Analog Devices AD73411 Datasheet

Low-Power
a
Analog Front End with DSP Microcomputer
FEATURES
AFE PERFORMANCE 16-Bit A/D Converter 16-Bit D/A Converter Programmable Input/Output Sample Rates 76 dB ADC SNR 77 dB DAC SNR 64 kS/s Maximum Sample Rate –90 dB Crosstalk Low Group Delay (25 s Typ per ADC Channel,
50 s Typ per DAC Channel) Programmable Input/Output Gain On-Chip Reference
DSP PERFORMANCE 19 ns Instruction Cycle Time @ 3.3 V, 52 MIPS
Sustained Performance AD73411-80
80K Bytes of On-Chip RAM, Configured as 16K Words
Program Memory RAM and 16K Words
Data Memory RAM AD73411-40
40K Bytes of On-Chip RAM, Configured as 8K Words
Program Memory RAM and 8K Words
Data Memory RAM
DATA
ADDRESS
GENERATORS
DAG 2
DAG 1
ARITHMETIC UNITS
ADSP-2100 BASE
ARCHITECTURE
AD73411
FUNCTIONAL BLOCK DIAGRAM
POWER-DOWN
CONTROL
PROGRAM
SEQUENCER
PROGRAM MEMORY ADDRESS
DATA MEMORY ADDRESS
PROGRAM MEMORY DATA
DATA MEMORY DATA
SHIFTERMACALU
REF
MEMORY
16K PM
(OPTIONAL
(OPTIONAL
8K)
SERIAL PORTS
SPORT 0
SPORT 1
SERIAL PORT
SPORT 2
ADC DAC
ANALOG FRONT END
SECTION
16K DM
8K)
PROGRAMMABLE
I/O
AND
FLAGS
TIMER
FULL MEMORY
MODE
EXTERNAL
ADDRESS
BUS
EXTERNAL
DATA
BUS
BYTE DMA
CONTROLLER
OR
EXTERNAL
DATA
BUS
INTERNAL
DMA
PORT
HOST MODE
GENERAL DESCRIPTION
The AD73411 is a single device incorporating a single analog front end (AFE) and a microcomputer optimized for digital signal processing (DSP) and other high-speed numeric processing applications.
The AD73411’s analog front end (AFE) section is suitable for general-purpose applications including speech and telephony. The AFE section features a 16-bit A/D converter and a 16-bit D/A converter. Each converter provides 76 dB signal-to-noise ratio over a voiceband signal bandwidth.
The AD73411 is particularly suitable for a variety of applications in the speech and telephony area, including low bit rate, high­quality compression, speech enhancement, recognition, and synthesis. The low group delay characteristic of the AFE makes it suitable for single or multichannel active control applications. The A/D and D/A conversion channels feature programmable input/output gains with ranges of 38 dB and 21 dB respectively. An on-chip reference voltage is included to allow single supply operation.
REV. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
The sampling rate of the AFE is programmable with four sepa­rate settings offering 64, 32, 16, and 8 kHz sampling rates (from a master clock of 16.384 MHz) while the serial port (SPORT2) allows easy expansion of the number of I/O channels by cascad­ing extra AFEs external to the AD73411.
The AD73411’s DSP engine combines the ADSP-2100 family base architecture (three computational units, data address gen­erators, and a program sequencer) with two serial ports, a 16-bit internal DMA port, a byte DMA port, a programmable timer, Flag I/O, extensive interrupt capabilities, and on-chip program and data memory.
The AD73411-80 integrates 80K bytes of on-chip memory configured as 16K words (24-bit) of program RAM, and 16K words (16-bit) of data RAM. The AD73411-40 integrates 40K bytes of on-chip memory configured as 8K words (24­bit) of program RAM, and 8K words (16-bit) of data RAM. Power-down circuitry is also provided to meet the low power needs of battery-operated portable equipment. The AD73411 is available in a 119-ball PBGA package.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 2000
AD73411–SPECIFICATIONS
(AVDD = DVDD = 3.0 V to 3.6 V; DGND = AGND = 0 V, f
1
f
= 64 kHz; TA = T
SAMP
MIN
to T
, unless otherwise noted.)
MAX
= 16.384 MHz,
MCLK
Parameter Min Typ Max Unit Test Conditions/Comments
AFE SECTION
REFERENCE
REFCAP
Absolute Voltage, V
REFCAP
1.08 1.2 1.32 V
REFCAP TC 50 ppm/°C 0.1 µF Capacitor Required from
REFOUT REFCAP to AGND2
Typical Output Impedance 145
Absolute Voltage, V
REFOUT
ADC SPECIFICATIONS
Maximum Input Range at VIN
2, 3
1.08 1.2 1.32 V Unloaded
1.578 V p-p Measured Differentially –2.85 dBm Max Input = (1.578/1.2) × V
REFCAP
Nominal Reference Level at VIN 1.0954 V p-p Measured Differentially
(0 dBm0) –6.02 dBm
Absolute Gain
PGA = 0 dB –2.2 –0.6 +1.0 dB 1.0 kHz, 0 dBm0
PGA = 38 dB –1.0 dB 1.0 kHz, 0 dBm0 Gain Tracking Error ± 0.1 dB 1.0 kHz, +3 dBm0 to –50 dBm0 Signal to (Noise + Distortion) Refer to Figure ?
PGA = 0 dB 71 76 dB 300 Hz to 3400 Hz;
70 74 dB 0 Hz to f
72 dB 300 Hz to 3400 Hz; f 56 dB 0 Hz to f
SAMP
SAMP
/2
/2; f
SAMP
SAMP
= 64 kHz
= 64 kHz
PGA = 38 dB 60 dB 300 Hz to 3400 Hz;
59 dB 0 Hz to f
SAMP
/2
Total Harmonic Distortion
PGA = 0 dB –85 –75 dB 300 Hz to 3400 Hz
PGA = 38 dB –85 dB 300 Hz to 3400 Hz Intermodulation Distortion –82 dB PGA = 0 dB Idle Channel Noise –76 dBm0 PGA = 0 dB Crosstalk –100 dB ADC Input Signal Level: 1.0 kHz, 0 dBm0
DAC Input at Idle DC Offset –20 +2 +25 mV PGA = 0 dB Power Supply Rejection –84 dB Input Signal Level at AVDD and DVDD
Group Delay Input Resistance at PGA
4, 5
2, 4, 6
DAC SPECIFICATIONS
Maximum Voltage Output Swing
25 µsf 45 k DMCLK = 16.384 MHz
2
Pins 1.0 kHz, 100 mV p-p Sine Wave
= 64 kHz
SAMP
Single-Ended 1.578 V p-p PGA = 6 dB
–2.85 dBm Max Output = (1.578/1.2) × V
REFCAP
Differential 3.156 V p-p PGA = 6 dB
3.17 dBm Max Output = 2 × ((1.578/1.2) × V
REFCAP
Nominal Voltage Output Swing (0 dBm0)
Single-Ended 1.0954 V p-p PGA = 6 dB
–6.02 dBm
Differential 2.1909 V p-p PGA = 6 dB
0 dBm
Output Bias Voltage
4
1.08 1.2 1.32 V REFOUT Unloaded Absolute Gain –1.8 –0.7 +0.4 dB 1.0 kHz, 0 dBm0; Unloaded Gain Tracking Error ± 0.1 dB 1.0 kHz, +3 dBm0 to –50 dBm0 Signal to (Noise + Distortion)
PGA = 0 dB 70 77 dB 300 Hz to 3400 Hz
76 dB 300 Hz to 3400 Hz; f
SAMP
= 64 kHz
PGA = 6 dB 77 dB 300 Hz to 3400 Hz
77 dB 300 Hz to 3400 Hz; f
SAMP
= 64 kHz
Total Harmonic Distortion at 0 dBm0
PGA = 0 dB –80 –70 dB
PGA = 6 dB –80 dB Intermodulation Distortion –76 dB PGA = 0 dB Idle Channel Noise –82 dBm0 PGA = 0 dB Crosstalk –100 dB ADC Input Signal Level: AGND; DAC
Output Signal Level: 1.0 kHz, 0 dBm0
–2–
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AD73411
Parameter Min Typ Max Unit Test Conditions/Comments
DAC SPECIFICATIONS (Continued)
Power Supply Rejection –81 dB Input Signal Level at AVDD and DVDD
Group Delay
Output DC Offset
4, 5
2, 7
25 µsf 50 µsf
–30 +5 +50 mV PGA = 6 dB
LOGIC INPUTS
, Input High Voltage DVDD – 0.8 DVDD V
V
INH
, Input Low Voltage 0 0.8 V
V
INL
IIH, Input Current –10 +10 µA
LOGIC OUTPUT
VOH, Output High Voltage DVDD – 0.4 DVDD V |IOUT| 100 µA
, Output Low Voltage 0 0.4 V |IOUT| 100 µA
V
OL
Three-State Leakage Current –10 +10 µA
POWER SUPPLIES
AVDD 3.0 3.6 V DVDD 3.0 3.6 V
9
I
DD
NOTES
1
Operating temperature range is as follows: –20°C to +85°C. Therefore, T
2
Test conditions: Input PGA set for 0 dB gain, Output PGA set for 6 dB gain, no load on analog outputs (unless otherwise noted).
3
At input to sigma-delta modulator of ADC.
4
Guaranteed by design.
5
Overall group delay will be affected by the sample rate and the external digital filtering.
6
The ADC’s input impedance is inversely proportional to DMCLK and is approximated by: (3.3 × 1011)/DMCLK.
7
Between VOUTP and VOUTN.
8
At VOUT output.
9
Test Conditions: no load on digital inputs, analog inputs ac-coupled to ground, no load on analog outputs.
Specifications subject to change without notice.
= –20°C and T
MIN
= +85°C.
MAX
Pins: 1.0 kHz, 100 mV p-p Sine Wave
= 64 kHz; Interpolator Bypassed
SAMP
= 64 kHz
SAMP
See Table I
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–3–
AD73411–SPECIFICATIONS
(AVDD = DVDD = VDD = 3.0 V to 3.6 V; DGND = AGND = 0 V, f f
= 64 kHz; TA = T
SAMP
MIN
to T
, unless otherwise noted.)
MAX
= 16.384 MHz,
MCLK
Parameter Test Conditions Min Typ Max Unit
DSP SECTION V
IH
V
IH
V
IL
V
OH
V
OL
I
IH
I
IL
I
OZH
I
OZL
I
DD
I
DD
C
I
C
O
NOTES
1
Bidirectional pins: D0–D23, RFS0, RFS1, SCLK0, SCLK1, TFS0, TFS1, A1–A13, PF0–PF7.
2
Input only pins: RESET, BR, DR0, DR1, PWD.
3
Input only pins: CLKIN, RESET, BR, DR0, DR1, PWD.
4
Output pins: BG, PMS, DMS, BMS, IOMS, CMS, RD, WR, PWDACK, A0, DT0, DT1, CLKOUT, FL2–0, BGH.
5
Although specified for TTL outputs, all AD73411 outputs are CMOS-compatible and will drive to VDD and GND, assuming no dc loads.
6
Guaranteed but not tested.
7
Three-statable pins: A0–A13, D0–D23, PMS, DMS, BMS, IOMS, CMS, RD, WR, DT0, DT1, SCLK0, SCLK1, TFS0, TFS1, RFS0, RFS1, PF0–PF7.
8
0 V on BR.
9
Idle refers to AD73411 state of operation during execution of IDLE instruction. Deasserted pins are driven to either VDD or GND.
10
VIN = 0 V and 3 V. For typical figures for supply currents, refer to Power Dissipation section.
11
IDD measurement taken with all instructions executing from internal memory. 50% of the instructions are multifunction (Types 1, 4, 5, 12, 13, 14), 30% are Type 2 and Type 6, and 20% are idle instructions.
12
Applies to PBGA package type.
13
Output pin capacitance is the capacitive load for any three-stated output pin.
Specifications subject to change without notice.
Hi-Level Input Voltage Hi-Level CLKIN Voltage @ VDD = max 2.2 V Lo-Level Input Voltage Hi-Level Output Voltage
Lo-Level Output Voltage
Hi-Level Input Current
Lo-Level Input Current
Three-State Leakage Current
Three-State Leakage Current
Supply Current (Idle)
Supply Current (Dynamic)
Input Pin Capacitance
Output Pin Capacitance
1, 2
1, 3
1, 4, 5
1, 4, 5
3
3
9
3, 6, 12
6, 7, 12, 13
@ VDD = max 2.0 V
@ VDD = min 0.8 V @ VDD = min I
= –0.5 mA 2.4 V
OH
@ VDD = min
= –100 µA
I
OH
6
VDD – 0.3 V @ VDD = min I
= 2 mA 0.4 V
OL
@ VDD = max V
= VDD max 10 µA
IN
@ VDD = max
= 0 V 10 µA
V
7
7
11
IN
@ VDD = max V
= VDD max
IN
@ VDD = max V
IN
@ VDD = 3.3 t
CK
t
CK
t
CK
8
= 0 V
= 19 ns = 25 ns = 30 ns
10
10
10
@ VDD = 3.3 T
= 25°C
AMB
t
= 19 ns
CK
= 25 ns
t
CK
t
= 30 ns
CK
10
10
10
8
10 µA
10 µA
12 mA 11 mA 10 mA
45 mA 43 mA 36 mA
@ VIN = 2.5 V
= 1.0 MHz
f
IN
T
= 25°C8pF
AMB
@ VIN = 2.5 V
= 1.0 MHz
f
IN
T
= 25°C8pF
AMB
–4–
REV. 0
AD73411
POWER CONSUMPTION
Parameter Typ Max SE MCLK On Test Conditions
AFE SECTION
ADC Only On 7 8 1 Yes REFOUT Disabled ADC and DAC On 11 12.5 1 Yes REFOUT Disabled REFCAP Only On 0.65 1.00 0 No REFOUT Disabled REFCAP and 2.7 3.8 0 No
REFOUT Only On All AFE Sections Off 0.6 0.75 0 Yes MCLK Active Levels Equal to 0 V and DVDD All AFE Sections Off 5 µA 30 µA 0 No Digital Inputs Static and Equal to 0 V or DVDD
DSP SECTION
Idle Mode 6.4 Dynamic 43
NOTES The above values are in mA and are typical values unless otherwise noted. Specifications subject to change without notice.
TIMING CHARACTERISTICS–AFE SECTION
Parameter Limit Unit Description
Clock Signals See Figure 1
t
1
t
2
t
3
Serial Port See Figures ? and ?
t
4
t
5
t
6
t
7
t
8
t
9
t
10
t
11
t
12
t
13
Specifications subject to change without notice.
61 ns min 16.384 MHz AMCLK Period
24.4 ns min MCLK Width High
24.4 ns min MCLK Width Low
t
1
0.4 × t
0.4 × t
1
1
ns min SCLK Period (SCLK = AMCLK) ns min SCLK Width High
ns min SCLK Width Low 20 ns min SDI/SDIFS Setup Before SCLK Low 0 ns min SDI/SDIFS Hold After SCLK Low 10 ns max SDOFS Delay from SCLK High 10 ns min SDOFS Hold After SCLK High 10 ns min SDO Hold After SCLK High 10 ns max SDO Delay from SCLK High 30 ns max SCLK Delay from MCLK
REV. 0
–5–
AD73411
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS*
(TA = +25°C unless otherwise noted)
AVDD, DVDD to GND . . . . . . . . . . . . . . . . –0.3 V to +4.6 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
Digital I/O Voltage to DGND . . . . . –0.3 V to DVDD + 0.3 V
Analog I/O Voltage to AGND . . . . . –0.3 V to AVDD + 0.3 V
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –20°C to +85°C
Reflow Soldering
Maximum Temperature . . . . . . . . . . . . . . . . . . . . . . . 225°C
Time at Maximum Temperature . . . . . . . . . . . . . . . . .15 sec
Maximum Temperature Ramp Rate . . . . . . . . . . . . 1.3°C/sec
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Storage Temperature Range . . . . . . . . . . . . –40°C to +125°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . . 150°C
PBGA, θ
Thermal Impedance . . . . . . . . . . . . . . . . . 25°C/W
JA
ORDERING GUIDE
Temperature Package Package
Model Range Description Option
AD73411BB-80 –20°C to +85°C 119-Ball Plastic Ball Grid Array B-119 AD73411BB-40 –20°C to +85°C 119-Ball Plastic Ball Grid Array B-119
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD73411 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
PBGA BALL CONFIGURATION
1
A
IRQE/ PF4
B
IRQL0/ PF5 PMS WR
IRQL1/ PF6 IOMS RD
C
IRQ2/ PF7 CMS BMS
D
DT0 TFS0 RFS0 A3/ IAD2 A2/ IAD1 A1/IAD0 A0
E
DR0 SCLK0 DT1/F0 PWDACK
F
TFS1/IRQ1 RFS1/IRQ0
G
SCLK1
H
EMS
J
K
ELOUT ELIN
BG D3 /IACK
L
EBG
M
N
BR
EBR
P
SDO SDOFS SDIFS SDI SE REFCAP REFOUT
R
T
VINP NC
AGND
U
NOTES: VDD (INT) – DSP CORE SUPPLY VDD (EXT) – DSP I/O DRIVER SUPPLY BOTH VDD (INT) AND VDD (EXT) SHOULD BE POWERED FROM THE SAME SUPPLY.
23
DMS
ERESET RESET
EE ECLK D23 D22 D21 D20
D2/ IAD15
D1/IAD14 VDD (INT)
D0/ IAD13 DVDD DGND
AVDD NC NC VOUTP VOUTN NC
VDD (INT) CLKIN A11/IAD10 A7/ IAD6 A4/ IAD3
DR1/FI GND
EINT
D5/ IAL D8 D9 D12 D15
D4/ IS D7/ IWR
VINN NC NC NC NC
4
XTAL A12/ IAD11 A8/IAD7 A5 /IAD4
VDD (EXT) A13/ IAD12 A9/ IAD8 GND
CLKOUT GND A10 /IAD9 A6/ IAD5
PF3 FL0 FL1 FL2
D19 D18 D17 D16
D6/ IRD
TOP VIEW
57
BGH
PWD
VDD (EXT) D11 D14
GND D10 D13
ARESET
6
MODE A /PF0 MODE B /PF1
VDD (EXT) MODE C /PF2
SCLK2 AMCLK
–6–
REV. 0
AD73411
PBGA BALL FUNCTION DESCRIPTIONS
BGA
Mnemonic Location Function
VINP T1 This pin allows direct access to the positive input of the sigma-delta modulator. VINN T3 This pin allows direct access to the negative input of the sigma-delta modulator. REFOUT R7 Buffered Reference Output, which has a nominal value of 1.2 V. REFCAP R6 A Bypass Capacitor to AGND of 0.1 µF is required for the on-chip reference. The capacitor should be
fixed to this pin. DGND P4 AFE Digital Ground/Substrate Connection. DVDD P3 AFE Digital Power Supply Connection. ARESET P5 Active Low Reset Signal. This input resets the entire analog front end, resetting the control registers and
clearing the digital circuitry. SCLK2 P6 Output Serial Clock whose rate determines the serial transfer rate to/from the codec. It is used to clock data
or control information to and from the serial port (SPORT2). The frequency of SCLK is equal to the
frequency of the master clock (AMCLK) divided by an integer number—this integer number being the product
of the external master clock rate divider and the serial clock rate divider. AMCLK P7 AFE Master Clock Input. AMCLK is driven from an external clock signal. If it is required to run the DSP
and AFE sections from a common clock crystal, AMCLK should be connected to the XTAL pin of the
DSP section. SDO R1 Serial Data Output of the Codec. Both data and control information may be output on this pin and is clocked on
the positive edge of SCLK. SDO is in three-state when no information is being transmitted and when SE is low. SDOFS R2 Framing Signal Output for SDO Serial Transfers. The frame sync is one bit wide and is active one SCLK
period before the first bit (MSB) of each output word. SDOFS is referenced to the positive edge of SCLK.
SDOFS is in three-state when SE is low. SDIFS R3 Framing Signal Input for SDI Serial Transfers. The frame sync is one bit wide and is valid one SCLK
period before the first bit (MSB) of each input word. SDIFS is sampled on the negative edge of SCLK and
is ignored when SE is low. SDI R4 Serial Data Input of the Codec. Both data and control information may be input on this pin and are clocked
on the negative edge of SCLK. SDI is ignored when SE is low. SE R5 SPORT2 Enable. Asynchronous input enable pin for SPORT2. When SE is set low by the DSP, the output
pins of SPORT2 are three-stated and the input pins are ignored. SCLK2 is also disabled internally in order
to decrease power dissipation. When SE is brought high, the control and data registers of SPORT2 are at
their original values (before SE was brought low), however the timing counters and other internal regis-
ters are at their reset values. AGND U1 AFE Analog Ground/Substrate Connection. AVDD U2 AFE Analog Power Supply Connection. VOUTP U5 Analog Output from the Positive Terminal of the Output. VOUTN U6 Analog Output from the Negative Terminal of the Output.
RESET H3 (Input) Processor Reset Input. BR N1 (Input) Bus Request Input. BG L1 (Output) Bus Grant Output. BGH F5 (Output) Bus Grant Hung Output. DMS A2 (Output) Data Memory Select Output. PMS B2 (Output) Program Memory Select Output. IOMS C2 (Output) Memory Select Output. BMS D3 (Output) Byte Memory Select Output. CMS D2 (Output) Combined Memory Select Output. RD C3 (Output) Memory Read Enable Output. WR B3 (Output) Memory Write Enable Output. IRQ2/ (Input) Edge- or Level-Sensitive Interrupt Request
PF7 D1 (Input/Output)
IRQL1/ (Input) Level-Sensitive Interrupt Requests
PF6 C1 (Input/Output) Programmable I/O Pin.
Programmable I/O Pin.
1
1
.
.
REV. 0
–7–
AD73411
PBGA BALL FUNCTION DESCRIPTIONS (Continued)
Mnemonic Location Function
BGA
1
IRQL0/ (Input) Level-Sensitive Interrupt Requests PF5 B1 (Input/Output) Programmable I/O Pin. IRQE/ (Input) Edge-Sensitive Interrupt Requests
.
1
.
PF4 A1 (Input/Output) Programmable I/O Pin. PF3 H4 (Input/Output) Programmable I/O Pin During Normal Operation.
Mode C/ (Input) Mode Select Input—Checked Only During RESET. PF2 G7 (Input/Output) Programmable I/O Pin During Normal Operation. Mode B/ (Input) Mode Select Input—Checked Only During RESET . PF1 F7 (Input/Output) Programmable I/O Pin During Normal Operation. Mode A/ (Input) Mode Select Input—Checked Only During RESET. PF0 F6 (Input/Output) Programmable I/O Pin During Normal Operation. CLKIN A4 (Inputs) Clock or Quartz Crystal Input. The CLKIN input cannot be halted or changed during operation XTAL B4 nor operated below 10 MHz during normal operation. CLKOUT D4 (Output) Processor Clock Output. SPORT0
TFS0 E2 (Input/Output) SPORT0 Transmit Frame Sync. RFS0 E3 (Input/Output) SPORT0 Receive Frame Sync. DT0 E1 (Output) SPORT0 Transmit Data. DR0 F1 (Input) SPORT0 Receive Data. SCLK0 F2 (Input/Output) SPORT0 Serial Clock.
SPORT1
TFS1/ (Input/Output) SPORT1 Transmit Frame Sync. IRQ1 G1 (Input) Edge or Level Sensitive Interrupt. RFS1 (Input/Output) SPORT1 Receive Frame Sync. IRQ0 G2 (Input) Edge or Level Sensitive Interrupt. DT1/ (Output) SPORT1 Transmit Data. FO F3 (Output) Flag Out DR1/ (Input) SPORT1 Receive Data. FI G3 (Input) Flag In
2
.
2
.
SCLK1 H1 (Input/Output) SPORT1 Serial Clock. FL0 H5 (Output) Flag 0. FL1 H6 (Output) Flag 1. FL2 H7 (Output) Flag 2. VDD(INT) A3 (Input) DSP Core Supply.
N3
VDD(EXT) C4 (Input) DSP I/O Interface Supply.
G6 M5
GND C7 DSP Ground.
D5 G4 N5
EZ-ICE Port
ERESET H2
EMS J1
EE J2
ECLK J3
ELOUT K1
ELIN K2
EINT K3
EBR P1
EBG M1
A
ddress Bus A0–E7; A1/IAD0–E6; A2/IAD1–E5; A3/IAD2–E4; A4/IAD3–A7; A5/IAD4–B7; A6/IAD5–D7; A7/IAD6–A6;
A8/IAD7–B6; A9/IAD8–C6; A10/IAD9–D6; A11/IAD10–A5; A12/IAD11–B5; A13/IAD12–C5
Data Bus D0/IAD13–P2; D1/IAD14–N2; D2/IAD15–M2; D3/IACK–L2; D4/IS–M3; D5/IAL–L3; D6/IRD–N4; D7/IWR–M4;
D8–L4; D9–L5; D10–N6; D11–M6; D12–L6; D13–N7; D14–M7; D15–L7; D16–K7; D17–K6; D18–K5; D19–K4; D20–J7; D21–J6; D22–J5; D23–J4
NOTES
1
Interrupt/Flag pins retain both functions concurrently. If IMASK is set to enable the corresponding interrupts, then the DSP will vector to the appropriate interrupt
vector address when the pin is asserted, either by external devices, or set as a programmable flag.
2
SPORT configuration determined by the DSP System Control Register. Software configurable.
–8–
REV. 0
AD73411
ARCHITECTURE OVERVIEW
The AD73411 instruction set provides flexible data moves and multifunction (one or two data moves with a computation) instructions. Every instruction can be executed in a single pro­cessor cycle. The AD73411 assembly language uses an algebraic syntax for ease of coding and readability. A comprehensive set of development tools supports program development.
DATA
ADDRESS
GENERATORS
DAG 2
DAG 1
ARITHMETIC UNITS
ADSP-2100 BASE
ARCHITECTURE
PROGRAM
SEQUENCER
PROGRAM MEMORY ADDRESS
DATA MEMORY ADDRESS
PROGRAM MEMORY DATA
DATA MEMORY DATA
SHIFTERMACALU
REF
POWER-DOWN
CONTROL
MEMORY
16K DM
16K PM
(OPTIONAL
(OPTIONAL
SPORT 0
ANALOG FRONT END
8K)
SERIAL PORTS
SPORT 1
SERIAL PORT
SPORT 2
ADC DAC
SECTION
8K)
PROGRAMMABLE
I/O
AND
FLAGS
TIMER
FULL MEMORY
MODE
EXTERNAL
ADDRESS
BUS
EXTERNAL
DATA
BUS
BYTE DMA
CONTROLLER
OR
EXTERNAL
DATA
BUS
INTERNAL
DMA
PORT
HOST MODE
Figure 1. Functional Block Diagram
Figure 1 is an overall block diagram of the AD73411. The pro­cessor section contains three independent computational units: the ALU, the multiplier/accumulator (MAC) and the shifter. The computational units directly process 16-bit data and have provi­sions to support multiprecision computations. The ALU performs a standard set of arithmetic and logic operations; division primi­tives are also supported. The MAC performs single-cycle multiply, multiply/add and multiply/subtract operations with 40 bits of accumulation. The shifter performs logical and arithmetic shifts, normalization, denormalization, and derive exponent operations.
The internal result (R) bus connects the computational units so that the output of any unit may be the input of any unit on the next cycle.
A powerful program sequencer and two dedicated data address generators ensure efficient delivery of operands to these com­putational units. The sequencer supports conditional jumps, subroutine calls and returns in a single cycle. With internal loop counters and loop stacks, the AD73411 executes looped code with zero overhead; no explicit jump instructions are required to maintain loops.
Two data address generators (DAGs) provide addresses for simultaneous dual operand fetches (from data memory and program memory). Each DAG maintains and updates four address pointers. Whenever the pointer is used to access data (indirect addressing), it is post-modified by the value of one of four possible modify registers. A length value may be associated with each pointer to implement automatic modulo addressing for circular buffers.
The two address buses (PMA and DMA) share a single external address bus, allowing memory to be expanded off-chip, and the two data buses (PMD and DMD) share a single external data bus. Byte memory space and I/O memory space also share the external buses.
An interface to low-cost byte-wide memory is provided by the Byte DMA port (BDMA port). The BDMA port is bidirectional and can directly address up to four megabytes of external RAM or ROM for off-chip storage of program overlays or data tables.
The AD73411 can respond to eleven interrupts. There can be up to six external interrupts (one edge-sensitive, two level-sensitive, and three configurable), and seven internal interrupts generated by the timer, the serial ports (SPORTs), the Byte DMA port and the power-down circuitry. There is also a master RESET signal. The two serial ports provide a complete synchronous serial interface with optional companding in hardware and a wide variety of framed or frameless data transmit and receive modes of operation.
Each port can generate an internal programmable serial clock or accept an external serial clock.
The AD73411 provides up to 13 general-purpose flag pins. The data input and output pins on SPORT1 can be alternatively configured as an input flag and an output flag. In addition, eight flags are programmable as inputs or outputs and three flags are always outputs.
A programmable interval timer generates periodic interrupts. A 16-bit count register (TCOUNT) is decremented every n pro­cessor cycle, where n is a scaling value stored in an 8-bit register (TSCALE). When the value of the count register reaches zero, an interrupt is generated and the count register is reloaded from a 16-bit period register (TPERIOD).
Analog Front End
The AFE section is configured as a separate block that is normally connected to either SPORT0 or SPORT1 of the DSP section. As it is not hardwired to either SPORT, users have total flexibil­ity in how they wish to allocate system resources to support the AFE. It is also possible to further expand the number of analog I/O channels connected to the SPORT by cascading other single or dual channel AFEs (AD73311 or AD73322) external to the AD73411.
REV. 0
–9–
AD73411
DVDDAVDD2AVDD1
VINP
VINN
VOUTP
VOUTN
REFCAP
REFOUT
ANALOG
LOOPBACK/
SINGLE-ENDED
ENABLE
+6/–15dB
PGA
0/38dB
PGA
CONTINUOUS
TIME
LOW-PASS FILTER
REFERENCE
AGND1
AGND2
ANALOG
SIGMA-DELTA
MODULATOR
SWITCHED­CAPACITOR
LOW-PASS FILTER
Figure 2. Functional Block Diagram of Analog Front End Section
The AFE is configured as a single I/O channel (similar to that of the discrete AD73311L; refer to the AD73311L data sheet for more details) having a 16-bit sigma-delta-based ADC and DAC. Both ADC and DAC share a common reference whose nominal value is 1.2 V. Figure 2 shows a block diagram of the AFE sec­tion of the AD73411. It shows an ADC and DAC as well as a common reference. Communication to both channels is handled by the SPORT2 block which interfaces to either SPORT0 or SPORT1 of the DSP section.
The I/O channel features fully differential inputs and outputs. The input section allows direct connection to the internal Pro­grammable Gain Amplifier at the input of the sigma-delta ADC section. The input section also features programmable differ­ential channel inversion and configuration of the differential input as two separate single-ended inputs. The ADC features a second order sigma-delta modulator which samples at MCLK/8. Its bitstream output is filtered and decimated by a Sinc-cubed decimator to provide a sample rate selectable from 64 kHz, 32 kHz, 16 kHz or 8 kHz (based on an MCLK of 16.384 MHz).
The DAC channel features a Sinc-cubed interpolator which increases the sample rate from the selected rate to the digital sigma-delta modulator rate of MCLK/8. The digital sigma-delta modulator’s output bitstream is fed to a single-bit DAC whose output is reconstructed/filtered by two stages of low-pass filtering (switched capacitor and continuous time) before being applied to the differential output driver.
FUNCTIONAL DESCRIPTION Encoder Channel
The encoder channel consists of an input configuration block, a switched capacitor PGA and a sigma-delta analog-to-digital converter (ADC). An on-board digital filter, which forms part of the sigma-delta ADC, also performs critical system-level filtering. Due to the high level of oversampling, the input anti­alias requirements are reduced such that a simple single pole RC stage is sufficient to give adequate attenuation in the band of interest.
Input Configuration Block
The input configuration block consists of a multiplexing arrange­ment that allows selection of various input configurations. This includes ADC input selection from either the VINP, VINN pins
SDI
1-BIT
DAC
AD73411
DIGITAL
SIGMA-DELTA
MODULATOR
DECIMATOR
INTERPOLATOR
DGND
SERIAL
I/O
PORT
SDIFS
SCLK
SDO
SDOFS
SE
MCLK
RESET
or from the DAC output via the Analog Loop-Back (ALB) arrangement. Differential inputs can be inverted and it is also possible to use the device in single-ended mode, which allows the option of using the VINP, VINN pins as two separate single-ended inputs, either of which can be selected under soft­ware control.
Programmable Gain Amplifier
The encoder section’s analog front end comprises a switched capacitor PGA that also forms part of the sigma-delta modulator. The SC sampling frequency is DMCLK/8. The PGA, whose programmable gain settings are shown in Table I, may be used to increase the signal level applied to the ADC from low output sources such as microphones, and can be used to avoid placing external amplifiers in the circuit. The input signal level to the sigma-delta modulator should not exceed the maximum input voltage permitted.
The PGA gain is set by bits IGS0, IGS1 and IGS2 (CRD:0–2) in Control Register D.
Table I. PGA Settings for the Encoder Channel
IGS2 IGS1 IGS0 Gain (dB)
00 0 0 00 1 6 01 0 12 01 1 18 10 0 20 10 1 26 11 0 32 11 1 38
ADC
The ADC consists of an analog sigma-delta modulator and a digital antialiasing decimation filter. The sigma-delta modu­lator noise-shapes the signal and produces 1-bit samples at a DMCLK/8 rate. This bitstream, representing the analog input signal, is input to the antialiasing decimation filter. The decima­tion filter reduces the sample rate and increases the resolution.
–10–
REV. 0
AD73411
Analog Sigma-Delta Modulator
The AD73411 input channel employs a sigma-delta conver­sion technique, which provides a high resolution 16-bit output with system filtering being implemented on-chip.
Sigma-delta converters employ a technique known as over­sampling, where the sampling rate is many times the highest frequency of interest. In the case of the AD73411, the initial sampling rate of the sigma-delta modulator is DMCLK/8. The main effect of oversampling is that the quantization noise is spread over a very wide bandwidth, up to f
/2 = DMCLK/16
S
(Figure 3a). This means that the noise in the band of interest is much reduced. Another complementary feature of sigma-delta converters is the use of a technique called noise-shaping. This technique has the effect of pushing the noise from the band of interest to an out-of-band position (Figure 3b). The combina­tion of these techniques, followed by the application of a digital filter, sufficiently reduces the noise in band to ensure good dynamic performance from the part (Figure 3c).
BAND
OF
INTEREST
fS/2
DMCLK/16
multiple of DMCLK/256, which is the decimation filter update rate. The final detail in Figure 4d shows the application of a final antialias filter in the DSP engine. This has the advantage of being implemented according to the user’s requirements and available MIPS. The filtering in Figures 4a through 4c is imple­mented in the AD73411.
FB = 4kHz F
SINIT
= DMCLK/8
a. Analog Antialias Filter Transfer Function
SIGNAL TRANSFER FUNCTION
NOISE TRANSFER FUNCTION
FB = 4kHz
F
SINIT
= DMCLK/8
b. Analog Sigma-Delta Modulator Transfer Function
a
.
NOISE-SHAPING
BAND
OF
INTEREST
f
/2
S
DMCLK/16
b.
DIGITAL FILTER
BAND
OF
INTEREST
f
/2
S
DMCLK/16
c.
Figure 3. Sigma-Delta Noise Reduction
Figure 4 shows the various stages of filtering that are employed in a typical AD73411 application. In Figure 4a we see the transfer function of the external analog antialias filter. Even though it is a single RC pole, its cutoff frequency is sufficiently far away from the initial sampling frequency (DMCLK/8) that it takes care of any signals that could be aliased by the sampling frequency. This also shows the major difference between the initial oversampling rate and the bandwidth of interest. In Figure 4b, the signal and noise-shaping responses of the sigma-delta modulator are shown. The signal response provides further rejection of any high frequency signals while the noise-shaping will push the inherent quantization noise to an out-of-band position. The detail of Figure 4c shows the response of the digital decimation filter (Sinc-cubed response) with nulls every
REV. 0
–11–
FB = 4kHz F
SINTER
= DMCLK/256
c. Digital Decimator Transfer Function
FB = 4kHz
F
SFINAL
= 8kHz
F
SINTER
= DMCLK/256
d. Final Filter LPF (HPF) Transfer Function
Figure 4. AD73411 ADC Frequency Responses
Decimation Filter
The digital filter used in the AD73411 carries out two impor­tant functions. Firstly, it removes the out-of-band quantization noise, which is shaped by the analog modulator and secondly, it decimates the high-frequency bitstream to a lower rate 15-bit word.
The antialiasing decimation filter is a sinc-cubed digital filter that reduces the sampling rate from DMCLK/8 at the modulator to an output rate at the SPORT of DMCLK/M (where M depends on the sample rate setting—M = 256 @ 64 kHz; M = 512 @ 32 kHz, M = 1024 @ 16 kHz, M = 2048 @ 8 kHz), and increases the resolution from a single bit to 15 bits. Its Z transform is given as: [(1–Z–N)/(1–Z–1)]3 where N is determined by the sampling rate (N = 32 @ 64 kHz, N = 64 @ 32 kHz, N = 128 @ 16 kHz, N = 256 @ 8 kHz). This ensures a minimal group delay of 25 µs at the 64 kHz sampling rate.
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