed

Select the link speed for PCIE1.

PCIE2 Link Speed

Select the link speed for PCIE2.

PCIE ASPM Support

is option enables/disables the ASPM support for all CPU downstream devices.

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

PCH PCIE ASPM Support

is option enables/disables the ASPM support for all PCH PCIE devices.

DMI ASPM Support

is option enables/disables the control of ASPM on CPU side of the DMI Link.

PCH DMI ASPM Support

is option enables/disables the ASPM support for all PCH DMI devices.

IOAPIC 24-119 Entries

I/O APICs contain a redirection table, which is used to route the interrupts it receives from

peripheral buses to one or more local APICs. Enable/disable IOAPIC 24-119 Entries to

expand to PIROI-PIROX.

Share Memory

Congure the size of memory that is allocated to the integrated graphics processor when

the system boots up.

IGPU Multi-Monitor

Select disable to disable the integrated graphics when an external graphics card is installed.

Select enable to keep the integrated graphics enabled at all times.

Onboard LAN

Enable or disable the onboard network interface controller.

Onboard HD Audio

Enable/disable onboard HD audio. Set to Auto to enable onboard HD audio and

automatically disable it when a sound card is installed.

Front Panel

Enable/disable front panel HD audio.

Onboard HDMI HD Audio

Enable audio for the onboard digital outputs.

Restore on AC/Power Loss

Select the power state aer a power failure. If [Power O] is selected, the power will

remain o when the power recovers. If [Power On] is selected, the system will start

to boot up when the power recovers.

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4.6.3 Storage Conguration

SATA Controller(s)

Enable/disable the SATA controllers.

SATA Aggressive Link Power Management

SATA Aggressive Link Power Management allows SATA devices to enter a low

power state during periods of inactivity to save power. It is only supported by AHCI

mode.

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Hard Disk S.M.A.R.T.

S.M.A.R.T stands for Self-Monitoring, Analysis, and Reporting Technolog y. It is a

monitoring system for computer hard disk drives to detect and report on various

indicators of reliability.

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

4.6.4 ACPI Conguration

Suspend to RAM

Select disable for ACPI suspend type S1. It is recommended to select auto for ACPI

S3 power saving.

ACPI HEPT Table

Enable the High Precision Event Timer for better performance.

PS/2 Keyboard Power On

Allow the system to be waked up by a PS/2 Keyboard.

PCIE Devices Power On

Allow the system to be waked up by a PCIE device and enable wake on LAN.

RTC Alarm Power On

Allow the system to be waked up by the rea l time clock alarm. Set it to By OS to let

it be handled by your operating system.

USB Keyboard/Remote Power On

Allow the system to be waked up by an USB keyboard or remote controller.

USB Mouse Power On

Allow the system to be waked up by an USB mouse.

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4.6.5 USB Conguration

Legacy USB Support

Enable or disable Legacy OS Support for USB 2.0 devices. If you encounter USB

compatibility issues it is recommended to disable legacy USB support. Select UEFI

Setup Only to support USB devices under the UEFI setup and Windows/Linux

operating systems only.

PS/2 Simulator

Enable PS/2 Simulator. is should be enabled for the complete USB keyboard

legacy support for non-USB aware OSes.

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*Enable this option if you install Windows 7.

XHCI Hand-o

is is a workaround for OSes without XHCI hand-o support. e XHCI

ownership change should be claimed by XHCI driver.

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

4.6.6 Trusted Computing

Security Device Support

Enable or disable BIOS support for security device.

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4.7 Tools

OMG (Online Management Guard)

Administrators are able to establish an internet curfew or restrict internet access

at specied times via OMG. You may schedule the starting and ending hours of

internet access granted to other users. In order to prevent users from bypassing

OMG, guest accounts without permission to modify the system time are required.

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UEFI Tech Service

Contact ASRock Tech Service if you are having trouble with your PC. Please setup

network conguration before using UEFI Tech Service.

Easy Driver Installer

For users that don’t have an optical disk drive to install the drivers from our support

CD, Easy Driver Installer is a handy tool in the UEFI that installs the LAN driver

to your system via an USB storage device, then downloads and installs the other

required drivers automatically.

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

Boot Manager

Boot Manager is specically designed for the dual OS platform/multi-OS platform

users to easily customize and manage the boot menu.

*Please connect more than one boot devices to use this tool.

Boot Manager

Enable/disable the Boot Manager.

Boot Manager Timeout

Enable/disable the Boot Manager Timeout.

Timeout Seconds

Congure the number of seconds to wait for the Boot Manager.

Instant Flash

Save UEFI les in your USB storage device and run Instant Flash to update your

UEFI.

Internet Flash - DHCP (Auto IP), Auto

ASRock Internet Flash downloads and updates the latest UEFI rmware version

from our servers for you. Please setup network conguration before using Internet

Flash.

*For BIOS backup and recovery purpose, it is recommended to plug in your USB

pen drive before using this function.

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Network Conguration

Use this to congure internet connection settings for Internet Flash.

Internet Setting

Enable or disable sound eects in the setup utility.

UEFI Download Server

Select a server to download the UEFI rmware.

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H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

4.8 Hardware Health Event Monitoring Screen

is section allows you to monitor the status of the hardware on your system,

including the parameters of the CPU temperature, motherboard temperature, fan

speed and voltage.

Fan-Tastic Tuning

Select a fan mode for CPU Fan 1, or choose Customize to set 5 CPU temperatures

and assign a respective fan speed for each temperature.

CPU Fan 1 Setting

Select a fan mode for CPU Fan 1, or choose Customize to set 5 CPU temperatures

and assign a respective fan speed for each temperature.

Chassis Fan 1 Setting

Select a fan mode for Chassis Fan 1, or choose Customize to set 5 CPU temperatures

and assign a respective fan speed for each temperature.

Chassis Fan 1 Temp Source

Select a fan temperature source for Chassis Fan 1.

Over Temperature Protection

When Over Temperature Protection is enabled, the system automatically shuts

down when the motherboard is overheated.

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Case Open Feature

Enable or disable Case Open Feature to detect whether the chassis cover has been

removed.

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H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

4.9 Security Screen

In this section you may set or change the supervisor/user password for the system.

You may also clear the user password.

Supervisor Password

Set or change the password for the administrator account. Only the administrator

has authority to change the settings in the UEFI Setup Utility. Leave it blank and

press enter to remove the password.

User Password

Set or change the password for the user account. Users are unable to change the

settings in the UEFI Setup Utility. Leave it blank and press enter to remove the

password.

Secure Boot

Use this item to enable or disable support for Windows 8.1 Secure Boot.

Intel(R) Platform Trust Technology

Enable/disable Intel PTT in ME. Disable this option to use discrete TPM Module.

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4.10 Boot Screen

is section displays the available devices on your system for you to congure the

boot settings and the boot priority.

Fast Boot

Fast Boot minimizes your computer's boot time. In fast mode you may not boot

from an USB storage device. Ultra Fast mode is only supported by Windows 8.1

and the VBIOS must support UEFI GOP if you are using an external graphics card.

Please notice that Ultra Fast mode will boot so fast that the only way to enter this

UEFI Setup Utility is to Clear CMOS or run the Restart to UEFI utility in Windows.

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Boot From Onboard LAN

Allow the system to be waked up by the onboard LAN.

Setup Prompt Timeout

Congure the number of seconds to wait for the setup hot key.

Bootup Num-Lock

Select whether Num Lock should be turned on or o when the system boots up.

Boot Beep

Select whether the Boot Beep should be turned on or o when the system boots up. Please

note that a buzzer is needed.

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

Full Screen Logo

Enable to display the boot logo or disable to show normal POST messages.

AddOn ROM Display

Enable AddOn ROM Display to see the AddOn ROM messages or congure the

AddOn ROM if you've enabled Full Screen Logo. Disable for faster boot speed.

Boot Failure Guard Message

If the computer fails to boot for a number of times the system automatically restores

the default settings.

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CSM (Compatibility Support Module)

CSM

Enable to launch the Compatibility Support Module. Please do not disable unless

you’re running a WHCK test. If you are using Windows 8.1 64-bit and all of your

devices support UEFI, you may also disable CSM for faster boot speed.

Launch PXE OpROM Policy

Select UEFI only to run those that support UEFI option ROM only. Select Legacy

only to run those that support legacy option ROM only. Select Do not launch to not

execute both legacy and UEFI option ROM.

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Launch Storage OpROM Policy

Select UEFI only to run those that support UEFI option ROM only. Select Legacy

only to run those that support legacy option ROM only. Select Do not launch to not

execute both legacy and UEFI option ROM.

Launch Video OpROM Policy

Select UEFI only to run those that support UEFI option ROM only. Select Legacy

only to run those that support legacy option ROM only. Select Do not launch to not

execute both legacy and UEFI option ROM.

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

4.11 Exit Screen

Save Changes and Exit

When you select this option the following message, “Save conguration changes

and exit setup?” will pop out. Select [OK] to save changes and exit the UEFI SETUP

UTILITY.

Discard Changes and Exit

When you select this option the following message, “Discard changes and exit

setup?” will pop out. Select [OK] to exit the UEFI SETUP UTILITY without saving

any changes.

Discard Changes

When you select this option the following message, “Discard changes?” will pop

out. Select [OK] to discard all changes.

Load UEFI Defaults

Load UEFI default values for a ll options. e F9 key can be used for this operation.

Launch EFI Shell from lesystem device

Copy shellx64.e to the root directory to launch EFI Shell.

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Contact Information

If you need to contact ASRock or want to know more about ASRock, you’re welcome

to visit ASRock’s website at http://ww w.asrock.com; or you may contact your dealer

for further information. For technical questions, please submit a support request

form at http://www.asrock.com/support/tsd.asp

ASRock Incorporation

2F., No.37, Sec. 2, Jhongyang S. Rd., Beitou District,

Taipei City 112, Taiwan (R.O.C.)

ASRock EUROPE B.V.

Bijsterhuizen 11-11

6546 AR Nijmegen

e Netherlands

Phone: [phone]

Fax: [phone]

ASRock America, Inc.

13848 Magnolia Ave, Chino, CA91710

U.S.A.

Phone: [phone]

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Fax: [phone]