VISHAY
16797
1
2
3
4
Vishay Semiconductors
IR Receiver for High Data Rate PCM at 455 kHz
Description
The TSOP5700 is a miniaturized SMD IR receiver for
infrared remote control and IR data transmission. PIN
diode and preamplifier are assembled on lead frame,
the epoxy package is designed as IR filter.
The demodulated output signal can directly be
decoded by a microprocessor. The main benefit is the
operation with high data rates and long distances.
Features
• Photo detector and preamplifier in one package
• Internal Bandfilter for PCM frequency
TSOP5700
• Internal shielding against electrical field
disturbance
• TTL and CMOS compatibility
• Output active low
• Small size package
Special Features
• Data rate 20 kbit/s
• Supply voltage 2.7 - 5.5 V
Block Diagram
16840
10 kΩ
PIN
AGCInput
Band
Pass
Control
Demodulator
Circuit
4
V
S
3
OUT
1
GND
• Short settling time after power on
• High envelope duty cycle can be received
• Enhanced immunity against disturbance from
energy saving lamps
• Taping available for topview and sideview
assembly
Mechanical Data
Pinning:
1 = GND, 2 = NC, 3 = OUT, 4 = V
S
Application Circuit
16843
Transmitter
with
TSHFxxxx
R1+C1recommended to suppress power supply
disturbances.
R2optional for improved pulse forming.
TSOPxxxx
Circuit
V
S
OUT
GND
R1=47Ω
C1=
4.7 µF
V
R2>=
1kΩ
O
µC
+V
GND
S
Document Number 82166
Rev. 5, 14-Aug-03
www.vishay.com
1
TSOP5700
Vishay Semiconductors
Absolute Maximum Ratings
T
= 25 °C, unless otherwise specified
amb
Parameter Test condition Symbol Val ue Unit
Supply Voltage Pin 4 V
Voltage at output to supply Pin 3 VS - V
Supply Current Pin 4 I
Output Voltage Pin 3 V
Output Current Pin 3 I
Junction Temperature T
Storage Temperature Range T
Operating Temperature Range T
Power Consumption T
Electrical and Optical Characteristics
T
= 25 °C, unless otherwise specified
amb
Parameter Test condition Symbol Min Ty p . Max Unit
Supply Current (Pin 4) Dark ambient I
Ev = 40 klx, sunlight I
Supply Voltage (Pin 4) V
Transmission Distance λp = 870 nm,
IR Diode TSHF5400,
I
= 300 mA
F
λp = 950 nm,
IR Diode TSAL6400,
I
= 300 mA
F
Threshold Irradiance λp = 870 nm,
optical test signal of Fig.1
Maximum Irradiance Optical test signal of Fig.1 E
Output Voltage Low (Pin 3) 1 kΩ external pull up resistor V
Output Voltage High (Pin 3) No external pull-up resistor,
Bandpass filter quality Q 10
Out-Pulse width tolerance Optical test signal of Fig.1,
Delay time of output pulse Optical test signal of Fig.1,
Receiver start up time Valid data after power on t
Falling time Leading edge of output pulse t
Rise time No external pull up resistor t
Directivity Angle of half transmission
test signal see fig. 1
2.5 mW/m
> 2.5 mW/m
E
e
1 kΩ external pull up resistor t
distance
≤ 85 °C P
amb
SD
SH
S
d
max
d
max
E
e min
e max
QL
V
QH
∆
2
≤ Ee ≤ 30 W/m
2
2
tpo
t
don
V
f
r
r
ϕ
1/2
2.7 5 5.5 V
30
VS - 0.25 V
- 15 + 5 + 15 µs
15 36 µs
VISHAY
- 0.3 to + 6.0 V
S
O
S
O
O
j
stg
amb
tot
2.0 2.7 mA
2.3 mA
15 m
9 m
1.5 2.5
50 µs
0.4 µs
12 µs
1.2 µs
± 50 deg
- 0.3 to
+ 0.3)
(V
S
5 mA
- 0.3 to + 6.0 V
15 mA
100 °C
- 40 to + 85 °C
- 25 to + 85 °C
50 mW
mW/m
W/m
100 mV
V
2
2
www.vishay.com
2
Document Number 82166
Rev. 5, 14-Aug-03
VISHAY
TSOP5700
Vishay Semiconductors
Typical Characteristics (T
Optical Test Signal
E
e
V
Q
V
QH
50%
V
QL
t
tpi=22∝s
po=tpi
t
don
t
po
15 ∝s
ı
(f=455kHz, 10 cycles/burst)
2.2 ∝s
> 48.6 ∝s
(min. duty cycle)
Output Signal of TSOP5700
90%
10%
t
f
amb
t
r
Figure 1. Output Function
Optical Test Signal
(IR diode TSHF5400,p870 nm, IF= 300 mA, f = 455 kHz, 10 cycles/burst)
tpi=22∝s
E
e
Output Signal of TSOP5700
V
O
V
OH
V
OL
j
tdon
jitter of leading edge jitter of output pulse width
t
don
t
po
= 25 °C unless otherwise specified)
30
P
25
20
t
16563
t
t
16565
j
tpo
t
15
10
5
j – Jitter of Output Pulse ( s )
Jitter – t
tdon, tpo
j
0
1 10 100 1000 10000 100000
0.1 1.0 10.0 100.0 1000.010000.0100000.0
16791
Figure 4. Jitter of Output Pulse
1.0
0.9
0.8
0.7
0.6
0.5
0.4
E – Responsitivity
0.3
/E
0.2
e min e rel
0.1
0.0
300 350 400 450 500 550 600
16751
N=10 cycles/burst
Jitter – t
po
don
Ee – Irradiance (mW/m2)
f – Frequency ( kHz )
Figure 2. Output Fucntion (mit Jitter)
35
P
30
25
20
15
10
po
5
don
t , t Output Pulse Length ( s )
0
0.1 1.0 10.0 100.0 1000.010000.0100000.0
16790
Output pulse width – t
1 10 100 1000 10000 100000
Ee – Irradiance (mW/m2)
Figure 3. Output Pulse Diagram (t
Document Number 82166
Rev. 5, 14-Aug-03
Delay time – t
N = 10 cycles/burst
don
Figure 5. Frequency Dependence of Responsivity
14
2
po
Correlation with ambient light sources:
2
≅
10W/m
12
10
1.4klx (Std.illum.A,T= 2855 K)
2
≅
10W/m 8.2klx (Daylight,T = 5900K)
ı
ı
ı
8
6
Ambient, λ = 950 nm
4
2
e min
0
E - Threshold Irradiance ( mW/m )
0.1 1.0 10 100
E - DC Irradiance (W/m2)
Figure 6. Sensitivity in Bright Ambient
don
16558
, tpo)
www.vishay.com
3
TSOP5700
Vishay Semiconductors
VISHAY
3.0
2
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
e min
1.0
E Threshold Irradiance ( mW/m )
23456
16559
Sensitivity in dark ambient
VS- Supply Voltage ( V )
Figure 7. Sensitivity vs. Supply Voltage
1.1
1.0
0.9
0.8
0.7
e min
0.6
E - Relative Sensitivity
0.5
16788
N - Burstlength ( carriercycles/burst )
1.2
1.0
0.8
0.6
0.4
rel
0.2
λ
S ( ) - Relative Spectral Sensitivity
0.0
750 800 850 900 950 1000 1050 1100 1150
16789
λ - Wavelength ( nm )
Figure 10. Relative Spectral Sensitivity vs. Wavelength
0°
10° 20°
1.0
0.9
0.8
0.7
26221814 2824201612108
16801
0.4 0.2 0 0.2 0.4
0.6
d
- Relative Transmission Distance
rel
30°
40°
50°
60°
70°
80°
0.6
Figure 8. Rel. Sensitivity vs. Burstlength
2.3
16754
2.2
2.1
2.0
1.9
1.8
1.7
s
I - Supply Current ( mA )
1.6
1.5
VS=5.5V
VS=2.7V
-5-15-25
5 1525354555657585
T
- Ambient T emperature ( °C)
amb
Figure 9. Supply Current vs. Ambient Temperature
www.vishay.com
4
Figure 11. Directivity
Document Number 82166
Rev. 5, 14-Aug-03
VISHAY
Recommendation for Suitable Data Formats
The circuit of the TSOP5700 is designed in that way
that disturbance signals are identified and unwated
output pulses due to noise or disturbances are
avoided. A bandpass filter, an automatic gain control
and an integrator stage is used to suppress such disturbances. The distinguishing marks between data
signal and disturbance are carrier frequency, burst
length and the envelope duty cycle.
The data signal should fulfill the following conditions:
• The carrier frequency should be close to 455 kHz.
• The burstlength should be at least 22 µs (10 cycles
of the carrier signal) and shorter than 500 µs.
• The separation time between two consecutive
bursts should be at least 26 µs.
• If the data bursts are longer than 500 µs then the
envelope duty cycle is limited to 25 %
• The duty cycle of the carrier signal (455 kHz) may be
between 50 % (1.1 µs pulses) and 10 % (0.2 µs
pulses). The lower duty cycle may help to save battery power.
TSOP5700
Vishay Semiconductors
Document Number 82166
Rev. 5, 14-Aug-03
www.vishay.com
5
TSOP5700
Vishay Semiconductors
Package Dimensions in mm
VISHAY
www.vishay.com
6
16776
Document Number 82166
Rev. 5, 14-Aug-03
VISHAY
Taping Version TSOP5700..TT
TSOP5700
Vishay Semiconductors
Document Number 82166
Rev. 5, 14-Aug-03
16584
www.vishay.com
7
TSOP5700
Vishay Semiconductors
Taping Version TSOP5700..TR
VISHAY
www.vishay.com
8
16585
Document Number 82166
Rev. 5, 14-Aug-03
VISHAY
Reel Dimensions
TSOP5700
Vishay Semiconductors
Document Number 82166
Rev. 5, 14-Aug-03
16734
www.vishay.com
9
TSOP5700
Vishay Semiconductors
Leader and Trailer
Trailer Leader
VISHAY
no devices no devices
min. 200 min. 400
devices
Cover Tape Peel Strength
According to DIN EN 60286-3
0.1 to 1.3 N
300 ± 10 mm/min
165 ° - 180 ° peel angle
Label
Standard bar code labels for finished goods
The standard bar code labels are product labels and
used for identification of goods. The finished goods
are packed in final packing area. The standard packing units are labeled with standard bar code labels
before transported as finished goods to warehouses.
The labels are on each packing unit and contain
Vishay Semiconductor GmbH specific data.
StartEnd
96 11818
www.vishay.com
10
Document Number 82166
Rev. 5, 14-Aug-03
VISHAY
Vishay Semiconductor GmbH standard bar code product label (finished goods)
Plain Writing Abbreviation
Item-Description
Item-Number
Selection-Code
LOT-/ Serial-Number
Data-Code
Plant-Code
Quantity
Accepted by:
Packed by:
Mixed Code Indicator
Origin
–
INO
SEL
BATCH
COD
PTC
QTY
ACC
PCK
MIXED CODE
xxxxxxx
+
Company Logo
TSOP5700
Vishay Semiconductors
Length
18
8
3
10
3 (YWW)
2
8
–
–
–
Long Bar Code Top Type
Item-Number
Plant-Code
Sequence-Number
Quantity
Total Length
Short Bar Code Bottom
Selection–Code
Data-Code
Batch-Number
Filter
Total Length
N8
N
X
N
–
Type
X3
N
X
–
–
Dry Packing
The reel is packed in an anti-humidity bag to protect
the devices from absorbing moisture during transportation and storage.
Aluminium bag
Label
Length
2
3
8
21
Length
3
10
1
17
16942
Final Packing
The sealed reel is packed into a cardboard box. A
secondary cardboard box is used for shipping purposes.
Reel
15973
Document Number 82166
Rev. 5, 14-Aug-03
www.vishay.com
11
TSOP5700
Vishay Semiconductors
Recommended Method of Storage
Dry box storage is recommended as soon as the aluminium bag has been opened to prevent moisture
absorption. The following conditions should be
observed, if dry boxes are not available:
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤ 60 % RH max.
After more than 72 hours under these conditions
moisture content will be too high for reflow soldering.
In case of moisture absorption, the devices will
recover to the former condition by drying under the
following condition:
192 hours at 40 °C + 5 °C/ -0 °C and < 5 % RH (dry
air/ nitrogen) or
96 hours at 60 °C +5 °C and < 5 % RH for all device
containers or
24 hours at 125 °C +5 °C not suitable for reel or
tubes.
An EIA JEDEC Standard JESD22-A112 Level 4 label
is included on all dry bags.
16943
Example of JESD22-A112 Level 4 label
ESD Precaution
Proper storage and handling procedures should be
followed to prevent ESD damage to the devices especially when they are removed from the Antistatic
Shielding Bag. Electro-Static Sensitive Devices warning labels are on the packaging.
Vishay Semiconductors Standard Bar-Code Labels
The Vishay Semiconductors standard bar-code labels
are printed at final packing areas. The labels are on
each packing unit and contain Vishay Semiconductors specific data.
VISHAY
16962
Operating Instructions
Reflow Soldering
• Reflow soldering must be done within 48 hours
stored under max. 30 °C, 80 % RH after opening
envelop
• Recommended soldering paste (composition: SN 63
%, Pb 37 %)
Melting temperature 178 °C to 192 °C
• Apply solder paste to the specified soldering pads,
by using a dispenser or by screen printing.
• Recommended thickness of metal mask is 0.2 mm
for screen printing.
• The recommended reflow furnace is a combinationtype with upper and lower heaters.
• Set the furnace temperatures for pre-heating and
heating in accordance with the reflow temperature
profile as shown below. Excercise extreme care to
keep the maximum temperature below 230 °C. The
following temperature profile means the tempera ture
at the device surface. Since temperature difference
occurs between the work and the surface of the circuit
board depending on the pes of circuit board or reflow
furnace, the operating conditions should be verified
prior to start of operation.
• Handling after reflow should be done only after the
work surface has been cooled off.
Manual Soldering
• Use the 6/4 solder or the solder containing silver.
• Use a soldering iron of 25 W or smaller. Adjust the
temperature of the soldering iron below 300 °C.
• Finish soldering within three seconds.
• Handle products only after the temperature is cooled
off.
Cleaning
• Perform cleaning after soldering strictly in conformance to the following conditions:
Cleaning agent:
2-propanol (isopropyl alcohol).
Commercially available grades (industrial use) should
be used.
www.vishay.com
12
Document Number 82166
Rev. 5, 14-Aug-03
VISHAY
TSOP5700
Vishay Semiconductors
Demineralized or distilled water having a resistivity of
not less than 500 mΩ corresponding to a conductivity
of 2 mS/m.
• Temperature and time: 30 seconds under the temperature below 50 °C or 3 minutes below 30 °C.
• Ultrasonic cleaning: Below 20 W.
Reflow Solder Profile
240
220
200
180
160
°
140
120
100
80
Temperature ( C )
60
40
20
16735
2 °C-4°C/s
0
0 50 100 150 200 250 300 350
2 °C-4°C/s
Time ( s )
10 s max.
@230°C
90 s max120 s - 180 s
Manual Soldering
• Use the 6/4 solder or the solder containing silver.
• Use a soldering iron of 25 W or smaller. Adjust the
temperature of the soldering iron below 300 °C.
• Finish soldering within three seconds.
• Handle products only after the temperature is cooled
off.
Cleaning
• Perform cleaning after soldering strictly in conformance to the following conditions:
Cleaning agent:
2-propanol (isopropyl alcohol)
Commercially available grades (industrial use) should
be used.
Demineralized or distilled water having a resistivity of
not less than 500 mΩ corresponding to a conductivity
of 2 mS/m.
• Temperature and time: 30 seconds under the temperature below 50 °C or 3 minutes below 30 °C.
• Ultrasonic cleaning: Below 20 W.
Reflow Solder Profile
Assembly Instructions
Reflow Soldering
• Reflow soldering must be done within 72 hours
stored under max. 30 °C, 60 % RH after opening
envelop
• Recommended soldering paste (composition: SN 63
%, Pb 37 %) Melting temperature 178 °C to 192 °C
• Apply solder paste to the specified soldering pads,
by using a dispenser or by screen printing.
• Recommended thickness of metal mask is 0.2 mm
for screen printing.
• The recommended reflow furnace is a combinationtype with upper and lower heaters.
• Set the furnace temperatures for pre-heating and
heating in accordance with the reflow temperature
profile as shown below. Excercise extreme care to
keep the maximum temperature below 230 °C. The
following temperature profile means the tempera ture
at the device surface. Since temperature differ ence
occurs between the work and the surface of the circuit
board depending on the pes of circuit board or reflow
furnace, the operating conditions should be verified
prior to start of operation.
• Handling after reflow should be done only after the
work surface has been cooled off.
240
220
200
180
160
q
140
120
100
80
Temperature ( C )
60
40
20
0
0 50 100 150 200 250 300 350
2 qC - 4 qC/s
120 s - 180 s
2 qC - 4 qC/s
90 s max
Time ( s )
10 s max.
@ 230 qC
16944
Document Number 82166
Rev. 5, 14-Aug-03
www.vishay.com
13
TSOP5700
Vishay Semiconductors
Taping Version TSOP..TT
VISHAY
www.vishay.com
14
Document Number 82166
Rev. 5, 14-Aug-03
VISHAY
Taping Version TSOP..TR
TSOP5700
Vishay Semiconductors
Document Number 82166
Rev. 5, 14-Aug-03
www.vishay.com
15
TSOP5700
Vishay Semiconductors
Reel Dimensions
VISHAY
www.vishay.com
16
Document Number 82166
Rev. 5, 14-Aug-03
VISHAY
Leader and Trailer
Cover Tape Peel Strength
According to DIN EN 60286-3
0.1 to 1.3 N
300 ± 10 mm/min
165 ° - 180 ° peel angle
Label
Standard bar code labels for finished goods
The standard bar code labels are product labels and
used for identification of goods. The finished goods
are packed in final packing area. The standard packing units are labeled with standard bar code labels
before transported as finished goods to warehouses.
The labels are on each packing unit and contain
Vishay Semiconductor GmbH specific data.
TSOP5700
Vishay Semiconductors
Dry Packing
The reel is packed in an anti-humidity bag to protect
the devices from absorbing moisture during transportation and storage.
Final Packing
The sealed reel is packed into a cardboard box. A
secondary cardboard box is used for shipping purposes.
Document Number 82166
Rev. 5, 14-Aug-03
www.vishay.com
17
TSOP5700
Vishay Semiconductors
Recommended Method of Storage
Dry box storage is recommended as soon as the aluminium bag has been opened to prevent moisture
absorption. The following conditions should be
observed, if dry boxes are not available:
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤ 60 % RH max.
After more than 72 hours under these conditions
moisture content will be too high for reflow soldering.
In case of moisture absorption, the devices will
recover to the former condition by drying under the
following condition:
192 hours at 40 °C + 5 °C/ -0 °C and < 5 % RH (dry
air/ nitrogen) or
96 hours at 60 °C +5 °C and < 5 % RH for all device
containers or
24 hours at 125 °C +5 °C not suitable for reel or
tubes.
An EIA JEDEC Standard JESD22-A112 Level 4 label
is included on all dry bags.
Example of JESD22-A112 Level 4 label
VISHAY
ESD Precaution
Proper storage and handling procedures should be
followed to prevent ESD damage to the devices especially when they are removed from the Antistatic
Shielding Bag. Electro-Static Sensitive Devices warning labels are on the packaging.
Vishay Semiconductors Standard Bar-Code Labels
The Vishay Semiconductors standard bar-code labels
are printed at final packing areas. The labels are on
each packing unit and contain Vishay Telefunken
specific data.
www.vishay.com
18
Document Number 82166
Rev. 5, 14-Aug-03
VISHAY
TSOP5700
Vishay Semiconductors
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and
operatingsystems with respect to their impact on the health and safety of our employees and the public, as
well as their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are
known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs
and forbid their use within the next ten years. Various national and international initiatives are pressing for an
earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the
use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments
respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each
customer application by the customer. Should the buyer use Vishay Semiconductors products for any
unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all
claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal
damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423
Document Number 82166
Rev. 5, 14-Aug-03
www.vishay.com
19
Loading...