APPLICATIONS
Video Line Driver
LCD Drivers
Computer Video Plug-In Boards
Ultrasound
RGB Amplifier
CCD Based Systems
PRODUCT DESCRIPTION
The AD813 is a low power, single supply triple video amplifier.
Each of the three current feedback amplifiers has 50 mA of output
current, and is optimized for driving one back-terminated video
load (150 Ω). The AD813 features gain flatness of 0.1 dB to
G = +2
RL = 150V
0.2
0.1
0
–0.1
–0.2
–0.3
NORMALIZED GAIN – dB
–0.4
–0.5
100k
1M100M10M
FREQUENCY – Hz
Figure 1. Fine Scale Gain Flatness vs. Frequency,
= 150
G = +2, R
Ω
L
REV. B
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
615V
65V
3V
5V
Triple Video Amplifier
AD813
PIN CONFIGURATION
14-Lead DIP and SOIC
OUT2
DISABLE1
DISABLE2
DISABLE3
V
+IN1
–IN1
OUT1
1
2
3
+
4
S
AD813
5
6
7
50 MHz while offering differential gain and phase error of
0.03% and 0.06°. This makes the AD813 ideal for broadcast
and consumer video electronics.
The AD813 offers low power of 5.5 mA per amplifier max and
runs on a single +3 V power supply. The outputs of each amplifier swing to within one volt of either supply rail to easily accommodate video signals. While operating on a single +5 V supply
the AD813 still achieves 0.1 dB flatness to 20 MHz and 0.05%
& 0.05° of differential gain and phase performance. All this is
offered in a small 14-lead plastic DIP or SOIC package. These
features make this triple amplifier ideal for portable and battery
powered applications where size and power are critical.
The outstanding bandwidth of 125 MHz along with 500 V/µs of
slew rate make the AD813 useful in many general purpose, high
speed applications where a single +3 V or dual power supplies
up to ±15 V are needed. Furthermore the AD813 contains a
high speed disable function for each amplifier in order to power
down the amplifier or high impedance the output. This can then
be used in video multiplexing applications. The AD813 is available in the industrial temperature range of –40°C to +85°C in
plastic DIP and SOIC packages as well as chips.
500mV
100
90
10
0%
5V
Figure 2. Channel Switching Characteristics for a 3:1 Mux
AD813AR-14–40°C to +85°C14-Lead Plastic SOIC R-14
AD813ACHIPS–40°C to +85°CDie Form
AD813AR-REEL13" REEL
AD813AR-REEL77" REEL
5962-9559601M2A* –55°C to +125°C 20-Lead LCC
*Refer to official DSCC drawing for tested specifications and pin configuration.
ORDERING GUIDE
TemperaturePackagePackage
Lead Temperature Range (Soldering 10 sec) . . . . . . . +300°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
The maximum power that can be safely dissipated by the
AD813 is limited by the associated rise in junction temperature.
The maximum safe junction temperature for the plastic encapsulated parts is determined by the glass transition temperature
of the plastic, about 150°C. Exceeding this limit temporarily
may cause a shift in parametric performance due to a change in
the stresses exerted on the die by the package. Exceeding a
junction temperature of 175°C for an extended period can result
in device failure.
While the AD813 is internally short circuit protected, this may
not be enough to guarantee that the maximum junction temperature (150°C) is not exceeded under all conditions. To
ensure proper operation, it is important to observe the derating
curves.
It must also be noted that in (noninverting) gain configurations
(with low values of gain resistor), a high level of input overdrive
can result in a large input error current, which may result in a
significant power dissipation in the input stage. This power
must be included when computing the junction temperature rise
due to total internal power.
METALIZATION PHOTO
Dimensions shown in inches and (mm).
0.124
+IN2
12
(3.15)
VS–
11
2.5
2.0
14-LEAD DIP PACKAGE
1.5
14-LEAD SOIC
1.0
MAXIMUM POWER DISSIPATION – Watts
0.5
–5080
–40
AMBIENT TEMPERATURE –
20 30 40 50 60 7090
010–10–20–30
C
T
= +150 C
J
Figure 3. Maximum Power Dissipation vs. Ambient
Temperature
VS–
11
VS–
11
+IN3
10
–IN2 13
OUT2 14
DISABLE1 1
DISABLE2 2
3
DISABLE3
VS+
4
+IN1
5
–IN1
6
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD813 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
9 –IN3
8 OUT3
7 OUT1
0.057
(1.45)
–6–
REV. B
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