YEALINK YL1023 User Manual

YL1023

IEEE 802.11a/b/g/n/ac Wireless LAN and Bluetooth Combo Stamp Module

1. General Description

The YL1023 IEEE 802.11 a/b/g/n/ac SDIO Wi-Fi with Bluetooth 4.2 combo
stamp module is a highly integrated wireless local area network (WLAN)
solution to let users enjoy the digital content through the latest
wireless technology without using the extra cables and cords. It
combines with Bluetooth 4.2 and provides a complete 2.4GHz Bluetooth
system which is fully compliant to Bluetooth 4.2 and v2.1 that supports
EDR of 2Mbps and 3Mbps for data and audio communications. It enables
a high performance, cost effective, low power, compact solution that
easily fits onto the SDIO and UART stamp module.
Compliant with the IEEE 802.11a/b/g/n/ac standard, YL1023 uses Direct
Sequence Spread Spectrum (DSSS), Orthogonal Frequency Division
Multiplexing (OFDM), BPSK, QPSK, CCK and QAM baseband modulation
technologies.
A high level of integration and full implementation of the power
management functions specified in the IEEE 802.11 standard minimize
system power requirements by using YL1023.
YL1023 module adopts QCA1023 single chip solution. The module design
is based on the QCA1023 solution.

2. Key Features

1. High speed wireless connection for Wi-Fi

2. 1(Transmit) 1(Receive) Wi-Fi and Bluetooth 4.2

3. Low power consumption and high performance

4. Enhanced wireless security

5. Fully qualified Bluetooth 4.2

6. Enhanced Data Rate(EDR) compliant for both 2Mbps and 3Mbps
supported

3. Block Diagram

A simplified block diagram of theYL1023 module is depicted in the figure
below。

Model Name

YL1023

Description

Wireless LAN &Bluetooth Stamp Module

WLAN Standard

IEEE 802.11 a/b/g/n/ac

Bluetooth Standard

Bluetooth 2.1+Enhanced Data Rate (EDR)+ BT4.2

Major Chipset

QCA1023

Host Interface

Wi-Fi : SDIO, BT :UART

Dimensions

12mm * 12mm * 2.0mm

Wi-Fi VID/PID

TBD

BT VID/PID

TBD

Weight

TBD

Operating Conditions

Voltage

power supply for host:3.3V

Temperature

-40℃~85℃

Storage temperature

-45℃~135℃

Electrical Specifications

Frequency Range

WLAN:

2.4 GHz ISM Bands 2.412-2.484 GHz
5G:5.150~5.240GHz, 5.745~5.825GHz
Bluetooth:
2402~2480MHz

Modulation

DSSS, OFDM, DBPSK, DQPSK, CCK, 16-QAM, 64­QAM,256-QAM for WLAN

GFSK (1Mbps), Π/4 DQPSK (2Mbps) and 8DPSK

(3Mbps) for Bluetooth

4. Specifications Table

Output Power

WLAN:

802.11b: 19dBm (11Mbps)

802.11g: 20dBm (54Mbps)

802.11n @2.4GHz: 19dBm (HT20 MCS7)

802.11n @2.4GHz: 19dBm (HT40 MCS7)

802.11a @5GHz: 13dBm (54Mbps)

802.11a @5GHz: 13dBm (VHT20 MCS7)

802.11ac @5GHz: 13dBm (VHT20 MCS7)

802.11ac @5GHz: 13dBm (VHT40 MCS8)

802.11ac @5GHz: 13dBm (VHT80 MCS9)

Receive Sensitivity

BT: BER < 0.1% (IQXEL80 Tx -70 Bm)

Data Rates

WLAN

802.11b: 1, 2, 5.5, 11Mbps

802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54Mbps

802.11n: up to 75Mbps-single

802.11n: up to 150Mbps

802.11ac:up to 96Mbps (20MHz channel)

802.11ac:up to 200Mbps (40MHz channel)

802.11ac:up to 433Mbps (80MHz channel)
Bluetooth
Bluetooth 2.1+EDR data rates of 1,2, and 3Mbps

Security

 WAPI
 WEP 64-bit and 128-bit encryption with H/W

TKIP processing

 WPA/WPA2(Wi-Fi Protected Access)
 AES-CCMP hardware implementation as part of

802.11i security
standard

Operating System
Compatibility

TBD

Symbol

Parameter

Maximum

Unit

VDD

3.3V power supply voltage

3.65

V

VDDIO

Voltage supply for GPIO

4.0

V

Symbol

Parameter

Rating

Unit

VDD

3.3V power supply voltage

3.135~3.465

V

5. Electrical Characteristics

5.1 Absolute Maximum Ratings

5.2 Recommended Operating Conditions