VISHAY TCDT1100, TCDT1100G Technical data

TCDT1100/ TCDT1100G
Optocoupler, Phototransistor Output
Features
• Isolation Test Voltage 3750 V
• Extra low coupling capacity - typical 0.2 pF
• High Common Mode Rejection
• No base terminal connection for improved noise immunity
• CTR offered in 4 groups
• Thickness through insulation > 0.75 mm
• Creepage current resistance according to VDE 0303/IEC 60112 Comparative Tracking Index: CTI = 275
RMS
nc
C
65
A (+) C (–) nc
Vishay Semiconductors
E
17201_1
DE
V
e3
Pb
Pb-free
• Lead-free component
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
Agency Approvals
• UL1577, File No. E76222 System Code A, Double Protection
• BSI IEC60950 IEC60065
• DIN EN 60747-5-2 (VDE0884) DIN EN 60747-5-5 pending
• FIMKO
Applications
Switch-mode power supplies Line receiver Computer peripheral interface Microprocessor system interface Circuits for safe protective separation against electri-
cal shock according to safety class II (reinforced iso­lation):
• For appl. class I - IV at mains voltage 300 V
• For appl. class I - III at mains voltage 600 V accord-
ing to DIN EN 60747-5-2(VDE0884)/ DIN EN 60747­5-5 pending, table 2.
Description
The TCDT1100/ TCDT1100G series consists of a phototransistor optically coupled to a gallium arsenide infrared-emitting diode in a 6-pin plastic dual inline package. The base of the phototransistor is not con­nected providing noise immunity.
The elements are mounted on one leadframe which provides a fixed distance between input and output for highest safety requirements.
VDE Standards
These couplers perform safety functions according to the following
equipment standards:
DIN EN 60747-5-2(VDE0884)/ DIN EN 60747-5-5 pending
Optocoupler for electrical safety requirements
IEC 60950/EN 60950
Office machines (applied for reinforced isolation for mains voltage
400 VRMS)
VDE 0804
Telecommunication apparatus and data processing
IEC 60065
Safety for mains-operated electronic and related household appa-
ratus
Order Information
Part Remarks
TCDT1100 CTR > 40 %, DIP-6
TCDT1101 CTR 40 - 80 %, DIP-6
TCDT1102 CTR 63 - 125 %, DIP-6
TCDT1103 CTR 100 - 200 %, DIP-6
TCDT1100G CTR > 40 %, DIP-6
TCDT1101G CTR 40 - 80 %, DIP-6
TCDT1102G CTR 63 - 125 %, DIP-6
TCDT1103G CTR 100 - 200 %, DIP-6
G = Leadform 10.16 mm; G is not marked on the body
Document Number 83535
Rev. 1.6, 26-Oct-04
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1
TCDT1100/ TCDT1100G
Vishay Semiconductors
Absolute Maximum Ratings
T
= 25 °C, unless otherwise specified
amb
Stresses in excess of the absolute Maximum Ratings can cause permanent damage to the device. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute Maximum Rating for extended periods of the time can adversely affect reliability.
Input
Parameter Test condition Symbol Val ue Unit
Reverse voltage V
Forward current I
Forward surge current t
10 µsI
p
Power dissipation P
Junction temperature T
Output
Parameter Test condition Symbol Val ue Unit
Collector emitter voltage V
Emitter collector voltage V
Collector current I
Collector peak current t
Power dissipation P
Junction temperature T
/T = 0.5, tp 10 ms I
p
R
F
FSM
diss
j
CEO
ECO
C
CM
diss
j
5V
60 mA
3A
100 mW
125 °C
32 V
7V
50 mA
100 mA
150 mW
125 °C
Coupler
Parameter Test condition Symbol Val ue Unit
Isolation test voltage (RMS) V
Total power dissipation P
Ambient temperature range T
Storage temperature range T
Soldering temperature 2 mm from case t 10 s T
ISO
tot
amb
stg
sld
3750 V
RMS
250 mW
- 55 to + 100 °C
- 55 to + 125 °C
260 °C
Electrical Characteristics
T
= 25 °C, unless otherwise specified
amb
Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering evaluation. Typical values are for information only and are not part of the testing requirements.
Input
Parameter Test condition Symbol Min Ty p. Max Unit
Forward voltage I
Junction capacitance V
= 50 mA V
F
= 0, f = 1 MHz C
R
F
j
1.25 1.6 V
50 pF
Output
Parameter Test condition Symbol Min Ty p. Max Unit
Collector emitter voltage I
Emitter collector voltage I
Collector-emitter cut-off current V
= 1 mA V
C
= 100 µAV
E
= 20 V, If = 0, E = 0 I
CE
CEO
ECO
CEO
32 V
7V
200 nA
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2
Document Number 83535
Rev. 1.6, 26-Oct-04
Coupler
Parameter Test condition Symbol Min Ty p . Max Unit
Collector emitter saturation voltage
Cut-off frequency V
Coupling capacitance f = 1 MHz C
= 10 mA, IC = 1 mA V
I
F
= 5 V, IF = 10 mA,
CE
= 100
R
L
Current Transfer Ratio
Parameter Test condition Part Symbol Min Ty p. Max Unit
I
C/IF
VCE = 5 V, IF = 10 mA TCDT1100
TCDT1100/ TCDT1100G
Vishay Semiconductors
CEsat
f
c
k
TCDT1100G
TCDT1101
TCDT1101G
TCDT1102
TCDT1102G
TCDT1103
TCDT1103G
110 kHz
0.3 pF
CTR 40 %
CTR 40 80 %
CTR 63 125 %
CTR 100 200 %
0.3 V
Maximum Safety Ratings
(according to DIN EN 60747-5-2(VDE0884)/ DIN EN 60747-5-5 pending) see figure 1 This optocoupler is suitable for safe electrical isolation only within the safety ratings. Compliance with the safety ratings shall be ensured by means of suitable protective circuits.
Input
Parameter Test condition Symbol Min Ty p . Max Unit
Forward current I
F
Output
Parameter Test condition Symbol Min Ty p . Max Unit
Power dissipation P
diss
Coupler
Parameter Test condition Symbol Min Ty p . Max Unit
Rated impulse voltage V
Safety temperature T
IOTM
si
Insulation Rated Parameters
Parameter Test condition Symbol Min Ty p . Max Unit
Partial discharge test voltage ­Routine test
Partial discharge test voltage ­Lot test (sample test)
100 %, t
test
= 60 s, t
t
Tr
(see figure 2)
test
= 1 s V
= 10 s,
V
pd
IOTM
V
pd
1.6 kV
6kV
1.3 kV
130 mA
265 mW
6kV
150 °C
Document Number 83535
Rev. 1.6, 26-Oct-04
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3
TCDT1100/ TCDT1100G
Vishay Semiconductors
Parameter Test condition Symbol Min Ty p. Max Unit
Insulation resistance VIO = 500 V R
V
300
250
200
150
100
= 500 V, T
IO
V
= 500 V, T
IO
(construction test only)
Phototransistor Psi ( mW )
= 100 °C R
amb
= 150 °C
amb
R
V
V
V
IO
IO
IO
IOTM
V
IOWM
IORM
12
10
11
10
9
10
t1, t2 = 1 to 10 s t
, t4 = 1 s
3
= 10 s
t
test
t
= 12 s
stres
Pd
50
tot
P – Total Power Dissipation ( mW )
0
IR-Diode Isi ( mA )
0 25 50 75 125
94 9182
Tsi – Safety Temperature ( °C )
Figure 1. Derating diagram
100
150
13930
0
t
1
tTr = 60 s
t
2
t
t3t
test
t
stres
4
t
Figure 2. Test pulse diagram for sample test according to DIN EN
60747-5-2(VDE0884)/ DIN EN 60747-; IEC60747
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Document Number 83535
Rev. 1.6, 26-Oct-04
Switching Characteristics
Parameter Test condition Symbol Min Ty p . Max Unit
Delay time V
Rise time V
Fall time V
Storage time V
Turn-on time V
Turn-off time V
Turn-on time V
Turn-off time V
= 5 V, IC = 5 mA, RL = 100
S
(see figure 3)
= 5 V, IC = 5 mA, RL = 100
S
(see figure 3)
= 5 V, IC = 5 mA, RL = 100
S
(see figure 3)
= 5 V, IC = 5 mA, RL = 100
S
(see figure 3)
= 5 V, IC = 5 mA, RL = 100
S
(see figure 3)
= 5 V, IC = 5 mA, RL = 100
S
(see figure 3)
= 5 V, IF = 10 mA, RL = 1 k
S
(see figure 4)
= 5 V, IF = 10 mA, RL = 1 k
S
(see figure 4)
TCDT1100/ TCDT1100G
Vishay Semiconductors
t
d
t
r
t
f
t
s
t
on
t
off
t
on
t
off
4.0 µs
7.0 µs
6.7 µs
0.3 µs
11.0 µs
7.0 µs
25.0 µs
42.5 µs
+ 5 V
= 5 mA;
I
C
Channel I
Channel II
95 10900
I
0
RG = 50 W t
p
= 0.01
T
tp = 50 Ps
I
F
F
50 W 100 W
Figure 3. Test circuit, non-saturated operation
1k
+5V
I
C
Channel I
Channel II
0
RG=50 t
p
= 0.01
T
tp=50 s
I
F
µ
IF=10mA
50
adjusted through input amplitude
Oscilloscope R
t 1 MW
L
d 20 pF
C
L
Oscilloscope
M1
R
L
20 pF
C
L
I
F
0
I
C
100%
90%
10%
0
t
d
t
t
p
t
d
t
r
t
(= td+tr) turn-on time
on
on
pulse duration delay time rise time
t
p
t
r
t
t
s
t
off
t
s
t
f
t
(= ts+tf) turn-off time
off
Figure 5. Switching Times
f
96 11698
t
t
storage time fall time
95 10843
Figure 4. Test circuit, saturated operation
Document Number 83535
Rev. 1.6, 26-Oct-04
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5
TCDT1100/ TCDT1100G
Vishay Semiconductors
Typical Characteristics (Tamb = 25 °C unless otherwise specified)
300
Coupled device
250
200
Phototransistor
150
IR-diode
100
50
tot
P –Total Power Dissipation ( mW )
0
0 40 80 120
T
96 11700
– Ambient Temperature(°C )
amb
Figure 6. Total Power Dissipation vs. Ambient Temperature
1000
100
10
1
F
I - Forward Current ( mA )
0.1 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
96 11862
VF- Forward Voltage(V)
10000
VCE=20V
I
=0
1000
F
100
with open Base ( nA )
10
CEO
I - Collector Dark Current,
1
0255075
T
95 11026
- Ambient Temperature (°C)
amb
100
Figure 9. Collector Dark Current vs. Ambient Temperature
100
10
1
C
I - Collector Current ( mA )
0.1
0.1 1 10
95 11054
V
CE
IF= 50mA
- Collector Emitter Voltage(V)
20 mA
10 mA
5mA
2mA
1mA
100
Figure 7. Forward Current vs. Forward Voltage
1.5
VCE=5V
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
rel
0.5
CTR - Relative Current Transfer Ratio
- 30 - 2 0 - 1 0 0 1 0 20 30 40 50 60 70 80
96 11920
=10 mA
I
F
T
- Ambient Temperature ( ° C)
amb
Figure 8. Relative Current Transfer Ratio vs. Ambient
Temperature
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Figure 10. Collector Current vs. Collector Emitter Voltage
1.0
0.8
0.6
0.4 CTR = 50%
0.2
20%
CEsat
V - Collector Emitter Saturation Voltage (V)
95 11055
0
110
IC- Collector Current ( mA )
10%
100
Figure 11. Collector Emitter Saturation Voltage vs. Collector
Current
Document Number 83535
Rev. 1.6, 26-Oct-04
1000
TCDT1100/ TCDT1100G
Vishay Semiconductors
VCE=5V
100
10
CTR - Current Transfer Ratio ( % )
1
0.1 1 10
95 11057
IF- Forward Current ( mA )
100
Figure 12. Current Transfer Ratio vs. Forward Current
50
t
off
t
on
20
offon
t / t - Turn on / Turn off Time ( µ s)
95 11017
40
30
20
Saturated Operation V
=5V
R
S
L
=1k
10
0
0 5 10 15
I
- Forward Current ( mA )
F
Customer Code/ Identification/ Option
UL Logo
Vishay Logo
17936
V
D E
V XXXY 68
Date Code (year, week)
Figure 15. Marking example
Product Code
VDE Logo
Plant Code
Package Code
Figure 13. Turn on / off Time vs. Forward Current
20
Non Saturated Operation V
=5V
S
R
= 100
L
15
10
t
on
t
off
5
offon
t / t - Turn on / Turn off Time ( µ s)
0
02 46
I
95 11016
- Collector Current ( mA )
C
Figure 14. Turn on / off Time vs. Collector Current
Document Number 83535
Rev. 1.6, 26-Oct-04
10
8
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7
TCDT1100/ TCDT1100G
Vishay Semiconductors
Package Dimensions in mm
Package Dimensions in mm
14770
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8
14771
Document Number 83535
Rev. 1.6, 26-Oct-04
TCDT1100/ TCDT1100G
Vishay Semiconductors
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operatingsystems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each
customer application by the customer. Should the buyer use Vishay Semiconductors products for any
unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all
claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal
damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423
Document Number 83535
Rev. 1.6, 26-Oct-04
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Legal Disclaimer Notice
Vishay
Document Number: 91000 www.vishay.com Revision: 08-Apr-05 1
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Vishay for any damages resulting from such improper use or sale.
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