UNITRODE UC1610, UC2610, UC3610 Technical data

DESCRIPTION
This eight-diode array is designed for high-current, low duty-cycle applications typical of flyback voltage clamping for inductive loads. The dual bridge connection makes this device particularly applicable to bipolar driven stepper motors.
The use of Schottky diode technology features high efficiency through lowered for­ward voltage drop and decreased reverse recovery time.
查询UC1610供应商
Dual Schottky Diode Bridge
FEATURES
Monolithic Eight-Diode Array
Exceptional Efficiency
Low Forward Voltage
Fast Recovery Time
High Peak Current
Small Size
ABSOLUTE MAXIMUM RATINGS
Peak Inverse Voltage (per diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50V
Peak Forward Current
UC1610 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1A
UC2610 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1A
UC3610 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3A
Power Dissipation at T
Storage Tempe rature Rang e. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
Lead Temperat ure (Solde ring, 10 Sec onds ). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
Note: Consult Packaging Sec tion of Databook f or thermal limitations and con sider at ions of
package.
CONNECTION DIAGRAMS
UC1610 UC2610 UC3610
A = +70°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1W
DIL-8 (TOP VIEW) N or J Package
PLCC-20 (TOP VIEW) Q Package
3/95
SOIC-16 (TOP VIEW) DW Package
UC1610 UC2610 UC3610
ELECTRICAL CHARACTERISTICS:
All specifications ap ply to each individu al diode. TJ = 25°C except as noted. TA = TJ.
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Forward Voltage Dro p I
Leakage Current V
F = 100mA 0.35 0.5 0.7 V
I
F = 1A 0.8 1.0 1.3 V
R = 40V .01 0.1 mA
V
R = 40V, TJ = +100°C 0.1 1.0 mA
Reverse Recovery 0.5A Forward to 0.5A Revers e 15 ns Forward Recovery 1A Forward to 1.1V Recovery 30 ns Junction Capacitance V
R = 5V 70 pF
Note: At forwar d curre nt s of grea ter than 1. 0A a parasit ic current of appr oxim at ely 10m A may be collected by adjacen t diodes.
Reverse Current vs V oltage Forward Curren t vs Voltage
UNITRODE INTEGRATED CIRCUITS 7 CONTINENTAL BLVD. MERRI MACK , NH 0305 4 TEL. (603) 424-2410 FAX (603) 424-3460
Forward Recovery CharacteristicsReverse Recovery Characteristics
2
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
Loading...