ZTE MW3650 Users Manual

Hardware Development Guide of

Version V1.0, 2015-09-28

Module Product

MW3650

Hardware Development Guide of Module Products

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Copyright © 2015 Shenzhen ZTEWelink Technology Co., Ltd. All rights reserved. The document contains ZTEWelink’s proprietary information. Without the prior written permission of ZTEWelink, no entity or individual is allowed to reproduce, transfer, distribute, use and disclose this document or any image, table, data or other information contained in this document.

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The product meets the design requirements of environmental protection and personal security. The storage, use or disposal of products should abide by the product manual, relevant contract or the laws and regulations of relevant country.

ZTEWelink reserves the right to make modifications on the product described in this document without prior notice, and keeps the right to revise or retrieve the document any time.

If you have any question about the manual, please consult the company or its distributors promptly.

MW3650

Revision History

Version Date Description

1.0 2015-09-28 1st released version

MW3650

Hardware Development Guide of Module Products

Contents

Figures ................................................................................................................................................. VII

Tables ................................................................................................................................................. VIII

1 About This Document .................................................................................................................. 10

1.1 Application Range ......................................................................................................... 10

1.2 Purpose .......................................................................................................................... 10

1.3 Supported & Reference Documents List ....................................................................... 11

1.4 Abbreviations ................................................................................................................ 11

2 Product Overview ......................................................................................................................... 13

MW3650

2.1 Technical Parameters ..................................................................................................... 14

2.2 Function Overview ........................................................................................................ 16

2.2.1 Baseband Function ................................................................................................ 16

2.2.2 Radio Frequency Function .................................................................................... 16

3 Mechanic Features ....................................................................................................................... 18

3.1 Module Illustration ........................................................................................................ 18

3.2 Module hex-vision images ............................................................................................ 19

3.3 Module Main Board PCB Encapsulation Dimension Diagram ..................................... 19

3.4 PCB Design Guidelines ................................................................................................. 21

3.5 Suggestions for Heat-dissipation Design ....................................................................... 22

4 Interfaces....................................................................................................................................... 23

4.1 Definition of PINs ......................................................................................................... 23

4.2 Hardware interface description ...................................................................................... 27

4.3 Ground ........................................................................................................................... 28

4.4 Power Interface .............................................................................................................. 28

4.4.1 V_MAIN PINS ..................................................................................................... 28

4.4.2 VREF PINS ........................................................................................................... 30

4.4.3 Power interface PCB Layout and Wiring Guidance .............................................. 30

4.5 Power-on/Power-off & Reset......................................................................................... 31

4.5.1 Power On .............................................................................................................. 31

Hardware Development Guide of Module Products

4.5.2 Power Off .............................................................................................................. 31

4.5.3 Reset ...................................................................................................................... 32

4.5.4 Power-on/Power-off Flow ..................................................................................... 32

4.6 UART Interface ............................................................................................................. 34

4.7 (U)SIM Card Interface .................................................................................................. 36

4.8 USB Interface ................................................................................................................ 38

4.9 Working Status Indicator Interface ................................................................................ 39

4.10 SPI Bus Interface ........................................................................................................... 40

4.11 I2C Bus .......................................................................................................................... 41

4.12 User Interface ................................................................................................................ 42

5 Antenna ......................................................................................................................................... 43

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5.1 Preliminary Antenna Evaluation .................................................................................... 43

5.2 Antenna Design Guidance ............................................................................................. 43

5.3 Suggested Antenna Location ......................................................................................... 44

5.4 RF PCB wire guidelines ................................................................................................ 45

5.5 EMC Requirements ....................................................................................................... 45

5.6 Index Requirement of Antenna ...................................................................................... 46

5.6.1 Passive Index of Antenna ...................................................................................... 46

5.6.2 Active Index of Antenna ....................................................................................... 47

5.6.3 OTA Test method of Whole Machine Antenna ...................................................... 48

6 Electric Feature ............................................................................................................................ 49

6.1 Interface PWL ............................................................................................................... 49

6.2 Power Supply ................................................................................................................ 49

6.3 Working Current ............................................................................................................ 49

7 Technical Index of Radio Frequency .......................................................................................... 51

7.1 Index of RF under UMTS Mode ................................................................................... 51

7.1.1 Maximum Transmission Power ............................................................................. 51

7.1.2 Receiving Sensibility ............................................................................................ 52

7.1.3 Spurious Emission Index ....................................................................................... 52

7.2 Index of RF under GPRS/GSM/EDGE Mode ............................................................... 52

7.2.1 Maximum Transmission Power ............................................................................. 53

7.2.2 Receiving Sensibility ............................................................................................ 53

Hardware Development Guide of Module Products

7.2.3 Spurious Emission Index ....................................................................................... 53

8 Related Test & Test Standard ...................................................................................................... 55

8.1 Testing Reference .......................................................................................................... 55

8.2 Description of Testing Environment .............................................................................. 56

8.3 Reliability Testing Environment .................................................................................... 56

8.4 Reliability Testing Result .............................................................................................. 57

8.5 ESD Characteristic ........................................................................................................ 58

9 SMT Process and Baking Guide ................................................................................................. 59

9.1 Storage Requirements .................................................................................................... 59

9.2 Module’s Position Requirements on Main board .......................................................... 59

9.3 Module Planeness Standard ........................................................................................... 60

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9.3.1 Process Routing Selection ..................................................................................... 60

9.3.2 Solder Paste Selection ........................................................................................... 60

9.3.3 Design of module PAD’s steel mesh opening on main board................................ 61

9.3.4 Module Board’s SMT process ............................................................................... 62

9.3.5 Module Soldering Reflow Curve .......................................................................... 63

9.3.6 Reflow method ...................................................................................................... 64

9.3.7 Maintenance of defects ......................................................................................... 64

9.4 Module’s Baking Requirements .................................................................................... 64

9.4.1 Module’s Baking Environment ............................................................................. 64

9.4.2 Baking device and operation procedure ................................................................ 65

9.4.3 Module Baking Conditions ................................................................................... 65

10 Safety Warnings and Notes .......................................................................................................... 66

Hardware Development Guide of Module Products

Figures

Figure 2-1 System Connection Structure ............................................................................. 16

Figure 4-1 PIN Configuration Diagram ............................................................................... 23

Figure 4-2 Wakeup Waveform .............................................................................................. 26

Figure 4-3 LDO Power Supply ............................................................................................ 29

Figure 4-4 DC/DC Switching Power Supply ....................................................................... 30

Figure 4-5 Power On & Reseting Circuit Reference Diagram ............................................. 31

Figure 4-6 Power-on Sequence Chart of Module ................................................................. 33

Figure 4-7 Power-off Sequence Chart of Module ................................................................ 33

Figure 4-8 UART Interface PWL Conversion Reference Design ........................................ 35

Figure 4-9 Module Serial Port & AP Application Processor ............................................... 35

Figure 4-10 The Connection of UART and Standard RS-232-C Interface .......................... 36

Figure 4-11 (U)SIM Card Console Circuit Reference Design ............................................. 37

Figure 4-12 USB Interface Circuit Reference Design Schematic Diagram ......................... 39

Figure 5-1 Translation Circuit Diagram ............................................................................... 44

Figure 5-2 OTA Test System ............................................................................................... 48

Figure 9-1 Green oil and white oil at module’s position on main board .............................. 60

Figure 9-2 Module Board’s Steel Mesh Diagram ................................................................ 62

Figure 9-3 Material Module Pallet ....................................................................................... 62

Figure 9-4 Module Furnace Temperature Curve Diagram ................................................... 63

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Hardware Development Guide of Module Products

Tables

Table 1-1 Support Documents List ...................................................................................... 11

Table 1-2 Abbreviation List ................................................................................................. 11

Table 2-1 Module Frequency band configuration ................................................................ 13

Table 2-2 Major Technical Parameters ................................................................................ 14

Table 2-3 Working Frequency Band .................................................................................... 17

Table 3-1 Product Illustration .............................................................................................. 18

Table 4-1 PIN Interface Definition ...................................................................................... 23

Table 4-2 Voltage Current Characteristic ............................................................................ 29

Table 4-3 Power-on/Power-off Time ................................................................................... 33

Table 4-4 The Definition of UART Signal .......................................................................... 34

Table 4-5 The Definition of USIM Card Interface............................................................... 36

Table 4-6 The Definition of USB PINS ............................................................................... 38

Table 4-7 The Correspondence of Port Map ........................................................................ 39

Table 4-8 Indicator Light Reference Design Schematic Diagram ....................................... 40

Table 4-9 The Description of Working Status Indicator Light ............................................ 40

Table 4-10 The Definition of SPI Interface ......................................................................... 40

Table 4-11 I2C Reference Circuit Design ............................................................................ 41

Table 5-1 The Passive Index Reference of Main Antenna about PAD product ................... 46

Table 5-2 The Passive Index Reference of Diversity Antenna about PAD product ............ 46

Table 5-3 Recommended Product OTA Index Requirement ............................................... 47

Table 6-1 Main Out ward Interface PWL of Module ........................................................... 49

Table 6-2 Input Voltage ....................................................................................................... 49

Table 6-3 The Current Consumption under Sleep Mode ..................................................... 50

Table 6-4 The Working Current of MODULE .................................................................... 50

Table 7-1 Maximum Transmission Power ........................................................................... 51

Table 7-2 Reference of Receiving Sensitivity ...................................................................... 52

Table 7-3 Spurious Emission Index ..................................................................................... 52

Table 7-4 Maximum Transmission Power of GSM850/900/1800/1900 (GMSK/8PSK) .... 53

Table 7-5 Receiving Sensitivity ........................................................................................... 53

Table 8-1 Testing Standard .................................................................................................. 55

Table 8-2 Testing Environment ........................................................................................... 56

Table 8-3 Testing Instrument & Device ............................................................................... 56

Table 8-4 Reliability Features .............................................................................................. 56

Table 8-5 The Temperature Testing Result Under Windless Condition .............................. 57

Table 8-6 The High/low Temperature Running and Storage Testing Result ....................... 57

Table 8-7 Module ESD Features .......................................................................................... 58

Table 9-1 Baking parameters ............................................................................................... 59

Table 9-2 LCC module PAD’s steel mesh opening ............................................................. 61

MW3650

Hardware Development Guide of Module Products

R&TTE Regulation:

In all cases assessment of the final product must be mass against the Essential requirements of

the R&TTE Directive Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant

Article 3.2 requirements.

Hereby, ZTE CORPORATION declares that this product is in complies with the essential

requirements of Article 3 of the R&TTE 1999/5/EC Directive.

MW3650

Hardware Development Guide of Module Products

About This Document

1.1 Application Range

This document is applicable as the hardware development guide of MW3650 module produce. Users need to design products according to the requirement and guide of this document. This document only can be applied to the hardware application development of MW3650 module product.

1.2 Purpose

This document provides the hardware solutions and development fundamentals for a product with the module. By reading this document, the user can have an overall knowledge of the module and a clear understanding of the technical parameters. With this document, the user can successfully fulfill the application and development of 3G wireless Internet product or equipment.

Besides the product function features and technical parameters, this document also provides the product reliability tests and related testing standards, business function realization process, RF performance indexes and a guide on the design of user circuits, to provide the user with a complete design reference.



NOTE:

At present, our company has a large number of module products. Users may come across many module board welding problems when using the module. To ensure the module board welding first pass yield and guarantee the module manufacturing and welding quality in the following integration process, please do as the chapter 9 of Manufacturing Guide in this document.

MW3650

Hardware Development Guide of Module Products

1.3 Supported & Reference Documents List

Besides this hardware development guide, we also provide the Datasheet document, software development guide and AT command reference guide. Table 1-1 is the support document list.

Table 1-1 Support Documents List

Document NO. Document Name

1 ZTEWelink Software Development Guide of Module

Product(MG3732_V2A&MW3650).pdf

2 ZTEWelink MW3650 Datasheet.pdf

3 AT Command reference guide for ZTEWelink

MG3732_V2A,MW3650 Module.pdf

1.4 Abbreviations

Table 1-2 is a list of abbreviations involved in this document, as well as the English full names.

Table 1-2 Abbreviation List

Abbreviations Full Name

ADC Analog-Digital Converter

ARP Antenna Reference Point

BER Bit Error Rate

BTS Base Transceiver Station

CDMA Code Division Multiple Access

CS Coding Scheme

CSD Circuit Switched Data

CPU Central Processing Unit

DAC Digital-to-Analog Converter

DCE Data Communication Equipment

DSP Digital Signal Processor

DTE Data Terminal Equipment

DTMF Dual Tone Multi-Frequency

DTR Data Terminal Ready

EGSM Enhanced GSM

EMC Electromagnetic Compatibility

Hardware Development Guide of Module Products

Abbreviations Full Name

EMI Electro Magnetic Interference

ESD Electronic Static Discharge

ETS European Telecommunication Standard

FDMA Frequency Division Multiple Access

FR Full Rate GPRS General Packet Radio Service

GSM Global Standard for Mobile Communications

IC Integrated Circuit

IMEI International Mobile Equipment Identity

ISO International Standards Organization

MW3650

ITU International Telecommunications Union

LCD Liquid Crystal Display

LED Light Emitting Diode

MCU Machine Control Unit

PCB Printed Circuit Board

PCL Power Control Level

PCS Personal Communication System

PDU Protocol Data Unit

PPP Point-to-point protocol

RAM Random Access Memory

RF Radio Frequency ROM Read-only Memory

RTC Real Time Clock

SIM Subscriber Identification Module

SMS Short Message Service

SPI Serial Peripheral Interface

TE Terminal Equipment also referred it as DTE

UART Universal asynchronous receiver-transmitter

UIM User Identifier Management

USB Universal Serial Bus

UMTS Universal Mobile Telecommunication System

WCDMA Wideband Code Division Multi Access

MW3650

Hardware Development Guide of Module Products

MW3650 is a WCDMA/HSDPA/GSM/GPRS/EDGE industry module developed by our company, and it is a wireless Internet module with LCC interface. The module has voice(optional), short message and data service functions. The downlink peak data rate is 3.6Mbps and the uplink peak data rate is 384Kbps, so it can supply the users with economical high speed internet access business, wireless data business and so on. It is widely applied to but not limited to the various products and equipment such as modem, embedded module, wireless phone, multimedia phone and touch screen communication device, PAD, vehicle-mounted terminals and electric consumed devices, using the MW3650 module.

The function features of this module are described as bellow:

1) Support UMTS/HSDPA 850(900)/1900/2100MHz frequency band,

1800/1900MHz frequency band.

Can supply GSM/GPRS/EDGE and UMTS/HSDPA high speed data access service in a mobile environment.

Support SMS and voice functions.

Product Overview

GSM/GPRS/EDGE 850/900/

Supply (U)SIM card interface (3.0V/1.8V), USB2.0 interface, 8-wire UART (compatible with 2-wire UART), power on/off, reset and so on.

Taking MW3650 module as an example, this document introduces the logical structure, hardware interfaces and main function in detail. It also supplies the corresponding design reference of hardware and structure.



NOTE:

At present,

according to the corresponding requirement of customers as is shown blow.

the frequency band of MW3650 module in UMTS mode can take proper tailoring or configuration

Table 2-1 Module Frequency band configuration

Configuration GSM Bands WCDMA Bands

MW3650V1A 850/1900MHz 1900/850MHz

MW3650V1B 900/1800MHz 2100/900MHz

MW3650V1C 900/1800MHz 2100MHz

MW3650

Hardware Development Guide of Module Products

2.1 Technical Parameters

The major features of the module can be described from the aspects of mechanic feature, base band, radio frequency, technical standard, environment features and so on. Table below is a list of the major technical parameters and features supported by module.

Table 2-2 Major Technical Parameters

Type Item Specifications

Dimensions (L × W × H) 30.0mm × 30..0mm × 2.3mm

Mechanical Feature

Weight About 5g

Encapsulation type LCC with 80 pins

Baseband

(U)SIM/SIM

USB interface USB 2.0 HIGH SPEED

UART interface 8-wire UART

Max Power Dissipation About 2.2W

Power Supply DC 3.3~4.2V, typical value is 3.8V

Working Current2

GSM Frequency Band

UMTS Frequency Band

Diversity Reception Frequency Band

Max. Transmitter Power

Standard SIM card interface 3V SIM card and 1.8V SIM card

Peak current About 0.6A

The average current in normal working

Standby current

EDGE/GPRS/GSM：1900/1800/900/850MHz

HSDPA/WCDMA：2100/1900/850(900)MHz;

NA1

UMTS2100/1900/900/850: Power Class 3 (+24dBm +2.5/-1.5dBm)

GSM/GPRS 850MHz/900MHz: Power Class 4 (+33dBm +

2.5/-0.5 dBm) GSM/GPRS 1800MHz/1900MHz: Power Class 1 (+30dBm

+2.5/-0.5 dBm) EDGE 850MHz/900MHz: Power Class E2 (+27dBm

+4.5/-1.5dBm) EDGE 1800MHz/1900MHz: Power Class E2 (+26dBm

+4.5/-2.5dBm)

About 540mA@UMTS 2100 About 239mA@GSM 900

About 5mA@UMTS About 5mA@GSM

Type Item Specifications

WCDMA2100 : ≤-108dBm WCDMA1900 : ≤-109dBm

Receiving sensitivity

Main Antenna External, Provide Antenna PAD

Data Rate

WCDMA900 : ≤-109dBm WCDMA850 : ≤-109 dBm

GSM850/900/1800/1900 : ≤-107dBm

GSM CS: UL 9.6kbps/DL 9.6kbps GPRS: Multi-slot Class 10 EDGE: Multi-slot Class 12 WCDMA CS: UL 64kbps/DL 64kbps WCDMA PS: UL 384kbps/DL 384kbps

MW3650

Hardware Development Guide of Module Products

Technical Standard

Environmen t Feature3

HSDPA HSDPA: DL 3.6Mb/s(Category 6)

Protocol HSDPA/WCDMA/EDGE/GPRS/GSM

3GPP Protocol R5, R4, R99

Windows XP (SP2 and later)

Windows Vista & 7

Working Temperature -30 ~ 75° C

Storage Temperature -40 ~ 85° C

Humidity 5%~ 95%

DATA Support

SMS

Voice Support

WinCE

Linux Android

Support ultra-long SMS Support Text and PDU mode Point to point MO and MT

Application

MMS

TCP/IP Support

UDP/IP Support

Phonebook Support

Upgrade Support

Support (Not support built-in MMS protocol stack temporarily)

MW3650

Hardware Development Guide of Module Products



NOTE:

“NA” indicates nonsupport.

Working current value is the average value tested under the max transmitter power. The value may be different in different condition and environment. Please take the actual measurement as the reference.

Please make sure that the module is started up in the recommended working current range and working temperature to avoid the damage or the abnormal working of the module.

2.2 Function Overview

2.2.1 Baseband Function

When connected with the system board, the module mainly includes the following signal groups: USB signal, (U)SIM card signal, status querying signal, UART signal, module power-on/resetting signal, main antenna interface and power-supply interface. Figure below is the system connection structure.

Figure 2-1 System Connection Structure

2.2.2 Radio Frequency Function

The working frequency band of module is shown in the table below.

a) Support HSDPA/WCDMA 850(900)/1900/2100MHz.

Hardware Development Guide of Module Products

b) Support GSM/EDGE/GPRS 850/900/1800/1900MHz.

c) The highest downlink rate supported by HSDPA is 3.6Mbit/s.

d) PS domain supports EDGE CLASS12/GPRS CLASS10 bearer service.

e) CS domain supports 64Kbit/s data service in WCDMA mode.

Table 2-3 Working Frequency Band

Working Frequency Band Uplink Frequency Band Downlink Frequency Band

UMTS850 (band V) 824 MHz — 849 MHz 869 MHz — 894 MHz

UMTS900 (band VIII) 880 MHz — 915 MHz 925 MHz — 960 MHz

UMTS1900 (band II) 1850 MHz — 1910 MHz 1930 MHz — 1990 MHz

MW3650

UMTS2100 (band I) 1920 MHz — 1980 MHz 2110 MHz — 2170 MHz

GSM850 824 MHz — 849MHz 869 MHz — 894 MHz

GSM900 890 MHz — 915MHz 925 MHz — 960MHz

GSM1800 1710 MHz — 1785MHz 1805 MHz — 1880MHz

GSM1900 1850 MHz — 1910MHz 1930 MHz — 1990MHz

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Hardware Development Guide of Module Products

Mechanic Features

3.1 Module Illustration

The Product Illustration of module is shown in the Figure 3-1.

Table 3-1 Product Illustration



NOTE:

The picture above is just for reference; please take the actual products as the reference.

 Dimensions (L × W × H): 30.0 mm × 30.0mm ×2.3mm



Weight: about 5g

3.2 Module hex-vision images

The module hex-vision images are shown in figure 3-2 (units: mm).

Figure 3-2 module hex-vision images

MW3650

Hardware Development Guide of Module Products

Note: the height in the figure above is without the module label, so it is 2.2mm.

3.3 Module Main Board PCB Encapsulation Dimension Diagram

The detailed dimension of PCB welding panel is shown in figure 3-3 (units: mm).

Hardware Development Guide of Module Products

Figure 3-3 The detailed dimension of PCB welding panel

MW3650

Figure 3-4 Recommended Welding Panel Design Dimension of Customer Interface Board

Hardware Development Guide of Module Products

Figure 3-5 PCB Bottom Welding Panel

MW3650

3.4 PCB Design Guidelines

To ensure the module has good performance in the application process, the users of modules should do as the following guidelines in the process of PCB wire designing:

1) For testing and maintenance convenience, the customer dev board PCB should be hollowed out to

show the test pionts as is shown in the red box in figure 3-5 so as to do JTAG installation and debugging.

2) The rest round test points are used for module power supply and calibration in SMT production

process. Do not short out these test points when connect the module to main board.

3) In the design process, the strongly disturbing signals such as clock signal, high-frequency digital

signal and switching signal of switch power supply should be placed far away from the module.

4) Please pay attention to the protection of RF and audio analog signal. If condition permits, it is

better to separate the analog ground and digital ground. After the separation, the signal line or power line should not pass over the separation channel.

5) To ensure the integrity and circulation ability, if condition permits, it is better to adopt planar form.

6) Please ensure the integrity of the module ground to reduce the leak of disturbing signal.

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