VISHAY SI7850DP-GE3 Datasheet

T
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N-Channel 60 V (D-S) Fast Switching MOSFET
Si7850DP
Vishay Siliconix
PowerPAK® SO-8 Single
D
D
7
D
6
5
D 8
FEATURES
• TrenchFET® power MOSFETs
• New low thermal resistance PowerPAK package with low 1.07 mm profile
• PWM optimized for fast switching
6.15 mm
Top View
1
5.15 mm
Bottom View
• 100 % R
1
2
S
3
S
4
S
G
• Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
APPLICATIONS
• Primary side switch for 24 V DC/DC applications
tested
g
• Secondary synchronous rectifier
PRODUCT SUMMARY
VDS (V) 60
max. () at VGS = 10 V 0.022
R
DS(on)
R
max. () at VGS = 4.5 V 0.031
DS(on)
Q
typ. (nC) 18
g
(A) 10.3
I
D
Configuration Single
ORDERING INFORMATION
Package PowerPAK SO-8 Lead (Pb)-free Si7850DP-T1-E3 Lead (Pb)-free and halogen-free Si7850DP-T1-GE3
®
Available
D
G
S
N-Channel MOSFE
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER SYMBOL 10 s STEADY STATE UNIT
Drain-source voltage V Gate-source voltage V
Continuous drain current (T
= 150 °C)
J
a
TA = 25 °C
= 85 °C 7.5 4.5
T
A
Continuous source current I Pulsed drain current I Avalanche current Single avalanche energy
Maximum power dissipation
b
b
a
TA = 25 °C
= 85 °C 2.3 0.9
T
A
Operating junction and storage temperature range T
DS
GS
I
D
S
DM
I
AS
E
AS
P
D
, T
J
stg
60 60
± 20 ± 20
10.3 6.2
3.7 1.5 40 40 15 15 11 11 mJ
4.5 1.8
-55 to +150 °C
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL TYPICAL MAXIMUM UNIT
Maximum junction-to-ambient
a
Maximum junction-to-case (drain) Steady state R
t 10 s
R
thJA
thJC
Notes
a. Surface mounted on 1" x 1" FR4 board b. Guaranteed by design, not subject to production testing
S09-0227-Rev. E, 09-Feb-09
1
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
22 28
2.6 3.3
Document Number: 71625
V
A
W
°C/WSteady state 58 70
Si7850DP
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SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-source breakdown voltage V
Gate threshold voltage V
Gate-body leakage I
Zero gate voltage drain current I
On-state drain current
a
Drain-source on-state resistance
Forward transconductance
Diode forward voltage
Dynamic
b
a
a
Total gate charge Q
Gate-drain charge Q
Gate resistance R
Turn-on delay time t
Rise time t
Turn-off delay time t
Fall time t
Source-drain reverse recovery time t
(BR)DSS
GS(th)
GSS
DSS
I
D(on)
a
R
DS(on)
g
fs
V
SD
g
gs
gd
g
d(on)
r
d(off)
f
rr
Notes
a. Pulse test: pulse width 300 μs, duty cycle 2 % b. Guaranteed by design, not subject to production testing
 
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
VGS = 0 V, ID = 250 μA 60 - -
V
= VGS, ID = 250 μA 1 - 3
DS
VDS = 0 V, VGS = ± 20 V - - ± 100 nA
V
V
DS
= 60 V, V
DS
= 60 V, V
GS
V
5 V, V
DS
V
= 10 V, ID = 10.3 A - 0.018 0.022
GS
= 4.5 V, ID = 8.7 A - 0.025 0.031
V
GS
= 0 V - - 1
GS
= 0 V, TJ = 55 °C - - 20
= 10 V 40 - - A
GS
VDS = 15 V, ID = 10.3 A - 26 - S
IS = 3.8 A, V
= 0 V - 0.85 1.2 V
GS
-1827
VDS = 30 V, V
= 10 V, ID = 10.3 A
GS
-3.4-
-5.3-
0.5 1.4 2.2
-1020
VDD = 30 V, RL = 30
I
1 A, V
D
= 10 V, Rg = 6
GEN
-1020
-2550
-1224
IF = 3.8 A, di/dt = 100 A/μs - 50 80
Vishay Siliconix
V
μA
nCGate-source charge Q
ns
S09-0227-Rev. E, 09-Feb-09
2
Document Number: 71625
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
0
8
16
24
32
40
0.0 0.5 1.0 1.5 2.0 2.5 3.0
VGS = 10 V thru 5 V
4 V
3V
V
DS
- Drain-to-Source Voltage (V)
- Drain Current (A)I
D
0
8
16
24
32
40
012345
TC = 150 °C
- 55 °C
V
GS
- Gate-to-Source Voltage (V)
- Drain Current (A)I
D
25 °C
0
2
4
6
8
10
0 4 8 12 16 20
VDS = 30 V I
D
= 10.3 A
- Gate-to-Source Voltage (V)
Qg - Total Gate Charge (nC)
V
GS
2.0 2.5
1
10
50
0 0.5 1.0 1.5
TJ = 25 °C
TJ = 150 °C
V
SD
- Source-to-Drain Voltage (V)
- Source Current (A)I
S
0
200
400
600
800
1000
1200
1400
0 102030405060
C
rss
C
oss
C
iss
VDS - Drain-to-Source Voltage (V)
C - Capacitance (pF)
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TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Si7850DP
Vishay Siliconix
Output Characteristics
Transfer Characteristics
0.06
0.05
0.04
0.03
- On-Resistance ()R
0.02
DS(on)
0.01
0.00 0 8 16 24 32 40
On-Resistance vs. Drain Current
S09-0227-Rev. E, 09-Feb-09
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ID - Drain Current (A)
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VGS = 4.5 V
Source-Drain Diode Forward Voltage
VGS = 10 V
3
Gate Charge
Capacitance
Document Number: 71625
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-50 -25 0 25 50 75 100 125 150
VGS = 10 V I
D
= 10.3 A
T
J
- Junction Temperature (°C)
R
DS(on)
- On-Resistance (Normalized)
0.00
0.01
0.02
0.03
0.04
0.05
0.06
0246810
ID = 10.3 A
- On-Resistance ()
R
DS(on)
VGS - Gate-to-Source Voltage (V)
-1.0
-0.8
-0.6
-0.4
-0.2
0.0
0.2
0.4
-50 -25 0 25 50 75 100 125 150
ID = 250 µA
Variance (V)V
GS(th)
TJ - Temperature (°C)
0.01
0
1
100
40
60
10 6000.1
Time (s)
20
80
Power (W)
100
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TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Si7850DP
Vishay Siliconix
On-Resistance vs. Junction Temperature
On-Resistance vs. Gate-to-Source Voltage
Threshold Voltage
Single Pulse Power
S09-0227-Rev. E, 09-Feb-09
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
4
Document Number: 71625
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