Advantech SQF-MSDM1-8G-21C, SQF-MSDM1-32G-21C, SQF-MSDS1-8G-85C, SQF-MSDU1-16G-21E, SQF-MSDU1-4G-21E Technical Manual

SQFlash

Industrial Class 10 Micro SD Card

Specifications subject to change without notice, contact your sales representatives for the most update information.

REV 0.3 Page 1 of 22 May 4, 2016

SQFlash Micro SD Card

Technical Manual

Class 10 (SQF-MSDx1-xM/G-21x)

SQFlash

Industrial Class 10 Micro SD Card

Specifications subject to change without notice, contact your sales representatives for the most update information.

REV 0.3 Page 2 of 22 May. 4, 2016

CONTENTS

1.

Overview ............................................................................................ 4 

2.Standard Features ............................................................................. 5

3.Additional Features ........................................................................... 6

4.Pin Assignment and Block Diagram ................................................ 8

5.Power Consumption ....................................................................... 11

6.DC Characters ................................................................................. 11

7.AC Characters ................................................................................. 14

8.Dimensions ...................................................................................... 19

Appendix: Part Number Table ........................................................... 21

SQFlash

Industrial Class 10 Micro SD Card

Specifications subject to change without notice, contact your sales representatives for the most update information.

REV 0.3 Page 3 of 22 May. 4, 2016

Revision History

Rev. Date History

0.1 2014/8/4

1. 1

st

draft

0.2 2014/8/21

1. Add Ultra MLC

0.3 2016/5/4

1. Add SLC

Advantech reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or
design. Information furnished by Advantech is believe d to be a ccurate and reli able. Howe ver, Advan tech doe s not assure any liability
arising out of the application or use of this information, nor t he application or use o f any product or circuit d escribed herein, neither
does it convey any license under its patent rights nor the rights of others.
Copyright © 1983-2015 Advantech Co., Ltd. All rights reserved.

SQFlash

Industrial Class 10 Micro SD Card

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REV 0.3 Page 4 of 22 May. 4, 2016

1. Overview

The SQFlash Micro Secure Digital card (SQF-MSD) is fully compliant to the specification released by SD Card

Association. The Command List supports [Part 1 Physical Layer Specification Ver3.01 Final] definitions. Card

Capacity of Non-secure Area, Secure Area Supports [Part 3 Security Specification Ver3.00 Final] specifications.

The microSD 3.0 card comes with 8-pin interface, designed to operate at a maximum operating frequency of

50MHz or 100MHz. It can alternate communication protocol between the SD mode and SPI mode. It performs data

error detection and correction with very low power consumption. Its capacity could be more than 128MB and up to

64GB.

SQFlash Industrial Micro SD card is one of the most popular cards today based on its high performance, good

reliability and wide compatibility. Not to mention that it’s well adapted for hand-held applications in

semi-industrial/medical markets already.

SQFlash

Industrial Class 10 Micro SD Card

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REV 0.3 Page 5 of 22 May. 4, 2016

2. Standard Features

 Support SD system specification version 3.0
 Card capacity of non-secure area and secure area support [Part 3 Security

Specification Ver3.0 Final] Specifications

 Support SD SPI mode
 Designed for read-only and read/write cards
 Bus Speed Mode (using 4 parallel data lines)

– UHS-I mode

● SDR12 - SDR up to 25MHz 1.8V signaling

● SDR25 - SDR up to 50MHz 1.8V signaling

● SDR50: 1.8V signaling, Frequency up to 100 MHz, up to 50MB/sec

● SDR104: 1.8V signaling, Frequency up to 208MHz, up to 104MB/sec

● DDR50: 1.8V signaling, Frequency up to 50 MHz, sampled on both clock edges, up to 50MB/sec

Note: Timing in 1.8V signaling is different from that of 3.3V signaling.

 The command list supports [Part 1 Physical Layer Specification Ver3.1 Final]

definitions

 Copyrights Protection Mechanism

– Compliant with the highest security of SDMI standard

 Support CPRM (Content Protection for Recordable Media) of SD Card
 Card removal during read operation will never harm the content
 Password Protection of cards (optional)
 Write Protect feature using mechanical switch
 Built-in write protection features (permanent and temporary)
 +4KV/-4KV ESD protection in contact pads
 Operation voltage range: 2.7 ~ 3.6V

SQFlash

Industrial Class 10 Micro SD Card

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REV 0.3 Page 6 of 22 May. 4, 2016

3. Additional Features

 Capacities

– SLC type : 128MB，256MB，512MB，1GB，2GB
– MLC type：4GB，8GB，16GB，32GB，64GB
– Ultra MLC type：2GB，4GB，8GB，16GB，32GB

 Flash type

– 24 nm SLC

– A19 nm MLC

 Performance (SLC)

Capacity Mode

Sequential

Read (MB/s) Write (MB/s)

128MB Non-UHS 16 4
256MB Non-UHS 16 10
512MB Non-UHS 16 10

1GB Non-UHS 18 10
2GB Non-UHS 20 20

 Performance (MLC)

Capacity Mode

Sequential

Read (MB/s) Write (MB/s)

2GB UHS-I 90 20
4GB UHS-I 90 20

8GB UHS-I 90 30
16GB UHS-I 90 40
32GB UHS-I 90 40
64GB UHS-I 90 45

 Temperature Ranges

– Normal Temperature

● -25℃ to 85℃

– Industrial Temperature

● -40℃ to 85℃

 Mechanical Specification

– Shock：1,500G, Peak / 0.5ms
– Vibration：20G, Peak / 20~2000Hz

– Drop: 1.5m free fall

– Bending: ≥ 10N, hold 1min / 5times

– Torque: 0.15N-m or +/-2.5deg

– Salt Spray:

● Concentration: 3% NaCl

● Temperature: 35℃

● Storage for 24 HRS

– Waterproof: JIS IPX7 compliance

 Humidity

– Operating Humidity：5% ~ 93%
– Non-Operating Humidity：5% ~ 93%

SQFlash

Industrial Class 10 Micro SD Card

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REV 0.3 Page 7 of 22 May. 4, 2016

 NAND flash Data Retention

– 10 years

SQFlash

Industrial Class 10 Micro SD Card

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REV 0.3 Page 8 of 22 May. 4, 2016

4. Flash Management

 Error Correction Code (ECC)

Flash memory cells will deteriorate with use, which might generate random bit errors in the stored data. Thus,
SQF-MSD applies the BCH ECC algorithm, which can detect and correct errors occur during read process,
ensure data been read correctly, as well as protect data from corruption.

 Wear Leveling

NAND Flash devices can only undergo a limited number of program/erase cycles, and in most cases, the
flash media are not used evenly. If some area get updated more frequently than others, the lifetime of the
device would be reduced significantly. Thus, Wear Leveling technique is applied to extend the lifespan of
NAND Flash by evenly distributing write and erase cycles across the media.
SQF-MSD provides advanced Wear Leveling algorithm, which can efficiently spread out the flash usage
through the whole flash media area. Moreover, by implementing both dynamic and static Wear Leveling
algorithms, the life expectancy of the NAND Flash is greatly improved.

 Bad Block Management

Bad blocks are blocks that include one or more invalid bits, and their reliability is not guaranteed. Blocks that
are identified and marked as bad by the manufacturer are referred to as “Initial Bad Blocks”. Bad blocks that
are developed during the lifespan of the flash are named “Later Bad Blocks”. SQF-MSD implements an
efficient bad block management algorithm to detect the factory-produced bad blocks and manages any bad
blocks that appear with use. This practice further prevents data being stored into bad blocks and improves
the data reliability.

 Auto-Read Refresh

Auto-Read Refresh is specifically applied on devices that read data mostly but rarely write data, such as GPS.
When blocks are continuously read, then the device cannot activate wear leveling since it can only be applied
while writing data. Thus, errors will accumulate and become uncorrectable. Accordingly, to avoid errors
exceed the amount ECC can correct and blocks turn bad, The firmware of SQF-MSD will automatically
refresh the bit errors when the error number in one block approaches the threshold, ex., 24 bits.

SQFlash

Industrial Class 10 Micro SD Card

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REV 0.3 Page 9 of 22 May. 4, 2016

 Endurance

JEDEC defined an endurance rating TBW (TeraByte Written), following by the equation below, for indicating
the number of terabytes a flash drive can be written which is a measurement of flash drive’s expected
lifespan, represents the amount of data written to the device.

TBW = [(NAND Endurance) x (Flash Drive Capacity)] / WAF

 NAND Endurance: Program / Erase cycle of a NAND flash.

o SLC: 60,000 cycles
o Ultra MLC: 20,000 cycles
o MLC: 3,000 cycles

 Flash Drive Capacity: Physical capacity in total of a Flash Drive.
 WAF: Write Amplification Factor (WAF), as the equation shown below, is a numerical value

representing the ratio between the amount of data that a flash drive controller needs to write and the
amount of data that the host’s flash controller writes. A better WAF, which is near to 1, guarantees
better endurance and lower frequency of data written to flash memory.

WAF = (Lifetime write to flash) / (Lifetime write to host)

The TBW rating for a flash drive shall be derived for and verified under the following workload conditions,

 Sequential Write (copy file into card)
 P/E cycles incurred: erase count after writing – erase count before writing

 SQFlash Micro SD Card TBW

capacity

TBW

WAF SLC WAF Ultra MLC MLC

128 MB

1.024414

7 -- -- --

256 MB 14 -- -- --

1 GB 58 -- -- --
2 GB 117

1.0301339

39 -­4 GB 234 77 11
8 GB 469 155 23

16 GB 937 310 47
32 GB 1874 621 93
64 GB -- -- 1243 186

128 GB -- -- -- 372

SQFlash

Industrial Class 10 Micro SD Card

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REV 0.3 Page 10 of 22 May. 4, 2016

5. Pin Assignment and Block Diagram

pin

SD Mode SPI Mode

Name Type

1

Description Name Type Description

1 DAT2 I/O/PP Data Line[bit2] RSV

2 CD/DAT3 2 I/O/PP

3

Card Detect/

Data Line[bit3]

CS I

3

Chip Select (neg

true)
3 CMD PP Command/Response DI I Data In
4 V

DD

S Supply voltage VDD S Supply voltage

5 CLK I Clock SCLK I Clock

6 V

SS

S Supply voltage ground VSS S

Supply voltage

ground
7 DAT0 I/O/PP Data Line[bit0] DO O/PP Data Out
8 DAT1 I/O/PP Data Line[bit1] RSV

(1) S: power supply, I: input; O: output using push-pull drivers; PP:I/O using push-pull driver
(2) The extended DAT lines (DAT1-DAT3)are input on power up. They start to operate as DAT lines after

SET_BUS_WIDTH command. The Host shall keep its own DAT1-DAT3 lines in input mode, as well,
while they are not used. It is defined so, in order to keep compatibility to MultiMedia Cards.

(3) At power up this line has a 50KOhm pull up enabled in the card. This resistor serves two functions Card

detection and Mode Selection. For Mode Selection, the host can drive the line high or let it be pulled
high to select SD mode. If the host wants to select SPI mode it should drive the line low. For Card
detection, the host detects that the line is pulled high. This pull-up should be disconnected by the user
during regular data transfer period, with SET_CLR_CARD_DETECT (ACMD42) command.

Name Width Description

CID 128bit

Card identification number; card individual number for identification.

Mandatory

RCA1 16bit

Relative card address; local system address of a card, dynamically
suggested by the card and approved by the host during initialization.

Mandatory

DSR 16bit Driver Stage Register; to configure the card’s output drivers. Optional

CSD 128bit

Card Specific Data; information about the card operation conditions.

Mandatory

SCR 64bit

SD Configuration Register; information about the SD Memory Card's Special

Features capabilities Mandatory

OCR 32bit Operation conditions register. Mandatory.

SSR 512bit

SD Status; information about the card proprietary features

Mandatory

OCR 32bit

Card Status; information about the card status

Mandatory

SQFlash

Industrial Class 10 Micro SD Card

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REV 0.3 Page 11 of 22 May. 4, 2016

6. Power Consumption

Table list as below is the power consumption of SQF-MSD card with different type of flash memory.

Capacity Flash Structure Read Write Idle

4GB 4GB x 1 100 100 150

8GB 8GB x 1 100 100 150
16GB 8GB x 2 150 150 180
32GB 8GB x 4 180 180 220
64GB 8GB x 8 200 200 250

(1) Data transfer mode is single channel.

7. Electrical Specifications

Absolute Maximum Rating

Item Symbol Parameter MIN MAX Unit

1 VDD-VSS DC Power Supply -0.3 +3.3 V
2 VIN Input Voltage VSS-0.3 VDD+0.3 V
3 Ta Operating Temperature (Gold) -25 +85



4 Ta Operating Temperature (Diamond) -40 +85



5 Tst Storage Temperature -40 +85



6 VDD V

DD

Voltage 2.7 3.6 V

8. DC Characters

 BUS Operating Conditions for 3.3V Signaling

 Threshold level for High Voltage Range

Parameter Symbol Min Max Unit Remarks

Supply voltage VDD 2.7 3.6 V

Output High Voltage VOH 0.75*VDD V IOH=-100uA VDDMin.

Output Low Voltage VOL 0.125*VDD V IOL = 100uA VDD min

Input High Voltage VIH 0.625*VDD VDD+0.3 V

Input Low Voltage VIL VSS-0.3 0.25 *VDD V

Power up time 250 ms from 0v to VDD min.



Bus signal levels

SQFlash

Industrial Class 10 Micro SD Card

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REV 0.3 Page 12 of 22 May. 4, 2016

 Peak Voltage and Leakage Current

Parameter Symbol Min Max Unit Remarks

Peak voltage on all lines

-0.3 VDD+0.3 V

All Inputs

Input Leakage Current

-10 10 uA

All Outputs

Output Leakage Current

-10 10 uA

 Bus Signal Line Levels

Parameter symbol Min Max Unit Remark

Pull-up resistance

R

CMD

R

DAT

10 100 kΩ to prevent bus floating

Total bus capacitance for each
signal line

C

L

40 pF

1 card
CHOST+CBUS shall
not exceed 30 pF

Capacitance of the card for each
signal pin

CCAR
D

10 pF

Maximum signal line inductance 16 nH fpp<20 MHz

Pull-up resistance inside card (pin1)

RDAT3

10 90 kΩ

May be used for
card detection

 Power Up Time

Host needs to keep power line level less than 0.5V and more than 1ms before power ramp up.

 Power On or Power Cycle

Followings are requirements for Power on and Power cycle to assure a reliable SD Card hard reset.
(1) Voltage level shall be below 0.5V

(2) Duration shall be at least 1ms.

 Power Supply Ramp Up

The power ramp up time is defined from 0.5V threshold level up to the operating supply voltage which is
stable between VDD (min.) and VDD (max.) and host can supply SDCLK.
Followings are recommendation of Power ramp up:
(1) Voltage of power ramp up should be monotonic as much as possible.
(2) The minimum ramp up time should be 0.1ms.

(3) The maximum ramp up time should be 35ms for 2.7-3.6V power supply.

SQFlash

Industrial Class 10 Micro SD Card

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REV 0.3 Page 13 of 22 May. 4, 2016

 Power Down and Power Cycle

(1) When the host shuts down the power, the card VDD shall be lowered to less than 0.5Volt for a

minimum period of 1ms. During power down, DAT, CMD, and CLK should be disconnected or driven
to logical 0 by the host to avoid a situation that the operating current is drawn through the signal
lines.

(2) If the host needs to change the operating voltage, a power cycle is required. Power cycle means the

power is turned off and supplied again. Power cycle is also needed for accessing cards that are

already in Inactive State. To create a power cycle the host shall follow the power down description

before power up the card (i.e. the card VDD shall be once lowered to less than 0.5Volt for a

minimum period of 1ms).

SQFlash

Industrial Class 10 Micro SD Card

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REV 0.3 Page 14 of 22 May. 4, 2016

9. AC Characters

 microSD Interface timing (Default)

Parameter Symbol Min Max Unit Remark

Clock CLK (All values are referred to min(VIH) and max(VIL)

Clock frequency Data Transfer Mode fPP 0 25 MHz

C

card

≤ 10 pF

(1 card)

Clock frequency Identification Mode fOD 0

(1)

/100 400 kHz

C

card

≤ 10 pF

(1 card)

Clock low time tWL 10 ns

C

card

≤ 10 pF

(1 card)

Clock high time tWH 10 ns

C

card

≤ 10 pF

(1 card)

Clock rise time t

TLH

10 ns

C

card

≤ 10 pF

(1 card)

Clock fall time t

THL

10 ns

C

card

≤ 10 pF

(1 card)

Inputs CMD, DAT (referenced to CLK)

Input set-up time t

ISU

5 ns

C

card

≤ 10 pF

(1 card)

Input hold time tIH 5 ns

C

card

≤ 10 pF

(1 card)

Outputs CMD, DAT (referenced to CLK)

Output Delay time during Data

Transfer Mode

t

ODLY

0 14 ns

CL≤ 40 pF

(1 card)

Output Delay time during

Identification Mode

tODLY 0 50 ns

CL≤ 40 pF

(1 card)

(1) 0Hz means to stop the clock. The given minimum frequency range is for cases were continues clock

is required.

SQFlash

Industrial Class 10 Micro SD Card

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REV 0.3 Page 15 of 22 May. 4, 2016

 microSD Interface Timing (High-Speed Mode)

Card Input Timing (High Speed Card)

Card Output Timing (High Speed Mode)

Parameter Symbol Min Max Unit Remark

Clock CLK (All values are referred to min(VIH) and max(VIL)

Clock frequency Data Transfer

Mode

fPP 0 50 MHz

C

card

≤ 10 pF

(1 card)

Clock low time tWL 7 ns

C

card

≤ 10 pF

(1 card)

Clock high time tWH 7 ns

C

card

≤ 10 pF

(1 card)

Clock rise time t

TLH

3 ns

C

card

≤ 10 pF

(1 card)

Clock fall time t

THL

3 ns

C

card

≤ 10 pF

(1 card)

Inputs CMD, DAT (referenced to CLK)

Input set-up time t

ISU

6 ns

C

card

≤ 10 pF

(1 card)

Input hold time tIH 2 ns

C

card

≤ 10 pF

(1 card)

Outputs CMD, DAT (referenced to CLK)

Output Delay time during Data

Transfer Mode

t

ODLY

14 ns

CL≤ 40 pF

(1 card)

Output Hold time TOH 2.5 ns

CL≤ 15 pF

(1 card)

Total System capacitance of

each line¹

CL 40 pF

CL≤ 15 pF

(1 card)

(1) In order to satisfy severe timing, host shall drive only one card.

SQFlash

Industrial Class 10 Micro SD Card

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REV 0.3 Page 16 of 22 May. 4, 2016

 microSD Interface timing (SDR12, SDR25, SDR50 and SDR104 Modes)

 Input

Symbol Min Max Unit Remark

tCLK 4.80 0 ns 208MHz (Max.), Between rising edge, VCT= 0.975V

tCR, tCF - 0.2 * tCLK ns tCR, tCF < 2.00ns (max.) at 100MHz, CCARD=10pF

Clock Duty 30 70 %

Clock Signal Timing

 SDR50 and SDR104 Input Timing

Symbol Min Max Unit SDR104 Mode

tls 1.40 - ns C

CARD

=10pF, VCT= 0.975V

tlH 0.80 - ns C

CARD

=5pF, VCT= 0.975V

Symbol Min Max Unit SDR50 Mode

tls 3.00 - ns CCARD =10pF, VCT= 0.975V

tlH 0.80 - ns CCARD =5pF, VCT= 0.975V

Card Input Timing

SQFlash

Industrial Class 10 Micro SD Card

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REV 0.3 Page 17 of 22 May. 4, 2016

 Output Timing of Variable Window (SDR104)

Symbol Min Max Unit Remark

tOP 0 2 Ul Card Output Phase

󰅿tOP

-350 +1550 ps Delay variable due to temperature change after tuning

tODW 0.60 - Ul tODW=2.88ns at 208MHz

Output Timing of Fixed Data Window

 SD Interface timing (DDR50 Modes)

Symbol Min Max Unit Remark

tCLK 20 - ns 50MHz (Max.), Between rising edge

tCR, tCF - 0.2 * tCLK ns tCR, tCF < 4.00ns (max.) at 50MHz, CCARD=10pF

Clock Duty 45 55 %

Clock Signal Timing

Timing Diagram DAT Inputs / Outputs Referenced to CLK in DDR50 Mode

SQFlash

Industrial Class 10 Micro SD Card

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REV 0.3 Page 18 of 22 May. 4, 2016

Parameter Symbol Min Max Unit Remark

Input CMD (referenced to CLK rising edge)

Input set-up time t

ISU

6 - ns

C

card

≤ 10 pF

(1 card)

Input hold time tIH 0.8 - ns

C

card

≤ 10 pF

(1 card)

Output CMD (referenced to CLK rising edge)

Output Delay time during Data

Transfer Mode

t

ODLY

13.7 ns

C

card

≤ 30 pF

(1 card)

Output Hold time tOH 1.5 - ns

C

card

≤ 10 pF

(1 card)

Inputs DAT (referenced to CLK rising and falling edges)

Input set-up time t

ISU2X

3 - ns

C

card

≤ 10 pF

(1 card)

Input hold time t

IH2X

0.8 - ns

C

card

≤ 10 pF

(1 card)

Outputs CMD, DAT (referenced to CLK)

Output Delay time during Data

Transfer Mode

t

ODLY2X

- 7.0 ns

CL≤ 25 pF

(1 card)

Output Hold time t

OH2X

1.5 - ns

CL≥ 15 pF

(1 card)

SQFlash

Industrial Class 10 Micro SD Card

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REV 0.3 Page 19 of 22 May. 4, 2016

10. Dimensions

SQFlash

Industrial Class 10 Micro SD Card

Specifications subject to change without notice, contact your sales representatives for the most update information.

REV 0.3 Page 20 of 22 May. 4, 2016

SQFlash

Industrial Class 10 Micro SD Card

Specifications subject to change without notice, contact your sales representatives for the most update information.

REV 0.3 Page 21 of 22 May. 4, 2016

Appendix: Part Number Table

Product Advantech PN

SQF MICRO SD C10 SLC 128M (0~70°C) SQF-MSDS1-128M-21C

SQF MICRO SD C10 SLC 256M (0~70°C) SQF-MSDS1-256M-21C

SQF MICRO SD C10 SLC 512M (0~70°C) SQF-MSDS1-512M-21C

SQF MICRO SD C10 SLC 1G (0~70°C) SQF-MSDS1-1G-21C

SQF MICRO SD C10 SLC 2G (0~70°C) SQF-MSDS1-2G-21C

SQF MICRO SD C10 SLC 128M (-40~85°C) SQF-MSDS1-128M-21E

SQF MICRO SD C10 SLC 256M (-40~85°C) SQF-MSDS1-256M-21E

SQF MICRO SD C10 SLC 512M (-40~85°C) SQF-MSDS1-512M-21E

SQF MICRO SD C10 SLC 1G (-40~85°C) SQF-MSDS1-1G-21E

SQF MICRO SD C10 SLC 2G (-40~85°C) SQF-MSDS1-2G-21E

SQFlash

Industrial Class 10 Micro SD Card

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REV 0.3 Page 22 of 22 May. 4, 2016

MLC

Product Advantech PN

SQF MICRO SD C10 MLC 4G (-25~85°C) SQF-MSDM1-4G-21C

SQF MICRO SD C10 MLC 8G (-25~85°C) SQF-MSDM1-8G-21C

SQF MICRO SD C10 MLC 16G (-25~85°C) SQF-MSDM1-16G-21C

SQF MICRO SD C10 MLC 32G (-25~85°C) SQF-MSDM1-32G-21C

SQF MICRO SD C10 MLC 64G (-25~85°C) SQF-MSDM1-64G-21C

SQF MICRO SD C10 MLC 4G (-40~85°C) SQF-MSDM1-4G-21E

SQF MICRO SD C10 MLC 8G (-40~85°C) SQF-MSDM1-8G-21E

SQF MICRO SD C10 MLC 16G (-40~85°C) SQF-MSDM1-16G-21E

SQF MICRO SD C10 MLC 32G (-40~85°C) SQF-MSDM1-32G-21E

SQF MICRO SD C10 MLC 64G (-40~85°C) SQF-MSDM1-64G-21E

Ultra MLC

Product Advantech PN

SQF MICRO SD C10 UMLC 2G (-25~85°C) SQF-MSDU1-2G-21C

SQF MICRO SD C10 UMLC 4G (-25~85°C) SQF-MSDU1-4G-21C

SQF MICRO SD C10 UMLC 8G (-25~85°C) SQF-MSDU1-8G-21C

SQF MICRO SD C10 UMLC 16G (-25~85°C) SQF-MSDU1-16G-21C

SQF MICRO SD C10 UMLC 32G (-25~85°C) SQF-MSDU1-32G-21C

SQF MICRO SD C10 UMLC 2G (-40~85°C) SQF-MSDU1-2G-21E

SQF MICRO SD C10 UMLC 4G (-40~85°C) SQF-MSDU1-4G-21E

SQF MICRO SD C10 UMLC 8G (-40~85°C) SQF-MSDU1-8G-21E

SQF MICRO SD C10 UMLC 16G (-40~85°C) SQF-MSDU1-16G-21E

SQF MICRO SD C10 UMLC 32G (-40~85°C) SQF-MSDU1-32G-21E

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

Advantech:
SQF-MSDS1-2G-85E SQF-MSDS1-8G-85C SQF-MSDU1-16G-21E SQF-MSDU1-32G-21C SQF-MSDM1-32G-21C
SQF-MSDU1-4G-21E SQF-MSDM1-8G-21C SQF-MSDS1-8G-85E SQF-MSDM1-16G-21C SQF-MSDU1-8G-21C

SQF-MSDM1-32G-21E SQF-MSDM1-64G-21C SQF-MSDU1-32G-21E SQF-MSDS1-2G-85C SQF-MSDM1-8G-21E
SQF-MSDU1-16G-21C SQF-MSDM1-16G-21E SQF-MSDM1-64G-21E SQF-MSDM1-4G-21C SQF-MSDS1-4G-85E
SQF-MSDS1-1G-85C SQF-MSDM1-4G-21E SQF-MSDS1-1G-85E SQF-MSDU1-2G-21E SQF-MSDU1-4G-21C
SQF-MSDU1-8G-21E SQF-MSDS1-4G-85C SQF-MSDU1-2G-21C