Transcend Compact Flash Card CF 266X, TS8GCF266, TS2GCF266, TS4GCF266 Specification Sheet
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Description
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Features
266X CompactFlash Card
The Transcend CF 266X is a High Speed Compact
Flash Card with high quality Flash Memory assembled
on a printed circuit board.
Placement
• CompactFlash Specification Version 4.1 Complaint
• RoHS compliant products
• Single Power Supply: 3.3V±5% or 5V±10%
o
• Operating Temperature: -25
• Operation Modes:
PC Card Memory Mode
PC Card IO Mode
True IDE Mode
• True IDE Mode supports
Ultra DMA Mode 0 to Mode 4
MultiWord DMA Mode 0 to Mode 4
PIO Mode 0 to Mode 6
• Durability of Connector: 10,000 times
• Support S.M.A.R.T (Self-defined)
• Support Wear-Leveling to extend product life
• Compliant to CompactFlash, PCMCIA, and ATA
C to 85oC
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standards
Dimensions
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266X CompactFlash Card
Transcend
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Block Diagram
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Pin Assignments and Pin Type
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266X CompactFlash Card
Note: 1) These signals are required only for 16 bit accesses and not required when installed in 8 bit
systems. Devices should allow for 3-state signals not to consume current.
2) The signal should be grounded by the host.
3) The signal should be tied to VCC by the host.
4) The mode is optional for CF+ Cards, but required for CompactFlash Storage Cards.
5) The -CSEL signal is ignored by the card in PC Card modes. However, because it is not
pulled upon the card in these modes, it should not be left floating by the host in PC Card
modes. In these modes, the pin should be connected by the host to PC Card A25 or
grounded by the host.
6) If DMA operations are not used, the signal should be held high or tied to VCC by the host. For
proper operation in older hosts: while DMA operations are not active, the card shall ignore
this signal,including a floating condition
7) Signal usage in True IDE Mode except when Ultra DMA mode protocol is active.
8) Signal usage in True IDE Mode when Ultra DMA mode protocol DMA Write is active.
9) Signal usage in True IDE Mode when Ultra DMA mode protocol DMA Read is active.
10) Signal usage in PC Card I/O and Memory Mode when Ultra DMA mode protocol DMA Write is active.
11) Signal usage in PC Card I/O and Memory Mode when Ultra DMA mode protocol DMA Read is active.
12) Signal usage in PC Card I/O and Memory Mode when Ultra DMA protocol is active.
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Signal Description
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Electrical Specification
The following tables indicate all D.C. Characteristics for the CompactFlash Storage Card. Unless
otherwise stated, conditions are:
Vcc = 5V ±10%
Vcc = 3.3V ± 5%
Absolute Maximum Conditions
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Input Power
Input Leakage Current
Input Characteristics
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Output Drive Type
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Output Drive Characteristics
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Signal Interface
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266X CompactFlash Card
Notes: 1) Control Signals: each card shall present a load to the socket no larger than 50 pF 10 at a DC current of 700 μA low
state and 150 μA high state, including pull-resistor. The socket shall be able to drive at least the following load
10 while meeting all AC timing requirements: (the number of sockets w ired in parallel) multiplied by (50 pF with DC
current 700 μA low state and 150 μA high state per socket).
2) Resistor is optional.
3) Status Signals: the socket shall present a load to the card no larger than 50 pF
state and 100 μA high state, including pull-up resistor. The card shall be able to drive at least the following load
10 while meeting all AC timing requirements: 50 pF at a DC current of 400 μA low state and 100 μA high state.
4) Status Signals: the socket shall present a load to the card no larger than 50 pF
state and 100 μA high state, including pull-up resistor. The card shall be able to drive at least the following load
10 while meeting all AC timing requirements: 50 pF at a DC current of 400 μA low state and 100 μA high state.
5) Status Signals: the socket shall present a load to the card no larger than 50 pF
state and 100 μA high state, including pull-up resistor. The card shall be able to drive at least the following load
10 while meeting all AC timing requirements: 50 pF at a DC current of 400 μA low state and 1100 μA high state.
6) BVD2 was not defined in the JEIDA 3.0 release. Systems fully supporting JEIDA release 3 SRAM cards shall
pull-up pin 45 (BVD2) to avoid sensing their batteries as “Low.”
7) Address Signals: each card shall present a load of no more than 100pF
150μA high state. The host shall be able to drive at least the following load
requirements: (the number of sockets wired in parallel) multiplied by (100pF with DC current 450μA low state
and 150μA high state per socket).
8) Data Signals: the host and each card shall present a load no larger than 50pF
150μA high state. The host and each card shall be able to drive at least the following load
timing requirements: 100pF with DC current 1.6mA low state and 300μA high state. This permits the host to wire
two sockets in parallel without derating the card access speeds.
9) Reset Signal: This signal is pulled up to prevent the input from floating when a CFA to PCMCIA adapter is used in
a PCMCIA revision 1 host. However, to minimize DC current drain through the pull-up resistor in normal
operation the pull-up should be turned off once the Reset signal has been actively driven low by the host.
Consequently, the input is specified as an I2Z because the resistor is not necessarily detectable in the input
current leakage test.
10) Host and card restrictions for CF Advanced Timing Modes and Ultra DMA modes: Additional Requirements for
CF Advanced Timing Modes and Ultra DMA Electrical Requirements for additional required limitations on the
implementation of CF Advanced Timing modes and Ultra DMA modes respectively.
Additional Requirements for CF Advanced Timing Modes
The CF Advanced Timing modes include PCMCIA I/O and Memory modes that are 100ns or faster and True
IDE PIO Modes 5,6 and Multiword DMA Modes 3,4.
When operating in CF Advanced timing modes, the host shall conform to the following requirements:
1) Only one CF device shall be attached to the CF Bus.
2) The host shall not present a load of more than 40pF to the device for all signals, including any cabling.
3) The maximum cable length is 0.15 m (6 in). The cable length is measured from the card connector to the host
controller. 0.46 m (18 in) cables are not supported.
4) The -WAIT and IORDY signals shall be ignored by the host.
Devices supporting CF Advanced timing modes shall also support slower timing modes, to ensure operability with
systems that do not support CF Advanced timing modes
10 at a DC current of 450μA low state and
10 at a DC current of 400 μA low
10 at a DC current of 400 μA low
10 at a DC current of 400 μA low
10 while meeting all AC timing
10 at a DC current of 450μA and
10 while meeting all AC
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Ultra DMA Electrical Requirements
Host and Card signal capacitance limits for Ultra DMA operation
The host interface signal capacitance at the host connector shall be a maximum of 25 pF for each signal as measured at
1 MHz. The card interface signal capacitance at the card connector shall be a maximum of 20 pF for each signal as
measured at 1 MHz.
Series termination required for Ultra DMA operation
Series termination resistors are required at both the host and the card for operation in any of the Ultra DMA modes. Table
13 describes typical values for series termination at the host and the device.
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Table: Typical Series Termination for Ultra DMA
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Table: Ultra DMA Termination with Pull-up or Pull down Example
Printed Circuit Board (PCB) Trace Requirements for Ultra DMA
On any PCB for a host or device supporting Ultra DMA:
The longest D[15:00] trace shall be no more than 0.5" longer than either STROBE trace as measured from
the IC pin to the connector.
The shortest D[15:00] trace shall be no more than 0.5" shorter than either STROBE trace as measured from
the IC pin to the connector.
Ultra DMA Mode Cabling Requirement
Operation in Ultra DMA mode requires a crosstalk suppressing cable. The cable shall have a grounded line
between each signal line.
For True IDE mode operation using a cable with IDE (ATA) type 40 pin connectors it is recommended that the
host sense the cable type using the method described in the ANSI INCITS 361-2002 AT Attachment - 6
standard, to prevent use of Ultra DMA with a 40 conductor cable.
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Attribute Memory Read Timing Specification
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Configuration Register (Attribute Memory) Write Timing Specification
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Common Memory Read Timing Specification
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Common Memory Write Timing Specification
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I/O Input (Read) Timing Specification
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I/O Output (Write) Timing Specification
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