Contact Texas Instruments for details. Q100 qualification data
available on request.
(1)
SGLS280B − JANUARY 2005 − REVISED FEBRUARY 2007
DESCRIPTION
As members of the SWIFT family of dc/dc regulators,
the TPS54310 low-input-voltage high-output-current
synchronous-buck PWM converter integrates all
required active components. Included on the substrate
with the listed features are a true, high-performance,
voltage error amplifier that provides high performance
under transient conditions, an undervoltage-lockout
circuit to prevent start up until the input voltage reaches
3 V, an internally and externally set slow-start circuit to
limit in-rush currents, and a power good output useful
for processor/logic reset, fault signaling, and supply
sequencing.
The TPS54310 device is available in a thermally
enhanced 20-pin TSSOP (PWP) PowerPAD
package, which eliminates bulky heatsinks. Texas
Instruments provides evaluation modules and the
SWIFTdesigner software tool to aid in quickly achieving
high-performance power supply designs to meet
aggressive equipment development cycles.
APPLICATIONS
DPoint of Load Regulation for High
Performance DSPs, FPGAs, ASICs, and
Microprocessors
DAutomotive Systems
− Navigation Units
− Entertainment Modules
− Satellite Radio
DIndustrial High-Density Systems With Power
Distributed at 5 V or 3.3 V
ORDERING INFORMATION
PACKAGED DEVICES
T
J
−40°C to 125°C0.9 V to 3.3 VTPS54310QPWPRQ1
(1)
The PWP package is taped and reeled as indicated by the R suffix to the device type (i.e., TPS54310QPWPRQ1). See the Application section
of the data sheet for PowerPAD drawing and layout information.
semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD and SWIFT are trademarks of T exas Instruments.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during
storage or handling to prevent electrostatic damage to the MOS gates.
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Simplified Schematic
InputOutput
VIN
TPS54310
VBIAS
BOOT
PGND
COMP
VSENSE
AGND
PH
Compensation
Network
96
94
92
90
88
86
Efficiency − %
84
82
80
00.511.522.53
EFFICIENCY
LOAD CURRENT
TA = 25°C
VI = 5 V
VO = 3.3 V
Load Current − A
vs
ABSOLUTE MAXIMUM RATINGS
over operat i n g f ree-air temperature range unless otherwise noted
VIN, SS/ENA, FSEL−0.3 to 7V
RT−0.3 to 6V
I
VSENSE−0.3 to 4V
BOOT−0.3 to 17V
VBIAS, PWRGD, COMP−0.3 to 7V
O
PH−0.6 to 10V
PHInternally Limited
O
COMP, VBIAS6mA
PH6A
Sink current
COMP6mA
SS/ENA,PWRGD10mA
Voltage dif ferentialAGND to PGND±0.3V
Continuous power dissipation
Operating virtual junction temperature range, T
Storage temperature, T
stg
J
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds300°C
(1)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , a nd
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability .
(1)
TPS54310-Q1UNIT
See Power Dissipation
Rating Table
−40 to 150°C
−65 to 150°C
2
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RECOMMENDED OPERATING CONDITIONS
Input voltage range, V
Operating junction temperature, T
I
J
SGLS280B − JANUARY 2005 − REVISED FEBRUARY 2007
MIN NOM MAX UNIT
36V
−40125°C
PACKAGE DISSIPATION RATINGS
PACKAGE
20-pin PWP with solder26°C/W3.85 W
20-pin PWP without solder57.5°C/W1.73 W0.96 W0.69 W
(1)
For more information on the PWP package, see the Texas Instruments technical brief (SLMA002).
(2)
Test board conditions:
1. 3” × 3”, 2 layers, Thickness: 0.062”
2. 1.5 oz copper traces located on the top of the PCB
3. 1.5 oz copper ground plane on the bottom of the PCB
4. Ten thermal vias (see the recommended land pattern in application section of this data sheet)
(3)
Maximum power dissipation may be limited by overcurrent protection.
THERMAL IMPEDANCE
JUNCTION-TO-AMBIENT
(1) (2)
TA = 25°C
POWER RATING
(3)
TA = 70°C
POWER RATING
2.12 W1.54 W
TA = 85°C
POWER RATING
3
V
V
Line regulation
(1) (3)
%/V
Load regulation
(1) (3)
%/A
Internally set free-running frequency range
kHz
Externally set free-running frequency range
kHz
SGLS280B − JANUARY 2005 − REVISED FEBRUARY 2007
ELECTRICAL CHARACTERISTICS
TJ = −40°C to 125°C, VIN = 3 V to 6 V (unless otherwise noted)
High-level threshold voltage, FSEL2.5V
Low-level threshold voltage, FSEL0.8V
Pulse duration, FSEL
Frequency range, FSEL
Ramp valley
Ramp amplitude (peak-to-peak)
Minimum controllable on time
Maximum duty cycle
Specified by design
Static resistive loads only
Specified by the circuit used in Figure 10.
To ensure proper operation when RC filter is used between external clock and FSEL pin, the recommended values are R ≤ 1kΩ and
C ≤ 120 pF.
IL = 1.5 A, fs = 350 kHz, TJ = 125°C0.07
IL = 1.5 A, fs = 550 kHz, TJ = 125°C0.07
IL = 0 A to 3 A, fs = 350 kHz, TJ = 125°C0.03
IL = 0 A to 3 A, fs = 550 kHz, TJ = 125°C0.03
RT = 180 kΩ (1% resistor to AGND)
RT = 160 kΩ (1% resistor to AGND)290312350
RT = 68 kΩ (1% resistor to AGND)
6.29.6
8.412.8
2.5µs
50ns
0.75V
1V
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mA
100µA
kHz
200ns
4
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Current limit trip point
A
r
Power MOSFET switches
m
ELECTRICAL CHARACTERISTICS (continued)
TJ = −40°C to 125°C, VIN = 3 V to 6 V (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
ERROR AMPLIFIER
Error amplifier open loop voltage gain1-kΩ COMP to AGND
Error amplifier unity gain bandwidthParallel 10 kΩ, 160 pF COMP to AGND
Error amplifier common-mode input voltage
range
I
IB
V
O
PWM COMPARATOR
SLOW-START/ENABLE
POWER GOOD
CURRENT LIMIT
THERMAL SHUTDOWN
OUTPUT POWER MOSFETS
DS(on)
(1)
(2)
Input bias current, VSENSE
Output voltage slew rate (symmetric),
(1)
COMP
PWM comparator propagation delay time,
PWM comparator input to PH pin (excluding
dead time)
Power good threshold voltageVSENSE falling90%V
Power good hysteresis voltage
Power good falling edge deglitch
Output saturation voltage, PWRGDI
Leakage current, PWRGDVI = 5.5 V1µA
Current limit leading edge blanking time100ns
Current limit total response time200ns
Thermal shutdown trip point
Thermal shutdown hysteresis
Specified by design
Matched MOSFETs, low side r
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
production tested, high side r
DS(on)
Powered by internal LDO
VSENSE = V
10-mV overdrive
= 2.5 mA0.180.3V
(sink)
VI = 3 V , output shorted
VI = 6 V , output shorted
IO = 3 A,VI = 6 V
IO = 3 A,VI = 3 V
(1)
ref
(1)
specified by design
DS(on)
SGLS280B − JANUARY 2005 − REVISED FEBRUARY 2007
90110dB
(1)
(1)
(1)
(1)
(2)
(2)
35MHz
0VBIASV
60250nA
11.4V/µs
7085ns
0.03V
2.5µs
2.63.354.1ms
3%V
35µs
46.5
4.57.5
135150165°C
10°C
5988
85136
ref
ref
Ω
5
PWP PACKAGE
DESCRIPTION
SGLS280B − JANUARY 2005 − REVISED FEBRUARY 2007
PIN ASSIGNMENTS
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(TOP VIEW)
AGND
VSENSE
COMP
PWRGD
BOOT
PH
PH
PH
PH
PH
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
RT
FSEL
SS/ENA
VBIAS
VIN
VIN
VIN
PGND
PGND
PGND
Terminal Functions
TERMINAL
NAMENO.
AGND1Analog ground. Return for compensation network/output divider, slow-start capacitor, VBIAS capacitor, RT resistor, and
BOOT5Bootstrap input. A 0.022-µF to 0.1-µF low-ESR capacitor connected from BOOT to PH generates floating drive for the
COMP3Error amplifier output. Connect the compensation network from COMP to VSENSE.
PGND11−13 Power ground. High current return for the low-side driver and power MOSFET. Connect PGND with large copper areas to the
PH6−10Phase input/output. Junction of the internal high and low-side power MOSFETs and output inductor.
PWRGD4Power good open drain output. High when VSENSE ≥ 90% V
RT20Frequency setting resistor input. Connect a resistor from RT to AGND to set the switching frequency , fs.
SS/ENA18Slow-start/enable input/output. Dual function pin which provides logic input to enable/disable device operation and capacitor
FSEL19Synchronization input. Dual function pin which provides logic input to synchronize to an external oscillator or pin select
VBIAS17Internal bias regulator output. Supplies regulated voltage to internal circuitry. Bypass VBIAS pin to AGND pin with a high
VIN14−16 Input supply for the power MOSFET switches and internal bias regulator. Bypass VIN pins to PGND pins close to the device
VSENSE2Error amplifier inverting input.
FSEL pin. Make PowerPAD connection to AGND.
high-side FET driver.
input and output supply returns and negative terminals of the input and output capacitors.
, otherwise PWRGD is low. Note that output is low when
SS/ENA is low or internal shutdown signal active.
input to externally set the start-up time.
between two internally set switching frequencies. When used to synchronize to an external signal, a resistor must be
connected to the RT pin.
quality, low ESR 0.1-µF to 1-µF ceramic capacitor.
package with a high quality, low ESR 1-µF to 10-µF ceramic capacitor.
ref
6
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