Complete DDR2, DDR3, DDR3L, and LPDDR3 Memory Power Solution
Synchronous Buck Controller, 2-A LDO, with Buffered Reference
Check for Samples: TPS51716
1
FEATURES
2
•Synchronous Buck Controller (VDDQ)
– Conversion Voltage Range: 3 V to 28 V
– Output Voltage Range: 0.7 V to 1.8 V
– 0.8% V
– D-CAP2™ Mode for Ceramic Output
Capacitors
– Selectable 500 kHz/670 kHz Switching
Frequencies
– Optimized Efficiency at Light and Heavy
Loads with Auto-skip Function
– Supports Soft-Off in S4/S5 States
– OCL/OVP/UVP/UVLO Protectionsdedicated LDO supply input.
– Powergood Output
•2-A LDO(VTT), Buffered Reference(VTTREF)
– 2-A (Peak) Sink and Source Current
– Requires Only 10-μF of Ceramic Output
Capacitance
– Buffered, Low Noise, 10-mA VTTREF
Output
– 0.8% VTTREF, 20-mV VTT Accuracy
– Support High-Z in S3 and Soft-Off in S4/S5
•Thermal Shutdown
•20-Pin, 3 mm × 3 mm, QFN Package
Accuracy
REF
DESCRIPTION
The TPS51716 provides a complete power supply for
DDR2,DDR3, DDR3L, andLPDDR3 memory
systems in the lowest total cost and minimum space.
It integrates a synchronous buck regulator controller
(VDDQ) with a 2-A sink/source tracking LDO (VTT)
and buffered low noise reference (VTTREF). The
TPS51716 employs D-CAP2™ mode coupled with
500 kHz or 670 kHz operating frequencies that
supports ceramic output capacitors without an
external compensation circuit. The VTTREF tracks
VDDQ/2 with excellent 0.8% accuracy. The VTT,
whichprovides2-Asink/sourcepeakcurrent
capabilities,requiresonly10-μFofceramic
capacitance. In addition, the device features a
The TPS51716 provides rich, useful functions as well
as excellent power supply performance. It supports
flexible power state control, placing VTT at high-Z in
S3 and discharging VDDQ, VTT and VTTREF (softoff) in S4/S5 state. It includes programmable OCL
withlow-sideMOSFETR
OVP/UVP/UVLO and thermal shutdown protections.
TI offers the TPS51716 in a 20-pin, 3 mm × 3 mm,
QFN package and specifies it for an ambient
temperature range between –40°C and 85°C.
TPS51716
SLUSB94 –OCTOBER 2012
DS(on)
sensing,
APPLICATIONS
•DDR2/DDR3/DDR3L/LPDDR3 Memory Power
Supplies
•SSTL_18, SSTL_15, SSTL_135 and HSTL
Termination
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
2D-CAP2, NexFET are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
www.ti.com
ORDERING INFORMATION
T
A
PACKAGEPINS
–40°C to 85°CPlastic Quad Flat Pack (QFN)20
ORDERABLE DEVICEOUTPUTMINIMUM
NUMBERSUPPLYQUANTITY
TPS51716RUKRTape and reel3000
TPS51716RUKTMini reel250
(1)
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
PGOOD–0.36
Junction temperature range, T
Storage temperature range, T
J
STG
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the network ground terminal unless otherwise noted.
(3) Voltage values are with respect to the SW terminal.
DRVH14O High-side MOSFET gate driver output.
DRVL11O Low-side MOSFET gate driver output.
GND7–Signal ground.
MODE19IConnect resistor to GND to configure switching frequency, control mode and discharge mode. (See Table 2)
PGND10–Gate driver power ground. R
PGOOD20O Powergood signal open drain output. PGOOD goes high when VDDQ output voltage is within the target range.
REFIN8I
SW13I/O High-side MOSFET gate driver return. R
S317IS3 signal input. (See Table 1)
S516IS5 signal input. (See Table 1)
TRIP18IConnect resistor to GND to set OCL at V
VBST15IHigh-side MOSFET gate driver bootstrap voltage input. Connect a capacitor from the VBST pin to the SW pin.
VDDQSNS9IVDDQ output voltage feedback. Reference input for VTTREF. Also serves as power supply for VTTREF.
VLDOIN2IPower supply input for VTT LDO. Connect VDDQ in typical application.
VREF6O 1.8-V reference output.
VTT3O VTT 2-A LDO output. Need to connect 10 μF or larger capacitance for stability.
VTTGND4–Power ground for VTT LDO.
VTTREF5O Buffered VTT reference output. Need to connect 0.22 μF or larger capacitance for stability.
VTTSNS1IVTT output voltage feedback.
V5IN12I5-V power supply input for internal circuits and MOSFET gate drivers.
Thermal padThermal pad. Connect directly to system GND plane with multiple vias.
I/ODESCRIPTION
current sensing input(+).
DS(on)
Reference input for VDDQ. Connect to the midpoint of a resistor divider from VREF to GND. Add a capacitor for
stable operation.
current sensing input(–).
DS(on)
/8. Output 10-μA current at room temperature, TC= 4700 ppm/°C.