Transcend CompactFlash 400X, CompactFlash TS16G-64GCF400, TS16GCF400, TS64GCF400 Datasheet

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400X CompactFlash Card

Transcend Information Inc.

V1.0

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Description

Dedicated to fulfill the demanding requirements of

performance-conscious photographers, Transcend

proudly releases its Extreme 400X CompactFlash

cards. With its amazing performance, the Transcend

400X CompactFlash memory card allows the

professional photographers and enthusiasts to get the

most from your digital single lens reflex (DSLR)

camera. Users are guaranteed to make consecutive

shooting and non-stop video recording and share their

digital artwork with the world!

Placement

Dimensions

Features

•

CompactFlash Specification Version 4.1 Compliant

•

RoHS compliant products

• Single Power Supply: 3.3V±5% or 5V±10%

•

Operating Temperature: -25oC to 85oC

•

Storage Temperature: -40oC to 85oC

•

Operating/ Storage Humidity: 5% to 95%

•

Operation Modes:



PC Card Memory Mode



PC Card IO Mode



True IDE Mode

•

True IDE Mode supports:



Ultra DMA Mode 0 to Ultra DMA Mode 6 (Ultra DMA

mode 5/6 must supply with 3.3V)



MultiWord DMA Mode 0 to MultiWord DMA Mode 4



PIO Mode 0 to PIO Mode 6

•

PC Card Mode supports up to Ultra DMA Mode 6

•

True IDE mode: Fixed Disk (Default)

•

PC Card Mode: Removable Disk (Default)

• Durability of Connector: 10,000 times

• Built-in 15 bit ECC (Error Correction Code) functionality

• Support Global Wear-Leveling to extend product life

• Transfer rate up to read 90MB/s write 60MB/s based on

TestMetrix.

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Specification

* Note: 24-hours chamber test on ASUS Striker 2 Extreme, 1GB RAM, Windows® XP Version 2002 SP3.

Interface Specification

Drivers

No Device Driver Required

ATA/ATAPI 7

PIO Mode 0 - 6

Multiword mode 0 - 4

ATA Compatibility

UDMA Mode 0 - 6

Physical Specification

Form Factor

Compact Flash Card

Storage Capacities

16 GB to 64 GB

Length

36.40 ± 0.15

Width

42.80 ± 0.10

Dimensions (mm)

Height

3.30 ± 0.10

Environmental Specifications

Operating Temperature

-25 ℃ to 85 ℃

Storage Temperature

-40 ℃ to 85 ℃

Humidity

Operating Humidity (Non condensation)

5% to 95%

Storage Humidity (Non condensation)

5% to 95%

Power Consumption

Product

TS16GF400 TS32GCF400 TS64GCF400

Standby

0.2mA 0.2mA 0.2mA

Read

221.0mA 225.7mA

231.6mA

Power Consumption

(DC 3.3V @25℃)

Write

213.2mA 231.7mA

205.7mA

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Note : 25 ℃, according to IDE to CF card transferring board test on ASUS P4S800-MX, 1GB RAM, IDE interface support

UDMA6, Windows® XP Version 2002 SP2, CrystalDiskMark, copied file 100MB

* Note: FAT32 format

Performance

Model P/N Capacity Read(MB/s) Write(MB/s) Random Read (MB/s) Random Write (MB/s)

TS16GCF400 16GB 83.67 44.96 82.38 8.671

TS32GCF400 32GB 86.16 45.82 85.09 10.99

TS64GCF400 64GB 88.87 39.67 88.48 10.59

Actual Capacity

Model P/N User LBA Cylinder Head Sector

TS16GCF400 31293360 31045 16 63

TS32GCF400 62537328 62041 16 63

TS64GCF400 125059072 16383 15 63

Transcend

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Block Diagram

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Pin Assignments and Pin Type

PC Card Memory Mode PC Card I/O Mode True IDE Mode

4

Num

Signal

Name

Type

In, Out Type Pin Num

Signal Name

Type

In, Out

Type

Num

Signal Name

Type

In, Out

Type

1 GND

Ground 1 GND

Ground

1 GND

Ground

2 D03 I/O I1Z, OZ3 2 D03 I/O I1Z, OZ3

2 D03 I/O I1Z, OZ3

3 D04 I/O I1Z, OZ3 3 D04 I/O I1Z, OZ3

3 D04 I/O I1Z, OZ3

4 D05 I/O I1Z, OZ3 4 D05 I/O I1Z, OZ3

4 D05 I/O I1Z, OZ3

5 D06 I/O I1Z, OZ3 5 D06 I/O I1Z, OZ3

5 D06 I/O I1Z, OZ3

6 D07 I/O I1Z, OZ3 6 D07 I/O I1Z, OZ3

6 D07 I/O I1Z, OZ3

7 -CE1 I I3U 7 -CE1 I I3U 7 -CS0 I I3Z

8 A10 I I1Z 8 A10 I I1Z 8 A102 I I1Z

9 -OE I I3U 9 -OE I I3U 9 -ATA SEL I I3U

10

A09 I I1Z 10 A09 I I1Z 10 A092 I I1Z

11

A08 I I1Z 11 A08 I I1Z 11 A082 I I1Z

12

A07 I I1Z 12 A07 I I1Z 12 A072 I I1Z

13

VCC

Power 13 VCC

Power

13 VCC

Power

14

A06 I I1Z 14 A06 I I1Z 14 A062 I I1Z

15

A05 I I1Z 15 A05 I I1Z 15 A052 I I1Z

16

A04 I I1Z 16 A04 I I1Z 16 A042 I I1Z

17

A03 I I1Z 17 A03 I I1Z 17 A032 I I1Z

18

A02 I I1Z 18 A02 I I1Z 18 A02 I I1Z

19

A01 I I1Z 19 A01 I I1Z 19 A01 I I1Z

20

A00 I I1Z 20 A00 I I1Z 20 A00 I I1Z

21

D00 I/O I1Z, OZ3 21 D00 I/O I1Z, OZ3 21 D00 I/O I1Z, OZ3

22

D01 I/O I1Z, OZ3 22 D01 I/O I1Z, OZ3 22 D01 I/O I1Z, OZ3

23

D02 I/O I1Z, OZ3 23 D02 I/O I1Z, OZ3 23 D02 I/O I1Z, OZ3

24

WP O OT3 24 -IOIS16 O OT3 24 -IOCS16

O ON3

25

-CD2 O Ground 25 -CD2 O Ground

25 -CD2 O Ground

26

-CD1 O Ground 26 -CD1 O Ground

26 -CD1 O Ground

27

D111 I/O I1Z, OZ3 27 D111 I/O I1Z, OZ3 27 D111 I/O I1Z, OZ3

28

D121 I/O I1Z, OZ3 28 D121 I/O I1Z, OZ3 28 D121 I/O I1Z, OZ3

29

D131 I/O I1Z, OZ3 29 D131 I/O I1Z, OZ3 29 D131 I/O I1Z, OZ3

30

D141 I/O I1Z, OZ3 30 D141 I/O I1Z, OZ3 30 D141 I/O I1Z, OZ3

31

D151 I/O I1Z, OZ3 31 D151 I/O I1Z, OZ3 31 D151 I/O I1Z, OZ3

32

-CE21 I I3U 32 -CE21 I I3U 32 -CS11 I I3Z

33

-VS1 O Ground 33 -VS1 O Ground

33 -VS1 O Ground

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PC Card Memory Mode PC Card I/O Mode True IDE Mode

4

Num

Signal Name

Type

In, Out

Type

Num

Signal Name

Type

In, Out

Type

Num

Signal Name

Type

In, Out

Type

-HIOE7

HSTROBE8

34

-HIOE

HSTROBE

10

HDMARDY

11

I I3U 34

-HIOE

HSTROBE10

-HDMARDY11

I I3U 34

-HDMARDY

9

I I3Z

-IOWR -IOWR -IOWR7

35

STOP

10,11

I I3U 35

STOP

10,11

I I3U 35

STOP

8,9

I I3Z

36

-WE I I3U 36 -WE I I3U 36 -WE3 I I3U

37

READY O OT1 37 -IREQ O OT1 37 INTRQ O OZ1

38

VCC Power 38 VCC Power 38 VCC Power

39

-CSEL5 I I2Z 39 -CSEL5 I I2Z 39 -CSEL I I2U

40

-VS2 O OPEN 40 -VS2 O OPEN 40 -VS2 O OPEN

41

RESET I I2Z 41 RESET I I2Z 41 -RESET I I2Z

-WAIT -WAIT IORDY7 ON1

-DDMARDY

10

-DDMARDY10

-DDMARDY8

42

DSTROBE11

O OT1 42

DSTROBE

11

O OT1 42

DSTROBE9

O

OT113

-INPACK -INPACK

43

-DMARQ12

O OT1 43

-DMARQ12

O OT1 43 DMARQ O OZ1

-REG I I3U 44 -REG

44

-DMACK

12

DMACK

12

I I3U 44 -DMACK 6 I I3U

45

BVD2 O OT1 45 -SPKR O OT1 45 -DASP I/O I1U, ON1

46

BVD1 O OT1 46 -STSCHG O OT1 46 -PDIAG I/O I1U, ON1

47

D081 I/O

I1Z,

OZ3

47 D081 I/O

I1Z,

OZ3

47 D081 I/O I1Z, OZ3

48

D091 I/O

I1Z,

OZ3

48 D091 I/O

I1Z,

OZ3

48 D091 I/O I1Z, OZ3

49

D101 I/O

I1Z,

OZ3

49 D101 I/O

I1Z,

OZ3

49 D101 I/O I1Z, OZ3

50

GND Ground 50 GND Ground 50 GND Ground

Note: 1) These signals are required only for 16 bit accesses and not required when installed in 8 bit systems. Devices should allow for 3-state

signals not to consume current.

2) The signal should be grounded by the host.

3) The signal should be tied to VCC by the host.

4) The mode is required for CompactFlash Storage Cards.

5) The -CSEL signal is ignored by the card in PC Card modes. However, because it is not pulled upon the card in these modes, it should not be left floating by the host in PC Card modes. In these modes, the pin should be connected by the host to PC Card A25 or grounded by the host.

6) If DMA operations are not used, the signal should be held high or tied to VCC by the host. For proper operation in older hosts: while DMA operations are not active, the card shall ignore this signal,including a floating condition

7) Signal usage in True IDE Mode except when Ultra DMA mode protocol is active.

8) Signal usage in True IDE Mode when Ultra DMA mode protocol DMA Write is active.

9) Signal usage in True IDE Mode when Ultra DMA mode protocol DMA Read is active.

10) Signal usage in PC Card I/O and Memory Mode when Ultra DMA mode protocol DMA Write is active.

11) Signal usage in PC Card I/O and Memory Mode when Ultra DMA mode protocol DMA Read is active.

12) Signal usage in PC Card I/O and Memory Mode when Ultra DMA protocol is active.

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

Input Leakage Current

Note: In Table 1 below, x refers to the characteristics described in table 2. For example, I1U indicates a pull-up resistor with a type 1 input characteristic.

Table 1: Input Leakage Current

Type Parameter Symbol

Conditions MIN TYP MAX Units

IxZ Input Leakage Current

IL Vih = Vcc / Vil = Gnd -1

1 µA

IxU Pull-Up Resistor RPU1 Vcc = 5.0V 50k

500k Ohm

IxD Pull-Down Resistor RPD1 Vcc = 5.0V 50k

500k Ohm

Note: The minimum pull-up resistor resistance meets the PCMCIA PC Card specification of 10k ohms but is intentionally higher in the CompactFlash Specification to reduce power use.



Input Characteristics

Table 2: Input Characteristics

MIN TYP MAX MIN TYP MAX

Type Parameter Symbol

VCC = 3.3 V VCC = 5.0 V

Units

1

Input Voltage CMOS

Vih

Vil

2.4

0.6 4.0

1

0.8

Volts

2

Input Voltage CMOS

Vih

Vil

1.5

0.6 2.0

0.8

Volts

3

Input Voltage CMOS Schmitt Trigger

Vth

Vtl

1.8

1.0

2.8

2.0

Volts

Notes: 1) The host provides a logic output high voltage for a CMOS load of .9 x VCC. For a 5 volt product, this translates to .9 x

4.5 = 4.05 volts minimum Voh.



Output Drive Type

Note: In Table 3 below, x refers to the characteristics described in Table 4. For example, OT3 refers to Totem pole output with a type 3 output drive characteristic.

Table 3: Output Drive Type

Type Output Type Valid Conditions

OTx Totempole Ioh & Iol

OZx Tri-State N-P Channel Ioh & Iol

OPx P-Channel Only Ioh Only

ONx N-Channel Only Iol Only

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Output Drive Characteristics

Table 4: Output Drive Characteristics

Type

Parameter Symbol Conditions MIN TYP MAX Units

1 Output Voltage

Voh

Vol

Ioh = -4 mA

Iol = 4 mA

Vcc

-0.8V

Gnd

+0.4V

Volts

2 Output Voltage

Voh

Vol

Ioh = -4 mA

Iol = 4 mA

Vcc

-0.8V

Gnd

+0.4V

Volts

3 Output Voltage

Voh

Vol

Ioh = -4 mA

Iol = 4 mA

Vcc

-0.8V

Gnd

+0.4V

Volts

X

Tri-State Leakage

Current

Ioz

Vol = Gnd

Voh = Vcc

-10

10 µA

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Signal Description

Signal Name

Dir.

Description

A10 – A00

(PC Card Memory Mode)

A10 – A00

(PC Card I/O Mode)

A02 - A00

(True IDE Mode)

I

8,10,11,12,

14,15,16,17,

18,19,20

These address lines along with the -REG signal are used to

select the following:

The I/O port address registers within the CompactFlash Storage Card , the memory mapped

port address registers within the CompactFlash Storage Card,

a byte in the card's information structure and its configura

tion control and status

registers.

This signal is the same as the PC Card Memory Mode signal.

In True IDE Mode, only A[02:00] are used to select the one of eight registers in the Task File, the remaining address lines should be grounded by the host.

BVD1

(PC Card Memory Mode)

-STSCHG

(PC Card I/O Mode)

Status Changed

-PDIAG

(True IDE Mode)

I/O

46 This signal is asserted high, as BVD1 is not supported.

This signal is asserted low to alert the host to changes in the

READY and Write

Protect states, while the I/O interface is configured. Its use is controlled by the Card Config and Status Register.

In the True IDE Mode, this input / output is the Pass Diagnostic signal in the Master / Slave handshake protocol.

BVD2

(PC Card Memory Mode)

-SPKR

(PC Card I/O Mode)

-DASP

(True IDE Mode)

I/O

45 This signal is asserted high, as BVD2 is not supported.

This line is the Binary Audio output from the card. If the Card does not support the Binary Audio function, this line should be held negated.

In the True IDE Mode, this input/output is the Disk Active/Slave

Present signal in

the Master/Slave handshake protocol.

-CD1, -CD2

(PC Card Memory Mode)

-CD1, -CD2

(PC Card I/O Mode)

-CD1, -CD2

(True IDE Mode)

O

26,25 These Card Detect pins are connected to ground on the

CompactFlash Storage

Card. They are used by the host to determine that the CompactFlash Storage Card is fully inserted into its socket.

This signal is the same for all modes.

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Signal Name

Dir.

Description

-CE1, -CE2

(PC Card Memory Mode)

Card Enable

-CE1, -CE2

(PC Card I/O Mode)

Card Enable

-CS0, -CS1

(True IDE Mode)

I

7,32

These input signals are used both to select the card and to indicate to the card whether a byte or a word operation is being performed. -CE2 always accesses the odd byte of the word.-CE1 accesses the even byte or the Odd byte of the word depending on A0 and -CE2. A multiplexing scheme based on A0,-CE1,

-CE2 allows 8 bit hosts to access all data on D0-D7. See Table 27, Table 29, Table 31, Table 35, Table 36 and Table 37.

This signal is the same as the PC Card Memory Mode signal.

In the True IDE Mode, -CS0 is the address range select for the task file registers while -CS1 is used to select the Alternate Status Register and the Device Control Register.

While –DMACK is asserted, -CS0 and –CS1 shall be held negated and the width of the transfers shall be 16 bits.

-CSEL

(PC Card Memory Mode)

-CSEL

(PC Card I/O Mode)

-CSEL

(True IDE Mode)

I

39

This signal is not used for this mode, but should be connected by

the host to PC

Card A25 or grounded by the host.

This signal is not used for this mode, but should be connected by

the host to PC

Card A25 or grounded by the host.

This internally pulled up signal is used to configure this device as

a Master or a

Slave when configured in the True IDE Mode.

When this pin is grounded, this device is configured as a Master.

When the pin is open, this device is configured as a Slave.

D15 - D00

(PC Card Memory Mode)

D15 - D00

(PC Card I/O Mode)

D15 - D00

(True IDE Mode)

I/O

31,30,29,28, 27,49,48,47,

6,5,4,3,2,

23, 22, 21

These lines carry the Data, Commands and Status information

between the host

and the controller. D00 is the LSB of the Even

Byte of the Word. D08 is the LSB

of the Odd Byte of the Word.

This signal is the same as the PC Card Memory Mode signal.

In True IDE Mode, all Task File operations occur in byte mode

on the low order

bus D[7:0] while all data transfers are 16 bit using D[15:0].

GND

(PC Card Memory Mode)

GND

(PC Card I/O Mode)

GND

(True IDE Mode)

--

1,50 Ground.

This signal is the same for all modes.

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Signal Name

Dir.

Description

-INPACK

(PC Card Memory Mode except Ultra DMA Protocol Active)

-INPACK

(PC Card I/O Mode except Ultra DMA Protocol Active)

Input Acknowledge

-DMARQ

(PC Card Memory Mode -Ultra DMA Protocol Active)

-DMARQ

(PC Card I/O Mode -Ultra DMA Protocol Active)

DMARQ

(True IDE Mode)

O

43 This signal is not used in this mode.

The Input Acknowledge signal is asserted by the CompactFlash Storage Card when the card is selected and responding to an I/O read cycle at the address that is on the address bus. This signal is used by the host to control the enable

of

any input data buffers between the CompactFlash Storage Card and the CPU.

Hosts that support a single socket per interface logic, such as for Advanced Timing Modes and Ultra DMA operation may ignore the –INPACK signal from the device and manage their input buffers based solely on Card Enable signals.

This signal is a DMA Request that is used for DMA data

transfers between host

and device. It shall be asserted by the

device when it is ready to transfer data to

or from the host. For Multiword DMA transfers, the direction of data transfer is controlled by -HIOE and -IOWR. This signal is used in a

handshake manner with

(-)DMACK, i.e., the device shall wait until the host asserts (-)DMACK before negating (-)DMARQ, and re-asserting (-)DMARQ if there is more data to transfer.

In PCMCIA I/O Mode, the -DMARQ shall be ignored by the host

while the host is

performing an I/O Read cycle to the device. The host shall not initiate an I/O Read cycle while -DMARQ is asserted by the device.

In True IDE Mode, DMARQ shall not be driven when the device

is not selected in

the Drive-Head register.

While a DMA operation is in progress, -CS0 (-CE1)and -CS1 (-CE2) shall be held negated and the width of the transfers shall be 16 bits.

If there is no hardware support for True IDE DMA mode in the host, this output signal is not used and should not be connected at the host. In this case, the BIOS must report that DMA mode is not supported by the host so that device drivers will not attempt DMA mode operation.

A host that does not support DMA mode and implements both

PC Card and True

IDE modes of operation need not alter the PC Card mode connections while in True IDE mode as long as this does not prevent proper operation in any mode.

-HIOE

(PC Card Memory Mode except Ultra DMA Protocol Active)

-HIOE

(PC Card I/O Mode except Ultra DMA Protocol Active)

-HIOE

(True IDE Mode – Except Ultra DMA Protocol Active)

-HDMARDY

(All Modes - Ultra DMA Protocol DMA Read)

HSTROBE

(All Modes - Ultra DMA Protocol DMA Write)

I

34 This signal is not used in this mode.

This is an I/O Read strobe generated by the host. This signal

gates I/O data onto

the bus from the CompactFlash Storage

Card when the card is configured to use

the I/O interface.

In True IDE Mode, while Ultra DMA mode is not active, this

signal has the same

function as in PC Card I/O Mode.

In all modes when Ultra DMA mode DMA Read is active, this

signal is asserted

by the host to indicate that the host is ready to receive Ultra DMA data-

in bursts.

The host may negate – HDMARDY to pause an Ultra DMA transfer.

In all modes when Ultra DMA mode DMA Write is active, this signal is the data out strobe generated by the host. Both the

rising and falling edge of HSTROBE

cause data to be latched by the device. The host may stop generating HSTROBE edges to pause an Ultra DMA data-out burst.

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Signal Name

Dir.

Description

-IOWR

(PC Card Memory Mode– Except Ultra DMA Protocol Active)

-IOWR

(PC Card I/O Mode –

Except Ultra

DMA Protocol Active)

-IOWR

(True IDE Mode – Except Ultra

DMA Protocol Active)

STOP

(All Modes – Ultra DMA Protocol Active)

I

35

This signal is not used in this mode.

The I/O Write strobe pulse is used to clock I/O data on the Card Data bus into the CompactFlash Storage Card controller registers when the CompactFlash Storage Card is configured to use the I/O interface.

The clocking shall occur on the negative to positive edge of the signal (trailing edge).

In True IDE Mode, while Ultra DMA mode protocol is not active, this signal has the same function as in PC Card I/O Mode. When Ultra DMA mode protocol is supported, this signal must be negated before entering Ultra DMA mode protocol.

In All Modes, while Ultra DMA mode protocol is active, the

assertion of this signal

causes the termination of the Ultra DMA data burst.

-OE

(PC Card Memory Mode)

-OE

(PC Card I/O Mode)

-ATA SEL

(True IDE Mode)

I

9

This is an Output Enable strobe generated by the host interface. It is used to read data from the CompactFlash Storage Card in Memory Mode and to read the CIS and configuration registers.

In PC Card I/O Mode, this signal is used to read the CIS and configuration registers.

To enable True IDE Mode this input should be grounded by the host.

READY

(PC Card Memory Mode)

-IREQ

(PC Card I/O Mode)

INTRQ

(True IDE Mode)

O

37

In Memory Mode, this signal is set high when the CompactFlash Storage Card

is

ready to accept a new data transfer operation and is held low when the card is busy.

At power up and at Reset, the READY signal is held low (busy) until the CompactFlash Storage Card has completed its power up or reset function. No access of any type should be made to the CompactFlash Storage Card during this time.

Note, however, that when a card is powered up and used with RESET continuously disconnected or asserted, the Reset function of the RESET pin is disabled. Consequently, the

continuous assertion of RESET from the application

of power shall not cause the READY signal to remain continuously in the busy state.

I/O Operation – After the CompactFlash Storage Card Card has been configured for I/O operation, this signal is used as -

Interrupt Request. This line is

strobed low to generate a pulse mode interrupt or held low for a level mode interrupt.

In True IDE Mode signal is the active high Interrupt Request to the host.

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Signal Name

Dir.

Description

-REG

(PC Card Memory Mode– Except Ultra DMA Protocol Active)

Attribute Memory Select

-REG

(PC Card I/O Mode –

Except Ultra

DMA Protocol Active)

This signal is used during Memory Cycles to distinguish between Common Memory and Register (Attribute) Memory accesses.

High for Common Memory,

Low for Attribute Memory.

In PC Card Memory Mode, when Ultra DMA Protocol is supported by the host and the host has enabled Ultra DMA

protocol on the card the, host shall keep the

-REG signal negated during the execution of any DMA Command by the device.

The signal shall also be active (low) during I/O Cycles when the

I/O address is on

the Bus.

In PC Card I/O Mode, when Ultra DMA Protocol is supported by

the host and the

host has enabled Ultra DMA protocol on the card the, host shall keep the -

REG

signal asserted during the execution of any DMA Command by the device.

-DMACK

(PC Card Memory Mode when Ultra DMA Protocol Active)

DMACK

(PC Card I/O Mode when Ultra DMA Protocol Active)

-DMACK

(True IDE Mode)

I

44

This is a DMA Acknowledge signal that is asserted by the host in response to (-)DMARQ to initiate DMA transfers.

In True IDE Mode, while DMA operations are not active, the card

shall ignore the

(-)DMACK signal, including a floating condition.

If DMA operation is not supported by a True IDE Mode only host, this signal should be driven high or connected to VCC by the host.

A host that does not support DMA mode and implements both PC Card and True-IDE modes of operation need not alter the PC Card mode connections while in True-IDE mode as long as this does not prevent proper operation all modes.

RESET

(PC Card Memory Mode)

RESET

(PC Card I/O Mode)

-RESET

(True IDE Mode)

I

41 The CompactFlash Storage Card is Reset when the

RESET pin is high with the

following important exception:

The host may leave the RESET pin open or keep it continually high from the application of power without causing a continuous Reset of the card. Under either of these conditions, the card shall emerge from power-up having completed an initial Reset.

The CompactFlash Storage Card is also Reset when the Soft Reset bit in the Card Configuration Option Register is set.

This signal is the same as the PC Card Memory Mode signal.

In the True IDE Mode, this input pin is the active low hardware reset from the host.

VCC

(PC Card Memory Mode)

VCC

(PC Card I/O Mode)

VCC

(True IDE Mode)

--

13,38 +5 V, +3.3 V power.

This signal is the same for all modes.

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Signal Name

Dir.

Description

-VS1

-VS2

(PC Card Memory Mode)

-VS1

-VS2

(PC Card I/O Mode)

-VS1

-VS2

(True IDE Mode)

O

33 40

Voltage Sense Signals. -VS1 is grounded on the Card and sensed by the Host so that the CompactFlash Storage Card CIS can be read at 3.3 volts and -

VS2 is

reserved by PCMCIA for a secondary voltage and is not connected on the Card.

This signal is the same for all modes.

-WAIT

(PC Card Memory Mode –

Except

Ultra DMA Protocol Active)

-WAIT

(PC Card I/O Mode –

Except Ultra

DMA Protocol Active)

IORDY

(True IDE Mode – Except Ultra DMA Protocol Active)

-DDMARDY

(All Modes – Ultra DMA Write Protocol Active)

DSTROBE

(All Modes – Ultra DMA Read Protocol Active)

O

42

The -WAIT signal is driven low by the CompactFlash Storage

Card to signal the

host to delay completion of a memory or I/O cycle that is in progress.

This signal is the same as the PC Card Memory Mode signal.

In True IDE Mode, except in Ultra DMA modes, this output signal may be used as IORDY.

In all modes, when Ultra DMA mode DMA Write is active, this

signal is asserted

by the device during a data burst to indicate that the device is ready to receive Ultra DMA data out bursts. The device may negate -DDMARDY to pause an Ultra DMA transfer.

In all modes, when Ultra DMA mode DMA Read is active, this

signal is the data in

strobe generated by the device. Both the rising and falling edge of DSTROBE cause data to be latched by the host. The device may stop generating DSTROBE edges to pause an Ultra DMA data in burst.

-WE

(PC Card Memory Mode)

-WE

(PC Card I/O Mode)

-WE

(True IDE Mode)

I

36 This is a signal driven by the host and used for strobing memory

write data to the

registers of the CompactFlash Storage Card when the card is configured in the

memory interface mode. It is also used for writing the configuration registers.

In PC Card I/O Mode, this signal is used for writing the configuration registers.

In True IDE Mode, this input signal is not used and should be

connected to VCC

by the host.

WP (PC Card Memory Mode) Write Protect

-IOIS16 (PC Card I/O Mode)

-IOCS16 (True IDE Mode)

O

24

Memory Mode – The CompactFlash Storage Card

does not have a write protect

switch. This signal is held low after the completion of the reset initialization sequence.

I/O Operation – When the CompactFlash Storage Card is configured for I/O Operation Pin 24 is used for the -I/O Selected is 16 Bit Port (-

IOIS16) function. A

Low signal indicates

that a 16 bit or odd byte only operation can be performed at

the addressed port.

In True IDE Mode this output signal is asserted low when this

device is expecting

a word data transfer cycle.

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Electrical Specification

The following tables indicate all D.C. Characteristics for the CompactFlash Storage Card. Unless

otherwise stated, conditions are:

Vcc = 5V ±10%

Vcc = 3.3V ± 5%



Absolute Maximum Conditions

 DC Characteristics

CompactFlash Interface I/O at 5.0V

Parameter

Symbol

Min.

Max.

Unit

Remark

Supply Voltage

V

CC

4.5 5.5 V

High level output voltage VOH

VCC

─

──

─

0.8

V

Low level output voltage VOL 0.8 V

4.0 V

Non-schmitt trigger

High level input voltage VIH

2.92 V

Schmitt trigger

1

0.8 V

Non-schmitt trigger

Low level input voltage VIL

1.70 V

Schmitt trigger

1

Pull up resistance2 RPU 50 73 KOhm

Pull down resistance RPD 50 97 KOhm

CompactFlash Interface I/O at 3.3V

Parameter

Symbol

Min.

Max.

Unit

Remark

Supply Voltage

V

CC

3.135 3.465 V

High level output voltage VOH

VCC

────

0.8

V

Low level output voltage VOL 0.8 V

2.4 V

Non-schmitt trigger

High level input voltage VIH

2.05 V

Schmitt trigger

1

0.6 V

Non-schmitt trigger

Low level input voltage VIL

1.25 V

Schmitt trigger

1

Pull up resistance2 RPU 52.7 141 KOhm

Pull down resistance RPD 47.5 172 KOhm

1. Include CE1, CE2, HREG, HOE, HIOE, HWE, HIOW pins

2. Include CE1, CE2, HREG, HOE, HIOE, HWE, HIOW, CSEL (P35), PDIAG, DASP pins

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

Input Power



Input Characteristics for UDMA mode >4

In UDMA modes greater than 4, the following characteristics apply. Voltage output high and low values shall be met

at the source connector to include the effect of series termination.

Table: Input Characteristics (UDMA Mode > 4)

Parameter Symbol MIN MAX Units

DC supply voltage to drivers V

DD3

3.3 –8% 3.3% + 8% Volts

Low to high input threshold V+ 1.5 2.0 Volts

High to low input threshold V- 1.0 1.5 Volts

Difference between input thresholds:

((V+

current value

) - (V-

current value

))

V

HYS

320 Volts

Average of thresholds:

((V+

current value

) + (V-

current value

))/2

V

THRAVG

1.3 1.7 Volts



Output Drive Characteristics for UDMA mode > 4

In UDMA modes greater than 4, the characteristics specified in the following table apply. Voltage output high and low

values shall be met at the source connector to include the effect of series termination.

Table: Output Drive Characteristics (UDMA Mode > 4)

Parameter Symbol

MIN MAX Units

DC supply voltage to drivers V

DD3

3.3 –8% 3.3% + 8% Volts

Voltage output high at -6 mA to +3 mA (at VoH2 the output s

hall

be able to supply and sink current toVDD3)

V

oH2

V

DD3

–0.51 V

DD3

+0.3 Volts

Voltage output low at 6 mA V

oL2

0.51 Volts

Notes:

1) I

oLDASP

shall be 12 mA minimum to meet legacy timing and signal integrity.

2) I

oH

value at 400 μA is insufficient in the case of DMARQ that is pulled low by a 5.6 kΩ resistor.

3) Voltage output high and low values shall be met at the source connector to include the effect of series termination.

4) A device shall have less than 64 μA of leakage current into a 6.2 KΩ pull-down resistor while the INTRQ signal is in the released state.

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

Signal Interface

Electrical specifications shall be maintained to ensure data reliability. Additional requirements are necessary for

Advanced Timing Modes and Ultra DMA modes operations. See next sections for additional information.

Item Signal Card10 Host

10

Control Signal

-CE1

-CE2

-REG

-HIOE

-IOWR

Pull-up to VCC 500 K

Ω ≧ R≧

50 KΩ and

shall be sufficient to keep inputs inactive when the pins are not connected at the host.

1

-OE

-WE

Pull-up to VCC 500 KΩ ≧ R ≧ 50 KΩ.

1,2

RESET

Pull-up to VCC 500 KΩ ≧ R ≧ 50 KΩ.

1,2,9,

Status Signal

READY

-WAIT WP

Pull-up to VCC R ≧ 10 KΩ.

3

-INPACK

In PCMCIA PC Card modes Pull-up to VCC

R ≧ 10 KΩ.4

In True IDE mode, if DMA operation is supported by the host, Pull-down to Gnd R

≧

5.6 KΩ.5

PC Card / True IDE hosts switch the pull-

up

to pull down in True IDE mode if DMA operation is supported.

The PC Card mode Pull-up may be left active during True IDE mode if True IDE DMA operation is not supported.

Address

A[10:00]

-CSEL

Data Bus D[15:00]

1.

Card Detect

-CD[2:1] Connected to GND in the card

Voltage Sense

-VS1

-VS2

Pull-up to Vcc 10 KΩ ≦ R ≦100KΩ.

Battery/Detect BVD[2:1]

Pull-up R ≧ 50 KΩ.

3.6

Notes: 1) Control Signals: each card shall present a load to the socket no larger than 50 pF

10

at a DC current of 700 μA

low state and 150 μA high state, including pull-resistor. The socket shall be able to drive at least the following load

10

while meeting all AC timing requirements: (the number of sockets wired in parallel) multiplied by (50 pF

with DC current 700 μA low state and 150 μA high state per socket).

2) Resistor is optional.

3) Status Signals: the socket shall present a load to the card no larger than 50 pF

10

at a DC current of 400 μA low

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state and 100 μA high state, including pull-up resistor. The card shall be able to drive at least the following load

10

while meeting all AC timing requirements: 50 pF at a DC current of 400 μA low state and 100 μA high state.

4) Status Signals: the socket shall present a load to the card no larger than 50 pF

10

at a DC current of 400 μA low

state and 100 μA high state, including pull-up resistor. The card shall be able to drive at least the following load

10

while meeting all AC timing requirements: 50 pF at a DC current of 400 μA low state and 100 μA high state.

5) Status Signals: the socket shall present a load to the card no larger than 50 pF

10

at a DC current of 400 μA low

state and 100 μA high state, including pull-up resistor. The card shall be able to drive at least the following load

10

while meeting all AC timing requirements: 50 pF at a DC current of 400 μA low state and 1100 μA high state.

6) BVD2 was not defined in the JEIDA 3.0 release. Systems fully supporting JEIDA release 3 SRAM cards shall pull-up pin 45 (BVD2) to avoid sensing their batteries as “Low.”

7) Address Signals: each card shall present a load of no more than 100pF

10

at a DC current of 450μA low state and

150μA high state. The host shall be able to drive at least the following load

10

while meeting all AC timing

requirements: (the number of sockets wired in parallel) multiplied by (100pF with DC current 450μA low state

and 150μA high state per socket).

8) Data Signals: the host and each card shall present a load no larger than 50pF

10

at a DC current of 450μA and

150μA high state. The host and each card shall be able to drive at least the following load

10

while meeting all

AC timing requirements: 100pF with DC current 1.6mA low state and 300μA high state. This permits the host to wire two sockets in parallel without derating the card access speeds.

9) Reset Signal: This signal is pulled up to prevent the input from floating when a CFA to PCMCIA adapter is used in a PCMCIA revision 1 host. However, to minimize DC current drain through the pull-up resistor in normal operation the pull-up should be turned off once the Reset signal has been actively driven low by the host. Consequently, the input is specified as an I2Z because the resistor is not necessarily detectable in the input current leakage test.

10) Host and card restrictions for CF Advanced Timing Modes and Ultra DMA modes: Additional Requirements for CF Advanced Timing Modes and Ultra DMA Electrical Requirements for additional required limitations on the implementation of CF Advanced Timing modes and Ultra DMA modes respectively.



Additional Requirements for CF Advanced Timing Modes

The CF Advanced Timing modes include PC Card I/O and Memory modes that are 100ns or faster, PC Card Ultra DMA modes 3 or above and True IDE PIO Modes 5,6, Multiword DMA Modes 3,4 and True IDE Ultra DMA modes 3 or above.

When operating in CF Advanced timing modes, the host shall conform to the following requirements:

1) Only one CF device shall be attached to the CF Bus.

2) The host shall not present a load of more than 40pF to the device for all signals, including any cabling.

3) The maximum cable length is 0.15 m (6 in). The cable length is measured from the card connector to the host controller. 0.46 m (18 in) cables are

not

supported.

4) The -WAIT and IORDY signals shall be ignored by the host.

Devices supporting CF Advanced timing modes shall also support slower timing modes, to ensure operability with systems that do not support CF Advanced timing modes

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

Ultra DMA Electrical Requirements



Host and Card signal capacitance limits for Ultra DMA operation

The host interface signal capacitance at the host connector shall be a maximum of 25 pF for each signal as measured at 1 MHz.

The card interface signal capacitance at the card connector shall be a maximum of 20 pF for each signal as measured at 1 MHz.

 Series termination required for Ultra DMA operation

Series termination resistors are required at both the host and the card for operation in any of the Ultra DMA modes. Table describes typical values for series termination at the host and the device.

Table: Typical Series Termination for Ultra DMA

Signal Host Termination Device Termination

-HIOE (-HDMARDY,HSTROBE) 22 ohm 82 ohm

-IOWR (STOP) 22 ohm 82 ohm

-CS0, -CS1 33 ohm 82 ohm A00, A01, A02 33 ohm 82 ohm

-DMACK 22 ohm 82 ohm D15 through D00 33 ohm 33 ohm DMARQ 82 ohm 22 ohm INTRQ 82 ohm 22 ohm IORDY (-DDMARDY, DSTROBE) 82 ohm 22 ohm

-RESET 33 ohm 82 ohm NOTE

−

Only those signals requiring termination are listed in this table. If a signal is not listed, series termination is not required for operation in an Ultra DMA mode. Shows signals also requiring a pull-up or pull-down resistor at the host. The actual termination values should be selected to compensate for transceiver and trace impedance to match the characteristic cable impedance.

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

Printed Circuit Board (PCB) Trace Requirements for Ultra DMA

On any PCB for a host or device supporting Ultra DMA:



The longest D[15:00] trace shall be no more than 0.5" longer than either STROBE trace as measured from the IC pin to the connector.



The shortest D[15:00] trace shall be no more than 0.5" shorter than either STROBE trace as measured from the IC pin to the connector.



Ultra DMA Mode Cabling Requirement



Operation in Ultra DMA mode requires a crosstalk suppressing cable. The cable shall have a grounded line between each signal line.



For True IDE mode operation using a cable with IDE (ATA) type 40 pin connectors it is recommended that the host sense the cable type using the method described in the ANSI INCITS 361-2002 AT Attachment - 6 standard, to prevent use of Ultra DMA with a 40 conductor cable.

Table: Ultra DMA Termination with Pull-up or Pull down Example

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

Attribute Memory Read Timing Specification

Attribute Memory access time is defined as 300 ns. Detailed timing specs are shown in Table below

Speed Version 300 ns

Item

Symbol

IEEE Symbol

Min ns.

Max ns.

Read Cycle Time tc(R) tAVAV 300 Address Access Time ta(A) tAVQV 300 Card Enable Access Time ta(CE)

tELQV 300

Output Enable Access Time ta(OE)

tGLQV 150

Output Disable Time from CE tdis(CE)

tEHQZ 100

Output Disable Time from OE tdis(OE)

tGHQZ 100

Address Setup Time tsu (A)

tAVGL 30

Output Enable Time from CE ten(CE)

tELQNZ 5

Output Enable Time from OE ten(OE)

tGLQNZ 5

Data Valid from Address Change tv(A) tAXQX 0

Note: All times are in nanoseconds. Dout signifies data provided by the CompactFlash Storage Card to the system. The -CE signal or both the -OE signal and the -WE signal shall be de-asserted between consecutive cycle operations.

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 Configuration Register (Attribute Memory) Write Timing Specification

The Card Configuration write access time is defined as 250 ns. Detailed timing specifications are shown in Table

below.

Table: Configuration Register (Attribute Memory) Write Timing

Speed Version

250 ns

Item Symbol Min ns Max ns

Write Cycle Time tc(W) 250

Write Pulse Width tw(HWE) 150

Address Setup Time tsu(HA) 30

Write Recovery Time trec(HWE) 30

Data Setup Time for WE tsu(HD-HWEH) 80

Data Hold Time th(HD) 30

Note: All times are in nanoseconds. Din signifies data provided by the system to the CompactFlash Storage Card .

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 Common Memory Read Timing Specification

Cycle Time Mode: 250 ns 120 ns 100 ns 80 ns

Item Symbol

IEEE Symbol

Min

ns.

Max

ns.

Min

ns.

Max

ns.

Min

ns.

Max

ns.

Min

ns.

Max ns.

Output Enable Access Time ta(HOE) tGLQV

125

60

50

45

Output Disable Time from HOE tdis(HOE) tGHQZ

100

60

50

45

Address Setup Time tsu(HA) tAVGL 30

15

10

Address Hold Time th(HA) tGHAX 20

15

10

CEx Setup before HOE tsu(CEx) tELGL 5

5

CEx Hold following HOE th(CEx) tGHEH 20

15

10

Wait Delay Falling from HOE tv(IORDY-HOE) tGLWTV

35

na

1

Data Setup for Wait Release tv(IORDY) tQVWTH

0

na

1

Wait Width Time

2

tw(IORDY) tWTLWTH

350

na

1

Notes:1) –WAIT is not supported in this mode.

2) The maximum load on -WAIT is 1 LSTTL with 50 pF (40pF below 120nsec Cycle Time) total load. All times are in nanoseconds. Dout signifies data provided by the CompactFlash Storage Card to the system. The -WAIT signal may be ignored if the -OE cycle to cycle time is greater than the Wait Width time. The Max Wait Width time can be determined from the Card Information Structure. The W ait Width time meets the PCMCIA PC Card specification of 12µs but is intentionally less in this specification.

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

Common Memory Write Timing Specification

Cycle Time Mode: 250 ns 120 ns 100 ns 80 ns

Item Symbol

IEEE Symbol

Min

ns.

Max

ns.

Min

ns.

Max

ns.

Min

ns.

Max

ns.

Min

ns.

Ma x ns.

Data Setup before HWE tsu (HD-HWEH) tDVWH 80

50

40

30

Data Hold following HWE th(HD) tWMDX 30

15

10

HWE Pulse Width tw(HWE) tWLWH 150

70

60

55

Address Setup Time tsu(HA) tAVWL 30

15

10

CEx Setup before HWE tsu(CEx) tELWL 5

5

Write Recovery Time trec(HWE) tWMAX 30

15

Address Hold Time th(HA) tGHAX 20

15

CEx Hold following HWE th(CEx) tGHEH 20

15

10

Wait Delay Falling from HWE tv (IORDY-HWE) tWLWTV

35

na

1

WE High from Wait Release tv(IORDY) tWTHWH 0

0

na

1

Wait Width Time

2

tw (IORDY) tWTLWTH

350

na

1

Notes: 1) –WAIT is not supported in this mode.

2) The maximum load on -WAIT is 1 LSTTL with 50 pF (40pF below 120nsec Cycle Time) total load. All times are in nanoseconds. Din signifies data provided by the system to the CompactFlash Storage Card. The -WAIT signal may be ignored if the -HWE cycle to cycle time is greater than the Wait Width time. The Max Wait Width time can be determined from the Card Information Structure. The Wait Width time meets the PCMCIA PC Card specification of 12µs but is intentionally less in this specification.

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 I/O Input (Read) Timing Specification

Cycle Time Mode: 250 ns 120 ns 100 ns 80 ns

Item Symbol

IEEE

Symbol

Min

ns.

Max

ns.

Min

ns.

Max

ns.

Min

ns.

Max

ns.

Min

ns.

Ma

x

ns.

Data Delay after HIOE td(HIOE) tlGLQV

100

50

45

Data Hold following HIOE th(HIOE) tlGHQX 0

5

HIOE Width Time tw(HIOE) tlGLIGH 165

70

65

55

Address Setup before HIOE tsuA(HIOE) tAVIGL 70

25

15

Address Hold following HIOE thA(HIOE) tlGHAX 20

10

CEx Setup before HIOE tsuCE(HIOE) tELIGL 5

5

CEx Hold following HIOE thCE(HIOE) tlGHEH 20

10

HREG Setup before HIOE tsuREG (HIOE) tRGLIGL 5

5

HREG Hold following HIOE thREG (HIOE) tlGHRGH 0

0

Wait Delay Falling from HIOE2 tdWT(HIOE) tlGLWTL

35

35 35 Na

1

Data Delay from Wait Rising2 td(IORDY) tWTHQV

0

0 0 Na

1

Wait Width Time2 tw(IORDY) tWTLWTH

350

Na

1

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

I/O Output (Write) Timing Specification

Cycle Time Mode: 255 ns 120 ns 100 ns 80 ns

Item

Symbol

IEEE

Symbol

Min

ns.

Max

ns.

Min

ns.

Max ns.

Min

ns.

Max ns.

Min

ns.

Ma x ns.

Data Setup before HIOW tsu(HIOW) tDVIWH 60

20 20 15

Data Hold following HIOW th(HIOW) tlWHDX 30

10 5 5

HIOW Width Time tw(HIOW) tlWLIWH 165 70 65 55

Address Setup before HIOW tsuA(HIOW) tAVIWL 70

25 25 15

Address Hold following HIOW thA(HIOW) tlWHAX 20

20 10 10

CEx Setup before HIOW tsuCE (HIOW) tELIWL 5

5 5 5

CEx Hold following HIOW thCE (HIOW) tlWHEH 20

20 10 10

HREG Setup before HIOW tsuREG (HIOW) tRGLIWL 5

5 5 5

HREG Hold following HIOW thREG (HIOW) tlWHRGH 0

0 0 0

Wait Delay Falling from HIOW2 tdWT(HIOW) tlWLWTL

35

35 35 Na1

HIOW high from W ait high2 tdrHIOW (IORDY) tWTJIWH 0

0 0 Na1

Wait Width Time2 tw(IORDY)

tWTLWT H

350 350 350

Na1

Transcend CompactFlash 400X, CompactFlash TS16G-64GCF400, TS16GCF400, TS64GCF400 Datasheet

Specifications and Main Features

Frequently Asked Questions

User Manual