Supply voltage specified in OCR register Except CMD0, 15,55,
Supply voltage differentials (V
Power up time 250 ms From 0v to V
Note. The current consumption of any card during the power-up procedure must not exceed 10 mA.
~
2
G
G
U
SS1
U
, V
S
S
S
SS2
D
D
D
DD
) -0.3 0.3 V
2.0 3.6 V CMD0, 15,55,ACMD41
microSD Memory Card
commands
ACMD41 commands
DD
Min.
• Bus Signal Line Load
The total capacitance C
capacitance C
C
= C
L
HOST
Where N is the number of connected cards. Requiring the sum of the host and bus capacitances not to exceed 30 pF for
up to 10 cards, and 40 pF for up to 30 cards, the following values must not be exceeded:
Bus signal line capacitance C
Single card capacitance C
Maximum signal line inductance 16 nH f
Pull-up resistance inside card (pin1) R
Note that the total capacitance of CMD and DAT lines will be consist of C
connected separately to the SD Memory Card host.
Pull-up resistance R
Bus signal line capacitance C
Transcend Information Inc.
itself and the capacitance C
BUS
+ C
BUS
Parameter SymbolMin. Max. Unit Remark
Parameter SymbolMin. Max. Unit Remark
the CLK line of the SD Memory Card bus is the sum of the bus master capacitance C
L
of each card connected to this line:
CARD
+ Ν*C
CARD
CMD
L
CARD
DAT3
, R
L
DAT
100 pF f
10 pF
10 90 KΩMay be used for card
, C
HOST
10 100 KΩTo prevent bus floating
250 pF f
3
and one C
BUS
≤ 20 MHz, 7 cards
PP
≤ 20 MHz
PP
detection
≤ 5 MHz, 21 cards
PP
HOST
only since they are
CARD
, the bus
T
S
2
5
6
M
~
2
G
U
T
S
2
5
6
M
~
2
T
S
2
5
6
M
• Bus Signal Levels
As the bus can be supplied with a variable supply voltage, all signal levels are related to the supply voltage.
~
2
G
G
U
U
S
S
S
D
D
D
microSD Memory Card
To meet the requirements of the JEDEC specification JESD8-1A, the card input and output voltages shall be within the
following specified ranges for any V
Parameter Symbol Min. Max. Unit Remark
Output HIGH voltage V
Output LOW voltage V
Input HIGH voltage V
Input LOW voltage V
of the allowed voltage range:
DD
OH
OL
IH
IL
0.75* V
0.625* V
V
DD
0.125* V
DD
– 0.3 0.25* V
SS
V I
DD
V
+ 0.3 V
DD
DD
= -100 μA @VDD min
OH
V I
V
= 100 μA @VDD min
OL
Transcend Information Inc.
4
T
S
2
5
6
M
T
S
2
5
T
S
• Bus Timing (Default)
2
5
6
6
M
M
~
~
~
2
2
2
G
G
G
U
U
U
S
S
S
D
D
D
microSD Memory Card
Parameter SymbolMin Max. Unit Remark
Clock CLK (All values are referred to min (VIH) and max (VIL)
Clock frequency Data Transfer Mode f
Clock frequency Identification Mode
(The low freq. is required for MultiMediaCard
compatibility.)
Inputs CMD, DAT (referenced to CLK)
Input set-up time t
Input hold time t
Outputs CMD, DAT (referenced to CLK)
Output Delay time t
PP
f
OD
t
WL
t
WH
t
TLH
t
THL
ISU
ODLY
0 25 MHz C
0 400 KHz C
10 ns C
50 ns C
50 ns C
IH
50 ns C
10 ns C
50 ns C
10 ns C
10 ns C
5 ns C
5 ns C
0 14 ns C
≤ 100 pF, (7 cards)
L
≤ 250 pF, (21 cards)
L
≤ 100 pF, (7 cards) Clock low time
L
≤ 250 pF, (21 cards)
L
≤ 100 pF, (7 cards) Clock high time
L
≤ 250 pF, (21 cards)
L
≤ 100 pF, (7 cards) Clock rise time
L
≤ 250 pF, (21 cards)
L
≤ 100 pF, (7 cards) Clock fall time
L
≤ 250 pF, (21 cards)
L
≤ 25 pF, (1 cards)
L
≤ 25 pF, (1 cards)
L
≤ 25 pF, (1 cards)
L
Transcend Information Inc.
5
T
S
2
5
6
M
~
2
G
T
S
2
5
6
M
~
T
S
2
5
6
M
• Bus Timing (High-speed Mode)
~
2
2
G
G
U
U
U
S
S
S
D
D
D
microSD Memory Card
Parameter SymbolMin Max. Unit Remark
Clock CLK (All values are referred to min (VIH) and max (VIL)
Clock frequency Data Transfer Mode f
Clock low time t
Clock high time t
Clock rise time t
Clock fall time t
Inputs CMD, DAT (referenced to CLK)
Input set-up time t
Input hold time t
Outputs CMD, DAT (referenced to CLK)
Output Delay time during Data Transfer Modet
Output Hold time t
Total System capacitance for each line
1) In order to satisfy severe timing, host shall drive only one card.
Moisture and corrosion Operation: 25°C / 95% rel. humidity
Durability 10000 mating cycles
Bending 10N
Torque 0.10N*m , +/- 2.5deg max
Drop test 1.5m free fall
UV light exposure UV: 254nm, 15Ws/cm² according to ISO 7816-1
Visual inspection
Shape and form
Above technical information is based on standard data and tested to be reliable. However, Transcend makes no warranty,
either expressed or implied, as to its accuracy and assumes no liability in connection with the use of this product.
Transcend reserves the right to make changes in specifications at any time without prior notice.
~
2
G
G
U
U
S
S
S
D
D
D
Storage: -40°C (168h) / 85°C (500h)
Junction temperature: max. 95°C
Storage: 40°C / 93% rel. hum./500h
Salt Water Spray: 3% NaCl/35C; 24h acc. MIL STD Method 1009
No warppage; no mold skin; complete form; no cavities surface smoothness <= -0.1
mm/cm² within contour; no cracks; no pollution (fat, oil dust, etc.)
microSD Memory Card
Transcend Information Inc.
7
T
S
2
5
6
M
~
2
G
U
T
S
2
5
6
M
~
2
T
S
2
5
6
M
Register Information
Within the card interface six registers are defined: OCR, CID, CSD, RCA, DSR and SCR. These can be accessed only
by corresponding commands (see Chapter 4.7). The OCR, CID, CSD and SCR registers carry the card/content specific
information, while the RCA and DSR registers are configuration registers storing actual configuration parameters.
1. OCR register
The 32-bit operation conditions register stores the V
register includes a status information bit. This status bit is set if the card power up procedure has
been finished. The OCR register shall be implemented by the cards which do not support the full
operating voltage range of the SD Memory Card bus, or if the card power up extends the definition
in the timing diagram.
~
2
G
G
U
U
S
S
S
D
D
D
microSD Memory Card
DD voltage profile of the card. In addition, this
A voltage range is not supported if the corresponding bit value is set to LOW. As long as the card is busy, the
corresponding bit (31) is set to LOW.
Transcend Information Inc.
8
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