Analog Devices SMP08FP, SMP08FS Datasheet

Octal Sample-and-Hold
a
FEATURES Internal Hold Capacitors Low Droop Rate TTL/CMOS Compatible Logic Inputs Single or Dual Supply Operation Break-Before-Make Channel Addressing Compatible With CD4051 Pinout Low Cost
APPLICATIONS Multiple Path Timing Deskew for ATE Memory Programmers Mass Flow/Process Control Systems Multichannel Data Acquisition Systems Robotics and Control Systems Medical and Analytical Instrumentation Event Analysis Stage Lighting Control
SMP08*

FUNCTIONAL BLOCK DIAGRAM

INPUT
3
(LSB)
A
SW
(MSB)
C
B
1 OF 8 DECODER
SW
SW
SW
SW
INH
691011
SW
SW
8 16 13
14
15
12
1
5
2
DGND V
DD
CH0OUT
CH1OUT
CH2OUT
OUT
CH
3
OUT
CH
4
CH5OUT
CH6OUT
GENERAL DESCRIPTION
The SMP08 is a monolithic octal sample-and-hold; it has eight internal buffer amplifiers, input multiplexer, and internal hold capacitors. It is manufactured in an advanced oxide isolated CMOS technology to obtain high accuracy, low droop rate, and fast acquisition time. The SMP08 has a typical linearity error of only 0.01% and can accurately acquire a 10-bit input signal to ±1/2 LSB in less than 7 microseconds. The SMP08’s output swing includes the negative supply in both single and dual sup­ply operation.
The SMP08 was specifically designed for systems that use a calibration cycle to adjust a multiple of system parameters. The low cost and high level of integration make the SMP08 ideal for calibration requirements that have previously required an ASIC, or high cost multiple D/A converters.
*Protected by U.S. Patent No. 4,739,281.
SW
HOLD CAPS
(INTERNAL)
4
OUT
CH
7
V
7
SS
SMP08
The SMP08 is also ideally suited for a wide variety of sample­and-hold applications including amplifier offset or VCA gain adjustments. One or more SMP08s can be used with single or multiple DACs to provide multiple set points within a system.
The SMP08 offers significant cost and size reduction over dis­crete designs. It is available in a 16-pin plastic DIP, or surface­mount SOIC package.
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Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 617/329-4700 World Wide Web Site: http://www.analog.com Fax: 617/326-8703 © Analog Devices, Inc., 1996
SMP08–SPECIFICATIONS
(@ VDD = +5 V, VSS = –5 V, DGND = 0 V, RL = No Load, TA = –408C to +858C for SMP08F,
ELECTRICAL CHARACTERISTICS
Parameter Symbol Conditions Min Typ Max Units
Linearity Error –3 V V Buffer Offset Voltage V
Hold Step V Droop Rate V
Output Source Current I Output Sink Current I Output Voltage Range RL = 20 k –3.0 +3.0 V
LOGIC CHARACTERISTICS
Logic Input High Voltage V Logic Input Low Voltage V Logic Input Current I
DYNAMIC PERFORMANCE
Acquisition Time
3
2
Hold Mode Settling Time t Channel Select Time t Channel Deselect Time t Inhibit Recovery Time t Slew Rate SR 3 V/µs Capacitive Load Stability <30% Overshoot 500 pF Analog Crosstalk –3 V to +3 V Step –72 dB
SUPPLY CHARACTERISTICS
Power Supply Rejection Ratio PSRR V Supply Current I
OS
HS
CH SOURCE SINK
INH INL
IN
t
AQ H CH DCS IR
DD
unless otherwise noted)
+3 V 0.01 %
TA = +25°C, VIN = 0 V 2.5 10 mV –40°C T VIN = 0 V, TA = +25°C to +85°C 2.5 4 mV V
/tTA = +25°C, VIN = 0 V 2 20 mV/s
VIN = 0 V VIN = 0 V
VIN = 2.4 V 0.5 1 µA
TA = +25°C, –3 V to +3 V to 0.1% 3.6 7 µs To ±1 mV of Final Value 1 µs
TA = +25°C 4 7.5 mA –40°C TA +85°C 5 9.5 mA
IN
+85°C, VIN = 0 V 3.5 20 mV
A
= 0 V, TA = –40°C5mV
IN
1 1
1.2 mA
0.5 mA
2.4 V
0.8 V
90 ns 45 ns 90 ns
= ±5 V to ±6 V 60 75 dB
S
(@ VDD = +12 V, VSS = 0 V, DGND = 0 V, RL = No Load, TA = –408C to +858C for SMP08F,
ELECTRICAL CHARACTERISTICS
Parameter Symbol Conditions Min Typ Max Units
Linearity Error 60 mV V Buffer Offset Voltage V
Hold Step V Droop Rate V
Output Source Current I Output Sink Current I Output Voltage Range R
LOGIC CHARACTERISTICS
Logic Input High Voltage V Logic Input Low Voltage V Logic Input Current I
DYNAMIC PERFORMANCE
Acquisition Time
3
2
Hold Mode Settling Time t Channel Select Time t Channel Deselect Time t Inhibit Recovery Time t Slew Rate SR R Capacitive Load Stability <30% Overshoot 500 pF Analog Crosstalk 0 V to 10 V Step –72 dB
SUPPLY CHARACTERISTICS
Power Supply Rejection Ratio PSRR 10.8 V V Supply Current I
NOTES
1
Outputs are capable of sinking and sourcing over 20 mA but offset is guaranteed at specified load levels.
2
All input control signals are specified with tr = tf = 5 ns (10% to 90% of +5 V) and timed from a voltage level of 1.6 V.
3
This parameter is guaranteed without test.
4
Slew rate is measured in the sample mode with 0 V to 10 V step from 20% to 80%.
Specifications subject to change without notice.
OS
HS
CH SOURCE SINK
INH INL
IN
t
AQ
H CH DCS IR
DD
unless otherwise noted)
10 V 0.01 %
TA = +25°C, VIN = 6 V 2.5 10 mV –40°C T VIN = 6 V, TA = +25°C to +85°C 2.5 4 mV V
IN
/tTA = +25°C, VIN = 6 V 2 20 mV/s
VIN = 6 V VIN = 6 V
L
RL = 10 k 0.06 9.5 V
VIN = 2.4 V 0.5 1 µA
TA = +25°C, 0 V to 10 V to 0.1% 3.5 4.25 µs –40°C T To ±1 mV of Final Value 1 µs
L
TA = +25°C 6.0 8.0 mA –40°C TA +85°C 8.0 10.0 mA
IN
+85°C, VIN = 6 V 3.5 20 mV
A
= 6 V, TA = –40°C5mV
1 1
1.2 mA
0.5 mA
= 20 k 0.06 10.0 V
2.4 V
0.8 V
+85°C 3.75 6.00 µs
A
90 ns 45 ns
= 20 k
4
13.2 V 60 75 dB
DD
34 V/µs
90 ns
–2–
REV. D
SMP08

ABSOLUTE MAXIMUM RATINGS

VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, 17 V
V
to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, 17 V
DD
V
to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, V
LOGIC
VIN to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS, V
V
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS, V
OUT
DD DD DD
Model Range Description Option
SMP08FP –40°C to +85°C Plastic DIP N-16 SMP08FS –40°C to +85°C SO-16 R-16A

ORDERING GUIDE

Temperature Package Package
Analog Output Current . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
(Not Short-Circuit Protected)
Operating Temperature Range
PIN CONNECTIONS
FP, FS . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300°C
Package Type uJA* u
JC
Units
16-Pin Plastic DIP (P) 76 33 °C/W 16-Pin SOIC (S) 92 27 °C/W
*θJA is specified for worst case mounting conditions, i.e., θJA is specified for device
in socket for plastic DIP package; θJA is specified for device soldered to printed circuit board for SO package.
CH4OUT CH6OUT
INPUT
OUT
CH
7
CH
OUT
5
INH V
DGND
SS
1 2 3 4 5
(Not to Scale)
6 7 8
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the SMP08 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
SMP08
TOP VIEW
WARNING!
V
16
DD
OUT
CH
15
2
CH
OUT
14
1
CH
OUT
13
0
CH
OUT
12
3
11
A CONTROL
10
B CONTROL
9
C CONTROL
ESD SENSITIVE DEVICE
REV. D
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