TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18)
TOSHIBA LED Lamps
TLRF1060(T18), TLSF1060(T18), TLOF1060(T18),
TLYF1060(T18), TLPYF1060(T18), TLGF1060(T18),
TLFGF1060(T18), TLPGF1060(T18)
Panel Circuit Indicator
• Surface-mount devices
• 2.2 (L) × 1.4 (W) × 1.3 (H) mm
• Flat-top type
• InGaAℓP LEDs
• High luminous intensity
• Low drive current, high-intensity light emission
• Colors: red, orange, yellow, green, pure green
• Pb free reflow soldering is possible
• Applications: automotive use, message signboards, backlighting
etc.
• Standard embossed tape packing: T18 (3000/reel)
8-mm tape reel
Color and Material
Unit: mm
JEDEC ―
JEITA ―
Product Name Color Material
TLRF1060 Red
TLSF1060 Red
TLOF1060 Orange
TLYF1060 Yellow
TLPYF1060 Yellow
TLGF1060 Green
TLFGF1060 Green
TLPGF1060 Pure Green
InGaAℓP
TOSHIBA 4-2F1
Weight: 0.01 g (typ.)
1
2006-05-30
TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18)
Maximum Ratings
Product Name
TLRF1060
TLSF1060
TLOF1060
TLYF1060
TLPYF1060
TLGF1060
TLFGF1060
TLPGF1060
(Ta = 25°C)
Forward Current
I
(mA)
F
Please see Note 1
30 15 75 −40~100 −40~100
Note 1: Forward current derating
50
40
(mA)
F
30
20
10
Allowable forward current I
0
0 20 40 60 80 100 120
Ambient temperature Ta (°C)
Electrical Characteristics
Product Name
Min Typ. Max I
TLRF1060 1.7 2.0 2.5
TLSF1060 1.7 2.0 2.5
TLOF1060 1.7 2.0 2.5
TLYF1060 1.7 2.1 2.5
TLPYF1060 1.7 2.1 2.5
TLGF1060 1.7 2.2 2.5
TLFGF1060 1.7 2.2 2.5
TLPGF1060 1.7 2.2 2.5
Unit V mA µA V
(Ta = 25°C)
Forward Voltage VF Reverse Current IR
Reverse Voltage
V
(V)
R
I
– Ta
F
F
20 10 15
Power Dissipation
PD (mW)
Max VR
Operation
Temperature
T
(°C)
opr
Storage
Temperature
T
(°C)
stg
2
2006-05-30
TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18)
Optical Characteristics–1
Product Name
TLRF1060 40 100 320 20 PA / QA / RA / SA
TLSF1060 100 200 500 20 RA / SA / TA
TLOF1060 100 220 500 20 RA / SA / TA
TLYF1060 63 180 320 20 QA / RA / SA
TLPYF1060 40 100 320 20 PA / QA / RA / SA
TLGF1060 40 80 320 20 PA / QA / RA / SA
TLFGF1060 25 50 125 20 NA / PA / QA
TLPGF1060 10 20 50 20 LA / MA / NA
Unit mcd mA
Luminous Intensity IV
Min Typ. Max I
(Ta = 25°C)
Available Iv rank
F
Please see Note 2
Note 2: The specification on the above table is used for Iv classification of LEDs in Toshiba facility.
Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned.
Rank
LA 10 20
MA 16 32
NA 25 50
PA 40 80
QA 63 125
RA 100 200
SA 160 320
TA 250 500
Unit mcd mcd
Luminous Intensity IV
Min Max
Optical Characteristics–2
(Ta = 25°C)
Emission Spectrum
Product Name
TLRF1060 ⎯ 644 ⎯ 18 624 630 638
TLSF1060
TLOF1060 ⎯ 612 ⎯ 15 599 605 613
TLYF1060 ⎯ 590 ⎯ 13 580 587 595
TLPYF1060 ⎯ 583 ⎯ 13 574 580 586
TLGF1060 ⎯ 574 ⎯ 11 565 571 576
TLFGF1060 ⎯ 568 ⎯ 11 565 565 565
TLPGF1060 ⎯ 562 ⎯ 11 555 558 564
Unit nm nm nm mA
Peak Emission
Wavelength λ
Min Typ. Max Typ. Min Typ. Max
⎯
623 ⎯ 17 607 613 621
p
∆λ Dominant Wavelength λ
d
I
F
20
The cautions
• This visible LED lamp also emits some IR light.
If a photodetector is located near the LED lamp, please ensure that it will not be affected by the IR light.
• This product is designed as a general display light source usage, and it has applied the measurement standard
that matched with the sensitivity of human's eyes. Therefore, it is not intended for usage of functional
application (ex. Light source for sensor, optical communication and etc) except general display light source.
3
2006-05-30
TLRF1060
(typ.)
(typ.)
(typ.)
(typ.)
(typ.)
TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18)
100
Ta = 25°C
30
(mA)
F
10
I
– VF
F
1000
Ta = 25°C
300
(mcd)
100
V
30
I
V
– IF
3
Forward current I
1
1.4 1.6 1.8 2.0 2.2 2.4 2.6
Forward voltage VF (V)
10
Luminous intensity I
3
1
1 10 100
3 30
Forward current IF (mA)
10
5
V
3
Relative intensity I
1
0.5
0.3
I
V
– Tc
Wavelength characteristic
1.0
IF = 20 mA
Ta = 25°C
0.8
0.6
0.4
Relative intensity
0.2
0.1
−40
−20 0 20 40 60 80 100
Case temperature Tc (°C)
0
580 600 620 640 660 680 700
Wavelength λ (nm)
Radiation pattern
Ta = 25°C
40°
30°
20°
50°
60°
70°
80°
10°
0°
10°
20°
30°
40°
50°
60°
70°
80°
1.00.80.6 0.4 0.2 0
90° 90°
4
2006-05-30
TLSF1060
I
(typ.)
(typ.)
(typ.)
(typ.)
(typ.)
TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18)
100
Ta = 25°C
30
(mA)
F
10
I
– VF
F
1000
Ta = 25°C
300
(mcd)
100
V
30
I
– IF
V
3
Forward current I
1
1.4 1.6 1.8 2.0 2.2 2.4 2.6
Forward voltage VF (V)
10
Luminous intensity I
3
1
1 10 100
3 30
Forward current IF (mA)
10
5
3
1
0.5
Relative intensity
0.3
I
V
– Tc
1.0
Wavelength characteristic
0.8
0.6
0.4
Relative intensity
0.2
IF = 20 mA
Ta = 25°C
0.1
−40
−20 0 20 40 60 80 100
Case temperature Tc (°C)
0
580 600 620 640 660 680 700
Wavelength λ (nm)
Radiation pattern
Ta = 25°C
40°
30°
20°
50°
60°
70°
80°
10°
0°
10°
20°
30°
40°
50°
60°
70°
80°
90° 90°
1.00.80.6 0.4 0.2 0
5
2006-05-30
TLOF1060
I
(typ.)
(typ.)
(typ.)
(typ.)
(typ.)
TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18)
100
Ta = 25°C
30
(mA)
F
10
I
– VF
F
1000
Ta = 25°C
300
(mcd)
100
V
30
I
V
– IF
3
Forward current I
1
1.4 1.6 1.8 2.0 2.2 2.4 2.6
Forward voltage VF (V)
10
Luminous intensity I
3
1
1 10 100
3 30
Forward current IF (mA)
10
5
3
I
V
– Tc
Wavelength characteristic
1.0
IF = 20 mA
Ta = 25°C
0.8
1
0.5
Relative intensity
0.3
0.6
0.4
Relative intensity
0.2
0.1
−40
−20 0 20 40 60 80 100
Case temperature Tc (°C)
0
540 560 580 600 620 640 660
Wavelength λ (nm)
Radiation pattern
Ta = 25°C
40°
30°
20°
50°
60°
70°
80°
10°
0°
10°
20°
30°
40°
50°
60°
70°
80°
90° 90°
1.00.80.6 0.4 0.2 0
6
2006-05-30
TLYF1060
I
(typ.)
(typ.)
(typ.)
(typ.)
(typ.)
TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18)
100
Ta = 25°C
30
(mA)
F
10
I
– VF
F
1000
Ta = 25°C
300
(mcd)
100
V
30
I
V
– IF
3
Forward current I
1
1.4 1.6 1.8 2.0 2.2 2.4 2.6
Forward voltage VF (V)
10
Luminous intensity I
3
1
1 10 100
3 30
Forward current IF (mA)
10
5
3
1
0.5
Relative intensity
0.3
I
V
– Tc
Wavelength characteristic
1.0
IF = 20 mA
Ta = 25°C
0.8
0.6
0.4
Relative intensity
0.2
0.1
−40
−20 0 20 40 60 80 100
Case temperature Tc (°C)
0
540 560 580 600 620 640 660
Wavelength λ (nm)
Radiation pattern
Ta = 25°C
40°
30°
20°
50°
60°
70°
80°
10°
0°
10°
20°
30°
40°
50°
60°
70°
80°
90° 90°
1.00.80.6 0.4 0.2 0
7
2006-05-30
TLPYF1060
I
(typ.)
(typ.)
(typ.)
(typ.)
(typ.)
TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18)
100
Ta = 25°C
30
(mA)
F
10
I
– VF
F
1000
Ta = 25°C
300
(mcd)
100
V
30
I
V
– IF
3
Forward current I
1
1.4 1.6 1.8 2.0 2.2 2.4 2.6
Forward voltage VF (V)
10
Luminous intensity I
3
1
1 10 100
3 30
Forward current IF (mA)
10
5
3
1
0.5
Relative intensity
0.3
I
V
– Tc
Wavelength characteristic
1.0
IF = 20 mA
Ta = 25°C
0.8
0.6
0.4
Relative intensity
0.2
0.1
−40
−20 0 20 40 60 80 100
Case temperature Tc (°C)
0
540 560 580 600 620 640 660
Wavelength λ (nm)
Radiation pattern
Ta = 25°C
40°
30°
20°
50°
60°
70°
80°
10°
0°
10°
20°
30°
40°
50°
60°
70°
80°
90° 90°
1.00.80.6 0.4 0.2 0
8
2006-05-30
TLGF1060
I
(typ.)
(typ.)
(typ.)
(typ.)
(typ.)
TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18)
100
Ta = 25°C
30
(mA)
F
10
I
– VF
F
1000
Ta = 25°C
300
(mcd)
100
V
30
I
V
– IF
3
Forward current I
1
1.4 1.6 1.8 2.0 2.2 2.4 2.6
Forward voltage VF (V)
10
Luminous intensity I
3
1
1 10 100
3 30
Forward current IF (mA)
10
5
3
1
0.5
Relative intensity
0.3
I
V
– Tc
Wavelength characteristic
1.0
0.8
0.6
IF = 20 mA
Ta = 25°C
0.4
Relative intensity
0.2
0.1
−40
−20 0 20 40 60 80 100
Case temperature Tc (°C)
0
540
620600 580 560
Wavelength λ (nm)
Radiation pattern
Ta = 25°C
40°
30°
20°
50°
60°
70°
80°
10°
0°
10°
20°
30°
40°
50°
60°
70°
80°
90° 90°
1.00.80.6 0.4 0.2 0
9
2006-05-30
TLFGF1060
I
(typ.)
(typ.)
(typ.)
(typ.)
(typ.)
TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18)
100
Ta = 25°C
30
(mA)
F
10
I
F
– VF
1000
Ta = 25°C
300
(mcd)
100
V
30
I
V
– IF
3
Forward current I
1
1.4 1.6 1.8 2.0 2.2 2.4 2.6
Forward voltage VF (V)
10
Luminous intensity I
3
1
1 10 100
3 30
Forward current IF (mA)
10
5
3
1
0.5
Relative intensity
0.3
I
V
– Tc
Wavelength characteristic
1.0
IF = 20 mA
Ta = 25°C
0.8
0.6
0.4
Relative intensity
0.2
0.1
−40
−20 0 20 40 60 80 100
Case temperature Tc (°C)
0
520
600580 560 540
Wavelength λ (nm)
Radiation pattern
Ta = 25°C
40°
30°
20°
50°
60°
70°
80°
10°
0°
10°
20°
30°
40°
50°
60°
70°
80°
90° 90°
1.00.80.6 0.4 0.2 0
10
2006-05-30
TLPGF1060
I
(typ.)
(typ.)
(typ.)
(typ.)
(typ.)
TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18)
100
Ta = 25°C
30
(mA)
F
10
I
– VF
F
100
Ta = 25°C
30
(mcd)
10
V
3
I
V
– IF
3
Forward current I
1
1.4 1.6 1.8 2.0 2.2 2.4 2.6
Forward voltage VF (V)
1
Luminous intensity I
0.3
0.1
1 10 100
3 30
Forward current IF (mA)
10
5
3
1
0.5
Relative intensity
0.3
I
V
– Tc
Wavelength characteristic
1.0
0.8
0.6
IF = 20 mA
Ta = 25°C
0.4
Relative intensity
0.2
0.1
−40
−20 0 20 40 60 80 100
Case temperature Tc (°C)
0
520
600580 560 540
Wavelength λ (nm)
Radiation pattern
Ta = 25°C
40°
30°
20°
50°
60°
70°
80°
10°
0°
10°
20°
30°
40°
50°
60°
70°
80°
90° 90°
1.00.80.6 0.4 0.2 0
11
2006-05-30
TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18)
r
Packaging
These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid
moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air
before soldering and they should therefore be stored under the following conditions:
1. This moisture proof bag may be stored unopened within 12 months at the following conditions.
Temperature: 5°C~30°C
Humidity: 90% (max)
2. After opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of
5°C to 30°C/60% RH or below.
3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to
pink) or the expiration date has passed, the devices should be baked in taping with reel.
After baking, use the baked devices within 72 hours, but perform baking only once.
Baking conditions: 60±5°C, for 12 to 24 hours.
Expiration date: 12 months from sealing date, which is imprinted on the label.
4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.
Furthermore, prevent the devices from being destructed against static electricity for baking of it.
5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not
throw or drop the packed devices.
Mounting Method
Soldering
• Reflow soldering
Temperature profile for Pb soldering (example)
240°C max
10 s max
(*)
(*)
Package surface
temperature (°C)
140~160°C
(*)
4°C/s max
max(*)
60~120 s
4°C/s max
max(*)
(*)
Time (s)
• The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under
the above conditions.
• Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of
opening the package.
• Second reflow soldering
In case of second reflow soldering should be performed within 168 h of the first reflow under the above
conditions.
Storage conditions before the second reflow soldering: 30°C, 60% RH (max)
• Make any necessary soldering corrections manually.
(only once at each soldering point)
Soldering iron : 25 W
Temperature : 300°C or less
Time : within 3 s
• Do not perform wave soldering.
Recommended soldering pattern
0.8 1.2
0.8
Temperature profile for Pb-free soldering (example)
(*)
5 s max
4°C/s max
230°C
(*)
60~120 s
Time (s)
(*)
(*)
max(*)
30~50s max(*)
150~180°C
ature (°C)
4°C/s max
Package surface
tempe
Unit: mm
260°C max
max(*)
1.0
12
2006-05-30
TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18)
Cleaning
When cleaning is required after soldering, Toshiba recommends the following cleaning solvents.
It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the
recommended conditions). In selecting the one for your actual usage, please perform sufficient review
on washing condition, using condition and etc.
ASAHI CLEAN AK-225AES : (made by ASAHI GLASS)
KAO CLEAN TROUGH 750H : (made by KAO)
PINE ALPHA ST-100S : (made by ARAKAWA CHEMICAL)
TOSHIBA TECHNOCARE : (made by GE TOSHIBA SILICONES)
(FRW-17, FRW-1, FRV-100)
Precautions when Mounting
Do not apply force to the plastic part of the LED under high-temperature conditions.
To avoid damaging the LED plastic, do not apply friction using a hard material.
When installing the PCB in a product, ensure that the device does not come into contact with other cmponents.
Tape Specifications
1. Product number format
The type of package used for shipment is denoted by a symbol suffix after the product number. The
method of classification is as below. (this method, however does not apply to products whose electrical
characteristics differ from standard Toshiba specifications)
(1) Tape Type: T18 (4-mm pitch)
(2) Example
TLSF1060 (T18)
2. Tape dimensions
Unit: mm
Symbol Dimension Tolerance Symbol Dimension Tolerance
D 1.5 +0.1/−0 P2 2.0 ±0.05
E 1.75 ±0.1 W 8.0 ±0.2
P0 4.0 ±0.1 P 4.0 ±0.1
t 0.2 ±0.05 A0 1.5 ±0.1
F 3.5 ±0.05 B0 2.5 ±0.1
D1 1.1 ±0.1 K0 1.5 ±0.1
Tape type
Toshiba product No.
D
P0
K
0
P
2
E
t
F
W
B
0
Polarity
A0
P D
1
13
2006-05-30
3. Reel dimensions
φ44
4. Leader and trailer sections of tape
TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18)
Unit: mm
9 ± 0.3
11.4 ± 1.0
+0
−4
2 ± 0.5
180
φ60
φ13
40 mm or more
(Note 1)
40 mm or more
(Note 2)
Leading part: 190 mm (min)
Note1: Empty trailer section
Note2: Empty leader section
14
2006-05-30
5. Packing display
•
(1) Packing quantity
(2) Packing form: Each reel is sealed in an aluminum pack with silica gel.
6. Label format
(1) Example: TLSF1060 (T18)
TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18)
Reel 3,000 pcs
Carton 15,000 pcs
P/N: TOSHIBA
TYPE TLSF1060
ADDC (T18) Q’TY 3,000 pcs
Lot Number Key code for TSB 32C 3000
(RANK SYMBOL)
Use under 5-30degC/60%RH within 168h
SEAL DATE:
[[G]]/RoHS COMPATIBLE DIFFUSED IN *****
*Y3804xxxxxxxxxxxxxxxxx* ASSEMBLED IN *****
(2) Label location
• Reel
Tape feel direction
Label position
• The aluminum package in which the reel is supplied also has the label attached to
center of one side.
Carton
Label position
15
2006-05-30
TL(RF,SF,OF,YF,PYF,GF,FGF,PGF)1060(T18)
RESTRICTIONS ON PRODUCT USE
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break,
cut, crush or dissolve chemically.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
16
2006-05-30
Loading...