Texas Instruments TPS 54310 – Q 1 INSTALLATION INSTRUCTIONS

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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
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    !"
FEATURES
Be Supported Along With Major-Change Approval
D 60-m MOSFET Switches for High Efficiency
at 3-A Continuous Output Source or Sink Current
D 0.9-V to 3.3-V Adjustable Output Voltage With
1% Accuracy
D Externally Compensated for Design Flexibility D Fast Transient Response D Wide PWM Frequency: Fixed 350 kHz,
550 kHz, or Adjustable 280 kHz to 700 kHz
D Load Protected by Peak Current Limit and
Thermal Shutdown
D Integrated Solution Reduces Board Area and
Total Cost
(1)
Contact Texas Instruments for details. Q100 qualification data available on request.
(1)
SGLS280B − JANUARY 2005 − REVISED FEBRUARY 2007
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DESCRIPTION
As members of the SWIFT family of dc/dc regulators, the TPS54310 low-input-voltage high-output-current synchronous-buck PWM converter integrates all required active components. Included on the substrate with the listed features are a true, high-performance, voltage error amplifier that provides high performance under transient conditions, an undervoltage-lockout circuit to prevent start up until the input voltage reaches 3 V, an internally and externally set slow-start circuit to limit in-rush currents, and a power good output useful for processor/logic reset, fault signaling, and supply sequencing.
The TPS54310 device is available in a thermally enhanced 20-pin TSSOP (PWP) PowerPAD package, which eliminates bulky heatsinks. Texas Instruments provides evaluation modules and the SWIFT designer software tool to aid in quickly achieving high-performance power supply designs to meet aggressive equipment development cycles.
APPLICATIONS
D Point of Load Regulation for High
Performance DSPs, FPGAs, ASICs, and Microprocessors
D Automotive Systems
− Navigation Units
− Entertainment Modules
− Satellite Radio
D Industrial High-Density Systems With Power
Distributed at 5 V or 3.3 V
ORDERING INFORMATION
PACKAGED DEVICES
T
J
−40°C to 125°C 0.9 V to 3.3 V TPS54310QPWPRQ1
(1)
The PWP package is taped and reeled as indicated by the R suffix to the device type (i.e., TPS54310QPWPRQ1). See the Application section of the data sheet for PowerPAD drawing and layout information.
semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD and SWIFT are trademarks of T exas Instruments.
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OUTPUT VOLTAGE
PLASTIC HTSSOP
Copyright 2007, Texas Instruments Incorporated
(PWP)
(1)
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Input voltage range, V
Output voltage range, V
Source current, I
Sink current
SGLS280B − JANUARY 2005 − REVISED FEBRUARY 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
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Simplified Schematic
Input Output
VIN
TPS54310
VBIAS
BOOT PGND
COMP
VSENSE
AGND
PH
Compensation Network
96
94
92
90
88
86
Efficiency − %
84
82
80
0 0.5 1 1.5 2 2.5 3
EFFICIENCY
LOAD CURRENT
TA = 25°C VI = 5 V VO = 3.3 V
Load Current − A
vs
ABSOLUTE MAXIMUM RATINGS
over operat i n g f ree-air temperature range unless otherwise noted
VIN, SS/ENA, FSEL −0.3 to 7 V RT −0.3 to 6 V
I
VSENSE −0.3 to 4 V BOOT −0.3 to 17 V VBIAS, PWRGD, COMP −0.3 to 7 V
O
PH −0.6 to 10 V PH Internally Limited
O
COMP, VBIAS 6 mA PH 6 A
Sink current
COMP 6 mA SS/ENA,PWRGD 10 mA
Voltage dif ferential AGND to PGND ±0.3 V Continuous power dissipation Operating virtual junction temperature range, T
Storage temperature, T
stg
J
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300 °C (1)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , a nd functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability .
(1)
TPS54310-Q1 UNIT
See Power Dissipation
Rating Table
−40 to 150 °C
−65 to 150 °C
2
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RECOMMENDED OPERATING CONDITIONS
Input voltage range, V Operating junction temperature, T
I
J
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SGLS280B − JANUARY 2005 − REVISED FEBRUARY 2007
MIN NOM MAX UNIT
3 6 V
−40 125 °C
PACKAGE DISSIPATION RATINGS
PACKAGE
20-pin PWP with solder 26°C/W 3.85 W
20-pin PWP without solder 57.5°C/W 1.73 W 0.96 W 0.69 W
(1)
For more information on the PWP package, see the Texas Instruments technical brief (SLMA002).
(2)
Test board conditions:
1. 3” × 3”, 2 layers, Thickness: 0.062”
2. 1.5 oz copper traces located on the top of the PCB
3. 1.5 oz copper ground plane on the bottom of the PCB
4. Ten thermal vias (see the recommended land pattern in application section of this data sheet)
(3)
Maximum power dissipation may be limited by overcurrent protection.
THERMAL IMPEDANCE
JUNCTION-TO-AMBIENT
(1) (2)
TA = 25°C
POWER RATING
(3)
TA = 70°C
POWER RATING
2.12 W 1.54 W
TA = 85°C
POWER RATING
3
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V
V
Line regulation
(1) (3)
%/V
Load regulation
(1) (3)
%/A
Internally set free-running frequency range
kHz
Externally set free-running frequency range
kHz
SGLS280B − JANUARY 2005 − REVISED FEBRUARY 2007
ELECTRICAL CHARACTERISTICS
TJ = −40°C to 125°C, VIN = 3 V to 6 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY VOLTAGE, VIN
VIN input voltage range 3 6 V
fs = 350 kHz, FSEL 0.8 V, RT open, phase pin open
Quiescent current
UNDER VOLTAGE LOCK OUT
Start threshold voltage, UVLO 2.95 3 Stop threshold voltage, UVLO 2.7 2.8 Hysteresis voltage, UVLO 0.16 V Rising and falling edge deglitch, UVLO
BIAS VOLTAGE
O
CUMULATIVE REFERENCE
V
ref
REGULATION
OSCILLATOR
(1) (2) (3) (4)
Output voltage, VBIAS I Output current, VBIAS
Accuracy
Externally set free-running frequency range
High-level threshold voltage, FSEL 2.5 V Low-level threshold voltage, FSEL 0.8 V Pulse duration, FSEL Frequency range, FSEL Ramp valley Ramp amplitude (peak-to-peak) Minimum controllable on time Maximum duty cycle
Specified by design Static resistive loads only Specified by the circuit used in Figure 10. To ensure proper operation when RC filter is used between external clock and FSEL pin, the recommended values are R 1k and C 120 pF.
(1)
(1)
(2)
(1)
(1) (4)
(1)
(1)
(1)
(1)
fs = 550 kHz, FSEL 2.5 V, RT open, phase pin open
Shutdown, SS/ENA = 0 V 1 1.4
= 0 2.7 2.8 2.95 V
(VBIAS)
0.882 0.891 0.900 V
IL = 1.5 A, fs = 350 kHz, TJ = 125°C 0.07 IL = 1.5 A, fs = 550 kHz, TJ = 125°C 0.07 IL = 0 A to 3 A, fs = 350 kHz, TJ = 125°C 0.03 IL = 0 A to 3 A, fs = 550 kHz, TJ = 125°C 0.03
FSEL 0.8 V, RT open 265 350 440 FSEL 2.5 V, RT open 415 550 680
(1)
(1)
252 280 308
663 700 762
330 700 kHz
90%
RT = 180 k (1% resistor to AGND) RT = 160 k (1% resistor to AGND) 290 312 350 RT = 68 k (1% resistor to AGND)
6.2 9.6
8.4 12.8
2.5 µs
50 ns
0.75 V 1 V
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mA
100 µA
kHz
200 ns
4
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Current limit trip point
A
r
Power MOSFET switches
m
ELECTRICAL CHARACTERISTICS (continued)
TJ = −40°C to 125°C, VIN = 3 V to 6 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ERROR AMPLIFIER
Error amplifier open loop voltage gain 1-k COMP to AGND Error amplifier unity gain bandwidth Parallel 10 k, 160 pF COMP to AGND Error amplifier common-mode input voltage
range
I
IB
V
O
PWM COMPARATOR
SLOW-START/ENABLE
POWER GOOD
CURRENT LIMIT
THERMAL SHUTDOWN
OUTPUT POWER MOSFETS
DS(on)
(1) (2)
Input bias current, VSENSE Output voltage slew rate (symmetric),
(1)
COMP
PWM comparator propagation delay time, PWM comparator input to PH pin (excluding dead time)
Enable threshold voltage, SS/ENA 0.82 1.2 1.4 V Enable hysteresis voltage, SS/ENA Falling edge deglitch, SS/ENA Internal slow-start time Charge current, SS/ENA SS/ENA = 0 V 2.5 5 8 µA Discharge current, SS/ENA SS/ENA = 0.2 V , VI = 2.7 V 1.2 2.3 4 mA
Power good threshold voltage VSENSE falling 90 %V Power good hysteresis voltage Power good falling edge deglitch Output saturation voltage, PWRGD I Leakage current, PWRGD VI = 5.5 V 1 µA
Current limit leading edge blanking time 100 ns Current limit total response time 200 ns
Thermal shutdown trip point Thermal shutdown hysteresis
Specified by design Matched MOSFETs, low side r
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
production tested, high side r
DS(on)
Powered by internal LDO VSENSE = V
10-mV overdrive
= 2.5 mA 0.18 0.3 V
(sink)
VI = 3 V , output shorted VI = 6 V , output shorted
IO = 3 A, VI = 6 V IO = 3 A, VI = 3 V
(1)
ref
(1)
specified by design
DS(on)

SGLS280B − JANUARY 2005 − REVISED FEBRUARY 2007
90 110 dB
(1)
(1)
(1) (1)
(2) (2)
3 5 MHz 0 VBIAS V
60 250 nA
1 1.4 V/µs
70 85 ns
0.03 V
2.5 µs
2.6 3.35 4.1 ms
3 %V
35 µs
4 6.5
4.5 7.5
135 150 165 °C
10 °C
59 88 85 136
ref ref
5
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PWP PACKAGE
DESCRIPTION
SGLS280B − JANUARY 2005 − REVISED FEBRUARY 2007
PIN ASSIGNMENTS
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(TOP VIEW)
AGND
VSENSE
COMP
PWRGD
BOOT
PH PH PH PH PH
1 2 3 4 5 6 7 8 9 10
20 19 18 17 16 15 14 13 12 11
RT FSEL SS/ENA VBIAS VIN VIN VIN PGND PGND PGND
Terminal Functions
TERMINAL
NAME NO.
AGND 1 Analog ground. Return for compensation network/output divider, slow-start capacitor, VBIAS capacitor, RT resistor, and
BOOT 5 Bootstrap input. A 0.022-µF to 0.1-µF low-ESR capacitor connected from BOOT to PH generates floating drive for the
COMP 3 Error amplifier output. Connect the compensation network from COMP to VSENSE. PGND 11−13 Power ground. High current return for the low-side driver and power MOSFET. Connect PGND with large copper areas to the
PH 6−10 Phase input/output. Junction of the internal high and low-side power MOSFETs and output inductor. PWRGD 4 Power good open drain output. High when VSENSE 90% V
RT 20 Frequency setting resistor input. Connect a resistor from RT to AGND to set the switching frequency , fs. SS/ENA 18 Slow-start/enable input/output. Dual function pin which provides logic input to enable/disable device operation and capacitor
FSEL 19 Synchronization input. Dual function pin which provides logic input to synchronize to an external oscillator or pin select
VBIAS 17 Internal bias regulator output. Supplies regulated voltage to internal circuitry. Bypass VBIAS pin to AGND pin with a high
VIN 14−16 Input supply for the power MOSFET switches and internal bias regulator. Bypass VIN pins to PGND pins close to the device
VSENSE 2 Error amplifier inverting input.
FSEL pin. Make PowerPAD connection to AGND.
high-side FET driver.
input and output supply returns and negative terminals of the input and output capacitors.
, otherwise PWRGD is low. Note that output is low when
SS/ENA is low or internal shutdown signal active.
input to externally set the start-up time.
between two internally set switching frequencies. When used to synchronize to an external signal, a resistor must be connected to the RT pin.
quality, low ESR 0.1-µF to 1-µF ceramic capacitor.
package with a high quality, low ESR 1-µF to 10-µF ceramic capacitor.
ref
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