Version 1.0
Published June 2015
Copyright©2015 ASRock INC. All rights reserved.
Copyright Notice:
No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.
Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/
perchlorate”
ASRock Website: http://www.asrock.com
Contents
Chapter 1 Introduction 1
1.1 Package Contents 1
1.2 Specications 2
1.3 Motherboard Layout 6
1.4 I/O Panel 8
Chapter 2 Installation 10
2.1 Installing the CPU 11
2.2 Installing the CPU Fan and Heatsink 14
2.3 Installing Memory Modules (DIMM) 15
2.4 Expansion Slots (PCI Express Slots) 17
2.5 Jumpers Setup 18
2.6 Onboard Headers and Connectors 19
Chapter 3 Software and Utilities Operation 23
3.1 Installing Drivers 23
3.2 ASRock Live Update & APP Shop 24
3.2.1 UI Overview 24
3.2.2 Apps 25
3.2.3 BIOS & Drivers 28
3.2.4 Setting 29
3.3 Enabling USB Ports for Windows® 7 Installation 30
Chapter 4 UEFI SETUP UTILITY 33
4.1 Introduction 33
4.1.1 UEFI Menu Bar 33
4.1.2 Navigation Keys 34
4.2 Main Screen 35
4.3 OC Tweaker Screen 36
4.4 Advanced Screen 44
4.4.1 CPU Conguration 45
4.4.2 Chipset Conguration 47
4.4.3 Storage Conguration 49
4.4.4 Super IO Conguration 50
4.4.5 ACPI Conguration 51
4.4.6 USB Conguration 53
4.4.7 Trusted Computing 54
4.5 Tools 55
4.6 Hardware Health Event Monitoring Screen 59
4.7 Security Screen 61
4.8 Boot Screen 62
4.9 Exit Screen 65
H110M-DVS/D3
Chapter 1 Introduction
ank you for purchasing ASRock H110M-DVS/D3 motherboard, a reliable
motherboard produced under ASRock ’s consistently stringent qualit y control.
It delivers excellent performance with robust design conforming to ASRock’s
commitment to quality and endurance.
In this documentation, Chapter 1 and 2 contains the introduction of the
motherboard and step-by-step installation guides. Chapter 3 contains the operation
guide of the soware and utilities. Chapter 4 contains the conguration guide of
the BIOS setup.
Becau se the motherboard speci cations and the BIOS soware might be updated, the
content of this doc umentation will be subject to change without notice. In case any modications of this documentation occur, the updated version will be available on ASRock’s
website w ithout further notice . If you require technical suppor t related to this motherboard, please v isit our website for specic information about the model you are using. You
may nd the l atest VGA cards and CPU support list on ASRock’s website as well. ASRock
website http://www.asrock.com.
1.1 Package Contents
• ASRock H110M-DVS/D3 Motherboard (Micro ATX Form Factor)
• ASRock H110M-DVS/D3 Quick Installation Guide
• ASRock H110M-DVS/D3 Support CD
• 2 x Serial ATA (SATA) Data Cables (Optional)
• 1 x I/O Panel Shield
English
1.2 Specications
English
Platform
CPU
Chipset
Memory
Expansion
Slot
Graphics
• Micro ATX Form Factor
• Solid Capacitor design
• High Density Glass Fabric PCB
• Supports 6th Generation Intel® CoreTM i7/i5/i3/Pentium®/
Celeron® Processors (Socket 1151)
• Supports Intel® Turbo Boost 2.0 Technology
• Intel® H110
• Dual Channel DDR3/DDR3L Memory Technology
• 2 x DDR3/DDR3L DIMM Slots
• Supports DDR3/DDR3L 1600/1333/1066 non-ECC, un-
buered memory
• Supports ECC UDIMM memory modules (operate in non-
ECC mo de)
• Max. capacity of system memory: 32GB
• Supports Intel® Extreme Memory Prole (XMP) 1.3 / 1.2
• 1 x PCI Express 3.0 x16 Slot (PCIE1: x16 mode)
• 2 x PCI Express 2.0 x1 Slots
* Intel® HD Graphics Built-in Visuals and the VGA outputs can
be supported only with processors which are GPU integrated.
• Supports Intel® HD Graphics Built-in Visuals : Intel® Quick
Sync Video with AVC, MVC (S3D) and MPEG-2 Full
HW Encode1, Intel® InTruTM 3D, Intel® Clear Video HD
Technology, Intel® InsiderTM, Intel® HD Graphics 510/530
• Pixel Shader 5.0, DirectX 12
• Max. shared memory 1792MB
• Dual graphics output: Support DVI-D and D-Sub ports by
independent display controllers
• Supports DVI-D with max. resolution up to 1920x1200 @
60Hz
2 3
H110M-DVS/D3
• Supports D-Sub with ma x. resolution up to 1920x1200 @
60Hz
• Supports Accelerated Media Codecs: HEVC, VP8, VP9
• Supports HDCP with DVI-D Port
• Supports Full HD 1080p Blu-ray (BD) playback with DVI-D
Port
Audio
LAN
Rear Panel
I/O
• 7.1 CH HD Audio (Realtek ALC887 Audio Codec)
* To congure 7.1 CH HD Audio, it is required to use an HD
front panel audio module and enable the multi-channel audio
feature through the audio driver.
• Supports Surge Protection (ASRock Full Spike Protection)
• ELNA Audio Caps
• PCIE x1 Gigabit LAN 10/100/1000 Mb/s
• R ea ltek RTL8111E
• Supports Wake-On-LAN
• Supports Lightning/ESD Protection (ASRock Full Spike
Protection)
• Supports LAN Cable Detection
• Supports Energy Ecient Ethernet 802.3az
• Supports PXE
• 1 x PS/2 Mouse/Keyboard Port
• 1 x D-Sub Port
• 1 x DVI-D Port
• 4 x USB 2.0 Ports (Supports ESD Protection (ASRock Full
Spike Protection))
• 2 x USB 3.0 Ports (Supports ESD Protection (ASRock Full
Spike Protection))
• 1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED
LED)
• HD Audio Jacks: Line in / Front Speaker / Microphone
English
Storage
• 4 x SATA3 6.0 Gb/s Connectors, support NCQ, AHCI and
Hot Plug
Connector
BIOS
Feature
Hardware
Monitor
• 1 x COM Port Header
• 1 x TPM Header
• 1 x Chassis Intrusion and Speaker Header
• 1 x CPU Fan Connector (4-pin)
• 1 x Chassis Fan Connector (4-pin)
* e CPU Fan Connector supports the CPU fan of maxi-
mum 1A (12W) fan power.
• 1 x 24 pin ATX Power Connector
• 1 x 4 pin 12V Power Connector
• 1 x Front Panel Audio Connector
• 1 x USB 2.0 Header (Supports 2 USB 2.0 ports) (Supports
ESD Protection (ASRock Full Spike Protection))
• 1 x USB 3.0 Header (Supports 2 USB 3.0 ports) (Supports
ESD Protection (ASRock Full Spike Protection))
• 128Mb AMI UEFI Legal BIOS with multilingua l GUI sup-
port
• ACPI 1.1 Compliant wake up events
• SMBIOS 2.3.1 Support
• CPU, GT_CPU, DRAM, PCH 1.0V, VCCIO, VCCSA Voltage
Multi-adjustment
• CPU/Chassis temperature sensing
• CPU/Chassis Fan Tachometer
• CPU/Chassis Quiet Fan (Auto adjust chassis fan speed by
CPU temperature)
• CPU/Chassis Fan multi-speed control
• CASE OPEN detection
• Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore, CPU
English
4 5
H110M-DVS/D3
OS
• Microso® Windows® 10 64-bit / 8.1 64-bit / 7 32-bit / 7 64-
bit
* To install Windows® 7 OS, a modied installation disk with
xHCI drivers packed into the ISO le is required. Please refer to
page 30 for more detailed instructions.
* For the updated Windows® 10 driver, please visit ASRock's
website for details: http://www.asrock.com
Certications
* For detailed product information, please visit our website: http://www.asrock .com
Please realize that there i s a certain risk involved with overclocking, including adjusting
the setting in the BIOS , applying Untied Overclocking Technology, or using third-party
overclocking tools. Ove rclocking may aect your system’s stabilit y, or even cau se damage to
the components and devices of your system. It should be done at your own r isk and expense.
We are not responsible for possible damage caused b y overclocking.
• FCC, CE, WHQL
• ErP/EuP ready (ErP/EuP ready power supply is required)
English
Intel
H110
DDR 3_B1 (6 4 bit, 24 0-pin m odule )
DDR 3_A1 (6 4 bit, 24 0-pin m odule )
CMOS
Battery
Sup er
I/O
ATXPWR 1
Top:
RJ-45
USB 2.0
T: USB0
B: USB1
CLRCMO S1
1
HDLED RESET
PLED PWRBTN
PANEL1
1
USB4_5
COM1
1
1
HD_AUDIO1
H110M-DVS/D3
CHA_FAN1
RoHS
7
9
12
16
15
2
CPU_FAN1
3
4
6
5
1
128Mb
BIOS
Audio
CODEC
PCIE1
PCI Express 3.0
TPMS1
1
1
USB3_4_5
PCIE3
USB 2.0
T: USB2
B: USB3
Top:
LINE IN
Cente r:
FRONT
Botto m:
MIC IN
1
ATX12V1
USB 3. 0
T: USB0
B: USB 1
PS2
Keyb oard
/Mous e
SPK_CI1
1
PCIE2
Front USB 3.0
8
10
11
13
14
17
VGA1
DVI 1
SATA3_0 SATA3 _2
SATA3_1 SATA3 _3
1.3 Motherboard Layout
English
6 7
No. Description
1 ATX 12V Power Connector (ATX12V1)
2 CPU Fan Connector (CPU_FAN1)
3 2 x 240-pin DDR3/DDR3L DIMM Slots (DDR3_A1, DDR3_B1)
4 ATX Power Connector (ATXPWR1)
5 USB 3.0 Header (USB3_4_5)
6 SATA3 Connector (SATA3_2)
7 SATA3 Connector (SATA3_3)
8 SATA3 Connector (SATA3_1)
9 SATA3 Connector (SATA3_0)
10 Clear CMOS Jumper (CLR MOS1)
11 System Panel Header (PANEL1)
12 USB 2.0 Header (USB4_5)
13 Chassis Intrusion and Speaker Header (SPK_CI1)
14 TPM Header (TPMS1)
15 COM Port Header (COM1)
16 Chassis Fan Connector (CHA_FAN1)
17 Front Panel Audio Header (HD_ AUDIO1)
H110M-DVS/D3
English
1.4 I/O Panel
3
4
1
2
5
10
9
8
7
No. Description No. Description
1 PS/2 Mouse/Keyboard Port 6 Microphone (Pink)**
2 D-Sub Port (VGA1) 7 USB 2.0 Ports (USB01)
3 LAN RJ-45 Port* 8 USB 2.0 Ports (USB_23)
4 Line In (Light Blue)** 9 DVI-D Port
5 Front Speaker (Lime)** 10 USB 3.0 Ports (USB3_01)
* ere are two LEDs on each LAN port. Plea se refer to the table below for the LAN port LED indications.
ACT/LINK LED
SPEED LED
LAN Por t
Activity / Link LED Speed LED
Status Description Status Description
O No Link O 10Mbps connection
Blinking Data Activity Orange 100Mbps connection
On Link Green 1Gbps connection
6
English
8 9
H110M-DVS/D3
** To congure 7.1 CH HD Audio, it i s required to use an HD front panel audio module and enable the multichannel audio feature through the audio driver.
Please set Speaker Cong uration to “7.1 Speaker” in the Realte k HD Audio Manager.
Function of the Audio Ports in 7.1-channel Conguration:
Port Function
Light Blue (Rear panel) Rear Speaker Out
Lime (Rear panel) Front Speaker Out
Pink (Rear panel) Central /Subwoofer Speaker Out
Lime (Front panel) Side Speaker Out
English
Chapter 2 Installation
is is a Micro ATX form factor motherboard. Before you install the motherboard,
study the conguration of your chassis to ensure that the motherboard ts into it.
Pre-installation Precautions
Take note of the following precautions before you install motherboard components
or change any motherboard settings.
• Make sure to unplug the power cord before installing or removing the motherboard
components. Failure to do so may cause physical injuries and damages to motherboard
components.
• In order to avoid damage from static electricity to the motherboard’s components,
NEVER place your motherboard directly on a carpet. Also remember to use a grounded
wrist strap or touch a safety grounded object before you handle the components.
• Hold components by the edges and do not touch the ICs.
• Whenever you uninstall any components, place them on a grounded anti-static pad or
in the bag that comes with the components.
• When placing screws to secure the motherboard to the chassis, please do not over-
tighten the screws! Doing so may damage the motherboard.
English
10 11
2.1 Installing the CPU
1. Before you insert the 1151-Pin CPU into the socket , please check if the PnP cap is on the
socket, if the CPU sur face is unclean, or if the re are any bent pins in the socket . Do not
force to in sert the CPU into the socket if above situation is found. Otherwise, the CPU
will be seriously damaged.
2. Unplug all power c ables be fore installing the CPU.
1
H110M-DVS/D3
A
B
2
English
3
4
5
English
12 13
H110M-DVS/D3
Please save and replace the cover if the processor is remove d. e cove r must be placed if
you wish to return the motherboard for ae r service.
English
2.2 Installing the CPU Fan and Heatsink
1 2
FAN
CPU_
English
14 15
H110M-DVS/D3
2.3 Installing Memory Modules (DIMM)
is motherboard provides two 240-pin DDR3/DDR3L (Double Data Rate 3)
DIMM slots, and supports Dual Channel Memory Technology.
1. For dual channel conguration, you always need to install identical (the same brand,
speed , size and chip-type) DDR3/DDR3L DIMM pairs.
2. It is unable to activate Dual Channel Memory Technology with only one memory module
installed.
3. It is not allowed to install a DDR or DDR2 memory module into a DDR3/DDR 3L slot;
otherwise, this mothe rboard and DI MM may be damaged..
e DIMM only ts in one correct orientation. It wil l cause permane nt damage to the
motherboard and the DIMM if you force the DIMM into the slot at incorrect orie ntation.
English
1
2
3
English
16 17
H110M-DVS/D3
2.4 Expansion Slots (PCI Express Slots)
ere are 3 PCI Express slots on the motherboard.
Before installing an expansion card, plea se make sure that the power supply is sw itched o
or the power cord is unplugged. Please read the d ocumentation of the expansion card and
make necessary hardware settings for the card before you start the installation.
PCIe slots:
PCIE1 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards.
PCIE2 (PCIe 2.0 x1 slot) is used for PCI Express x1 lane width cards
PCIE3 (PCIe 2.0 x1 slot) is used for PCI Express x1 lane width cards.
English
2.5 Jumpers Setup
e illustration shows how jumpers are setup. When the jumper cap is placed on
the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper
is “Open”. e illustration shows a 3-pin jumper whose pin1 and pin2 are “Short”
when a jumper cap is placed on these 2 pins.
Clear CMOS Jumper
(CLR MOS1)
(see p.6, No. 10)
CLRMOS1 allows you to clear the data in CMOS. To clear and reset the system
parameters to default setup, please turn o the computer and unplug the power
cord from the power supply. Aer waiting for 15 seconds, use a jumper cap to
short pin2 and pin3 on CLRMOS1 for 5 seconds. However, please do not clear the
CMOS right aer you update the BIOS. If you need to clear the CMOS when you
just nish updating the BIOS, you must boot up the system rst, and then shut it
down before you do the clear-CMOS action. Please be noted that the password,
date, time, and user default prole will be cleared only if the CMOS batter y is
removed.
Clear CMOSDefault
If you clear the CMOS, the case open may be detected. Please adjust the BIOS option “Cl ear
Status” to clear the record of previous ch assis intrus ion statu s.
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18 19
2.6 Onboard Headers and Connectors
Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over these
heade rs and connectors. Placing jumper caps over the heade rs and connectors will cause
permanent damage to the motherboard.
H110M-DVS/D3
System Panel Header
(9-p i n PA NE L1)
(see p.6, No. 11)
PWRBTN (Power Switch):
Connec t to the power switch on the cha ssis front panel. You may congure the way to turn
o your system using the power switch.
RESET (Reset Sw itch):
Connec t to the reset switch on the cha ssis front panel. Press the reset switch to restart the
computer if the computer freezes and fails to pe rform a normal restar t.
PLED (Syste m Power LED):
Connec t to the power status indicator on the ch assis front panel. e LED i s on when the
system is operating. e LED keeps blinking when the system is in S1/S3 sleep state. e
LED is o when the system is in S4 sleep state or powered o (S5).
HDLED (Ha rd Drive Activity LED):
Connec t to the hard drive ac tivity LED on the cha ssis front panel. e LED is on when the
hard drive is reading or writing data.
e front panel des ign may dier by cha ssis. A f ront panel modul e mainly consists of power
switch, reset switch, power LED, hard drive ac tivity LED, speak er and etc . When connecting your ch assis front panel module to this header, make sure the wire assignments and the
pin assignment s are matched cor rectly.
1
PLED+
PLED-
HDLED-
HDLED+
PWRBTN#
GND
RESET#
GND
GND
Connect the power
switch, reset switch and
system status indicator on
the chassis to this header
according to the pin
assignments below. Note
the positive and negative
pins before connecting
the cables.
English
Chassis Intrusion and
SPEAKER
Speaker Header
(7-pi n SPK_C I1)
(see p.6, No. 13)
DUMMY
+5V
1
SIGNAL
DUMMY
GND
DUMMY
Please connect the
chassis intrusion and the
chassis speaker to this
header.
Serial ATA3 Connectors
(SATA3_0)
(see p.6, No. 9)
(SATA 3_1)
(see p.6, No. 8)
(SATA3_2)
(see p.6, No. 6)
(SATA 3_3)
(see p.6, No. 7)
USB 2.0 Header
(9-pin USB4_5)
(see p.6, No. 12)
USB 3.0 Header
(19-pin USB3_4_ 5)
(see p.6, No. 5)
SATA3_2
SATA3_0
USB_PWR
1
USB_PWR
Vbus
IntA_PA_SSRX-
IntA_PA_SSRX+
GND
IntA_PA_SSTX-
IntA_PA_SSTX+
GND
IntA_PA_D-
IntA_PA_D+
ese four SATA3
connectors support SATA
data cables for internal
storage devices with up to
SATA3_3
6.0 Gb/s data transfer rate.
SATA3_1
-B
+B
GND
DUMMY
GND
+A
-A
VbusVbus
IntA_PB_SSRX-
IntA_PB_SSRX+
GND
IntA_PB_SSTX-
IntA_PB_SSTX+
GND
IntA_PB_D-
IntA_PB_D+
Dummy
1
ere is one header on
this motherboard. Each
USB 2.0 header can
support two ports.
Besides two USB 3.0 ports
on the I/O panel, there
is one header on this
motherboard. Each USB
3.0 header can support
two ports.
English
20 21
H110M-DVS/D3
Front Panel Audio Header
(9-pin HD_AU DIO1)
(see p.6, No. 17)
1. High Denition Audio supports Jack Sensing, but the panel wire on the chas sis must support HDA to function correc tly. Please follow the instructions in our manual and chassis
manual to install your system.
2. If you use an AC’97 audio panel, please install it to the front panel audio heade r by the
steps below:
A. Connect Mic_ IN (MIC) to MIC2_L.
B. Conne ct Audio_R (RIN) to OUT2_R and Audio_L (LIN) to OUT2 _L.
C. Connect Ground (GND) to Ground (GND).
D. MIC_ RET and OUT_RET are for the HD audio panel only. You don’t need to connect
them for the AC’97 audio panel.
E. To activate the front mic, go to the “FrontMic” Tab in the Realtek Control panel and
adjust “Recording Volume”.
MIC_RET
PRESENCE#
GND
OUT_RET
OUT2_L
J_SENSE
1
Chassis Fan Connector
(4-pin CHA_FAN1)
(see p.6, No. 16)
FAN_SPEED_CONTROL
CHA_FAN_SPEED
FAN_VOLTAGE
is header is for
connecting audio devices
OUT2_R
to the front audio panel.
MIC2_R
MIC2_L
Please connect fan cables
to the fan connector and
match the black wire to
the ground pin.
GND
CPU Fan Connector
(4-pin CPU_FAN1)
(see p.6, No. 2)
FAN_VOLTAGE
CPU_FAN_SPEED
GND
1 2 3 4
FAN_SPEED_CONTROL
is motherboard pro-
vides a 4-Pin CPU fan
(Quiet Fan) connector.
If you plan to connect a
3-Pin CPU fan, please
connect it to Pin 1-3.
English
ATX Power Connector
(24-pin AT X PW R1)
(see p.6, No. 4)
1
13
is motherboard pro-
vides a 24-pin ATX power
connector. To use a 20-pin
ATX power supply, please
plug it along Pin 1 and Pin
13.
12
24
ATX 12V Power
Connector
(4-pin ATX12V1)
(see p.6, No. 1)
Serial Port Header
(9-pin COM1)
(see p.6, No. 15)
TPM Header
(17-pi n TPMS1)
(see p.6, No. 14)
is motherboard pro-
vides a 4-pin ATX 12V
power connector.
RRXD1
1
DDTR#1
TTXD1
DDCD#1
DDSR#1
CCTS#1
RRTS#1
GND
RRI#1
is COM1 header
supports a serial port
module.
is connector supports Trusted
Platform Module (TPM) system,
which can securely store keys,
SMB _CLK _MA IN
GND
SMB _DAT A_M AIN
LAD 2
GND
LAD 1
S_P WRDW N#
SER IRQ#
GND
digital certicates, passwords,
1
+3V
LAD 3
FRA ME
PCI CLK
LAD 0
PCI RST#
and data. A TPM system also
helps enhance network security,
protects digital identities, and
GND
+3V SB
ensures platform integrity.
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H110M-DVS/D3
Chapter 3 Software and Utilities Operation
3.1 Installing Drivers
e Support CD that comes with the motherboard contains necessary drivers and
useful utilities that enhance the motherboard’s features.
Running The Support CD
To begin using the support CD, insert the CD into your CD-ROM drive. e CD
automatically displays the Main Menu if “AUTORUN” is enabled in your computer.
If the Main Menu does not appear automatically, locate and double click on the le
“ASRSETUP.EXE” in the Support CD to display the menu.
Drivers Menu
e drivers compatible to your system will be auto-detected and listed on the
support CD driver page. Please click Install All or follow the order from top to
bottom to install those required drivers. erefore, the drivers you install can work
properly.
Utilities Menu
e Utilities Menu shows the application soware that the motherboard supports.
Click on a specic item then follow the installation wizard to install it.
To improve Windows 7 compatibility, please download and install the following hot x
provided by Microso.
“KB2720599”: http://support.microso.com/kb/2720599/en-us
English
3.2 ASRock Live Update & APP Shop
e ASRock Live Update & APP Shop is an online store for purchasing and
downloading soware applications for your ASRock computer. You can quickly and
easily install various apps and support utilities, such as USB Key, XFast LAN, XFast
RAM and more. With ASRock APP Shop, you can optimize your system and keep
your motherboard up to date simply with a few clicks.
Double-click on your desktop to access ASRock Live Update & APP Shop
util ity.
*You need to be connected to the Internet to download apps from the ASRock Live Update & APP Shop.
3.2.1 UI Overview
English
Category Panel
Information Panel
Category Panel: e category panel contains several category tabs or buttons that
when selected the information panel below displays the relative information.
Information Panel: e information panel in the center displays data about the
currently selected category and allows users to perform job-related tasks.
Hot News: e hot news section displays the various latest news. Click on the image
to visit the website of the selected news and know more.
Hot News
24 25
H110M-DVS/D3
3.2.2 Apps
When the "Apps" tab is selected, you will see all the available apps on screen for you
to download.
Installing an App
Step 1
Find the app you want to install.
e most recommended app appears on the le side of the screen. e other various
apps are shown on the right. Please scroll up and down to see more apps listed.
You can check the price of the app and whether you have already intalled it or not.
- e red icon displays the price or "Free" if the app is free of charge.
- e green "Installed " icon means the app is installed on your computer.
Step 2
Click on the app icon to see more details about the selected app.
English
Step 3
If you want to install the app, click on the red icon
Step 4
When installation completes, you can nd the green "Installed" icon appears on the
upper right corner.
to start downloading.
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To uninstall it, simply click on the trash can icon .
* e trash icon may not appear for certain apps.
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Upgrading an App
You can only upgrade the apps you have already installed. When there is an
available new version for your app, you will nd the mark of "New Version"
appears below the installed app icon.
Step 1
Click on the app icon to see more details.
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Step 2
Click on the yellow icon
to start upgrading.
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3.2.3 BIOS & Drivers
Installing BIOS or Drivers
When the "BIOS & Drivers" tab is selected, you will see a list of recommended or
critical updates for the BIOS or drivers. Please update them all soon.
Step 1
Please check the item information before update. Click on
Step 2
Click to select one or more items you want to update.
Step 3
Click Update to start the update process.
to see more details.
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3.2.4 Setting
In the "Setting" page, you can change the language, select the server location, and
determine if you want to automatically run the ASRock Live Update & APP Shop
on Windows startup.
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3.3 Enabling USB Ports for Windows® 7 Installation
Intel® Braswell and Skylake has removed their support for the Enhanced Host
Controller Interface (EHCI – USB2.0) and only kept the eXtensible Host Controller
Interface (XHCI – USB3.0). Due to that fact that XHCI is not included in the
Windows 7 inbox drivers, users may nd it dicult to install Windows 7 operating
system because the USB ports on their motherboard won’t work. In order for the
USB ports to function properly, please create a Windows® 7 installation disk with
the Intel® USB 3.0 eXtensible Host Controller (xHCI) drivers packed into the ISO
le.
Requirements
• A Windows® 7 installation disk or USB drive
• USB 3.0 drivers (included in the ASRock Support CD or website)
• A Windows® PC
• Win7 USB Patcher (included in the ASRock Support CD or website)
Scenarios
You have an ODD and PS/2 ports:
If there is an optical disc drive, PS/2 ports and PS/2 Keyboard or mouse on your computer,
you can skip the instructions below and go ahead to install Windows® 7 OS.
You only have an ODD (For Intel Skylake platforms only):
If there is an optical disc drive but no PS/2 ports on your computer, please enable the “PS/2
Simulator” option in UEFI SETUP UTILITY > Advanced > USB Conguration, which
allows the USB port to function as a PS/2 port, and then you can install the Windows® 7
OS. Please set PS/S Simulator back to disabled aer the installation.
You’ve got nothing:
If you do not have an optical disc drive, please nd another computer and follow the
instructions below to create a new ISO le with the “Win7 USB Patcher”. en use the new
patched Windows® 7 installation USB drive to install Windows® 7 OS.
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Instructions
Step 1
Insert the Windows® 7 installation disk or USB drive to your system.
Step 2
Extract the tool (Win7 USB Patcher) and launch it.
Step 3
Select the “Win7 Folder” from Step1 by clicking the red circle as shown as the picture
below.
Step 4
Select the “USB Driver Folder” by clicking the red circle as shown as the picture below.
If you are using ASRock ’s Support CD for the USB 3.0 driver, please select your CD-ROM.
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Step 5
Select where to save the ISO le by pressing the red circle as shown as the picture below.
Step 6
If you want to burn the patched image to a CD, please check “Burn Image” and select “Target
Device to Burn”. If not, the patched ISO image will be exported to the destination selected
in Step5. en Press “Start” to proceed.
Step 7
Now you are able to install Windows® 7 on Braswell or Skylake with the new burned CD.
Or please use the patched ISO image to make an OS USB drive to install the OS.
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Chapter 4 UEFI SETUP UTILITY
4.1 Introduction
is section explains how to use the UEFI SETUP UTILITY to congure your
system. You may run the UEFI SETUP UTILITY by pressing <F2> or <Del> right
aer you power on the computer, otherwise, the Power-On-Self-Test (POST) will
continue with its test routines. If you wish to enter the UEFI SETUP UTILITY aer
POST, restart the system by pressing <Ctl> + <Alt> + <Delete>, or by pressing the
reset button on the system chassis. You may also restart by turning the system o
and then back on.
Becau se the UEFI soware is constantly being updated, the following UEFI setup screens
and descriptions are for re ference purpose only, and they may not exactly match what you
see on your screen.
4.1.1 UEFI Menu Bar
e top of the screen has a menu bar with the following selections:
Main
OC Tweaker
Advanced
Tool
H/W Monitor
Boot
Security
Exit
For setting system time/date information
For overclocking congurations
For advanced system congurations
Useful tools
Displays current hardware status
For conguring boot settings and boot priority
For security settings
Exit the current screen or the UEFI Setup Utility
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4.1.2 Navigation Keys
Use < > key or < > key to choose among the selections on the menu bar, and
use < > key or < > key to move the cursor up or down to select items, then
press <Enter> to get into the sub screen. You can also use the mouse to click your
required item.
Please check the following table for the descriptions of each navigation key.
Navigation Key(s) Description
+ / -
<Tab>
<PGUP>
<PGDN>
<HOME>
<END>
<F1>
<F5>
<F7>
<F9>
<F10>
<F12>
<ESC>
To change option for the selected items
Switch to next function
Go to the previous page
Go to the next page
Go to the top of the screen
Go to the bottom of the screen
To display the General Help Screen
Add / Remove Favorite
Discard changes and exit the SETUP UTILITY
Load optimal default values for all the settings
Save changes and exit the SETUP UTILITY
Print screen
Jump to the Exit Screen or exit the current screen
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4.2 Main Screen
When you enter the UEFI SETUP UTILITY, the Main screen will appear and
display the system overview.
Favorite
Display your collection of BIOS items. Press F5 to add/remove your favorite items.
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4.3 OC Tweaker Screen
In the OC Tweaker screen, you can set up overclock ing features.
Becau se the UEFI soware is constantly being updated, the following UEFI setup screens
and descriptions are for re ference purpose only, and they may not exactly match what you
see on your screen.
CPU Conguration
Intel SpeedStep Technology
Intel SpeedStep technology allows processors to switch between multiple frequen-
cies and voltage points for better power saving and heat dissipation.
Intel Turbo Boost Technology
Intel Turbo Boost Technology enables the processor to run above its base operating
frequency when the operating system requests the highest performance state.
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Long Duration Power Limit
Congure Package Power Limit 1 in watts. When the limit is exceeded, the CPU
ratio will be lowered aer a period of time. A lower limit can protect the CPU and
save power, while a higher limit may improve performance.
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Long Duration Maintained
Congure the period of time until the CPU ratio is lowered when the Long
Duration Power Limit is exceeded.
Short Duration Power Limit
Congure Package Power Limit 2 in watts. When the limit is exceeded, the CPU
ratio will be lowered immediately. A lower limit can protect the CPU and save
power, while a higher limit may improve performance.
System Agent Current Limit
Congure the current limit of the system agent. A lower limit can protect the CPU
and save power, while a higher limit may improve performance.
CPU Core Current Limit
Congure the current limit of the CPU core. A lower limit can protect the CPU and
save power, while a higher limit may improve performance.
GT Slice Current Limit
Congure the current limit of the GT slice. A lower limit can protect the CPU and
save power, while a higher limit may improve performance.
GT Slice Frequency
Congure the frequency of the integrated Slice GPU.
DRAM Conguration
DRAM Tweaker
Fine tune the DRAM settings by leaving marks in checkboxes. Click OK to conrm and
apply your new settings.
DRAM Timing Conguration
Load XMP Setting
Load XMP settings to overclock the DDR4 memory and perform beyond standard
specications.
DRAM Reference Clock
Select Auto for optimized settings.
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DRAM Frequency
If [Auto] is selected, the motherboard will detect the memory module(s) inserted
and assign the appropriate frequency automatically.
DRAM Frequency OC Preset
If the DRAM frequency is selected, the corresponding DRAM and BCLK frequency for
overclocking will be set.
Primary Timing
CAS# Latency (tCL)
e time between sending a column address to the memory and the beginning of the data
in response.
RAS# to CAS# Delay and Row Precharge (tRCDtRP) O
RAS# to CAS# Delay : e number of clock cycles required between the opening of
a row of memory and accessing columns within it.
Row Precharge: e number of clock cycles required between the issuing of the
precharge command and opening the next row.
RAS# Active Time (tRAS)
e number of clock cycles required between a bank active command and issuing the
precharge command.
Command Rate (CR)
e delay between when a memory chip is selected and when the rst active command can
be issued.
Secondary Timing
Write Recovery Time (tWR)
e amount of delay that must elapse aer the completion of a valid write operation,
before an active bank can be precharged.
Refresh Cycle Time (tRFC)
e number of clocks from a Refresh command until the rst Activate command to
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the same rank.
RAS to RAS Delay (tRRD)
e number of clocks between two rows activated in dierent banks of the same
rank.
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Write to Read Delay (tWTR)
e number of clocks between the last valid write operation and the next read command to
the same internal bank.
Read to Precharge (tRTP)
e number of clocks that are inserted between a read command to a row pre-
charge command to the same rank.
Four Activate Window (tFAW)
e time window in which four activates are allowed the same rank.
CAS Write Latency (tCWL)
Congure CAS Write Latency.
Third Timing
tREFI
Congure refresh cycles at an average periodic interval.
tCKE
Congure the period of time the DDR4 initiates a minimum of one refresh
command internally once it enters Self-Refresh mode.
tRDRD_sg
Congure between module read to read delay.
tRDRD_dg
Congure between module read to read delay.
tRDRD_dr
Congure between module read to read delay.
tRDRD_dd
Congure between module read to read delay.
tRDWR_sg
Congure between module read to write delay.
tRDWR_dg
Congure between module read to write delay.
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tRDWR_dr
Congure between module read to write delay.
tRDWR_dd
Congure between module read to write delay.
tWRRD_sg
Congure between module write to read delay.
tWRRD_dg
Congure between module write to read delay.
tWRRD_dr
Congure between module write to read delay.
tWRRD_dd
Congure between module write to read delay.
tWRWR_sg
Congure between module write to write delay.
tWRWR_dg
Congure between module write to write delay.
tWRWR_dr
Congure between module write to write delay.
tWRWR_dd
Congure between module write to write delay.
RTL (CH A)
Congure round trip latency for channel A.
RTL (CH B)
Congure round trip latency for channel B.
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IO-L (CH A)
Congure IO latency for channel A.
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IO-L (CH B)
Congure IO latency for channel B.
Fourth Timing
twRPRE
Congure twRPRE.
Write_Early_ODT
Congure Write_Early_ODT.
tAONPD
Congure tAONPD.
tXP
Congure tXP.
tXPDLL
Congure t XPDLL.
tPRPDEN
Congure tPRPDEN.
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tRDPDEN
Congure tRDPDEN.
twRPDEN
Congure twRPDEN.
OREF_RI
Congure OREF_RI.
tREFIx9
Congure tREFIx9.
txSDLL
Congure txSDLL.
txs_oset
Congure txs_oset.
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tZQOPER
Congure tZQOPER.
tMOD
Congure tMOD.
ZQCS_period
Congure ZQCS_period.
tZQCS
Congure tZQCS.
Advanced Setting
ODT WR (CH A)
Congure the memory on die termination resistors' WR for channel A.
ODT WR (CH B)
Congure the memory on die termination resistors' WR for channel B.
ODT PARK (CH A)
Congure the memory on die termination resistors' PARK for channel A.
ODT PARK (CH B)
Congure the memory on die termination resistors' PARK for channel B.
ODT NOM (CH A)
Use this to change ODT (CH A) Auto/Manual settings. e default is [Auto].
ODT NOM (CH B)
Use this to change ODT (CH B) Auto/Manua l settings. e default is [Auto].
MRC Fast Boot
Enable Memory Fast Boot to skip DRAM memory training for booting faster.
Voltage Conguration
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CPU Vcore Voltage
Congure the voltage for the CPU Vcore.
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DRAM Voltage
Use this to congure DRAM Voltage. e default value is [Auto].
PCH +1.0 Voltage
Congure the chipset voltage (1.0V).
GT Voltage
Congure the voltage for the GT.
VCCSA Voltage
Congure the voltage for the VCCSA.
Save User Default
Type a prole name and press enter to save your settings as user default.
Load User Default
Load previously saved user defaults.
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4.4 Advanced Screen
In this section, you may set the congurations for the following items: CPU
Conguration, Chipset Conguration, Storage Conguration, Super IO Congura-
tion, ACPI Conguration, USB Conguration and Trusted Computing.
Setting wrong values in this section may cause the system to malfunction.
UEFI Conguration
Active Page on Entry
Select the default page when entering the UEFI setup utility.
Full HD UEFI
When [Auto] is selected, the resolution will be set to 1920 x 1080 if the monitor
supports Full HD resolution. If the monitor does not support Full HD resolution,
then the resolution will be set to 1024 x 768. When [Disable] is selected, the
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resolution will be set to 1024 x 768 directly.
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4.4.1 CPU Conguration
Intel Hyper Threading Technology
Intel Hyper reading Technology allows multiple threads to run on each core, so
that the overall performance on threaded soware is improved.
Active Processor Cores
Select the number of cores to enable in each processor package.
CPU C States Support
Enable CPU C States Support for power saving. It is recommended to keep C3, C6
and C7 all enabled for better power saving.
Enhanced Halt State (C1E)
Enable Enhanced Halt State (C1E) for lower power consumption.
Package C State Support
Enable CPU, PCIe, Memory, Graphics C State Support for power saving.
CPU Thermal Throttling
Enable CPU internal thermal control mechanisms to keep the CPU from overheat-
ing.
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No-Execute Memory Protection
Processors with No-Execution Memory Protection Technology may prevent certain
classes of malicious buer overow attacks.
Intel Virtualization Technology
Intel Virtualization Technology allows a platform to run multiple operating systems
and applications in independent partitions, so that one computer system can
function as multiple virtual systems.
Hardware Prefetcher
Automatically prefetch data and code for the processor. Enable for better
performance.
Adjacent Cache Line Prefetch
Automatically prefetch the subsequent cache line while retrieving the currently
requested cache line. Enable for better performance.
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4.4.2 Chipset Conguration
Primary Graphics Adapter
Select a primary VGA.
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VT-d
Intel® Virtualization Technology for Directed I/O helps your virtual machine
monitor better utilize hardware by improving application compatibility and
reliability, and providing additional levels of manageability, security, isolation, and
I/O performance.
PCIE2 Link Speed
Select the link speed for PCIE2.
PCIE ASPM Support
is option enables/disables the ASPM support for all CPU downstream devices.
PCH PCIE ASPM Support
is option enables/disables the ASPM support for all PCH PCIE devices.
DMI ASPM Support
is option enables/disables the control of ASPM on CPU side of the DMI Link.
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PCH DMI ASPM Support
is option enables/disables the ASPM support for all PCH DMI devices.
Share Memory
Congure the size of memory that is allocated to the integrated graphics processor when
the system boots up.
IGPU Multi-Monitor
Select disable to disable the integrated graphics when an external graphics card is installed.
Select enable to keep the integrated graphics enabled at all times.
Render Standby
Power down the render unit when the GPU is idle for lower power consumption.
Onboard LAN
Enable or disable the onboard network interface controller.
Onboard HD Audio
Enable/disable onboard HD audio. Set to Auto to enable onboard HD audio and
automatically disable it when a sound card is installed.
Front Panel
Enable/disable front panel HD audio.
Deep Sleep
Congure deep sleep mode for power saving when the computer is shut down.
Restore on AC/Power Loss
Select the power state aer a power failure. If [Power O ] is selected, the power will
remain o when the power recovers. If [Power On] is selected, the system will start
to boot up when the power recovers.
Good Night LED
By enabling Good Night LED, the Power/HDD LEDs will be switched o when the
system is on. It will also automatically switch o the Power and Keyboard LEDs
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when the system enters into Standby/Hibernation mode.
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4.4.3 Storage Conguration
SATA Controller(s)
Enable/disable the SATA controllers.
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SATA Aggressive Link Power Management
SATA Aggressive Link Power Management allows SATA devices to enter a low
power state during periods of inactivity to save power. It is only supported by AHCI
mode.
Hard Disk S.M.A.R.T.
S.M.A.R.T stands for Self-Monitoring, Analysis, and Reporting Technology. It is a
monitoring system for computer hard disk drives to detect and report on various
indicators of reliability.
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4.4.4 Super IO Conguration
Serial Port
Enable or disable the Serial port.
Serial Port Address
Select the address of the Serial port.
PS2 Y-Cable
Enable the PS2 Y-Cable or set this option to Auto.
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4.4.5 ACPI Conguration
Suspend to RAM
Select disable for ACPI suspend type S1. It is recommended to select auto for ACPI
S3 power saving.
ACPI HEPT Table
Enable the High Precision Event Timer for better performance.
PS/2 Keyboard Power On
Allow the system to be waked up by a PS/2 Keyboard.
PCIE Devices Power On
Allow the system to be waked up by a PCIE device and enable wa ke on LAN.
Ring-In Power On
Allow the system to be waked up by onboard COM port modem Ring-In signals.
RTC Alarm Power On
Allow the system to be waked up by the real time clock alarm. Set it to By OS to let
it be handled by your operating system.
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USB Keyboard/Remote Power On
Allow the system to be waked up by an USB keyboard or remote controller.
USB Mouse Power On
Allow the system to be waked up by an USB mouse.
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4.4.6 USB Conguration
Legacy USB Support
Enable or disable Legacy OS Support for USB 2.0 devices. If you encounter USB
compatibility issues it is recommended to disable legacy USB support. Select UEFI
Setup Only to support USB devices under the UEFI setup and Windows/Linux
operating systems only.
Port 60/64 Emulation
Enable the support of I/O port 60h/64h emulation. is should be enabled for the
complete USB keyboard legacy support for non-USB aware OS.
*Enable this option if you install Windows 7.
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4.4.7 Trusted Computing
Security Device Support
Enable or disable BIOS support for security device.
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4.5 Tools
OMG (Online Management Guard)
Administrators are able to establish an internet curfew or restrict internet access
at specied times via OMG. You may schedule the starting and ending hours of
internet access granted to other users. In order to prevent users from bypassing
OMG, guest accounts without permission to modify the system time are required.
UEFI Tech Service
Contact ASRock Tech Service if you are having trouble with your PC. Please setup
network conguration before using UEFI Tech Service.
Easy Driver Installer
For users that don’t have an optical disk drive to install the drivers from our support
CD, Easy Driver Installer is a handy tool in the UEFI that installs the LAN driver
to your system via an USB storage device, then downloads and installs the other
required drivers automatically.
Boot Manager
Boot Manager is specically designed for the dual OS platform/multi-OS platform
users to easily customize and manage the boot menu.
*Please connect more than one boot devices to use this tool.
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Boot Manager
Enable/disable the Boot Manager.
Boot Manager Timeout
Enable/disable the Boot Manager Timeout.
Timeout Seconds
Congure the number of seconds to wait for the Boot Manager.
Dehumidier Function
If Dehumidier Function is enabled, the computer will power on automatically to
dehumidify the system aer entering S4/S5 state.
Dehumidier Period
Congure the period of time until the computer powers on and enables
Dehumidier aer entering S4/S5 state.
Dehumidier Duration
Congure the duration of the dehumidifying process before it returns to S4/S5
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state.
Dehumidier CPU Fan Setting
Congure the speed of the CPU fan while Dehumidier is enabled. e higher the
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value, the faster the fan speed.
Max: 255
Min: 1
Instant Flash
Save UEFI les in your USB storage device and run Instant Flash to update your
UEFI.
Internet Flash - DHCP (Auto IP), Auto
ASRock Internet Flash downloads and updates the latest UEFI rmware version
from our servers for you. Please setup network conguration before using Internet
Flash.
*For BIOS backup and recovery purpose, it is recommended to plug in your USB
pen drive before using this function.
Secure Backup UEFI
Whenever one of the ROM images are outdated or corrupted, switch to the other
ash ROM and execute Secure Backup UEFI to duplicate the current working ROM
image to the secondary ash ROM.
Network Conguration
Use this to congure internet connection settings for Internet Flash.
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Internet Setting
Enable or disable sound eects in the setup utility.
UEFI Download Server
Select a server to download the UEFI rmware.
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4.6 Hardware Health Event Monitoring Screen
is section allows you to monitor the status of the hardware on your system,
including the parameters of the CPU temperature, motherboard temperature, fan
speed and voltage.
Fan-Tastic Tuning
Select a fan mode for CPU Fans 1&2, or choose Customize to set 5 CPU
temperatures and assign a respective fan speed for each temperature.
CPU Fan Setting
Select a fan mode for CPU Fans, or choose Customize to set 5 CPU temperatures
and assign a respective fan speed for each temperature.
Chassis Fan Setting
Select a fan mode for Chassis Fan, or choose Customize to set 5 CPU temperatures
and assign a respective fan speed for each temperature.
Chassis Fan Temp Source
Select a fan temperature source for Chassis Fan.
Over Temperature Protection
When Over Temperature Protection is enabled, the system automatically shuts
down when the motherboard is overheated.
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Case Open Feature
Enable or disable Case Open Feature to detect whether the chassis cover has been
removed.
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4.7 Security Screen
In this section you may set or change the supervisor/user password for the system.
You may also clear the user password.
Supervisor Password
Set or change the password for the administrator account. Only the administrator
has authority to change the settings in the UEFI Setup Utility. Leave it blank and
press enter to remove the password.
User Password
Set or change the password for the user account. Users are unable to change the
settings in the UEFI Setup Utility. Leave it blank and press enter to remove the
password.
Secure Boot
Use this item to enable or disable support for Windows 8.1 Secure Boot.
Intel(R) Platform Trust Technology
Enable/disable Intel PTT in ME. Disable this option to use discrete TPM Module.
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4.8 Boot Screen
is section displays the available devices on your system for you to congure the
boot settings and the boot priority.
Fast Boot
Fast Boot minimizes your computer's boot time. In fast mode you may not boot
from an USB storage device. Ultra Fast mode is only supported by Windows 8.1
and the VBIOS must support UEFI GOP if you are using an external graphics card.
Please notice that Ultra Fast mode will boot so fast that the only way to enter this
UEFI Setup Utility is to Clear CMOS or run the Restart to UEFI utility in Windows.
Boot From Onboard LAN
Allow the system to be waked up by the onboard LAN.
Setup Prompt Timeout
Congure the number of seconds to wait for the setup hot key.
Bootup Num-Lock
Select whether Num Lock should be turned on or o when the system boots up.
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Boot Beep
Select whether the Boot Beep should be turned on or o when the system boots up. Please
note that a buzzer is needed.
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Full Screen Logo
Enable to display the boot logo or disable to show normal POST messages.
AddOn ROM Display
Enable AddOn ROM Display to see the AddOn ROM messages or congure the
AddOn ROM if you've enabled Full Screen Logo. Disable for faster boot speed.
Boot Failure Guard
If the computer fails to boot for a number of times the system automatically restores
the default settings.
Boot Failure Guard Count
Congure the number of attempts to boot until the system automatically restores
the default settings.
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CSM (Compatibility Support Module)
CSM
Enable to launch the Compatibility Support Module. Please do not disable unless
you’re running a WHCK test. If you are using Windows 8.1 64-bit and all of your
devices support UEFI, you may also disable CSM for faster boot speed.
Launch PXE OpROM Policy
Select UEFI only to run those that support UEFI option ROM only. Select Legacy
only to run those that support legacy option ROM only. Select Do not launch to not
execute both legacy and UEFI option ROM.
Launch Storage OpROM Policy
Select UEFI only to run those that support UEFI option ROM only. Select Legacy
only to run those that support legacy option ROM only. Select Do not launch to not
execute both legacy and UEFI option ROM.
Launch Video OpROM Policy
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Select UEFI only to run those that support UEFI option ROM only. Select Legacy
only to run those that support legacy option ROM only. Select Do not launch to not
execute both legacy and UEFI option ROM.
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4.9 Exit Screen
Save Changes and Exit
When you select this option the following message, “Save conguration changes
and exit setup?” will pop out. Select [OK] to save changes and exit the UEFI SETUP
UTILITY.
Discard Changes and Exit
When you select this option the following message, “Discard changes and exit
setup?” will pop out. Select [OK] to exit the UEFI SETUP UTILITY without saving
any changes.
Discard Changes
When you select this option the following message, “Discard changes?” will pop
out. Select [OK] to discard all changes.
Load UEFI Defaults
Load UEFI default values for all options. e F9 key can be used for this operation.
Launch EFI Shell from lesystem device
Copy shellx64.e to the root director y to launch EFI Shell.
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Contact Information
If you need to contact ASRock or want to know more about ASRock, you’re welcome
to visit ASRock’s website at http://www.asrock.com; or you may contact your dealer
for further information. For technica l questions, please submit a support request
form at http://www.asrock.com/support/tsd.asp
ASRock Incorporation
2F., No.37, Sec. 2, Jhongyang S. Rd., Beitou District,
Taipei City 112, Taiwan (R.O.C.)
ASRock EUROPE B.V.
Bijsterhuizen 11-11
6546 AR Nijmegen
e Netherlands
Phone: +31-24-345-44-33
Fax: +31-24-345-44-38
ASRock America, Inc.
13848 Magnolia Ave, Chino, CA91710
U.S.A.
Phone: +1-909-590-8308
Fax: +1-909-590-1026
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