Capacitive input filter T
common heatsink of 1 °C/W
= 55 °C, TJ = 125 °C
A
12.016.0A
MAJOR RATINGS AND CHARACTERISTICS
SYMBOLCHARACTERISTICSVALUESUNITS
I
F(AV)
V
I
FSM
V
T
RRM
F
J
Sinusoidal waveform10A
800/1200V
200A
10 A, TJ = 25 °C1.1V
- 40 to 150°C
VOLTAGE RATINGS
V
, MAXIMUM PEAK
PART NUMBER
10ETS08PbF800900
10ETS12PbF12001300
RRM
REVERSE VOLTAGE
V
V
, MAXIMUM NON-REPETITIVE
RSM
PEAK REVERSE VOLTAGE
V
I
RRM
AT 150 °C
mA
0.5
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOLTEST CONDITIONSVALUESUNITS
Maximum average forward currentI
Maximum peak one cycle
non-repetitive surge current
Maximum I
Maximum I
* Pb containing terminations are not RoHS compliant, exemptions may apply
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2
t for fusingI2t
2
t for fusingI2tt = 0.1 ms to 10 ms, no voltage reapplied1450A2s
F(AV)
I
FSM
TC = 105 °C, 180° conduction half sine wave10
10 ms sine pulse, rated V
10 ms sine pulse, no voltage reapplied200
10 ms sine pulse, rated V
10 ms sine pulse, no voltage reapplied145
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applied170
RRM
applied130
RRM
A
2
A
s
10ETS08PbF, 10ETS12PbF High Voltage Series
Vishay Semiconductors
Input Rectifier Diode, 10 A
ELECTRICAL SPECIFICATIONS
PARAMETER SYMBOLTEST CONDITIONS VALUESUNITS
Maximum forward voltage dropV
Forward slope resistancer
Threshold voltageV
Maximum reverse leakage currentI
FM
F(TO)
RM
10 A, TJ = 25 °C1.1V
t
TJ = 150 °C
TJ = 25 °C
T
= 150 °C0.50
J
V
= Rated V
R
RRM
20m
0.82V
0.05
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOLTEST CONDITIONSVALUESUNITS
Maximum junction and storage temperature rangeT
Maximum thermal resistance, junction to caseR
Maximum thermal resistance, junction to ambient
(PCB mount)
Soldering temperatureT
, T
J
Stg
DC operation2.5
thJC
(1)
R
62
thJA
S
Approximate weight
Marking deviceCase style TO-220AC
Note
(1)
When mounted on 1" square (650 mm2) PCB of FR-4 or G-10 material 4 oz. (140 μm) copper 40 °C/W
For recommended footprint and soldering techniques refer to application note #AN-994
- 40 to 150°C
240°C
2g
0.07oz.
10ETS08
10ETS12
mA
°C/W
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Initial TJ = 150 °C
at 60 Hz 0.0083 s
at 50 Hz 0.0100 s
10
Number of Equal Amplitude
Half Cycle Current Pulses (N)
Fig. 5 - Maximum Non-Repetitive Surge Current
Ø
= 150 °C
16141210
100
Maximum Average
Forward Power Loss (W)
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Revision: 22-Jul-10DiodesAmericas@vishay.com
16
14
12
10
180°
120°
90°
60°
30°
8
6
4
2
0
0
Fig. 3 - Forward Power Loss Characteristics
2468
Average Forward Current (A)
RMS limit
Ø
Conduction angle
10ETS.. Series
= 150 °C
T
J
240
220
200
180
160
140
120
100
Forward Current (A)
Peak Half Sine Wave
80
60
10
40
Maximum non-repetitive surge current
versus pulse train duration.
Initial T
No voltage reapplied
Rated V
10ETS.. Series
0.11.00.01
J
RRM
= 150 °C
reapplied
Pulse Train Duration (s)
Fig. 6 - Maximum Non-Repetitve Surge Current
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0.1
1
10
0.00010.0010.010.1 1
Square Wave Pulse Duration (s)
Z
thJC
- Transient
Thermal Impedance (°C/W)
10
D = 0.50
D = 0.33
D = 0.25
D = 0.17
D = 0.08
Steady state value
(DC operation)
10ETS.. Series
Single pulse
10ETS08PbF, 10ETS12PbF High Voltage Series
Vishay Semiconductors
Input Rectifier Diode, 10 A
100
TJ = 25 °C
10
10ETS.. Series
Instantaneous Forward Current (A)
1
0.51.01.52.02.5
0
Instantaneous Forward Voltage (V)
Fig. 7 - Forward Voltage Drop Characteristics
TJ = 150 °C
3.0
Fig. 8 - Thermal Impedance Z
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Revision: 22-Jul-10DiodesAmericas@vishay.com
, DiodesAsia@vishay.com, DiodesEurope@vishay.com5
Assembly
lot code
xxxxxx
V P119X
AC
TO-220AC
Part number
Product version (optional):
P = Lead (Pb)-free
None = Standard
Date code:
Year 1 = 2001
Week 19
Line X
Part Marking Information
Vishay High Power Products
Example: This is a xxxxxx with
assembly lot code AC,
assembled on WW 19, 2001in the assembly line “X”
D14.2215.870.5600.6253Ø P3.543.730.1390.147
D18.389.020.3300.355Q2.543.050.1000.120
D212.1912.880.4800.5076θ90° to 93°90° to 93°
Notes
(1)
Dimensioning and tolerancing per ASME Y14.5M-1994
(2)
Lead dimension and finish uncontrolled in L1
(3)
Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outermost extremes of the plastic body
(4)
Dimension b1, b3 and c1 apply to base metal only
(5)
Controlling dimensions: inches
(6)
Thermal pad contour optional within dimensions E, H1, D2 and E1
(7)
Outline conforms are derived from the actual package outline
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.