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Video Signal Processor With IEEE-1394 Link Layer Controller
TSB15LV01
TSB15LV01I
SLLA216 – JUNE 2006
FEATURES
• Programmable Status/Test Terminals
• Compatible With 1394 Trade Association’s • Seamlessly Connects to TI’s 1394 Physical
Digital Camera Specification, Draft 1.04 Layer Devices
• 1394a Link Layer Controller With 400 Mbits/s
Capability
• Support for Several CCD Sensors
– Sony ICX084AK, ICX098AK
– Sharp LZ24BP
– Texas Instruments TC237
• Integrated CCD (Charge-Coupled Device) and
CDS (Correlated Double Sampling) Pulse
Timer With Programmable Pulse Skew
• Video Controls
– Brightness (Auto/Manual)
– Exposure (Auto/Manual)
APPLICATIONS
• PC Video Camera
• Video Conferencing
• Video Capture
• Still Picture Capture
• Set-Top Boxes
• Video Phone
• Gaming
• Webcam
• Robotics
• Security
– Sharpness (Manual)
– Saturation (Manual)
– White Balance (Auto/Manual)
– Gamma (Manual)
– Backlight Compensation (Manual)
• Three Stepper Motor Controls for
Focus/Zoom/Tilt or Other Motorized
Functions
• EEPROM Interface
DESCRIPTION
The TSB15LV01 is a video signal processor integrated with a 1394 link layer controller. It is designed to be the
center of a host-controlled, full-motion color camera when coupled with a 1394 PHY, CCD sensor and driver,
analog front end, and an external EEPROM device. A camera based on the TSB15LV01 is compliant with the
IEEE 1394a standard and the 1394 Trade Association’s Digital Camera specification, Draft 1.04.
The TSB15LV01 offers the advantage of 24-bit true-color digital video processing. This gives superior video
quality at higher sustained data rates. Isochronous transfer of the video data and asynchronous control of the
camera are accomplished via the 1394 high-speed serial bus, operating at data rates of up to 400 Mbits/s. This
bus allows noncompressed full-motion digital video at rates of 30 frames/sec. Use of this serial connection
eliminates the need for expensive video capture cards. The chipset supports the YUV 4:1:1, YUV 4:2:2, YUV
4:4:4, and RGB 24-bit formats.
The video signal processor (VSP) portion of the device incorporates proprietary digital image processing
techniques, implemented with an advanced digital signal processing (DSP) ASIC. These techniques enable a
camera to achieve excellent color accuracy and resolution. The use of a custom advanced CMOS ASIC process
allows for both the advanced digital image processing techniques and for advanced color space conversion. This
allows the multiple output formats required for a multipurpose video conferencing camera. Use of this advanced,
low-power CMOS process also enables the camera to be powered by a notebook computer operating on battery
power. The device is designed to work with CCDs that have a pixel resolution of 640(H) y 480(V). This
resolution meets the VGA square pixel standards.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated
www.ti.com
TSB15LV01
TSB15LV01I
SLLA216 – JUNE 2006
The 1394 link layer controller is capable of up to 400 Mbits/s operation and is compatible with both the IEEE
1394–1995 and 1394a standards. The TSB15LV01 implements all registers and address space required by the
1394 Trade Association’s Digital Camera specification, Draft 1.04 (hereafter referred to as the Digital Camera
Specification).
The device supports packet speeds of up to 400 Mbits/s, but the maximum bandwidth consumed by the device
is 200 Mbits/s. This means that a TSB15LV01-based camera leaves at least 200 Mbits/s available to other
functions.
NOTE:
This product is for high-volume PC applications only. For a complete datasheet or
more information contact support@ti.com.
2
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PACKAGE OPTION ADDENDUM
www.ti.com
26-May-2011
PACKAGING INFORMATION
Orderable Device
TSB15LV01IPFC NRND TQFP PFC 80 TBD Call TI Call TI
TSB15LV01PFC ACTIVE TQFP PFC 80 96 Green (RoHS
TSB15LV01PFCG4 ACTIVE TQFP PFC 80 96 Green (RoHS
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Status
(1)
Package Type Package
Drawing
Pins Package Qty
Eco Plan
& no Sb/Br)
& no Sb/Br)
(2)
Lead/
Ball Finish
CU NIPDAU Level-4-260C-72 HR
CU NIPDAU Level-4-260C-72 HR
MSL Peak Temp
(3)
Samples
(Requires Login)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MTQF009A – OCTOBER 1994 – REVISED DECEMBER 1996
PFC (S-PQFP-G80) PLASTIC QUAD FLATPACK
61
80
1,05
0,95
0,50
60
0,27
0,17
41
1
9,50 TYP
12,20
SQ
11,80
14,20
SQ
13,80
20
0,08
21
40
M
0,13 NOM
Gage Plane
0,25
0,05 MIN
0,75
0,45
0°–7°
1,20 MAX
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
Seating Plane
0,08
4073177/B 11/96
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