Differential Input and Output Driver
or Two Single-Ended Drivers
High Output Power
Power Package
26 dBm Differential Line Drive for ADSL Application
40 V p-p Differential Output Voltage, R
500 mA Minimum Output Drive/Amp, R
Thermally Enhanced SOIC
400 mA Minimum Output Drive/Amp, R
Low Distortion
–66 dB @ 1 MHz THD, R
= 200 ⍀, V
L
0.05% and 0.45ⴗ Differential Gain and Phase, R
(6 Back-Terminated Video Loads)
High Speed
120 MHz Bandwidth (–3 dB)
900 V/s Differential Slew Rate
70 ns Settling Time to 0.1%
Thermal Shutdown
APPLICATIONS
ADSL, HDSL and VDSL Line Interface Driver
Coil or Transformer Driver
CRT Convergence and Astigmatism Adjustment
Video Distribution Amp
Twisted Pair Cable Driver
PRODUCT DESCRIPTION
The AD815 consists of two high speed amplifiers capable of
supplying a minimum of 500 mA. They are typically configured
as a differential driver enabling an output signal of 40 V p-p on
±15 V supplies. This can be increased further with the use of a
–40
VS = 615V
G = +10
–50
–60
V
OUT
= 40V p-p
= 50 ⍀
L
L
L
= 40 V p-p
OUT
= 5 ⍀
= 10 ⍀
= 25 ⍀
L
Differential Driver
AD815
FUNCTIONAL BLOCK DIAGRAM
15-Lead Through-Hole SIP (Y) and Surface-Mount
DDPAK(VR)
coupling transformer with a greater than 1:1 turns ratio. The
low harmonic distortion of –66 dB @ 1 MHz into 200 Ω
combined with the wide bandwidth and high current drive make
the differential driver ideal for communication applications such
as subscriber line interfaces for ADSL, HDSL and VDSL.
The AD815 differential slew rate of 900 V/µs and high load drive
are suitable for fast dynamic control of coils or transformers,
and the video performance of 0.05% and 0.45° differential gain
and phase into a load of 25 Ω enable up to 12 back-terminated
loads to be driven.
Three package styles are available, and all work over the
industrial temperature range (–40°C to +85°C). Maximum
output power is achieved with the power package available for
through-hole mounting (Y) and surface-mounting (VR). The
24-lead SOIC (RB) is capable of driving 26 dBm for full rate
ADSL with proper heat sinking.
–70
RL = 50V
–80
(DIFFERENTIAL)
–90
–100
TOTAL HARMONIC DISTORTION – dBc
–110
REV. B
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
Lead Temperature Range (Soldering, 10 sec) . . . . . . . +300°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Specification is for device in free air with 0 ft/min air flow: 15-Lead Through-Hole
The maximum power that can be safely dissipated by the AD815
is limited by the associated rise in junction temperature. The
maximum safe junction temperature for the plastic encapsulated
parts is determined by the glass transition temperature of the
plastic, about 150°C. Exceeding this limit temporarily may
cause a shift in parametric performance due to a change in the
stresses exerted on the die by the package. Exceeding a junction
temperature of 175°C for an extended period can result in
device failure.
The AD815 has thermal shutdown protection, which guarantees
that the maximum junction temperature of the die remains below a
safe level, even when the output is shorted to ground. Shorting
the output to either power supply will result in device failure.
To ensure proper operation, it is important to observe the
derating curves and refer to the section on power considerations.
It must also be noted that in high (noninverting) gain configurations
(with low values of gain resistor), a high level of input overdrive
can result in a large input error current, which may result in a
significant power dissipation in the input stage. This power
must be included when computing the junction temperature rise
due to total internal power.
Plot of Maximum Power Dissipation vs. Temperature
Model Temperature RangePackage DescriptionPackage Option
AD815ARB-24–40°C to +85°C24-Lead Thermally Enhanced SOICRB-24
AD815ARB-24-REEL–40°C to +85°C24-Lead Thermally Enhanced SOICRB-24
AD815AVR–40°C to +85°C15-Lead Surface Mount DDPAKVR-15
AD815AY–40°C to +85°C15-Lead Through-Hole SIP with Staggered Leads and 90° Lead FormY-15
AD815AYS–40°C to +85°C15-Lead Through-Hole SIP with Staggered Leads and Straight Lead FormYS-15
AD815-EBEvaluation Board
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD815 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
REV. B–3–
ORDERING GUIDE
AD815–Typical Performance Characteristics
JUNCTION TEMPERATURE – 8C
–40100–20020406080
36
34
18
SUPPLY CURRENT – mA
26
24
22
20
30
28
32
VS = 615V
VS = 65V
SUPPLY VOLTAGE – 6Volts
33
30
18
0162
TOTAL SUPPLY CURRENT – mA
468101214
27
24
21
TA = +258C
AD815
20
15
10
5
COMMON-MODE VOLTAGE RANGE – 6Volts
0
0205
SUPPLY VOLTAGE – 6Volts
1015
Figure 1. Input Common-Mode Voltage Range vs. Supply
Voltage