ZETEX ZXMN3A02X8 Technical data

查询ZXMN3A02X8供应商
30V N-CHANNEL ENHANCEMENT MODE MOSFET
SUMMARY V
(BR)DSS
This new generation of TRENCH MOSFETs from Zetex utilizes a unique structure that combines the benefits of low on-resistance with fast switching speed. This makes them ideal for high efficiency, low voltage, power management applications.
=30V; R
DS(ON)
ZXMN3A02X8
=0.025 ID=6.7A
FEATURES
Low on-resistance
Fast switching speed
Low threshold
Low gate drive
Low profile SOIC package
APPLICATIONS
DC - DC Converters
Power Management Functions
Disconnect switches
Motor control
ORDERING INFORMATION
DEVICE REEL
ZXMN3A02X8TA 7” 12mm 1000 units
ZXMN3A02X8TC 13” 12mm 4000 units
DEVICE MARKING
ZXMN 3A02
SIZE
TAPE WIDTH
QUANTITY PER REEL
Top View
ISSUE 1 - JANUARY 2002
1
ZXMN3A02X8
ABSOLUTE MAXIMUM RATINGS.
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage Gate Source Voltage Continuous Drain Current V
Pulsed Drain Current (c) Continuous Source Current (Body Diode) (b) Pulsed Source Current (Body Diode) (c) Power Dissipation at T
Linear Derating Factor Power Dissipation at T
Linear Derating Factor Operating and Storage Temperature Range
A
A
=10V; TA=25°C (b)
GS
V
=10V; TA=70°C (b)
GS
V
=10V; TA=25°C (a)
GS
=25°C (a)
=25°C (b)
V
DSS
V
GS
I
D
I
DM
I
S
I
SM
P
D
P
D
T
j:Tstg
THERMAL RESISTANCE
PARAMETER SYMBOL VALUE UNIT
Junction to Ambient (a)
Junction to Ambient (b)
R
R
θJA
θJA
30 V
20 V
6.7
5.4
5.3 24 A
3.2 A 24 A
1.1
8.8
1.8
14.4
-55 to +150 °C
113 °C/W
70 °C/W
mW/°C
mW/°C
A
W
W
NOTES (a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper,
in still air conditions (b) For a device surface mounted on FR4 PCB measured at t10 secs. (c) Repetitive rating 25mm x 25mm FR4 PCB, D = 0.05, pulse width 10s - pulse width limited by maximum
junction temperature.
ISSUE 1 - JANUARY 2002
2
CHARACTERISTICS
ZXMN3A02X8
* For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.
ISSUE 1 - JANUARY 2002
3
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