Manufactured under license from Dolby Laboratories. "Dolby" and
the double-D symbol are trademarks of Dolby Laboratories.
Page 3
SPECIFICATIONS
< VCR Section >
DescriptionUnitMinimumNominalMaximumRemark
1. Video
1-1. Video Output (PB)Vp-p0.81.01.2SP Mode
1-2. Video Output (R/P)Vp-p0.81.01.2
1-3. Video S/N Y (R/P)dB4045
1-4. Video Color S/N AM (R/P)dB3741SP Mode
1-5. Video Color S/N PM (R/P)dB3036SP Mode
1-6. Resolution (PB)Line230245SP Mode
2. Servo
2-1. Jitter Lowµsec0.070.12SP Mode
2-2. Wow & Flutter%0.30.5SP Mode
3. Normal Audio
3-1. Output (PB) dBV-9-4-3SP Mode
3-2. Output (R/P)dBV-9-4-1.5SP Mode
3-3. S/N (R/P)dB3641SP Mode
3-4. Distortion (R/P)%1.04.0SP Mode
3-5. Freq. resp (R/P) at 200HzdB-6-2SP Mode
(-20dB ref. 1kHz) at 8kHzdB-8-2SP Mode
SP Mode,
W/O Burst
4. Tuner
4-1. Video outputVp-p0.81.01.2E-E Mode
4-2. Video S/NdB3944E-E Mode
4-3. Audio outputdB-10-6-2E-E Mode
4-4. Audio S/NdB4046E-E Mode
5. Hi-Fi Audio
5-1. OutputdBV-12-9-4SP Mode
5-2. Dynamic RangedB7085SP Mode
5-3. Freq. resp (6dB B.W)Hz20 ~ 20K SP Mode
Note: Nominal specs represent the design specs. All units should be able to approximate these – some will exceed
and some may drop slightly below these specs. Limit specs represent the absolute worst condition that still might
be considered acceptable; In no case should a unit fail to meet limit specs.
1-1-1H9504SP
Page 4
< DVD Section >
ITEMCONDITIONSUNITNOMINALLIMIT
1. Video Output75 ohm load Vpp1.0± 0.1
2. Optical Digital OutdBm-18
3. Audio (PCM)
3-1. Output Level1kHz 0dBVrms2.0
3-2. S/NdB100
3-3. Freq. Response
DVDfs=48kHz 20~20kHzdB± 0.5
CDfs=44.1kHz 20~20 kHzdB± 0.5
3-4. THD+N
DVD1 kHz 0dB%0.02
CD1 kHz 0dB%0.03
NOTES:
1. All Items are measured without pre-emphasis unless otherwise specified.
2. Power supply : AC230 V 60 Hz
3. Load imp. : 100 K ohm
4. Room ambient : 5
°C ~ 40 °C
1-1-2H9504SP
Page 5
LASER BEAM SAFETY PRECAUTIONS
This DVD player uses a pickup that emits a laser beam.
Do not look directly at the laser beam coming
from the pickup or allow it to strike against your
skin.
The laser beam is emitted from the location shown in the figure. When checking the laser diode, be sure to keep
your eyes at least 30cm away from the pickup lens when the diode is turned on. Do not look directly at the laser
beam.
Caution: Use of controls and adjustments, or doing procedures other than those specified herein, may result in
hazardous radiation exposure.
Drive Mecha Assembly
Laser Beam Radiation
Laser Pickup
Turntable
1-2-1DVD_LASER
Page 6
IMPORTANT SAFETY PRECAUTIONS
Product Safety Notice
Some electrical and mechanical parts have special
safety-related characteristics which are often not evident from visual inspection, nor can the protection they
give necessarily be obtained by replacing them with
components rated for higher voltage, wattage, etc.
Parts that have special safety characteristics are identified by a ! on schematics and in parts lists. Use of a
substitute replacement that does not have the same
safety characteristics as the recommended replacement part might create shock, fire, and/or other hazards. The Product’s Safety is under review
continuously and new instructions are issued whenever appropriate. Prior to shipment from the factory,
our products are carefully inspected to confirm with
the recognized product safety and electrical codes of
the countries in which they are to be sold. However, in
order to maintain such compliance, it is equally important to implement the following precautions when a set
is being serviced.
Precautions during Servicing
A. Parts identified by the ! symbol are critical for
safety. Replace only with part number specified.
B. In addition to safety, other parts and assemblies
are specified for conformance with regulations
applying to spurious radiation. These must also be
replaced only with specified replacements.
Examples: RF converters, RF cables, noise blocking capacitors, and noise blocking filters, etc.
C. Use specified internal wiring. Note especially:
1)Wires covered with PVC tubing
2)Double insulated wires
3)High voltage leads
D. Use specified insulating materials for hazardous
live parts. Note especially:
1)Insulation tape
2)PVC tubing
3)Spacers
4)Insulators for transistors
E. When replacing AC primary side components
(transformers, power cord, etc.), wrap ends of
wires securely about the terminals before soldering.
F. Observe that the wires do not contact heat produc-
ing parts (heatsinks, oxide metal film resistors, fusible resistors, etc.).
G. Check that replaced wires do not contact sharp
edges or pointed parts.
H. When a power cord has been replaced, check that
5 - 6 kg of force in any direction will not loosen it.
I. Also check areas surrounding repaired locations.
J. Be careful that foreign objects (screws, solder
droplets, etc.) do not remain inside the set.
K. Crimp type wire connector
The power transformer uses crimp type connectors
which connect the power cord and the primary side
of the transformer. When replacing the transformer,
follow these steps carefully and precisely to prevent
shock hazards.
Replacement procedure
1)Remove the old connector by cutting the wires at a
point close to the connector.
Important: Do not re-use a connector. (Discard it.)
2)Strip about 15 mm of the insulation from the ends
of the wires. If the wires are stranded, twist the
strands to avoid frayed conductors.
3)Align the lengths of the wires to be connected.
Insert the wires fully into the connector.
4)Use a crimping tool to crimp the metal sleeve at its
center. Be sure to crimp fully to the complete closure of the tool.
L. When connecting or disconnecting the internal
connectors, first, disconnect the AC plug from the
AC outlet.
1-3-1DVD_SFNP
Page 7
Safety Check after Servicing
Examine the area surrounding the repaired location for
damage or deterioration. Observe that screws, parts,
and wires have been returned to their original positions. Afterwards, do the following tests and confirm
the specified values to verify compliance with safety
standards.
1. Clearance Distance
When replacing primary circuit components, confirm
specified clearance distance (d) and (d’) between soldered terminals, and between terminals and surrounding metallic parts. (See Fig. 1)
Table 1 : Ratings for selected area
AC Line VoltageClearance Distance (d) (d’)
Chassis or Secondary Conductor
Primary Circuit Terminals
dd'
230 V
Note: This table is unofficial and for reference only.
Be sure to confirm the precise values.
≥3 mm(d)
≥6 mm(d’)
2. Leakage Current Test
Confirm the specified (or lower) leakage current
between B (earth ground, power cord plug prongs)
and externally exposed accessible parts (RF terminals, antenna terminals, video and audio input and
output terminals, microphone jacks, earphone jacks,
etc.) is lower than or equal to the specified value in the
table below.
Measuring Method (Power ON) :
Insert load Z between B (earth ground, power cord
plug prongs) and exposed accessible parts. Use an
AC voltmeter to measure across the terminals of load
Z. See Fig. 2 and the following table.
Table 2: Leakage current ratings for selected areas
AC Line VoltageLoad ZLeakage Current (i)
2kΩ RES.
Connected in
parallel
230 V
50kΩ RES.
Connected in
parallel
i≤0.7mA AC Peak
i≤2mA DC
i≤0.7mA AC Peak
i≤2mA DC
Exposed Accessible Part
Z
One side of
B
Power Cord Plug Prongs
One side of power cord plug
prongs (B) to:
Antenna terminals
A/V Input, Output
AC Voltmeter
(High Impedance)
RF or
Fig. 1
Fig. 2
Note: This table is unofficial and for reference only. Be sure to confirm the precise values.
1-3-2DVD_SFNP
Page 8
STANDARD NOTES FOR SERVICING
Circuit Board Indications
a. The output pin of the 3 pin Regulator ICs is indi-
cated as shown.
Top View
Out
b. For other ICs, pin 1 and every fifth pin are indicated
as shown.
Pin 1
c. The 1st pin of every male connector is indicated as
shown.
Input
In
Bottom View
5
10
Pb (Lead) Free Solder
When soldering, be sure to use the Pb free solder.
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:.
(1) Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
Fig. S-1-1
Pin 1
Instructions for Connectors
1. When you connect or disconnect the FFC (Flexible
Foil Connector) cable, be sure to first disconnect
the AC cord.
2. FFC (Flexible Foil Connector) cable should be
inserted parallel into the connector, not at an angle.
FFC Cable
Connector
CBA
(2) Remove the flat pack-IC with tweezers while apply-
ing the hot air.
(3) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
(4) Release the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
Caution:
1. The Flat Pack-IC shape may differ by models. Use
an appropriate hot-air flat pack-IC desoldering
machine, whose shape matches that of the Flat
Pack-IC.
2. Do not supply hot air to the chip parts around the
flat pack-IC for over 6 seconds because damage to
the chip parts may occur. Put masking tape around
the flat pack-IC to protect other parts from damage.
(Fig. S-1-2)
* Be careful to avoid a short circuit.
1-4-1DVD_NOTE
Page 9
3. The flat pack-IC on the CBA is affixed with glue, so
be careful not to break or damage the foil of each
pin or the solder lands under the IC when removing
it.
Hot-air
Flat Pack-IC
Desoldering
Machine
CBA
With Soldering Iron:
(1) Using desoldering braid, remove the solder from all
pins of the flat pack-IC. When you use solder flux
which is applied to all pins of the flat pack-IC, you
can remove it easily. (Fig. S-1-3)
Flat Pack-IC
Desoldering Braid
Masking
Tape
Tweezers
Flat Pack-IC
Fig. S-1-2
Soldering Iron
Fig. S-1-3
(2) Lift each lead of the flat pack-IC upward one by
one, using a sharp pin or wire to which solder will
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Sharp
Pin
Fine Tip
Soldering Iron
Fig. S-1-4
(3) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
(4) Release the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
With Iron Wire:
(1) Using desoldering braid, remove the solder from all
pins of the flat pack-IC. When you use solder flux
which is applied to all pins of the flat pack-IC, you
can remove it easily. (Fig. S-1-3)
(2) Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
(3) While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solder
melts so as to lift the IC leads from the CBA contact
pads as shown in Fig. S-1-5
1-4-2DVD_NOTE
Page 10
(4) Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
(5) Release the flat pack-IC from the CBA using twee-
zers. (Fig. S-1-6)
Note:
When using a soldering iron, care must be taken
to ensure that the flat pack-IC is not being held by
glue. When the flat pack-IC is removed from the
CBA, handle it gently because it may be damaged
if force is applied.
2. Installation
(1) Using desoldering braid, remove the solder from
the foil of each pin of the flat pack-IC on the CBA so
you can install a replacement flat pack-IC more
easily.
(2) The “I” mark on the flat pack-IC indicates pin 1.
(See Fig. S-1-7.) Be sure this mark matches the 1
on the PCB when positioning for installation. Then
presolder the four corners of the flat pack-IC. (See
Fig. S-1-8.)
(3) Solder all pins of the flat pack-IC. Be sure that none
of the pins have solder bridges.
To Solid
Mounting Point
CBA
Hot Air Blower
Iron Wire
Soldering Iron
Fig. S-1-5
Fine Tip
Soldering Iron
Example :
or
Pin 1 of the Flat Pack-IC
is indicated by a " " mark.
Fig. S-1-7
Presolder
Flat Pack-IC
CBA
Fig. S-1-8
Flat Pack-IC
Tweezers
Fig. S-1-6
1-4-3DVD_NOTE
Page 11
Instructions for Handling
Semi-conductors
Electrostatic breakdown of the semi-conductors may
occur due to a potential difference caused by electrostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a grounding band (1MΩ) that is properly grounded to remove any static electricity that may
be charged on the body.
2. Ground for Workbench
(1) Be sure to place a conductive sheet or copper plate
with proper grounding (1MΩ) on the workbench or
other surface, where the semi-conductors are to be
placed. Because the static electricity charge on
clothing will not escape through the body grounding band, be careful to avoid contacting semi-conductors with your clothing.
< Incorrect >
< Correct >
1MΩ
CBA
Grounding Band
1MΩ
CBA
Conductive Sheet or
Copper Plate
1-4-4DVD_NOTE
Page 12
PREPARATION FOR SERVICING
How to Enter the Service Mode
About Optical Sensors
Caution:
An optical sensor system is used for the Tape Start
and End Sensors on this equipment. Carefully read
and follow the instructions below. Otherwise the unit
may operate erratically.
What to do for preparation
Insert a tape into the Deck Mechanism Assembly and
press the PLAY button. The tape will be loaded into
the Deck Mechanism Assembly. Make sure the power
is on, connect TP501 (SENSOR INHIBITION) to
GND. This will stop the function of Tape Start Sensor,
Tape End Sensor and Reel Sensors. (If these TPs are
connected before plugging in the unit, the function of
the sensors will stay valid.) See Fig. 1.
Note: Because the Tape End Sensors are inactive, do
not run a tape all the way to the start or the end of the
tape to avoid tape damage.
Q503
Q504
TP501
S-INH
Fig. 1
1-5-1H9500PFS
Page 13
CABINET DISASSEMBLY INSTRUCTIONS
1. Disassembly Flowchart
This flowchart indicates the disassembly steps to gain
access to item(s) to be serviced. When reassembling,
follow the steps in reverse order. Bend, route, and
dress the cables as they were originally.
[1] Top Cover
[2] Front
Assembly
[17] Side
Bracket
[5] DVD Main
CBA
[13] DVD OPEN/
CLOSE CBA
[12] Main CBA
[14] Function
CBA
[3] Top Bracket
[4] DVD Mecha
Assembly
[6] Rear Unit
[10] VCR
Chassis Unit
[15] Jack CBA
[9] Rear Panel
[8] PCB Bracke
[7] Power
Supply CBA
[11] Deck
Assembly
[16] Deck
Pedestal
t
ID/
LOC.
No.
[8]
[9]
[10]
[11]
PAR T
PCB
Bracket
Rear Panel
VCR
Chassis
Unit
Deck
Assembly
REMOVE/*UNHOOK/
Fig.
UNLOCK/RELEASE/
No.
UNPLUG/DESOLDER
D63(S-9)-
D6-----------
5(S-10), 2(S-11),
D7
2(S-11A)
Desolder, (S-12),
D8
(S-12A)
[12]Main CBA D8-----------
DVD
REMOVAL
OPEN/
[13]
CLOSE
D8Desolder-
CBA
Function
[14]
CBA
D8Desolder-
[15]Jack CBAD8Desolder-
Deck
[16]
[17]
Pedestal
Side
Bracket
D97(S-13)-
D9(S-14)-
Note
-
4,5
2. Disassembly Method
ID/
LOC.
No.
PART
Fig.
No.
[1]Top Cover D17(S-1)-
Front
[2]
[3]
Assembly
To p
Bracket
D2(S-2), *7(L-1)
D22(S-3), 2(S-3A)-
DVD
[4]
Mecha
D3
Assembly
DVD Main
[5]
CBA
D4
[6]Rear UnitD5
Power
[7]
Supply
D62(S-8), 2(S-8A)-
CBA
REMOVAL
REMOVE/*UNHOOK/
UNLOCK/RELEASE/
UNPLUG/DESOLDER
3(S-4), *CN302,
*CN401, *CN601
2(S-5), *CN201,
*CN301
4(S-6), 4(S-7),
*CN003
Note
1
1-1
1-2
-
2
2-1
2-2
2-3
3
-
↓
(1)
↓
(2)
↓
(3)
↓
(4)
↓
(5)
Note:
(1): Identification (location) No. of parts in the figures
(2): Name of the part
(3): Figure Number for reference
(4): Identification of parts to be removed, unhooked,
unlocked, released, unplugged, unclamped, or
desoldered.
P=Spring, L=Locking Tab, S=Screw,
CN=Connector
*=Unhook, Unlock, Release, Unplug, or Desolder
e.g. 2(S-2) = two Screws (S-2),
2(L-2) = two Locking Tabs (L-2)
(5): Refer to “Reference Notes.”
1-6-1H9531DC
Page 14
Reference Notes
CAUTION 1: Locking Tabs (L-1) are fragile. Be careful
not to break them.
1-1. Remove Screw (S-2).
1-2. Release seven Locking Tabs (L-1) (to do this, first
release five Locking Tabs (A) at the side and top,
and then release two Locking Tabs (B) at the bottom.)
CAUTION 2: Electrostatic breakdown of the laser
diode in the optical system block may occur as a
potential difference caused by electrostatic charge
accumulated on cloth, human body etc., during
unpacking or repair work.
To avoid damage of pickup follow next procedures.
2-1. Slide the pickup unit as shown in Fig. D4.
2-2. Short the three short lands of FPC cable with sol-
der before removing the FFC cable (CN201) from
it. If you disconnect the FFC cable (CN201), the
laser diode of pickup will be destroyed. (Fig. D4)
2-3. Disconnect Connector (CN301). Remove two
Screws (S-5) and lift the DVD Main CBA. (Fig.
D4)
CAUTION 3: When reassembling, confirm the FFC
cable (CN301) is connected completely. Then remove
the solder from the three short lands of FPC cable.
(Fig. D4)
CAUTION 4: When reassembling, solder wire jumpers
as shown in Fig. D8.
CAUTION 5: Before installing the Deck Assembly, be
sure to place the pin of LD-SW on Main CBA as shown
in Fig. D8. Then, install the Deck Assembly while
aligning the hole of Cam Gear with the pin of LD-SW,
the shaft of Cam Gear with the hole of LD-SW as
shown in Fig. D8.
(L-1)
(A)
(L-1)
(S-2)
(B)
[2] Front Assembly
CN601
CN302
(S-4)
CN401
(S-3)
(S-3A)
[3] Top Bracket
(S-3A)
(A)
(L-1)
(A)
Fig. D2
(S-4)
(S-4)
[4] DVD Mecha Assembly
[1] Top Cover
(S-1)
(S-1)
Fig. D1
Fig. D3
(S-1)
1-6-2H9531DC
Page 15
(S-5)
CN301
CN201
(S-5)
[5] DVD Main
CBA
DVD Mecha
(S-8)
(S-8)
(S-8A)
[8] PCB Bracket
[7] Power Supply CBA
(S-8A)
(S-9)
[9] Rear Panel
Fig. D6
A
Slide
[6] Rear Unit
B
Pickup Unit
View for A
Short the three short
lands by soldering
View for B
Fig. D4
(S-7)
(S-6)
(S-7)
CN003
(S-10)
(S-11A)
[10] VCR Chassis Unit
(S-11A)
(S-11)
(S-10)
(S-11)
(S-10)
Fig. D7
(S-7)
Fig. D5
1-6-3H9531DC
Page 16
[11] Deck
Assembly
FE Head
Cylinder Assembly
ACE Head
Assembly
Pin
SW507
LD-SW
Desolder
Lead with
blue stripe
[13] DVD OPEN/
CLOSE CBA
[12] Main CBA
(S-12)
[14] Function CBA
From
ACE Head
Assembly
[15] Jack CBA
(S-12A)
Lead with
blue stripe
[11] Deck Assembly
Shaft
Hole
LD-SW
Lead with blue stripe
Desolder from bottom
Desolder
Lead with
blue stripe
From
Cylinder
Assembly
[12] Main CBA
Cam Gear
Hole
Pin
[12] Main CBA
From
FE Head
From
Capstan
Motor
Assembly
Desolder
Lead connections of Deck Assembly and Main CBA
Lead with
white stripe
Printing side
Desolder
BOTTOM VIEW
Fig. D8
1-6-4H9531DC
Page 17
[16] Deck Pedestal
(S-13)
(S-14)
[17] Side
Bracket
(S-13)
To Remove the Disc Manually
Fig. D9
1. Remove the Top Cover.
2. Rotate this roulette in the direction of the arrow as
shown below.
Top Cover
1
DVD Mecha
Tray
Deck Assembly
3
2
Rotate this roulette in
the direction of the arrow
2
1-6-5H9531DC
Page 18
ELECTRICAL ADJUSTMENT INSTRUCTIONS
General Note: "CBA" is an abbreviation for
"Circuit Board Assembly."
NOTE:
1.Electrical adjustments are required after replacing
circuit components and certain mechanical parts.
It is important to do these adjustments only after
all repairs and replacements have been completed. Also, do not attempt these adjustments
unless the proper equipment is available.
2.To perform these alignment / confirmation procedures, make sure that the tracking control is set in
the center position: Press either "CHANNEL L5??" or
"CHANNEL K" button on the front panel first, then
the "PLAY" button on the front panel.
CH1
CH2
Figure 1
EXT. Syncronize Trigger Point
1.0H
6.5H±1H (416.0µs±60µs)
Switching Pulse
0.5H
V-Sync
Test Equipment Required
1.Oscilloscope: Dual-trace with 10:1 probe,
V-Range: 0.001~50V/Div.,
F-Range: DC~AC-20MHz
2.Alignment Tape (FL6A)
Head Switching Position Adjustment
Purpose:
To determine the Head Switching point during
playback.
Symptom of Misadjustment:
May cause Head Switching noise or vertical jitter
in the picture.
Test pointAdj.PointModeInput
TP751(V-OUT)
TP504(RF-SW)
GND
Tape
FL6AOscilloscope
VR501
(Switching Point)
(MAIN CBA)
Measurement
Equipment
PLAY
(SP)
6.5H±1H
(416.0µs±60µs)
-----
Spec.
Reference Notes:
Playback the Alignment tape and adjust VR501 so that
the V-sync front edge of the CH1 video output waveform is at the 6.5H(416.0µs) delayed position from the
rising edge of the CH2 head switching pulse waveform.
Connections of Measurement Equipment
TP751
Main CBA
GND
TP504
Oscilloscope
CH1 CH2
Trig. (+)
1-7-1H9500EA
Page 19
FIRMWARE RENEWAL MODE
1. Turn the power on and remove the disc on the tray.
2. To put the DVD player into version up mode, press
[9], [8], [7], [6], and [SEARCH MODE] buttons on
the remote control unit in that order. The tray will
open automatically.
Fig. a appears on the screen and Fig. b appears on
the VFD.
F/W Version Up Mode
Please insert a DISC
for F/W Version Up.
EXIT: POWER
Fig. a Version Up Mode Screen
Fig. b VFD in Version Up Mode
The DVD player can also enter the version up
mode with the tray open. In this case, Fig. a will be
shown on the screen while the tray is open.
3. Load the disc for version up.
4. The DVD player enters the F/W version up mode
automatically. Fig. c appears on the screen and
Fig. d appears on the VFD.
F/W Version Up Mode
VERSION : ********
Reading...(*2)
5. After programming is finished, the tray opens automatically. Fig. e appears on the screen and the
checksum in (*3) of Fig. e appears on the VFD.
(Fig. f)
F/W Version Up Mode
VERSION : ********
Completed
SUM : 7abc (*3)
Fig. e Completed Program Mode Screen
Fig. f VFD upon Finishing the Programming Mode (Example)
At this time, no buttons are available.
6. Unplug the AC cord from the AC outlet. Then plug it
again.
7. Turn the power on by pressing the power button
and the tray will close.
8. Press [1], [2], [3], [4], and [DISPLAY] buttons on the
remote control unit in that order.
Fig. g appears on the screen.
The appearance shown in (*2) of Fig. c is
described as follows:
AppearanceNo.State
Reading...Sending files into the memory
1
Erasing...Erasing previous version data
2
Programming...
3Writing new version data
Fig. g
9. Press [3] button on the remote control unit.
Fig. h appears on the screen.
model: ******Ver: ****Region: **
TEST 3: EEPROM CLEAR
EEPROM CLEAR: OK
EXIT: POWERRETURN: -----
Fig. h
10.To finish this mode, press [POWER] button.
1-8-1H9500TEST
Page 20
1-9-11-9-2H9504BLS
Servo/System Control Block Diagram
MLOADING
MOTOR
CYLINDER ASSEMBLYCAPSTAN MOTOR
DRUM
MOTOR
PG
SENSOR
CONTROL
HEAD
CL287
55CTL(+)
66CTL(-)
CL504
AC HEAD ASSEMBLY
MAIN CBA
KEY- 1
POWER-LED
DVD-LED
REC-LED
VCR-LED
TIMER-LED
ST-S
T-REEL
REMOTE-VIDEO
CTL(+)
RESET
REC-SAF-SW
PG-DELAY
CTL(-)
D-V-SYNC
D-REC-H
INPUT-SELECT
RF-SW
H-A-SW
C-ROTA
END-S
14
94
95
10
4
80
34
2
13
15
18
33
41
16
31
7
(DECK ASSEMBLY)
T-REEL
Q515
RESET
Q506
S-REEL79
SW-POINT
AL+5V
VR501
TIMER+5V
S-REEL
PS502
TP502
KEY- 2
8
IIC-BUS SDA
IIC-BUS SDA
IIC-BUS SCL
A-MUTE-H
IIC-BUS SDA
IIC-BUS SCL
Hi-Fi-H-SW
A-MODE
OUTPUT-SELECT
A-MUTE-H
Hi-Fi-H-SW
A-MODE
H-A-COMP
17
V-ENV
6
P-ON-H
C-POW
-SW
P-ON-H
C-POW-SW
P-DOWN-L
67
66
86 P-DOWN-L
P-OFF-H
73 P-OFF-H
OUTPUT-SELECT
SW506
TO
VIDEO BLOCK
TO
Hi-Fi AUDIO
BLOCK
TO
AUDIO BLOCK
22KEY-1
44
POWER-LED
KEY SWITCH
CL505
D591
CL591
AL+5V
FUNCTION CBA
SDA
SCL
IC502 (MEMORY)
72
32
19
83
IIC-BUS SCL
D-V-SYNC
D-REC-H
INPUT
-SELECT
RF-SW
H-A-SW
C-ROTA
IIC-BUS SDA
H-A-COMP
V-ENV
58
C-SYNC
C-SYNC
OUTPUT-SELECT
IIC-BUS SCL
71
LD-SW
REMOTE-VIDEO
9
AL+5V
AL+5V
SW507
LD-SW
AL+5V
D555
S-LED
TO
POWER
SUPPLY
BLOCK
TP501
Q507
Q502
Q508
D504
Q509
Q511
S-INH
M
CAPSTAN
MOTOR
IC501
(SERVO/SYSTEM CONTROL)
LINE-MUTE
LINE-MUTE
82
5
6
SENSOR CBA
SENSOR CBA
END-S
ST-S
Q504
Q503
REC-SAFETY
END-S
CTL97
FF/REW-L84
Q510
TP503
CTL
74
23
25
29
30
26
POWER
REC
D503
VCR
D502
DVD
TO DVD SYSTEM
CONTROL BLOCK
<DVD SECTION>
TO DVD SYSTEM
CONTROL BLOCK
<DVD SECTION>
KEY
SWITCH
AL+5V
D501
TIMER
CL502
C-FG
C-CONT
D-PFG
C-F/R
90
76
87
78
LM-FWD/REV
81
D-CONT77
AL+20.5V/+12V
AL+12V(2)
P-ON+15V
P-ON+5V
1
AL+20.5V/+12V
2 P-ON+5V
3 C-FG
4
C-F/R
5
C-CONT
6
GND
7
LM-FWD/REV
8
D-CONT
9
D-PFG
10
GND
11
AL+12V(2)
12
P-ON+15V
M
DRV-DATA
DRV-STB
DRV-CLK
68
69
70
DVD-POWER
DRV-DATA
DRV-STB
DRV-CLK
DVD-POWER
21
BLOCK DIAGRAMS
Page 21
IIC-BUS SDA
IIC-BUS SCL
CYLINDER ASSEMBLY
V(R)-1
V-COM
V(L)-1
CL251
1
2
3
Video Block Diagram
1-9-31-9-4H9504BLV
(DECK ASSEMBLY)
VIDEO (R)-1
HEAD
SP
HEAD
AMP
EP
HEAD
AMP
REC FM
AGC
TO SERVO/SYSTEM
CONTROL BLOCK
TO SERVO/SYSTEM
CONTROL BLOCK
RF-SW
D-REC-H
C-ROTA
D-V-SYNC
H-A-SW
H-A-COMP
V-ENV
LUMINANCE
SIGNAL
PROCESS
CHROMINANCE
SIGNAL
PROCESS
V-ENV
H-A-COMP
H-A-SW
D-V-SYNC
RF-SW/C-ROTA
VIDEO (L)-1
HEAD
VIDEO (L)-2
HEAD
VIDEO (R)-2
HEAD
V(L)-2
V-COM
V(R)-2
4
5
6
TU701
IC301
(Y/C SIGNAL PROCESS)
IC501 (OSD)
REC-VIDEO SIGNAL
SERIAL
DECORDER
48
50
52
56
24
6
50
52
19
20
JK101
V-OUT1
V-IN1
61
63
96
95
94
93
90
89
88
87
CHARA.
INS.
CCD 1H DELAY
SP
BYPASS
MUTE
PB/EE
IN1
TUNER
IN1
TUNER
MUTE
PB/EE
FRT
IN2
FRT
IN2
AGC
PR
R
Y
C
P
R P R P
EP
Y. DELAY
Y/C
MIX
+
21
7978
AGCVXO
OSD
CHARACTER
MIX
FBC
1/2
5859
65
2928
6968
4643
84
83
71
62
70
D-REC-H
80
BUFFER
Q104
DVD
VCR
TP751
V-OUT
WF3
TP301
C-PB
WF2
TU-VIDEO
VIDEO
BUFFER
Q301
MAIN CBA
54
TP504
RF-SW
WF1
OUTPUT-SELECT
DVD-VIDEO
TO SERVO
/SYSTEM
CONTROL
BLOCK
TO SERVO/SYSTEM
CONTROL BLOCK
X301
4.43MHz
C-SYNC
C-SYNC 67
IC751 (SW)
4
5
3
11109
SW CTL
Q752
MODE: SP/RECPB-VIDEO SIGNAL DVD VIDEO SIGNAL
INPUT SELECT
V-OUT2
8
V-IN281010
JACK CBA
19
20
JK1402
V-OUT2
V-IN2
CL2017
CL2018
BUFFER
Q103
JK752
V-IN-F
3
IC1404 (SW)
5
4
TO DVD
VIDEO BLOCK
<DVD SECTION>
9
SW CTL
Page 22
1-9-51-9-6H9504BLA
Audio Block Diagram
REC
AMP
100
3
AUTO
BIAS
2
1
+5V
+5V
Q404
Q406
BIAS
OSC
Q403
N-A-PB
TO Hi-Fi
AUDIO BLOCK
N-A-REC
Q401
(PB=ON)
Q405
SWITCHING
D-REC-OFF
5
EQ
AMP
98
7
LINE
AMP
REC-ON
AUDIO HD-SW
CONTROL
MUTE
11
6
PB-ON
SP/LP-ON
P
TUNERIN2
IN1
R
ALC
DET
ALC
IC301
(AUDIO SIGNAL PROCESS)151317
4 A-PB/REC
CL504
3 A-COM
1 AE-H
2 AE-H/FE-H
A-PB/REC 4
A-COM 3
AE-H 1
AE-H/FE-H 2
CL287
AUDIO
HEAD
AUDIO
ERASE
HEAD
ACE HEAD ASSEMBLY
FE HEAD
2 FE-H
1 FE-H-GND
CL501
MAIN CBA
PB-AUDIO SIGNALREC-AUDIO SIGNALMode : SP/REC
71
A-MUTE-H
IIC-BUS SCL
IIC-BUS SDATO SERVO/SYSTEM
CONTROL BLOCK
FULL
ERASE
HEAD
68 69
SERIAL
DECODER
(DECK ASSEMBLY)
12
16
INV
ATT
Page 23
1-9-71-9-8H9504BLH
Hi-Fi Audio Block Diagram
48
47
61 71
62 70
14
15
78
R-CH
INSEL
L-CH
INSEL
IF SINAL
PROCESS
NOR
SW
SERIAL
DATA
DECODER
OUTPUT
SELECT
VCO
LPF
L-CH
BPF
R-CH
PNR
L-CH
PNR
LIMDEV
COMP
SW
NOISE
VCO
LPF
LIMDEV
COMP
COMP
SW
NOISE
ENV
DET
DO
DET
MIX
R-CH
BPF
P
R
R
L
P
R
HOLD
PULSE
NOISE
DET
34 33
21
76
77
74
37
38
39
75
73
26
53
24
27
N-A-REC
LIM
80
N-A-PB
Hi-Fi-H-SW
LINE-MUTE
A-MODE
TO AUDIO BLOCK
IIC-BUS SDA
IIC-BUS SCL
TO
SERVO/ SYSTEM
CONTROL BLOCK
Hi-Fi
AUDIO
(R)
HEAD
Hi-Fi
AUDIO
(L)
HEAD
CYLINDER
ASSEMBLY
MAIN CBA
Hi-Fi-A(R) 7
Hi-Fi-COM 8
Hi-Fi-A(L) 9
CL251
IC451 (MTS/ SAP/ Hi-Fi AUDIO PROCESS/ Hi-Fi HEAD AMP)
REC-AUDIO SIGNALPB-AUDIO SIGNALMode : SP/REC
DVD AUDIO SIGNAL
AFV CBA
JK101
A-OUT1(R)
A-OUT1(L)
2
6
2
6
1
3
1
3
JK1402
A-IN2(R)
A-IN2(L)
A-IN1(R)
A-IN1(L)
A-OUT2(R)
A-OUT2(L)
TU-AUDIO(R)
4
TU-AUDIO(L)
5
4
5
CN701CN1CN701CN1
TU701
SIF
AUDIO
22
2
ALC
SW
SW
ALC
67
65
Q451
MUTE-ON
MUTE-ON
REAR
JK751
A-OUT(R)
A-OUT(L)
JK754
A-IN(R)-F
JK753
A-IN(L)-F
IC751 (SW)
13
12
14
15
1
2
11109
SW CTL
BUFFER
BUFFER
Q107
Q108
Q752
VCR
DVD
VCR
DVD
OUTPUT-SELECT
DVD-A(R)
DVD-A(L)
TO DVD AUDIO
BLOCK
<DVD SECTION>
TO SERVO
/SYSTEM
CONTROL
BLOCK
50
60
58
2
52
56
6
10
4
12
54
8
JACK CBA
A-IN2(R)
4
A-IN2(L)
5
4
5
A-OUT2(R)
1
A-OUT2(L)
2
1
2
CL2017CL2018
(DECK ASSEMBLY)
SIF
2
2
Page 24
1-9-91-9-10H9504BLP
Power Supply Block Diagram
CAUTION
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,
REPLACE ONLY WITH THE SAME TYPE T1.6AL/250V FUSE.
NOTE :
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
CAUTION !
Fixed voltage (or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
TO SERVO/SYSTEM
CONTROL BLOCK
DIAGRAM
<VCR SECTION>
DVD-POWER
TO SERVO/SYSTEM
CONTROL BLOCK
DIAGRAM
<VCR SECTION>
CN302CN2014
PLAY1
1
STOP2
2
POWER3
3
OPEN/CLOSE
PLAY
STOP
POWER
OPEN/CLOSE
4
4
Q1505
SW2020
CL2015CL2016
OPEN/CLOSE
2 GND
2
1
OPEN/CLOSE
1
DVD OPEN/CLOSE CBA
SW2021
STOP
SW2022
PLAY
48
47
61
94
FS(+) 18
FS(-) 19
TS(+) 20
TS(-) 17
CN201
FSTS
PICK-UP
UNIT
EV+3.3V
Page 26
1-9-131-9-14H9504BLD
Digital Signal Process Block Diagram
C 6
D 7
A 8
B 5
F 10
E 2
DVD-LD 14
CD-LD 12
PD-MONI 13
CN201
CN201
IC201
(SW)
IC105 (LATCH)
IC102 (SDRAM)IC101 (MICRO CONTROLLER)
CD/DVD
PICK-UP
UNIT
DETECTOR
CD/DVD 9
Q251,Q252
CDDVD
AMP
Q253,Q254
AMP
4
1 3
6
GND(DVD-PD)
15
GND(CD-PD)
16
GND(LD)
11
RF
SIGNAL
PROCESS
CIRCUIT
DVD/CD
FORMATTER
AUDIO
I/F
VIDEO
I/F
NTSC/PAL
ENCODER
DMA
BCU
INST.
ROM
32BIT
CPU
DATA
ROM
INTERRUPT
CONTROLLER
WATCH DOG
TIMER
CPU
I/F
TIMER
DECODER
I/F
CPU
I/F
READ
MEMORY
DATA
ROM
DSP
DECODER
PIXEL
OPERATION
I/O
PROCESSOR
INST.
ROM
DATA
ROM
INST.
ROM
DATA
ROM
INST.
ROM
SERIAL
D/A
GENERAL
I/O
INTERRUPT
CONTROLLER
TIMER
WATCH DOG
TIMER
32BIT CPU
STREAM
I/F
EXTERNAL
MEMORY
I/F
SDRAM
ECC
UMAC
124
125
122
123
128
129
126
127
131
130
135
133
132
134
78
DEBUG
BCU
INST
CACHE
D TYPE
LATCH
DATA
CACHE
D/A
D/A
D/A
TO DVD
VIDEO
/AUDIO
BLOCK
DIAGRAM
163
164
Y
C
R
G
VIDEO-Y
VIDEO-C
VIDEO-R
VIDEO-G
TO DVD
VIDEO
/AUDIO
BLOCK
DIAGRAM
181
SPDIF
175
PCM-BCK
176
PCM-DATA0
174
PCM-LRCLK
161
158
EXT ADT (0-15), EXT ADR (16-19)
EXT ADT (0-15), EXT ADR (16-19)
EXT ADT (0-7)
EXT ADT (8-15)
EXT ADR (0-7)
EXT ADR (0-15)
EXT ADR (8-15)
SDRAM DATA(0-31)SDRAM DATA(0-31)
SDRAM ADDRESS(0-10)SDRAM ADDRESS(0-10)
2
9
~
12
19
~
210
235
~
IC104 (LATCH)
D TYPE
LATCH
2
9
~
12
19
~
2
13
184
205
247
256
~~~
2
13
31
56
74
85
~~~
IC103 (FLASH ROM)
FLASH
ROM
29
36
38
45
~~
DVD MAIN CBA UNIT
DATA(VIDEO/AUDIO) SIGNALDVD VIDEO SIGNAL
DATA(AUDIO) SIGNAL
24
27
60
66
~~
EXT ADT (0-15)
EXT ADR (16-19)
~
1
9
16
25
48
~
D/A
B
VIDEO-B
160
Page 27
1-9-151-9-16H9504BLVD
DVD Video / Audio Block Diagram
IC601 (AUDIO DAC)
7
8
12
11
DIGITAL
AUDIO OUT
JK1202
BUFFER
Q1351
IC1201
Q1203
Q1201
Q1202
VREF
+3.3V
(AMP)
CN601CN1601
1313DVD-A(L)
1515DVD-A(R)
1414
DVD-A(L)-MUTE
1616
DVD-A(R)-MUTE
1212
DVD-A-MUTE
1
2
3
13
14
15
16
TO DVD
SYSTEM
CONTROL
/SERVO
BLOCK
DIAGRAM
TO
DIGITAL
SIGNAL
PROCESS
BLOCK
DIAGRAM
SERIAL
PORT
SERIAL
CONTROL
4X/8X
OVERSAMPLING
DIGITAL FILTER
/FUNCTION
CONTROLLER
ENPHANCED
MULTI-LEVEL
DELTA-SIGMA
MODULATOR
DAC
LPF+AMP
L-CH
R-CH
LPF+AMP
DAC
ZERO DETECT
SYSTEM CLOCK
1
2
6
7
5
DVD-A(L)
DVD-A(R)
PCM-BCK
SPDIF
PCM-DATA0
PCM-LRCLK
ADAC-MD
ADAC-MC
ADAC-ML
PCM-SCLK
MAIN CBADVD MAIN CBA UNIT
DVD AUDIO SIGNALDATA(AUDIO) SIGNAL
1818SPDIF
A-MUTE
+3.3V
Q1204
WF9
3
WF7
WF8
CN601
11VIDEO-Y
99VIDEO-C
33VIDEO-R
77VIDEO-G
55VIDEO-B
VIDEO-Y
VIDEO-C
VIDEO-R
VIDEO-G
JK1401
S-VIDEO OUT
CN1601
34
2
1
IC1402 (VIDEO DRIVER)
28
4dB
AMP
2dB
AMP
LPFDRIVER
Y
C
31
2dB
AMP
DRIVER
4dB
AMP
2dB
AMP
LPFDRIVER
22
4dB
AMP
2dB
AMP
LPFDRIVER
14
19
4dB
AMP
2dB
AMP
LPFDRIVER
16
6
2
33
TO DIGITAL
SIGNAL PROCESS
BLOCK DIAGRAM
DVD VIDEO SIGNAL
WF4
WF5
WF6
25
4dB
AMP
2dB
AMP
LPFDRIVER
12
VIDEO-B
TO
AUDIO
BLOCK
DIAGRAM
<VCR
SECTION>
DVD-VIDEO
TO VIDEO
BLOCK DIAGRAM
<VCR SECTION>
11
15
7
JK101
DVD-G
DVD-R
DVD-B
FIBER OPTIC
TRANS MODULE
3
IC1204
Page 28
SCHEMATIC DIAGRAMS / CBA’S AND TEST POINTS
Standard Notes
WARNING
Many electrical and mechanical parts in this chassis
have special characteristics. These characteristics
often pass unnoticed and the protection afforded by
them cannot necessarily be obtained by using replacement components rated for higher voltage, wattage,
etc. Replacement parts that have these special safety
characteristics are identified in this manual and its
supplements; electrical components having such features are identified by the mark " ! " in the schematic
diagram and the parts list. Before replacing any of
these components, read the parts list in this manual
carefully. The use of substitute replacement parts that
do not have the same safety characteristics as specified in the parts list may create shock, fire, or other
hazards.
Notes:
1. Do not use the part number shown on these drawings for ordering. The correct part number is shown
in the parts list, and may be slightly different or
amended since these drawings were prepared.
2. All resistance values are indicated in ohms
3
(K=10
3. Resistor wattages are 1/4W or 1/6W unless otherwise specified.
4. All capacitance values are indicated in µF
(P=10
5. All voltages are DC voltages unless otherwise
specified.
6. Electrical parts such as capacitors, connectors,
diodes, IC’s, transistors, resistors, switches, and
fuses are identified by four digits. The first two digits are not shown for each component. In each
block of the diagram, there is a note such as shown
below to indicate these abbreviated two digits.
, M=106).
-6
µF).
1-10-1SCPA1
Page 29
LIST OF CAUTION, NOTES, AND SYMBOLS USED IN THE SCHEMATIC DIAGRAMS ON THE FOLLOWING
PAG ES :
1. CAUTION:
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH THE SAME TYPE FUSE.
2. CAUTION:
Fixed Voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown, first check to see that all components in the power supply circuit are not defective before you connect the AC plug to the AC power supply. Otherwise it may cause some components in the
power supply circuit to fail.
3. Note:
(1) Do not use the part number shown on the drawings for ordering. The correct part number is shown in the parts
list, and may be slightly different or amended since the drawings were prepared.
(2) To maintain original function and reliability of repaired units, use only original replacement parts which are listed
with their part numbers in the parts list section of the service manual.
4. Wire Connectors
(1) Prefix symbol "CN" means "connector" (can disconnect and reconnect).
(2) Prefix symbol "CL" means "wire-solder holes of the PCB" (wire is soldered directly).
5. Voltage indications for PLAY and REC modes on the schematics are as shown below:
< DVD Section >
231
5.0
The same voltage for
both PLAY & STOP modes
Indicates that the voltage
is not consistent here.
6. How to read converged lines
1-D3
Distinction Area
Line Number
(1 to 3 digits)
Examples:
1. "1-D3" means that line number "1" goes to area "D3".
2. "1-B1" means that line number "1" goes to area "B1".
7. Test Point Information
: Indicates a test point with a jumper wire across a hole in the PCB.
: Used to indicate a test point with a component lead on foil side.
: Used to indicate a test point with no test pin.
5.0
(2.5)
PLAY mode
STOP mode
< VCR Section >
5.0
The same voltage for
both PLAY, REC & DVD
modes
5.0
(2.5)
< >
PLAY mode
REC mode
DVD mode
231
Indicates that the voltage
is not consistent here.
3
2
1
ABCD
Unit: Volts
1-B1
AREA D3
AREA B1
1-D3
: Used to indicate a test point with a test pin.
1-10-2SCRK05
Page 30
Main 1/9 Schematic Diagram < VCR Section >
1-10-3
1-10-4
H9504SCM1
Page 31
Main 2/9 & Sensor Schematic Diagram < VCR Section >
1-10-5
1-10-6
H9504SCM2
Note:
When it is necessary to replace one or more of the following Diodes,
all one should be replaced: D501, D502, D503, D504.
*
1
Page 32
1-10-7
1-10-8
H9504SCM3
Main 3/9 Schematic Diagram < VCR Section >
Page 33
Main 4/9 Schematic Diagram < VCR Section >
1-10-9
1-10-10
H9504SCM4
Page 34
Main 5/9 Schematic Diagram < VCR Section >
1-10-11
1-10-12
H9504SCM5
Page 35
Main 6/9 Schematic Diagram < VCR Section >
1-10-13
1-10-14
H9504SCM6
Page 36
Main 7/9 Schematic Diagram < VCR Section >
1-10-15
1-10-16
H9504SCM7
Page 37
Main 8/9 & DVD Open/ Close Schematic Diagram < VCR Section >
1-10-17
1-10-18
H9504SCM8
Page 38
1-10-191-10-20
Main 9/9 Schematic Diagram < VCR Section >
H9504SCM9
Page 39
1-10-211-10-22
Power Supply & Junction Schematic Diagram < VCR Section >
H9504SCP
NOTE :
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
CAUTION !
Fixed voltage ( or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
Page 40
1-10-23
1-10-24
Jack Schematic Diagram < VCR Section >
H9504SCJ
Page 41
1-10-251-10-26
Function Schematic Diagram < VCR Section >
H9504SCF
Page 42
1-10-27
1-10-28
AFV Schematic Diagram < VCR Section >
H9504SCAFV
Page 43
Main CBA Top View & Sensor CBA Top View
SW-P
VR501
CTL
TP503
V-OUT
TP751
WF3
C-PB
TP301
WF2
RF-SW
TP504
WF1
S-INH
TP501
1-10-29
BH9510F01014A
BHB300F01014-A
BHB300F01014-B
1-10-30
Sensor CBA Top View
Page 44
1-10-31
Main CBA Bottom View
BH9510F01014A
1-10-32
Page 45
1-10-33
Function CBA Top View
BH9510F01014B
1-10-34
Function CBA Bottom View
BH9510F01014C
DVD OPEN/CLOSE CBA Top ViewDVD OPEN /CLOSE CBA Bottom View
Page 46
Junction CBA Top ViewJunction CBA Bottom View
1-10-35
Power Supply CBA Top View
BH9510F01022A
Power Supply CBA Bottom View
BH9510F01022B
BECAUSE A HOT CHASSIS GROUND IS PRESENT IN THE POWER
SUPPLY CIRCUIT , AN ISOLATION TRANSFORMER MUST BE USED.
ALSO , IN ORDER TO HAVE THE ABILITY TO INCREASE THE INPUT
SLOWLY , WHEN TROUBLESHOOTING THIS TYPE POWER SUPPLY
CIRCUIT , A VARIABLE ISOLATION TRANSFORMER IS REQUIRED.
CAUTION !
Fixed voltage ( or Auto voltage selectable ) power supply circuit is used in this unit.
If Main Fuse (F1001) is blown, check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
NOTE :
The voltage for parts in hot circuit is measured
using hot GND as a common terminal.
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
1-10-36
Page 47
1-10-37
1-10-38
Jack CBA Top ViewJack CBA Bottom View
AFV CBA Top ViewAFV CBA Bottom View
BHC400F01092
BH9510F01022C
Page 48
DVD Main 1/3 Schematic Diagram < DVD Section >
H9504SCD1
1-10-391-10-40
Page 49
1-10-41
1-10-42
DVD Main 2/3 Schematic Diagram < DVD Section >
H9504SCD2
Page 50
1-10-431-10-44
PIN.NO PLAY STOP PIN.NO PLAY STOP PIN.NO PLAY STOP PIN.NO PLAY STOP
1.Clean all parts for the tape transport (Upper Drum with Video Head / Pinch Roller / Audio Control Head / Full
Erase Head) using 90% lsopropyl Alcohol.
2.After cleaning the parts, do all DECK ADJUSTMENTS.
3.For the reference numbers listed above, refer to Deck Exploded Views.
* B73 ------ Recording model only
* B86 ------ Not used in 2 head model.
M Brake (TU) Assembly (HI)
LDG Belt
II
II
2-1-1U27MENHS
Page 62
Cleaning
Cleaning of Video Head
Clean the head with a head cleaning stick or chamois
cloth.
Procedure
1.Remove the top cabinet.
2.Put on a glove (thin type) to avoid touching the
upper and lower drum with your bare hand.
3.Put a few drops of 90% Isopropyl alcohol on the
head cleaning stick or on the chamois cloth and,
by slightly pressing it against the head tip, turn the
upper drum to the right and to the left.
Notes:
1.The video head surface is made of very hard
material, but since it is very thin, avoid cleaning it
vertically.
2.Wait for the cleaned part to dry thoroughly before
operating the unit.
3.Do not reuse a stained head cleaning stick or a
stained chamois cloth.
Cleaning of Audio Control Head
Clean the head with a cotton swab.
Procedure
1.Remove the top cabinet.
2.Dip the cotton swab in 90% isopropyl alcohol and
clean the audio control head. Be careful not to
damage the upper drum and other tape running
parts.
Notes:
1.Avoid cleaning the audio control head vertically.
2.Wait for the cleaned part to dry thoroughly before
operating the unit or damage may occur.
ACE Head
Upper
Cylinder
Do Not !
Video Head
Do Not touch
with your bare
hand!
Cleaning Stick
2-1-2U27MENHS
Page 63
SERVICE FIXTURE AND TOOLS
J-1-1, J-1-2
J-3
J-2
J-4
J-5
Ref. No. NamePart No.Adjustment
J-1-1Alignment TapeFL6AHead Adjustment of Audio Control Head
J-1-2Alignment TapeFL6N8
J-2Guide Roller Adj.ScrewdriverAvailable
J-3MirrorAvailable
J-4Azimuth Adj.Screwdriver +Available
J-5X Value Adj.Screwdriver -Available
(1 speed only)
FL6NS8
(2 speed only)
Locally
Locally
Locally
Locally
2-2-1U25PFIX
Azimuth and X Value Adjustment of Audio Control
Head / Adjustment of Envelope Waveform
Guide Roller
Tape Transportation Check
A/C Head Height
X Value
Page 64
MECHANICAL ALIGNMENT PROCEDURES
Explanation of alignment for the tape to correctly run
starts on the next page. Refer to the information below
on this page if a tape gets stuck, for example, in the
mechanism due to some electrical trouble of the unit.
4-4-1 Service Information
A. Method for Manual Tape Loading/Unloading
To load a cassette tape manually:
1. Disconnect the AC plug.
2. Remove the Top Case and Front Assembly.
3. Inser t a cassette tape. Though the tape will not be
automatically loaded, make sure that the cassette
tape is all the way in at the inlet of the Cassette
Holder. To confirm this, lightly push the cassette
tape further in and see if the tape comes back out,
by a spring motion, just as much as you have
pushed in.
4. Turn the LDG Belt in the appropriate direction
shown in Fig. M1 for a minute or two to complete
this task.
To unload a cassette tape manually:
1. Disconnect the AC plug.
2. Remove the Top Case and Front Assembly.
3. Make sure that the Moving guide preparations are
in the Eject Position.
4. Turn the LDG Belt in the appropriate direction
shown in Fig. M1 until the Moving guide preparations come to the Eject Position. Stop turning when
the preparations begin clicking or can not be
moved further. However, the tape will be left
wound around the cylinder.
5. Turn the LDG Belt in the appropriate direction continuously, and the cassette tape will be ejected.
Allow a minute or two to complete this task.
B. Method to place the Cassette Holder in the tape-
loaded position without a cassette tape
1. Disconnect the AC Plug.
2. Remove the Top Case and Front Assembly.
3. Turn the LDG Belt in the appropriate direction
shown in Fig. M1. Release the locking tabs shown
in Fig. M1 and continue turning the LDG Belt until
the Cassette Holder comes to the tape-loaded
position. Allow a minute or two to complete this
task.
Top View
Moving guide T preparation
(Eject Position)
Moving guide S preparation
(Eject Position)
Push the tape
to load it.
Push the locking tab gently to unlock
when loading without a cassette.
UNLOAD
/EJECT
LOAD
Side View
LDG Belt
Fig. M1
Bottom View
LDG Belt (B)
UNLOAD
/EJECT
Cam Gear
Fig. M2
2-3-1H9500MA
Page 65
1.Tape Interchangeability Alignment
Note:
To do these alignment procedures, make sure that the
Tracking Control Circuit is set to the center position
every time a tape is loaded or unloaded. (Refer to
page 2-3-4, procedure 1-C, step 2.)
Note: Before starting this Mechanical Alignment, do all
Electrical Adjustment procedures.
Flowchart of Alignment for tape traveling
Loading (Use a blank tape.)
Adjust the height of the Guide Rollers
(Supply side and take-up side).
(Use a blank tape.) (pg. 2-3-3)
1-A
Not good
Check to see that the tape is not creasing
and that there is no slack on the supply
and take-up side Guide Rollers.
(Use a blank tape.)
1-A
Adjust the X Value for maximum envelope.
(pg. 2-3-3) (Use Alignment Tape.)
Adjust the envelope. (pg. 2-3-4)
Check the envelope.
1-B
1-C
1-C
OK
Adjust the Audio Section.
(Azimuth Alignment) (pg. 2-3-4)
Check the audio output.
1-D
1-D
OK
Not good
Not good
Do the final tape-traveling test to see that
the tape runs normally in play mode without creasing or slacking.
1-A
OK
Completion
Check the following:
1. X Value (pg. 2-3-3)
2. Envelope (pg. 2-3-4)
OK
1-B, 1-C
Not good
2-3-2H9500MA
Adjust the X value and envelope.
1-B, 1-C
Page 66
1-A. Preliminary/Final Checking and
Alignment of Tape Path
Purpose:
To make sure that the tape path is well stabilized.
Symptom of Misalignment:
If the tape path is unstable, the tape will be damaged.
Note: Do not use an Alignment Tape for this procedure. If the unit is not correctly aligned, the tape may
be damaged.
1. Playback a blank cassette tape and check to see
that the tape runs without creasing at Guide Rollers
[2] and [3], and at points A and B on the lead surface. (Refer to Fig M3 and M4.)
2. If creasing is apparent, align the height of the guide
rollers by turning the top of Guide Rollers [2] and
[3] with a Guide Roller Adj. Screwdriver. (Refer to
Fig. M3 and M5.)
Guide Roller [2]
A
Take-up Guide Post [4]
Lead Surface of Cylinder
Correct
Guide Roller
Tape
Guide Roller [3]
B
Tape
Incorrect
AC Head
Fig. M3
Fig. M4
3. Check to see that the tape runs without creasing at
Take-up Guide Post [4] or without snaking between
Guide Roller [3] and AC Head. (Fig. M3 and M5)
4. If creasing or snaking is apparent, adjust the Tilt
Adj. Screw of the AC Head. (Fig. M6)
Azimuth Adj. Screw
AC Head
X-Value Adj.
Screwdriver
Tilt Adj. Screw
Fig. M6
1-B. X Value Alignment
Purpose:
To align the Horizontal Position of the Audio/Control/
Erase Head.
Symptom of Misalignment:
If the Horizontal Position of the Audio/Control/Erase
Head is not properly aligned, maximum envelope cannot be obtained at the Neutral position of the Tracking
Control Circuit.
1. Connect the oscilloscope to TP301 (C-PB) and
TP503 (CTL) on the Main CBA. Use TP504 (RFSW) as a trigger.
2. Playback the Gray Scale of the Alignment Tape
(FL6NS8) and confirm that the PB FM signal is
present.
3. Set the Tracking Control Circuit to the center position by pressing CH UP button then “ PLAY ” button
on the unit. (Refer to note on bottom of page
2-3-4.)
4. Use the X-Value Adj. Screwdriver so that the PB
FM signal at TP301 (C-PB) is maximum. (Fig. M6)
5. Press CH UP button on the unit until the CTL waveform has shifted by approx. +2msec. Make sure
that the envelope is simply attenuated (shrinks in
height) during this process so that you will know
the envelope has been at its peak.
Take-up Guide
Post
Tape
Fig. M5
2-3-3H9500MA
Page 67
6. Press CH DOWN button on the unit until the CTL
waveform has shifted from its original position (not
the position achieved in step 5, but the position of
CTL waveform in step 4) by approximately -2msec.
Make sure that the envelope is simply attenuated
(shrinks in height) once CTL waveform passes its
original position and is further brought in the minus
direction.
7. Set the Tracking Control Circuit to the center position by pressing CH UP button and then “ PLAY ”
button.
1-C. Checking/Adjustment of Envelope
Waveform
Purpose:
To achieve a satisfactory picture and precise tracking.
Symptom of Misalignment:
If the envelope output is poor, noise will appear in the
picture. The tracking will then lose precision and the
playback picture will be distorted by any slight variation of the Tracking Control Circuit.
1. Connect the oscilloscope to TP301 (C-PB) on the
Main CBA. Use TP504 (RF-SW) as a trigger.
2. Playback the Gray Scale on the Alignment Tape
(FL6NS8). Set the Tracking Control Circuit to the
center position by pressing CH UP button and then
“ PLAY ” button on the unit. Adjust the height of
Guide Rollers [2] and [3] (Fig. M3, Page 2-3-3)
watching the oscilloscope display so that the envelope becomes as flat as possible. To do this adjustment, turn the top of the Guide Roller with the
Guide Roller Adj. Screwdriver.
3. If the envelope is as shown in Fig. M7, adjust the
height of Guide Roller [2] (Refer to Fig. M3) so that
the waveform looks like the one shown in Fig. M9.
4. If the envelope is as shown in Fig. M8, adjust the
height of Guide Roller [3] (Refer to Fig. M3) so that
the waveform looks like the one shown in Fig. M9.
5. When Guide Rollers [2] and [3] (Refer to Fig.M3)
are aligned properly, there is no envelope drop
either at the beginning or end of track as shown in
Fig. M9.
Dropping envelope level at the beginning of track.
Dropping envelope level at the end of track.
Fig. M8
Envelope is adjusted properly. (No envelope drop)
Fig. M9
Note: Upon completion of the adjustment of Guide
Rollers [2] and [3] (Refer to Fig. M3), check the X
Value by pushing the CH UP or DOWN buttons alternately, to check the symmetry of the envelope. Check
the number of pushes to ensure center position. The
number of pushes CH UP button to achieve 1/2 level
of envelope should match the number of pushes CH
DOWN button from center. If required, redo the “X
Value Alignment.”
1-D. Azimuth Alignment of Audio/Control/
Erase Head
Purpose:
To correct the Azimuth alignment so that the Audio/
Control/Erase Head meets tape tracks properly.
Symptom of Misalignment:
If the position of the Audio/Control/Erase Head is not
properly aligned, the Audio S/N Ratio or Frequency
Response will be poor.
1. Connect the oscilloscope to the audio output jack
on the rear side of the deck.
2. Playback the alignment tape (FL6NS8) and confirm
that the audio signal output level is 8kHz.
3. Adjust Azimuth Adj. Screw so that the output level
on the AC Voltmeter or the waveform on the oscilloscope is at maximum. (Fig. M6)
Fig. M7
2-3-4H9500MA
Page 68
DISASSEMBLY/ASSEMBLY PROCEDURES
OF DECK MECHANISM
Before following the procedures described below, be sure to remove the deck assembly from the cabinet. (Refer to
CABINET DISASSEMBLY INSTRUCTIONS on page 1-6-1.)
All the following procedures, including those for adjustment and replacement of parts, should be done in Eject
mode; see the positions of [44] and [45] in Fig. DM1 on page 2-4-3. When reassembling, follow the steps in reverse
order.
First, while pushing the locking tab as
shown in the right, slide and pull up the right
side on [2] to release Pin A and Pin B from
the slots A.
Then, remove Pin C and Pin D on [2] from
the slots B as shown.
[2]
Pin A
Locking tab
2
Pull up
A
1
Slide
Pin B
Slot A
Slot A
View for A
Fig. DM4
Desolder
from bottom
(S-2)
View for A
[50]
(L-12)
A
Lead with
Red Stripe
Fig. DM6
2-4-4H9500DA
Page 72
[9]
A
(S-4)
[8]
[14]
(S-5)
(S-6)
[15]
(S-3)
Adj. Screw
[13]
LDG
Belt
Desolder
from bottom
Lead with White Stripe
View for A
[8]
Fig. DM7
[11]
(L-4)
(P-3)
[12]
[10]
Fig. DM9
[17]
(L-5)
[16]
[18]
(P-4)
(P-2)
Pin of [12]
View for A
Pin of [10]
Groove of [27]
[27]
A
(S-7)
Fig. DM10
When reassembling [10] and
[12], confirm that pin of [10]
and pin of [12] are in the
groove of [27] as shown.
Fig. DM8
2-4-5H9500DA
Page 73
Cap Belt
[19]
(S-8)
Fig. DM11
[24]
[27]
(S-9)
(L-8)
(C-4)
(C-5)
[28]
[29]
[30]
[26]
(L-7)
(C-3)
[23]
(C-2)
[25]
[22]
turn
(L-6)
(C-1)
[20]
[21]
Pin on [22]
[31]
Position of Mode Lever when installed
Pin of [36]
Bottom View
[27]
Pin of [33]
Align [26] and [27] as shown.
First groove on [27]
Pin of [37]
First tooth on [44]
[26]
Position of pin on [22]
[27]
Fig. DM12
[27]
When reassembling [27],
meet the first groove on
[27] to the first tooth on
Top View
[44] as shown.
Fig. DM13
2-4-6H9500DA
Page 74
[33]
(P-5)
[32]
(L-9)
Refer to the Alignment
Section, Page 2-4-8.
[35]
[34]
Fig. DM14
[44]
[45]
[46]
(L-11)
Fig. DM16
(P-6)
[37]
(C-7)
[41]
[39]
turn
(C-6)
[40]
turn
[43]
(L-10)
[42]
[38]
[36]
turn
[48]
[47]
Slide
Fig. DM17
Fig. DM15
2-4-7H9500DA
Page 75
ALIGNMENT PROCEDURES OF MECHANISM
The following procedures describe how to align the
individual gears and levers that make up the tape loading/unloading mechanism. Since information about the
state of the mechanism is provided to the System
Control Circuit only through the Mode Switch, it is
essential that the correct relationship between individual gears and levers be maintained.
All alignments are to be performed with the mechanism in Eject mode, in the sequence given. Each
procedure assumes that all previous procedures have
been completed.
IMPORTANT:
If any one of these alignments is not performed properly, even if off by only one tooth, the unit will unload or
stop and it may result in damage to the mechanical or
electrical parts.
Alignment points in Eject Position
Top View
Alignment 3
Alignment 1
Loading Arm (SP) and (TU) Assembly
Install Loading Arm (SP) and (TU) Assembly so that
their triangle marks point to each other as shown in
Fig. AL2.
Alignment 2
Mode Gear
Keeping the two triangles pointing at each other, install
the Loading Arm (SP) Assembly so that the last tooth
of the gear meets the most inside teeth of the Mode
Gear. See Fig. AL2.
Alignment 1
Triangle Marks
Loading Arm
(SP) Assembly
Last Tooth
Alignment 2
Loading Arm
(TU) Assembly
Most inside teeth
of Mode Gear
Mode Gear
Fig. AL2
Bottom View
Alignment 1
Alignment 2
Fig. AL1
Alignment 3
Cam Gear (A) (HI), Rack Assembly
Install the Rack Assembly so that the first tooth on the
gear of the Rack Assembly meets the first groove on
the Cam Gear (A) (HI) as shown in Fig. AL3.
See Electrical Parts List
for parts with this mark.
Some Ref. Numbers are
not in sequence.
2B15
2B15
2B46
JW001
JW002
JW003
JW009
JW007
2B13
1B1
2L071
2L071
2L071
2L071
2L071
C'
A'
B'
2B9
A11
2L033
JW008
Sensor CBA
AFV CBA
Sensor CBA
DVD Open/Close CBA
2B6
RM2001
F1001
Power Supply CBA
Junction CBA
2L052
2L031
2L031
2L052
2B40
JW006
JW005
2B33
2L053
2L053
2B33
Jack CBA
2L035
2B53
2B54
A1X
2L034
EXPLODED VIEWS
Cabinet
3-1-13-1-2H9504CEX
Page 78
Packing
Some Ref. Numbers
are not in sequence.
X5
S7
S2
X20DX20CX20BX20A
X1
X3
X2
X4
S2
S3
Unit
A14
S1
3-1-3H9504PEX
Page 79
DECK EXPLODED VIEWS
Deck Mechanism View 1
B2
B9
L1191
B73
B10
L1053
B411
B567
L1467
B494
MarkDescription
Floil G-684G or Multemp MH-D
SLIDUS OIL #150
B35
B553
(Blue grease)
B11
B12
B571
L1450
B492
B74
L1051
B37
B410
L1450
B121
B8
Chassis Assembly
Top View (Lubricating Point)
B501
L1466
B126
B86
Some Ref. Numbers are not in sequence.
Chassis Assembly
Bottom View (Lubricating Point)
3-1-4H9504DEX
Page 80
Deck Mechanism View 2
B487
B587
B416
B521
B591
MarkDescription
Floil G-684G or Multemp MH-D
SLIDUS OIL #150
SANKOUL FG84M
(Yellow grease)
(Blue grease)
B508
B414
B572
B565
B499
B417
B568
B573
B585
B574
B518
B564
B590
B148
B592
B31
B522
L1151
L1406
B3
B558
B557
B525
B578
B579
B582
B580
B583
B579
View
for A
Some Ref. Numbers are not in sequence.
A
B581
B559
B516
B133
B52
B551
B507
B488
B491
B513
Bottom Side (Grease point)
Bottom Side
(Grease point)
3-1-5H9504DEX
Page 81
Deck Mechanism View 3
L1321
B355
L1341
B347
B482
MarkDescription
Floil G-684G or Multemp MH-D
SLIDUS OIL #150
L1321
B354
B483
B425
(Blue grease)
B562
B563
B300
B313
B529
B360
B359
B361
B555
Some Ref. Numbers are not in sequence.
B303
B514
3-1-6H9504DEX
Page 82
MECHANICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a !
have special characteristics important to safety. Before
replacing any of these components, read carefully the
product safety notice in this service manual. Don't
degrade the safety of the product through improper servicing.
Ref. No.DescriptionPart No.
A1XFRONT ASSEMBLY H9504ED0VM204649
A2TOP COVER H9400UD0VM101208
A3CHASSIS(E4+U27) H9400UD0VM101207A
A4PANEL, REAR H9510ED0VM204130
A10!LABEL, RATING(U) H9504ED or----------
!LABEL, RATING(D) H9504ED----------
A11LABEL, RESET H9300ED----------
A14LABEL, SERIAL NO. HE240ED or----------
LABEL, BAR CODE H9504ED----------
A20PANEL, TRAY H9407JD0VM415151
1B1DECK ASSEMBLY CZD012/VM17E0N17E0FL
1B2DVD MECHA 0838 VCDVM040N79F0GVM
2B1DECK PEDESTAL-1 H9400UD0VM101201A-1
2B2TOP BRACKET H9100UD0VM203252A
2B3SIDE BRACKET H9100UD0VM305013
2B6DECK PEDESTAL-2 H9400UD0VM101201A-2
2B7DECK PEDESTAL-3 H9400UD0VM101201A-3
2B9TAPE, HIMELON(40*20) H9500ED0VM415545
2B16TAPE, HIMELON H9206JD0VM413956
2B18FIBER, TOP CASE HC460ED0VM412906
2B40INSULATOR H9500ED0VM306050
2L011SCREW, S-TIGHT M3X8 BIND + CHROMEGBMS3080
2L012SCREW, S-TIGHT M3X8 BIND + CHROMEGBMS3080
2L021SCREW, S-TIGHT M3X26 H9400UD0VM414507
2L031SCREW, S-TIGHT M3X5 BIND HEAD+GBMS3050
2L032SCREW, S-TIGHT M3X5 BIND HEAD+GBMS3050
2L033SCREW, S-TIGHT M3X5 BIND HEAD+GBMS3050
2L034SCREW, S-TIGHT M3X6 BIND HEAD+GBMS3060
2L035SCREW, S-TIGHT M3X5 BIND HEAD+GBMS3050
2L041SCREW, C-TIGHT M3X5 BIND HEAD +GBCC3050
2L051SCREW, P-TIGHT M3X6 BIND HEAD+GBMP3060
2L052SCREW, P-TIGHT M3X6 BIND HEAD+GBMP3060
2L054SCREW, P-TIGHT M3X6 BIND HEAD+GBMP3060
2L061SCREW, B-TIGHT M3X8 BIND HEAD +GBKB3080
2L062SCREW, B-TIGHT M3X8 BIND HEAD +GBKB3080
2L071SCREW, P-TIGHT M3X10 WASHER HEAD+GCMP3100
2L081SCREW, S-TIGHT M3X5 BIND HEAD +GBKS3050
2L082SCREW, S-TIGHT M3X5 BIND HEAD +GBKS3050
2L091SCREW, P-TIGHT M3X8 BIND HEAD+GBCP3080
PAC KI NG
S1GIFT BOX CARTON H9504ED0VM306934
S2STYROFOAM(2) H9100UD0VM203377C
S3UNIT, BAG E5500UD0VM411683
S721P PAD HC463FD0VM413384
ACCESSORIES
X1REMOTE CONTROL UNIT 364/CRC007NA214ED
X2DRY BATTERY R6P/2S orXB0M451T0001
DRY BATTERY ES-GR6M-CXB0M571GLP01
X3RF CORD PAL 1.2M orWPZ0122LG001
Ref. No.DescriptionPart No.
RF CABLE CC1001020012010WPZ0122LW001
X4ACCESSORY BAG K8092BA0VM404632
X521P CABLE(BYR SUPPLY) H9300ED0VMN03276
X20A!OWNER'S MANUAL(ENGLISH) H9504ED0VMN04097
X20B!OWNER'S MANUAL(GERMAN) H9504ED0VMN04098
X20C!OWNER'S MANUAL(ITALIAN) H9504ED0VMN04162
X20D!OWNER'S MANUAL(DUTCH) H9504ED0VMN04163
200403093-2-1H9504CA
Page 83
ELECTRICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a !
have special characteristics important to safety. Before
replacing any of these comp onents, read carefully the
product safety notice in this service manual. Don't
degrade the safety of the product through improper servicing.
NOTES:
1.Par ts that are not assigned par t numbers (---------)
are not available.
2.Tolerance of Capacitors and Resistors are noted
with the following symbols.
C.....±0.25%D.....±0.5%F.....±1%
G.....±2%J......±5%K.....±10%
M.....±20%N.....±30%Z.....+80/-20%
3.LED Type:
When it is necessary to replace one or mo re of the
following diodes, all four should be replaced: D501,
D502, D503, and D504 on the Main CBA.
DVD MAIN CBA UNIT
Ref. No. DescriptionPart No.
DVD MAIN CBA UNITN79GRGEP
MCV CBA
Ref. No. DescriptionPart No.
MCV CBA
Consists of the following
MAIN CBA (MC V-A)
FUNCTION CBA (MCV-B)
DVD OPEN/CLOSE CBA (MCV -C)
SENSOR CBA
MAIN CBA
Ref. No. DescriptionPart No.
MAIN CBA (MCV-A)
Consists of the following
CAPACITORS
C056ELECTROLYTIC CAP. 47µF/25V M orCE1EMASDL470
ELECTROLYTIC CAP. 47µF/25V MCE1EMASTL470
C057ELECTROLYTIC CAP. 10µF/16V M orCE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTL100
C058ELECTRIC DOUBLE LAYER CAP0.047F/5.5V Z or CA0J473NE003
ELECTRIC DOUBLE LAYER CAP. 0.047F/5.5V Z CA0J473MS014
C059ELECTROLYTIC CAP. 100µF/6.3V M orCE0KMASDL101
ELECTROLYTIC CAP. 100µF/6.3V MCE0KMASTL101
C060CHIP CERAMIC CAP.(1608) B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP.(1608) B K 0.047µF/25VCHD1EK30B473
C062CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F10 4
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C063ELECTROLYTIC CAP. 47µF/16V M orCE1CMASDL470
ELECTROLYTIC CAP. 47µF/16V MCE1CMASTL470
0VSA14058
--------------
--------------
-------------0VSA14057
----------
Ref. No. DescriptionPart No.
C068CHIP CERAMIC CAP .(1608) CH J 470pF/50V orCHD1JJ3CH471
CHIP CERAMIC CAP . CG J 470pF/50VCHD1JJ3CG471
C104ELECTROLYTIC CAP . 100 µF/16V M orCE1CMASDL101
ELECTROLYTIC CAP. 100µF/16V MCE1CMASTL101
C107ELECTROLYTIC CAP . 470 µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C109CHIP CERAMIC CAP .(1608) CH J 470pF/50V orCHD1JJ3CH471
CHIP CERAMIC CAP . CG J 470pF/50VCHD1JJ3CG471
C112CHIP CERAMIC CAP .(1608) CH J 470pF/50V orCHD1JJ3CH471
CHIP CERAMIC CAP . CG J 470pF/50VCHD1JJ3CG471
C113CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C114CHIP CERAMIC CAP . B K 1000pF/50VCHD1JK30B102
C116CHIP CERAMIC CAP . B K 2200pF/50VCHD1JK30B222
C117ELECTROLYTIC CAP . 1 µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C118CHIP CERAMIC CAP . B K 2200pF/50VCHD1JK30B222
C127ELECTROLYTIC CAP . 10µF/16V M orCE1CMASDL100
ELECTROLYTIC CAP. 10µF/16V MCE1CMASTL100
C129ELECTROLYTIC CAP . 100 µF/16V M H7CE1CMAVSL101
C130ELECTROLYTIC CAP . 4.7 µF/50V M H7CE1JMAVSL4R7
C131ELECTROLYTIC CAP . 4.7 µF/50V M H7CE1JMAVSL4R7
C132ELECTROLYTIC CAP . 4.7 µF/50V M H7CE1JMAVSL4R7
C251ELECTROLYTIC CAP . 10µF/16V M H7CE1CMAVSL100
C252CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C253CHIP CERAMIC CAP . B K 1000pF/50VCHD1JK30B102
C254ELECTROLYTIC CAP . 1 µF/50V M H7CE1JMA VSL1R0
C301CHIP CERAMIC CAP .( 1608) B K 0.022µF/50V orCHD1JK30B223
CHIP CERAMIC CAP.(1608) B K 0.022µF/25VCHD1EK30B223
C302ELECTROLYTIC CAP . 1 µF/50V M H7CE1JMA VSL1R0
C303CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C305ELECTROLYTIC CAP . 1 µF/50V M H7CE1JMA VSL1R0
C306CHIP CERAMIC CAP .( 1608) B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP.(1608) B K 0.047µF/25VCHD1EK30B473
C307CHIP CERAMIC CAP .( 1608) B K 0.022µF/50V orCHD1JK30B223
CHIP CERAMIC CAP.(1608) B K 0.022µF/25VCHD1EK30B223
C308CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C309CHIP CERAMIC CAP . CH J 68pF/50V orCHD1JJ3CH680
CHIP CERAMIC CAP . CG J 68pF/50VCHD1JJ3CG680
C310CHIP CERAMIC CAP . CH J 68pF/50V orCHD1JJ3CH680
CHIP CERAMIC CAP . CG J 68pF/50VCHD1JJ3CG680
C311CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C312ELECTROLYTIC CAP . 10µF/16V M H7CE1CMAVSL100
C313ELECTROLYTIC CAP . 1 µF/50V M H7CE1JMASSL1R0
C314CHIP CERAMIC CAP .( 1608) B K 0.01µF/50VCHD1JK30B103
C315CHIP CERAMIC CAP .( 1608) B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP.(1608) B K 0.047µF/25VCHD1EK30B473
C316ELECTROLYTIC CAP . 1 µF/50V M H7CE1JMA VSL1R0
200403093-3-1H9504EL
Page 84
Ref. No. DescriptionPart No.
C317CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C324CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C325CHIP CERAMIC CAP. B K 8200pF/50VCHD1JK30B822
C326CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C328ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C329CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C330ELECTROLYTIC CAP. 100µF/16V M H7CE1CMAVSL101
C331ELECTROLYTIC CAP. 220µF/6.3V M H7CE0KMAVSL221
C333CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C334ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C335ELECTROLYTIC CAP. 100µF/6.3V H7CE0KMAVSL101
C341CHIP CERAMIC CAP. CH D 10pF/50V orCHD1JD3CH100
CHIP CERAMIC CAP. CG D 10pF/50VCHD1JD3CG100
C342CHIP CERAMIC CAP. B K 1000pF/50VCHD1JK30B102
C343ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C344ELECTROLYTIC CAP. 4.7 µF/25V M NP H7CP1EMAVSB4R7
C345ELECTROLYTIC CAP. 0.47µF/50V M H7CE1JMAVSLR47
C346CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. CG J 68pF/50VCHD1JJ3CG680
C348CERAMIC CAP.(AX) F Z 0.1µF/50VCCA1JZTFZ104
C349ELECTROLYTIC CAP. 0.47µF/50V M H7CE1JMAVSLR47
C350CERAMIC CAP.(AX) F Z 0.1µF/50VCCA1JZTFZ104
C402FILM CAP.(P) 0.018µF/50V JCMA1JJP00183
C403CERAMIC CAP. B K 470pF/100VCCD2AKS0B471
C404ELECTROLYTIC CAP. 220µF/6.3V M H7CE0KMASSL221
C405ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C410ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C411CHIP CERAMIC CAP.(1608) B K 0.01µF/ 50VCHD1JK30B103
C412ELECTROLYTIC CAP. 33µF/6.3V M H7CE0KMAVSL330
C413CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C414CHIP CERAMIC CAP.(1608) B K 0.01µF/ 50VCHD1JK30B103
C415ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C416CHIP CERAMIC CAP.(1608) B K 4700pF/50VCHD1JK30B472
C417ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
C418CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. CG J 220pF/50VCHD1JJ3CG221
C420CHIP CERAMIC CAP.(1608) B K 0.01µF/ 50VCHD1JK30B103
C421ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C451CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C452ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C453ELECTROLYTIC CAP. 22µF/10V M H7CE1AMAVSL220
C454CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C455CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C456ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C457ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C458CHIP CERAMIC CAP.(1608) B K 0.01µF/ 50VCHD1JK30B103
C461CHIP CERAMIC CAP.(1608) B K 0.01µF/ 50VCHD1JK30B103
C462CHIP CERAMIC CAP.(1608) B K 4700pF/50VCHD1JK30B472
C463ELECTROLYTIC CAP. 22µF/10V M H7CE1AMAVSL220
C464CHIP CERAMIC CAP.(1608) B K 0.01µF/ 50VCHD1JK30B103
C465ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C466CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C467CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C468ELECTROLYTIC CAP. 220µF/ 6.3V M H7CE0KMAVSL221
C469ELECTROLYTIC CAP. 22µF/10V M H7CE1AMAVSL220
C470CHIP CERAMIC CAP.(1608) B K 4700pF/50VCHD1JK30B472
C471CHIP CERAMIC CAP.(1608) B K 0.01µF/ 50VCHD1JK30B103
C472ELECTROLYTIC CAP. 4.7µF/25V M H7CE1EMAVSL4R7
C473ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C474CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C475CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C476ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
C477CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
200403093-3-2H9504EL
Page 85
Ref. No. DescriptionPart No.
C478CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C479ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C480ELECTROLYTIC CAP. 4.7 µF/25V M H7CE1EMAVSL4R7
C481ELECTROLYTIC CAP. 4.7 µF/25V M H7CE1EMAVSL4R7
C482CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C483ELECTROLYTIC CAP. 4.7 µF/25V M H7CE1EMAVSL4R7
C484ELECTROLYTIC CAP. 4.7 µF/25V M H7CE1EMAVSL4R7
C485ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C486CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C487ELECTROLYTIC CAP. 47µF/16V M H7CE1CMAVSL470
C488CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C505CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C506ELECTROLYTIC CAP. 220µF/6.3V M H7CE0KMAVSL221
C508CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C509CHIP CERAMIC CAP. B K 1000pF/50VCHD1JK30B102
C510CHIP CERAMIC CAP.(1608) B K 4700pF/50VCHD1JK30B472
CHIP CERAMIC CAP. CG J 330pF/50VCHD1JJ3CG331
C515CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C516ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
C517CERAMIC CAP.(AX) F Z 0.022µF/25VCCA1EZTFZ223
C518ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
CHIP CERAMIC CAP. CG J 560pF/50VCHD1JJ3CG561
C521ELECTROLYTIC CAP. 22µF/6.3V M H7CE0KMAVSL220
C522CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C524CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C527CERAMIC CAP.(AX) B K 100pF/50VCCA1JKT0B101
C531CHIP CERAMIC CAP.(1608) B K 4700pF/50VCHD1JK30B472
C533CHIP CERAMIC CAP.(1608) B K 0.047µF/50V orCHD1JK30B473
CHIP CERAMIC CAP.(1608) B K 0.047µF/25VCHD1EK30B473
C534ELECTROLYTIC CAP. 47µF/6.3V M H7CE0KMAVSL470
C535CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
C703CHIP CERAMIC CAP. B K 1000pF/50VCHD1JK30B102
C706CHIP CERAMIC CAP.(1608) B K 0.047µF/ 50V orCHD1JK30B473
CHIP CERAMIC CAP.(1608) B K 0.047µF/25VCHD1EK30B473
C708ELECTROLYTIC CAP. 10µF/16V M H7CE1CMAVSL100
C709CHIP CERAMIC CAP.(1608) B K 0.01µF/ 50VCHD1JK30B103
C711CHIP CERAMIC CAP.(1608) B K 0.01µF/ 50VCHD1JK30B103
C712CHIP CERAMIC CAP.(1608) F Z 0.1µF/ 50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C714CHIP CERAMIC CAP. B K 1500pF/50VCHD1JK30B152
C715CHIP CERAMIC CAP. F Z 0.22µF/ 16V orCHD1CZ30F224
CHIP CERAMIC CAP. FZ Z 0.22µF/ 25VCHD1EZ3FZ224
C716CHIP CERAMIC CAP. F Z 0.22µF/ 16V orCHD1CZ30F224
CHIP CERAMIC CAP. FZ Z 0.22µF/ 25VCHD1EZ3FZ224
C751CHIP CERAMIC CAP.(1608) B K 0.01µF/ 50VCHD1JK30B103
C752ELECTROLYTIC CAP. 47µF/10V M H7CE1AMAVSL470
C753ELECTROLYTIC CAP. 4.7µF/50V M H7CE1JMASSL4R7
C754ELECTROLYTIC CAP. 4.7µF/50V M H7CE1JMASSL4R7
C755CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C756CHIP CERAMIC CAP. B K 2200pF/50VCHD1JK30B222
C757ELECTROLYTIC CAP. 47µF/6.3V M orCE0KMASDL470
ELECTROLYTIC CAP. 47µF/6.3V MCE0KMASTL470
C758CERAMIC CAP.(AX) Y M 0.01µF/ 16VCCA1CMT0Y103
CHIP CERAMIC CAP. CG J 100pF/50VCHD1JJ3CG101
C1355CHIP CERAMIC CAP. F Z 1µF/10VCHD1AZ30F105
C1359CHIP CERAMIC CAP. CH D 9pF/50VCHD1JD3CH9R0
C1393ELECTROLYTIC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C1394ELECTROLYTIC CAP. 47µF/ 6.3V M H7CE0KMAVSL470
C1402PCB JUMPER D0.6-P5.0JW5.0T
C1421CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C1422CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1441CHIP CERAMIC CAP.(1608) B K 0.33µF/10VCHD1AK30B334
C1442ELECTROLYTIC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C1445ELECTROLYTIC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C1461ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C1462ELECTROLYTIC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C1471ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C1481ELECTROLYTIC CAP. 1µF/50V M orCE1JMASDL1R0
ELECTROLYTIC CAP. 1µF/50V MCE1JMASTL1R0
C1482ELECTROLYTIC CAP. 470µF/6.3V M orCE0KMASDL471
ELECTROLYTIC CAP. 470µF/6.3V MCE0KMASTL471
C1486ELECTROLYTIC CAP. 1µF/50V M H7CE1JMAVSL1R0
C1487CHIP CERAMIC CAP. B K 1000pF/50VCHD1JK30B102
C1523CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C1531CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C1532ELECTROLYTIC CAP. 22µF/ 6.3V M H7CE0KMAVSL220
C2002CHIP CERAMIC CAP. B K 1000pF/50VCHD1JK30B102
C2004ELECTROLYTIC CAP. 100µF/6.3V H7CE0KMAVSL101
C2012CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
Ref. No. DescriptionPart No.
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C2013CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C2016CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
CONNECTORS
CN050CONNECTOR BASE, 18P TUC-P18P-B1J3TUA18TG001
CN701AFV PCB ASSEMBLY CP2500/9300H9300AFV
CN1051FMN CONNECTOR, SIDE 22P 22FMN-STRKJCFNG22JG004
CN1601FMN CONNECTOR, SIDE 18P 18FMN-STKJCFNG18JG003
CN2014FMN CONNECTOR, SIDE 4P 04FMN-STRKJCFNG04JG004
DIODES
D051RECTIFIER DIODE 1N4005NDQZ001N4005
D052RECTIFIER DIODE 1N4005NDQZ001N4005
D053RECTIFIER DIODE 1N4005NDQZ001N4005
D054ZENER DIODE DZ-10BSBT265 orNDTB00DZ10BS
ZENER DIODE MTZJT-7710BQDTB00MTZJ10
D056ZENER DIODE DZ-33BSDT265 orNDTD00DZ33BS
ZENER DIODE MTZJT-7733DQDTD00MTZJ33
D057RECTIFIER DIODE 1N4005NDQZ001N4005
D101ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D102ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D103ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D104ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D105ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D106ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D107ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D108ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D109ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D110ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D115ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D118ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D119ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D121ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D301SWITCHING DIODE 1N4148M orNDTZ01N4148M
SWITCHING DIODE 1SS133(T-77)QDTZ001SS133
D510SWITCHING DIODE 1N4148M orNDTZ01N4148M
SWITCHING DIODE 1SS133(T-77)QDTZ001SS133
D511ZENER DIODE DZ-7.5BSAT265 orNDTA0DZ7R5BS
ZENER DIODE MTZJT-777.5AQDTA0MTZJ7R5
D512SWITCHING DIODE 1N4148M orNDTZ01N4148M
SWITCHING DIODE 1SS133(T-77)QDTZ001SS133
D555LED MIE-534A2 orNPZZM1E534A2
200403093-3-4H9504EL
Page 87
Ref. No. DescriptionPart No.
LED SIR-563ST3F P orQPQPS1R563ST
LED SIR-563ST3F QQPQQS1R563ST
D611SWITCHING DIODE 1N4148M orNDTZ01N4148M
SWITCHING DIODE 1SS133(T-77)QDTZ001SS133
D701ZENER DIODE DZ-33BSDT265 orNDTD00DZ33BS
ZENER DIODE MTZJT-7733DQDTD00MTZJ33
D751ZENER DIODE DZ-8.2BSAT265 orNDTA0DZ8R2BS
ZENER DIODE MTZJT-778.2AQDTA0MTZJ8R2
D1052SCHOTTKY BARRIER DIODE SB140 orNDQZ000SB140
SCHOTTKY BARRIER DIODE ERB81-004AERB81004***
D1053RECTIFIER DIODE 1N4005NDQZ001N4005
D1054RECTIFIER DIODE 1N4005NDQZ001N4005
D1055RECTIFIER DIODE 1N4005NDQZ001N4005
D1056PCB JUMPER D0.6-P10.0JW10.0T
D1057RECTIFIER DIODE 1N4005NDQZ001N4005
D1301ZENER DIODE DZ-5.6BSBT265 orNDTB0DZ5R6BS
ZENER DIODE MTZJT-775.6BQDTB0MTZJ5R6
D1401ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D1402ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D1501PCB JUMPER D0.6-P5.0JW5.0T
LED EXCLUSIVE(A) CP2790/9500/EVERLIGH0VDM12324
D501LED(RED) 204HD/ENPQZ00204HDE
D502LED(GREEN) 204-10GD/S957NPQZ10GDS957
D503LED(GREEN) 204-10GD/S957NPQZ10GDS957
D504LED(RED) 204HD/ENPQZ00204HDE
LED EXCLUSIVE(B) CP2790/9500/LITEON0VDM12325
D501LED(RED) LTL-4211NNPQZLTL4211N
D502LED(GREEN) LTL-4231NNPQZLTL4231N
D503LED(GREEN) LTL-4231NNPQZLTL4231N
D504LED(RED) LTL-4211NNPQZLTL4211N
ICS
IC301IC:Y/C/A LA71750EM-MPB-EQSZBA0RSY020
IC451IC:HIFI LA72648M-MPB-EQSZBA0RSY033
IC501MICROCONTROLLER 16BIT M37762MCA-
IC502IC:EEPROM CAT24WC02JI orNSZBA0SBG001
IC611V.F.D. 7-BT-292GNTVFD150FT010
IC612FL DRIVER IC PT6313-S-TPNSZBA0TG2006
IC751IC:SWITCH TC4053BF(N) orQSMBA0STS002
IC1201IC:OP AMP KIA4558P orNSZBA0SJY004
IC1204FIBER OPTIC TRANS.MODULE 0C-0805T*002 or JWHHA00JD002
C11CHIP CERAMIC CAP.(1608) B K 0.01µF/ 50VCHD1JK30B103
C12ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSL100
C13CHIP CERAMIC CAP.(1608) B K 0.01µF/ 50VCHD1JK30B103
C14CHIP CERAMIC CAP.(1608) B K 0.01µF/ 50VCHD1JK30B103
C15ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSL100
C16ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSL100
C17CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C19CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C20ELECTROLYTIC CAP. 3.3µF/50V M H7CE1JMASSL3R3
C21CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25V orCHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1µF/50VCHD1JZ3FZ104
C22ELECTROLYTIC CAP. 10µF/16V M H7CE1CMASSL100
C24ELECTROLYTIC CAP. 0.22µF/50V M H7CE1JMASSLR22
Five different, but interchangeable, types of B558
(LOADING MOTOR) may be installed in these models.
Please confirm B558 (LOADING MOTOR) type by a
part number on it. B558 (LOADING MOTOR) type varies in combination with L1151. Please see Table 1 for
details and combination.
Table 1 (B558 and L1151 Combination)
LOADING MOTOR (B558)SCREW (L1151)
DescriptionParts No.DescriptionParts No.
LOADING MOTOR
M31E-1 R-14 7376
LOADING MOTOR
M31E-1 R-14 7391
LOADING MOTOR
M31E-1 R-14 7377
LOADING MOTOR
MDB2B80
LOADING MOTOR
MDB2B82
MMDZB12MM003
MMDZB12MM004
MMDZB12MM006
MMDZB12SJ008
MMDZB10SJ001
SCREW, SEMS
M2.6X4 PAN HEAD+
SCREW, SEMS
M3X4 PAN HEAD+
CPM39040
CPM33040
Ref.NoDescriptionPart No.
B2CYLINDER ASSEMBLY MK12 PAL 4HD HIFI orN1767CYL
CYLINDER ASSEMBLY(V) MK12 PAL 4HD HIFIN1769CYL
B3LOADING MOTOR ASSEMBLY MK11 TVCR0VSA13465
B8PULLEY ASSEMBLY(HI) MK120VSA13501
B9MOVING GUIDE S PREPARATION MK120VSA13560
B10MOVING GUIDE T PREPARATION MK120VSA13562
B11LOADING ARM(TU) ASSEMBLY MK120VSA13300
B12LOADING ARM(SP) ASSEMBLY MK120VSA13299
B31AC HEAD ASSEMBLY MK120VSA13275
B35TAPE GUIDE ARM ASSEMBLY MK120VSA13277
B37CAPSTAN MOTOR 288/VCCM012N9671CML
B52CAP BELT MK100VM411138
B73FE HEAD ASSEMBLY MK11 orN9742FEL
FE HEAD ASSEMBLY MK11 orN9743FEL
FE HEAD(MK11) MH-131SF11 orDHVEC01Z0005
FE HEAD(MK11) VTR-1X2ERS11-148 orDHVEC01TE004
FE HEAD(MK12) VTR-1X2ERS11-155 orDHVEC01TE005
FE HEAD(MK12) HVFHP0047ADHVEC01AL007
B74PRISM MK100VM202870
B86F BRAKE ASSEMBLY(HI) MK120VSA13447
B121WORM MK120VM414091
B126PULLEY MK120VM414330B
B133IDLER ASSEMBLY(HI) MK120VSA13451
B148TG CAP MK60VM407664C
B300C DRIVE LEVER(TU) MK120VM203773
B303F DOOR OPENER MK12 or0VM203751C
F DOOR OPENER MK120VM203751
B313C DRIVE SPRING MK120VM414145
B347GUIDE HOLDER A MK100VM304920
B354SLIDER(TU) MK120VM101172F
B355SLIDER(SP) MK12 or0VM101182F
SLIDER(SP) SUB ASSEMBLY MK12 or0VDM12542
Ref.NoDescriptionPart No.
SLIDER(SP) MK120VM101182H
B359CLEANER LEVER MK100VM304413
B360CLEANER ROLLER MK90VM410032C
B361CL POST MK100VM411114
B410PINCH ARM(A) ASSEMBLY(4) MK12 or0VSA13572
PINCH ARM(A) ASSEMBLY(5) MK120VSA13788
B411PINCH SPRING MK120VM414644
B414M BRAKE(SP) ASSEMBLY(HI) MK120VSA13655
B416M BRAKE(TU) ASSEMBLY(HI) MK120VSA13449
B417TENSION SPG(3002645) MK12.50VM414221G
B425LOCK LEVER SPRING MK100VM411110
B482CASSETTE PLATE MK120VM203749
B483LOCK LEVER MK120VM414095
B487BAND BRAKE(SP) MK120VM305723
B488MODE LEVER(HI) MK120VM101175J
B491CAM GEAR(A)(HI) MK120VM101176
B492MODE GEAR(LM) MK120VM204236
B494C DOOR OPENER MK120VM305719
B499T LEVER HOLDER MK120VM305729
B501WORM HOLDER MK12 or0VM203767
WORM HOLDER(R) MK120VM204324
B507REEL WASHER MK9 5*2.1*0.50VM410058
B508S BRAKE SPRING(HI) MK120VM414899
B513P.S.W F 6*2.55*0.50VM402629A
B514SCREW RACK MK100VM411535
B516REEL WASHER MK9 5*2.1*0.50VM410058
B518P.S.W CUT 1.6X4.0X0.5T0VM408485A
B521REV BRAKE SPG(HI) MK120VM414943
B522TG POST ASSEMBLY MK100VSA11012
B525LDG BELT MK110VM412804
B529CLEANER ASSEMBLY MK100VSA11161
B551FF ARM(HI) MK120VM306183
B553REV SPRING MK110VM412555
B555RACK ASSEMBLY MK120VSA13289
B557MOTOR PULLEY U50VM403205A
B558LOADING MOTOR MDB2B82 orMMDZB10SJ001
LOADING MOTOR MDB2B80 orMMDZB12SJ008
LOADING MOTOR M31E-1 R-14 7376 orMMDZB12MM003
LOADING MOTOR M31E-1 R14 7391 orMMDZB12MM004
LOADING MOTOR M31E-1 R-14 7377MMDZB12MM006
B559CLUTCH ASSEMBLY(HI) MK120VSA13450
B562C DRIVE LEVER(SP) MK120VM203772
B563SLIDER SHAFT MK120VM305762
B564M GEAR(HI) MK120VM305755
B565SENSOR GEAR(HI) MK120VM305756
B567PINCH ARM(B) MK120VM305718
B568BT ARM MK120VM305728
B571P.S.W CUT 1.6X4.0X0.5T0VM408485A
B572P.S.W CUT 1.6X4.0X0.5T0VM408485A
B573REEL S MK110VM203436
B574REEL T MK100VM202872C
B578TR GEAR A MK100VM304440
B579TR GEAR B MK120VM305900
B580TR GEAR C MK120VM305743A
B581CENTER GEAR MK110VM305081
B582TR GEAR SPRING MK100VM411187C
B583CAM WASHER MK120VM414741
200403093-4-1H9504DPL
Page 97
Ref.NoDescriptionPart No.
B585PSW(317505) MK110VM413663
B587TENSION LEVER ASSEMBLY MK120VSA13279
B590BRAKE ARM(TU) MK120VM203752E
B591BAND BRAKE(TU) MK120VM305724C
B592TG POST MK100VM411108E
L1051SCREW, B-TIGHT M2.6X6 PAN HEAD+GPMB9060
L1053SCREW, S-TIGHT M2.6X8 WASHER HEAD+GCMS9080
L1151SCREW, SEMS M3X4 PAN HEAD + orCPM33040
SCREW, SEMS M2.6X4 PAN HEAD+CPM39040
L1191SCREW, S-TIGHT M2.6X8 WASHER HEAD+GCMS9080
L1321SCREW, S-TIGHT M3X6 BIND HEAD+GBMS3060
L1341SCREW, P-TIGHT M2X6 PAN HEAD+GPMP2060
L1406AC HEAD SCREW MK90VM410964
L1450SCREW, SEMS M2.6X5 PAN HEAD+CPM39050
L1466SCREW, S-TIGHT M2.6X6 BIND HEAD+GBMS9060
L1467SCREW M2.6X5 WASHER HEAD+SCM39050
200403093-4-2H9504DPL
Page 98
VCR-D 4501
H9504ED
2004-04-01
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