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Fast Avalanche Sinterglass Diode
Features
• Glass passivated junction
• Hermetically sealed package
• Low reverse current
• Soft recovery characteristics
• Lead (Pb)-free component
• Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
Applications
Fast rectification and switching diode
Mechanical Data
Case: SOD-57 Sintered glass case
Terminals: Plated axial leads, solderable per
MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: approx. 369 mg
e2
BYT52.
Vishay Semiconductors
949539
Parts Table
Part Type differentiation Package
BYT52A V
BYT52B V
BYT52D V
BYT52G V
BYT52J V
BYT52K V
BYT52M V
Absolute Maximum Ratings
T
= 25 °C, unless otherwise specified
amb
Parameter Test condition Part Symbol Val ue Unit
Reverse voltage = Repetitive
peak reverse voltage
Peak forward surge current t
see electrical characteristics BYT52A V
= 10 ms, half sinewave I
p
= 50 V; I
R
= 100 V; I
R
= 200 V; I
R
= 400 V; I
R
= 600 V; I
R
= 800 V; I
R
= 1000 V; I
R
= 1.4 A SOD-57
FAV
= 1.4 A SOD-57
FAV
= 1.4 A SOD-57
FAV
= 1.4 A SOD-57
FAV
= 1.4 A SOD-57
FAV
= 1.4 A SOD-57
FAV
= 1.4 A SOD-57
FAV
= V
R
BYT52B V
BYT52D V
BYT52G V
BYT52J V
BYT52K V
BYT52M V
R
R
R
R
R
R
= V
= V
= V
= V
= V
= V
FSM
RRM
RRM
RRM
RRM
RRM
RRM
RRM
50 V
100 V
200 V
400 V
600 V
800 V
1000 V
50 A
Document Number 86029
Rev. 1.6, 13-Apr-05
www.vishay.com
1
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BYT52.
Vishay Semiconductors
Parameter Test condition Part Symbol Value Unit
Average forward current on PC board I
l = 10 mm I
Junction and storage
temperature range
Non repetitive reverse
avalanche energy
Maximum Thermal Resistance
T
= 25 °C, unless otherwise specified
amb
Parameter Test condition Symbol Value Unit
Junction ambient l = 10 mm, T
Electrical Characteristics
T
= 25 °C, unless otherwise specified
amb
Parameter Test condition Symbol Min Ty p. Max Unit
Forward voltage I
Reverse current V
Reverse recovery time I
= 0.4 A BYT52J E
I
(BR)R
BYT52K E
BYT52M E
= constant R
L
on PC board with spacing
25 mm
= 1 A V
F
= V
R
RRM
V
= V
R
= 0.5 A, IR = 1 A, iR = 0.25 A t
F
, Tj = 150 °C I
RRM
thJA
R
thJA
F
I
R
R
rr
FAV
FAV
T
= T
j
stg
R
R
R
0.85 A
1.4 A
- 55 to + 175 °C
10 mJ
10 mJ
10 mJ
45 K/W
100 K/W
1.3 V
5 µA
150 µA
200 ns
Typical Characteristics (Tamb = 25 °C unless otherwise specified)
120
100
80
thJA
R - Therm. Resist. Junction/Ambient (K/W)
94 9552
60
40
20
0
0
51015 25
l - Lead Length ( mm )
ll
TL= constant
20
30
Figure 1. Max. Thermal Resistance vs. Lead Length
10
Tj=175°C
1
0.1
0.01
F
I - Forward Current ( A)
0.001
0 0.5 1.0 1.5 2.0 2.5 3.0
16328
Tj=25°C
- Forward Voltage(V)
V
F
Figure 2. Forward Current vs. Forward Voltage
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2
Document Number 86029
Rev. 1.6, 13-Apr-05
Page 3
BYT52.
Vishay Semiconductors
1.6
1.4
1.2
1.0
0.8
0.6
0.4
R
= 100 K/W
thJA
0.2
16329
FAV
I - Average Forward Current ( A )
PCB:d=25mm
0.0
0 20 40 60 80 100 120 140 160 180
T
- Ambient Temperature ( ° C)
amb
=V
V
R
RRM
half sinewave
R
= 45 K/W
thJA
l=10mm
Figure 3. Max. Average Forward Current vs. Ambient Temperature
1000
VR=V
RRM
100
10
R
I - Reverse Current ( µA)
1
25 50 75 100 125 150 175
16330
T
– Junction Temperature ( °C)
j
500
450
400
350
300
250
200
150
100
50
R
P - Reverse Power Dissipation ( mW )
0
25 50 75 100 125 150 175
16331
Tj- Junction Temperature (°C)
PR-Limit
@80%V
VR=V
PR-Limit
@100 % V
R
RRM
R
Figure 5. Max. Reverse Power Dissipation vs. Junction
Temperature
40
35
30
25
20
15
10
D
C - Diode Capacitance ( pF )
5
0
0.1 1 10 100
V
16332
- Reverse Voltage(V)
R
f=1MHz
Figure 4. Reverse Current vs. Junction Temperature
Package Dimensions in mm (Inches)
Sintered Glass Case
SOD-57
26(1.014) min.
Document Number 86029
Rev. 1.6, 13-Apr-05
Cathode Identification
4.0 (0.156) max.
3.6 (0.140)max.
26(1.014) min.
Figure 6. Diode Capacitance vs. Reverse Voltage
94 9538
ISO Method E
0.82 (0.032) max.
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BYT52.
Vishay Semiconductors
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as
their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are
known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs
and forbid their use within the next ten years. Various national and international initiatives are pressing for an
earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use
of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments
respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each
customer application by the customer. Should the buyer use Vishay Semiconductors products for any
unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all
claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal
damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
www.vishay.com
4
Document Number 86029
Rev. 1.6, 13-Apr-05
Page 5
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
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Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000 www.vishay.com
Revision: 18-Jul-08 1
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