Family 10h
AMD Phenom™ II Processor
Product Data Sheet
Publication # 46878
Revision: 3.04
Issue Date: February 2009
Advanced Micro Devices
© 2009 Advanced Micro Devices, Inc. All rights reserved.
The contents of this document are provided in connection with Advanced Micro Devices, Inc.
(“AMD”) products. AMD makes no representations or warranties with respect to the accuracy
or completeness of the contents of this publication and reserves the right to make changes to
specifications and product descriptions at any time without notice. The information contained
herein may be of a preliminary or advance nature and is subject to change without notice. No
license, whether express, implied, arising by estoppel or otherwise, to any intellectual property
rights is granted by this publication. Except as set forth in AMD’s Standard Terms and
Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or
implied warranty, relating to its products including, but not limited to, the implied warranty of
merchantability, fitness for a particular purpose, or infringement of any intellectual property
right.
AMD’s products are not designed, intended, authorized or warranted for use as components in
systems intended for surgical implant into the body, or in other applications intended to
support or sustain life, or in any other application in which the failure of AMD’s product could
create a situation where personal injury, death, or severe property or environmental damage
may occur. AMD reserves the right to discontinue or make changes to its products at any time
without notice.
Trad em arks
AMD, the AMD Arrow logo, AMD Phenom and combinations thereof, AMD CoolCore, AMD PowerNow!, Cool‘n’Quiet, and
3DNow! are trademarks of Advanced Micro Devices, Inc.
HyperTransport is a licensed trademark of the HyperTransport Technology Consortium.
MMX is a trademark of Intel Corporation.
Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
PID:46878 Rev:3.04 - February 2009 Family 10h AMD Phenom™ II Processor Product Data Sheet
Revision History
Date Revision Description
February 2009 3.04 Second Public Release
• Updated brand-specific image on front page
• Added AM3 package and Socket AM3 Socket Infrastructure
• Added support for DDR3 SDRAM, up to 667 MHz
• Increased HyperTransport™ 3.0 max data rate to 4400 MT/s
• Added triple-core option
• Updated L3 configuration
• Removed statement about miscellaneous IO signals
January 2009 3.02 Initial Public Release
Revision History
3
PID:46878 Rev:3.04 - February 2009 Family 10h AMD Phenom™ II Processor Product Data Sheet
1 Family 10h AMD Phenom™ II Processor Features
The following is a list of features and capabilities of the Family 10h AMD Phenom™ II processor.
• Compatible with Existing 32-Bit Code Base
• Including support for SSE, SSE2, SSE3, SSE4a, ABM, MMX™, 3DNow!™ technology and legacy x86
instructions
• Runs existing operating systems and drivers
• Local APIC on the chip
• AMD64 Technology
• AMD64 technology instruction set extensions
• 64-bit integer registers, 48-bit addresses
• Sixteen 64-bit integer registers
• Sixteen 128-bit SSE/SSE2/SSE3/SSE4a registers
• Multi-Core Architecture
• Triple-core or quad-core options
• AMD Balanced Smart Cache
• Discrete L1 and L2 cache structures for each core
• Shared L3 cache structure
• Machine Check Architecture
• Includes hardware scrubbing of major ECC protected arrays
• Cache Structures
• 64-Kbyte 2-Way Associative ECC-Protected L1 Data Cache
• Two 64-bit operations per cycle, 3-cycle latency
• 64-Kbyte 2-Way Associative Parity-Protected L1 Instruction Cache
• With advanced branch prediction
• 512-Kbyte 16-Way Associative ECC-Protected L2 Cache
• Exclusive cache architecture storage in addition to L1 caches
• 6128-Kbyte (6-Mbyte) Maximum, 64-way Maximum Associative ECC-Protected L3 Cache
• Shared cache architecture storage in addition to exclusive L1 and L2 caches
• 2-cycle latency improvement for Phenom II processors
• Floating-Point Unit
• AMD Wide Floating-Point Accelerator
• 128-bit Floating-Point Unit (FPU)
• Virtualization Features
• SVM disable and lock
• Nested paging
• Rapid Virtualization Indexing
• Improved world-switch speed for Phenom II processors
• Power Management
• Multiple low-power states
• AMD Cool‘n’Quiet™ 3.0
• 45-nm process for decreased power consumption
• Enhanced AMD PowerNow!™ Technology
• AMD Smart Fetch Technology
• AMD CoolCore™ Technology
• Enhanced L3 clock-gating for Phenom II processors
• Dual Dynamic Power Management
Family 10h AMD Phenom™ II Processor Features
4
PID:46878 Rev:3.04 - February 2009 Family 10h AMD Phenom™ II Processor Product Data Sheet
• System Management Mode (SMM)
• ACPI-compliant, including support for processor performance states
• Supported power states: C0, C1, C1E, S0, S1, S3, S4, S5
• Electrical Interfaces
• DDR2 SDRAM: SSTL_1.8 per JEDEC specification
• DDR3 SDRAM: Compliant to JEDEC DDR3 1.5-V SDRAM specification
• Refer to the AMD Family 10h Processor Electrical Data Sheet, order# 40014, for electrical details of
AMD Family 10h processors.
• HyperTransport™ Technology to I/O Devices
• HyperTransport 1 and HyperTransport 3 technology supported
• One (1) link, 16-bits in each direction, supporting up to 2000 MT/s or 4.0 GB/s in each direction in
HyperTransport Generation 1.0 mode and 4400 MT/s or 8.8 GB/s in each direction in HyperTransport
Generation 3.0 mode.
• Integrated Memory Controller
• AMD Memory Optimizer Technology
• Low-latency, high-bandwidth
• Adaptive Prefetching Support
• ECC checking with double-bit detect and single-bit correct
• Supports up to four unbuffered DIMMs
• Package AM2r2
• 144-bit DDR2 SDRAM controller operating at frequencies up to 533 MHz
• Package AM3
• 144-bit DDR3 SDRAM controller operating at frequencies up to 667 MHz
• Available Packages
• Compliant with RoHS (EU Directive 2002/95/EC) with lead used only in small amounts in specifically
exempted applications
• Package AM2r2
• Refer to the AM2r2 Processor Functional Data Sheet, order# 41697, for functional and mechanical
details of the AM2r2 package processor.
• 940-pin lidded micro PGA
• 1.27-mm pin pitch
• 31 x 31 row pin array
• Organic C4 die attach
• Package AM3
• Refer to the AM3 Processor Functional Data Sheet, order# 40778, for functional and mechanical
details of the AM3 socket.
• 938-pin lidded micro PGA
• 1.27-mm pin pitch
• 31 x 31 row pin array
• Organic C4 die attach
Family 10h AMD Phenom™ II Processor Features
5
PID:46878 Rev:3.04 - February 2009 Family 10h AMD Phenom™ II Processor Product Data Sheet
2 Compatible Socket Infrastructures
Refer to the AMD Infrastructure Roadmap, order# 41842 for information on platform feature
implications of package and socket infrastructure combinations. Family 10h AMD Phenom™ II
processors support the following socket infrastructures:
• Socket AM2r2 Socket Infrastructure
• Compatible with AM2, AM2r2, and AM3 package processors
• Refer to the AM2r2 Processor Functional Data Sheet, order# 41697, for functional and mechanical
details of the AM2r2 socket.
• Socket AM3 Socket Infrastructure
• Compatible with AM3 package processors
• Refer to the AM3 Processor Functional Data Sheet, order# 40778, for functional and mechanical details
of the AM3 socket.
Compatible Socket Infrastructures
6
Loading...