Alcatel-lucent 1850 TSS-5C RELEASE 1 User Manual

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Alcatel-Lucent 1850 TSS-5C
T R A N S P O R T S E R V I C E S W I T C H | R E L E A S E 1
The Alcatel-Lucent 1850 Transport Service Switch TSS-5C is a compact Packet-Optical Transport switch and Ethernet access demarcation device, ideally suited for mobile backhaul and business Ethernet services. High­availability, mission-critical Ethernet and E1/DS1/STM-1 services are supported by a comprehensive set of Packet Transport Network (PTN) and Carrier Ethernet features. The 1850 TSS-5C extends T-MPLS capability — upgradeable to MPLS-TP in a future release — to the network edge for access/aggregation and is compliant to Metro Ethernet Forum standards.
The Alcatel-Lucent 1850 TSS-5C is equally well-equipped to be deployed as a network termination unit for demarcation, media conversion, and distance extension applications as part of a Carrier Ethernet service offering. This is supported by an extensive set of management, QoS, bridging, VLAN and security features. As a highly versatile, resilient, yet cost-effective platform, the 1850 TSS-5C provides the lowest cost per bit networking in the industry.
An integral part of the Alcatel-Lucent 1850 TSS portfolio, the 1850 TSS-5C operates in the access/aggregation layer. It feeds into higher capacity products such as the 1850 TSS-100, 1850 TSS-160 and 1850 TSS-320, extending T-MPLS support to the network edge. It is fully managed by the Alcatel-Lucent 1350 Optical Management System.
Designed for outside plant deploy­ment, the 1850 TSS-5C is an excellent choice for aggregating TDM/packet mobile backhaul traffic at 2G/3G/4G cell sites. This converged transport platform provides a growth path for exponentially increasing IP traffic, while fully supporting TDM traffic with circuit emulation/psuedowire. Its compact 1RU chassis fits in any wiring closet — essential when deployed as a network termination unit for business Carrier Ethernet services.
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Features
• Compact 1RU chassis
• 9 Gb/s switching fabric
• Fast Ethernet & GigE, electrical and optical interfaces
• STM-1 and E1/DS1 interfaces
• T-MPLS (future upgradeable to MPLS-TP)
• Metro Ethernet Forum (MEF) certified with high reliability and OAM support
• Circuit Emulation over Ethernet with MPLS PWE3
• E-line, E-LAN, and E-Tree services
• Both T-MPLS and Carrier Ethernet protection mechanisms supported
• Multiple synchronization options
• Environmentally and ESD hardened for outside plant deployment
Benefits
• Achieve economies of scale using a single access platform for mobile backhaul/transport and Carrier Ethernet services
• Maintain high-margin revenue streams from priority traffic with advanced traffic management and QoS features
• Accelerate network transformation from TDM to packet architectures
• Reduce CAPEX by eliminating the need for overlay networks and multiple equipment types
• Reduce OPEX by simplifying oper­ations, training, and network management requirements
Technical specifications
System hardware
• 9 Gb/s switching fabric
• 4 x GigE interfaces (SFP)
• 12 x FE interfaces (electrical)
• Two slots for optional interface modules (hot-swappable)
• Management LAN, console, MDIO, and station clock ports or external synchronization interfaces
• Power supply (DC or AC)
• Fan tray (hot-swappable)
Multi-service module
• 1 x STM-1 channelized CES (SFP)
• 16 x E1 (75Ω) CES
• 1 x GigE (SFPs: 1000BASE-T, SX, LX, ZX, BX10/20/40, EZX, CWDM short or long haul, DWDM)
Fast Ethernet module electrical
• 8 x FE (10/100BASE-T)
Fast Ethernet module optical
• 8 x FE (SFPs: FX, L X, BX)
DS1/E1 module
• 16 x DS1 (100 Ω)/E1 (120 Ω) CES
E1 module
• 16 x E1 (75 Ω) CES
Synchronization
• Synchronous Ethernet (ITU-T G.8261/G.8262/Y.1362)
• Synchronous Ethernet with SSM
• IEEE 1588v2 master/slave/ transport clock
• 1588v2 ToD and 1PPS interface
Protection
• G.8031 Ethernet linear protection
• G.8032 Ethernet ring protection
• G.8131 T-MPLS 1:1 bidirectional linear protection
• IEEE 802.1AX link aggregation
OAM
• IEEE 802.3ah link OAM
• IEEE 802.1ag CFM: connectivity check, loopback, link trace
• Ethernet OAM ITU-T Y.1731 (RDI, AIS, LM, two-way and one-way DM)
• T-MPLS OAM: CV, APS, FDI, RDI, LB, DM, LM
• Ethernet 802.1ag CC, LB, LT in T-MPLS mode
• MEF S-OAM
• EVC loopback
• Performance monitoring: port counters, RMON IETF RFC 2819, EVC availability and SLA counters (Y.1563)
Ethernet
• MAC bridging, IEEE 802.1D, RSTP
• 16,000 MAC table
• VLAN bridging, IEEE 802.1Q
• Provider bridging IEEE 802.1ad
• MEF Ethernet services: E-line, E-LAN, E-Tree
• Jumbo frames: 9600 bytes
• Auto-negotiation support, flow control, MDIX
• Port mirroring: ingress/egress
• L2 control protocol filtering/ tunneling
• L2 Access Control Lists (ACL)
• Multiple classification options: port, VID, PCP, MAC DA/SA, IPv4 DSCP
• 8 QoS classes
• Strict priority, WRR scheduling
• Tail-drop
• Ingress two-rate, three-color metering/ policing RFC2698/ MEF10.1
• Class-based queuing
• Egress shaping per port/queue
• Anti Denial of Service (DoS) attacks
• MPLS label push/pop/swap operations, LER or LSR
Alcatel-Lucent 1850 TSS-5C | Release 1 | Data Sheet2
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PWE3
• Related RFCs: 4553, 4446, 4197, 3985, 3916
• E1 pseudowires: SAToP
• E-Line services
• 1024 bidirectional tunnels
• 1024 bidirectional pseudowires
• CAC
• T-MPLS 8 QoS
• TDM CES timing modes: TDM loop line, Ethernet Line (SyncE or adaptive or differential packet timing), external, free-running
Management
• Alcatel-Lucent 1350 Optical Management System (OMS)
• Web browser interface (ZIC)
• Command Line Interface (CLI)
• TL1, SNMP v2/v3
• SSH, SSL
• Remote software download via SFTP
• Ethernet in-band management (VL AN)
Physical specifications
Dimensions and weight
• 1 Rack Unit (RU)
• Height: 44 mm (1.73 in.)
• Width: 442 mm (17.40 in.)
• Depth: 212 mm (8.35 in.)
• Weight: max. 4.4 kg (9.7 lb)
• Wall-mount and rack-mount kits (19 in., 23 in., ETSI)
Power
• Redundant -48/-60 V DC or +24 V DC
• 90 V AC - 264 V AC
• Current drain: 3 A max. at +24 V DC, 1 A max. at 90 V AC
• Power consumption: < 80 W
Environmental
• Hardened for outside-plant operation:
¬ Operating temperature: -40°C
to +65°C (-40°F to +149°F)
¬ Humidity: 5% to 95%,
non-condensing
• Electrically hardened for utility substation deployment
¬ Compliant to key criteria in
IEEE 1613, IEEE C37.90 ¬ IEEE C37.90.1 SWC ¬ IEEE C37.90.2 RFI ¬ IEEE C37.90.3 ESD
Regulatory and standards compliance
• NEBS Level 3 GR-1089-CORE Issue 4, GR-63-CORE Issue 3
• CE Mark: EN 300 386
• IEC 60825-1 and IEC 60825-2, 21 CFR 1040
• UL/CSA 60950-1, CSA C22.2 No.60950-1, EN 60950-1
• EN 55022 Class A: radiated and conducted emissions
• EN 61000-4-2, -3, -4, -5, and -6
• ETSI 300-019 Storage, Class
1.2; Transportation, Class 2.3; Operational, Class 3.2
• FCC Part 15 and Industry Canada ICES-003 Class A
• FCC Part 68
• ANSI T1.315 / ETS EN 300 -132-2
• IEEE 1613, IEEE C37.90
• IEC 61850-3
• ITU-T K.21
• MEF 9/14 certified
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