User's Guide
SLWU038 – August 2006
TRF2436EVM
This user’s guide provides an overview of the TRF2436 evaluation module (EVM) to
get you started using the TRF2436EVM right away. It also provides a general
description of the features and functions to be considered when using this module.
Contents
1 Introduction .......................................................................................... 1
2 TRF2436EVM Operational Procedure ........................................................... 2
3 Physical Description ................................................................................ 3
List of Figures
1 Top Layer 1 .......................................................................................... 4
2 Ground Plane Layer 2.............................................................................. 4
3 Power Plane Layer 3 ............................................................................... 5
4 Bottom Layer 4 ...................................................................................... 5
List of Tables
1 TRF2436EVM PARTS LIST ....................................................................... 6
1 Introduction
1.1 Purpose
The TRF2436 EVM provides a platform for evaluating the TRF2436 high-power, dual-band RF front-end
under various signals, reference, and supply conditions. Use this document with the EVM schematic
diagram supplied. Using the TRF2436EVM, you can rapidly evaluate the TRF2436 with a minimum of
manual setup.
1.2 System Requirements
Use the following equipment when evaluating the TRF2436EVM:
• +3.3-V power supply, 800 mA.
• Signal generator: Agilent ESG Series (with baseband I/Q modulation option for modulated testing) or
equivalent.
• Spectrum analyzer: Agilent PSA Series (with phase noise option) or equivalent.
• Vector signal analyzer: Agilent 89600 Series for 802.16x modulated EVM testing or equivalent.
1.3 Power Requirements
The demonstration board requires only one supply for proper operation. Connect +3.3 V at P1 and the
return to P2. Always terminate active PA outputs before enabling the power supply.
Voltage Limits
Exceeding the maximum input voltages can damage EVM components. Undervoltage can cause improper
operation of some or all of the EVM components.
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TRF2436EVM Operational Procedure
1.4 Hardware Configuration
The TRF2436EVM can be set up in a variety of configurations to accommodate a specific mode of
operation. Before starting an evaluation, decide on the configuration and make the appropriate
connections or changes. The demonstration board comes with the following factory-set configuration:
Jumper J10 installed between 1-2
Jumper J11 installed between 2-3
Jumper J12 installed between 1-2
Jumper J13 installed between 1-2
Jumper J14 installed between 1-2
LO input drive
The TRF2436 has been designed to be driven with a differential LO input. A simple balun centered at ~2.6
GHz can be used to convert a single-ended input from an RF source to a differential pair to provide a
differential LO to the EVM through SMA connectors J3 and J4.
The 2436 will function if driven single-ended, but it is not designed to operate in this condition, nor has it
been evaluated in this condition. To drive the LO single-ended, connect an RF source to the LOP SMA
(J3) and terminate the LON SMA (J4) input with 50 Ω .
Filtering
The TRF2436EVM is provided with no filtering. The mixer output, PA input/LNA output, and RF
input/output pins are brought out directly to SMA connectors on the EVM. Filtering may be incorporated
by:
• Connecting an external filter to RFANTA (J6) for filtering after the PA in TX mode or before the LNA in
RX mode.
• Connecting an external filter between the MFA (J8) and RFA (J9) jacks for filtering between the mixer
and PA/LNA stages
2 TRF2436EVM Operational Procedure
2.1 TX Operation
1. Connect +3.3 V to P1 and ground to P2 but do not turn on.
2. Connect differential LO source to LOP/LON jacks (or use external balun).
Set the appropriate frequency and power level between 0 to +4 dBm. Remember that for A-band
operation, the LO input frequency is doubled inside the TRF2436; so, the LO should be set to half the
frequency desired at the mixer LO port.
3. Connect an IF source to the IF port. Set to 374 MHz with a typical power level of –20 dBm.
4. Set ABSEL (J12) to a logic high 1.
5. Set TR (J13) to a logic high 1.
6. Set PA_B SEL (J11) to a logic low 0.
7. Set PA_A SEL (J10) to logic high 1.
8. RXDGC = don’t care
9. For mixer stage measurement:
a. Terminate RFA (J9) and RFANTA (J6) into 50 Ω .
b. Connect a spectrum analyzer to MFA (J8).
c. Turn on the 3.3-V power supply (~300 mA to 320 mA).
d. Observe the output of the mixer stage on a spectrum analyzer.
10. For PA stage measurement:
a. Terminate IF (J7) and MFA (J8) into 50 Ω .
b. Apply an RF to RFA (J9).
c. Connect a spectrum analyzer to RFANTA (J6).
d. Turn on the power supply.
e. Observe the PA output on a spectrum analyzer.
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Physical Description
2.2 RX Operation
1. Set TR (J13) to logic 0.
2. Set PA_A SEL (J10) to logic 0.
3. Connect a differential LO source to the LOP/LON SMAs (or use an external balun).
Set the LO to an appropriate frequency, with the power level between 0 to +4 dBm. Remember that for
A-band operation, the LO input frequency is doubled inside the TRF2436; so, the LO should be set to
half the frequency desired at the mixer LO port.
4. For mixer stage measurement:
a. Terminate RFA (J9) and RFANTA (J6) into 50 Ω .
b. Connect an RF source to MFA (J8). Set to a desired RF frequency and typical power level
of –20 dBm.
c. Connect a spectrum analyzer to the IF (J7) output.
d. Turn on the 3.3-V power supply (~90 mA).
e. Observe the IF output on a spectrum analyzer (374 MHz).
5. For LNA stage measurement:
a. Terminate IF (J7) and MFA (J8) into 50 Ω .
b. Connect an RF source to RFANTA (J6). Set to a desired frequency and typical power
level of –40 dBm.
c. Connect a spectrum analyzer to RFA (J9).
d. Turn on the power supply.
e. Observe the LNA output on a spectrum analyzer.
f. Use jumper J14 (RXDGC) to select between LNA high (pins 2-3) and low gain (pins 1-2)
modes.
3 Physical Description
This section describes the physical characteristics and PCB layout of the EVM and lists the components
used on the module.
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Physical Description
3.1 PCB Layout
The EVM is constructed on a 4-layer, 3.6-inch × 3.6-inch, 0.042-inch thick PCB using Polycad 370
Turbo/HR material. Figure 1 through Figure 4 show the PCB layout for the EVM.
Figure 1. Top Layer 1
Figure 2. Ground Plane Layer 2
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