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IEEE 1394a-2000 OHCI PHY/Link Layer Controller
TSB43AB23
SLLA210 – JUNE 2006
FEATURES
• Fully compliant with 1394 Open Host
• Extended resume signaling for compatibility
with legacy DV components
Controller Interface Specification (Release • PHY-link logic performs system initialization
1.1) and arbitration functions
• Fully compliant with provisions of IEEE Std • PHY-link encode and decode functions
1394-1995 for a high-performance serial bus
and IEEE Std 1394a-2000
1
included for data-strobe bit level encoding
• PHY-link incoming data resynchronized to
• Fully interoperable with FireWire and i.LINK local clock
implementations of IEEE Std 1394
• Low-cost 24.576-MHz crystal provides
• Compliant with Intel Mobile Power Guideline transmit and receive data at 100M bits/s,
2000 200M bits/s, and 400M bits/s
• Full IEEE Std 1394a-2000 support includes: • Node power class information signaling for
connection debounce, arbitrated short reset, system power management
multispeed concatenation, arbitration
acceleration, fly-by concatenation, and port
disable/suspend/resume
• Power-down features to conserve energy in
battery-powered applications include:
automatic device power down during
suspend, PCI power management for
link-layer, and inactive ports powered down
• Ultralow-power sleep mode
• Three IEEE Std 1394a-2000 fully compliant
cable ports at 100M bits/s, 200M bits/s, and
400M bits/s
• Cable ports monitor line conditions for active
connection to remote node
• Cable power presence monitoring
• Separate cable bias (TPBIAS) for each port
• 1.8-V core logic with universal PCI interfaces
compatible with 3.3-V and 5-V PCI signaling
environments
• Physical write posting of up to three
outstanding transactions
• PCI burst transfers and deep FIFOs to
• Serial ROM interface supports 2-wire serial
EEPROM devices
• Two general-purpose I/Os
• Register bits give software control of
contender bit, power class bits, link active
control bit, and IEEE Std 1394a-2000 features
• Fabricated in advanced low-power CMOS
process
• Isochronous receive dual-buffer mode
• Out-of-order pipelining for asynchronous
transmit requests
• Register access fail interrupt when the PHY
SCLK is not active
• PCI power-management D0, D1, D2, and D3
power states
• Initial bandwidth available and initial
channels available registers
• PME support per 1394 Open Host Controller
Interface Specification
NOTE: Implements technology covered by one or more patents
of Apple Computer, Incorporated and SGS Thompson,
Limited.
tolerate large host latency
• PCI_CLKRUN protocol
• External cycle timer control for customized
synchronization
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated
www.ti.com
TSB43AB23
SLLA210 – JUNE 2006
DESCRIPTION
The Texas Instruments TSB43AB23 device is an integrated 1394a-2000 OHCI PHY/link-layer controller (LLC)
device that is fully compliant with the PCI Local Bus Specification, the PCI Bus Power Management Interface
Specification (Revision 1.1), IEEE Std 1394-1995, IEEE Std 1394a-2000, and the 1394 Open Host Controller
Interface Specification (Release 1.1). It is capable of transferring data between the 33-MHz PCI bus and the
1394 bus at 100M bits/s, 200M bits/s, and 400M bits/s. The TSB43AB23 device provides three 1394 ports that
have separate cable bias (TPBIAS). The TSB43AB23 device also supports the IEEE Std 1394a-2000
power-down features for battery-operated applications and arbitration enhancements.
As required by the 1394 Open Host Controller Interface Specification (OHCI) and IEEE Std 1394a-2000, internal
control registers are memory-mapped and nonprefetchable. The PCI configuration header is accessed through
configuration cycles specified by PCI, and it provides plug-and-play (PnP) compatibility. Furthermore, the
TSB43AB23 device is compliant with the PCI Bus Power Management Interface Specification as specified by the
PC 2001 Design Guide requirements. The TSB43AB23 device supports the D0, D1, D2, and D3 power states.
The TSB43AB23 design provides PCI bus master bursting, and it is capable of transferring a cacheline of data
at 132M bytes/s after connection to the memory controller. Because PCI latency can be large, deep FIFOs are
provided to buffer the 1394 data.
The TSB43AB23 device provides physical write posting buffers and a highly-tuned physical data path for SBP-2
performance. The TSB43AB23 device also provides multiple isochronous contexts, multiple cacheline burst
transfers, and advanced internal arbitration.
An advanced CMOS process achieves low power consumption and allows the TSB43AB23 device to operate at
PCI clock rates up to 33 MHz.
The TSB43AB23 PHY-layer provides the digital and analog transceiver functions needed to implement a
three-port node in a cable-based 1394 network. Each cable port incorporates two differential line transceivers.
The transceivers include circuitry to monitor the line conditions as needed for determining connection status, for
initialization and arbitration, and for packet reception and transmission.
The TSB43AB23 PHY-layer requires only an external 24.576-MHz crystal as a reference for the cable ports. An
external clock may be provided instead of a crystal. An internal oscillator drives an internal phase-locked loop
(PLL), which generates the required 393.216-MHz reference signal. This reference signal is internally divided to
provide the clock signals that control transmission of the outbound encoded strobe and data information. A
49.152-MHz clock signal is supplied to the integrated LLC for synchronization and is used for resynchronization
of the received data.
Data bits to be transmitted through the cable ports are received from the integrated LLC and are latched
internally in synchronization with the 49.152-MHz system clock. These bits are combined serially, encoded, and
transmitted at 98.304M, 196.608M, or 393.216M bits/s (referred to as S100, S200, or S400 speeds, respectively)
as the outbound data-strobe information stream. During transmission, the encoded data information is
transmitted differentially on the twisted-pair B (TPB) cable pair(s), and the encoded strobe information is
transmitted differentially on the twisted-pair A (TPA) cable pair(s).
During packet reception, the TPA and TPB transmitters of the receiving cable port are disabled, and the
receivers for that port are enabled. The encoded data information is received on the TPA cable pair, and the
encoded strobe information is received on the TPB cable pair. The received data-strobe information is decoded
to recover the receive clock signal and the serial data bits. The serial data bits are resynchronized to the local
49.152-MHz system clock and sent to the integrated LLC. The received data is also transmitted (repeated) on
the other active (connected) cable ports.
Both the TPA and TPB cable interfaces incorporate differential comparators to monitor the line states during
initialization and arbitration. The outputs of these comparators are used by the internal logic to determine the
arbitration status. The TPA channel monitors the incoming cable common-mode voltage. The value of this
common-mode voltage is used during arbitration to set the speed of the next packet transmission. In addition,
the TPB channel monitors the incoming cable common-mode voltage on the TPB pair for the presence of the
remotely supplied twisted-pair bias voltage.
The TSB43AB23 device provides a 1.86-V nominal bias voltage at the TPBIAS terminal for port termination. The
PHY layer contains two independent TPBIAS circuits. This bias voltage, when seen through a cable by a remote
receiver, indicates the presence of an active connection. This bias voltage source must be stabilized by an
external filter capacitor of 1.0 µ F.
2
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TSB43AB23
SLLA210 – JUNE 2006
The line drivers in the TSB43AB23 device operate in a high-impedance current mode and are designed to work
with external 112- Ω line-termination resistor networks in order to match the 110- Ω cable impedance. One
network is provided at each end of a twisted-pair cable. Each network is composed of a pair of series-connected
56- Ω resistors. The midpoint of the pair of resistors that is directly connected to the TPA terminals is connected
to its corresponding TPBIAS voltage terminal. The midpoint of the pair of resistors that is directly connected to
the TPB terminals is coupled to ground through a parallel R-C network with recommended values of 5 k Ω and
220 pF. The values of the external line-termination resistors are designed to meet the standard specifications
when connected in parallel with the internal receiver circuits. An external resistor connected between the R0 and
R1 terminals sets the driver output current and other internal operating currents. This current-setting resistor has
a value of 6.34 k Ω ± 1%.
When the power supply of the TSB43AB23 device is off and the twisted-pair cables are connected, the
TSB43AB23 transmitter and receiver circuitry present a high impedance to the cable and do not load the
TPBIAS voltage at the other end of the cable.
When the device is in a low-power state (for example, D2 or D3) the TSB43AB23 device automatically enters a
low-power mode if all ports are inactive (disconnected, disabled, or suspended). In this low-power mode, the
TSB43AB23 device disables its internal clock generators and also disables various voltage and current
reference circuits, depending on the state of the ports (some reference circuitry must remain active in order to
detect new cable connections, disconnections, or incoming TPBIAS, for example). The lowest power
consumption (the ultralow-power sleep mode) is attained when all ports are either disconnected or disabled with
the port interrupt enable bit cleared.
The TSB43AB23 device exits the low-power mode when bit 19 (LPS) in the host controller control register at
OHCI offset 50h/54h is set to 1 or when a port event occurs which requires that the TSB43AB23 device to
become active in order to respond to the event or to notify the LLC of the event (for example, incoming bias is
detected on a suspended port, a disconnection is detected on a suspended port, or a new connection is
detected on a nondisabled port). When the TSB43AB23 device is in the low-power mode, the internal
49.153-MHz clock becomes active (and the integrated PHY layer becomes operative) within 2 ms after bit 19
(LPS) in the host controller control register at OHCI offset 50h/54h is set to 1.
The TSB43AB23 device supports hardware enhancements to better support digital video (DV) and MPEG data
stream reception and transmission. These enhancements are enabled through the isochronous receive digital
video enhancements register at OHCI offset A88h. The enhancements include automatic timestamp insertion for
transmitted DV and MPEG-formatted streams and common isochronous packet (CIP) header stripping for
received DV streams.
The CIP format is defined by the IEC 61883-1:1998 specification. The enhancements to the isochronous data
contexts are implemented as hardware support for the synchronization timestamp for both DV and MPEG CIP
formats. The TSB43AB23 device supports modification of the synchronization timestamp field to ensure that the
value inserted via software is not stale—that is, the value is less than the current cycle timer when the packet is
transmitted.
NOTE:
This product is for high-volume PC applications only. For a complete datasheet or
more information contact support@ti.com.
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3
PACKAGE OPTION ADDENDUM
www.ti.com
20-Mar-2008
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
STSB43AB23PDT ACTIVE TQFP PDT 128 90 Green (RoHS &
no Sb/Br)
TSB43AB23PDT ACTIVE TQFP PDT 128 90 Green (RoHS &
no Sb/Br)
TSB43AB23PDTG4 ACTIVE TQFP PDT 128 90 Green (RoHS &
no Sb/Br)
TSB43AB23PGE ACTIVE LQFP PGE 144 60 Green (RoHS &
no Sb/Br)
TSB43AB23PGEG4 ACTIVE LQFP PGE 144 60 Green (RoHS &
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
(3)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MTQF017A – OCTOBER 1994 – REVISED DECEMBER 1996
PGE (S-PQFP-G144) PLASTIC QUAD FLATPACK
109
144
1,45
1,35
108
73
72
0,27
0,17
0,50
37
1
17,50 TYP
20,20
SQ
19,80
22,20
SQ
21,80
36
0,05 MIN
0,08
0,25
0,75
0,45
M
0,13 NOM
Gage Plane
0°–7°
1,60 MAX
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Seating Plane
0,08
4040147/C 10/96
1
MECHANICAL DATA
MPQF013 – NOVEMBER 1995
PDT (S-PQFP-G128) PLASTIC QUAD FLATPACK
97
128
0,40
96
1
12,40 TYP
14,05
SQ
13,95
16,10
SQ
15,90
0,23
0,13
65
32
64
33
0,05
M
0,05 MIN
0,13 NOM
Gage Plane
0,25
0°–5°
1,05
0,95
1,20 MAX
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
0,75
0,45
Seating Plane
0,08
4087726/A 11/95
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
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