The above models are classified as green products (*1), as indicated by the underlined serial
numbers. This Service Manual describes replacement parts for the green products. When
repairing these green product(s), use the part(s) described in this manual and lead-free solder (*2).
DVDHDD
REC
ON / STANDBY
For (*1) and (*2), see the next page.
TOSHIBA CORPORATION 2006
Published in Japan, Sep., 2006 GREEN
Page 2
(*1) GREEN PRODUCT PROCUREMENT
The EC is actively promoting the WEEE & RoHS Directives that define standards for recycling
and reuse of Waste Electrical and Electronic Equipment and for the Restriction of the use of
certain Hazardous Substances. From July 1, 2006, the RoHS Directive will prohibit any
marketing of new products containing the restricted substances.
Increasing attention is given to issues related to the global environmental. Toshiba Corporation
recognizes environmental protection as a key management tasks, and is doing its utmost to
enhance and improve the quality and scope of its environmental activities. In line with this,
Toshiba proactively promotes Green Procurement, and seeks to purchase and use products,
parts and materials that have low environmental impacts.
Green procurement of parts is not only confined to manufacture. The same green parts used in
manufacture must also be used as replacement parts.
(*2) LEAD-FREE SOLDER
This product is manufactured using lead-free solder as a part of a movement within the consumer
products industry at large to be environmentally responsible. Lead-free solder must be used in the
servicing and repair of this product.
WARNING
This product is manufactured using lead free solder.
DO NOT USE LEAD BASED SOLDER TO REPAIR THIS PRODUCT !
The melting temperature of lead-free solder is higher than that of leaded solder by 86°F to 104°F
(30°C to 40°C). Use of a soldering iron designed for lead-based solders to repair product made
with lead-free solder may result in damage to the component and or BOARD being soldered.
Great care should be made to ensure high-quality soldering when servicing this product —
especially when soldering large components, through-hole pins, and on BOARDs — as the level
of heat required to melt lead-free solder is high.
Page 3
MAIN SECTION
HDD & DVD VIDEO RECORDER
RD-XS25SE/RD-XS25SB/RD-XS25SF
Main Section
I Specifications
I Adjustment Procedures
I Schematic Diagrams
I BOARD’s
I Exploded Views
I Parts List
Digital audio outputOne Coaxial pin jack
Output level500mVp-p (75 Ω)
Note
The specifications and design of this unit are subject to change without notice.
Y (Iuminance) 1Vp-p (75 Ω)
C (colour) 300mVp-p (75 Ω)
Ω
Y (Iuminance) 1Vp-p (75 Ω)
C (colour) 300mVp-p (75 Ω)
680
Ω)
1-1-1E2B10SP
Page 5
LASER BEAM SAFETY PRECAUTIONS
This DVD player uses a pickup that emits a laser beam.
Do not look directly at the laser beam coming
from the pickup or allow it to strike against your
skin.
The laser beam is emitted from the location shown in the figure. When checking the laser diode, be sure to keep
your eyes at least 30 cm away from the pickup lens when the diode is turned on. Do not look directly at the laser
beam.
CAUTION: Use of controls and adjustments, or doing procedures other than those specified herein, may result in
hazardous radiation exposure.
Drive Mechanism Assembly
Laser Beam Radiation
Laser Pickup
Turntable
Location: Inside Top of DVD mechanism.
1-2-1R3PLSP
Page 6
IMPORTANT SAFETY PRECAUTIONS
Product Safety Notice
Some electrical and mechanical parts have special
safety-related characteristics which are often not evident from visual inspection, nor can the protection
they give necessarily be obtained by replacing them
with components rated for higher voltage, wattage,
etc. Parts that have special safety characteristics are
identified by a ! on schematics and in parts lists. Use
of a substitute replacement that does not have the
same safety characteristics as the recommended
replacement part might create shock, fire, and/or other
hazards. The Product’s Safety is under review continuously and new instructions are issued whenever
appropriate. Prior to shipment from the factory, our
products are carefully inspected to confirm with the
recognized product safety and electrical codes of the
countries in which they are to be sold. However, in
order to maintain such compliance, it is equally important to implement the following precautions when a set
is being serviced.
Precautions during Servicing
A. Parts identified by the ! symbol are critical for
safety. Replace only with part number specified.
B. In addition to safety, other parts and assemblies
are specified for conformance with regulations
applying to spurious radiation. These must also be
replaced only with specified replacements.
Examples: RF converters, RF cables, noise blocking capacitors, and noise blocking filters, etc.
C. Use specified internal wiring. Note especially:
1)Wires covered with PVC tubing
2)Double insulated wires
3)High voltage leads
D. Use specified insulating materials for hazardous
live parts. Note especially:
1)Insulation tape
2)PVC tubing
3)Spacers
4)Insulators for transistors
E. When replacing AC primary side components
(transformers, power cord, etc.), wrap ends of
wires securely about the terminals before soldering.
F. Observe that the wires do not contact heat produc-
ing parts (heatsinks, oxide metal film resistors, fusible resistors, etc.).
G. Check that replaced wires do not contact sharp
edges or pointed parts.
H. When a power cord has been replaced, check that
5 - 6 kg of force in any direction will not loosen it.
I. Also check areas surrounding repaired locations.
J. Be careful that foreign objects (screws, solder
droplets, etc.) do not remain inside the set.
K. Crimp type wire connector
The power transformer uses crimp type connectors
which connect the power cord and the primary side
of the transformer. When replacing the transformer,
follow these steps carefully and precisely to prevent shock hazards.
Replacement procedure
1)Remove the old connector by cutting the wires at a
point close to the connector.
Important: Do not re-use a connector. (Discard it.)
2)Strip about 15 mm of the insulation from the ends
of the wires. If the wires are stranded, twist the
strands to avoid frayed conductors.
3)Align the lengths of the wires to be connected.
Insert the wires fully into the connector.
4)Use a crimping tool to crimp the metal sleeve at its
center. Be sure to crimp fully to the complete closure of the tool.
L. When connecting or disconnecting the internal
connectors, first, disconnect the AC plug from the
AC outlet.
1-3-1DVD_SFNP
Page 7
Safety Check after Servicing
Examine the area surrounding the repaired location
for damage or deterioration. Observe that screws,
parts, and wires have been returned to their original
positions. Afterwards, do the following tests and confirm the specified values to verify compliance with
safety standards.
1. Clearance Distance
When replacing primary circuit components, confirm
specified clearance distance (d) and (d’) between soldered terminals, and between terminals and surrounding metallic parts. (See Fig. 1)
Table 1 : Ratings for selected area
AC Line VoltageClearance Distance (d), (d’)
220 to 240 V
Note: This table is unofficial and for reference only.
Be sure to confirm the precise values.
2. Leakage Current Test
≥3 mm(d)
≥6 mm(d’)
Chassis or Secondary Conductor
Primary Circuit
d'd
Fig. 1
Exposed Accessible Part
Confirm the specified (or lower) leakage current
between B (earth ground, power cord plug prongs)
and externally exposed accessible parts (RF terminals, antenna terminals, video and audio input and
output terminals, microphone jacks, earphone jacks,
etc.) is lower than or equal to the specified value in the
table below.
Measuring Method (Power ON) :
Insert load Z between B (earth ground, power cord
plug prongs) and exposed accessible parts. Use an
AC voltmeter to measure across the terminals of load
Z. See Fig. 2 and the following table.
Table 2: Leakage current ratings for selected areas
AC Line VoltageLoad ZLeakage Current (i)
220 to 240 V
2kΩ RES.
Connected in
parallel
50kΩ RES.
Connected in
parallel
i≤0.7mA AC Peak
i≤2mA DC
i≤0.7mA AC Peak
i≤2mA DC
Z
One side of
B
Power Cord Plug Prongs
One side of power cord plug
AC Voltmeter
(High Impedance)
prongs (B) to:
RF or
Antenna terminals
A/V Input, Output
Fig. 2
Note: This table is unofficial and for reference only. Be sure to confirm the precise values.
1-3-2DVD_SFNP
Page 8
STANDARD NOTES FOR SERVICING
NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.
Circuit Board Indications
1. The output pin of the 3 pin Regulator ICs is
indicated as shown.
Top View
Out
2. For other ICs, pin 1 and every fifth pin are
indicated as shown.
Pin 1
3. The 1st pin of every male connector is indicated as
shown.
Pin 1
Input
In
Bottom View
5
10
Pb (Lead) Free Solder
When soldering, be sure to use the Pb free solder.
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:
1. Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
Fig. S-1-1
Instructions for Connectors
1. When you connect or disconnect the FFC (Flexible
Foil Connector) cable, be sure to first disconnect
the AC cord.
2. FFC (Flexible Foil Connector) cable should be
inserted parallel into the connector, not at an
angle.
FFC Cable
Connector
BOARD
* Be careful to avoid a short circuit.
2. Remove the flat pack-IC with tweezers while
applying the hot air.
3. Bottom of the flat pack-IC is fixed with glue to the
BOARD; when removing entire flat pack-IC, first
apply soldering iron to center of the flat pack-IC
and heat up. Then remove (glue will be melted).
(Fig. S-1-6)
4. Release the flat pack-IC from the BOARD using
tweezers. (Fig. S-1-6)
CAUTION:
1. The Flat Pack-IC shape may differ by models. Use
an appropriate hot-air flat pack-IC desoldering
machine, whose shape matches that of the Flat
Pack-IC.
2. Do not supply hot air to the chip parts around the
flat pack-IC for over 6 seconds because damage
to the chip parts may occur. Put masking tape
around the flat pack-IC to protect other parts from
damage. (Fig. S-1-2)
1-4-1DVDN_SN
Page 9
3. The flat pack-IC on the BOARD is affixed with
glue, so be careful not to break or damage the foil
of each pin or the solder lands under the IC when
removing it.
With Soldering Iron:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
BOARD
Masking
Tape
Tweezers
Hot-air
Flat Pack-IC
Desoldering
Machine
Flat Pack-IC
Fig. S-1-2
Flat Pack-IC
Desoldering Braid
Soldering Iron
Fig. S-1-3
2. Lift each lead of the flat pack-IC upward one by
one, using a sharp pin or wire to which solder will
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Sharp
Pin
Fine Tip
Soldering Iron
3. Bottom of the flat pack-IC is fixed with glue to the
BOARD; when removing entire flat pack-IC, first
apply soldering iron to center of the flat pack-IC
and heat up. Then remove (glue will be melted).
(Fig. S-1-6)
4. Release the flat pack-IC from the BOARD using
tweezers. (Fig. S-1-6)
Fig. S-1-4
1-4-2DVDN_SN
Page 10
With Iron Wire:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
2. Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
3. While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solder
melts so as to lift the IC leads from the BOARD
contact pads as shown in Fig. S-1-5.
4. Bottom of the flat pack-IC is fixed with glue to the
BOARD; when removing entire flat pack-IC, first
apply soldering iron to center of the flat pack-IC
and heat up. Then remove (glue will be melted).
(Fig. S-1-6)
5. Release the flat pack-IC from the BOARD using
tweezers. (Fig. S-1-6)
Note: When using a soldering iron, care must be
taken to ensure that the flat pack-IC is not
being held by glue. When the flat pack-IC is
removed from the BOARD, handle it gently
because it may be damaged if force is applied.
Hot Air Blower
2. Installation
1. Using desoldering braid, remove the solder from
the foil of each pin of the flat pack-IC on the
BOARD so you can install a replacement flat packIC more easily.
2. The “●” mark on the flat pack-IC indicates pin 1.
(See Fig. S-1-7.) Be sure this mark matches the 1
on the BOARD when positioning for installation.
Then presolder the four corners of the flat pack-IC.
(See Fig. S-1-8.)
3. Solder all pins of the flat pack-IC. Be sure that
none of the pins have solder bridges.
Example :
Pin 1 of the Flat Pack-IC
is indicated by a " " mark.
Fig. S-1-7
To Solid
Mounting Point
BOARD
Tweezers
Iron Wire
Soldering Iron
Fig. S-1-5
Fine Tip
Soldering Iron
Flat Pack-IC
or
Presolder
Flat Pack-IC
BOARD
Fig. S-1-8
Fig. S-1-6
1-4-3DVDN_SN
Page 11
Instructions for Handling Semiconductors
Electrostatic breakdown of the semi-conductors may
occur due to a potential difference caused by
electrostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a grounding band (1 MΩ) that is
properly grounded to remove any static electricity that
may be charged on the body.
2. Ground for Workbench
Be sure to place a conductive sheet or copper plate
with proper grounding (1 MΩ) on the workbench or
other surface, where the semi-conductors are to be
placed. Because the static electricity charge on
clothing will not escape through the body grounding
band, be careful to avoid contacting semi-conductors
with your clothing.
<Incorrect>
<Correct>
1MΩ
BOARD
Grounding Band
1MΩ
BOARD
Conductive Sheet or
Copper Plate
1-4-4DVDN_SN
Page 12
HANDLING PRECAUTIONS FOR HDD
CAUTION:
1. SHOCK
a. Exposing HDD to shock may be the biggest
damaging factor. Please note that HDD is easily
damaged even if dropped from any height. Be sure
to place HDD on a shock-absorbent mat. Also, be
careful when transporting HDD.
b. Be careful not to subject HDD to any shock when
tightening screws for HDD replacement.
(Tighten screws manually, not with an electric
driver.)
2. MOISTURE
a. Moisture may also be a damaging factor. HDD is
semiclosed style. Sudden changes in ambient
temperature may cause moisture to form. Monitor
temperature and do not allow moisture to form on
the media surface. Also, when opening HDD
package, do so only after package is at ambient
temperature.
b. After replacing HDD, leave it to reach room
temperature (about 2 hours) for preventing dew
internal condensation, and then work necessary
task such as operation check.
4. OTHERS
a. Be careful so as not to do the followings.
Otherwise, HDD might be damaged.
- DO NOT disassemble HDD.
- When handling HDD, be sure to hold both sides
securely.
b. HDD should be stored, packed in the protective
bag, in suitable surroundings (i.e., no extreme
changes in temperature to avoid condensation).
c. When transporting HDD, be sure to use the
exclusive packing case (the replacement HDD
carton).
d. Do not stack HDDs.
e. Do not place vertically because HDD is unstable
and easy to fall.
3. STATIC ELECTRICITY
a. After removing HDD or taking replacement HDD
out of the protective bag (the replacement HDD is
packed in a protective bag), place HDD on a
conductive surface. A grounding band should be
worn when handling.
Grounding Band
Both the conductive surface and grounding band
should be grounded.
b. Make sure that HDD is placed on main unit
completely and then let go of it, when assembling.
c. Do not put HDD on a packing bag. (for preventing
electrostatic damage)
1-5-1DHD_SN
Page 13
CABINET DISASSEMBLY INSTRUCTIONS
NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.
1. Disassembly Flowchart
This flowchart indicates the disassembly steps to gain
access to item(s) to be serviced. When reassembling,
follow the steps in reverse order. Bend, route, and
dress the cables as they were originally.
(1): Identification (location) No. of parts in the figures
(2): Name of the part
(3): Figure Number for reference
(4): Identification of parts to be removed, unhooked,
unlocked, released, unplugged, unclamped, or
desoldered.
P=Spring, L=Locking Tab, S=Screw,
CN=Connector
*=Unhook, Unlock, Release, Unplug, or Desolder
e.g. 6(S-1) = six Screws (S-1),
5(L-1) = five Locking Tabs (L-1)
(5): Refer to “Reference Notes.”
↓
[8]
HDD
Bracket
D5 4(S-5)---
1-6-1E2B10DC
Page 14
Reference Notes
1. Locking Tabs (L-1) ,(L-2) and (L-3) are fragile. Be
careful not to break them.
1-1. Release five Locking Tabs (L-1).
1-2. Release three Locking Tabs (L-2) and
remove the Front Assembly.
1-3. Release three Locking Tabs (L-3).
2. Do not replace the DVD Mechanism or the DVD/
HDD MAIN BOARD Assembly separately, when
replacing the DVD Mechanism & DVD/HDD MAIN
BOARD Assembly. Order the new DVD
Mechanism & DVD/HDD MAIN BOARD Assembly.
2-1. Whenever you have replaced the HDD unit,
initialize the HDD unit. To initialize the HDD
unit, perform the following.To put the HDD &
DVD into the HDD mode, press the [HDD]
button on the remote control unit.
2-2. To put the HDD & DVD into the self-check
mode, after pressing [VARIABLE SKIP]
button, press the [3], [6], and [9] buttons on
the remote control in that order within three
seconds.
2-3. Press [ENTER] button. The HDD & DVD is
initialized and the power is turned off
automatically after two seconds.
(L-1)
(L-2)
(L-1)
(L-1)
CN1641
[2] Front Unit
Fig. D2
[4] BOARD
CONTROL
[1] Cover Top
(S-1)
(S-1)
(S-1)
Fig. D1
[3] Front Assembly
Attachment
Holder
(S-4)
CN1015
(S-3)
(L-3)
Fig. D3
[6] DVD Mechanism
& DVD/HDD MAIN
BOARD Assembly
CN651
CN101
CN701
[5] HDD
Assembly
(S-2)
Locking Card Spacer
Fig. D4
1-6-2E2B10DC
Page 15
[7] BOARD ATA
HDD Plate Earth
CN3001
[12] Cover Fan
[14] Panel Rear
(S-9)
Earth Fan
(S-6)
(S-5)
[9] HDD
[8] HDD Bracket
[10] Panel Rear Unit
CN1601
Fig. D5
(S-8)
(S-7)
(S-8)
CN1802
[11] BOARD
JACK
[15] BOARD
POWER SUPPLY
(S-10)
[16] Power
Holder
CN1151
[13] DC Fan Motor
Fig. D7
(S-10)
(S-11)
Lead
with
blue
stripe
Desolder
Fig. D6
[17] BOARD
POWER
[18] Front
Bracket R
(S-12)
Fig. D8
1-6-3E2B10DC
Page 16
HOW TO SELF-CHECK AND INITIALIZE THE HDD & DVD
1. Turn on the HDD & DVD.
2. To put the HDD & DVD into the HDD mode, press [HDD] on the remote control unit.
3. To put the HDD & DVD into the self-check mode, after pressing [VARIABLE SKIP] button, press the [3], [6],
and [9] buttons on the remote control in that order within three seconds.
Fig. a appears on the screen and all LEDs light.
"
" differs depending on the models.
*******
Self-Analysys and Report
*1
*2
*3
DVD CONNECT STATUS :
HDD CONNECT STATUS :
HDD POWER ON HOURS :
*4
*5
*6
BE Ver. :
FE Ver. :
Sub Micon Ver. :
T2*******Q2J
R20_0**_***h
NFQ2***T1-3N11
Fig. a: Self-Check Mode Screen
Table 1: Description of Fig. a
INDICATIONDESCRIPTION
DVD CONNECT STATUS (*1)Connecting Condition of DVD(F/E)
HDD CONNECT STATUS (*2)Connecting Condition of HDD
Value of HDD power on hours obtained from S.M.A.R.T. command. (If not obtainable,
HDD POWER ON HOURS (*3)
value of HDD power on hours is “0”.)
Value in parentheses is the factory setting value. (If no setting, the value is “0”.)
BE Ver. (*4)B/E version
FE Ver. (*5)F/E version
Sub Micon Ver. (*6)Sub micro controller version
4. Upon the self-check completion, Fig. b appears on the screen.
"
" differs depending on the models.
*******
Self-Analysys and Report
*7
*8
DVD CONNECT STATUS : OK
HDD CONNECT STATUS : OK
HDD POWER ON HOURS : 100(40)
T2*******Q2J
R20_0**_***h
NFQ2***T1-3N11
ENTER
POWER
*10
BE Ver. :
FE Ver. :
Sub Micon Ver. :
*9
FACTORY DEFAULT :
POWER OFF :
Fig. b: Screen of Finishing Self-Check Mode
1-7-1E2B10INT
Page 17
Table 2: Indication of DVD self-check (*7)
INDICATIONDESCRIPTION
OKConnection of DVD is normal.
NOT FOUNDDVD drive cannot be found.
CABLE ERROR
FFC cable (connecting to CN401) between the DVD drive and the DVD/HDD MAIN BOARD
is not connected correctly.
Table 3: Indication of HDD self-check (*8)
INDICATIONDESCRIPTION
OKConnection of HDD is normal.
NOT FOUNDHDD drive cannot be found.
CABLE ERRORFFC cable between the BOARD ATA and the HDD drive is not connected correctly.
Table 4: Available button in self-check mode
BUTTONDESCRIPTION
ENTER (*9)Initialize (only when the self-check mode is complete)
ON / STANDBY (*10)Turn the power off (when the self-check mode is complete)
OTHERNot available
5. When the self-check mode is complete, press [] button to turn the power off.
When initializing the HDD & DVD, press [ENTER] button. Fig. c appears on the screen. After two seconds, the
power is turned off automatically.
"
" differs depending on the models.
*******
Self-Analysys and Report
DVD CONNECT STATUS : OK
HDD CONNECT STATUS : OK
HDD POWER ON HOURS : 100(40)
BE Ver. :
FE Ver. :
Sub Micon Ver. :
FACTORY DEFAULT :*11WRITING
T2*******Q2J
R20_0**_***h
NFQ2***T1-3N11
Fig. c: Initialize Mode Screen
Table 5: Description of *11 in Fig. c
INDICATIONDESCRIPTION
ENTERInitialization preparation is complete.
WRITINGInitializing
OKInitializing is finished normally.
NGInitializing is not finished normally.
NOTE: When initializing, “Current Clock”, “Setup Changing Item”, “Channel Setup”, “Area Setup”, “Program” and
“HDD Contents” are initialized.
1-7-2E2B10INT
Page 18
FIRMWARE RENEWAL MODE
1. Update Contents
ItemStatus
1B/EUpdate B/E FIRMWARE
2F/EUpdate F/E FIRMWARE
2. Update
1. Turn the power on and remove the disc in the tray.
2. To switch the HDD & DVD into the HDD mode,
press [HDD] on the remote control unit.
3. To put the HDD & DVD into version up mode,
press [VARIABLE SKIP] and [6], [5], [4] buttons on
the remote control unit in that order within 3
seconds. The tray will open automatically.
Fig. a appears on the TV screen and Fig. b
appears on the VFD.
*FIRMWARE version will differ depending on the
model. Fig. a is an example.
DISC UPDATE
4. Load the update disc.
The TV screen will display Fig. c.
- If the update disc contains only a single file, the
update will initiate automatically when the disc is
inserted.
*FIRMWARE version will differ depending on the
model. Fig. c is an example.
DISC UPDATE
H3T00141B2C.MOT
<DIR> BE
<DIR> FE
Fig. c: Update Disc TV Screen
Effective FIRMWARE update files will have the file
extensions shown below.
File extensionStatus
MOTF/E FIRMWARE file
Please Insert F/W Disc
Fig. a: Update Mode TV Screen
Fig. b: VFD Display in Update Mode
5. Select the desired FIRMWARE to be updated with
the arrow button and press the [ENTER] or [PLAY]
button.
The tray will open automatically; close the tray by
pressing [OPEN/CLOSE] button or by hand.
6. Fig. d appears on the TV screen and Fig. e
appears on the VFD, and the update will start.
*FIRMWARE version will differ depending on the
model. Fig. d is an example.
DISC UPDATE
*1
TARGET: B/E
*2
STATUS: EXECUTING
DISC UPDATING
Fig. d: TV Display during update
The status displayed in *1 is as shown below.
DisplayStatus
B/EFIRMWARE B/E
F/EFIRMWARE F/E
UNKNOWNNot FIRMWARE B/E or F/E
1-8-1E2B10FW
Page 19
The status displayed in *2 is as shown below.
DisplayStatus
EXECUTING
Loading F/W from Update Disc or
writing to Flash memory
ERRORError during Flash memory writing
FILE ERRORCheck SAM error in F/W file
READ ERROR Error during F/W file reading
3. How to Verify the Firmware
Version
1. Turn the power on and remove the disc in the tray.
2. To switch the HDD & DVD into HDD mode, press
[HDD] on the remote control unit.
3. To put the HDD & DVD into version display mode,
press [VARIABLE SKIP] and [1], [2], [3] buttons on
the remote control unit in that order within 3
seconds. Fig. i appears on the TV screen.
******* part will differ depending on the model.
Fig. i is an example.
Fig. e: VFD Display during update
When the TV screen displays "Firmware
Updating... XX% Complete," the VFD will indicate
"XX"%.
7. When update is complete, the unit will shut off
automatically.
8. If an error occured during updating, the TV screen
will display Fig. f.
*FIRMWARE version will differ depending on the
model. Fig. f is an example.
DISC UPDATE
TARGET: B/E
STATUS: ERROR
PLEASE PUSH POWER BUTTON
Fig. f: TV Display when completing update with error
Fig. h: VFD Display when completing update with error
In this case, all button operations will be invalid
except [] button.
9. Press [] button to turn the power off and press
[] button again to turn the power back on and
finish updating.
VERSION INFORMATION
Model Name :
BE Ver. :
FE Ver :
Sub Micon Ver. :
REGION:
CPRM KEY NO:
HDD MODEL:
DivX Ver.:
Effective buttons in this mode are the following...
ButtonsOperations
POWER
SETUP
TOP MENU
Power off to release from this
mode.
Version display disappears and
SETUP screen appears.
Version display disappears and
TOP MENU screen appears.
Version display disappears and
TIMER PROG.
TIMER PROGRAMMING screen
appears.
DUBBING
MENU
Others
Version display disappears and
DUBBING screen appears.
While displaying version and
normal operation.
1-8-2E2B10FW
Page 20
FLOW CHART NO.1
The power cannot be turned on.
TROUBLESHOOTING
NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.
Is the fuse normal?
Ye s
Is normal state restored when once unplugged
power cord is plugged again after several seconds.
Ye s
Is the EV+5V line voltage normal?
Ye s
Check each rectifying circuit of secondary circuit
and service it if defective.
FLOW CHART NO.2
The fuse blows out.
Check the presence that the primary component
is leaking or shorted and service it if defective.
After servicing, replace the fuse.
FLOW CHART NO.3
When the output voltage fluctuates.
No
No
No
See FLOW CHART No.2 <The fuse blows out.>
Check for lead or short-circuiting of primary
circuit component and service it if defective.
(Q2101,Q2102,T2001,D2104)
Check the presence that the rectifying diode or circuit
is shorted in each rectifying circuit of secondary side
and service it if defective.
Does the secondary side photo coupler circuit
operate normally?
Ye s
Check the circuit and service it if defective.
(IC2101, D2113, D2110)
FLOW CHART NO.4
When buzz sound can be heard in the vicinity of power circuit.
Check if there is short circuit on the rectifying diode and the circuit in each rectifying circuit of secondary side and
service it if defective. (D2201,D2202,D2203,D2204,D2205,D2206,D2207,D2208,D2209,IC1151,IC1152,IC1025,
IC1002,Q1015,Q1508,Q1160,Q1163,Q2203,Q1154,Q1159)
FLOW CHART NO.5
-FL is not outputted.
Is the supply voltage of -30V fed to the anode of
D2201?
Ye s
Check for load circuit short-circuiting or leak, and
service it if defective.
No
No
Check the circuit and service it if defective.
(IC2101, IC2201,D2213)
Check D2201 and their periphery, and service it if
defective.
1-9-1E2B10TR
Page 21
FLOW CHART NO.6
HDD+12V is not outputted.
Is 14V voltage supplied to the collector of Q2203?
No
Ye s
Is the "H" pulse inputted to
the base of Q1016?
No
Ye s
Check Q2221,IC2204,D2225 and their periphery,
and service it if defective.
FLOW CHART NO.7
P-ON+10V is not outputted. (HDD+12V is outputted normally.)
Is 11V voltage supplied to the base of Q1160?
No
Ye s
Replace Q1160.
FLOW CHART NO.8
EV +10.5V is not outputted.
Is HDD+12V outputted normally?
No
Ye s
Replace Q1163.
Check D2204, D2205, D2212, C2204 and their
periphery, and service it if defective.
Check the line between the base of Q1016 and
Pin (77) of IC1501,and service it if defective.
Check D1162 and their periphery, and service
it if defective.
See FLOW CHART No.6
<HDD+12V is not outputted.>
FLOW CHART NO.9
AL+9V is not outputted.
Is 12V voltage supplied to Pin (3) of IC1002?
Ye s
Replace IC1002.
FLOW CHART NO.10
AL+5V(1) is not outputted.
Check D2206,D2207,D2213,C2205,C2216 and
their periphery, and service it if defective.
FLOW CHART NO.11
AL+5V is not outputted. (AL+9V is outputted normally.)
Is 7V voltage supplied to the
collector
of Q1508?
Ye s
Is 5.6V voltage supplied to the base of Q1508?
Ye s
Replace Q1508.
No
No
No
Check D1170, D1171, D2205, D2212, C2204
and their periphery, and service it if defective.
Check D1172, D1173 and their periphery, and
service it if defective.
Check D1508 and their periphery, and service it if
defective.
1-9-2E2B10TR
Page 22
FLOW CHART NO.12
P-ON+5V is not outputted. (P-ON+10V is outputted normally.)
Is 5V voltage supplied to the
Is the "H" pulse inputted to
Replace Q1154.
FLOW CHART NO.13
SYS +5V is not outputted.
Is 12V voltage inputted to Pin (3) of IC1025?
Replace IC1025.
FLOW CHART NO.14
EV+32V is not outputted.
Is the supply voltage 44V fed the cathode of D2202?
Check D1701 and their periphery and service it
if defective.
FLOW CHART NO.15
AUDIO +5V is not outputted. (P-ON+10V is outputted normally.)
collector
Ye s
the base of Q1154?
Ye s
Ye s
Ye s
of Q1154?
No
No
No
No
Check D2206, D2207, D2213, C2205, C2216 and
their periphery, and service it if defective.
Check R1162, R1166 and their periphery, and
service it if defective.
Check D1027, D2204, D2205, D2212, C2204 and
their periphery, and service it if defective.
Check D2202, C2202 and their periphery, and
service it if defective.
Is 6V voltage supplied to the base of Q1163?
Ye s
Replace Q1163.
FLOW CHART NO.16
EV+3.3V is not outputted. (SYS+5V is outputted normally.)
Is the voltage of approximately 4V supplied to
the base of Q1159?
Ye s
Replace Q1159.
FLOW CHART NO.17
P-ON+2.5V is not outputted.
Is 5V voltage supplied to Pin(1) of IC1151?
Ye s
Replace IC1151.
FLOW CHART NO.18
P-ON+3.3V is not outputted.
Is 5V voltage supplied to Pin(1) of IC1152?
Ye s
Replace IC1152.
No
No
No
No
Check D1163, C1168 and their periphery, and
service it if defective.
Check IC1153 and their periphery, and service it if
defective.
Check D2209, C2217 and their periphery, and
service it if defective.
Check D2209, C2217 and their
periphery, and service it if defective.
1-9-3E2B10TR
Page 23
FLOW CHART NO.19
VI +1.2V is not outputted.
Check D2203, C2203 and their periphery, and
service it if defective.
FLOW CHART NO.20
The fluorescent display tube does not light up.
Is 5V voltage supplied to Pin(6, 24) of IC1503?
Ye s
Is approximately -23V to -28V voltage supplied to
Pin(15) of IC1503?
Ye s
Is there approximately 500kHz oscillation to
Pin(26) of IC1503?
Ye s
Are the filament voltage applied between (1)
and (24) of the fluorescent display tube?
Also negative voltage applied between these pins
and GND?
Ye s
Replace the fluorescent display tube.
FLOW CHART NO.21
The key operation is not functioning.
Are the contact point and the installation state of
the key switches normal?
Ye s
Is the control voltage normally inputted into
Pin(82, 83) of IC1501?
Ye s
Replace IC1501 or DVD MECHANISM & DVD
MAIN BOARD ASSEMBLY.
No
No
No
No
No
No
Check the SYS+5V line and service it if defective.
Check the -FL line and service it if defective.
Check R1560, IC1503 and their periphery, and
service it if defective.
Check the power circuit, D2208, D2215, C2207,
C2208 and their periphery, and service it if
defective.
Re-install some key switches correctly or
replace some key switches.
Check the key switches and their periphery, and
service it if defective.
KEYTerminal voltage of IC1501-82,83-1
2.39
1.98
1.27
0.92
0.51
(V)
IC1501-82
REC
CH UP
REC
SPEED
CH
DOWN
POWER
IC1501-83
----------
REW
FWD
STOP
PLAY
POWER
KEY-2
1-9-4E2B10TR
Page 24
FLOW CHART NO.22
No operation is possible from the remote control unit. (
Operation is possible from the unit.)
Is 5V voltage supplied to the Pin(3) terminal of
the RM1501 (remote control receiver)?
Ye s
Is the "L" pulse sent out from Pin(1) terminal of
the RM1501 (remote control receiver) when the
remote control unit is activated?
Ye s
Is the "L" pulse signal supplied to the Pin(3) of
IC1501?
Ye s
Replace IC1501 or DVD MECHANISM & DVD
MAIN BOARD ASSEMBLY.
FLOW CHART NO.23
The disc tray cannot be opened and closed. (It can be done using the remote control unit.)
Is the normal control voltage inputted to Pin(83) of
IC1501?
operation is not functioning.>
Replace the DVD MECHANISM & DVD MAIN
BOARD ASSEMBLY.
Refer to "FLOW CHART NO.21" <The key
Ye s
No
No
No
No
Check SYS+5V line and service it if defective.
Replace the RM1501 (remote control receiver).
Or replace remote control unit.
Check the line between the RM1501 (remote
control receiver) and the Pin(3) of IC1501, and
service it if defective.
Replace the "OPEN/CLOSE" button (SW1643).
FLOW CHART NO.24
[No Disc] indicated.
Both functions of picture and sound do not operate normally.
Replace the DVD MECHANISM & DVD MAIN
BOARD ASSEMBLY.
FLOW CHART NO.25
VIDEO E-E does not appear normally.
Are the video signals inputted to each pin of
IC1201?
Is 5V voltage supplied to Pin(63) of IC1201?
Is 9V voltage supplied to Pin(75) of IC1201?
Ye sN o
Replace IC1201.
Check the AL+5V(2) , AL+9V
line and service it if defective.
Are the audio signals outputted to the specific
output terminal?
Are the audio signals outputted to the audio
terminal (JK1206)?
Are the audio signals outputted to the audio
terminal (JK2001)?
Are the audio signals outputted to the audio
terminal (JK1801)?
Check the periphery between Pin(73,74) of IC1201
No
No
No
and the audio terminal (JK1206), and service it if
defective.
Check the periphery between Pin(71,72) of IC1201
and the audio terminal (JK2001), and service it if
defective.
Check the periphery between Pin(67,68) of IC1201
and the audio terminal (JK1801), and service it if
defective.
1-9-10E2B10TR
Page 30
FUNCTION INDICATOR SYMBOLS
< DVD/HDD >
Note: If an error occurs, a message with the error number appears on the screen.
Recording Error
02-50
Error message
Error No.
MessageError No. Error DescriptionError Example
Disc error
Recording
error
System error
04-50
04-51
03-50
03-52Loader error
03-53Poor media
03-54
03-55Writing error (video)
03-56General error
03-57Device error
03-60Unrecordable disc
02-50
02-51Disc protection failure
02-52Format failure
02-53Abnormal loaderThis code is output when an appropriate DVD drive is not connected.
02-54
02-57Fan lock
02-58F/E hang-up
02-59HDD hang-up
Renewal error at
ejecting disc
Disc includes still
picture
Recording error
caused by media
error
Control information
error and control data
error
Erasing error (all
titles)
Abnormal HDD
mount
This code is output when there is a control information writing failure
due to tray being open during writing or disc loading.
This code is output upon attempt to write data (finalizing disc protect
data, etc.) on a disc including a still picture.
This code is output when recording error caused by media error
occurs, e.g.,stopping recording during attempting to record on a
scratched disc.
This code is output when tray open/close error occurs. Also, when
the tray open error occurs at F/E and when the recovery fails even if
the B/E retries.
This code is output when a DVD operation error occurs during
copying.
This code is output when a chip (EMMA) outputs unusual data while
recording and the control information writing fails.
This code is output when video writing fails while copying at high
speed.
This code is output when a number of errors occur:
Ex.1) When Outplay list creation fails.
Ex.2) When the system can’t take the title information which should
be written on the disc.
Ex3) When starting to copy, recording is paused and restarted but,
after the recording pause, recording start fails.
This code is output when an HDD operation error occurs (HDD
recording error), while copying at high speed or constant speed.
This code is output when recording is attempted on a non recordable disc such as a CD or DVD-ROM.
This code is output when an error occurs erasing entire VR playlist,
HDD playlist or HDD originals.
This code is output when protected pre-existing information that
should be on a disc is missing (VR disc protection error).
This code is output when HDD formatting occurs in maintenance
mode.
This code is output when a [PLAY], [STOP], [HDD/DVD REC],
[DISC MENU] button is pressed while HDD is not functional.
This code is output when fan locking (over 30 seconds) is detected.
After the error message is displayed, the power turns off.
This code is output when an F/E hang-up event occurs. After the
error message is displayed, the power turns off.
This code is output when HDD hang-up event occurs. After the error
message is displayed, the power turns off.
1-10-1E2B10FIS
Page 31
E2B10BLS
NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.
IC1501
(SUB MICRO CONTROLLER)
Q1111
IC1502
SYS+5V
RESET
12
RESET
SW1501
12
RESET
LOW-POW80
REG-CONT
PWR-SW
22
77
74
P-DOWN
Q1112
XOUT
13
XIN
15
VFD
FL1501
GRID
~
23
1G
(VFD DRIVER)
DIN
IC1503
28
1
FL-DIN
XCOUT
XCIN
11
10
17
~
7G
CLK
STB
1
2
2
100
FL-CLK
FL-STB
3
REMOTE
SEGMENT
~
7
14
~
h
a
RM1501
75
REMOTE2
SYS-RESET
233635
16
i
SENSOR
REMOTE
SUB-RXD
SUB-TXD
EV+12V
FAN
Q1601
FAN
1
CN1601
Q1603
FAN-LOCK
2
78
79
FAN-CONT2
FAN-CONT1
Q1602
Q1604
1V2-CONT
24
TO VIDEO
SCL
SDA
87
FAN-LOCK
BLOCK DIAGRAM
DVD/HDD-AUDIO-MUTE
TO AUDIO
BLOCK DIAGRAM
SDA
AUDIO-MUTE
SCART-AUDIO-MUTE
Q1506
21
202625
29
AUDIO-MUTE
SCART-AUDIO-MUTE
DVD/HDD-AUDIO-MUTE
SCL
Q1507
I2C-SCL
I2C-SDA
KEY-1
KEY-2
8283706968
SCL
SDA
TU1701(TUNER UNIT)
9
10
POWER-LED
HDD-LED
DVD-LED
1-11-1
BOARD POWER
BLOCK DIAGRAMS
LOW-POW
REG-CONT
PWR-SW
TO POWER SUPPLY
BLOCK DIAGRAM
X1502
10MHz
X'TAL
32.768KHz
X1501
OPEN
/CLOSE
SW1643
CN1641CN1650
KEY-255POWER-LED 22HDD-LED66DVD-LED7
X'TAL
CN1201
44SYS-RESET
11SUB-RXD
CN701
T4
J25
N23
SUB-RXD
SYS-RESET
SYS-RESET
33SUB-TXD
X802
N24
SUB-TXD
27MHz
X'TAL
N2
CLK 27 IN
N1
IC106
CLK 27 OUT
CN101CN1151
VI+1.2VP-ON+1.2V
+1.2V
REGULATOR
30301V2-CONT
KEY-13
3
KEY SWITCH
KEY SWITCH
7
SYS+5V
DVD
D1653
D1652
HDD
D1651
POWER
Q1653
Q1652
BOARD CONTROL
Q1651
DVD/HDD MAIN BOARD
IC101
(MAIN MICRO CONTROLLER)
System Control Block Diagram
Page 32
E2B10BLD
NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.
TO VIDEO
BLOCK
DIAGRAM
CN1201
24
30
28
26
10
TO AUDI O
BLOCK
DIAGRAM
CN1201
14
16
18
JK1209
(REAR)
DIGITAL
AUDIO OUT
(COAXIAL)
REC VIDEO SIGNAL PB VIDEO SIGNALREC AUDIO SIGNAL PB AUDIO SIGNAL
G4
D/A
M4
D/A
L4
D/A
VIDEO
ENCODER
VIDEO
I/F
K1
D/A
CN701
G3
D/A
VIDEO-Y(I/P)-OUT
VIDEO-Y(I)-OUT
VIDEO-C-OUT22VIDEO-C-IN8
VIDEO-Cb/Pb-OUT
VIDEO-Cr/Pr-OUT
IC701 (VIDEO DECODER)
Y2, AA4,
VIDEO-Y/CVBS-IN
10
13
DECODERA/D45-50
DECODERA/D39-44
AB1-AB4
V3, Y3, W1,
Y4, W2, AA3
IC801
(AUDIO D/A CONVERTER)
BACK-END
DIGITAL
CN701
AUDIO(L)-OUT
151416
L-CH
R-CH
768
U1R3U2
SIGNAL
PROCESS
AUDIO(R)-OUT
DVD/HDD-AUDIO-MUTE12AUDIO(L)-IN20AUDIO(R)-IN
MUTE
AUDIO D/A
CONVERTER
4
P26
3
N26
2
M26
5
T3
R26
AUDIO
Q1803
BUFFER
BOARD JACK
13
14
R-CH
L-CH
AUDIO A/D
789
P2R1P3
CONVERTER
101112
T2
6
IC802
(AUDIO A/D CONVERTER)
R2
I/F
CN1802
99SPDIF
BOARD
POWER
WF7
2828SPDIF
CN101CN1151 CN1801
DDR SDRAM
FLASH MEMORY
IC104 (FLASH MEMORY)
IC102,IC103 (DDR SDRAM)
1-11-2
CN3002 CN3001CN651
HARD DISK
DRIVE
IC101
IC201
BOARD ATA
RF/
ERROR AMP
LPC
IC301
CN201
TILT
TRACKING
PICK
-UP
DVD MECHANISM
FOCUS
MOTOR
DRIVER
FRONT-END
DIGITAL
SIGNAL
PROCESS
TRAY OPEN
IC202
CN301
CN1001
+3.3V
CN1003
FE
OP AMP
ENCODER
BOARD
IC302
SLED
MOTOR
ENCODER
MOTOR
DRIVER
M
CN1002
SPINDLE
MOTOR
DVD/HDD MAIN BOARD
BOARD RELAY
M
Digital Signal Process Block Diagram
Page 33
JK2001
NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.
VIDEO IN2
20
VIDEO IN1
JK1206
20
JK1201 (FRONT)
VIDEO-IN1
VIDEO OUT
TU1701
(TUNER UNIT)
17
JK1212
C
34
Y
(FRONT)
S-VIDEO
IN1
21
IC1501 (VPS)
GV-IN
16
SYNC-IN
98
SCL
TO SYSTEM CONTROL
E2B10BLV
BLOCK DIAGRAM
SDA
BOARD POWER
REC VIDEO SIGNAL PB VIDEO SIGNAL
Q1509
1262161420
SW
SW
65
64
GCL
LPF
SW
SW
SW
AGC
SW
7
SW
BUFFER
9
AGC
SW
LPF
SW
Q1505,
Q1510
CLAMP
P-ON+5V
43
IIC
42
I/F
1-11-3
(VIDEO SIGNAL PROCESS)IC1201
DRIVERFBC
224850
49
BUFFER
Q2003
JK2001
7
19
11
15
VIDEO-B
VIDEO-R
VIDEO-G
VIDEO OUT2
Video Block Diagram
Q1202
MUTE
61
BUFFER
Q1201
MUTE
59
BUFFER
WF1
WF5
VIDEO-Y/CVBS-IN
CN1201
10
SW
5152535557
VIDEO-Y(I/P)-OUT
VIDEO-Cr/Pr-OUT
VIDEO-Cb/Pb-OUT
8 VIDEO-C-IN
24
26
28
TO DIGITAL
SIGNAL
PROCESS
BLOCK
DIAGRAM
CN701
+
WF4WF2
VIDEO-Y(I)-OUT
VIDEO-C-OUT
30
22
MUTEFBC
DRIVER
30
WF3
BUFFER
Q1204
JK1206
19
VIDEO OUT1
DRIVER
46
11715
VIDEO-B
VIDEO-G
DRIVER
44
VIDEO-R
DRIVER
45
SW
DRIVER
DRIVER
DRIVER
40
38
39
CN1801CN1802
VIDEO-Cb/Pb
11VIDEO-Y
33
22VIDEO-Cr/Pr
JK1804 (REAR)
VIDEO-Y
-OUT
VIDEO-Cb/Pb
-OUT
VIDEO-Cr/Pr
-OUT
MUTE
MUTE
DRIVERFBC
DRIVER
36
34
VIDEO-Y(YC)
VIDEO-C(YC)
55
77
CY
21
4
3
JK1213
(REAR)
S-VIDEO
OUT
BOARD JACK
Page 34
NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.
AUDIO(R)-IN2
AUDIO(L)-IN2
2
613
JK2001
REC AUDIO SIGNAL PB AUDIO SIGNAL
AUDIO(L)-OUT2
AUDIO(R)-OUT2
MUTE-ON
Q2002
MUTE-ON
Q2001
AUDIO(L)-IN1
613
JK1206
AUDIO(R)-IN1
AUDIO(L)-OUT1
AUDIO(R)-OUT1
2
Q1805
Q1804
MUTE-ON
MUTE-ON
Q1801
DRIVE
(REAR)
C
JK1801
SIF OUT
AUDIO OUT
TU1701 (TUNER UNIT)
72
6
43
IF SIGNAL
PROCESS
IC2
31
30
AUDIO(L)
-OUT1
MUTE-ON
Q1806
AUDIO(R)
-OUT1
MUTE-ON
Q1807
Q1802
DRIVE
AUDIO(L)
(FRONT)
JK1202
-IN1
(FRONT)
JK1203
AUDIO(R)
-IN1
TO SYSTEM CONTROL
BLOCK DIAGRAM
AUDIO-MUTE
SCART-AUDIO-MUTE
DVD/HDD-AUDIO-MUTE
E2B10BLA
(AUDIO SIGNAL PROCESS)
IC1201
67
72
SW
71
SW
74
SW
68
73
SW
90
948592
899384
91
1-11-4
)
OP AMP
(
IC1203
SW
80
6
OP
AMP
7
SW
SW
I/F
IIC
76
7
OP
AMP
6
(OP AMP)
IC1202
77
1
OP
AMP
2
42
43
SDA
SCL
SW
79
2
OP
AMP
1
BOARD POWER
TO SYSTEM CONTROL
BLOCK DIAGRAM
Audio Block Diagram
WF6
CN1201
AUDIO(L)-OUT
AUDIO(R)-OUT
AUDIO(L)-IN
DVD/HDD-AUDIO-MUTE
14
16
12
20
TO DIGITAL
SIGNAL
PROCESS
BLOCK
DIAGRAM
AUDIO(R)-IN
18
CN701
Page 35
NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.
-FL
EV+32V
SYS+5V
EV+3.3V
+5V REG.
IC1025
Q1025
+3.3V REG.
Q1159
NOTE:
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
REG
IC1153
SHUNT
REGULATOR
EV+12V
IC1002
AL+9V
AL+5V(2)
+5V REG.
Q1508
+9V REG.
AL+12V
TO HARD
DISK DRIVE
CN1015
AL+5V(1)
Q1015
1 HDD+5V
4 HDD+12V
Q2203
AUDIO+5V
+5V REG.
+10V REG.
Q1160Q1163
Q2221
REG
PWR-SWTO SYSTEM
Q1016
IC2204
SHUNT
CONTROL
BLOCK
DIAGRAM
REG-CONT
LOW-POW
Q1154
REGULATOR
P-ON+5V
P-ON+10V
SW+5V
F1
TO HDD/DVD
F2
MAIN BOARD
CN101
4-6 P-ON+10.5V
19-21 VI+1.2V
CN1151
IC1152
P-ON+2.5V(1)
9-11 P-ON+5V
24,25
14-16 P-ON+3.3V
+3.3V REG.
+2.5V REG.
IC1151
E2B10BLP
BOARD POWER
Q1164
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
4 -FL27
30 EV+33V1
29 VI+1.2V2
28 VI+1.2V3
27 EV+12V4
26 EV+12V5
25 EV+12V6
CN2001CN1152
16
15
14
T2001
3
D2104
BRIDGE
RECTIFIER
LINE
L2001
FILTER
F2001
CAUTION !
Fixed voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F2001) is blown , check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
HOT CIRCUIT. BE CAREFUL.
Otherwise it may cause some components in the power supply circuit to fail.
T1.6A L 250V
5
9 REG-VCC 22
24 EV+12V7
8 EV+5V23
23 EV+12V8
22 EV+12V9
10 REG-VCC 21
13
Q2101
1-11-5
7 EV+5V24
6 EV+5V25
5 EV+5V26
3F128
2F229
1 LOW-POW 30
21 SAFETY2B 10
Q2209
COLD
IC2201
SHUNT
12
11
10
7
Q2102
9
8
IC2101
ERROR
VOLTAGE DET
1
23
4
REGULATOR
REG
HOT
BOARD POWER SUPPLY
AC2001
Power Supply Block Diagram
Page 36
SCHEMATIC DIAGRAMS / BOARD’S AND TEST POINTS
NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.
Standard Notes
WARNING
Many electrical and mechanical parts in this chassis
have special characteristics. These characteristics
often pass unnoticed and the protection afforded by
them cannot necessarily be obtained by using
replacement components rated for higher voltage,
wattage, etc. Replacement parts that have these
special safety characteristics are identified in this
manual and its supplements; electrical components
having such features are identified by the mark " ! "
in the schematic diagram and the parts list. Before
replacing any of these components, read the parts list
in this manual carefully. The use of substitute
replacement parts that do not have the same safety
characteristics as specified in the parts list may create
shock, fire, or other hazards.
Notes:
1. Do not use the part number shown on these
drawings for ordering. The correct part number is
shown in the parts list, and may be slightly different
or amended since these drawings were prepared.
2. All resistance values are indicated in ohms
3
(K=10
3. Resistor wattages are 1/4W or 1/6W unless
otherwise specified.
4. All capacitance values are indicated in µF
(P=10
5. All voltages are DC voltages unless otherwise
specified.
6. Electrical parts such as capacitors, connectors,
diodes, IC’s, transistors, resistors, switches, and
fuses are identified by four digits. The first two
digits are not shown for each component. In each
block of the diagram, there is a note such as shown
below to indicate these abbreviated two digits.
, M=106).
-6
µF).
1-12-1H3P_SC
Page 37
LIST OF CAUTION, NOTES, AND SYMBOLS USED IN THE SCHEMATIC DIAGRAMS ON
THE FOLLOWING PAGES:
1. CAUTION:
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH THE SAME TYPE FUSE.
2. CAUTION:
Fixed Voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F2001) is blown, first check to see that all components in the power supply circuit are not
defective before you connect the AC plug to the AC power supply. Otherwise it may cause some components
in the power supply circuit to fail.
3. Note:
1. Do not use the part number shown on the drawings for ordering. The correct part number is shown in the
parts list, and may be slightly different or amended since the drawings were prepared.
2. To maintain original function and reliability of repaired units, use only original replacement parts which are
listed with their part numbers in the parts list section of the service manual.
4. Voltage indications for PLAY and REC modes on the schematics are as shown below:
The same voltage for
both PLAY & STOP modes
5. How to read converged lines
1-D3
Distinction Area
Line Number
(1 to 3 digits)
Examples:
1. "1-D3" means that line number "1" goes to the line number
"1" of the area "D3".
2. "1-B1" means that line number "1" goes to the line number
"1" of the area "B1".
6. Test Point Information
: Indicates a test point with a jumper wire across a hole in the BOARD.
: Used to indicate a test point with a component lead on foil side.
: Used to indicate a test point with no test pin.
231
5.0
5.0
(2.5)
Indicates that the voltage
is not consistent here.
PLAY mode
STOP mode
Unit: Volts
3
AREA D3
2
1
AREA B1
1-D3
ABCD
1-B1
: Used to indicate a test point with a test pin.
1-12-2H3P_SC
Page 38
----------
---------PST3621NR
0.1
Group AGroup B
----------
----------
0.015
R3112N211A-TR-F
/BU4221G-TR
IC1502A
IC1502B
C1507A
These components (IC1502A, C1507A, IC1502B, C1507B)
can be used in any models.
However, you cannot mix components under
Group A with the ones under Group B.
You can choose either Group. The difference
between Group A and Group B is shown below.
*1 NOTE
C1507B
NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.
E2B10SCM1
1-12-3
POWER 1/5 Schematic Diagram
Page 39
f
d
h
R
W
CD
a
b
a
b
a
b
a
b
a
b
a
b
7G 6G 5G 4G 3G 2G 1G
a
bcd
FL1501 MATRIX CHART
c
d
c
d
c
d
c
d
c
d
c
deg
DVD
efg
efg
efg
efg
effg
efg
HDD
C
hhh
VCRDB
P-SCAN
TIME
SHIFT
PM
i
NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.
E2B10SCM2
VCR
h
DB
P-SCAN
5G4G3G 2G1G
6G
TIME
7G
HDD
f
a
C
SHIFT
PM
1-12-4
W
R
DVD
CD
d
b
ef
d
g
c
h
h
POWER 2/5 Schematic Diagram
Page 40
MODELMARK
RD-XS25 SFC
RD-XS25 SEA
Comparison Chart of
RD-XS25 SBB
Models and Marks
NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.
E2B10SCM3
1-12-5
POWER 3/5 Schematic Diagram
Page 41
NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.
E2B10SCM4
1-12-6
POWER 4/5 Schematic Diagram
Page 42
NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.
E2B10SCM5
1-12-7
POWER 5/5 Schematic Diagram
Page 43
NOTE:
NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
E2B10SCP
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
1-12-8
CAUTION !
Fixed voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F2001) is blown , check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
POWER SUPPLY Schematic Diagram
Page 44
E2B10SCATA
NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.
E2B10SCCNT
E2B10SCJ
1-12-9
CONTROL Schematic DiagramATA Schematic Diagram
JACK Schematic Diagram
Page 45
NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.
E2B10SCD1
The order of pins shown in this diagram is different from that of actual IC101.
IC101 is divided into five and shown as IC101 (1/5) ~ IC101 (5/5) in this DVD/HDD Main Schematic Diagram Section.
2 NOTE:
1-12-10
DVD/HDD Main 1/5 Schematic Diagram
Page 46
NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.
E2B10SCD2
The order of pins shown in this diagram is different from that of actual IC101.
IC101 is divided into five and shown as IC101 (1/5) ~ IC101 (5/5) in this DVD/HDD Main Schematic Diagram Section.
2 NOTE:
1-12-11
DVD/HDD Main 2/5 Schematic Diagram
Page 47
E2B10SCD3
NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.
The order of pins shown in this diagram is different from that of actual IC101.
IC101 is divided into five and shown as IC101 (1/5) ~ IC101 (5/5) in this DVD/HDD Main Schematic Diagram Section.
2 NOTE:
1-12-12
DVD/HDD Main 3/5 Schematic Diagram
Page 48
E2B10SCD4
NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.
The order of pins shown in this diagram is different from that of actual IC101.
IC101 is divided into five and shown as IC101 (1/5) ~ IC101 (5/5) in this DVD/HDD Main Schematic Diagram Section.
2 NOTE:
1-12-13
DVD/HDD Main 4/5 Schematic Diagram
Page 49
NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.
E2B10SCD5
The order of pins shown in this diagram is different from that of actual IC101.
IC101 is divided into five and shown as IC101 (1/5) ~ IC101 (5/5) in this DVD/HDD Main Schematic Diagram Section.
2 NOTE:
1-12-14
DVD/HDD Main 5/5 Schematic Diagram
Page 50
NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.
BE2B10F01042A
1-12-15
BOARD POWER Top View
Page 51
WF7
PIN 28 OF
NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.
BE2B10F01042A
CN1151
WF3
PIN 30 OF
1-12-16
IC1201
WF6
PIN 14 OF
WF2
CN1201
PIN 22 OF
CN1201
WF1
PIN 24 OF
WF5
CN1201
WF4
PIN 26 OF
CN1201
PIN 28 OF
CN1201
BOARD POWER Bottom View
Page 52
NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.
Because a hot chassis ground is present in the power
supply circut, an isolation transformer must be used.
Also, in order to have the ability to increase the input
slowly, when troubleshooting this type power supply
circuit, a variable isolation transformer is required.
BE2B00F01022A
CAUTION !
Fixed voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F2001) is blown , check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
NOTE:
The voltage for parts in hot circuit is measured using
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
hot GND as a common terminal.
1-12-17
BOARD POWER SUPPLY Top View
Page 53
NOTE: BOARD MEANS PRINTED CIRCUIT BOARD.
Because a hot chassis ground is present in the power
supply circut, an isolation transformer must be used.
Also, in order to have the ability to increase the input
slowly, when troubleshooting this type power supply
circuit, a variable isolation transformer is required.
BE2B00F01022A
CAUTION !
Fixed voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F2001) is blown , check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
NOTE:
The voltage for parts in hot circuit is measured using
! have special characteristics important to safety.
Before replacing any of these components, read
carefully the product safety notice in this service
manual. Don't degrade the safety of the product
through improper servicing.
Comparison Chart of Models and Marks
ModelMark
RD-XS25-S-TEA
RD-XS25-S-TBB
RD-XS25-S-TFC
Loca-
!
Mark TSB P/NReference No.Description
tion No.
A1XP000475850 1VM222712PANEL FRONT E2B10ED
A21VM120915CHASSIS E2A00JD
A3P000475860 1VM323256COVER TOP E2B10ED
A51VM424907FOOT E2B10ED
A22A1VM323455ATOPPER POP E2B10ED
A22B,C1VM323455TOPPER POP E2B10ED
1B3P000475990 UHDD160VE002 ST3160212ACE
2B11VM222371HDD BRACKET E2A00JD
2B31VM220260COVER FAN E6800ED
2B10XP0U024WD004 LOCKING CARD SPACER
2B111VM424123EFRONT BRACKET R
2B121VM222669POWER HOLDER
2B251VM320812EARTH FAN E6800ED
2B261VM424521HDD PLATE EARTH
2B271VM424763INSULATION SHEET
2B280VM413956TAPE HIMELON H9206JD
FM1001P000459880 MMEZL12NH008 DC FAN MOTOR D05U-
2L010GBCC3050SCREW C-TIGHT M3X5
2L011GBCC3050SCREW C-TIGHT M3X5
2L012GBCC3050SCREW C-TIGHT M3X5
2L013GBCC3050SCREW C-TIGHT M3X5
2L020GBHB3080SCREW B-TIGHT M3X8
2L0400VM412937ASCREW C-TIGHT M3X6
2L0410VM412937ASCREW C-TIGHT M3X6
2L0420VM412937ASCREW C-TIGHT M3X6
2L0500VM412936ASCREW S-TIGHT M3X10
2L070SAC3T050INCH SCREW 3.4X5 +
2L071SAC3T050INCH SCREW 3.4X5 +
W5P000476000 WX1E2B10-003 HDD ATA FFC WX1E2B10-
ST3160212ACE
KGLS-12S
E2A00JD
E2B10ED
E2A00JD
E2A00JD
12TS1 09(UX)
BIND HEAD +
BIND HEAD +
BIND HEAD +
BIND HEAD +
BIND HEAD+
E5610UD
E5610UD
E5610UD
E5610UD
003
ACCESSORIES
X1A,C P000475970 NB317EDREMOTE CONTROL UNIT
X1BP000476070 NB318BDREMOTE CONTROL UNIT
X3P000460030 WPZ0122LG001 RF CORD PAL 1.2M
X40VM416059ACCESSORY BAG
NB317ED
NB318BD
E5795ED
Loca-
!
! X20BP000476030 1VMN23191OWNERS MANUAL(EN)
! X20AAP000475870 1VMN23186OWNERS MANUAL(EN)
! X20ACP000476090 1VMN23192OWNERS MANUAL(EN)
! X20BAP000475880 1VMN23187OWNERS MANUAL(SP)
! X20BCP000476080 1VMN23188OWNERS MANUAL(FR)
! X20CAP000475890 1VMN23189OWNERS MANUAL(GE)
! X20DAP000475900 1VMN23190OWNERS MANUAL(DU)
Mark TSB P/NReference No.Description
tion No.
X60VM406766BAG REMOCON STD
X22AP000475910 1VMN23223QUICK GUIDE E2B10ED
X22BP000476040 1VMN23224QUICK GUIDE E2B11BD
X22CP000476100 1VMN23225QUICK GUIDE E2B12FD
X36B1VMN22863REGISTERATION CARD
X34B0VM416082SHOE
X38B1VM424769HELP LINE SHEET
REMOCON
E2B11BD
E2B10ED
E2B12FD
E2B10ED
E2B12FD
E2B10ED
E2B10ED
E7B71BD
BAG(RECYCLMARK)
E5795ED
E9BA1BD
200608281-18-1E2B10CA
Page 63
ELECTRICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a
! have special characteristics important to safety.
Before replacing any of these components, read
carefully the product safety notice in this service
manual. Don't degrade the safety of the product
through improper servicing.
NOTES:
1. Parts that are not assigned part numbers (---------)
are not available.
2. Tolerance of Capacitors and Resistors are noted
with the following symbols.
C.....±0.25%D.....±0.5%F.....±1%
G.....±2%J......±5%K.....±10%
M.....±20%N.....±30%Z.....+80/-20%
Comparison Chart of Models and Marks
ModelMark
RD-XS25-S-TEA
RD-XS25-S-TBB
RD-XS25-S-TFC
DVD MECHANISM & DVD/HDD MAIN
BOARD ASSEMBLY
Loca-
!
!
!
!
Mark TSB P/NReference No.Description
tion No.
P000475960
A
P2
P000476060
B
P2
P000476120
C
P2
N78EECEN
N78EFCBN
N78EGCFN
DVD MECHANISM & DVD/
HDD MAIN BOARD
ASSEMBLY
DVD MECHANISM & DVD/
HDD MAIN BOARD
ASSEMBLY
DVD MECHANISM & DVD/
HDD MAIN BOARD
ASSEMBLY
POWER ASSEMBLY
Loca-
!
!!P1
BOARD POWER
!
Mark TSB P/NReference No.Description
tion No.
A,BCP000475920
P1
Loca-
tion No.
P000476110
Mark TSB P/NReference No.Description
1VSA15017
1VSA15071
----------BOARD POWER (POWER
----------BOARD CONTROL
----------BOARD JACK (POWER C)
----------BOARD POWER (POWER
POWER ASSEMBLY
POWER ASSEMBLY
Consists of the following:
A)
(POWER B)
A)
Consists of the following:
CAPACITORS
C1CHD1JZ30F104 CHIP CERAMIC
C4CHD1JJ3CH560 CHIP CERAMIC CAP. CH J
C5CHD1JJ3CH220 CHIP CERAMIC
C6CHD1JJ3CH560 CHIP CERAMIC CAP. CH J
C7CHD1JC3CH3R0 CHIP CERAMIC CAP. CH
CAP.(1608) F Z 0.1µF/50V
56pF/50V
CAP.(1608) CH J 22pF/50V
56pF/50V
C 3pF/50V
Loca-
!
Mark TSB P/NReference No.Description
tion No.
C8CHD1JC3CH3R0 CHIP CERAMIC CAP. CH
C11CHD1JK30B103 CHIP CERAMIC
C12CE1CMASSL100 ELECTROLYTIC CAP.
C13CHD1JK30B103 CHIP CERAMIC
C14CHD1JK30B103 CHIP CERAMIC
C15CE1CMASSL100 ELECTROLYTIC CAP.
C16CE1CMASSL100 ELECTROLYTIC CAP.
C17CHD1JZ30F104 CHIP CERAMIC
C19CHD1JZ30F104 CHIP CERAMIC
C20CE1JMASSL3R3 ELECTROLYTIC CAP.
C21CHD1JZ30F104 CHIP CERAMIC
C22CE1CMASSL100 ELECTROLYTIC CAP.
C23CCHD1AZ30F474 CHIP CERAMIC CAP. F Z
C24CE1JMASSLR22 ELECTROLYTIC CAP.
C27CCA1JZTFZ104 CERAMIC CAP.(AX) F Z
C1014CE1CMASSL470 ELECTROLYTIC CAP.
C1015CE0KMASDL102 ELECTROLYTIC CAP.
C1016CE0KMASDL102 ELECTROLYTIC CAP.
C1025CHD1JK30B103 CHIP CERAMIC
C1026CE1CMASSL101 ELECTROLYTIC CAP.
C1027CHD1EK30B104 CHIP CERAMIC
C1152CE1CMASSL470 ELECTROLYTIC CAP.
C1153CE0KMASDL101 ELECTROLYTIC CAP.
C1160CE1CMASSL470 ELECTROLYTIC CAP.
C1161CE0KMASSL101 ELECTROLYTIC CAP.
C1162CHD1JZ30F104 CHIP CERAMIC
C1163CHD1JK30B103 CHIP CERAMIC
C1164CE1CMASDL471 ELECTROLYTIC CAP.
C1167CE0KMASSL331 ELECTROLYTIC CAP.
C1168CE1CMASSL470 ELECTROLYTIC CAP.
C1173CE0KMASDL101 ELECTROLYTIC CAP.
C1174CE0KMASDL101 ELECTROLYTIC CAP.
C1175CE0KMASSL331 ELECTROLYTIC CAP.
C1176CHD1JZ30F104 CHIP CERAMIC
C1177CHD1JZ30F104 CHIP CERAMIC
C1202CHD1JZ30F104 CHIP CERAMIC
C1203CCA1JZTFZ104 CERAMIC CAP.(AX) F Z
C 3pF/50V
CAP.(1608) B K 0.01µF/
50V
10µF/16V M H7
CAP.(1608) B K 0.01µF/
50V
CAP.(1608) B K 0.01µF/
50V
10µF/16V M H7
10µF/16V M H7
CAP.(1608) F Z 0.1µF/50V
CAP.(1608) F Z 0.1µF/50V
3.3µF/50V M H7
CAP.(1608) F Z 0.1µF/50V
10µF/16V M H7
0.47µF/10V
0.22µF/50V M H7
0.1µF/50V
47µF/16V M H7
1000µF/6.3V M
1000µF/6.3V M
CAP.(1608) B K 0.01µF/
50V
100µF/16V M H7
CAP.(1608) B K 0.1µF/25V
47µF/16V M H7
100µF/6.3V M
47µF/16V M H7
100µ
F/6.3V M H7
CAP.(1608) F Z 0.1µF/50V
CAP.(1608) B K 0.01µF/
50V
470µF/16V M
330µF/6.3V M H7
47µF/16V M H7
100µF/6.3V M
100µF/6.3V M
330µF/6.3V M H7
CAP.(1608) F Z 0.1µF/50V
CAP.(1608) F Z 0.1µF/50V
CAP.(1608) F Z 0.1µF/50V
0.1µF/50V
200608281-19-1E2B10EL
Page 64
Loca-
!
Mark TSB P/NReference No.Description
tion No.
C1206CHD1JZ30F104 CHIP CERAMIC
C1207CHD1JZ30F104 CHIP CERAMIC
C1208CE1CMASSL221 ELECTROLYTIC CAP.
C1209CHD1JZ30F104 CHIP CERAMIC
C1210CE1CMASSL100 ELECTROLYTIC CAP.
C1211CE1CMASSL100 ELECTROLYTIC CAP.
C1212CHD1JJ3CH330 CHIP CERAMIC
C1213CHD1JJ3CH330 CHIP CERAMIC
C1215CHD1JZ30F104 CHIP CERAMIC
C1216CE0KMASSL101 ELECTROLYTIC CAP.
C1218CE0KMASSL331 ELECTROLYTIC CAP.
C1221CE1CMASSL100 ELECTROLYTIC CAP.
C1222CE1CMASSL100 ELECTROLYTIC CAP.
C1223CHD1JJ3CH271 CHIP CERAMIC
C1224CHD1JJ3CH271 CHIP CERAMIC
C1225CHD1JJ3CH470 CHIP CERAMIC
C1226CHD1JJ3CH470 CHIP CERAMIC
C1227CHD1JZ30F104 CHIP CERAMIC
C1228CE1CMASSL100 ELECTROLYTIC CAP.
C1229CE1CMASSL100 ELECTROLYTIC CAP.
C1230CE1JMASDLR47 ELECTROLYTIC CAP.
C1231CHD1JJ3CH680 CHIP CERAMIC
C1232CE1JMASDLR47 ELECTROLYTIC CAP.
C1233CE1JMASDLR47 ELECTROLYTIC CAP.
C1234CE1JMASDLR47 ELECTROLYTIC CAP.
C1235CHD1JJ3CH270 CHIP CERAMIC CAP. CH J
C1236CE1JMASDLR47 ELECTROLYTIC CAP.
C1237CHD1JZ30F104 CHIP CERAMIC
C1239CE1EMASDL4R7 ELECTROLYTIC CAP.
C1240CE1JMASDLR47 ELECTROLYTIC CAP.
C1241CE1JMASDLR47 ELECTROLYTIC CAP.
C1242CE1JMASDLR47 ELECTROLYTIC CAP.
C1243CE1JMASDL1R0 ELECTROLYTIC CAP. 1µF/
C1244CE1EMASDL4R7 ELECTROLYTIC CAP.
C1246CE1EMASDL4R7 ELECTROLYTIC CAP.
C1247CE1AMASDL470 ELECTROLYTIC CAP.
C1248CE1EMASDL4R7 ELECTROLYTIC CAP.
C1249CE1JMASDL1R0 ELECTROLYTIC CAP. 1µF/
C1250CCA1JZTFZ104 CERAMIC CAP.(AX) F Z
C1251CE1EMASDL4R7 ELECTROLYTIC CAP.
CAP.(1608) F Z 0.1µF/50V
CAP.(1608) F Z 0.1µF/50V
220µF/16V M H7
CAP.(1608) F Z 0.1µF/50V
10µF/16V M H7
10µF/16V M H7
CAP.(1608) CH J 33pF/50V
CAP.(1608) CH J 33pF/50V
CAP.(1608) F Z 0.1µF/50V
100µF/6.3V M H7
330µF/6.3V M H7
10µF/16V M H7
10µF/16V M H7
CAP.(1608) CH J 270pF/
50V
CAP.(1608) CH J 270pF/
50V
CAP.(1608) CH J 47pF/50V
CAP.(1608) CH J 47pF/50V
CAP.(1608) F Z 0.1µF/50V
10µF/16V M H7
10µF/16V M H7
0.47µF/50V M
CAP.(1608) CH J 68pF/50V
0.47µF/50V M
0.47µF/50V M
0.47µF/50V M
27pF/50V
0.47µF/50V M
CAP.(1608) F Z 0.1µF/50V
4.7µF/25V M
0.47µF/50V M
0.47µF/50V M
0.47µF/50V M
50V M
4.7µF/25V M
4.7µF/25V M
47µF/10V M
4.7µF/25V M
50V M
0.1µF/50V
4.7µF/25V M
Loca-
!
Mark TSB P/NReference No.Description
tion No.
C1252CE1EMASSL4R7 ELECTROLYTIC CAP.
C1253CE1JMASDL1R0 ELECTROLYTIC CAP. 1µF/
C1254CE1EMASDL4R7 ELECTROLYTIC CAP.
C1255CE1EMASDL4R7 ELECTROLYTIC CAP.
C1256CHD1JZ30F104 CHIP CERAMIC
C1257CE1EMASDL4R7 ELECTROLYTIC CAP.
C1258CE1JMASDL1R0 ELECTROLYTIC CAP. 1µF/
C1259CE1EMASDL4R7 ELECTROLYTIC CAP.
C1260CE1EMASDL4R7 ELECTROLYTIC CAP.
C1261CE1JMASDL1R0 ELECTROLYTIC CAP. 1µF/
C1262CE0KMASSL470 ELECTROLYTIC CAP.
C1263CHD1JZ30F104 CHIP CERAMIC
C1264JW5.0TBOARD JUMPER D0.6-
C1265CE1JMASDL1R0 ELECTROLYTIC CAP. 1µF/
C1266CHD1JZ30F104 CHIP CERAMIC
C1267CE1CMASSL100 ELECTROLYTIC CAP.
C1268CHD1JZ30F104 CHIP CERAMIC
C1269CE1JMASDL1R0 ELECTROLYTIC CAP. 1µF/
C1270CHD1JZ30F104 CHIP CERAMIC
C1272CHD1JZ30F104 CHIP CERAMIC
C1273CHD1JZ30F104 CHIP CERAMIC
C1274CE1JMASSL1R0 ELECTROLYTIC CAP. 1µF/
C1275CHD1JZ30F104 CHIP CERAMIC
C1276CE0KMASDL470 ELECTROLYTIC CAP.
C1277CE1JMASSL1R0 ELECTROLYTIC CAP. 1µF/
C1278CHD1JZ30F104 CHIP CERAMIC
C1279CE0KMASDL470 ELECTROLYTIC CAP.
C1280CE1JMASSL1R0 ELECTROLYTIC CAP. 1µF/
C1281CE1JMASDL1R0 ELECTROLYTIC CAP. 1µF/
C1282CE0KMASDL471 ELECTROLYTIC CAP.
C1283CE0KMASDL471 ELECTROLYTIC CAP.
C1284CHD1EK30B104 CHIP CERAMIC
C1285CE1JMASDL1R0 ELECTROLYTIC CAP. 1µF/
C1286CE0KMASDL471 ELECTROLYTIC CAP.
C1287CE1JMASDL1R0 ELECTROLYTIC CAP. 1µF/
C1288CE0KMASDL471 ELECTROLYTIC CAP.
C1290CE1JMASDL1R0 ELECTROLYTIC CAP. 1µF/
C1291CE0KMASDL471 ELECTROLYTIC CAP.
C1292CE0KMASDL471 ELECTROLYTIC CAP.
C1293CE0KMASDL471 ELECTROLYTIC CAP.
4.7µF/25V M H7
50V M
4.7µF/25V M
4.7µF/25V M
CAP.(1608) F Z 0.1µF/50V
4.7µF/25V M
50V M
4.7µF/25V M
4.7µF/25V M
50V M
47µF/6.3V M H7
CAP.(1608) F Z 0.1µF/50V
P5.0
50V M
CAP.(1608) F Z 0.1µF/50V
10µF/16V M H7
CAP.(1608) F Z 0.1µF/50V
50V M
CAP.(1608) F Z 0.1µF/50V
CAP.(1608) F Z 0.1µF/50V
CAP.(1608) F Z 0.1µF/50V
50V M H7
CAP.(1608) F Z 0.1µF/50V
47µF/6.3V M
50V M H7
CAP.(1608) F Z 0.1µ
47µF/6.3V M
50V M H7
50V M
470µF/6.3V M
470µF/6.3V M
CAP.(1608) B K 0.1µF/25V
50V M
470µF/6.3V M
50V M
470µF/6.3V M
50V M
470µF/6.3V M
470µF/6.3V M
470µF/6.3V M
F/50V
200608281-19-2E2B10EL
Page 65
Loca-
!
If C1507A is 0.015µF, then IC1502A is R3112N211A-TR-F.
If C1507B is 0.1µF, then IC1502B is PST3621NR.
Mark TSB P/NReference No.Description
tion No.
C1294CE0KMASDL471 ELECTROLYTIC CAP.
C1295CHD1JZ30F104 CHIP CERAMIC
C1296CHD1JZ30F104 CHIP CERAMIC
C1297CE0KMASSL470 ELECTROLYTIC CAP.
C1301CHD1JK30B222 CHIP CERAMIC CAP. B K
C1302CHD1JK30B222 CHIP CERAMIC CAP. B K
C1303CE1CMASSL101 ELECTROLYTIC CAP.
C1305CE1CMASDL101 ELECTROLYTIC CAP.
C1501CHD1JJ3CH101 CHIP CERAMIC
C1502CHD1JJ3CH240 CHIP CERAMIC CAP. CH J
C1503CHD1JJ3CH270 CHIP CERAMIC CAP. CH J
C1504CHD1JZ30F104 CHIP CERAMIC
C1505CHD1JJ3CH101 CHIP CERAMIC
C1507ACHD1JK30B153 CHIP CERAMIC
IC1502AQSZBA0TRC026 VOLTAGE DETECT
C1507BCHD1EK30B104 CHIP CERAMIC
IC1502BQSZBA0TMM162 SYSTEM RESET IC
C1508CHD1JJ3CH270 CHIP CERAMIC CAP. CH J
C1509CHD1JJ3CH270 CHIP CERAMIC CAP. CH J
C1510CHD1JZ30F104 CHIP CERAMIC
C1511CHD1EK30B104 CHIP CERAMIC
C1512CHD1JJ3CH102 CHIP CERAMIC
C1513CHD1JJ3CH102 CHIP CERAMIC
C1515CE1JMASDL3R3 ELECTROLYTIC CAP.
C1516CE1JMASDL3R3 ELECTROLYTIC CAP.
C1517CHD1JZ30F104 CHIP CERAMIC
C1518CE0KMASSL101 ELECTROLYTIC CAP.
C1519CHD1JZ30F104 CHIP CERAMIC
C1520CHD1JZ30F104 CHIP CERAMIC
C1521CE1JMASDL3R3 ELECTROLYTIC CAP.
C1522CHD1JJ3CH101 CHIP CERAMIC
C1523CHD1JZ30F104 CHIP CERAMIC
C1524CE0KMASDL101 ELECTROLYTIC CAP.
C1526CE1CMASSL100 ELECTROLYTIC CAP.
C1527CE0KMASSL470 ELECTROLYTIC CAP.
C1528CHD1JZ30F104 CHIP CERAMIC
C1529CHD1EK30B104 CHIP CERAMIC
470µF/6.3V M
CAP.(1608) F Z 0.1µF/50V
CAP.(1608) F Z 0.1µF/50V
47µF/6.3V M H7
2200pF/50V
2200pF/50V
100µF/16V M H7
100µF/16V M
CAP.(1608) CH J 100pF/
50V
24pF/50V
27pF/50V
CAP.(1608) F Z 0.1µF/50V
CAP.(1608) CH J 100pF/
50V
CAP.(1608) B K 0.015µF/
50V
R3112N211A-TR-F
CAP.(1608) B K 0.1µF/25V
PST3621NR
27pF/50V
27pF/50V
CAP.(1608) F Z 0.1µF/50V
CAP.(1608) B K 0.1µF/25V
CAP.(1608) CH J 1000pF/
50V
CAP.(1608) CH J 1000pF/
50V
3.3µF/50V M
3.3µF/50V M
CAP.(1608) F Z 0.1µF/50V
100µF/6.3V M H7
CAP.(1608) F Z 0.1µF/50V
CAP.(1608) F Z 0.1µF/50V
3.3µF/50V M
CAP.(1608) CH J 100pF/
50V
CAP.(1608) F Z 0.1µF/50V
100µF/6.3V M
10µF/16V M H7
47µF/6.3V M H7
CAP.(1608) F Z 0.1µF/50V
CAP.(1608) B K 0.1µF/25V
Loca-
!
Mark TSB P/NReference No.Description
tion No.
C1530CHD1EK30B104 CHIP CERAMIC
C1531CHD1JJ3CH470 CHIP CERAMIC
C1532CHD1EK30B104 CHIP CERAMIC
C1533CHD1JJ3CH470 CHIP CERAMIC
C1534CHD1JZ30F104 CHIP CERAMIC
C1536CHD1JK30B222 CHIP CERAMIC CAP. B K
C1601CE1CMASDL101 ELECTROLYTIC CAP.
C1602CHD1EK30B104 CHIP CERAMIC
C1603CHD1EK30B104 CHIP CERAMIC
C1636CHD1JJ3CH101 CHIP CERAMIC
C1638CE0KMASDL470 ELECTROLYTIC CAP.
C1704CHD1JK30B103 CHIP CERAMIC
C1708CHD1JZ30F104 CHIP CERAMIC
C1709CHD1JK30B103 CHIP CERAMIC
C1711CHD1JZ30F104 CHIP CERAMIC
C1713CHD1JZ30F103 CHIP CERAMIC CAP. F Z
C1714CE1JMASDL100 ELECTROLYTIC CAP.
C1715CE1JMASDLR33 ELECTROLYTIC CAP.
C1801CHD1JK30B222 CHIP CERAMIC CAP. B K
C1803CHD1JK30B222 CHIP CERAMIC CAP. B K
C1806CHD1JK30B222 CHIP CERAMIC CAP. B K
C1807CHD1JK30B102 CHIP CERAMIC
C1808CHD1JK30B222 CHIP CERAMIC CAP. B K
C1809CHD1JK30B222 CHIP CERAMIC CAP. B K
C1811CE1JMASSL1R0 ELECTROLYTIC CAP. 1µF/
C1812CHD1JK30B222 CHIP CERAMIC CAP. B K
C1813CHD1JZ30F104 CHIP CERAMIC
C1814CHD1JK30B102 CHIP CERAMIC
C1817CE1JMASSL1R0 ELECTROLYTIC CAP. 1µF/
C1819CHD1JK30B222 CHIP CERAMIC CAP. B K
C1820CHD1JK30B222 CHIP CERAMIC CAP. B K
C1827CHD1JK30B102 CHIP CERAMIC
C1831CE1JMASDL1R0 ELECTROLYTIC CAP. 1µF/
C1834CE1CMASSL470 ELECTROLYTIC CAP.
C2002CHD1JK30B222 CHIP CERAMIC CAP. B K
C2004CHD1JK30B222 CHIP CERAMIC CAP. B K
C2005CHD1JJ3CH471 CHIP CERAMIC
C2006CHD1JK30B222 CHIP CERAMIC CAP. B K
CAP.(1608) B K 0.1µF/25V
CAP.(1608) CH J 47pF/50V
CAP.(1608) B K 0.1µF/25V
CAP.(1608) CH J 47pF/50V
CAP.(1608) F Z 0.1µF/50V
2200pF/50V
100µF/16V M
CAP.(1608) B K 0.1µF/25V
CAP.(1608) B K 0.1µF/25V
CAP.(1608) CH J 100pF/
50V
47µF/6.3V M
CAP.(1608) B K 0.01µF/
50V
CAP.(1608) F Z 0.1µF/50V
CAP.(1608) B K 0.01µF/
50V
CAP.(1608) F Z 0.1µF/50V
0.01µF/50V
10µF/50V M
0.33µF/50V M
2200pF/50V
2200pF/50V
2200pF/50V
CAP.(1608) B K 1000pF/
50V
2200pF/50V
2200pF/50V
50V M H7
2200pF/50V
CAP.(1608) F Z 0.1µF/50V
CAP.(1608) B K 1000pF/
50V
50V M H7
2200pF/50V
2200pF/50V
CAP.(1608) B K 1000pF/
50V
50V M
47µF/16V M H7
2200pF/50V
2200pF/50V
CAP.(1608) CH J 470pF/
50V
2200pF/50V
200608281-19-3E2B10EL
Page 66
Loca-
!
Mark TSB P/NReference No.Description
tion No.
C2007CHD1JJ3CH471 CHIP CERAMIC
C2008CHD1JJ3CH102 CHIP CERAMIC
C2009CE1JMASDL1R0 ELECTROLYTIC CAP. 1µF/
C2010CE1JMASDL1R0 ELECTROLYTIC CAP. 1µF/
C2011CHD1JJ3CH102 CHIP CERAMIC
C2021CE0KMASDL471 ELECTROLYTIC CAP.
C2022CE1CMASSL101 ELECTROLYTIC CAP.
C2023CE0KMASDL102 ELECTROLYTIC CAP.
C2024CHD1JJ3CH102 CHIP CERAMIC
C2210CE1CMASDL471 ELECTROLYTIC CAP.
C2214CE1JMASDL100 ELECTROLYTIC CAP.
C2235CHD1JK30B103 CHIP CERAMIC
CAP.(1608) CH J 470pF/
50V
CAP.(1608) CH J 1000pF/
50V
50V M
50V M
CAP.(1608) CH J 1000pF/
50V
470µF/6.3V M
100µF/16V M H7
1000µF/6.3V M
CAP.(1608) CH J 1000pF/
50V
470µF/16V M
10µF/50V M
CAP.(1608) B K 0.01µF/
50V
CONNECTORS
CN1015WX1E2B10-006 AV-MAIN AV FFC
CN1151WX1E2A00-004 FFC WIRE H3 PW-AV
CN1152JC96J30ER007 FFC CONNECTOR 30PIN
CN1201WX1E2B10-001 AV-MAIN AV FFC
CN1601J3PHC02JG029 PH CONNECTOR TOP 2P
CN1641JC96J07ER007 FPC/FFC CONNECTOR
CN1801WX1E2B10-007 AV-MAIN AV FFC
WX1E2B10-006
30PIN 30PIN
IMSA-9615S-30A-PP-A
WX1E2B10-001
B2B-PH-K-S (LF)(SN)
IMSA-9615S-07A-PP-A
WX1E2B10-007
DIODES
D2QDTZ001SS133 SWITCHING DIODE
D1015QDTZ001SS133 SWITCHING DIODE
D1016QDTZ001SS133 SWITCHING DIODE
D1017QDTZ001SS133 SWITCHING DIODE
D1018QDTZ001SS133 SWITCHING DIODE
D1019QDTZ001SS133 SWITCHING DIODE
D1025QDTB0MTZJ9R1 ZENER DIODE MTZJT-
D1026QDTB00MTZJ15 ZENER DIODE MTZJT-
D1027NDQZ001N4005 RECTIFIER DIODE
D1028QDTZ001SS133 SWITCHING DIODE
D1131QDTB0MTZJ3R0 ZENER DIODE MTZJT-
D1151NDLZ001N5397 DIODE 1N5397-B
D1152NDLZ001N5397 DIODE 1N5397-B
D1154QDTZ001SS133 SWITCHING DIODE
D1160QDTZ001SS133 SWITCHING DIODE
D1161QDTZ001SS133 SWITCHING DIODE
D1162QDTB00MTZJ11 ZENER DIODE MTZJT-
D1163QDTB0MTZJ5R6 ZENER DIODE MTZJT-
D1164QDTZ001SS133 SWITCHING DIODE
1SS133(T-77)
1SS133(T-77)
1SS133(T-77)
1SS133(T-77)
1SS133(T-77)
1SS133(T-77)
779.1B
7715B
1N4005
1SS133(T-77)
773.0B
1SS133(T-77)
1SS133(T-77)
1SS133(T-77)
7711B
775.6B
1SS133(T-77)
Loca-
!
Mark TSB P/NReference No.Description
tion No.
D1165QDTZ001SS133 SWITCHING DIODE
D1166QDTZ001SS133 SWITCHING DIODE
D1167QDTZ001SS133 SWITCHING DIODE
D1168NDQZ001N4005 RECTIFIER DIODE
D1169NDQZ000SB140 SCHOTTKY BARRIER
D1170NDLZ001N5397 DIODE 1N5397-B
D1171NDLZ001N5397 DIODE 1N5397-B
D1172NDQZ001N4005 RECTIFIER DIODE
D1173NDQZ001N4005 RECTIFIER DIODE
D1174QDTZ001SS133 SWITCHING DIODE
D1175QDTZ001SS133 SWITCHING DIODE
D1177NDQZ001N4005 RECTIFIER DIODE
D1178QDTZ001SS133 SWITCHING DIODE
D1179QDTZ001SS133 SWITCHING DIODE
D1181QDTB0MTZJ2R2 ZENER DIODE MTZJT-
D1182QDTB0MTZJ6R8 ZENER DIODE MTZJT-
D1183QDTZ001SS133 SWITCHING DIODE
D1184QDTZ001SS133 SWITCHING DIODE
D1201QDTZ001SS133 SWITCHING DIODE
D1202QDTZ001SS133 SWITCHING DIODE
D1501QDTZ001SS133 SWITCHING DIODE
D1502QDTB0MTZJ7R5 ZENER DIODE MTZJT-
D1508QDTB0MTZJ5R6 ZENER DIODE MTZJT-
D1509QDTZ001SS133 SWITCHING DIODE
D1601QDTZ001SS133 SWITCHING DIODE
D1701QDTB00MTZJ33 ZENER DIODE MTZJT-
D1702QDTZ001SS133 SWITCHING DIODE
D1703QDTZ001SS133 SWITCHING DIODE
D1704QDTZ001SS133 SWITCHING DIODE
D1705QDTZ001SS133 SWITCHING DIODE
D1801QDTA00MTZJ11 ZENER DIODE MTZJT-
D1802QDTA00MTZJ11 ZENER DIODE MTZJT-
D1803QDTA00MTZJ11 ZENER DIODE MTZJT-
D1804QDTA00MTZJ11 ZENER DIODE MTZJT-
D1805QDTA00MTZJ11 ZENER DIODE MTZJT-
D1806QDTA00MTZJ11 ZENER DIODE MTZJT-
D1807QDTA00MTZJ11 ZENER DIODE MTZJT-
D1808QDTA00MTZJ11 ZENER DIODE MTZJT-
D1809QDTA00MTZJ11 ZENER DIODE MTZJT-
D1810QDTA00MTZJ11 ZENER DIODE MTZJT-
D1811QDTA0MTZJ8R2 ZENER DIODE MTZJT-
1SS133(T-77)
1SS133(T-77)
1SS133(T-77)
1N4005
DIODE SB140
1N4005
1N4005
1SS133(T-77)
1SS133(T-77)
1N4005
1SS133(T-77)
1SS133(T-77)
772.2B
776.8B
1SS133(T-77)
1SS133(T-77)
1SS133(T-77)
1SS133(T-77)
1SS133(T-77)
777.5B
775.6B
1SS133(T-77)
1SS133(T-77)
7733B
1SS133(T-77)
1SS133(T-77)
1SS133(T-77)
1SS133(T-77)
7711A
7711A
7711A
7711A
7711A
7711A
7711A
7711A
7711A
7711A
778.2A
200608281-19-4E2B10EL
Page 67
Loca-
!
Mark TSB P/NReference No.Description
tion No.
D1812QDTB0MTZJ6R2 ZENER DIODE MTZJT-
D1813QDTB0MTZJ6R2 ZENER DIODE MTZJT-
D1814QDTB0MTZJ6R2 ZENER DIODE MTZJT-
D1815QDTB0MTZJ6R2 ZENER DIODE MTZJT-
D1816QDTA00MTZJ11 ZENER DIODE MTZJT-
D2001QDTA00MTZJ11 ZENER DIODE MTZJT-
D2002QDTA00MTZJ11 ZENER DIODE MTZJT-
D2003QDTA00MTZJ11 ZENER DIODE MTZJT-
D2004QDTA00MTZJ11 ZENER DIODE MTZJT-
D2005QDTA00MTZJ11 ZENER DIODE MTZJT-
D2006QDTA00MTZJ11 ZENER DIODE MTZJT-
D2007QDTA00MTZJ11 ZENER DIODE MTZJT-
D2008QDTA00MTZJ11 ZENER DIODE MTZJT-
D2009QDTA00MTZJ11 ZENER DIODE MTZJT-
D2010QDTA00MTZJ11 ZENER DIODE MTZJT-
D2011QDTA00MTZJ11 ZENER DIODE MTZJT-
D2218QDTB00MTZJ24 ZENER DIODE MTZJT-
D2219QD1Z001SS400 SWITCHING DIODE
D2220QDTB00MTZJ24 ZENER DIODE MTZJT-
D2224QD1Z001SS400 SWITCHING DIODE
D2225QDTZ001SS133 SWITCHING DIODE
776.2B
776.2B
776.2B
776.2B
7711A
7711A
7711A
7711A
7711A
7711A
7711A
7711A
7711A
7711A
7711A
7711A
7724B
1SS400
7724B
1SS400
1SS133(T-77)
ICS
IC2P000459920 NSZBA0SP3005 IC AUDIO PROCESSOR
IC1002NSZBA0T2T001 VOLTAGE REGULATOR
IC1025NSZBA0STY245 IC REGULATOR TLV1117I
IC1151P000457260 QSZBA0SSH054 VOLTAGE REGULATOR
IC1152P000457260 QSZBA0SSH054 VOLTAGE REGULATOR
IC1153P000459940 NSZBA0TJY036 IC SHUNT REGULATOR
IC1201P000459970 QSZBA0RHT051 IC INTERFACE
IC1202P000459910 NSZBA0SJY035 IC OP AMP KIA4558P/P
IC1203P000468640 NSZBA0S2H003 IC OP AMP UTC4580
IC1501QSZAB0RHT139 IC SUB MICON
If IC1502A is R3112N211A-TR-F, then C1507A is 0.015µF.