Quad-Channel, 12-Bit, Serial Input, 4 mA to 20 mA Output
A
V
DAC with Dynamic Power Control and HART Connectivity
Data Sheet
FEATURES
12-bit resolution and monotonicity
Dynamic power control for thermal management
or external PMOS mode
Current output ranges: 0 mA to 20 mA, 4 mA to 20 mA,
and 0 mA to 24 mA
±0.1% total unadjusted error (TUE) maximum
User-programmable offset and gain
On-chip diagnostics
On-chip reference: ±10 ppm/°C maximum
−40°C to +105°C temperature range
APPLICATIONS
Process control
Actuator control
PLCs
HART network connectivity
GENERAL DESCRIPTION
The AD5737 is a quad-channel current output DAC that
operates with a power supply range from 10.8 V to 33 V.
On-chip dynamic power control minimizes package power
dissipation by regulating the voltage on the output driver from
FUNCTIONAL BLOCK DIAGRAM
AV
+15V
DD
AGND
AD5737
7.4 V to 29.5 V using a dc-to-dc boost converter optimized for
minimum on-chip power dissipation.
Each channel has a corresponding CHART pin so that HART
signals can be coupled onto the current output of the AD5737.
The AD5737 uses a versatile 3-wire serial interface that operates
at clock rates of up to 30 MHz and is compatible with standard
SPI, QSPI™, MICROWIRE®, DSP, and microcontroller interface
standards. The serial interface also features optional CRC-8 packet
error checking, as well as a watchdog timer that monitors activity
on the interface.
PRODUCT HIGHLIGHTS
1. Dynamic power control for thermal management.
2. 12-bit performance.
3. Quad channel.
4. HART compliant.
COMPANION PRODUCTS
Product Family: AD5755, AD5755-1, AD5757, AD5735
External References: ADR445, ADR02
Digital Isolators: ADuM1410, ADuM1411
Power: ADP2302, ADP2303Additional companion products on the AD5737 product page
CC
5.0V
SW
V
x
BOOST_x
DV
DD
DGND
LDAC
SCLK
SDIN
SYNC
SDO
CLEAR
FAU LT
ALERT
AD1
AD0
REFOUT
REFIN
NOTES
1. x = A, B, C, OR D.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
Output Current Drift vs. Time Drift after 1000 hours, ¾ scale output, TJ = 150°C
90 ppm FSR External R
140 ppm FSR Internal R
Resistive Load 1000 Ω
DC Output Impedance 100 MΩ
DC PSRR 0.02 1 μA/V
REFERENCE INPUT/OUTPUT
Reference Input
Reference Input Voltage 4.95 5 5.05 V For specified performance
DC Input Impedance 45 150 MΩ
Reference Output
Output Voltage 4.995 5 5.005 V TA = 25°C
Reference TC
= 15 V; DVDD = 2.7 V to 5.5 V; AVCC = 4.5 V to 5.5 V; dc-to-dc converter disabled; AGND = DGND = GNDSWx = 0 V;
BOOST_x
= 300 Ω; all specifications T
L
1
SET
Min Typ Max Unit Test Conditions/Comments
MIN
to T
, unless otherwise noted.
MAX
Assumes ideal resistor (see the External Current
Setting Resistor section for more information)
2
2
±3 ppm FSR/°C
2
±5 ppm FSR/°C
SET
3, 4
3, 4
−0.1 ±0.017 +0.1 % FSR
2
±6 ppm FSR/°C
2
±9 ppm FSR/°C
3, 4
−0.14 ±0.02 +0.14 % FSR
2
4
2
±4 ppm FSR/°C
−0.14 ±0.022 +0.14 % FSR
±14 ppm FSR/°C
−0.011 % FSR Internal R
V
BOOST_x
2.4
−
V
BOOST_x
2.7
V
−
SET
SET
SET
SET
The dc-to-dc converter has been characterized
with a maximum load of 1 kΩ, chosen such that
compliance is not exceeded; see Figure 30 and
the DC-DC MaxV bits in Table 27
2
2
−10 ±5 +10 ppm/°C
Rev. A | Page 4 of 44
Data Sheet AD5737
Parameter
1
Output Noise (0.1 Hz to 10 Hz)
2
Noise Spectral Density
Output Voltage Drift vs. Time
2
Capacitive Load
Min Typ Max Unit Test Conditions/Comments
2
7 μV p-p
100 nV/√Hz At 10 kHz
2
180 ppm Drift after 1000 hours, TJ = 150°C
1000 nF
Load Current 9 mA See Figure 41
Short-Circuit Current 10 mA
Line Regulation
Load Regulation
Thermal Hysteresis
2
3 ppm/V See Figure 42
2
95 ppm/mA See Figure 41
2
160 ppm First temperature cycle
5 ppm Second temperature cycle
DC-TO-DC CONVERTER
Switch
Switch On Resistance 0.425 Ω
Switch Leakage Current 10 nA
Peak Current Limit 0.8 A
Oscillator
Oscillator Frequency 11.5 13 14.5 MHz
This oscillator is divided down to provide the
dc-to-dc converter switching frequency
Maximum Duty Cycle 89.6 % At 410 kHz dc-to-dc switching frequency
DIGITAL INPUTS
2
JEDEC compliant
Input High Voltage, VIH 2 V
Input Low Voltage, VIL 0.8 V
Input Current −1 +1 μA Per pin
Pin Capacitance 2.6 pF Per pin
DIGITAL OUTPUTS
2
SDO, ALERT Pins
Output Low Voltage, VOL 0.4 V Sinking 200 μA
Output High Voltage, VOH DVDD − 0.5 V Sourcing 200 μA
High Impedance Leakage
−1 +1 μA
Current
High Impedance Output
2.5 pF
Capacitance
FAU LT Pin
Output Low Voltage, VOL 0.4 V 10 kΩ pull-up resistor to DVDD
0.6 V At 2.5 mA
Output High Voltage, VOH 3.6 V 10 kΩ pull-up resistor to DVDD
POWER REQUIREMENTS
AVDD 9 33 V
DVDD 2.7 5.5 V
AVCC 4.5 5.5 V
AIDD 7 7.5 mA
DICC 9.2 11 mA
= DVDD, VIL = DGND, internal oscillator
V
IH
running, over supplies
AICC 1 mA Outputs unloaded, over supplies
5
I
BOOST
Power Dissipation 155 mW
1 mA Per channel, 0 mA output
= 15 V, DVDD = 5 V, dc-to-dc converter
AV
DD
enabled, outputs disabled
1
Temperature range: −40°C to +105°C; typical at +25°C.
2
Guaranteed by design and characterization; not production tested.
3
For current outputs with internal R
and loaded with the same code.
4
See the Current Output Mode with Internal R
5
Efficiency plots in Figure 32 through Figure 35 include the I
, the offset, full-scale, and TUE measurements exclude dc crosstalk. The measurements are made with all four channels enabled
SET
section for more information about dc crosstalk.
SET
quiescent current.
BOOST
Rev. A | Page 5 of 44
AD5737 Data Sheet
AC PERFORMANCE CHARACTERISTICS
AVDD = V
REFIN = 5 V; R
= 15 V; DVDD = 2.7 V to 5.5 V; AVCC = 4.5 V to 5.5 V; dc-to-dc converter disabled; AGND = DGND = GNDSWx = 0 V;
BOOST_x
= 300 Ω; all specifications T
L
MIN
to T
, unless otherwise noted.
MAX
Table 2.
Parameter
DYNAMIC PERFORMANCE, CURRENT
1
Min Typ Max Unit Test Conditions/Comments
OUTPUT
Output Current Settling Time 15 μs To 0.1% FSR, 0 mA to 24 mA range
See Test Conditions/Comments ms
For settling times when using the dc-to-dc converter, see Figure 25, Figure 26, and Figure 27
Output Noise (0.1 Hz to 10 Hz
0.15 LSB p-p 12-bit LSB, 0 mA to 24 mA range
Bandwidth)
Output Noise Spectral Density 0.5 nA/√Hz
Measured at 10 kHz, midscale output, 0 mA
to 24 mA range
1
Guaranteed by design and characterization; not production tested.
TIMING CHARACTERISTICS
AVDD = V
REFIN = 5 V; R
Table 3.
Parameter
t1 33 ns min SCLK cycle time
t2 13 ns min SCLK high time
t3 13 ns min SCLK low time
t4 13 ns min
t5 13 ns min
t6 198 ns min
t7 5 ns min Data setup time
t8 5 ns min Data hold time
t9 20 μs min
5 μs min
t10 10 ns min
t11 500 ns max
t12 See Table 2 μs max DAC output settling time
t13 10 ns min CLEAR high time
t14 5 μs max CLEAR activation time
t15 40 ns max SCLK rising edge to SDO valid
t16 21 μs min All DACs updated
5 μs min Single DAC updated
t17 500 ns min
t18 800 ns min
4
t
19
20 μs min All DACs updated
5 μs min Single DAC updated
1
Guaranteed by design and characterization; not production tested.
2
All input signals are specified with t
3
See Figure 3, Figure 4, Figure 5, and Figure 6.
4
This specification applies if
= 15 V; DVDD = 2.7 V to 5.5 V; AVCC = 4.5 V to 5.5 V; dc-to-dc converter disabled; AGND = DGND = GNDSWx = 0 V;
BOOST_x
= 300 Ω; all specifications T
L
1, 2, 3
Limit at T
MIN
, T
Unit Description
MAX
MIN
to T
, unless otherwise noted.
MAX
falling edge to SCLK falling edge setup time
SYNC
24th/32nd SCLK falling edge to SYNC
high time
SYNC
rising edge to LDAC falling edge (all DACs updated or any channel has
SYNC
rising edge (see ) Figure 53
digital slew rate control enabled)
rising edge to LDAC falling edge (single DAC updated)
SYNC
pulse width low
LDAC
falling edge to DAC output response time
LDAC
rising edge to DAC output response time (LDAC = 0)
SYNC
falling edge to SYNC rising edge
LDAC
pulse width
RESET
high to next SYNC low (digital slew rate control enabled)
SYNC
= t
= 5 ns (10% to 90% of DVDD) and timed from a voltage level of 1.2 V.
RISE
FALL
LDAC
is held low during the write cycle; otherwise, see t9.
Rev. A | Page 6 of 44
Data Sheet AD5737
Timing Diagrams
t
1
SCLK
SYNC
SDIN
LDAC
I
OUT_x
LDAC = 0
I
OUT_x
CLEAR
I
OUT_x
1224
t
6
t
4
t
7
MSB
t
13
t
t
3
t
8
14
t
2
t
10
t
5
t
19
LSB
t
t
9
t
17
t
16
10
t
t
11
t
12
12
t
RESET
18
10067-002
Figure 3. Serial Interface Timing Diagram
SCLK
SYNC
SDIN
SDO
11
MSBMSBLSBLSB
INPUT WORD SPECIFIES
REGISTER TO BE RE AD
UNDEFINEDSELECTED REGISTER DATA
2424
t
6
NOP CONDITI ON
MSBLSB
t
15
CLOCKED OUT
Figure 4. Readback Timing Diagram
10067-003
Rev. A | Page 7 of 44
AD5737 Data Sheet
C
SCLK
SYN
SDIN
SDO
LSBMSB
1216
DUT_
R/W
DUT_
AD1
SDO DISABLED
XXXD15D14D1D0
AD0
SDO_
ENAB
STATUSSTATUSSTATUSSTATUS
10067-004
Figure 5. Status Readback During Write, Timing Diagram
200µAI
TO OUTPUT
PIN
C
L
50pF
200µAI
Figure 6. Load Circuit for SDO Timing Diagrams
OL
OH
VOH (MIN) OR
V
(MAX)
OL
10067-005
Rev. A | Page 8 of 44
Data Sheet AD5737
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Transient currents of up to
100 mA do not cause SCR latch-up.
Table 4.
Parameter Rating
AVDD, V
to AGND, DGND −0.3 V to +33 V
BOOST_x
AVCC to AGND −0.3 V to +7 V
DVDD to DGND −0.3 V to +7 V
Digital Inputs to DGND
−0.3 V to DV
+ 0.3 V or +7 V
DD
(whichever is less)
Digital Outputs to DGND
−0.3 V to DV
+ 0.3 V or +7 V
DD
(whichever is less)
REFIN, REFOUT to AGND
−0.3 V to AV
+ 0.3 V or +7 V
DD
(whichever is less)
I
OUT_x
to AGND
AGND to V
BOOST_x
or 33 V if
using the dc-to-dc converter
SWx to AGND −0.3 V to +33 V
AGND, GNDSWx to DGND −0.3 V to +0.3 V
Operating Temperature Range ( TA)
Industrial1 −40°C to +105°C
Storage Temperature Range −65°C to +150°C
Junction Temperature (TJ max) 125°C
Power Dissipation (TJ max − TA)/θJA
Lead Temperature JEDEC industry standard
Soldering J-STD-020
1
Power dissipated on chip must be derated to keep the junction temperature
below 125°C.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Junction-to-air thermal resistance (θJA) is specified for a JEDEC
4-layer test board.
Table 5. Thermal Resistance
Package Type θJA Unit
64-Lead LFCSP (CP-64-3) 20 °C/W
ESD CAUTION
Rev. A | Page 9 of 44
AD5737 Data Sheet
C
2
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
DCDC_D
INDI
PIN 1
ATO R
SET_CRSET_D
REFOUT
REFINNCCHARTD
R
646362616059585756555453525150
BOOST_ D
OUT_D
IGATED
COMP
V
NC
I
AGNDNCCHARTCNCIGATEC
49
R
1
SET_B
2
R
SET_A
AD0
AD1
SYNC
SCLK
SDIN
SDO
DV
DGND
LDAC
CLEAR
ALERT
FAU LT
3
4
5
6
7
8
9
10
11
DD
12
13
14
15
16
171819202122232425262728293031
DGND
RESET
DD
NC
AV
AD5737
TOP VIEW
(Not to Scale)
NC
DCDC_A
IGATEA
BOOST_A
CHARTA
V
COMP
32
NC
NC
OUT_A
AGND
I
DCDC_B
IGATEB
CHARTB
COMP
REFGND
REFGND
NOTES
1. NC = NO CONNEC T. DO NOT CONNECT TO THIS PIN.
. THE EXPOSED PADDLE SHOULD BE CONNECTED TO AGND, OR, ALTERNATIVELY,
IT CAN BE LEFT ELECTRI CALLY UNCONNECTED. IT IS RECOMMENDED THAT
THE PADDLE BE THERMALLY CONNECTED TO A COPPER PLANE F OR ENHANCED
THERMAL PERFO RMANCE.
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
COMP
I
OUT_C
V
BOOST_C
AV
CC
SW
C
GNDSW
GNDSW
SW
D
AGND
SW
A
GNDSW
GNDSW
SW
B
AGND
V
BOOST_B
I
OUT_B
DCDC_C
C
D
A
B
10067-006
Figure 7. Pin Configuration
Table 6. Pin Function Descriptions
Pin No. Mnemonic Description
1 R
2 R
SET_B
SET_A
An external, precision, low drift, 15 kΩ current setting resistor can be connected to this pin to improve the
temperature drift performance. For more information, see the External Current Setting Resistor section.
I
OUT_B
An external, precision, low drift, 15 kΩ current setting resistor can be connected to this pin to improve the
temperature drift performance. For more information, see the External Current Setting Resistor section.
I
OUT_A
3 REFGND Ground Reference Point for Internal Reference.
4 REFGND Ground Reference Point for Internal Reference.
5 AD0 Address Decode for the Device Under Test (DUT) on the Board.
6 AD1 Address Decode for the DUT on the Board.
7
Frame Synchronization Signal for the Serial Interface. Active low input. When SYNC is low, data is clocked
SYNC
into the input shift register on the falling edge of SCLK.
8 SCLK
Serial Clock Input. Data is clocked into the input shift register on the falling edge of SCLK. The serial interface
operates at clock speeds of up to 30 MHz.
9 SDIN Serial Data Input. Data must be valid on the falling edge of SCLK.
10 SDO Serial Data Output. Used to clock data from the serial register in readback mode (see Figure 4 and Figure 5).
11 DVDD Digital Supply Pin. The voltage range is from 2.7 V to 5.5 V.
12 DGND Digital Ground.
13
Load DAC. This active low input is used to update the DAC register and, consequently, the DAC outputs.
LDAC
When LDAC is tied permanently low, the addressed DAC data register is updated on the rising edge of
SYNC. If LDAC is held high during the write cycle, the DAC input register is updated, but the DAC output
(see ). Using this mode, all analog outputs can be
is updated only on the falling edge of LDAC
updated simultaneously. The
LDAC pin must not be left unconnected.
Figure 3
Rev. A | Page 10 of 44
Data Sheet AD5737
Pin No. Mnemonic Description
14 CLEAR
15 ALERT
16
FAU LT
17 DGND Digital Ground.
18
RESET
19 AVDD Positive Analog Supply Pin. The voltage range is from 9 V to 33 V.
20 NC No Connect. Do not connect to this pin.
21 CHARTA HART Input Connection for DAC Channel A. For more information, see the HART Connectivity section.
22 IGATEA
23 COMP
24 V
BOOST_A
DCDC_A
25 NC No Connect. Do not connect to this pin.
26 I
Current Output Pin for DAC Channel A.
OUT_A
27 AGND Ground Reference Point for Analog Circuitry. This pin must be connected to 0 V.
28 NC No Connect. Do not connect to this pin.
29 CHARTB HART Input Connection for DAC Channel B. For more information, see the HART Connectivity section.
30 NC No Connect. Do not connect to this pin.
31 IGATEB
32 COMP
33 I
34 V
DCDC_B
Current Output Pin for DAC Channel B.
OUT_B
BOOST_B
35 AGND Ground Reference Point for Analog Circuitry. This pin must be connected to 0 V.
36 SWB
37 GNDSWB Ground Connection for DC-to-DC Switching Circuit. This pin should always be connected to ground.
38 GNDSWA Ground Connection for DC-to-DC Switching Circuit. This pin should always be connected to ground.
39 SWA
40 AGND Ground Reference Point for Analog Circuitry. This pin must be connected to 0 V.
41 SWD
42 GNDSWD Ground Connection for DC-to-DC Switching Circuit. This pin should always be connected to ground.
43 GNDSWC Ground Connection for DC-to-DC Switching Circuit. This pin should always be connected to ground.
44 SWC
45 AVCC Supply for DC-to-DC Circuitry. The voltage range is from 4.5 V to 5.5 V.
46 V
47 I
48 COMP
BOOST_C
Current Output Pin for DAC Channel C.
OUT_C
DCDC_C
Active High, Edge Sensitive Input. When this pin is asserted, the output current is set to the programmed
clear code bit setting. Only channels enabled to be cleared are cleared. For more information, see the
Asynchronous Clear section. When CLEAR is active, the DAC output register cannot be written to.
Active High Output. This pin is asserted when there is no SPI activity on the interface pins for a preset time.
For more information, see the Alert Output section.
Active Low, Open-Drain Output. This pin is asserted low when any of the following conditions is detected:
open circuit, PEC error, or an overtemperature condition (see the Fault Output section).
Hardware Reset, Active Low Input.
Optional Connection for External Pass Transistor. Leave this pin unconnected when using the dc-to-dc
converter. For more information, see the External PMOS Mode section.
DC-to-DC Compensation Capacitor. Connect a 10 nF capacitor from this pin to ground. Used to regulate the
feedback loop of the Channel A dc-to-dc converter. Alternatively, if using an external compensation resistor,
place a resistor in series with a capacitor to ground from this pin. For more information, see the DC-to-DC
Converter Compensation Capacitors section and the AI
Supply Requirements—Slewing section.
CC
Supply for Channel A Current Output Stage (see Figure 48). To use the dc-to-dc converter, connect this pin
as shown in Figure 55.
Optional Connection for External Pass Transistor. Leave this pin unconnected when using the dc-to-dc
converter. For more information, see the External PMOS Mode section.
DC-to-DC Compensation Capacitor. Connect a 10 nF capacitor from this pin to ground. Used to regulate the
feedback loop of the Channel B dc-to-dc converter. Alternatively, if using an external compensation resistor,
place a resistor in series with a capacitor to ground from this pin. For more information, see the DC-to-DC
Converter Compensation Capacitors section and the AI
Supply Requirements—Slewing section.
CC
Supply for Channel B Current Output Stage (see Figure 48). To use the dc-to-dc converter, connect this pin
as shown in Figure 55.
Switching Output for Channel B DC-to-DC Circuitry. To use the dc-to-dc converter, connect this pin as
shown in Figure 55.
Switching Output for Channel A DC-to-DC Circuitry. To use the dc-to-dc converter, connect this pin as
shown in Figure 55.
Switching Output for Channel D DC-to-DC Circuitry. To use the dc-to-dc converter, connect this pin as
shown in Figure 55.
Switching Output for Channel C DC-to-DC Circuitry. To use the dc-to-dc converter, connect this pin as
shown in Figure 55.
Supply for Channel C Current Output Stage (see Figure 48). To use the dc-to-dc converter, connect this pin
as shown in Figure 55.
DC-to-DC Compensation Capacitor. Connect a 10 nF capacitor from this pin to ground. Used to regulate the
feedback loop of the Channel C dc-to-dc converter. Alternatively, if using an external compensation resistor,
place a resistor in series with a capacitor to ground from this pin. For more information, see the DC-to-DC
Converter Compensation Capacitors section and the AI
Rev. A | Page 11 of 44
Supply Requirements—Slewing section.
CC
AD5737 Data Sheet
Pin No. Mnemonic Description
49 IGATEC
50 NC No Connect. Do not connect to this pin.
51 CHARTC HART Input Connection for DAC Channel C. For more information, see the HART Connectivity section.
52 NC No Connect. Do not connect to this pin.
53 AGND Ground Reference Point for Analog Circuitry. This pin must be connected to 0 V.
54 I
Current Output Pin for DAC Channel D.
OUT_D
55 NC No Connect. Do not connect to this pin.
56 V
57 COMP
BOOST_D
DCDC_D
58 IGATED
59 CHARTD HART Input Connection for DAC Channel D. For more information, see the HART Connectivity section.
60 NC No Connect. Do not connect to this pin.
61 REFIN External Reference Voltage Input.
62 REFOUT
63 R
64 R
SET_D
SET_C
EPAD
Optional Connection for External Pass Transistor. Leave this pin unconnected when using the dc-to-dc
converter. For more information, see the External PMOS Mode section.
Supply for Channel D Current Output Stage (see Figure 48). To use the dc-to-dc converter, connect this pin
as shown in Figure 55.
DC-to-DC Compensation Capacitor. Connect a 10 nF capacitor from this pin to ground. Used to regulate the
feedback loop of the Channel D dc-to-dc converter. Alternatively, if using an external compensation resistor,
place a resistor in series with a capacitor to ground from this pin. For more information, see the DC-to-DC
Converter Compensation Capacitors section and the AICC Supply Requirements—Slewing section.
Optional Connection for External Pass Transistor. Leave this pin unconnected when using the dc-to-dc
converter. For more information, see the External PMOS Mode section.
Internal Reference Voltage Output. It is recommended that a 0.1 μF capacitor be placed between REFOUT
and REFGND.
An external, precision, low drift, 15 kΩ current setting resistor can be connected to this pin to improve the
temperature drift performance. For more information, see the External Current Setting Resistor section.
I
OUT_D
An external, precision, low drift, 15 kΩ current setting resistor can be connected to this pin to improve the
temperature drift performance. For more information, see the External Current Setting Resistor section.
I
OUT_C
Exposed Pad. The exposed paddle should be connected to AGND, or, alternatively, it can be left electrically
unconnected. It is recommended that the paddle be thermally connected to a copper plane for enhanced
thermal performance.
Rev. A | Page 12 of 44
Data Sheet AD5737
TYPICAL PERFORMANCE CHARACTERISTICS
CURRENT OUTPUTS
0.008
0.006
4mA TO 20mA, INTERNAL R
4mA TO 20mA, EXTERNAL R
4mA TO 20mA, INTERNAL R
4mA TO 20mA, EXTERNAL R
, WITH DC- TO-DC CONVERT ER
SET
,WITHDC-TO-DCCONVERTER
SET
SET
SET
0.004
0.002
0
INL ERROR (%FSR)
–0.002
–0.004
–0.006
AVDD=15V
T
=25°C
A
01000200030004000
CODE
Figure 8. Integral Nonlinearity Error vs. DAC Code Figure 11. Integral Nonlinearity Error vs. Temperature, Internal R
10067-231
0.008
0.006
0.004
0.002
–0.002
INL ERROR (%FSR)
4mA TO 20mA RANGE M AX INL
0mA TO 24mA RANGE M AX INL
0mA TO 20mA RANGE MAX INL
0
4mA TO 20mA RANGE MIN INL
0mA TO 24mA RANGE MIN INL
0mA TO 20mA RANGE MIN INL
AVDD=15V
–0.004
–0.006
–0.008
–40–20020406080100
TEMPERATURE (°C)
10067-234
SET
1.0
4mA TO 20mA, INTERNAL R
0.8
4mA TO 20mA, EXTERNAL R
4mA TO 20mA, INTERNAL R
4mA TO 20mA, EXTERNAL R
0.6
,WITH DC-TO-DC CONVERTER
SET
,WITHDC-TO-DCCONVERTER
SET
SET
SET
0.4
0.2
0
–0.2
DNL ERROR (LSB)
–0.4
AVDD=15V
–0.6
T
=25°C
A
–0.8
–1.0
01000200030004000
CODE
10067-232
0.008
0.006
0.004
–0.002
INL ERROR (%FSR)
0.002
4mA TO 20mA RANGE MAX INL
0mA TO 24mA RANGE MAX INL
0mA TO 20mA RANGE MAX INL
0
4mA TO 20mA RANGE MIN INL
0mA TO 24mA RANGE MIN INL
0mA TO 20mA RANGE MIN INL
AVDD=15V
–0.004
–0.006
–0.008
–40–20020406080100
TEMPERATURE (°C)
Figure 9. Differential Nonlinearity Error vs. DAC Code Figure 12. Integral Nonlinearity Error vs. Temperature, External R
0.06
0.05
4mA TO 20mA, INTERNAL R
4mA TO 20mA, INTERNAL R
SET
, WITH DC- TO-DC CONVERT ER
SET
0.04
0.03
0.02
0.01
AVDD=15V
=25°C
T
A
0
–0.01
–0.02
TOTAL UNADJUSTED ERROR (%FSR)
–0.03
–0.04
4mA TO 20mA, EXTERNAL R
4mA TO 20mA, EXTERNAL R
SET
,WITHDC-TO-DCCONVERTER
SET
01000200030004000
CODE
10067-233
1.0
0.8
0.6
0.4
MAX DNL
0.2
0
–0.2
DNL ERROR (LSB)
–0.4
–0.6
–0.8
–1.0
–40–20020406080100
MIN DNL
AVDD=15V
ALL RANGES
INTERNAL AND EXTERNA L R
SET
TEMPERATURE (°C)
Figure 10. Total Unadjusted Error vs. DAC Code Figure 13. Differential Nonlinearity Error vs. Temperature
10067-235
SET
10067-236
Rev. A | Page 13 of 44
AD5737 Data Sheet
0.025
0.020
0.015
0.010
0.005
0
–0.005
–0.010
AVDD = 15V
–0.015
TOTAL UNADJUSTED ERROR (%FSR)
–0.020
–0.025
–40–20020406080100
4mA TO 20mA RANGE, INTERNAL R
4mA TO 20mA RANGE, EXTERNAL R
TEMPERATURE (°C)
Figure 14. Total Unadjusted Error vs. Temperature
0.020
0.015
0.010
0.005
0
–0.005
–0.010
FULL-SCAL E ERROR (%FSR)
–0.015
–0.020
AVDD = 15V
4mA TO 20mA RANGE, INT ERNAL R
4mA TO 20mA RANGE, EXT ERNAL R
–40–20020406080100
TEMPERATURE (°C)
Figure 15. Full-Scale Error vs. Temperature
SET
SET
SET
SET
10067-155
10067-157
0.008
0.006
0.004
MAX INL
4mA TO 20mA RANGE
TA = 25°C
0.002
0
INL ERROR (%FSR)
–0.002
–0.004
–0.006
51015202530
MIN INL
SUPPLY (V)
Figure 17. Integral Nonlinearity Error vs. Supply, External R
0.008
MAX INL
0.006
0.004
4mA TO 20mA RANGE
0.002
TA = 25°C
0
INL ERROR (%FSR)
–0.002
–0.004
–0.006
51015202530
MIN INL
SUPPLY (V)
Figure 18. Integral Nonlinearity Error vs. Supply, Internal R
10067-240
SET
10067-241
SET
0.005
0
–0.005
–0.010
–0.015
GAIN ERROR (%FS R)
AVDD = 15V
–0.020
–0.025
–40–20020406080100
4mA TO 20mA RANGE, I NTERNAL R
4mA TO 20mA RANGE, EXT ERNAL R
TEMPERATURE (°C)
Figure 16. Gain Error vs. Temperature
SET
SET
10067-159
Rev. A | Page 14 of 44
1.0
ALL RANGES
0.8
TA = 25°C
0.6
0.4
0.2
MAX DNL
0
–0.2
DNL ERROR (LSB)
–0.4
MIN DNL
–0.6
–0.8
–1.0
5 1015202530
SUPPLY (V)
Figure 19. Differential Nonlinearity Error vs. Supply
10067-242
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