ASRock H110M-DVS R3.0 Service Manual

Version 1.0

Published August 2016

Copyright©2016 ASRock INC. All rights reserved.

Copyright Notice:

No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.

Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to

infringe.

Disclaimer:

Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.

With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.

In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.

is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that

may cause undesired operation.

CALIFORNIA, USA ONLY

e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see ww w.dtsc.ca.gov/hazardouswaste/
perchlorate”

ASRock Website: http://www.asrock.com

AUSTRALIA ONLY

Our goods come with guarantees that cannot be excluded under the Australian Consumer
Law. You are entitled to a replacement or refund for a major failure and compensation for
any other reasonably foreseeable loss or damage caused by our goods. You are also entitled
to have the goods repaired or replaced if the goods fail to be of acceptable quality and the
failure does not amount to a major failure. If you require assistance please call ASRock Tel
: [phone] ext.123 (Standard International call charges apply)

e terms HDMI™ and HDMI High-Denition Multimedia Interface, and the HDMI
logo are trademarks or registered trademarks of HDMI Licensing LLC in the United
States and other countries.

Contents

Chapter 1 Introduction 1

1.1 Package Contents 1

1.2 Specications 2

1.3 Motherboard Layout 6

1.4 I/O Panel 10

Chapter 2 Installation 14

2.1 Installing the CPU 15

2.2 Installing the CPU Fan and Heatsink 18

2.3 Installing Memory Modules (DIMM) 19

2.4 Expansion Slots (PCI Express Slots) 21

2.5 Onboard Headers and Connectors 22

Chapter 3 Software and Utilities Operation 26

3.1 Installing Drivers 26

3.2 ASRock Live Update & APP Shop 27

3.2.1 UI Overview 27

3.2.2 Apps 28

3.2.3 BIOS & Drivers 31

3.2.4 Setting 32

3.3 Enabling USB Ports for Windows® 7 Installation 33

Chapter 4 UEFI SETUP UTILITY 36

4.1 Introduction 36

4.2 EZ Mode 37

4.3 Advanced Mode 38

4.3.1 UEFI Menu Bar 38

4.3.2 Navigation Keys 39

4.4 Main Screen 40

4.5 OC Tweaker Screen 41

4.6 Advanced Screen 49

4.6.1 CPU Conguration 50

4.6.2 Chipset Conguration 52

4.6.3 Storage Conguration 54

4.6.4 ACPI Conguration 55

4.6.5 USB Conguration 56

4.6.6 Trusted Computing 57

4.7 Tools 58

4.8 Hardware Health Event Monitoring Screen 61

4.9 Security Screen 63

4.10 Boot Screen 64

4.11 Exit Screen 67

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

Chapter 1 Introduction

ank you for purchasing ASRock H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-

DGS R3.0 motherboard, a reliable motherboard produced under ASRock’s

consistently stringent quality control. It delivers excellent performance with robust

design conforming to ASRock ’s commitment to quality and endurance.

In this documentation, Chapter 1 and 2 contains the introduction of the

motherboard and step-by-step installation guides. Chapter 3 contains the operation

guide of the soware and utilities. Chapter 4 contains the conguration guide of

the BIOS setup.

Becau se the motherboard specications and the BIOS soware might be updated, the
content of this documentation will be subject to change without notice. In case any
modications of this documentation occur, the updated version will be available on
ASRock’s website w ithout f urther notice. If you require technical support relate d to
this motherboard, please vi sit our website for s pecic information about the model
you are using. You may nd the l atest VGA cards and CPU suppor t list on ASRock’s
website a s well. ASRock website ht tp://www.a srock.com.

1.1 Package Contents

ASRock H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0 Motherboard (Micro

•

ATX Form Factor)

ASRock H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0 Quick Installation

•

Guide

ASRock H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0 Support CD

•

2 x Serial ATA (SATA) Data Cables (Optional)

•

1 x I/O Panel Shield

•

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1

1.2 Specications

Platform

CPU

Chipset

Memory

Expansion
Slot

•

•

•

•

•

•

•

•

•

•

•

•

•

•

* Supports NVMe SSD as boot disks

•

Micro ATX Form Factor

Solid Capacitor design

Supports 6th Generation Intel® CoreTM i7/i5/i3/Pentium®/

Celeron® Processors (Socket 1151)

4 Power Phase design

Supports CPU up to 95W

Supports Intel® Turbo Boost 2.0 Technology

Intel® H110

Dual Channel DDR4 Memory Technology

2 x DDR4 DIMM Slots

Supports DDR4 2133 non-ECC, un-buered memory

Supports ECC UDIMM memory modules (operate in non-

ECC mode)

Max. capacity of system memory: 32GB

Supports Intel® Extreme Memory Prole (XMP) 2.0

1 x PCI Express 3.0 x16 Slot (PCIE2: x16 mode)*

1 x PCI Express 2.0 x1 Slot

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2

Graphics

Intel® HD Graphics Built-in Visuals and the VGA outputs

•

can be supported only with processors which are GPU

integrated.

Supports Intel® HD Graphics Built-in Visuals : Intel® Quick

•

Sync Video with AVC, MVC (S3D) and MPEG-2 Full

HW Encode1, Intel® InTruTM 3D, Intel® Clear Video HD

Technology, Intel® InsiderTM, Intel® HD Graphics 510/530

Pixel Shader 5.0, DirectX 12

•

Max. shared memory 1024MB

•

* e size of ma ximum shared memory may vary from dierent

operating systems.

H110M-HDS R3.0:

Dual graphics output: Support DVI-D and HDMI ports by

•

independent display controllers

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

Supports HDMI with max. resolution up to 4K x 2K

•

(4096x2160) @ 24Hz / (3840x2160) @ 30Hz

Supports DVI-D with ma x. resolution up to 1920x1200 @

•

60Hz

Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and

•

HBR (High Bit Rate Audio) with HDMI Port (Compliant

HDMI monitor is required)

Supports Accelerated Media Codecs: HEVC, VP8, VP9

•

Supports HDCP with DVI-D and HDMI Ports

•

Supports Full HD 1080p Blu-ray (BD) playback with DVI-D

•

and HDMI Ports

H110M-DVS R3.0:

Dual graphics output: Support DVI-D and D-Sub ports by

•

independent display controllers

Supports DVI-D with ma x. resolution up to 1920x1200 @

•

60Hz

Supports D-Sub with max. resolution up to 1920x1200 @

•

60Hz

Supports Accelerated Media Codecs: HEVC, VP8, VP9

•

Supports HDCP with DVI-D Port

•

Supports Full HD 1080p Blu-ray (BD) playback with DVI-D

•

Port

H110M-DGS R3.0:

Supports DVI-D with ma x. resolution up to 1920x1200 @

•

60Hz

Supports Accelerated Media Codecs: HEVC, VP8, VP9

•

Supports HDCP with DVI-D Port

•

Supports Full HD 1080p Blu-ray (BD) playback with DVI-D

•

Port

Audio

7.1 CH HD Audio (Realtek ALC887 Audio Codec)

•

* To congure 7.1 CH HD Audio, it is required to use an HD

front panel audio module and enable the multi-channel audio

feature through the audio driver.

Supports Surge Protection (ASRock Full Spike Protection)

•

ELNA Audio Caps

•

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3

LAN

Rear Panel
I/O

PCIE x1 Gigabit LAN 10/100/1000 Mb/s

•

Realtek RTL8111C

•

Supports Wake-On-LAN

•

Supports Lightning/ESD Protection (ASRock Full Spike

•

Protection)

Supports LAN Cable Detection

•

Supports PXE

•

1 x PS/2 Mouse Port

•

1 x PS/2 Keyboard Port

•

4 x USB 2.0 Ports (Supports ESD Protection (ASRock Full

•

Spike Protection))*

* ACPI wake-up function is supported on USB01 ports only.

2 x USB 3.0 Ports (Supports ESD Protection (ASRock Full

•

Spike Protection))

1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED

•

LED)

HD Audio Jacks: Line in / Front Speaker / Microphone

•

H110M-HDS R3.0:

1 x DVI-D Port

•

1 x HDMI Port

•

H110M-DVS R3.0:

1 x D-Sub Port

•

1 x DVI-D Port

•

H110M-DGS R3.0:

1 x DVI-D Port

•

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4

Storage

Connector

4 x SATA3 6.0 Gb/s Connectors, support NCQ, AHCI and

•

Hot Plug

1 x TPM Header

•

1 x Chassis Intrusion and Speaker Header

•

1 x CPU Fan Connector (4-pin)

•

1 x Chassis Fan Connector (4-pin)

•

* e CPU Fan Connector supports the CPU fan of ma ximum

1A (12W) fan power.

1 x 24 pin ATX Power Connector

•

1 x 8 pin 12V Power Connector

•

1 x Front Panel Audio Connector

•

BIOS
Feature

Hardware
Monitor

OS

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

1 x USB 2.0 Header (Supports 2 USB 2.0 ports) (Supports

•

ESD Protection (ASRock Full Spike Protection))

1 x USB 3.0 Header (Supports 2 USB 3.0 ports) (Supports

•

ESD Protection (ASRock Full Spike Protection))

AMI UEFI Legal BIOS with multilingual GUI support

•

ACPI 5.0 Compliant wake up events

•

SMBIOS 2.7 Support

•

DRAM, PCH 1.0V Voltage Multi-adjustment

•

CPU/Chassis temperature sensing

•

CPU/Chassis Fan Tachometer

•

CPU/Chassis Quiet Fan (Auto adjust chassis fan speed by

•

CPU temperature)

CPU/Chassis Fan multi-speed control

•

CASE OPEN detection

•

Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore

•

Microso® Windows® 10 64-bit / 8.1 64-bit / 7 32-bit / 7 64-

•

bit

* To install Windows® 7 OS, a modied installation disk with

xHCI drivers packed into the ISO le is required. Please refer to

page 33 for more detailed instructions.

* For the updated Windows® 10 driver, please visit ASRock ’s

website for details: http://ww w.asrock.com

FCC, CE, WHQL

Certica-

•

tions

* For detailed product information, please visit our website: http://ww w.asrock.com

Please realize that the re is a certain r isk involved with overclo cking, including
adjusting the setting in the BIOS, applying Untied Overclocking Technol ogy, or using
third-party overclocking tool s. Overclocking may aect your system’s stability, or
even cause dam age to the components and devices of your system. It should be done
at your own risk and expense. We are not responsible for poss ible damage caused by
overclocking.

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5

1.3 Motherboard Layout

Intel

H110

DDR 4_B 1 (64 bi t, 28 8-p in mo dul e)

DDR 4_A 1 (64 bi t, 28 8-p in mo dul e)

ATXP WR1

PCIE 2

Top:
RJ- 45

USB 2. 0
T: US B0
B: USB 1

HDLED RESET

PLED PWR BTN

PANEL1

1

1

SPK_CI1

1

HD_AUD IO1

H110M-H DS

RoHS

USB 3.0
T: USB 1
B: U SB2

CMO S

Bat te ry

USB3_3_ 4

1

CPU_FAN 1

1

TPMS1

PCI E xp re ss 3.0

Front U SB 3.0

Top:

LINE IN

Cent er:

FRON T

Bott om:

MIC I N

SATA3_0_ 1

SATA3_2_ 3

BIOS
ROM

CLRMOS1

ATX12V 1

DVI 1

PCIE 1

PS2

Keyb oard

PS2

Mous e

HDM I1

USB 2.0
T: USB 2
B: U SB3

CHA_FAN 1

USB_4_ 5

1

H110M-HDS R3.0:

English

6

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

Intel

H110

DDR 4_B 1 (64 bi t, 28 8-p in mo dul e)

DDR 4_A 1 (64 bi t, 28 8-p in mo dul e)

ATXP WR1

PCIE 2

Top:
RJ- 45

USB 2. 0
T: US B0
B: USB 1

HDLED RESET

PLED PWR BTN

PANEL1

1

1

SPK_CI1

1

HD_AUD IO1

H110M-D VS

RoHS

USB 3.0
T: USB 1
B: U SB2

CMO S

Bat te ry

USB3_3_ 4

1

CPU_FAN 1

1

TPMS1

PCI E xp re ss 3.0

Front U SB 3. 0

Top:

LINE IN

Cent er:

FRON T

Bott om:

MIC I N

SATA3_0_ 1

SATA3_2_ 3

BIOS
ROM

CLRMOS1

ATX12V 1

DVI 1

PCIE 1

PS2

Keyb oard

PS2

Mous e

USB 2.0
T: USB 2
B: U SB3

CHA_FAN 1

USB_4_ 5

1

VGA 1

H110M-DVS R3.0:

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7

Intel

H110

DDR 4_B 1 (64 bi t, 28 8-p in mo dul e)

DDR 4_A 1 (64 bi t, 28 8-p in mo dul e)

ATXP WR1

PCIE 2

Top:
RJ- 45

USB 2. 0
T: US B0
B: USB 1

HDLED RESET

PLED PWR BTN

PANEL1

1

1

SPK_CI1

1

HD_AUD IO1

H110M-D GS

RoHS

USB 3.0
T: USB 1
B: U SB2

CMO S

Bat te ry

USB3_3_ 4

1

CPU_FAN 1

1

TPMS1

PCI E xp re ss 3.0

Front U SB 3. 0

Top:

LINE IN

Cent er:

FRON T

Bott om:

MIC I N

SATA3_0_ 1

SATA3_2_ 3

BIOS
ROM

CLRMOS1

ATX12V 1

DVI 1

PCIE 1

PS2

Keyb oard

PS2

Mous e

USB 2.0
T: USB 2
B: U SB3

CHA_FAN 1

USB_4_ 5

1

H110M-DGS R3.0:

English

8

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

No. Description

1 ATX 12V Power Connector (ATX12V1)

2 CPU Fan Connector (CPU_FAN1)

3 2 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)

4 Chassis Fan Connector (CHA_FAN1)

5 ATX Power Connector (ATXPWR1)

6 SATA3 Connectors (SATA3_2_3)

7 SATA3 Connectors (SATA3_0_1)

8 USB 3.0 Header (USB3_3_4)

9 USB 2.0 Header (USB_4_5)

10 System Panel Header (PANEL1)

11 Chassis Intrusion and Speaker Header (SPK_CI1)

12 TPM Header (TPMS1)

13 Front Panel Audio Header (HD_AUDIO1)

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9

1.4 I/O Panel

H110M-HDS R3.0:

1 2

3

4

11 56

No. Description No. Description

1 PS/2 Mouse Port 7 USB 2.0 Ports (USB_23)

2 LAN RJ-45 Port* 8 USB 3.0 Ports (USB3_12)

3 Line In (Light Blue)** 9 HDMI Port

4 Front Speaker (Lime)** 10 DVI-D Port

5 Microphone (Pink)** 11 PS/2 Keyboard Port

6 USB 2.0 Ports (USB01)***

10

789

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10

H110M-DVS R3.0:

1 3

2

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

4

5

11 67

No. Description No. Description

1 PS/2 Mouse Port 7 USB 2.0 Ports (USB01)***

2 D-Sub Port 8 USB 2.0 Ports (USB_23)

3 LAN RJ-45 Port* 9 USB 3.0 Ports (USB3_12)

4 Line In (Light Blue)** 10 DVI-D Port

5 Front Speaker (Lime)** 11 PS/2 Keyboard Port

6 Microphone (Pink)**

10

89

11

English

H110M-DGS R3.0:

1 2

3

4

English

10

9

78

No. Description No. Description

1 PS/2 Mouse Port 6 USB 2.0 Ports (USB01)***

2 LAN RJ-45 Port* 7 USB 2.0 Ports (USB_23)

3 Line In (Light Blue)** 8 USB 3.0 Ports (USB3_12)

4 Front Speaker (Lime)** 9 DVI-D Port

5 Microphone (Pink)** 10 PS/2 Keyboard Port

* ere are two LEDs on the LAN port. Please refer to the table below for the LAN port LED indications.

ACT/LINK L ED

SPEED LE D

LAN Por t

Activity / Link LED Speed LED

Status Description Status Description

O No Link O 10Mbps connection
Blinking Data Activity Orange 100Mbps connection
On Link Green 1Gbps connection

56

12

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

** To congure 7.1 CH HD Audio, it i s required to use an HD front panel audio module and enable the multi­channel audio feature through the audio driver.

Please set Speaker Conguration to “7.1 Speaker”in the Realtek HD Audio Manager.

Function of the Audio Por ts in 7.1-channel Con guration:

Port Function

Light Blue (Rear panel) Rear Speaker Out
Lime (Rear panel) Front Speaker Out
Pink (Rear panel) Central /Subwoofer Speaker Out
Lime (Front panel) Side Speaker Out

*** ACPI wake-up function is supported on USB01 por ts only.

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13

Chapter 2 Installation

is is a Micro ATX form factor motherboard. Before you install the motherboard,

study the conguration of your chassis to ensure that the motherboard ts into it.

Pre-installation Precautions

Take note of the following precautions before you install motherboard components

or change any motherboard settings.

Make sure to unplug the power cord before installing or removing the motherboard

•

components. Failure to do so may cause physical injuries and damages to motherboard

components.

In order to avoid damage from static electricity to the motherboard’s components,

•

NEVER place your motherboard directly on a carpet. Also remember to use a grounded

wrist strap or touch a safety grounded object before you handle the components.

Hold components by the edges and do not touch the ICs.

•

Whenever you uninstall any components, place them on a grounded anti-static pad or

•

in the bag that comes with the components.

When placing screws to secure the motherboard to the chassis, please do not over-

•

tighten the screws! Doing so may damage the motherboard.

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14

2.1 Installing the CPU

1. Before you inse rt the 1151-Pin CPU into the socket, plea se check if the PnP cap
is on the socket, if the CPU sur face is unclean, or if th ere are any b ent pins in the
socket. Do not force to insert the CPU into the socket if above situ ation is found.
Other wise, the CPU wil l be seriously d amaged.

2. Unplug all power cables before in stalling the CPU.

1

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

A

B

2

English

15

3

4

English

16

5

H110M-HDS R3.0 / H110M-DVS R3.0 / H110M-DGS R3.0

Please save and replace the cover if the processor i s removed. e cover must be
placed if you wish to return the motherboard for aer service.

17

English