TEXAS INSTRUMENTS TPS2041, TPS2051 Technical data

MAXIMUM CONTINUOUS
查询TPS2041D供应商
D
135-m -Maximum (5-V Input) High-Side MOSFET Switch
D
500 mA Continuous Current
D
Short-Circuit and Thermal Protection With Overcurrent Logic Output
D
Operating Range . . . 2.7 V to 5.5 V
D
Logic-Level Enable Input
D
2.5-ms Typical Rise Time
D
Undervoltage Lockout
D
10 µA Maximum Standby Supply Current
D
Bidirectional Switch
D
Available in 8-pin SOIC and PDIP Packages
D
Ambient Temperature Range, –40°C to 85°C
D
2-kV Human-Body-Model, 200-V Machine-Model ESD Protection
D
UL Listed – File No. E169910
description
TPS2041, TPS2051
POWER-DISTRIBUTION SWITCHES
SLVS172A –AUGUST 1998 – REVISED APRIL 1999
TPS2041
D OR P PACKAGE
(TOP VIEW)
GND
GND
1
IN
2
IN
3 4
EN
TPS2051
D OR P PACKAGE
(TOP VIEW)
1
IN
2
IN
3 4
EN
OUT
8
OUT
7
OUT
6 5
OC
OUT
8
OUT
7
OUT
6 5
OC
The TPS2041 and TPS2051 power distribution switches are intended for applications where heavy capacitive loads and short circuits are likely to be encountered. The TPS2041 and the TPS2051 are 135-m N-channel MOSFET high-side power switches. Each switch is controlled by a logic enable compatible with 5-V and 3-V logic. Gate drive is provided by an internal charge pump that controls the power-switch rise times and fall times to minimize current surges during switching. The charge pump requires no external components and allows operation from supplies as low as 2.7 V.
When the output load exceeds the current-limit threshold or a short is present, the TPS2041 and TPS2051 limit the output current to a safe level by switching into a constant-current mode, pulling the overcurrent (OC
) logic output low. When continuous heavy overloads and short circuits increase the power dissipation in the switch, causing the junction temperature to rise, a thermal protection circuit shuts off the switch in overcurrent to prevent damage. Recovery from a thermal shutdown is automatic once the device has cooled sufficiently. Internal circuitry ensures the switch remains off until valid input voltage is present.
The TPS2041 and TPS2051 are designed to limit at 0.9-A load. These power distribution switches are available in 8-pin small-outline integrated circuit (SOIC) and 8-pin plastic dual-in-line packages (PDIP) and operate over an ambient temperature range of –40°C to 85°C.
AVAILABLE OPTIONS
RECOMMENDED
T
A
–40°C to 85°C Active low 0.5 0.9 TPS2041D TPS2041P –40°C to 85°C Active high 0.5 0.9 TPS2051D TPS2051P
The D package is available taped and reeled. Add an R suffix to device type (e.g., TPS2041DR)
ENABLE
LOAD CURRENT
(A)
TYPICAL SHORT-CIRCUIT
CURRENT LIMIT AT 25°C
(A)
PACKAGED DEVICES
SOIC
(D)
PDIP
(P)
This document contains information on products in more than one phase of development. The status of each device is indicated on the page(s) specifying its electrical characteristics.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 1999, Texas Instruments Incorporated
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
1
TPS2041, TPS2051
I/O
DESCRIPTION
POWER-DISTRIBUTION SWITCHES
SLVS172A –AUGUST 1998 – REVISED APRIL 1999
TPS2041 functional block diagram
IN
Charge
Pump
Power Switch
CS
OUT
EN
GND
Current Sense
Driver
UVLO
Thermal
Sense
Current
Limit
Terminal Functions
TERMINAL
NO.
NAME
EN 4 I Enable input. Logic low turns on power switch. EN 4 I Enable input. Logic high turns on power switch. GND 1 1 I Ground IN 2, 3 2, 3 I Input voltage OC 5 5 O Over current. Logic output active low OUT 6, 7, 8 6, 7, 8 O Power-switch output
D OR P
TPS2041 TPS2051
OC
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
detailed description
power switch
TPS2041, TPS2051
POWER-DISTRIBUTION SWITCHES
SLVS172A –AUGUST 1998 – REVISED APRIL 1999
The power switch is an N-channel MOSFET with a maximum on-state resistance of 135 m (V Configured as a high-side switch, the power switch prevents current flow from OUT to IN and IN to OUT when disabled. The power switch supplies a minimum of 500 mA per switch.
charge pump
An internal charge pump supplies power to the driver circuit and provides the necessary voltage to pull the gate of the MOSFET above the source. The charge pump operates from input voltages as low as 2.7 V and requires very little supply current.
driver
The driver controls the gate voltage of the power switch. T o limit large current surges and reduce the associated electromagnetic interference (EMI) produced, the driver incorporates circuitry that controls the rise times and fall times of the output voltage. The rise and fall times are typically in the 2-ms to 4-ms range.
enable (EN or EN)
The logic enable disables the power switch and the bias for the charge pump, driver, and other circuitry to reduce the supply current to less than 10 µA when a logic high is present on EN (TPS2041) or a logic low is present on EN (TPS2051). A logic zero input on EN or a logic high on EN restores bias to the drive and control circuits and turns the power on. The enable input is compatible with both TTL and CMOS logic levels.
overcurrent (OC)
The OC encountered. The output will remain asserted until the overcurrent or overtemperature condition is removed.
current sense
open drain output is asserted (active low) when an overcurrent or overtemperature condition is
I(IN)
= 5 V).
A sense FET monitors the current supplied to the load. The sense FET measures current more efficiently than conventional resistance methods. When an overload or short circuit is encountered, the current-sense circuitry sends a control signal to the driver. The driver in turn reduces the gate voltage and drives the power FET into its saturation region, which switches the output into a constant current mode and holds the current constant while varying the voltage on the load.
thermal sense
An internal thermal-sense circuit shuts off the power switch when the junction temperature rises to approximately 140°C. Hysteresis is built into the thermal sense circuit. After the device has cooled approximately 20°C, the switch turns back on. The switch continues to cycle off and on until the fault is removed.
undervoltage lockout
A voltage sense circuit monitors the input voltage. When the input voltage is below approximately 2 V , a control signal turns off the power switch.
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
3
TPS2041, TPS2051
UNIT
POWER-DISTRIBUTION SWITCHES
SLVS172A –AUGUST 1998 – REVISED APRIL 1999
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Input voltage range, V Output voltage range, V Input voltage range, V Continuous output current, I
Continuous total power dissipation See Dissipation Rating Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature range, T Storage temperature range, T
Lead temperature soldering 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . .
Electrostatic discharge (ESD) protection: Human body model MIL-STD-883C 2 kV. . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltages are with respect to GND.
PACKAGE
D 725 mW 5.8 mW/°C 464 mW 377 mW P 1175 mW 9.4 mW/°C 752 mW 611 mW
(see Note 1) –0.3 V to 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I(IN)
O(OUT)
I(ENx)
(see Note 1) –0.3 V to V
or V
I(ENx)
O(OUT)
J
stg
Machine model 0.2 kV. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DISSIPATION RATING TABLE
TA 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
+ 0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I(IN)
–0.3 V to 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
internally limited. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
–40°C to 125°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
–65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
recommended operating conditions
TPS2041 TPS2051
MIN MAX MIN MAX
Input voltage, V Input voltage, V Continuous output current, I Operating virtual junction temperature, T
I(IN) I(EN
or V
)
I(EN)
O(OUT)
J
2.7 5.5 2.7 5.5 V 0 5.5 0 5.5 V 0 500 0 500 mA
–40 125 –40 125 °C
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PARAMETER
TEST CONDITIONS
UNIT
resistance, 5-V o eration
r
resistance, 3.3-V o eration
trRise time, output
ms
tfFall time, output
ms
PARAMETER
TEST CONDITIONS
UNIT
VILLow-level input voltage
IIInput current
A
PARAMETER
TEST CONDITIONS
UNIT
TPS2041, TPS2051
POWER-DISTRIBUTION SWITCHES
SLVS172A –AUGUST 1998 – REVISED APRIL 1999
electrical characteristics over recommended operating junction temperature range, V
= rated current, V
I
O
I(EN)
= 0 V, V
= Hi (unless otherwise noted)
I(EN)
I(IN)
= 5.5 V,
power switch
TPS2041 TPS2051
MIN TYP MAX MIN TYP MAX
V
= 5 V, TJ = 25°C 80 95 80 95
Static drain-source on-state
DS(on)
Static drain-source on-state
Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
-
p
-
p
p
p
I(IN)
V
= 5 V, TJ = 85°C 90 120 90 120
I(IN)
V
= 5 V, TJ = 125°C 100 135 100 135
I(IN)
V
= 3.3 V, TJ = 25°C 85 105 85 105
I(IN)
V
= 3.3 V, TJ = 85°C 100 135 100 135
I(IN)
V
= 3.3 V, TJ = 125°C 115 150 115 150
I(IN)
V
= 5.5 V,
I(IN)
CL = 1 µF, V
= 2.7 V,
I(IN)
CL = 1 µF, V
= 5.5 V,
I(IN)
CL = 1 µF, V
= 2.7 V,
I(IN)
CL = 1 µF,
TJ = 25°C, RL = 10
TJ = 25°C, RL = 10
TJ = 25°C, RL = 10
TJ = 25°C, RL = 10
2.5 2.5
3 3
4.4 4.4
2.5 2.5
m
enable input EN or EN
TPS2041 TPS2051
MIN TYP MAX MIN TYP MAX
V
High-level input voltage 2.7 V ≤ V
IH
p
p
t
Turnon time CL = 100 µF, RL = 10 20 20 ms
on
t
Turnoff time CL = 100 µF, RL = 10 40 40
off
TPS2041 V TPS2051 V
4.5 V ≤ V
2.7 V ≤ V I(EN)
I(EN)
5.5 V 2 2 V
I(IN)
5.5 V 0.8 0.8 V
I(IN)
4.5 V 0.4 0.4
I(IN)
= 0 V or V = V
I(IN)
I(EN)
or V
= V
I(IN)
= 0 V –0.5 0.5
I(EN)
–0.5 0.5
µ
current limit
I
OS
Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
Short-circuit output current
V
= 5 V, OUT connected to GND,
I(IN)
Device enabled into short circuit
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TPS2041 TPS2051
MIN TYP MAX MIN TYP MAX
0.7 0.9 1.1 0.7 0.9 1.1 A
5
TPS2041, TPS2051
PARAMETER
TEST CONDITIONS
UNIT
TPS2041
y,
A
EN
V
TPS2051
EN
V
TPS2041
y,
A
EN
V
TPS2051
Leakage current
d
A
g
g
T
25°C
A
PARAMETER
TEST CONDITIONS
UNIT
PARAMETER
TEST CONDITIONS
UNIT
POWER-DISTRIBUTION SWITCHES
SLVS172A –AUGUST 1998 – REVISED APRIL 1999
electrical characteristics over recommended operating junction temperature range, V
= rated current, V
I
O
I(EN)
= 0 V, V
= Hi (unless otherwise noted) (continued)
I(EN)
I(IN)
= 5.5 V,
supply current
TPS2041 TPS2051
MIN TYP MAX MIN TYP MAX
Supply current, No Load low-level output on OUT
Supply current, No Load high-level output on OUT
OUT connecte to ground
Reverse leakage IN = High current
impedance
EN = V
= 0
= 0
=
EN = V EN= 0 V –40°C ≤ TJ 125°C TPS2051 100
V
I(EN)
V
I(EN)
TJ = 25°C
I(IN)
–40°C ≤ TJ 125°C TJ = 25°C –40°C TJ 125°C TJ = 25°C –40°C TJ 125°C TJ = 25°C
I(IN)
–40°C ≤ TJ 125°C –40°C ≤ TJ 125°C TPS2041 100
I(IN)
= 0 V = Hi
°
=
J
TPS2041 0.3 TPS2051 0.3
0.015 1 10
0.015 1 10
80 100
100
80 100
100
undervoltage lockout
TPS2041 TPS2051
MIN TYP MAX MIN TYP MAX
Low-level input voltage 2 2.5 2 2.5 V Hysteresis TJ = 25°C 100 100 mV
µ
µ
µ
µ
overcurrent OC
Sink current Output low voltage IO = 5 V, V Off-state current
Specified by design, not production tested.
VO = 5 V 10 10 mA
VO = 5 V, VO = 3.3 V 1 1 µA
OL(OC)
TPS2041 TPS2051
MIN TYP MAX MIN TYP MAX
0.5 0.5 V
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TPS2041, TPS2051
POWER-DISTRIBUTION SWITCHES
SLVS172A –AUGUST 1998 – REVISED APRIL 1999
PARAMETER MEASUREMENT INFORMATION
OUT
V
I(EN)
(5 V/div)
V
I(EN)
V
O(OUT)
t
RL CL
V
O(OUT)
TEST CIRCUIT
50%
t
on
50%
90%
10%
V
I(EN)
t
off
V
O(OUT)
VOLTAGE WA VEFORMS
r
90%
90%
10%
50%
t
on
10%
50%
90%
10%
t
f
t
off
Figure 1. Test Circuit and Voltage Waveforms
V
I(EN)
(5 V/div)
V
O(OUT)
(2 V/div)
V
= 5 V
I(IN)
TA = 25°C CL = 0.1 µF
0123456
t – Time – ms
78910
Figure 2. Turnon Delay and Rise Time
with 0.1-µF Load
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
V
O(OUT)
(2 V/div)
V
= 5 V
I(IN)
TA = 25°C CL = 0.1 µF
0 1000 2000 3000
t – Time – ms
4000 5000
Figure 3. Turnoff Delay and Fall Time
with 0.1-µF Load
7
TPS2041, TPS2051 POWER-DISTRIBUTION SWITCHES
SLVS172A –AUGUST 1998 – REVISED APRIL 1999
PARAMETER MEASUREMENT INFORMATION
V
I(EN)
(5 V/div)
V
V
O(OUT)
(2 V/div)
0123456
t – Time – ms
TA = 25°C CL = 1 µF RL = 10
= 5 V
I(IN)
78910
V
I(EN)
(5 V/div)
V
O(OUT)
(2 V/div)
V
= 5 V
I(IN)
TA = 25°C CL = 1 µF RL = 10
0 2 4 6 8 10 12
t – Time – ms
14 16 18 20
Figure 4. Turnon Delay and Rise Time
with 1-µF Load
V
I(EN)
(5 V/div)
I
O(OUT)
(0.2 A/div)
0123 4 5 6
t – Time – ms
Figure 6. TPS2041, Short-Circuit Current,
Device Enabled into Short
V
= 5 V
I(IN)
TA = 25°C
78910
V
O(OUT)
(2 V/div)
I
O(OUT)
(0.5 A/div)
Figure 5. Turnoff Delay and Fall Time
with 1-µF Load
V
= 5 V
I(IN)
TA = 25°C
01020 30405060
t – Time – ms
70 80 90 100
Figure 7. TPS2041, Threshold Trip Current
with Ramped Load on Enabled Device
8
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
V
I(EN)
(5 V/div)
I
O(OUT)
(o.2 A/div)
PARAMETER MEASUREMENT INFORMATION
V
= 5 V
I(IN)
TA = 25°C RL = 10
470 µF
220 µF
100 µF
0 2 4 6 8 10 12
t – Time – ms
Figure 8. Inrush Current with 100-µF, 220-µF
and 470-µF Load Capacitance
14 16 18 20
V
O(OC)
(5 V/div)
I
O(OUT)
(0.5 A/div)
TPS2041, TPS2051
POWER-DISTRIBUTION SWITCHES
SLVS172A –AUGUST 1998 – REVISED APRIL 1999
V
= 5 V
I(IN)
Load Ramp,1A/100 ms TA = 25°C
0 20 40 60 80 100 120
t – Time – ms
Figure 9. Ramped Load on Enabled Device
140 160 180 200
V
= 5 V
I(IN)
TA = 25°C
V
O(OC)
(5 V/div)
I
O(OUT)
(0.5 A/div)
0 400 800 1200 1600 2000
t – Time – µs
Figure 10. 4- Load Connected to Enabled Device
V
O(OC)
(5 V/div)
I
O(OUT)
(1 A/div)
V
= 5 V
I(IN)
TA = 25°C
0 20 40 60 80 100 120 140 160 180 200
t – Time – µs
Figure 11. 1- Load Connected
to Enabled Device
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
9
TPS2041, TPS2051 POWER-DISTRIBUTION SWITCHES
SLVS172A –AUGUST 1998 – REVISED APRIL 1999
TYPICAL CHARACTERISTICS
6
5.5
5
4.5
4
Turn-On Delay – ms
3.5
3
2.5 3 3.5 4 4.5
3
V
= 5 V
I(IN)
CL = 1 µF TA = 25°C
2.9
TURNON DELAY
vs
INPUT VOLTAGE
VI – Input Voltage – V
Figure 12
RISE TIME
vs
LOAD CURRENT
CL = 1 µF RL = 10 TA = 25°C
5 5.5 6
17
CL = 1 µF RL = 10
16
TA = 25°C
15
14
13
12
Turn-Off Delay – ms
11
10
3
2.5 3 3.5 4 4.5
3.5 V
= 5 V
I(IN)
TA = 25°C CL = 1 µF
3.3
TURNOFF DELAY
vs
INPUT VOLTAGE
5 5.5 6
VI – Input Voltage – V
Figure 13
FALL TIME
vs
LOAD CURRENT
– Rise Time – ms
t
r
10
2.8
2.7
2.6
2.5
0.1 0.2 0.3 0.4 0.5 IL – Load Current – A
Figure 14
– Fall Time – ms
t
f
0.6 0.7 0.8 0.9
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
3.1
2.9
2.7
2.5
0.1 0.2 0.3 0.4 0.5 IL – Load Current – A
Figure 15
0.6 0.7 0.8 0.9
TPS2041, TPS2051
POWER-DISTRIBUTION SWITCHES
SLVS172A –AUGUST 1998 – REVISED APRIL 1999
TYPICAL CHARACTERISTICS
SUPPLY CURRENT, OUTPUT ENABLED
vs
JUNCTION TEMPERATURE
100
Aµ
V
V
I(IN)
I(IN)
= 5 V
V
I(IN)
= 3.3 V
= 4 V
90
80
70
60
– Supply Current, Output Enabled –
I(IN)
I
50
–50 –25 0 25 50
TJ – Junction Temperature – °C
Figure 16
SUPPLY CURRENT, OUTPUT ENABLED
vs
INPUT VOLTAGE
100
Aµ
90
TJ = 85°C
V
= 5.5 V
I(IN)
V
= 2.7 V
I(IN)
75 100 125 150
TJ = 125°C
SUPPLY CURRENT, OUTPUT DISABLED
vs
JUNCTION TEMPERATURE
1000
900
V
V
I(IN)
I(IN)
V
I(IN)
V
I(IN)
= 4 V
= 2.7 V
800 700
600 500 400 300 200
– Supply Current, Output Disabled – nA
100
I(IN)
0
I
–100
–50 –25 0 25 50 75
TJ – Junction Temperature – °C
Figure 17
SUPPLY CURRENT, OUTPUT DISABLED
vs
INPUT VOLTAGE
1000
800
TJ = 125°C
= 5.5 V = 5 V
100 125 150
80
70
TJ = 0°C
60
– Supply Current, Output Enabled –
I(IN)
I
50
2.5 3 3.5 4
TJ = –40°C
VI – Input Voltage – V
Figure 18
4.5
600
400
TJ = 25°C
200
0
– Supply Current, Output Disabled – nA
I(IN)
I
–200
5 5.5 6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
2.5 3 3.5 4 4.5
TJ = 85°C
TJ = –40°C
VI – Input Voltage – V
Figure 19
TJ = 25°C
TJ = 0°C
5 5.5 6
11
TPS2041, TPS2051 POWER-DISTRIBUTION SWITCHES
SLVS172A –AUGUST 1998 – REVISED APRIL 1999
TYPICAL CHARACTERISTICS
STATIC DRAIN-SOURCE ON-STATE RESISTANCE
vs
175
150
125
100
75
– Static Drain-Source On-State Resistance – m
50
–50 –25 0 25 50 75
DS(on)
r
JUNCTION TEMPERATURE
IO = 0.5 A
TJ – Junction Temperature –°C
V
I(IN)
= 2.7 V
V
I(IN)
V
I(IN)
V
I(IN)
100 125 150
Figure 20
INPUT-TO-OUTPUT VOLTAGE
vs
LOAD CURRENT
100
TA = 25°C
= 3.3 V
= 4.5 V = 5 V
STATIC DRAIN-SOURCE ON-STATE RESISTANCE
vs
175
150
125
100
75
– Static Drain-Source On-State Resistance – m
50
DS(on)
2.5 3 3.5 4 4.5
r
INPUT VOLTAGE
IO = 0.5 A
TJ = 125°C
TJ = 85°C
TJ = 25°C
TJ = 0°C
TJ = –40°C
5 5.5 6
VI – Input Voltage – V
Figure 21
SHORT-CURCUIT OUTPUT CURRENT
vs
INPUT VOLTAGE
0.95
– Input-to-Output Voltage – mV
O(OUT)
V
I(IN)
V
12
75
50
25
0
0.1 0.2 0.4
V
I(IN)
IL – Load Current – A
Figure 22
= 3.3 V
V
I(IN)
V
= 2.7 V
I(IN)
V
= 5 V
I(IN)
= 4.5 V
0.5 0.6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
– Short-circuit Output Current – A
OS
I
0.9
0.85
0.8
2.5 3 3.5 4
TJ = –40°C
TJ = 25°C
TJ = 125°C
4.5 5 65.5
VI – Input Voltage – V
Figure 23
TPS2041, TPS2051
POWER-DISTRIBUTION SWITCHES
SLVS172A –AUGUST 1998 – REVISED APRIL 1999
TYPICAL CHARACTERISTICS
1.2 TA = 25°C Load Ramp = 1 A/10 ms
1.175
1.15
Threshold Trip Current – A
1.125
1.1
2.5 3 3.5 4
2.5
2.4
THRESHOLD TRIP CURRENT
vs
INPUT VOLTAGE
4.5 5 65.5
VI – Input Voltage – V
Figure 24
UNDERVOLTAGE LOCKOUT
vs
JUNCTION TEMPERATURE
SHORT CIRCUIT OUTPUT CURRENT
JUNCTION TEMPERATURE
0.95
0.9
V
0.85
– Short-circuit Output Current – A
OS
I
0.8 –50 –25 0 25 50
TJ – Junction Temperature – °C
CURRENT LIMIT RESPONSE
500
450
sµ
400
vs
= 4 V
I(IN)
V
= 2.7 V
I(IN)
Figure 25
vs
PEAK CURRENT
V
= 5 V
I(IN)
75 100 125
V
= 5 V
I(IN)
TA = 25°C
Start Threshold
2.3
Stop Threshold
2.2
2.1
UVLO – Undervoltage Lockout – V
2
–50 –25 0 25 50 75
TJ – Junction Temperature – °C
Figure 26
350 300
250
200 150
Current Limit Response –
100
50
100 125 150
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
0
0 2.5 5 7.5
10 12.5
Peak Current – A
Figure 27
13
TPS2041, TPS2051 POWER-DISTRIBUTION SWITCHES
SLVS172A –AUGUST 1998 – REVISED APRIL 1999
TYPICAL CHARACTERISTICS
OVERCURRENT RESPONSE TIME (OC)
8
6
sµ
4
Response Time –
2
vs
PEAK CURRENT
V
= 5 V
I(IN)
TA = 25°C
0
0 2.5 5 7.5
Peak Current – A
10 12.5
Figure 28
APPLICATION INFORMATION
TPS2041
0.1 µF
2,3
IN
5
OC
4
EN
GND
1
OUT
6,7,8
0.1 µF 22 µF
Load
Power Supply
2.7 V to 5.5 V
Figure 29. Typical Application
power-supply considerations
A 0.01-µF to 0.1-µF ceramic bypass capacitor between INx and GND, close to the device, is recommended. Placing a high-value electrolytic capacitor on the output pin(s) is recommended when the output load is heavy . This precaution reduces power-supply transients that may cause ringing on the input. Additionally , bypassing the output with a 0.01-µF to 0.1-µF ceramic capacitor improves the immunity of the device to short-circuit transients.
14
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TPS2041, TPS2051
POWER-DISTRIBUTION SWITCHES
SLVS172A –AUGUST 1998 – REVISED APRIL 1999
APPLICATION INFORMATION
overcurrent
A sense FET is employed to check for overcurrent conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault is present long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted before the device is enabled or before V and immediately switch into a constant-current output.
In the second condition, the short occurs while the device is enabled. At the instant the short occurs, very high currents may flow for a short time before the current-limit circuit can react. After the current-limit circuit has tripped (reached the overcurrent trip threshhold) the device switches into constant-current mode.
In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the current-limit threshold is reached or until the thermal limit of the device is exceeded (see Figure 7). The TPS2041 and TPS2051 are capable of delivering current up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its constant-current mode.
has been applied (see Figure 6). The TPS2041 and TPS2051 sense the short
I(IN)
OC response
The OC open-drain output is asserted (active low) when an overcurrent or overtemperature condition is encountered. The output will remain asserted until the overcurrent or overtemperature condition is removed. Connecting a heavy capacitive load to an enabled device can cause momentary false overcurrent reporting from the inrush current flowing through the device, charging the downstream capacitor. An RC filter of 500 µs (see Figure 30) can be connected to the OC capacitors on the output lowers the inrush current flow through the device during hot-plug events by providing a low-impedance energy source, thereby reducing erroneous overcurrent reporting.
TPS2041
GND IN IN
EN
OUT OUT OUT
OC
Figure 30. Typical Circuit for OC Pin and RC Filter for Damping Inrush OC Responses
pin to reduce false overcurrent reporting. Using low-ESR electrolytic
V+
R
pullup
GND IN IN
EN
TPS2041
OUT OUT OUT
OC
V+
R
R
filter
pullup
To USB Controller
C
filter
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
15
TPS2041, TPS2051 POWER-DISTRIBUTION SWITCHES
SLVS172A –AUGUST 1998 – REVISED APRIL 1999
APPLICATION INFORMATION
power dissipation and junction temperature
The low on-resistance on the n-channel MOSFET allows small surface-mount packages, such as SOIC, to pass large currents. The thermal resistances of these packages are high compared to those of power packages; it is good design practice to check power dissipation and junction temperature. The first step is to find r the input voltage and operating temperature. As an initial estimate, use the highest operating ambient temperature of interest and read r
P
+
r
D
DS(on
Finally, calculate the junction temperature:
T
+
P
J
Where:
Compare the calculated junction temperature with the initial estimate. If they do not agree within a few degrees, repeat the calculation, using the calculated value as the new estimate. Two or three iterations are generally sufficient to get a reasonable answer.
D
TA = Ambient Temperature °C R
= Thermal resistance SOIC = 172°C/W, PDIP = 106°C/W
θJA
2
I
)
R
)
JA
T
A
q
from Figure 21. Next, calculate the power dissipation using:
DS(on)
DS(on)
at
thermal protection
Thermal protection prevents damage to the IC when heavy-overload or short-circuit faults are present for extended periods of time. The faults force the TPS2041 and TPS2051 into constant current mode, which causes the voltage across the high-side switch to increase; under short-circuit conditions, the voltage across the switch is equal to the input voltage. The increased dissipation causes the junction temperature to rise to high levels. The protection circuit senses the junction temperature of the switch and shuts it off. Hysteresis is built into the thermal sense circuit, and after the device has cooled approximately 20 degrees, the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is removed.
undervoltage lockout (UVLO)
An undervoltage lockout ensures that the power switch is in the off state at powerup. Whenever the input voltage falls below approximately 2 V, the power switch will be quickly turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. The UVLO will also keep the switch from being turned on until the power supply has reached at least 2 V, even if the switch is enabled. Upon reinsertion, the power switch will be turned on, with a controlled rise time to reduce EMI and voltage overshoots.
universal serial bus (USB) applications
The universal serial bus (USB) interface is a 12-Mb/s, or 1.5-Mb/s, multiplexed serial bus designed for low-to-medium bandwidth PC peripherals (e.g., keyboards, printers, scanners, and mice). The four-wire USB interface is conceived for dynamic attach-detach (hot plug-unplug) of peripherals. Two lines are provided for differential data, and two lines are provided for 5-V power distribution.
USB data is a 3.3-V level signal, but power is distributed at 5 V to allow for voltage drops in cases where power is distributed through more than one hub across long cables. Each function must provide its own regulated 3.3 V from the 5-V input or its own internal power supply.
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POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TPS2041, TPS2051
POWER-DISTRIBUTION SWITCHES
SLVS172A –AUGUST 1998 – REVISED APRIL 1999
APPLICATION INFORMATION
The USB specification defines the following five classes of devices, each differentiated by power-consumption requirements:
D
Hosts/self-powered hubs (SPH)
D
Bus-powered hubs (BPH)
D
Low-power, bus-powered functions
D
High-power, bus-powered functions
D
Self-powered functions
Self-powered and bus-powered hubs distribute data and power to downstream functions. The TPS2041 and TPS2051 can provide power-distribution solutions for many of these classes of devices.
host/self-powered and bus-powered hubs
Hosts and self-powered hubs have a local power supply that powers the embedded functions and the downstream ports (see Figure 31). This power supply must provide from 5.25 V to 4.75 V to the board side of the downstream connection under full-load and no-load conditions. Hosts and SPHs are required to have current limit protection and must report overcurrent conditions to the USB controller . T ypical SPHs are desktop PCs, monitors, printers, and stand-alone hubs.
USB
Control
Power Supply
3.3 V 5 V
0.1 µF
2, 3
TPS2041
IN
5
OC
4
EN
GND
OUT
7
0.1 µF 120 µF
Downstream
USB Ports
D+ D–
V
BUS
GND
May need RC Filter (see Figure 34)
Figure 31. One-Port Solution
Bus-powered hubs obtain all power from upstream ports and often contain an embedded function. The hubs are required to power up with less than one unit load. The BPH usually has one embedded function, and power is always available to the controller of the hub. If the embedded function and hub require more than 100 mA on powerup, the power to the embedded function may need to be kept off until enumeration is completed. This can be accomplished by removing power or by shutting off the clock to the embedded function. Power switching the embedded function is not necessary if the aggregate power draw for the function and controller is less than one unit load. The total current drawn by the bus-powered device is the sum of the current to the controller, the embedded function, and the downstream ports, and it is limited to 500 mA from an upstream port.
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
17
TPS2041, TPS2051 POWER-DISTRIBUTION SWITCHES
SLVS172A –AUGUST 1998 – REVISED APRIL 1999
APPLICATION INFORMATION
low-power bus-powered functions and high-power bus-powered functions
Both low-power and high-power bus-powered functions obtain all power from upstream ports; low-power functions always draw less than 100 mA; high-power functions must draw less than 100 mA at powerup and can draw up to 500 mA after enumeration. If the load of the function is more than the parallel combination of 44 and 10 µF at powerup, the device must implement inrush current limiting (see Figure 32).
Power Supply
D+ D–
V
BUS
GND
USB
Control
10 µF
3.3 V
0.1 µF
2,3
TPS2041
IN
5
OC
4
EN
GND
1
OUT
6, 7, 8
0.1 µF 10 µF
Internal Function
Figure 32. High-Power Bus-Powered Function
USB power-distribution requirements
USB can be implemented in several ways, and, regardless of the type of USB device being developed, several powe- distribution features must be implemented.
D
Hosts/self-powered hubs must: – Current-limit downstream ports – Report overcurrent conditions on USB V
D
Bus-powered hubs must: – Enable/disable power to downstream ports – Power up at <100 mA – Limit inrush current (<44 and 10 µF)
D
Functions must: – Limit inrush currents – Power up at <100 mA
The feature set of the TPS2041 and TPS2051 allows them to meet each of these requirements. The integrated current-limiting and overcurrent reporting is required by hosts and self-powered hubs. The logic-level enable and controlled rise times meet the need of both input and output ports on bus-power hubs, as well as the input ports for bus-power functions (see Figure 33).
BUS
18
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TPS2041, TPS2051
POWER-DISTRIBUTION SWITCHES
SLVS172A –AUGUST 1998 – REVISED APRIL 1999
APPLICATION INFORMATION
TUSB2040
Hub Controller
Upstream Port
D +
D –
GND
5 V
TPS2041
OC EN
IN
1 µF
0.1 µF
SN75240
A
B
OUT
4.7 µF
GND
C D
5 V Power
Supply
TPS76333
IN
3.3 V
GND
48-MHz
Crystal
Tuning
Circuit
4.7 µF
DP0 DM0
V
CC
XTAL1
XTAL2
OCSOFF
GND
BUSPWR GANGED
DP1
DM1
DP2
DM2
DP3
DM3
DP4
DM4
PWRON1
OVRCUR1
PWRON2
OVRCUR2
PWRON3
OVRCUR3
PWRON4
OVRCUR4
Tie to TPS2041 EN
TPS2041
EN
OC
EN
OC
EN
OC
EN
OC
IN
OUT
TPS2041
IN
OUT
TPS2041
IN
OUT
TPS2041
IN
OUT
Input
ABC
D
SN75240
ABC
D
SN75240
0.1 µF
0.1 µF
0.1 µF
0.1 µF
Ferrite Beads
Ferrite Beads
Ferrite Beads
Ferrite Beads
Downstream
Ports D +
D – GND
5 V
33 µF
D + D –
GND
5 V
33 µF
D + D –
GND
5 V
33 µF
D + D –
GND
5 V
USB rev 1.1 requires 120 µF per hub.
Figure 33. Hybrid Self/Bus-Powered Hub Implementation
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
33 µF
19
TPS2041, TPS2051 POWER-DISTRIBUTION SWITCHES
SLVS172A –AUGUST 1998 – REVISED APRIL 1999
APPLICATION INFORMATION
generic hot-plug applications (see Figure 34)
In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply normally turns on. Due to the controlled rise times and fall times of the TPS2041 and TPS2051, these devices can be used to provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the TPS2041 and TPS2051 also ensures the switch will be off after the card has been removed, and the switch will be off during the next insertion. The UVLO feature guarantees a soft start with a controlled rise time for every insertion of the card or module.
PC Board
Power
Supply
2.7 V to 5.5 V
1000 µF Optimum
0.1 µF
TPS2041
GND IN IN
EN
OUT OUT OUT
OC
Block of Circuitry
Overcurrent Response
Figure 34. Typical Hot-Plug Implementation
By placing the TPS2041 and TPS2051 between the VCC input and the rest of the circuitry , the input power will reach these devices first after insertion. The typical rise time of the switch is approximately 2.5 ms, providing a slow voltage ramp at the output of the device. This implementation controls system surge currents and provides a hot-plugging mechanism for any device.
20
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TPS2041, TPS2051
POWER-DISTRIBUTION SWITCHES
SLVS172A –AUGUST 1998 – REVISED APRIL 1999
MECHANICAL DATA
D (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PIN SHOWN
0.050 (1,27)
14
1
0.069 (1,75) MAX
A
0.020 (0,51)
0.014 (0,35)
0.010 (0,25)
0.004 (0,10)
DIM
8
7
PINS **
0.010 (0,25)
0.157 (4,00)
0.150 (3,81)
M
0.244 (6,20)
0.228 (5,80)
Seating Plane
0.004 (0,10)
8
14
0.008 (0,20) NOM
0°–8°
16
Gage Plane
0.010 (0,25)
0.044 (1,12)
0.016 (0,40)
A MAX
A MIN
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15). D. Falls within JEDEC MS-012
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
0.197
(5,00)
0.189
(4,80)
0.344
(8,75)
0.337
(8,55)
0.394
(10,00)
0.386
(9,80)
4040047/D 10/96
21
TPS2041, TPS2051 POWER-DISTRIBUTION SWITCHES
SLVS172A –AUGUST 1998 – REVISED APRIL 1999
MECHANICAL DATA
P (R-PDIP-T8) PLASTIC DUAL-IN-LINE PACKAGE
0.400 (10,60)
0.355 (9,02)
58
0.260 (6,60)
0.240 (6,10)
41
0.070 (1,78) MAX
0.020 (0,51) MIN
0.200 (5,08) MAX
0.125 (3,18) MIN
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001
0.010 (0,25)
M
0.310 (7,87)
0.290 (7,37)
Seating Plane
0°–15°
0.010 (0,25) NOM
4040082/B 03/95
22
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
IMPORTANT NOTICE
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TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO BE FULLY AT THE CUSTOMER’S RISK.
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TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
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