Analog Devices TMP35, TMP37, TMP36 Datasheet

a
Low Voltage Temperature Sensors
TMP35/TMP36/TMP37
FEATURES Low Voltage Operation (+2.7 V to +5.5 V) Calibrated Directly in 8C 10 mV/8C Scale Factor (20 mV/8C on TMP37)
628C Accuracy Over Temperature (typ)
60.58C Linearity (typ)
Stable with Large Capacitive Loads Specified –408C to +1258C, Operation to +1508C Less than 50 mA Quiescent Current Shutdown Current 0.5 mA max Low Self-Heating
APPLICATIONS Environmental Control Systems Thermal Protection Industrial Process Control Fire Alarms Power System Monitors CPU Thermal Management
PRODUCT DESCRIPTION
The TMP35, TMP36 and TMP37 are low voltage, precision centigrade temperature sensors. They provide a voltage output that is linearly proportional to the Celsius (Centigrade) tem­perature. The TMP35/TMP36/TMP37 do not require any external calibration to provide typical accuracies of ±1°C at +25°C and ±2°C over the –40°C to +125°C temperature range.
The low output impedance of the TMP35/TMP36/TMP37, and its linear output and precise calibration simplify interfacing to temperature control circuitry and A/D converters. All three devices are intended for single-supply operation from 2.7 V to 5.5 V maxi­mum. Supply current runs well below 50 µA providing very low self-heating—less than 0.1°C in still air. In addition, a shutdown function is provided to cut supply current to less than 0.5 µA.
The TMP35 is functionally compatible with the LM35/LM45 and provides a 250 mV output at +25°C. The TMP35 reads temperatures from +10°C to +125°C. The TMP36 is speci­fied from –40°C to +125°C, provides a 750 mV output at +25°C and operates to +125°C from a single 2.7 V supply. The TMP36 is functionally compatible with the LM50. Both the TMP35 and TMP36 have an output scale factor of +10 mV/°C. The TMP37 is intended for applications over the range +5°C to +100°C, and provides an output scale factor of 20 mV/°C. The TMP37 provides a 500 mV output at +25°C. Operation extends to +150°C with reduced accuracy for all devices when operating from a 5 V supply.
The TMP35/TMP36/TMP37 are all available in low cost 3-pin TO-92, and SO-8 and 5-pin SOT-23 surface mount packages.
FUNCTIONAL BLOCK DIAGRAM
+Vs (2.7V to 5.5V)
TMP35
SHUTDOWN
TMP36 TMP37
V
OUT
PACKAGE TYPES AVAILABLE
RT-5 (SOT-23)
V
1
OUT
+V
2
S
(Not to Scale)
NC
3
NC = NO CONNECT
TOP VIEW
GND
5
4
SHUTDOWN
SO-8
V
1
OUT
NC
2
(Not to Scale)
3
NC
GND
4
NC = NO CONNECT
TOP VIEW
+V
8
S
7
NC
6
NC
5
SHUTDOWN
TO-92
2
1 3
BOTTOM VIEW
(Not to Scale)
PIN 1 - +Vs, PIN 2 - V
, PIN 3 - GND
OUT
REV. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
(V
= +2.7 V to +5.5 V, –408C TA +1258C
S
1
TMP35/TMP36/TMP37F/G–SPECIFICATIONS
unless otherwise noted)
Parameter Symbol Conditions Min Typ Max Units
ACCURACY
TMP35/TMP36/TMP37F T TMP35/TMP36/TMP37G T
= +25°C ±1 ±2 °C
A
= +25°C ±1 ±3 °C
A
TMP35/TMP36/TMP37F Over Rated Temperature ±2 ±3 °C TMP35/TMP36/TMP37G Over Rated Temperature ±2 ±4 °C Scale Factor, TMP35 +10°C T Scale Factor, TMP36 –40°C T Scale Factor, TMP37 +5°C T
+5°C T
3.0 V +V
Load Regulation 0 µA I Power Supply Rejection Ratio PSRR T
= +25°C 30 100 m°C/V
A
PSRR 3.0 V +V
+125°C +10 +9.8/+10.2 mV/°C
A
+125°C +10 +9.8/+10.2 mV/°C
A
+85°C +20 +19.6/+20.4 mV/°C
A
+100°C +20 +19.6/+20.4 mV/°C
A
5.5 V
S
50 µA120m°C/µA
L
5.5 V 50 m°C/V
S
Linearity 0.5 °C Long-Term Stability T
= +150°C for 1 kHrs 0.4 °C
A
SHUTDOWN
Logic High Input Voltage V Logic Low Input Voltage V
IH IL
VS = 2.7 V 1.8 V VS = 5.5 V 400 mV
OUTPUT
TMP35 Output Voltage T TMP36 Output Voltage T TMP37 Output Voltage T
= +25°C 250 mV
A
= +25°C 750 mV
A
= +25°C 500 mV
A
Output Voltage Range 100 2000 mV Output Load Current I Short-Circuit Current I Capacitive Load Driving C Device Turn-On Time Output within ±1°C 0.5 1 ms
L SC
Note 2 250 µA
L
No Oscillations 100 ki100 pF Load
2
2
050µA
1000 10000 pF
POWER SUPPLY
Supply Range +V Supply Current I Supply Current (Shutdown) I
NOTES
1
Does not consider errors caused by self-heating.
2
Guaranteed but not tested.
Specifications subject to change without notice.
S SY (ON) SY (OFF)
2.7 5.5 V
Unloaded 50 µA Unloaded 0.01 0.5 µA
–2–
REV. A
TMP35/TMP36/TMP37
WAFER TEST LIMITS
(VS = +5 V, GND = O V, TA = +258C, unless otherwise noted)
Parameter Symbol Conditions Min Typ Max Units
ACCURACY
Scale Factor Deviation T Power Supply Rejection Ratio PSRR 2.7 V ≤ +V
= +25°C ±2 °C
A
5.5 V 30 m°C/V
S
SHUTDOWN
Logic High Input Voltage V Logic Low Input Voltage V
IH IL
VS = 2.7 V 1.8 V VS = 5.5 V 400 mV
OUTPUT
TMP35 Output Voltage T TMP36 Output Voltage T TMP37 Output Voltage T Short-Circuit Current I
SC
Device Turn-On Time Output within ±1°C 0.5 1 ms
= +25°C 250 mV
A
= +25°C 750 mV
A
= +25°C 500 mV
A
V
= 5.5 V 250 µA
S
100 ki100 pF Load
1
POWER SUPPLY
Supply Range V+ 2.7 5.5 V Supply Current I Supply Current (Shutdown) I
NOTES Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.
1
Guaranteed but not tested.
(ON) Unloaded at +5 V 50 µA
SY
(OFF) Unloaded at +5 V 0.5 µA
SY
DICE CHARACTERISTICS
Die Size 0.027 × 0.030 inch, 810 sq. mils
(0.685 × 0.762 mm, 0.522 sq. mm)
TRANSISTOR COUNT: 25
Substrate is connected to +V
S
1. V
OUT
1 4
32
2. GND
3. SHUTDOWN
4. +V
S
For additional DICE ordering information, refer to databook.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the TMP35/TMP36/TMP37 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. A
–3–
TMP35/TMP36/TMP37
SHDN
+V
OUT
+V
S
3X
25µA
2X
Q2 1X
R1
R2
R3
7.5µA
Q3
2X
GND
Q4
Q1
10X
6X
ABSOLUTE MAXIMUM RATINGS*
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7 V
Shutdown Pin . . . . . . . . . . . . . . GND
Output Pin . . . . . . . . . . . . . . . . . . . . . . GND # V
SHUTDOWN +V
# +V
OUT
S
S
Operating Temperature Range . . . . . . . . . . –55°C to +150°C
Dice Junction Temperature . . . . . . . . . . . . . . . . . . . . . +175°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +160°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300°C
*CAUTION
1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation at or above this specifica­tion is not implied. Exposure to the above maximum rating conditions for extended periods may affect device reliability.
2. Digital inputs are protected; however, permanent damage may occur on unprotected units from high-energy electrostatic fields. Keep units in conductive foam or packaging at all times until ready to use. Use proper antistatic handling procedures.
3. Remove power before inserting or removing units from their sockets.
Package Type u
JA
u
JC
Units
TO-92 (T9 Suffix) 162 120 °C/W SO-8 (S Suffix) 158 43 °C/W SOT-23 (RT Suffix) 300 180 °C/W
θJA is specified for device in socket (worst case conditions).
FUNCTIONAL DESCRIPTION
An equivalent circuit for the TMP3x family of micropower, centigrade temperature sensors is shown in Figure 1. At the heart of the temperature sensor is a bandgap core, which is comprised of transistors Q1 and Q2, biased by Q3 to approxi­mately 8 µA. The bandgap core operates both Q1 and Q2 at the same collector current level; however, since the emitter area of Q1 is 10 times that of Q2, Q1’s V
and Q2’s VBE are not equal
BE
by the following relationship:
A
VBE=Vln
E,Q1
A
E,Q2
ORDERING GUIDE
Accuracy Linear at 258C Operating Package
Model (8C max) Temperature Range Options
TMP35FT9 ±2.0 +10°C to +125°C TO-92 TMP35GT9 ± 3.0 +10°C to +125°C TO-92 TMP35FS ±2.0 +10°C to +125°C SO-8 TMP35GS ±3.0 +10°C to +125°C SO-8 TMP35GRT
2
±3.0 +10°C to +125°C RT-5
TMP36FT9 ±2.0 –40°C to +125°C TO-92 TMP36GT9 ± 3.0 –40°C to +125°C TO-92 TMP36FS ±2.0 –40°C to +125°C SO-8 TMP36GS ±3.0 –40°C to +125°C SO-8 TMP36GRT
2
±3.0 –40°C to +125°C RT-5
TMP37FT9 ±2.0 +5°C to +100°C TO-92 TMP37GT9 ± 3.0 +5°C to +100°C TO-92 TMP37FS ±2.0 +5°C to +100°C SO-8 TMP37GS ±3.0 +5°C to +100°C SO-8 TMP37GRT
NOTES
1
SO = Small Outline; RT = Plastic Surface Mount; TO = Plastic.
2
Consult factory for availability.
2
±3.0 +5°C to +100°C RT-5
1
Figure 1. Temperature Sensor Simplified Equivalent Circuit
Resistors R1 and R2 are used to scale this result to produce the output voltage transfer characteristic of each temperature sensor and, simultaneously, R2 and R3 are used to scale Q1’s V an offset term in V
. Table I summarizes the differences
OUT
between the three temperature sensors’ output characteristics:
Table I. TMP3x Output Characteristics
Offset Output Voltage Output Voltage
Sensor Voltage (V) Scaling (mV/8C) @ 258C
TMP35 0 10 250 mV TMP36 0.5 10 750 mV TMP37 0 20 500 mV
The output voltage of the temperature sensor is available at the emitter of Q4, which buffers the bandgap core and provides load current drive. Q4’s current gain, working with the available base current drive from the previous stage, sets the short-circuit current limit of these devices to 250 µA.
–4–
as
BE
REV. A
TMP35/TMP36/TMP37
FREQUENCY – Hz
100
0.01 20 100k100 1k 10k
31.6
10
3.16
1
0.32
0.1
0.032
POWER SUPPLY REJECTION – 8C/V
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
OUTPUT VOLTAGE – Volts
0.4
0.2
0
250 225 0 25 50 75 100 125
a. TMP35 b. TMP36 c. TMP37
VS = 3V
c
a
TEMPERATURE – 8C
Figure 2. Output Voltage vs. Temperature
5 4 3
a. MAXIMUM LIMIT ( G GRADE )
2 1
0
21 22
ACCURACY ERROR – 8C
23 24
25
0 20 40 60 80 100 120 140
a
b. TYPICAL ACCURACY ERROR c. MINIMUM LIMIT ( G GRADE )
b
c
TEMPERATURE – 8C
Figure 3. Accuracy Error vs. Temperature
b
Figure 5. Power Supply Rejection vs. Frequency
5
MINIMUM SUPPLY VOLTAGE REQUIRED TO MEET
4
DATA SHEET SPECIFICATION NO LOAD
3
b
2
1
MINIMUM SUPPLY VOLTAGE – Volts
a. TMP35/TMP36 b. TMP37
0 250 125225 0 25 50 75 100
TEMPERATURE – 8C
a
Figure 6. Minimum Supply Voltage vs. Temperature
0.4
V+ = +3V to +5.5V, NO LOAD
0.3
0.2
0.1
POWER SUPPLY REJECTION – 8C/V
0 250 125225 0 25 50 75 100
Figure 4. Power Supply Rejection vs. Temperature
REV. A
TEMPERATURE – 8C
–5–
60
a. V+ = 5V
50
40
30
SUPPLY CURRENT – µA
20
10
b. V+ = 3V
NO LOAD
a
b
250 125225 0 25 50 75 100
TEMPERATURE – 8C
Figure 7. Supply Current vs. Temperature
TMP35/TMP36/TMP37
50
TA = +25°C, NO LOAD
40
30
20
SUPPLY CURRENT – µA
10
0
07123456
SUPPLY VOLTAGE – Volts
8
Figure 8. Supply Current vs. Supply Voltage
50
a. V+ = 5V b. V+ = 3V
40
NO LOAD
30
20
SUPPLY CURRENT – nA
10
0 250 125225 0 25 50 75
TEMPERATURE – 8C
a
b
100
Figure 9. Supply Current vs. Temperature (Shutdown = 0 V)
400
= SHUTDOWN PIN HIGH TO LOW (3V TO 0V)
300
200
RESPONSE TIME – µs
100
0
250 125225 0 25 50 75
Figure 11. V
OUT
TEMPERATURE – 8C
Response Time for Shutdown Pin vs.
= SHUTDOWN PIN LOW TO HIGH (0V TO 3V) V
SETTLES WITHIN ±1°C
OUT
Temperature
1.0
0.8
0.6
0.4
0.2 0
1.0
0.8
0.6
OUTPUT VOLTAGE – Volts
0.4
0.2 0
250 2500 10050 150 200 300 350 400 450
Figure 12. V
OUT
= 25°C
T
A
V+ = 3V SHUTDOWN =
SIGNAL
T
= 25°C
A
V+ AND SHUTDOWN =
SIGNAL
TIME – µs
Response Time to Shutdown and V+
Pins vs. Time
100
400
300
200
RESPONSE TIME – µs
100
0 250 125225 0 25 50 75
Figure 10. V
Response Time for V+ Power-Up/Power-
OUT
Down vs. Temperature
= V+ AND SHUTDOWN PINS HIGH TO LOW (3V TO 0V)
= V+ AND SHUTDOWN PINS LOW TO HIGH (0V TO 3V) V
SETTLES WITHIN ±1°C
OUT
TEMPERATURE – 8C
100
–6–
110 100
90 80 70 60 50 40 30
PERCENT OF CHANGE – %
20 10
0
0
a
b
a. TMP35 SOIC SOLDERED TO .5" x .3" Cu PCB b. TMP36 SOIC SOLDERED TO .6" x .4" Cu PCB c. TMP35 TO-92 IN SOCKET SOLDERED TO
1" x .4" Cu PCB
100
c
200 300 400 500 600
TIME – sec
VIN = +3V, +5V
Figure 13. Thermal Response Time in Still Air
REV. A
140
a
b
FREQUENCY – Hz
2400
1000
0
10 10k100 1k
2200 2000
1600
1800
1400 1200
800 600 400 200
a. TMP35/36
b. TMP37
VOLTAGE NOISE DENSITY – nV/ Hz
120
100
a. TMP35 SOIC SOLDERED TO .5" x .3" Cu PCB b. TMP36 SOIC SOLDERED TO .6" x .4" Cu PCB c. TMP35 TO-92 IN SOCKET SOLDERED TO
1" x .4" Cu PCB
TMP35/TMP36/TMP37
10mV
100
90
1ms
80
60
40
TIME CONSTANT – sec
20
0
0 100 200 300 400 500 600
VIN = +3V, +5V
b
c
a
700
AIR VELOCITY – FPM
Figure 14. Thermal Response Time Constant in Forced Air
110 100
90 80 70 60 50
CHANGE – %
40 30 20 10
0
a
c
b
a. TMP35 SOIC SOLDERED TO .5" x .3" Cu PCB b. TMP36 SOIC SOLDERED TO .6" x .4" Cu PCB c. TMP35 TO-92 IN SOCKET SOLDERED TO
1" x .4" Cu PCB
10
0
VIN = +3V, +5V
20 30 40 50 60
TIME – sec
Figure 15. Thermal Response Time in Stirred Oil Bath
VOLT/DIVISION
10
0%
TIME/DIVISION
Figure 16. Temperature Sensor Wideband Output Noise Voltage. Gain = 100, BW = 157 kHz
Figure 17. Voltage Noise Spectral Density vs. Frequency
APPLICATIONS SECTION Shutdown Operation
All TMP3x devices include a shutdown capability that reduces the power supply drain to less than 0.5 µA, maximum. This feature, available only in the SO-8 and the SOT-23 packages, is TTL/CMOS level compatible, provided that the temperature sensor supply voltage is equal in magnitude to the logic supply voltage. Internal to the TMP3x at the SHUTDOWN pin, a pull-up current source to V SHUTDOWN pin to be driven from an open-collector/drain driver. A logic LOW, or zero-volt condition on the SHUTDOWN pin, is required to turn the output stage OFF. During shut­down, the output of the temperature sensors becomes a high impedance state where the potential of the output pin would then be determined by external circuitry. If the shutdown fea­ture is not used, it is recommended that the SHUTDOWN pin be connected to V
The shutdown response time of these temperature sensors is illustrated in Figures 10, 11 and 12.
REV. A
is connected. This permits the
IN
(Pin 8 on the SO-8, Pin 2 on the SOT-23).
IN
Mounting Considerations
If the TMP3x temperature sensors are thermally attached and protected, they can be used in any temperature measurement application where the maximum temperature range of the me­dium is between –40°C to +125°C. Properly cemented or glued to the surface of the medium, these sensors will be within 0.01°C of the surface temperature. Caution should be exercised, espe­cially with TO-92 packages, because the leads and any wiring to the device can act as heat pipes, introducing errors if the sur­rounding air-surface interface is not isothermal. Avoiding this condition is easily achieved by dabbing the leads of the tempera­ture sensor and the hookup wires with a bead of thermally con­ductive epoxy. This will ensure that the TMP3x die temperature is not affected by the surrounding air temperature.
Because plastic IC packaging technology is used, excessive me­chanical stress should be avoided when fastening the device with a clamp or a screw-on heat tab. Thermally conductive epoxy or glue, which must be electrically nonconductive, is recommended under typical mounting conditions.
–7–
TMP35/TMP36/TMP37
These temperature sensors, as well as any associated circuitry, should be kept insulated and dry to avoid leakage and corrosion. In wet or corrosive environments, any electrically isolated metal or ceramic well can be used to shield the temperature sensors. Condensation at very cold temperatures can cause errors and should be avoided by sealing the device, using electrically non­conductive epoxy paints or dip or any one of many printed circuit board coatings and varnishes.
Thermal Environment Effects
The thermal environment in which the TMP3x sensors are used determines two important characteristics: self-heating effects and thermal response time. Illustrated in Figure 18 is a thermal model of the TMP3x temperature sensors that is useful in un­derstanding these characteristics.
T
P
D
C
CH
θ
J
JC
T
C
C
θ
C
CA
T
A
Figure 18. TMP3x Thermal Circuit Model
In the TO-92 package, the thermal resistance junction-to-case,
θ
, is 120°C/W. The thermal resistance case-to-ambient, θ
JC
is the difference between θ
and θ
JA
, and is determined by
JC
CA
,
the characteristics of the thermal connection. The tempera­ture sensor’s power dissipation, represented by P
, is the
D
product of the total voltage across the device and its total supply current (including any current delivered to the load). The rise in die temperature above the medium’s ambient temperature is given by:
T
= PD×θJC
J
()
+T
CA
A
Thus, the die temperature rise of a TMP35 “RT” package mounted into a socket in still air at 25°C and driven from a +5 V supply is less than 0.04°C.
The transient response of the TMP3x sensors to a step change in the temperature is determined by the thermal resistances and the thermal capacities of the die, C thermal capacity of the case, C
, and the case, CC. The
CH
, varies with the measurement
C
medium since it includes anything in direct contact with the package. In all practical cases, the thermal capacity of the case is the limiting factor in the thermal response time of the sensor and can be represented by a single-pole RC time constant re­sponse. Figures 13 and 15 illustrate the thermal response time of the TMP3x sensors under various conditions. The thermal time constant of a temperature sensor is defined as the time required for the sensor to reach 63.2% of the final value for a step change in the temperature. For example, the thermal time constant of a TMP35 “S” package sensor mounted onto a 0.5" by 0.3" PCB is less than 50 sec in air, whereas in a stirred oil bath the time constant is less than 3 sec.
Basic Temperature Sensor Connections
The circuit in Figure 19 illustrates the basic circuit configura­tion for the TMP3x family of temperature sensors. The table shown in the figure illustrates the pin assignments of the tem­perature sensors for the three package types. For the SOT-23, Pin 3 is labeled as “NC” are as Pins 2, 3, 6 and 7 on the SO-8 package. It is recommended that no electrical connections be made to these pins. If the shutdown feature is not needed on the SOT-23 or the SO-8 package, the SHUTDOWN pin should be connected to V
.
S
2.7V < Vs < 5.5V
0.1µF
V
s
V
V
SHDN
OUT
V
S
TMP3x
GND
GND
SHDN
PIN ASSIGNMENTS
PACKAGE
SO-8 8 4 1 5 SOT-23-5 2 5 1 4 TO-92 1 3 2 NA
OUT
Figure 19. Basic Temperature Sensor Circuit Configuration
Note the 0.1 µF bypass capacitor on the input. This capacitor should be a ceramic type, have very short leads (surface mount would be preferable), and located as close a physical proximity to the temperature sensor supply pin as practical. Since these temperature sensors operate on very little supply current and could be exposed to very hostile electrical environments, it is important to minimize the effects of RFI (Radio-Frequency Interference) on these devices. The effect of RFI on these tem­perature sensors in specific and analog ICs in general is mani­fested as abnormal dc shifts in the output voltage due to the rectification of the high frequency ambient noise by the IC. In those cases where the devices are operated in the presence of high frequency radiated or conducted noise, a large value tanta­lum capacitor (.2.2 µF) placed across the 0.1 µF ceramic may offer additional noise immunity.
Fahrenheit Thermometers
Although the TMP3x temperature sensors are centigrade tem­perature sensors, a few components can be used to convert the output voltage and transfer characteristics to directly read Fahr­enheit temperatures. Shown in Figure 20a is an example of a simple Fahrenheit thermometer using either the TMP35 or the TMP37. This circuit can be used to sense temperatures from 41°F to 257°F, with an output transfer characteristic of 1 mV/°F using the TMP35, and from 41°F to 212°F using the TMP37 with an output characteristic of 2 mV/°F. This particular ap­proach does not lend itself well to the TMP36 because of its inherent 0.5 V output offset. The circuit is constructed with an AD589, a 1.23 V voltage reference, and four resistors whose values for each sensor are shown in the figure table. The scaling of the
–8–
REV. A
TMP35/TMP36/TMP37
output resistance levels was to ensure minimum output loading on the temperature sensors. A generalized expression for the circuit’s transfer equation is given by:
V
OUT
=
 
R1+R2
R1
TMP 35
()
 
R3
+
R3+R4
AD589
()
 
where: TMP35 = Output voltage of the TMP35, or the TMP37,
at the measurement temperature, T
M
, and
AD589 = Output voltage of the reference = 1.23 V.
Note that the output voltage of this circuit is not referenced to the circuit’s common. If this output voltage were to be applied directly to the input of an ADC, the ADC’s common should be adjusted accordingly.
V
S
0.1mF
TMP35/37
AD589
1.23V
V
S
GND
R1
V
OUT
R2
V
OUT
R3
R4
V
S
V
S
V
GND
OUT
R1
45.3k
R2 10k
@ –408F = 18mV
V
OUT
@ 2578F = 315mV
V
@ 1mV/8F – 588F
V
OUT
0.1µF
TMP36
Figure 20b. TMP36 Fahrenheit Thermometer Version 1
At the expense of additional circuitry, the offset produced by the circuit in Figure 20b can be avoided by using the circuit in Figure 20c. In this circuit, the output of the TMP36 is condi­tioned by a single-supply, micropower op amp, the OP193. Although the entire circuit operates from a single +3 V supply, the output voltage of the circuit reads the temperature directly, with a transfer characteristic of 1 mV/°F, without offset. This is accomplished through the use of an ADM660, a supply voltage inverter. The +3 V supply is inverted and applied to the P193’s V– terminal. Thus, for a temperature range between –40°F and 257°F, the output of the circuit reads –40 mV to 257 mV. A general expression for the circuit’s transfer equation is given by:
PIN ASSIGNMENTS
TCV
R1 (kV)
SENSOR
TMP35 1mV/8F 45.3 10 10 374 TMP37 2mV/8F 45.3 10 10 182
OUT
R2 (kV) R3 (kV) R4 (kV)
Figure 20a. TMP35/TMP37 Fahrenheit Thermometers
The same circuit principles can be applied to the TMP36, but because of the TMP36’s inherent offset, the circuit uses two less resistors as shown in Figure 20b. In this circuit, the output voltage transfer characteristic is 1 mV/°F, but is referenced to the circuit’s common; however, there is a 58 mV (58°F) offset in the output voltage. For example, the output voltage of the circuit would read 18 mV, were the TMP36 placed in –40°F ambient environment, and 315 mV at 257°F.
OUT
=
 
R5+R6
V
R6
R4
1+
TMP 36
()
R3
R4
R3
V
S
2
Average and Differential Temperature Measurement
In many commercial and industrial environments, temperature sensors are often used to measure the average temperature in a building, or the difference in temperature between two locations on a factory floor or in an industrial process. The circuits in Figures 21a and 21b demonstrate an inexpensive approach to average and differential temperature measurement. In Figure 21a, an OP193 is used to sum the outputs of three temperature sensors to produce an output voltage scaled by 10 mV/°C that represents the average temperature at three locations. The cir­cuit can be extended to as many temperature sensors as required as long as the circuit’s transfer equation is maintained. In this application, it is recommended that one temperature sensor type be used throughout the circuit; otherwise, the output voltage of the circuit will not produce an accurate reading of the various ambient conditions.
REV. A
–9–
TMP35/TMP36/TMP37
V
S
V
10mF/0.1mF
TMP36
OUT
GND
ELEMENT
R2 258.6k R4 10k R5 47.7k R6 10k
50kV
R2
50kV
+3V
R1
C1
10mF
TMP36
NC
10mF
R3 R4
2
1
2
4
3
R5
R6
8
ADM660
3
5
6
7
Figure 20c. TMP36 Fahrenheit Thermometer Version 2
8
OP193
4
0.1mF
–3V 10mF
NC
V
@ 1mV/8F
6
OUT
–408F # T
# 2578F
A
7
OP193
< 5.5V
S
4
0.1mF V
TEMP(AVG)
@ 10mV/8C FOR TMP35/36 @ 20mV/8C FOR TMP35/36
1
R5 100kV
R6
7.5kV
TMP3x
R1
300kV
R2
300kV
2.7V < +V
2
3
TMP3x
FOR R1 = R2 = R3 = R;
= 1 (TMP3x1 + TMP3x2+ TMP3x3)
TEMP(AVG)
3
3
TMP3x
R3
300kV
7.5kV
V
R5 = R1
R4
R4 = R6
Figure 21a. Configuring Multiple Sensors for Average Temperature Measurements
The circuit in Figure 21b illustrates how a pair of TMP3x sensors can be used with an OP193 configured as a difference amplifier to read the difference in temperature between two locations. In these applications, it is always possible that one temperature sensor would be reading a temperature below that of the other sensor. To accommodate this condition, the output of the OP193 is offset to a voltage at one-half the supply via R5 and R6. Thus, the output voltage of the circuit is measured relative to this point,
as shown in the figure. Using the TMP36, the output voltage of the circuit is scaled by 10 mV/°C. To minimize error in the differ­ence between the two measured temperatures, a common, readily available thin-film resistor network is used for R1–R4.
< 5.5V
2.7V < V
S
0.1mF
0.1mF
# TA # 125°C
TMP36
@T1
TMP36
@T2
*R1–R4, CADDOCK T914–100k–100, OR EQUIVALENT
R8 25kV
R3*
R9 25kV
CENTERED AT
R4*
R5
100kV
2
3
1mF
R6
100kV
OP193
R2*R1*
0.1mF
7
6
4
= T2 – T1 @ 10mV/8C
V
OUT
CENTERED AT
V
R7 100kV
V
2
OUT
S
Figure 21b. Configuring Multiple Sensors for Differential Temperature Measurements
–10–
REV. A
TMP35/TMP36/TMP37
Microprocessor Interrupt Generator
These inexpensive temperature sensors can be used with a volt­age reference and an analog comparator to configure an inter­rupt generator useful in microprocessor applications. With the popularity of fast 486 and Pentium* laptop computers, the need to indicate a microprocessor over-temperature condition has grown tremendously. The circuit illustrated in Figure 22 dem­onstrates one way to generate an interrupt using a TMP35, a CMP402 analog comparator, and a REF191, a 2 V precision voltage reference.
The circuit has been designed to produce a logic HIGH inter­rupt signal if the microprocessor temperature exceeds 80°C. This 80°C trip point was arbitrarily chosen (final value set by the microprocessor thermal reference design) and is set using an R3-R4 voltage divider of the REF191’s output voltage. Since the output of the TMP35 is scaled by 10 mV/°C, the voltage at the CMP402’s inverting terminal is set to 0.8 V.
Since temperature is a slowly moving quantity, the possibility for comparator chatter exists. To avoid this condition, hysteresis is used around the comparator. In this application, a hysteresis of 5°C about the trip point was arbitrarily chosen; the ultimate value for hysteresis should be determined by the end applica­tion. The output logic voltage swing of the comparator with R1 and R2 determine the amount of comparator hysteresis. Using a
3.3 V supply, the output logic voltage swing of the CMP402 is
2.6 V; thus, for a hysteresis of 5°C (50 mV @ 10 mV/°C), R1 is set to 20 k and R2 is set to 1 M. An expression for this circuit’s hysteresis is given by:
R1
V
=
HYS
V
()
 
LOGIC SWING,CMP402
R2
Since the likelihood that this circuit would be used in close proximity to high speed digital circuits, R1 is split into equal values and a 1000 pF is used to form a low-pass filter on the output of the TMP35. Furthermore, to prevent high frequency noise from contaminating the comparator trip point, a 0.1 µF capacitor is used across R4.
*All trademarks are the property of their respective holders.
3.3V
Thermocouple Signal Conditioning with Cold-Junction Compensation
The circuit in Figure 23 conditions the output of a Type K thermocouple, while providing cold-junction compensation, for temperatures between 0°C and 250°C. The circuit operates from single +3.3 V to +5.5 V supplies and has been designed to produce an output voltage transfer characteristic of 10 mV/°C.
A Type K thermocouple exhibits a Seebeck coefficient of approximately 41 µV/°C; therefore, at the cold junction, the TMP35, with a temperature coefficient of 10 mV/°C, is used with R1 and R2 to introduce an opposing cold-junction tem­perature coefficient of –41 µV/°C. This prevents the isothermal, cold-junction connection between the circuit’s PCB tracks and the thermocouple’s wires from introducing an error in the mea­sured temperature. This compensation works extremely well for circuit ambient temperatures in the range of 20°C to 50°C. Over a 250°C measurement temperature range, the thermo­couple produces an output voltage change of 10.151 mV. Since the required circuit’s output full-scale voltage is 2.5 V, the gain of the circuit is set to 246.3. Choosing R4 equal to 4.99 k sets R5 equal to 1.22 M. Since the closest 1% value for R5 is
1.21 M, a 50 k potentiometer is used with R5 for fine trim of the full-scale output voltage. Although the OP193 is a superior single-supply, micropower operational amplifier, its output stage is not rail-to-rail; as such, the 0°C output voltage level is 0.1 V. If this circuit were to be digitized by a single-supply ADC, the ADC’s common should be adjusted to 0.1 V accordingly.
Using TMP3x Sensors in Remote Locations
In many industrial environments, sensors are required to oper­ate in the presence of high ambient noise. These noise sources take on many forms; for example, SCR transients, relays, radio transmitters, arc welders, ac motors, et cetera. They may also be used at considerable distance from the signal conditioning cir­cuitry. These high noise environments are very typically in the form of electric fields, so the voltage output of the temperature sensor can be susceptible to contamination from these noise sources.
REV. A
0.1mF
V
TMP35
GND
S
V
OUT
R5 100k
REF191
3
R1A
10kV
0.1mF
2
6
4
1mF
1
C1 = CMP402
4
C
L
1000pF
R3
16kV
R1B
10kV
R4 10kV
V
REF
0.1mF
Figure 22. Pentium Over-Temperature Interrupt Generator
–11–
R2
1MV
0.1mF
3
6
5
4
C1
13
2
14
<808C
INTERRUPT
>808C
TMP35/TMP36/TMP37
3.3V < V
< 5.5V
S
TYPE K THERMO COUPLE
0.1mF
CHROMEL
ALUMEL
08C # T # 2508C
V
S
TMP35
GND
COLD
JUNCTION
ISOTHERMAL
BLOCK
V
OUT
R1*
24.9kV
CU
CU
R2* 102V
R3
R4
10MV
4.99kV
5%
NOTE: ALL RESISTORS 1%
UNLESS OTHERWISE NOTED
2
3
7
OP193
R5*
1.21MV
0.1mF
6
4
50kV
R6 100kV 5%
P1
V 0 – 2.5V
OUT
Figure 23. A Single-Supply, Type K Thermocouple Signal Conditioning Circuit with Cold-Junction Compensation
Illustrated in Figure 24 is a way to convert the output voltage of a TMP3x sensor into a current to be transmitted down a long twisted-pair shielded cable to a ground referenced receiver. The temperature sensors do not possess the capability of high output current operation; thus, a garden variety PNP transistor is used to boost the output current drive of the circuit. As shown in the table, the values of R2 and R3 were chosen to produce an arbi­trary full-scale output current of 2 mA. Lower values for the full-scale current are not recommended. The minimum-scale output current produced by the circuit could be contaminated by nearby ambient magnetic fields operating in vicinity of the circuit/cable pair. Because of the use of an external transistor, the minimum recommended operating voltage for this circuit is +5 V. Note, to minimize the effects of EMI (or RFI) both the circuit’s and the temperature sensor’s supply pins are bypassed with good quality, ceramic capacitors.
A Temperature to 4–20 mA Loop Transmitter
In many process control applications, two-wire transmitters are used to convey analog signals through noisy ambient environ­ments. These current transmitters use a “zero-scale” signal current of 4 mA that can be used to power the transmitter’s signal conditioning circuitry. The “full-scale” output signal in these transmitters is 20 mA.
A circuit that transmits temperature information in this fashion is illustrated in Figure 25. Using a TMP3x as the temperature sensor, the output current is linearly proportional to the tem­perature of the medium. The entire circuit operates from the +3 V output of the REF193. The REF193 requires no external trimming for two reasons: (1) the REF193’s tight initial output voltage tolerance and (2) the low supply current of TMP3x, the OP193 and the REF193. The entire circuit consumes less than 3 mA from a total budget of 4 mA. The OP193 regulates the output current to satisfy the current summation at the non­inverting node of the OP193. A generalized expression for the KCL equation at the OP193’s Pin 3 is given by:
I
=
OUT
 
R 7
×
R1
TMP 3x ×R3
1
× R3
V
REF
+
R2
For each of the three temperature sensors, the table below illus­trates the values for each of the components, P1, P2 and R1–R4:
0.1mF
0.01mF
R1
4.7kV
TMP3x
+5V
2N2907
V
S
V
OUT
V
OUT
R3
 
GND
SENSOR R2 R3 TMP35 634 634 TMP36 887 887 TMP37 1k 1k
R2
TWISTED PAIR BELDEN TYPE 9502 OR EQUIVALENT
Figure 24. A Remote, Two-Wire Boosted Output Current Temperature Sensor
Table II. Circuit Element Values for Loop Transmitter
Sensor R1(V) P1(V) R2(V) P2(V) R3(V) R4(V)
TMP35 97.6 k 5 k 1.58 M 100 k 140 k 56.2 k TMP36 97.6 k 5 k 931 k 50 k 97.6 k 47 k TMP37 97.6 k 5 k 10.5 k 500 84.5 k 8.45 k
–12–
REV. A
TMP35/TMP36/TMP37
The 4 mA offset trim is provided by P2, and P1 provides the circuit’s full-scale gain trim at 20 mA. These two trims do not interact because the noninverting input of the OP193 is held at a virtual ground. The zero-scale and full-scale output currents of the circuit are adjusted according to the operating tempera­ture range of each temperature sensor. The Schottky diode, D1, is required in this circuit to prevent loop supply power-on tran­sients from pulling the noninverting input of the OP193 more than 300 mV below its inverting input. Without this diode, such transients could cause phase reversal of the operational amplifier and possible latchup of the transmitter. The loop supply voltage compliance of the circuit is limited by the maximum applied input voltage to the REF193 and is from +9 V to +18 V.
A Temperature to Frequency Converter
Another common method of transmitting analog information from a remote location is to convert a voltage to an equivalent in the frequency domain. This is readily done with any of the low cost, monolithic voltage-to-frequency converters (VFCs) avail­able. These VFCs feature a robust, open-collector output tran­sistor for easy interfacing to digital circuitry. The digital signal produced by the VFC is less susceptible to contamination from external noise sources and line voltage drops because the only important information is the frequency of the digital signal. As long as the conversions between temperature and frequency are done accurately, the temperature data from the sensors can be reliably transmitted.
The circuit in Figure 26 illustrates a method by which the out­puts of these temperature sensors can be converted to a fre­quency using the AD654. The output signal of the AD654 is a square wave that is proportional to the dc input voltage across Pins 4 and 3. The transfer equation of the circuit is given by:
f
OUT
V
=
 
V
TMP
10 × RC
OFFSET
()
 
T
+5V
*
C
T
7
6
8
AD654
2
5
NB: ATTA (min),
*
RT & CT – SEE TABLE
T
1.7nF
1.8nF
2.1nF
R
PU
5kV
1
f
OUT
f
= 0Hz
OUT
10mF/0.1mF
TMP3x
100kV
P2
V
S
V
OUT
GND
R
*
T
+5V
R
OFF1
470V
SENSOR R
TMP35 TMP36 TMP37
0.1mF
4
3
R1
P1
f
OUT
OFFSET
R
OFF2
10V
(R1 + P1) C
T
11.8kV + 500V
16.2kV + 500V
18.2kV + 1kV
Figure 26. A Temperature to Frequency Converter
An offset trim network (f circuit to set f
at 0 Hz when the temperature sensor’s mini-
OUT
OFFSET ) is included with this
OUT
mum output voltage is reached. Potentiometer P1 is required to calibrate the absolute accuracy of the AD654. The table in the figure illustrates the circuit element values for each of the three sensors. The nominal offset voltage required for 0 Hz output from the TMP35 is 50 mV; for the TMP36 and TMP37, the offset voltage required is 100 mV. In all cases for the circuit values shown, the output frequency transfer characteristic of the circuit was set at 50 Hz/°C. At the receiving end, a frequency­to-voltage converter (FVC) can be used to convert the fre­quency back to a dc voltage for further processing. One such FVC is the AD650.
For complete information on the AD650 and AD654, please consult the individual data sheets for those devices.
REV. A
TMP3x
V
S
GND
R1*
V
OUT
* SEE TEXT FOR VALUES
P1*
20mA
ADJUST
R3*
R2*
P2* 4mA ADJUST
3
2
D1
R4*
D1 : HP5082–2810
A1 : OP193
+3V
6
REF193
1mF
0.1mF
7
4
R5 100kV
4
R6
100kV
2
R7
100V
Figure 25. A Temperature to 4-to-20 mA Loop Transmitter
–13–
Q1 2N1711
I
L
V
LOOP
+9V TO +18V
V
OUT
R
L
250V
TMP35/TMP36/TMP37
Driving Long Cables or Heavy Capacitive Loads
Although the TMP3x family of temperature sensors is capable of driving capacitive loads up to 10,000 pF without oscillation, output voltage transient response times can be improved with the use of a small resistor in series with the output of the tem­perature sensor, as shown in Figure 27. As an added benefit, this resistor forms a low-pass filter with the cable’s capacitance, which helps to reduce bandwidth noise. Since the temperature sensor is likely to be used in environments where the ambient noise level can be very high, this resistor helps to prevent rectifi­cation by the devices of the high frequency noise. The combina­tion of this resistor and the supply bypass capacitor offers the best protection.
+V
S
750V
V
0.1mF
TMP3x
GND
OUT
LONG CABLE OR HEAVY CAPACITIVE LOADS
Figure 27. Driving Long Cables or Heavy Capacitive Loads
Commentary on Long-Term Stability
The concept of long-term stability has been used for many years to describe by what amount an IC’s parameter would shift dur­ing its lifetime. This is a concept that has been typically applied to both voltage references and monolithic temperature sensors. Unfortunately, integrated circuits cannot be evaluated at room temperature (25°C) for 10 years or so to determine this shift. As a result, manufacturers very typically perform accelerated life­time testing of integrated circuits by operating ICs at elevated temperatures (between 125°C and 150°C) over a shorter period of time (typically, between 500 and 1000 hours).
As a result of this operation, the lifetime of an integrated circuit is significantly accelerated due to the increase in rates of reac­tion within the semiconductor material. A well-understood, and universal, model used by the semiconductor industry, that
relates the change in rates of reaction to a change in elevated temperatures, is the Arrhenius model. From the Arrhenius model, an acceleration factor can be calculated and applied to the parameter specified. For example, this acceleration factor can be used to reduce a temperature sensor’s long-term stability (e.g., 0.4°C after 1000 hours at T
= 150°C) to an observed
J
shift in that parameter at 25°C. For any semiconductor device, the acceleration factor is expressed as:
F = exp
E
 
1
a
×
k
T1
1
T 2
where F = Calculated acceleration factor;
E
= Activation energy in eV = 0.7 eV;
a
k = Boltzmann’s constant = 8.63 × 10 T1 = Test temperature in Kelvin, T
–5
eV/K;
= 150°C = 423.15 K;
J
and T2 = Desired operating temperature in Kelvin,
T
= 25°C = 298.15 K
J
For example, if the desired operating temperature of an IC is 25°C and has been subjected to test temperature of 150°C, the acceleration factor is:
F = 3.23 × 10
4
With this background information, the TMP3x family’s long­term stability can be mapped to what its equivalent observed shift would be at T
= 25°C. As quoted in the data sheet, the
A
long-term stability of these temperature sensors after 1000 hours at 150°C is 0.4°C. This shift is equivalent to 0.01°C/day at T
= 150°C. To determine what the observed shift would be at
J
T
= 25°C is a matter of applying the acceleration factor calcu-
A
lated above to this result:
0.01°C / day ×3.23 ×10−4=0.003m°C / day @25°C
Thus, if any of the TMP3x devices were to be used at 25°C, the observed shift would be no more than 0.003 m°C per day, or
0.1 m°C per month. Calculating the observed shift for any other operating temperature is simply a matter of calculating a new acceleration factor.
–14–
REV. A
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
TMP35/TMP36/TMP37
3-Lead Plastic Package
(TO-92)
0.135
(3.43)
MIN
SEATING
PLANE
0.500
(12.70)
MIN
0.105 (2.66)
0.095 (2.42)
0.105 (2.66)
0.080 (2.42)
0.105 (2.66)
0.080 (2.42)
123
BOTTOM VIEW
0.205 (5.20)
0.175 (4.96)
0.210 (5.33)
0.170 (4.38)
0.050 (1.27) MAX
0.019 (0.482)
0.016 (0.407) SQUARE
0.055 (1.39)
0.045 (1.15)
0.165 (4.19)
0.125 (3.94)
0.1574 (4.00)
0.1497 (3.80)
0.0098 (0.25)
0.0040 (0.10)
0.0669 (1.70)
0.0590 (1.50)
PIN 1
0.0512 (1.30)
0.0354 (0.90)
0.0059 (0.15)
0.0019 (0.05)
PIN 1
SEATING
PLANE
8-Lead SOIC
(SO-8)
0.1968 (5.00)
0.1890 (4.80)
8
5
0.2440 (6.20)
41
0.2284 (5.80)
0.0688 (1.75)
0.0532 (1.35)
0.0500 (1.27)
BSC
0.0192 (0.49)
0.0138 (0.35)
0.0098 (0.25)
0.0075 (0.19)
5-Lead Surface Mount
RT-5 (SOT-23 Type)
0.1181 (3.00)
0.1102 (2.80)
4 5
0.1181 (3.00)
1 3
2
0.0748 (1.90)
BSC
0.0197 (0.50)
0.0138 (0.35)
0.1024 (2.60)
0.0374 (0.95) BSC
0.0571 (1.45)
0.0374 (0.95)
SEATING PLANE
0.0196 (0.50)
0.0099 (0.25)
8° 0°
0.0500 (1.27)
0.0160 (0.41)
10°
x 45°
0.0079 (0.20)
0.0031 (0.08)
0.0217 (0.55)
0.0138 (0.35)
REV. A
–15–
C2116a–6–6/97
–16–
PRINTED IN U.S.A.
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