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Preface iii
Conventions
Take note of the following conventions used throughout this
manual to make sure that users perform certain tasks and
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Additional information, aids, and tips that help users perform
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NOTE:
NOTE:
Information to prevent minor physical injury, component damage, data loss, and/or program corruption when trying to com-
CAUTION:
WARNING:
plete a task.
Information to prevent serious physical injury, component
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complete a specific task.
ivPreface
MXE-200
Table of Contents
Preface.................................................................................... iii
List of Tables.......................................................................... xi
List of Figures...................................................................... xiii
ADLINK’s new Matrix MXE-200/200i ultra-compact embedded
platform, based on the Intel
E3826, delivers the most reliable I/O design for maximum connectivity, and a full aluminum alloy encl osure with industry- class construction makes it the embedded system of choice for industrial
automation and applications demanding reliability in harsh environments. Combined with ADLINK’s embedded SEMA Clo ud solution,the MXE-200/200i delivers manageability and robustness
required by mission critical operations. In addition, MXE-200i fully
supports Intel
integrated Wind River
McAfee Embedded Control, all together guaranteeing cornerstone
manageability and security critical to IoT-ready platforms.
With its two GbE LAN, two COM, two USB 2.0 and one USB 3.0
host ports, optional four isolated DI and four isolated DO w/ interrupt support, dual mini PCIe slots with one mSATA support and
USIM socket support communication with connections such as
WiFi, BT, 3G, and LTE, the MXE-200/200i enables seamless in terconnection, ensuring interoperability between systems. Matrix’s
proven rugged construction assures operation in harsh environments with operating shock tolerance up to 100 G and an
extended optional operating temperature range of -20°C to 70°C.
®
Gateway Solutions for the Internet of Things (IoT),
®
Atom™ SoC processor E3845/
®
Intelligent Device Platform XT, and
Introduction 1
Implementing ADLINK’s proprietary SEMA Cloud tool, the MXE200/200i maximizes manageability and security for a world of
applications, delivering efficient remote monitoring of system activity and health in real time, system control over a robust secured
channel, and complete, fully manageable utilization of system
resources. All told, the MXE-200/200i presents an intelligent,
robust embedded system supporting wide application development and easy service deployment, presenting outstanding performance in Intelligent Transportation, Facility Management,
Industrial Automation and Internet of Things (IoT).
1.2Features
X Intel
X Extremely compact: 120 (W) x 100 (D) x 55 (H) mm
X Rich I/O:
X Optional DIN-rail/wall mounting
X Included ADLINK SEMA Cloud solution
X Full support for Intel
®
Atom™ SoC processor E3845/E3826
Z 1x HDMI, 2x USB 2.0 + 1x USB 3.0, 2x GbE ports,
optional 4 isolated DI/O
Z 2x mPCIe slots (one supporting mSATA), 1x USIM
socket, 1x SDIO
®
Gateway Solutions for the Internet of
Things (IoT)
2Introduction
MXE-200
1.3Specifications
MXE-201MXE-202
System Core
ProcessorIntel® Atom™ E3845Intel® Atom™ E3826
ChipsetSoC with processor
Video1x HDMI
Memory2 GB DDR3L 1066 MHz memory down
I/O Interface
Ethernet2 GbE ports (2x Intel
Serial Ports
USB1 USB 3.0 ports + 2 USB 2.0 port
DIO4 optional DIO w/ 1.5KV isolation
Mini PCIe
USIM
WDTSupports watchdog timer
Power Supply
DC Input
AC Input
Storage
SD1 SD slot (SD/SDHC up to 16G)
mSATA1 mSATA shares slot with mini PCIe
Physical
Dimensions
Weight650 g (1.43 lbs)
MountingDIN-RAIL / Wall-mount kit
Environmental
Operating Temperature Standard: 0°C to 50°C (w/HDD)
2 internal PCIe mini card sockets w/ 1 mSATA
support
1 USIM socket for 3G communication (used for a
3G-mini module )
Built-in 6-36 VDC wide-range DC input
3P pluggable connectors with latch (GND, V-, V+)
Optional 40 W external AC-DC adapter for AC
input
120 (W) x 100 (D) x 55 (H) mm (4.68” x 3.9” x
2.17”)
®
I210IT)
Introduction 3
MXE-201MXE-202
Extended Temperature
-20°C to 60°C
(w/ industrial mSA TA)
-20°C to 70°C
(w/ industrial mSATA)
Storage Temperature-40°C to 85°C (excl. HDD/SDD/CFAST)
Humidity~95% @ 40°C (non-condensing)
VibrationOperating, 5 Grms, 5-500 Hz, 3 axes (w/ mSA TA)
ESDContact +/-4 KV and Air +/-8 KV
Shock
Operating, 50 G, half sine 11 ms duration (w/
mSATA)
EMCCE and FCC Class A
SafetyUL, CB
Cold boot of the system at -20°c and operation with 100% loading at 60°c is provided when the industrial solid-state drive stor-
NOTE:
NOTE:
age option is implemented.
Power Consumption
Power off0.3W
System Idle6.3W
Processor full load12.5W
In shutdown mode with DC input and
only USB keyboard/mouse
Under Windows Desktop with no
application programs executed
Under Windows with 100% CPU
utilization and 2D/3D graphics load
Under Windows with 100% CPU
System full load22W
utilization and simultaneous access to
all I/O devices
Recommended power
supply
40W
With consideration of voltage de-rating
under high environmental temperature
4Introduction
1x HDMI
3x U/D LED
1x SD
1x USB 3.0
2x USB
Type A
2x RJ-45
2x DB-9
USIM
2x USB
1x
GbE
1x USB
4DI+ 4DO
1x USB 3.0
USB hub
2x USB
2x
mini
PCIe
I210IT
2x HSUART
DDI#1
3x GPIO
1x SDIO
8x GPIO
2x USB
SATA
SATA
SATA
Switch
redriver
PCIe 1/2
GbE
PCIe 3
2x PCIe x1, PCIe port 1,2
16x GPIO
2x UART
2x USB2.0 host, ports 0,1
1x USB2.0 device
1x I2C (optional)
2x Ethernet 10/100 MBit/s
1x SD/SDIO/eMMC
Power Management
RTC
RFID
314-pin Golden finger
(optional)
2x I2C
BOOT Select
GbE
BMC
SPIBIOS
PCIe 3
SATA
USB 3.0 on AFB
I210IT
DDI#1
I2C
LSPI
PCIe 0
Figure 1-1: MXE-200 Functional Block Diagram
Intel®
Quark
SoC
X1000
Series
Intel®
Bay Trail
Soc
DDR3
MXE-200
DDR3
Memory
down
Up to 2 GB
(ECC
option)
1.4Unpacking Checklist
Before unpacking, check the shipping carton for an y damage. If
the shipping carton and/or contents are damaged, inform your
dealer immediately. Retain the shipping carton and packing
materials for inspection. Obtain authorization from your dealer
before returning any product to ADLINK. Ensure that the following items are included in the package.
X MXE-200 unit
X DIN-RAIL/wall-mounting brackets
X Screw pack for DIN-RAIL/wall-mounting and storage fixing
X Quick Start Guide
X ADLINK All-in-One DVD
Introduction 5
1.5Mechanical Drawings
All dimensions shown are in millimeters (mm) unless otherwise
stated.
NOTE:
NOTE:
100
120
Figure 1-2: Top View
6Introduction
Figure 1-3: Front View
MXE-200
55
Figure 1-4: (Right) Side View
Introduction 7
1.6Front Panel I/O Connectors
This section describes the I/O connectors located on the front
panel of the MXE-200.
G
H
APower ButtonEHDMI
BReset ButtonFGbE Port x2
CLED IndicatorsGUSB 2.0 Port x2
E
F
Figure 1-5: Front Panel I/O
D
BC
A
DSD CardHUSB 3.0 (Push-Push , Type II)
Table 1-1: MXE-200 Front Panel I/O Connector Legend
1.6.1Power Button
The power button is a non-latched push button with a blue LED
indicator. System is turned on when button is pressed, and the
8Introduction
MXE-200
power LED lit. If the system hangs, depressing the button for 5
seconds powers down the system.
1.6.2LED Indicators
In addition to the LED of the power button, thr ee LEDs on the fro nt
panel indicate the following operations.
IndicatorColorDescription
Indicates watchdog timer status.
Watchdog (WDT) Yellow
Hard disk driveOrange
StandbyBlue
T able 1-2: LED Indicators
Flashes when watchdog timer starts,
and when timer is expired, system will
auto-reboots.
When blinking, indicates the SAT A hard
driver is active
Indicates the system is in power
standby mode
1.6.3Reset Button
The reset button executes hard reset for the MXE-200.
Introduction 9
1.6.4HDMI Connector
Provides connection to HDMI monitor or VGA, DVI monitor via
HDMI-to-VGA adapter cable, and HDMI-to-DVI adapter cable.
The two Gigabit Ethernet ports on the front panel are based on an
Intel WGI210IT GbE controller.
The WG210IT supports:
X IEEE 802.3az Energy Efficient Ethernet
X IEEE 1588/802.1AS precision time synchronization
X IEEE 802.3av traffic shaper
X Interrupt moderation, VLAN support, IP checksum offload
X PCIe OBFF (Optimized Buffer Flush/Fill) for improved sys-
tem power management
X Four transmit and four receive queues
X RSS and MSI-X to lower CPU utilization in multi-core sys-
tems
X ECC - error correcting memory in packet buffers
X Wake-On-LAN
X NC-SI for greater bandwidth p assthrough
X SMBus low-speed serial bus to pass network traffic
X Preboot eXecution Environment (PXE) flash interface sup-
port
X Jumbo frame support
X LAN Teaming
LEDLED Color StatusDescription
OFFEthernet port is disconnected
Ethernet port is connected with no
activity
Ethernet port is connected and
active
Active/Link Yellow
ON
Flashing
OFF10 Mbps
Speed
Green/
Orange
Green100 Mbps
Orange1000 Mbps
Table 1-4: Gigabit Ethernet Port LED Function
Introduction 11
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