The TPS22966-Q1 device is a small, ultralow RON,
dual-channel load switch with adjustable rise time.
The device contains two N-channel MOSFETs that
can operate over an input voltage range of 0.8 V to
5.5 V and can support a maximum continuous current
of upto4 Aper channel.Each switchis
independently controlled by an on/off input (ON1 and
ON2), which can interface directly with low-voltage
control signals. The TPS22966-Q1 includes a 230-Ω
on-chip resistor for quick output discharge when the
switch is turned off.
The TPS22966-Q1 is available in a small, spacesaving 2-mm × 3-mm 14-SON package (DPU) with
integrated thermal pad allowing for high power
dissipation. The device is characterized for operation
over the free-air temperature range of –40°C to
105°C.
Device Information
PART NUMBERPACKAGEBODY SIZE (NOM)
TPS22966-Q1WSON (14)3.00 mm × 2.00 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
(1)
Typical Application Schematic
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
1VIN1ISwitch 1 input. Place an optional decoupling capacitor between this pin and GND for reduce VIN dip during
2VIN1ISwitch 1 input. Place an optional decoupling capacitor between this pin and GND for reduce VIN dip during
3ON1IActive high switch 1 control input. Do not leave floating.
4VBIASIBias voltage. Power supply to the device. See Application Information for more information.
5ON2IActive high switch 2 control input. Do not leave floating.
6VIN2ISwitch 2 input. Place an optional decoupling capacitor between this pin and GND for reduce VIN dip during
7VIN2ISwitch 2 input. Place an optional decoupling capacitor between this pin and GND for reduce VIN dip during
8VOUT2OSwitch 2 output.
9VOUT2OSwitch 2 output.
10CT2OSwitch 2 slew rate control. Can be left floating. Capacitor used on this pin should be rated for a minimum of 25
11GND–Ground
12CT1OSwitch 1 slew rate control. Can be left floating. Capacitor used on this pin should be rated for a minimum of 25
13VOUT1OSwitch 1 output.
14VOUT1OSwitch 1 output.
15Thermal PadOThermal pad (exposed center pad) to alleviate thermal stress. Tie to GND. See Layout Guidelines for layout
I/ODESCRIPTION
turnon of the channel. See Application Information section for more information.
turnon of the channel. See Application Informationfor more information.
turnon of the channel. See Application Information for more information.
turnon of the channel. See Application Information for more information.
Over operating free-air temperature range (unless otherwise noted)
V
V
V
V
I
MAX
I
PLS
T
T
T
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
(2) All voltage values are with respect to network ground terminal.
Input voltage–0.36V
IN1,2
Output voltage–0.36V
OUT1,2
ON-pin voltage–0.36V
ON1,2
VBIAS voltage–0.36V
BIAS
Maximum continuous switch current per channel4A
Maximum pulsed switch current per channel, pulse <300 µs, 2% duty cycle6A
Maximum junction temperature150°C
J
Maximum lead temperature (10-s soldering time)300°C
LEAD
Storage temperature–65150°C
STG
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under RecommendedOperating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Electrostatic dischargeV
(ESD)
Charged-device model (CDM), per JEDEC specification JESD22-±1500
(2)
C101
(1) (2)
MINMAXUNIT
VALUEUNIT
(1)
±4000
6.3 Recommended Operating Conditions
MINMAXUNIT
V
IN1,2
V
BIAS
V
ON1,2
V
OUT1,2
V
IH
V
IL
C
IN1,2
T
A
(1) Refer to Application Information.
(2) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
Input voltage range0.8V
Bias voltage range2.55.5V
ON voltage range05.5V
Output voltage rangeV
High-level input voltage, ONV
Low-level input voltage, ONV
Input capacitor1
Operating free-air temperature
have to be derated. Maximum ambient temperature [T
maximum power dissipation of the device in the application [P
in the application (θJA), as given by the following equation: T
= 2.5 V to 5.5 V1.25.5V
BIAS
= 2.5 V to 5.5 V00.5V
BIAS
(2)
] is dependent on the maximum operating junction temperature [T
A(max)
], and the junction-to-ambient thermal resistance of the part/package
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(1)
DPU (WSON)UNIT
14 PINS
°C/W
6.5 Electrical Characteristics: V
BIAS
= 5 V
Unless otherwise noted, the specifications apply over the operating ambient temperature, –40°C ≤ TA≤ 105°C (full) and V
= 5 V. Typical values are for TA= 25°C (unless otherwise noted).
PARAMETERTEST CONDITIONST
POWER SUPPLIES AND CURRENTS
V
quiescent current (both
I
IN(VBIAS-ON)
I
IN(VBIAS-ON)
I
IN(VBIAS-OFF)VBIAS
I
IN(VIN-OFF)
I
ON
BIAS
channels)
V
quiescent current (single
BIAS
channel)
shutdown currentV
V
off-state supply current
IN1,2
(per channel)
ON pin input leakage currentVON= 5.5 V–40°C to 105°C1µA