Texas Instruments TMX320VC5409PGE100, TMX320VC5409GGU100, TMS320VC5409GGU100, TMS320VC5409GGU-80, TMS320VC5409PGE100 Datasheet

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TMS320VC5409

FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

 Advanced Multibus Architecture With Three

Separate 16-Bit Data Memory Buses and One Program Memory Bus

 40-Bit Arithmetic Logic Unit (ALU),

Including a 40-Bit Barrel Shifter and Two Independent 40-Bit Accumulators

 17- × 17-Bit Parallel Multiplier Coupled to a

40-Bit Dedicated Adder for Non-Pipelined Single-Cycle Multiply/Accumulate (MAC) Operation

 Compare, Select, and Store Unit (CSSU) for

the Add/Compare Selection of the Viterbi Operator

 Exponent Encoder to Compute an

Exponent Value of a 40-Bit Accumulator Value in a Single Cycle

 T wo Address Generators With Eight

Auxiliary Registers and Two Auxiliary Register Arithmetic Units (ARAUs)

 Data Bus With a Bus-Holder Feature  Extended Addressing Mode for 8M × 16-Bit

Maximum Addressable External Program Space

 16K x 16-Bit On-Chip ROM  32K x 16-Bit Dual-Access On-Chip RAM  Single-Instruction-Repeat and

Block-Repeat Operations for Program Code

 Block-Memory-Move Instructions for Better

Program and Data Management

 Instructions With a 32-Bit Long Word

Operand

 Instructions With Two- or Three-Operand

Reads

 Arithmetic Instructions With Parallel Store

and Parallel Load

 Conditional Store Instructions  Fast Return From Interrupt  On-Chip Peripherals

– Software-Programmable Wait-State

Generator and Programmable Bank Switching

– On-Chip Phase-Locked Loop (PLL) Clock

Generator With Internal Oscillator or External Clock Source

– Three Multichannel Buffered Serial Ports

(McBSPs)

– Enhanced 8-Bit Parallel Host-Port

Interface With 16-Bit Data/Addressing – One 16-Bit Timer – Six-Channel Direct Memory Access

(DMA) Controller

 Power Consumption Control With IDLE1,

IDLE2, and IDLE3 Instructions With Power-Down Modes

 CLKOUT Off Control to Disable CLKOUT  On-Chip Scan-Based Emulation Logic,

IEEE Std 1149.1† (JTAG) Boundary Scan Logic

 12.5-ns Single-Cycle Fixed-Point

Instruction Execution Time (80 MIPS) for

3.3-V Power Supply (1.8-V Core)

 10-ns Single-Cycle Fixed-Point Instruction

Execution Time (100 MIPS) for 3.3-V Power Supply (1.8-V Core)

 Available in a 144-Pin Plastic Thin Quad

Flatpack (TQFP) (PGE Suffix) and a 144-Pin Ball Grid Array (BGA) (GGU Suffix)

NOTE:This data sheet is designed to be used in conjunction with the

TMS320C5000 DSP Family Functional Overview

(literature number SPRU307).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

†

IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

TMS320VC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

Table of Contents

Internal Oscillator with External Crystal 40. . . . . . . .

Divide-by-Two/Divide-by-Four Clock Option 41. . . .

Multiply-by-N Clock Option 42. . . . . . . . . . . . . . . . . . .

Memory and Parallel I/O Interface Timing 43. . . . . .

Timing For Externally Generated Wait States 49. . . HOLD

and HOLDA Timings 53. . . . . . . . . . . . . . . . . .

Reset, BIO

, Interrupt, and MP/MC Timings 55. . . . .

Instruction Acquisition (IAQ

), Interrupt

Acknowledge (IACK

), External Flag (XF),

and TOUT Timings 57. . . . . . . . . . . . . . . . . . . . .

Multichannel Buffered Serial Port Timing 59. . . . . . .

HPI8 Timing 67. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

HPI16 Timing 72. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Mechanical Data 76. . . . . . . . . . . . . . . . . . . . . . . . . . .

Description 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Pin Assignments 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Terminal Functions 6. . . . . . . . . . . . . . . . . . . . . . . . . . .

Memory 1 1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

On-chip Peripherals 15. . . . . . . . . . . . . . . . . . . . . . . . . .

Memory-mapped Registers 30. . . . . . . . . . . . . . . . . . . .

McBSP Control Registers And Subaddresses 33. . . .

DMA Subbank Addressed Registers 33. . . . . . . . . . . .

Interrupts 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Documentation Support 37. . . . . . . . . . . . . . . . . . . . . . .

Absolute Maximum Ratings 38. . . . . . . . . . . . . . . . . . .

Recommended Operating Conditions 38. . . . . . . . . . .

Electrical Characteristics 39. . . . . . . . . . . . . . . . . . . . . .

Parameter Measurement Information 39. . . . . . . . . . . .

description

The TMS320VC5409 fixed-point, digital signal processor (DSP) (hereafter referred to as the ’5409 unless otherwise specified) is based on an advanced modified Harvard architecture that has one program memory bus and three data memory buses. This processor provides an arithmetic logic unit (ALU) with a high degree of parallelism, application-specific hardware logic, on-chip memory , and additional on-chip peripherals. The basis of the operational flexibility and speed of this DSP is a highly specialized instruction set.

Separate program and data spaces allow simultaneous access to program instructions and data, providing the high degree of parallelism. Two read operations and one write operation can be performed in a single cycle. Instructions with parallel store and application-specific instructions can fully utilize this architecture. In addition, data can be transferred between data and program spaces. Such parallelism supports a powerful set of arithmetic, logic, and bit-manipulation operations that can all be performed in a single machine cycle. In addition, the ’5409 includes the control mechanisms to manage interrupts, repeated operations, and function calls.

TMS320VC5409

FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

HDS1

A18 A17 V

A16 D5 D4 D3 D2 D1 D0 RS X2/CLKIN X1 HD3 CLKOUT V

HPIENA CV

TMS TCK TRST TDI TDO EMU1/OFF EMU0 TOUT HD2 HPI16 CLKMD3 CLKMD2 CLKMD1 V

BDX1 BFSX1

A22

A10

HD7

A11 A12 A13 A14 A15

HAS V

HCS

HR/W

READY

R/W

MSTRB

IOSTRB

MSC

HOLDA

IAQ

HOLD

BIO

MP/MC

BDR1

BFSR1

144

A21

143

142

141A8140A7139A6138A5137A4136

HD6

135A3134A2133A1132A0131DV130

129

128

127

126

125

HD5

124

D15

123

D14

122

D13

121

HD4

120

D12

119

D11

118

117D9116D8115D7114D6113

112

373839404142434445464748495051525354555657585960616263646566676869

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36

108 107 106 105 104 103 102 101 100

99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73

BCLKR1

HCNTL0SSBCLKR0

BCLKR2

BFSR0

BFSR2

BDR0

HCNTL1

BDR2

BCLKX0

BCLKX2

HD0

BDX0

BDX2

IACK

HBIL

NMI

INT0

INT1

INT2

INT3

HD1

HRDY

HINT

111

110

A19

109

707172

BCLKX1

D10

A20

HDS2SSV

TMS320VC5409 PGE PACKAGE

†‡

(TOP VIEW)

BFSX0

BFSX2

NOTE: DVDD is the power supply for the I/O pins while CVDD is the power supply for the core CPU. VSS is the ground for both the I/O pins and

the core CPU.

The TMS320VC5409PGE (144-pin TQFP) package is footprint-compatible with the ’LC548, ’LC/VC549, and ’VC5410 devices.

TMS320VC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

TMS320VC5409 GGU PACKAGE

(BOTTOM VIEW)

A B

E F

H J

L M

3456781012 1113 9

The pin assignments table to follow lists each signal quadrant and BGA ball number for the TMS320VC5409GGU (144-pin BGA package) which is footprint-compatible with the ’LC548, ’LC/VC549, and ’VC5410 devices.

TMS320VC5409

FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

Pin Assignments for the TMS320VC5409GGU (144-Pin BGA Package)

†

SIGNAL

QUADRANT 1

BGA BALL #

SIGNAL

QUADRANT 2

BGA BALL #

SIGNAL

QUADRANT 3

BGA BALL #

SIGNAL

QUADRANT 4

BGA BALL #

A1 BFSX1 N13 V

N1 A19 A13 A22 B1 BDX1 M13 BCLKR1 N2 A20 A12 V

C2 DV

L12 HCNTL0 M3 V

B11

C1 V

L13 V

N3 DV

A11 A10 D4 CLKMD1 K10 BCLKR0 K4 D6 D10 HD7 D3 CLKMD2 K11 BCLKR2 L4 D7 C10 A11 D2 CLKMD3 K12 BFSR0 M4 D8 B10 A12 D1 HPI16 K13 BFSR2 N4 D9 A10 A13 E4 HD2 J10 BDR0 K5 D10 D9 A14 E3 TOUT J11 HCNTL1 L5 D11 C9 A15 E2 EMU0 J12 BDR2 M5 D12 B9

E1 EMU1/OFF J13 BCLKX0 N5 HD4 A9 HAS F4 TDO H10 BCLKX2 K6 D13 D8 V

F3 TDI H11 V

L6 D14 C8

F2 TRST H12 HINT M6 D15 B8

F1 TCK H13 CV

N6 HD5 A8

HCS G2 TMS G12 BFSX0 M7 CV

HR/W G1 V

G13 BFSX2 N7 V

READY G3 CV

G11 HRDY L7 HDS1 C7

PS G4 HPIENA G10 DV

K7 V

DS H1 V

F13 V

N8 HDS2 A6

IS H2 CLKOUT F12 HD0 M8 DV

R/W H3 HD3 F11 BDX0 L8 A0 C6

MSTRB H4 X1 F10 BDX2 K8 A1 D6

IOSTRB J1 X2/CLKIN E13 IACK N9 A2 A5

MSC J2 RS E12 HBIL M9 A3 B5

XF J3 D0 E11 NMI L9 HD6 C5

HOLDA J4 D1 E10 INT0 K9 A4 D5

IAQ K1 D2 D13 INT1 N10 A5 A4

HOLD K2 D3 D12 INT2 M10 A6 B4

BIO K3 D4 D11 INT3 L10 A7 C4

MP/MC L1 D5 C13 CV

N11 A8 A3

L2 A16 C12 HD1 M11 A9 B3 V

L3 V

C11 V

L11 CV

BDR1 M1 A17 B13 BCLKX1 N12 A21 A2

BFSR1 M2 A18 B12 V

M12 V

†

DVDD is the power supply for the I/O pins while CVDD is the power supply for the core CPU. VSS is the ground for both the I/O pins and the core CPU.

TMS320VC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

terminal functions

The ’5409 signal descriptions table lists each pin name, function, and operating mode(s) for the ’5409 device. Some of the ’5409 pins can be configured for one of two functions; a primary function and a secondary function. The names of these pins in secondary mode are shaded in grey in the following table.

Terminal Functions

TERMINAL

INTERNAL

TERMINAL

NAME

PIN STATE

I/O

†

DESCRIPTION

DATA SIGNALS

A22 (MSB) A21 A20 A19 A18 A17 A16 A15 A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 (LSB)

Bus holders

available (A15–A0)

O/Z

Parallel address bus A22 [most significant bit (MSB)] through A0 [least significant bit (LSB)]. The lower sixteen address pins (A15 to A0) are multiplexed to address all external memory (program, data) or I/O while the upper seven address pins (A22 to A16) are only used to address external program space. These pins are placed in the high-impedance state when the hold mode is enabled, or when OFF

is low.

D15 (MSB) D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 (LSB)

Bus holders

available

I/O/Z

Parallel data bus D15 (MSB) through D0 (LSB). The sixteen data pins (D15 to D0) are multiplexed to transfer data between the core CPU and external data/program memory or I/O devices. The data bus is placed in the high-impedance state when not outputting or when RS

or HOLD is asserted.

The data bus also goes into the high-impedance state when OFF

is low.

The data bus has bus holders to reduce the static power dissipation caused by floating, unused pins. These bus holders also eliminate the need for external bias resistors on unused pins. When the data bus is not being driven by the ’5409, the bus holders keep the pins at the previous logic level. The data bus holders on the ’5409 are disabled at reset and can be enabled/disabled via the BH bit of the bank-switching control register (BSCR).

INITIALIZATION, INTERRUPT, AND RESET OPERATIONS

IACK

O/Z

Interrupt acknowledge signal. IACK indicates receipt of an interrupt and that the program counter is fetching the interrupt vector location designated by A15–A0. IACK

also goes into the

high-impedance state when OFF

is low.

INT0 INT1 INT2 INT3

Schmitt

trigger

External user interrupts. INT0–INT3 are prioritized and are maskable by the interrupt mask register and the interrupt mode bit. INT0

–INT3 can be polled and reset by way of the interrupt flag register .

†

I = Input, O = Output, Z = High-impedance, S = Supply

TMS320VC5409

FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

Terminal Functions (Continued)

TERMINAL

NAME

DESCRIPTIONI/O

†

INTERNAL

TERMINAL

NAME

DESCRIPTIONI/O

†

PIN STATE

INITIALIZATION, INTERRUPT, AND RESET OPERATIONS (CONTINUED)

NMI

Schmitt

trigger

Nonmaskable interrupt. NMI is an external interrupt that cannot be masked by way of the INTM or the IMR. When NMI

is activated, the processor traps to the appropriate vector location.

Schmitt

trigger

Reset. RS causes the DSP to terminate execution and causes a reinitialization of the CPU and peripherals. When RS

is brought to a high level, execution begins at location 0FF80h of program

memory. RS

affects various registers and status bits.

MP/MC I

Microprocessor/microcomputer mode select. If active low at reset, microcomputer mode is selected, and the internal program ROM is mapped into the upper program memory space. If the pin is driven high during reset, microprocessor mode is selected, and the on-chip ROM is removed from program space. MP/MC

is only sampled at reset, and the MP/MC bit of the PMST register can

override the mode that is selected at reset.

MULTIPROCESSING SIGNALS

BIO

Schmitt

trigger

Branch control. A branch can be conditionally executed when BIO is active. If low, the processor executes the conditional instruction. For the XC instruction, the BIO

condition is sampled during

the decode phase of the pipeline; all other instructions sample BIO

during the read phase of the

pipeline.

XF O/Z

External flag output (latched software-programmable signal). XF is set high by the SSBX XF instruction, set low by the RSBX XF instruction or by loading ST1. XF is used for signaling other processors in multiprocessor configurations or used as a general-purpose output pin. XF goes into the high-impedance state when OFF

is low, and is set high at reset.

MEMORY CONTROL SIGNALS

DS PS IS

O/Z

Data, program, and I/O space select signals. DS, PS, and IS are always high unless driven low for accessing a particular external memory space. Active period corresponds to valid address information. DS

, PS, and IS are placed into the high-impedance state in the hold mode; the signals

also go into the high-impedance state when OFF

is low.

MSTRB O/Z

Memory strobe signal. MSTRB is always high unless low-level asserted to indicate an external bus access to data or program memory. MSTRB

is placed in the high-impedance state in the hold mode;

it also goes into the high-impedance state when OFF

is low.

READY I

Data ready. READY indicates that an external device is prepared for a bus transaction to be completed. If the device is not ready (READY is low), the processor waits one cycle and checks READY again. Note that the processor performs ready detection if at least two software wait states are programmed. The READY signal is not sampled until the completion of the software wait states.

R/W O/Z

Read/write signal. R/W indicates transfer direction during communication to an external device. R/W

is normally in the read mode (high), unless it is asserted low when the DSP performs a write

operation. R/W

is placed in the high-impedance state in hold mode; it also goes into the

high-impedance state when OFF

is low.

IOSTRB O/Z

I/O strobe signal. IOSTRB is always high unless low-level asserted to indicate an external bus access to an I/O device. IOSTRB

is placed in the high-impedance state in the hold mode; it also

goes into the high-impedance state when OFF

is low.

HOLD I

Hold. HOLD is asserted to request control of the address, data, and control lines. When acknowledged by the ’C54x, these lines go into the high-impedance state.

HOLDA O/Z

Hold acknowledge. HOLDA indicates that the ’5409 is in a hold state and that the address, data, and control lines are in the high-impedance state, allowing the external memory interface to be accessed by other devices. HOLDA

also goes into the high-impedance state when OFF is low.

MSC O/Z

Microstate complete. MSC indicates completion of all software wait states. When two or more software wait states are enabled, the MSC

pin goes low during the last of these wait states. If

connected to the READY input, MSC

forces one external wait state after the last internal wait state

is completed. MSC

also goes into the high-impedance state when OFF is low.

IAQ O/Z

Instruction acquisition signal. IAQ is asserted (active low) when there is an instruction address on the address bus. IAQ

goes into the high-impedance state when OFF is low.

†

I = Input, O = Output, Z = High-impedance, S = Supply

TMS320VC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

Terminal Functions (Continued)

TERMINAL

NAME

DESCRIPTIONI/O

†

INTERNAL

TERMINAL

NAME

DESCRIPTIONI/O

†

PIN STATE

OSCILLATOR/TIMER SIGNALS

CLKOUT O/Z

Master clock output signal. CLKOUT cycles at the machine-cycle rate of the CPU. The internal machine cycle is bounded by rising edges of this signal. CLKOUT also goes into the high-impedance state when OFF

is low.

CLKMD1 CLKMD2 CLKMD3

Schmitt

trigger

Clock mode select signals. These inputs select the mode that the clock generator is initialized to after reset. The logic levels of CLKMD1–CLKMD3 are latched when the reset pin is low, and the clock mode register is initialized to the selected mode. After reset, the clock mode can be changed through software, but the clock mode select signals have no effect until the device is reset again.

X2/CLKIN

Schmitt

trigger

Clock/oscillator input. If the internal oscillator is not being used, X2/CLKIN functions as the clock input.

X1 O

Output pin from the internal oscillator for the crystal. If the internal oscillator is not used, X1 should be left unconnected. X1 does not go into the high-impedance state when OFF

is low.

TOUT O/Z

Timer output. TOUT signals a pulse when the on-chip timer counts down past zero. The pulse is one CLKOUT cycle wide. TOUT also goes into the high-impedance state when OFF

is low.

MULTICHANNEL BUFFERED SERIAL PORT SIGNALS

BCLKR0 BCLKR1 BCLKR2

Schmitt

trigger

I/O/Z

Receive clocks. BCLKR serves as the serial shift clock for the buffered serial-port receiver. Input from an external clock source for clocking data into the McBSP. When not being used as a clock, these pins can be used as general-purpose I/O by setting RIOEN = 1.

BCLKR can be configured as an output by the way of the CLKRM bit in the PCR register.

BDR0 BDR1 BDR2

Buffered serial data receive (input) pin. When not being used as data-receive pins, these pins can be used as general-purpose I/O by setting RIOEN = 1.

BFSR0 BFSR1 BFSR2

I/O/Z

Frame synchronization pin for buffered serial-port input data. The BFSR pulse initiates the receive-data process over the BDR pin.

When not being used as data-receive synchronization pins,

these pins can be used as general-purpose I/O by setting RIOEN = 1.

BCLKX0 BCLKX1 BCLKX2

Schmitt

trigger

I/O/Z

Transmit clocks. Clock signal used to clock data from the transmit register. This pin can also be configured as an input by setting the CLKXM = 0 in the PCR register. When not being used as a clock, these pins can be used as general-purpose I/O by setting XIOEN = 1.

These pins are placed into the high-impedance state when OFF

is low.

BDX0 BDX1 BDX2

O/Z

Buffered serial-port transmit (output) pin. When not being used as data-transmit pins, these pins can be used as general-purpose I/O by setting XIOEN = 1.

These pins are placed into the high-impedance state when OFF

is low.

BFSX0 BFSX1 BFSX2

I/O/Z

Buffered serial-port frame synchronization pin for transmitting data. The BFSX pulse initiates the transmit-data process over BDX pin. If RS

is asserted when BFSX is configured as output, then

BFSX is turned into input mode by the reset operation.

When not being used as data-transmit

synchronization pins, these pins can be used as general-purpose I/O by setting XIOEN = 1.

These pins are placed into the high-impedance state when OFF

is low.

†

I = Input, O = Output, Z = High-impedance, S = Supply

TMS320VC5409

FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

Terminal Functions (Continued)

TERMINAL

NAME

DESCRIPTIONI/O

†

INTERNAL

TERMINAL

NAME

DESCRIPTIONI/O

†

PIN STATE

HOST-PORT INTERFACE SIGNALS

SECONDARY

PRIMARY

HA15 – HA0

Bus holders

available

I/O/Z A15 – A0 O/Z

These pins can be used to address internal memory via the HPI when the HPI16 pin is high. The sixteen address pins, A15 to A0, are multiplexed to transfer address between the core CPU and external data/program memory , I/O devices, or HPI in 16-bit mode.

The address bus includes bus holders to reduce the static power dissipation caused by floating, unused pins. The bus holders also eliminate the need for external bias resistors on unused pins. When the address bus is not being driven by the ’5409, the bus holders keep the pins at the logic level that was most recently driven. The address bus holders of the ’5409 are disabled at reset, and can be enabled/disabled via the HBH bit of the BSCR.

HD15 – HD0

Bus holders

available

I/O/Z D15 – D0 O/Z

These pins can be used to read/write internal memory via the HPI when the HPI16 pin is high. The sixteen data pins, D15 to D0, are multiplexed to transfer data between the core CPU and external data/program memory , I/O devices, or HPI in 16-bit mode. The data bus is placed in the high-impedance state when not outputting or when RS

or HOLD is asserted. The data bus also goes into the

high-impedance state when OFF

is low.

The data bus includes bus holders to reduce the static power dissipation caused by floating, unused pins. The bus holders also eliminate the need for external bias resistors on unused pins. When the data bus is not being driven by the ’5409, the bus holders keep the pins at the logic level that was most recently driven. The data bus holders of the ’5409 are disabled at reset, and can be enabled/disabled via the BH bit of the BSCR.

HD7 – HD0

Bus holders

available

I/O/Z

Parallel bidirectional data bus. When the HPI is disabled or when the HPI16 pin is high, these pins can also be used as general-purpose I/O pins. HD7–HD0 are placed in the high-impedance state when not outputting data or when OFF

is low.

The HPI data bus includes bus holders to reduce the static power dissipation caused by floating, unused pins. When the HPI data bus is not being driven by the ’5409, the bus holders keep the pins at the logic level that was most recently driven. The HPI data bus holders are disabled at reset. In 8-bit mode the bus holders can be enabled/disabled via the HBH bit of the BSCR. In 16-bit mode the bus holders are always active on the HD7–HD0 pins.

HCNTL0 HCNTL1

Pullup

resistor

Control. HCNTL0 and HCNTL1 select a host access to one of the three HPI registers. The control inputs have internal pullup resistors that are only enabled when HPIENA = 0.

HBIL

Pullup

resistor

Byte identification. HBIL identifies the first or second byte of transfer. The HBIL input has an internal pullup resistor that is only enabled when HPIENA = 0.

HCS

Schmitt

trigger/pullup

resistor

Chip select. HCS is the select input for the HPI and must be driven low during accesses. The chip-select input has an internal pullup resistor that is only enabled when HPIENA = 0.

HDS1 HDS2

Schmitt

trigger/pullup

resistor

Data strobe. HDS1 and HDS2 are driven by the host read and write strobes to control transfers. The strobe inputs have internal pullup resistors that are only enabled when HPIENA = 0.

HAS

Schmitt

trigger/pullup

resistor

Address strobe. Hosts with multiplexed address and data pins require HAS to latch the address in the HPIA register. HAS

has an internal pullup resistor that is only enabled when HPIENA = 0.

†

I = Input, O = Output, Z = High-impedance, S = Supply

TMS320VC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

Terminal Functions (Continued)

TERMINAL

NAME

DESCRIPTIONI/O

†

INTERNAL

TERMINAL

NAME

DESCRIPTIONI/O

†

PIN STATE

HOST-PORT INTERFACE SIGNALS (CONTINUED)

HR/W

Pullup

resistor

Read/write. HR/W controls the direction of an HPI transfer. R/W has an internal pullup resistor that is only enabled when HPIENA = 0.

HRDY O/Z

Ready. The ready output informs the host when the HPI is ready for the next transfer . HRDY goes into the high-impedance state when OFF

is low.

HINT O/Z

Interrupt. This output is used to interrupt the host. When the DSP is in reset, HINT is driven high. The signal goes into the high-impedance state when OFF is low.

HPIENA

Pulldown

resistor

HPI module select. HPIENA must be driven high during reset to enable the HPI. An internal pulldown resistor is always active and the HPIENA pin is sampled on the rising edge of RS

. If HPIENA is left open or is driven low during reset, the HPI module is disabled. Once the HPI is disabled, the HPIENA pin has no effect until the ’5409 is reset.

HPI16

Pulldown

resistor

HPI 16-bit select pin (internal pulldown, default HPI8). HPI16 = 1 selects the non-multiplexed mode. The non-multiplexed mode allows hosts with separate address/data buses to access the HPI address range via the 16 address pins (A15–A0). 16-bit data is also accessible through pins D0 through D15. Host-to-DSP and DSP-to-Host interrupts are not supported. There are no HPIC and HPIA register accesses in the non-multiplexed mode.

The HPI16 pin is sampled at RESET . The user should never change the value of the HPI16 pin while the RESET signal is HIGH.

SUPPLY PINS

S +VDD. Dedicated 1.8-V power supply for the core CPU

S +VDD. Dedicated 3.3-V power supply for the I/O pins

S Ground

TEST PINS

TCK

Schmitt

trigger/pullup

resistor

IEEE standard 1149.1 test clock. TCK is normally a free-running clock signal with a 50% duty cycle. The changes on the test access port (TAP) of input signals TMS and TDI are clocked into the T AP controller, instruction register , or selected test data register on the rising edge of TCK. Changes at the TAP output signal (TDO) occur on the falling edge of TCK.

TDI

Pullup

resistor

IEEE standard 1149.1 test data input pin with internal pullup device. TDI is clocked into the selected register (instruction or data) on a rising edge of TCK.

TDO O/Z

IEEE standard 1149.1 test data output. The contents of the selected register (instruction or data) are shifted out of TDO on the falling edge of TCK. TDO is in the high-impedance state except when the scanning of data is in progress. TDO also goes into the high-impedance state when OFF

is low.

TMS

Pullup

resistor

IEEE standard 1149.1 test mode select. Pin with internal pullup device. This serial control input is clocked into the TAP controller on the rising edge of TCK.

TRST

Pulldown

resistor

IEEE standard 1149.1 test reset. TRST, when high, gives the IEEE standard 1149.1 scan system control of the operations of the device. If TRST

is not connected or is driven low, the device operates in its functional mode, and the IEEE standard 1149.1 signals are ignored. Pin with internal pulldown device.

†

I = Input, O = Output, Z = High-impedance, S = Supply

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Terminal Functions (Continued)

TERMINAL

NAME

DESCRIPTIONI/O

†

INTERNAL

TERMINAL

NAME

DESCRIPTIONI/O

†

PIN STATE

TEST PINS (CONTINUED)

EMU0 I/O/Z

Emulator 0 pin. When TRST is driven low, EMU0 must be high for activation of the OFF condition. When TRST

is driven high, EMU0 is used as an interrupt to or from the emulator system and is

defined as input/output by way of the IEEE standard 1 149.1 scan system.

EMU1/OFF I/O/Z

Emulator 1 pin/disable all outputs. When TRST is driven high, EMU1/OFF is used as an interrupt to or from the emulator system and is defined as input/output by way of the IEEE standard 1149.1 scan system. When TRST

is driven low, EMU1/OFF is configured as OFF. The EMU1/OFF signal,

when active low, puts all output drivers into the high-impedance state. Note that OFF

is used exclusively for testing and emulation purposes (not for multiprocessing applications). Therefore, for the OFF

feature, the following apply:

TRST

= low EMU0 = high EMU1/OFF

= low

†

I = Input, O = Output, Z = High-impedance, S = Supply

memory

The ’5409 device provides both on-chip ROM and RAM memories to aid in system performance and integration.

on-chip ROM with bootloader

A bootloader is available in the standard ’5409 on-chip ROM. This bootloader can be used to automatically transfer user code from an external source to anywhere in the program memory at power up. If the MP/MC pin is sampled low during a hardware reset, execution begins at location FF80h of the on-chip ROM. This location contains a branch instruction to the start of the bootloader program. The standard ’5409 bootloader provides different ways to download the code to accommodate various system requirements:

 Parallel from 8-bit or 16-bit-wide EPROM  Parallel from I/O space 8-bit or 16-bit mode  Serial boot from serial ports 8-bit or 16-bit mode  Host-port interface boot  SPI serial EEPROM 8-bit boot mode

The standard on-chip ROM layout is shown in Table 1.

on-chip memory security

The ’5409 features a 16K-word

× 16-bit on-chip maskable ROM. Customers can arrange to have the ROM of

the ’5409 programmed with contents unique to any particular application. A security option is available to protect a custom ROM. The ROM and ROM/RAM security options are available on the ’5409. These security options are described in the

TMS320C54x DSP CPU and Peripherals Reference Set, Volume 1

(literature number

SPRU131). When the security options are enabled, JTAG emulation is inhibited or nonfunctional.

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on-chip ROM with bootloader (continued)

Table 1. Standard On-Chip ROM Layout

†

ADDRESS RANGE DESCRIPTION

0x0000h – 0xBFFFh External program space 0xC000h – 0xF7FFh Reserved 0xF800h – 0xFBFFh Bootloader

0xFC00h – 0xFEFFh Reserved

0xFF00h – 0xFF7Fh Reserved

†

0xFF80h – 0xFFFFh Interrupt vector table

†

In the ’VC5409 ROM, 128 words are reserved for factory device-testing purposes. Application code to be implemented in on-chip ROM must reserve these 128 words at addresses FF00h–FF7Fh in program space.

on-chip RAM

The ’5409 device contains 32K × 16-bit of on-chip dual-access RAM (DARAM). The DARAM is composed of four blocks of 8K words each. Each block in the DARAM can support two reads in one cycle, or a read and a write in one cycle. The DARAM is located in the address range 0080h–7FFFh in data space, and can be mapped into program/data space by setting the OVLY bit to one.

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memory map

Page 0 Program

Hex

Data

On-Chip

DARAM

†

(OVLY = 1)

External

(OVLY = 0)

MP/MC

= 0

(Microcomputer Mode)

MP/MC= 1

(Microprocessor Mode)

0000

007F 0080

FFFF

Reserved

(OVLY = 1)

External

(OVLY = 0)

Interrupts (External)

FF80

Memory-

Mapped

Registers

On-Chip

DARAM

†

(32K words)

ROM

(DROM=1)

or External

(DROM=0)

0080

FFFF

Hex

0000

FF7F

FF00

FEFF

BFFF

C000

FFFF

0060

007F

0000

Hex

Page 0 Program

External

Scratch-Pad

RAM

Reserved

(DROM=1)

or External

(DROM=0)

005F

Reserved

(OVLY = 1)

External

(OVLY = 0)

007F 0080

On-Chip

DARAM

†

(OVLY = 1)

External

(OVLY = 0)

FF80

FEFF

BFFF

C000

External

On-Chip ROM

(16K Words)

Interrupts (On-Chip)

7FFF

8000

FF00 FF7F

Reserved

†

DARAM0= 0060h – 1FFFh, DARAM1= 2000h – 3FFFh DARAM2= 4000h – 5FFFh, DARAM3= 6000h – 7FFFh

Figure 1. Memory Map

relocatable interrupt vector table

The reset, interrupt, and trap vectors are addressed in program space. These vectors are soft — meaning that the processor, when taking the trap, loads the program counter (PC) with the trap address and executes the code at the vector location. Four words are reserved at each vector location to accommodate a delayed branch instruction, either two 1-word instructions or one 2-word instruction, which allows branching to the appropriate interrupt service routine with minimal overhead.

At device reset, the reset, interrupt, and trap vectors are mapped to address FF80h in program space. However, these vectors can be remapped to the beginning of any 128-word page in program space after device reset. This is done by loading the interrupt vector pointer (IPTR) bits in the PMST register with the appropriate 128-word page boundary address. After loading IPTR, any user interrupt or trap vector is mapped to the new 128-word page.

NOTE:The hardware reset (RS) vector cannot be remapped because a hardware reset loads the IPTR with 1s. Therefore, the reset vector is always fetched at location FF80h in program space.

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extended program memory

The ’5409 CPU uses a paged extended memory scheme in program space to allow access of up to 8M program memory locations. In order to implement this scheme, the ’5409 includes several features that are also present on the ’548/’549 devices:

 Twenty-three address lines, instead of sixteen  An extra memory-mapped register, the XPC register defines the page selection. This register is

memory-mapped into data space to address 001Eh. At a hardware reset, the XPC is initialized to 0.

 Six extra instructions for addressing extended program space. These six instructions affect the XPC.

–

FB[D]

pmad (23 bits) – Far branch

–

FBACC[D]

Accu[22:0] – Far branch to the location specified by the value in accumulator A or

accumulator B

–

FCALL[D]

pmad (23 bits) – Far call

–

FCALA[D]

Accu[22:0] – Far call to the location specified by the value in accumulator A or accumulator B

–

FRET[D]

– Far return

–

FRETE[D]

– Far return with interrupts enabled

 In addition to these new instructions, two ’54x instructions are extended to use 23 bits in the ’5409:

– READA data_memory (using 23-bit accumulator address) – WRITA data_memory (using 23-bit accumulator address)

All other instructions, software interrupts, and hardware interrupts do not modify the XPC register and access only memory within the current page.

Program memory in the ’5409 is organized into 127 pages that are each 64K in length, as shown in Figure 2.

00 0000

Page 0

64K

†

1 0000

1 7FFF

Page 1

Lower

32K

‡

External

2 0000

2 7FFF

Page 2

Lower

32K

‡

External

. . .

7F 0000

7F 7FFF

Page 127

Lower

32K

‡

External

0 FFFF

1 8000

1 FFFF

Page 1

Upper

32K

External

2 8000

2 FFFF

Page 2

Upper

32K

External

. . .

7F 8000

7F FFFF

Page 127

Upper

32K

External

†

Refer to Figure 1. 5409 Memory Map.

‡

The Lower 32K words of pages 1 through 126 are available only when the OVLY bit is cleared to 0. If the OVL Y bit is set to 1, the on-chip RAM is mapped to the lower 32K words of all program space pages.

Figure 2. Extended Program Memory

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on-chip peripherals

The ’5409 device has the following peripherals:

 Software-programmable wait-state generator with programmable bank-switching wait states  An enhanced 8-bit host-port interface (HPI8/16) with 16-bit data/addressing  Three multichannel buffered serial ports (McBSPs)  One hardware timer  A clock generator with a phase-locked loop (PLL)  A direct memory access (DMA) controller

software-programmable wait-state generator

The software wait-state generator of the ’5409 is similar to that of the ’5410 and it can extend external bus cycles by up to fourteen machine cycles. Devices that require more than fourteen wait states can be interfaced using the hardware READY line. When all external accesses are configured for zero wait states, the internal clocks to the wait-state generator are automatically disabled. Disabling the wait-state generator clocks reduces the power consumption of the ’5409.

The software wait-state register (SWWSR) controls the operation of the wait-state generator. The 14 LSBs of the SWWSR specify the number of wait states (0 to 7) to be inserted for external memory accesses to five separate address ranges. This allows a different number of wait states for each of the five address ranges. Additionally, the software wait-state multiplier (SWSM) bit of the system configuration register (SCR) defines a multiplication factor of 1 or 2 for the number of wait states. At reset, the wait-state generator is initialized to provide seven wait states on all external memory accesses. The SWWSR bit fields are shown in Figure 3 and described in Table 2.

XPA I/O Data Data Program Program

14 12 11 9 8 6 5 3 2 015

R/W-111R/W-0 R/W-111 R/W-111 R/W-111 R/W-111

LEGEND: R = Read, W = Write

Figure 3. Software Wait-State Register (SWWSR) [Memory-Mapped Register (MMR) Address 0028h]

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software-programmable wait-state generator (continued)

Table 2. Software Wait-State Register (SWWSR) Bit Fields

BIT

RESET

NO. NAME

RESET

VALUE

FUNCTION

15 XPA 0

Extended program address control bit. XP A is used in conjunction with the program space fields (bits 0 through 5) to select the address range for program space wait states.

14–12 I/O 1

I/O space. The field value (0–7) corresponds to the base number of wait states for I/O space accesses within addresses 0000–FFFFh. The SWSM bit of the SWCR defines a multiplication factor of 1 or 2 for the base number of wait states.

11–9 Data 1

Upper data space. The field value (0–7) corresponds to the base number of wait states for external data space accesses within addresses 8000–FFFFh. The SWSM bit of the SWCR defines a multiplication factor of 1 or 2 for the base number of wait states.

8–6 Data 1

Lower data space. The field value (0–7) corresponds to the base number of wait states for external data space accesses within addresses 0000–7FFFh. The SWSM bit of the SWCR defines a multiplication factor of 1 or 2 for the base number of wait states.

5–3 Program 1

Upper program space. The field value (0–7) corresponds to the base number of wait states for external program space accesses within the following addresses:

 XPA = 0: x8000 – xFFFFh  XPA = 1: The upper program space bit field has no effect on wait states.

The SWSM bit of the SWCR defines a multiplication factor of 1 or 2 for the base number of wait states.

2–0 Program 1

Program space. The field value (0–7) corresponds to the base number of wait states for external program space accesses within the following addresses:

 XPA = 0: x0000–x7FFFh  XPA = 1: 00000–FFFFFh

The SWSM bit of the SWCR defines a multiplication factor of 1 or 2 for the base number of wait states.

The software wait-state multiplier bit of the software wait-state configuration register is used to extend the base number of wait states selected by the SWWSR. The SWCR bit fields are shown in Figure 4 and described in Table 3.

Reserved

115

R/W-0

SWSM

R/W-0

LEGEND: R = Read, W = Write

Figure 4. Software Wait-State Configuration Register (SWCR) [MMR Address 002Bh]

Table 3. Software Wait-State Configuration Register (SWCR) Bit Fields

RESET

NO. NAME

RESET

VALUE

FUNCTION

15–1 Reserved 0

These bits are reserved and are unaffected by writes.

0 SWSM 0

Software wait-state multiplier . Used to multiply the number of wait states defined in the SWWSR by a factor of 1 or 2.

 SWSM = 0: wait-state base values are unchanged (multiplied by 1).  SWSM = 1: wait-state base values are multiplied by 2 for a maximum of 14 wait states.

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programmable bank-switching wait states

The programmable bank-switching logic of the ’5409 is functionally equivalent to that of the ’548/’549 devices. This feature automatically inserts one cycle when accesses cross memory-bank boundaries within program or data memory space. A bank-switching wait state can also be automatically inserted when accesses cross the data space boundary into program space.

The bank-switching control register (BSCR) defines the bank size for bank-switching wait-states. Figure 5 shows the BSCR and its bits are described in Table 4.

BNKCMP PS-DS Reserved HBH

12 11 3 2 115

R/W-0R-0R/W-1R/W-1111

EXIO

010

R/W-0R/W-0

LEGEND: R = Read, W = Write

Figure 5. Bank-Switching Control Register (BSCR) [MMR Address 0029h]

Table 4. Bank-Switching Control Register Fields

BIT

RESET

NO. NAME

RESET

VALUE

FUNCTION

15–12 BNKCMP 1111

Bank compare. BNKCMP determines the external memory-bank size. BNKCMP is used to mask the four MSBs of an address. For example, if BNKCMP = 11 11b, the four MSBs (bits 12–15) are compared, resulting in a bank size of 4K words. Bank sizes of 4K words to 64K words are allowed.

11 PS-DS 1

Program read – data read access. PS-DS inserts an extra cycle between consecutive accesses of program read and data read or data read and program read. PS-DS = 0 No extra cycles are inserted by this feature. PS-DS = 1 One extra cycle is inserted between consecutive data and program reads.

10–3 Reserved 0 These bits are reserved and are unaffected by writes.

HPI bus holder. HBH controls the HPI bus holder feature. HBH is cleared to 0 at reset.

8-bit Mode

HBH = 0 The bus holder is disabled for the HPI data bus (HD[7:0]). HBH = 1 The bus holders are enabled on HD[7:0]. When not driven, the HPI data bus (HD[7:0]) is held

in the previous logic level.

2 HBH 0

HPI bus holder. HBH controls the HPI bus holder feature. HBH is cleared to 0 at reset.

16-bit Mode

HBH = 0 The bus holder is disabled for the HPI address bus (HA[15:0]). The HPI GPIO pins (HD[7:0])

are held in the previous logic level.

HBH = 1 The bus holders are enabled on HA[15:0]. When not driven, the HPI address bus (A[15:0])

and HPI GPIO pins (HD[7:0]) are held in the previous logic level.

1 BH 0

Bus holder. BH controls the data bus holder feature. BH is cleared to 0 at reset. BH = 0 The bus holder is disabled. BH = 1 The bus holder is enabled. When not driven, the data bus (D[15:0]) is held in the previous

logic level.

0 EXIO 0

External bus interface off. The EXIO bit controls the external bus-off function. EXIO = 0 The external bus interface functions as usual. EXIO = 1 The address bus, data bus, and control signals become inactive after completing the current

bus cycle. Note that the DROM, MP/MC

, and OVLY bits in the PMST and the HM bit of ST1

cannot be modified when the interface is disabled.

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parallel I/O ports

The ’5409 CPU has a total of 64K I/O ports. These ports can be addressed by the PORTR instruction or the PORTW instruction. The IS

signal indicates a read/write operation through an I/O port. The ’5409 can interface

easily with external devices through the I/O ports while requiring minimal off-chip address-decoding circuits.

enhanced 8-bit host-port interface (HPI8/16)

The ’5409 host-port interface, also referred to as the HPI8/16, is an enhanced version of the standard 8-bit HPI found on earlier ’54x DSPs (’542, ’545, ’548, and ’549). The HPI8/16 is an 8-bit parallel port for interprocessor communication. The features of the HPI8/16 include:

Standard features:

 Sequential transfers (with autoincrement) or random-access transfers  Host interrupt and ’54x interrupt capability  Multiple data strobes and control pins for interface flexibility

Enhanced features of the ’5409 HPI8/16:

 Access to entire on-chip RAM through DMA bus  Capability to continue transferring during emulation stop  Capability to transfer 16-bit address and 16-bit data (non-multiplexed mode)

The HPI8/16 functions as a slave and enables the host processor to access the on-chip memory of the ’5409. A major enhancement to the ’5409 HPI over previous versions is that it allows host access to the entire on-chip memory range of the DSP. The HPI8/16 does not have access to external memory. The host and the DSP both have access to the on-chip RAM at all times and host accesses are always synchronized to the DSP clock. If the host and the DSP contend for access to the same location, the host has priority , and the DSP waits for one HPI8/16 cycle. Note that since host accesses are always synchronized to the ’5409 clock, an active input clock (CLKIN) is required for HPI8/16 accesses during IDLE states, and host accesses are not allowed while the ’5409 reset pin is asserted.

0000h 005Fh

Reserved

0060h

007Fh

Scratch-Pad

RAM

0080h

7FFFh

On-Chip RAM

(32K x 16 Bits)

8000h

FFFFh

Reserved

Figure 6. ’5409 HPI Memory Map

standard 8-bit mode

The HPI8/16 interface consists of an 8-bit bidirectional data bus and various control signals. Sixteen-bit transfers are accomplished in two parts with the HBIL input designating high or low byte. The host communicates with the HPI8 through three dedicated registers — HPI address register (HPIA), HPI data register (HPID), and an HPI control register (HPIC). The HPIA and HPID registers are only accessible by the host, and the HPIC register is accessible by both the host and the ’5409. If the HPI is disabled (HPIENA = 0) or in HPI16 mode (HPI16 = 1), the 8-bit bidirectional data pins HD0–HD7 can be used as general-purpose input/output (GPIO).

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16-bit nonmultiplexed mode

nonmultiplexed

mode, a host with separate address/data buses can access the HPI16 data register (HPID) via the HD 16-bit bidirectional data bus, and the address register (HPIA) via the 16-bit HA address bus, external address and data pins, A0–A15 and D0–D15, respectively . The host initiates an access with the strobe signals (HDS1

, HDS2, HCS) and controls the direction of the access with the HR/W signal. The HPI16 can stall host

accesses via the HRDY signal. Note that the HPIC register is not available in

nonmultiplexed

mode since there are no HCNTL signals available. All host accesses initiate a DMA read or write access. The HPI16 nonmultiplexed mode does not support host-to-DSP and DSP-to-host interrupts. When the HPI is disabled or in HPI16 mode, HD0–HD7 can be configured as general-purpose input/output (GPIO). The HPI16 pin is sampled at RESET. The HPI16 pin should never be changed while the device RESET is HIGH.

host bus holder configuration

The ’5409 has two bus holder control bits, BH (BSCR[1]) and HBH (BSCR[2]), to control the bus keepers of the address bus (A[15–0]), data bus (D[15–0]) and the HPI data bus (HD[7–0]). The bus keeper enabling/disabling is described in Table 5.

Table 5. Bus Holder Control Bits

HPI16 pin BH HBH D[15–0] A[15–0] HD[7–0]

0 0 0 OFF OFF OFF 0 0 1 OFF OFF ON 0 1 0 ON OFF OFF 0 1 1 ON OFF ON 1 0 0 OFF OFF ON 1 0 1 OFF ON ON 1 1 0 ON OFF ON 1 1 1 ON ON ON

The HPI bus holders are activated via the HBH bit in the Bank Switch Control Register (BSCR). The HBH bit can control bus holder behavior for both the 8-bit and 16-bit modes. In the 8-bit mode, the HBH bit controls the bus holders on the host data pins HD7–HD0. When HBH = 1, the host data bus holders are active. When HBH = 0 the host data bus holders are inactive. In the 16-bit nonmultiplexed mode, the bus holders for pins HD7–HD0 are always active; however, the HBH bit controls the host address pins A15–A0. When HBH = 1, the host address bus holders are active. When HBH = 0, the host address bus holders are inactive.

operation during IDLE2

The HPI can continue to operate during IDLE1 or IDLE2 by using special clock management logic that turns on relevant clocks to perform a synchronous memory access, and then turns the clocks back off to save power . The DSP CPU does not wake up from the IDLE mode during this process.

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multichannel buffered serial ports (McBSPs)

The ’5409 device has three high-speed, full-duplex multichannel buffered serial ports (McBSPs) that allow direct interface to other ’C54x/’LC54x devices, codecs, and other devices in a system. The McBSPs are based on the standard serial port interface found on other ’54x devices. Like its predecessors, the McBSP provides:

 Full-duplex communication  Double-buffer data registers, which allow a continuous data stream  Independent framing and clocking for receive and transmit

In addition, the McBSP has the following capabilities:

 Direct interface to:

– T1/E1 framers – MVIP switching-compatible and ST-BUS compliant devices – IOM-2 compliant devices – AC97-compliant devices – Serial peripheral interface (SPI) devices

 Multichannel transmit and receive of up to 32 channels in a 128 channel stream.  A wide selection of data sizes including 8, 12, 16, 20, 24, or 32 bits  µ-law and A-law companding  Programmable polarity for both frame synchronization and data clocks  Programmable internal clock and frame generation

For detailed information on the standard features of the McBSP, refer to the

TMS320C54x DSP Enhanced

Peripherals Reference Set

, literature number SPRU302.

Although the BCLKS pin is not available on the ’5409 PGE and GGU packages, the ’5409 is capable of synchronization to external clock sources. BCLKX or BCLKR can be used by the sample rate generator for external synchronization. The sample rate clock mode extended (SCLKME) bit field is located in the PCR to accommodate this option.

15 14 13 12 1 1 10 9 8

Reserved XIOEN RIOEN FSXM FSRM CLKXM CLKRM

RW RW RW RW RW RW RW

76543210

SCLKME CLKS STAT DX STAT DR STAT FSXP FSRP CLKXP CLKRP

RW RW RW RW RW RW RW RW

LEGEND: R = Read, W = Write

Figure 7. Pin Control Register (PCR)

SPI is a trademark of Motorola Inc.

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multichannel buffered serial ports (McBSPs) (continued)

Table 6. Pin Control Register (PCR) Bit Field Description

BIT NAME FUNCTION

15 – 14 Reserved Reserved. Pins are not used.

13 XIOEN

Transmit/Receive general-purpose I/O mode ONLY when XRST=0 in the SPCR(1/2)

XIOEN = 0 DX pin is not a general-purpose output. FSX and CLKX are not general-purpose I/Os. XIOEN = 1 DX pin is a general-purpose output. FSX and CLKX are general-purpose I/Os. These serial port

pins do not perform serial port operations.

12 RIOEN

Transmit/Receive general-purpose I/O mode ONLY when RRST=0 in the SPCR(1/2)

RIOEN = 0 DR and CLKS pins are not general-purpose inputs. FSR and CLKR are not general-purpose

I/Os.

RIOEN = 1 DR and CLKS pins are general-purpose inputs. FSR and CLKR are general-purpose I/Os.

These serial port pins do not perform serial port operations. The CLKS pin is affected by a combination of RRST

and RIOEN signals of the receiver.

11 FSXM

Transmit frame synchronization mode

FSRM = 0 Frame synchronization signal derived from an external source. FSRM = 1 Frame synchronization is determined by the sample rate generator frame synchronization mode

bit (FSGM) in the SRGR2.

10 FSRM

Receive frame synchronization mode

FSRM = 0 Frame synchronization pulses generated by an external device. FSR is an input pin. FSRM = 1 Frame synchronization generated internally by the sample rate generator. FSR is an output pin

except when GSYNC=1 in the SRGR.

9 CLKRM

Receiver clock mode

Case 1: Digital loop-back mode is not set (DLB=0) in SPCR1.

CLKRM = 0 Receive clock (CLKR) is an input pin driven by an external clock. CLKRM= 1 CLKR is an output pin and is driven by the internal sample rate generator

Case 2: Digital loop-back mode set (DLB=1) in SPCR1

CLKRM = 0 Receive clock (

Not

the CLKR pin) is driven by transmit clock (CLKX), which is based on CLKXM

bit in the PCR. CLKR pin is in high-impedance mode.

CLKRM= 1 CLKR is an output pin and is driven by the transmit clock. The transmit clock is derived based

on the CLKXM bit in the PCR.

8 CLKXM

Transmitter clock mode

CLKXM = 0 Receiver/transmitter clock is driven by an external clock with CLK(R/X) as an input pin CLKXM= 1 CLK(R/X) is an output pin and is driven by the internal sample rate generator

During SPI mode (CLKSTP is a non-zero value):

CLKXM = 0 McBSP is a slave and clock (CLKX) is driven by the SPI master in the system. CLKR is

internally driven by CLKX.

CLKXM= 1 McBSP is a master and generates the clock (CLKX) to drive its receive clock (CLKR) and the

shift clock of the SPI-compliant slaves in the system.

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Table 6. Pin Control Register (PCR) Bit Field Description (Continued)

BIT FUNCTIONNAME

7 SCLKME

Sample rate clock mode extended

SCLKME = 0 External clock via CLKS or CPU clock is used as a reference by the sample rate generator.

SCLKME = 1 External clock via CLKR or CLKX clock is used as a reference by the sample rate generator. 6 CLKS STAT CLKS pin status. CLKS STAT reflects value on CLKS pin when selected as a general-purpose input. 5 DX STAT DX pin status. DX STAT reflects value on DX pin when it is selected as a general-purpose output. 4 DR STAT DR pin status. DR STAT reflects value on DR pin when it is selected as a general-purpose input.

FSXP

Receive/Transmit frame synchronization polarity.

3 – 2

FSXP

FSRP

FS(R/X)P = 0 Frame synchronization pulse FS(R/X) is active high

FS(R/X)P = 1 Frame synchronization pulse FS(R/X) is active low

1 CLKXP

Transmit clock polarity

CLKXP = 0 Transmit data sampled on rising edge of CLKR

CLKXP = 1 Transmit data sampled on falling edge of CLKR

0 CLKRP

Receive clock polarity

CLKRP = 0 Receive data sampled on falling edge of CLKR

CLKRP = 1 Receive data sampled on rising edge of CLKR

The ’5409 sample rate generator has four clock input options that are only available when both the PCR and SRGR2 are used. Table 7 shows the sample rate generator clock input options.

Table 7. Sample Rate Generator Clock Input Options

MODE

SCLKME

(PCR.7)

CLKSM

(SRGR2.13)

CLKS pin 0 0

CPU 0 1

CLKR pin 1 0

CLKX pin 1 1

15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

GSYNC CLKSP CLKSM

FSGM

FPER

RW RW RW RW RW

LEGEND: R = Read, W = Write

Figure 8. Sample Rate Generator Register 2 (SRGR2)

multichannel buffered serial ports (McBSPs) (continued)

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multichannel buffered serial ports (McBSPs) (continued)

Table 8. Sample Rate Generator Register 2 (SRGR2) Bit Field Descriptions

BIT NAME FUNCTION

BIT

NAME

FUNCTION

15 GSYNC

Sample rate generator clock synchronization. Only used when the external clock (CLKS) drives the sample rate generator clock (CLKSM=0)

GSYNC = 0 The sample rate generator clock (CLKG) is free-running. GSYNC = 1 The sample rate generator clock (CLKG) is running. But CLKG is resynchronized and frame sync

signal (FSG) is generated only after detecting the receive frame synchronization signal (FSR). Also, frame period (FPER) is a don’t care because the period is dictated by the external frame sync pulse.

14 CLKSP

CLKS polarity clock edge select. Only used when the external clock (CLKS) drives the sample rate generator clock (CLKSM=0).

CLKSP = 0 Rising edge of CLKS generates CLKG and FSG. CLKSP = 1 Falling edge of CLKS generates CLKG and FSG.

13 CLKSM

McBSP sample rate generator clock mode

SCLKME = 0 CLKSM = 0 Sample rate generator clock derived from the CLKS pin (in PCR) CLKSM = 1 Sample rate generator clock derived from CPU clock

SCLKME = 1 CLKSM = 0 Sample rate generator clock derived from CLKR pin (in PCR) CLKSM = 1 Sample rate generator clock derived from CLKX pin

12 FSGM

Sample rate generator transmit frame synchronization mode. Used when FSXM=1 in the PCR.

FSGM = 0 Transmit frame sync signal (FSX) due to DXR(1/2) copy FSGN = 1 Transmit frame sync signal driven by the sample rate generator frame sync signal (FSG)

11 – 0 FPER

Frame period. This determines when the next frame sycn signal should become active. Range: up to 212; 1 to 4096 CLKG periods.

hardware timer

The ’5409 device features one 16-bit timing circuit with a 4-bit prescaler. The main counter of each timer is decremented by one every CLKOUT cycle. Each time the counter decrements to 0, a timer interrupt is generated. The timer can be stopped, restarted, reset, or disabled by specific control bits.

clock generator

The clock generator provides clocks to the ’5409 device, and consists of an internal oscillator and a phase-locked loop (PLL) circuit. The clock generator requires a reference clock input, which can be provided by using a crystal resonator with the internal oscillator, or from an external clock source. The reference clock input is then divided by two (DIV mode) to generate clocks for the ’5409 device, or the PLL circuit can be used (PLL mode) to generate the device clock by multiplying the reference clock frequency by a scale factor, allowing use of a clock source with a lower frequency than that of the CPU.The PLL is an adaptive circuit that, once synchronized, locks onto and tracks an input clock signal.

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clock generator (continued)

When the PLL is initially started, it enters a transitional mode during which the PLL acquires lock with the input signal. Once the PLL is locked, it continues to track and maintain synchronization with the input signal. Then, other internal clock circuitry allows the synthesis of new clock frequencies for use as master clock for the ’5409 device.

This clock generator allows system designers to select the clock source. The sources that drive the clock generator are:

 A crystal resonator circuit. The crystal resonator circuit is connected across the X1 and X2/CLKIN pins of

the ’5409 to enable the internal oscillator.

 An external clock. The external clock source is directly connected to the X2/CLKIN pin, and X1 is left

unconnected.

The software-programmable PLL features a high level of flexibility, and includes a clock scaler that provides various clock multiplier ratios, capability to directly enable and disable the PLL, and a PLL lock timer that can be used to delay switching to PLL clocking mode of the device until lock is achieved. Devices that have a built-in software-programmable PLL can be configured in one of two clock modes:

 PLL mode. The input clock (X2/CLKIN) is multiplied by 1 of 31 possible ratios. These ratios are achieved

using the PLL circuitry.

 DIV (divider) mode. The input clock is divided by 2 or 4. Note that when DIV mode is used, the PLL can be

completely disabled in order to minimize power dissipation.

The software-programmable PLL is controlled using the 16-bit memory-mapped (address 0058h) clock mode register (CLKMD). The CLKMD register is used to define the clock configuration of the PLL clock module. Upon reset, the CLKMD register is initialized with a predetermined value dependent only upon the state of the CLKMD1 – CLKMD3 pins as shown in Table 9.

Table 9. Clock Mode Settings at Reset

CLKMD1 CLKMD2 CLKMD3

CLKMD

CLOCK MODE

CLKMD1

CLKMD2

CLKMD3

RESET VALUE

CLOCK MODE

0 0 0 E007h PLL x 15 0 0 1 9007h PLL x 10

0 1 0 4007h PLL x 5 1 0 0 1007h PLL x 2 1 1 0 F007h PLL x 1 1 1 1 0000h 1/2 (PLL disabled) 1 0 1 F000h 1/4 (PLL disabled) 0 1 1 — Reserved

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DMA controller

The ’5409 direct memory access (DMA) controller transfers data between points in the memory map without intervention by the CPU. The DMA controller allows movements of data to and from internal program/data memory, internal peripherals (such as the McBSPs), and external program/data memory to occur in the background of CPU operation. The DMA has six independent programmable channels allowing six different contexts for DMA operation.

features

The DMA has the following features:

 The DMA has external memory access.  The DMA operates independently of the CPU.  The DMA has six channels. The DMA can keep track of the contexts of six independent block transfers.  The DMA has higher priority than the CPU for internal accesses.  Each channel has independently programmable priorities.  Each channel’s source and destination address registers can have configurable indexes through memory

on each read and write transfer, respectively. The address may remain constant, be post-incremented, post-decremented, or be adjusted by a programmable value.

 Each internal read or write transfer may be initialized by selected sync events.  Each DMA channel is capable of sending interrupts to the CPU.  The DMA can perform double-word transfers (a 32-bit transfer of two 16-bit words). (Internally only)

DMA external access

The ’5409 DMA supports external accesses to extended program, extended data, and extended I/O memory . These overlay pages are only visible to the DMA controller. A maximum of two DMA channels can be used for external memory accesses. The DMA external accesses require 9 cycle minimums for external writes and 13 cycle minimums for external reads.

The control of the bus is arbitrated between the CPU and the DMA. While the DMA or CPU is in control of the external bus the other will be held–off via wait states until the current transfer is complete. The DMA takes precedence over XIO requests. The HOLD

/HOLDA feature of the ’5409 affects external CPU transfers as well as external DMA transfers. When an external processor asserts the HOLD pin to gain control of the memory interface, the HOLDA

signal is not asserted until all pending DMA transfers are complete. To prevent the DMA from blocking out the CPU or HOLD/HOLDA feature from accessing the external bus, uninterrupted burst transfers are

not

supported by the DMA. Subsequently , CPU and DMA arbitration testing is performed for each

external bus cycle, regardless of the bus activity.

 Only two channels are available for external accesses. (One for external reads/one for external writes.)  Single-word (16-bit) transfers are supported for external accesses.  The DMA does not support transfers from peripherals to external memory.  The DMA does not support transfers from external memory to the peripherals.  The DMA does not support external to external transfers.  The DMA does not support synchronized external transfers.

The HM bit in the ST1 register indicates whether the processor continues internal execution when acknowledging an active HOLD signal.

 HM = 0, the processor continues execution from internal program memory but places its external interface

in the high impedance state.

 HM = 1, the processor halts internal execution.

To ensure that proper arbitration occurs, the HM bit should be set to 0 in the memory-mapped ST1 register. If the HM is set to 1 the processor will halt during DMA external transfers.

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DMA external transfer

Unlike the ’5410, the ’5409 DMA mode control register (DMMCRx) has two additional bits; DLAXS (DMMCRn[5]) and SLAXS (DMMCRn[11]). These new bits specify the on/off-chip memory for the source and destination of the program/data/IO spaces.

 When DLAXS is set to 0 (default), the DMA does not perform an external access for the destination. When

DLAXS is set to 1, the DMA performs an external access to the destination location.

 When SLAXS is set to 0 (default), the DMA does not perform an external access for the source. When

DLAXS is set to 1, the DMA performs an external access from the source location.

Two new registers are added to the ’5409 DMA to support DMA accesses to/from DMA extended data memory , page 1 to page 127.

 The DMA extended source data page register (XSRCDP[6:0]) is located at subbank address 028h.  The DMA extended destination data page register (XDSTDP[6:0]) is located at subbank address 029h.

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DMA memory map

The DMA memory map, as shown in Figure 9, allows DMA transfers to be unaffected by the status of the MP/MC, DROM, and OVLY bits.

Program

Data

Program

FFFF

0021

0060

002F 0030

Reserved

C000

017FFF

018000

0037 0038

xxFFFF

003F 0040

FFFF

Hex

010000

Hex

0000

BFFF

External

01FFFF

xx0000

Hex

Program

Page 0

Page 5, 6, ...

Page n

External

DARAM Internal

32K

Hex

0000

007F 0080

External

On-Chip

ROM

Reserved

001F

0023 0024

0033 0034

0035 0036

0039

003A

0049

7FFF

8000

004A 004B

003B 003C

005F

004C

DRR20 DRR10 DXR20

DXR10

Reserved

DRR22 DRR12 DXR22

DXR12

Reserved

RCERA2 XCERA2

Reserved

DRR21 DRR11

DXR21 DXR11

Reserved

RCERA0 XCERA0

Reserved

Scratch-

Pad RAM

DARAM

External

0080

007F

0044

0043

0042

0041

0022

0020

0031 0032

Reserved

RCERA1 XCERA1

Data

xx0000

Page 1, 2, ... 127

External

I/O

0000

External

Hex Hex

xxFFFF FFFF

7FFF

8000

Page 0, 1, ... 127

NOTE: n = 1, 2, 3, or 4

Figure 9. TMS320VC5409 DMA Memory Map

DMA priority level

Each DMA channel can be independently assigned high priority or low priority relative to each other. Multiple DMA channels that are assigned to the same priority level are handled in a round-robin manner.

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DMA source/destination address modification

The DMA provides flexible address-indexing modes for easy implementation of data management schemes such as autobuffering and circular buffers. Source and destination addresses can be indexed separately and can be post-incremented, post-decremented, or post-incremented with a specified index offset.

DMA in autoinitialization mode

The DMA can automatically reinitialize itself after completion of a block transfer. Some of the DMA registers can be preloaded for the next block transfer through the DMA global reload registers (DMGSA, DMGDA, and DMGCR). Autoinitialization allows:

 Continuous operation: Normally, the CPU would have to reinitialize the DMA immediately after the

completion of the current block transfer; but with the global reload registers, it can reinitialize these values for the next block transfer any time after the current block transfer begins.

 Repetitive operation: The CPU does not preload the global reload register with new values for each block

transfer but only loads them on the first block transfer.

DMA transfer counting

The DMA channel element count register (DMCTRx) and the frame count register (DMFRCx) contain bit fields that represent the number of frames and the number of elements per frame to be transferred.

 Frame count. This 8-bit value defines the total number of frames in the block transfer. The maximum number

of frames per block transfer is 128 (FRAME COUNT= 0ffh). The counter is decremented upon the last read transfer in a frame transfer. Once the last frame is transferred, the selected 8-bit counter is reloaded with the DMA global frame reload register (DMGFR) if the AUTOINIT bit is set to 1. A frame count of 0 (default value) means the block transfer contains a single frame.

 Element count. This 16-bit value defines the number of elements per frame. This counter is decremented

after the read transfer of each element. The maximum number of elements per frame is 65536 (DMCTRn = 0FFFFh). In autoinitialization mode, once the last frame is transferred, the counter is reloaded with the DMA global count reload register (DMGCR).

DMA transfers in double-word mode (Internal Only)

Double-word mode allows the DMA to transfer 32-bit words in any index mode. In double-word mode, two consecutive 16-bit transfers are initiated and the source and destination addresses are automatically updated following each transfer. In this mode, each 32-bit word is considered to be one element.

DMA channel index registers

The particular DMA channel index register is selected by way of the SIND and DIND field in the DMA mode control register (DMMCRx). Unlike basic address adjustment, in conjunction with the frame index DMFRI0 and DMFRI1, the DMA allows different adjustment amounts depending on whether or not the element transfer is the last in the current frame. The normal adjustment value (element index) is contained in the element index registers DMIDX0 and DMIDX1. The adjustment value (frame index) for the end of the frame is determined by the selected DMA frame index register (either DMFRI0 or DMFRI1).

The element index and the frame index affect address adjustment as follows:

 Element index: For all except the last transfer in the frame, the element index determines the amount to be

added to the DMA channel for the source/destination address register (DMSRCx/DMDSTx) as selected by the SIND/DIND bits.

 Frame index: If the transfer is the last in a frame, the frame index is used for address adjustment as selected

by the SIND/DIND bits. This occurs in both single-frame and multi-frame transfer.

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DMA interrupts

The ability of the DMA to interrupt the CPU based on the status of the data transfer is configurable and is determined by the IMOD and DINM bits in the DMA channel mode control register (DMMCRn). The available modes are shown in Table 10.

Table 10. DMA Interrupts

MODE DINM IMOD INTERRUPT

ABU (non-decrement) 1 0 At full buffer only ABU (non-decrement) 1 1 At half buffer and full buffer Multi-Frame 1 0 At block-transfer complete (DMCTRn = DMSEFCn[7:0] = 0) Multi-Frame 1 1 At end of frame and end of block (DMCTRn = 0) Either 0 X No interrupt generated Either 0 X No interrupt generated

DMA controller synchronization events

The internal transfers associated with each DMA channel can be synchronized to one of several events. The DSYN bit field of the DMSEFCn register selects the synchronization event for a channel. The list of possible events and the DSYN values are shown in Table 11.

Table 11. DMA Synchronization Events

DSYN VALUE DMA SYNCHRONIZATION EVENT

0000b No synchronization used 0001b McBSP0 receive event 0010b McBSP0 transmit event 0011b McBSP2 receive event 0100b McBSP2 transmit event 0101b McBSP1 receive event 0110b McBSP1 transmit event 0111b Reserved 1000b Reserved 1001b Reserved 1010b Reserved 1011b Reserved 1100b Reserved 1101b Timer interrupt event 1110b External interrupt 3

1111b Reserved

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DMA channel interrupt selection

The DMA controller can generate a CPU interrupt for each of the six channels. However, due to a limit on the number of internal CPU interrupt inputs, channels 0, 1, 2, and 3 are multiplexed with other interrupt sources. DMA channels 0, 1, 2, and 3 share an interrupt line with the receive and transmit portions of the McBSP. When the ’5409 is reset, the interrupts from these three DMA channels are deselected. The INTSEL bit field in the DMPREC register can be used to select these interrupts, as shown in Table 12.

Table 12. DMA Channel Interrupt Selection

INTSEL Value IMR/IFR[6] IMR/IFR[7] IMR/IFR[10] IMR/IFR[11]

00b (reset) BRINT2 BXINT2 BRINT1 BXINT1

01b BRINT2 BXINT2 DMAC2 DMAC3 10b DMAC0 DMAC1 DMAC2 DMAC3 11b Reserved

memory-mapped registers

The ’5409 has 27 memory-mapped CPU registers, which are mapped in data memory space addresses 0h to 1Fh. The device also has a set of memory-mapped registers associated with peripherals. Table 13 gives a list of CPU memory-mapped registers (MMRs) available on ’5409. Table 14 shows additional peripheral MMRs associated with the ’5409.

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memory-mapped registers (continued)

Table 13. CPU Memory-Mapped Registers

ADDRESS

NAME

DEC HEX

DESCRIPTION

IMR 0 0 Interrupt mask register IFR 1 1 Interrupt flag register – 2–5 2–5 Reserved for testing ST0 6 6 Status register 0 ST1 7 7 Status register 1 AL 8 8 Accumulator A low word (15–0) AH 9 9 Accumulator A high word (31–16) AG 10 A Accumulator A guard bits (39–32) BL 11 B Accumulator B low word (15–0) BH 12 C Accumulator B high word (31–16) BG 13 D Accumulator B guard bits (39–32) TREG 14 E T emporary register TRN 15 F Transition register AR0 16 10 Auxiliary register 0 AR1 17 11 Auxiliary register 1 AR2 18 12 Auxiliary register 2 AR3 19 13 Auxiliary register 3 AR4 20 14 Auxiliary register 4 AR5 21 15 Auxiliary register 5 AR6 22 16 Auxiliary register 6 AR7 23 17 Auxiliary register 7 SP 24 18 Stack pointer register BK 25 19 Circular buffer size register BRC 26 1A Block repeat counter RSA 27 1B Block repeat start address REA 28 1C Block repeat end address PMST 29 1D Processor mode status (PMST) register XPC 30 1E Extended program page register – 31 1F Reserved

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memory-mapped registers (continued)

Table 14. Peripheral Memory-Mapped Registers

NAME ADDRESS DESCRIPTION TYPE

DRR20 20h Data receive register 2 McBSP #0 DRR10 21h Data receive register 1 McBSP #0 DXR20 22h Data transmit register 2 McBSP #0 DXR10 23h Data transmit register 1 McBSP #0 TIM 24h Timer register Timer PRD 25h Timer period counter Timer TCR 26h Timer control register Timer – 27h Reserved SWWSR 28h Software wait-state register External Bus BSCR 29h Bank-switching control register External Bus – 2Ah Reserved SWCR 2Bh Software wait-state control register External Bus HPIC 2Ch HPI control register HPI – 2Dh–2Fh Reserved DRR22 30h Data receive register 2 McBSP #2 DRR12 31h Data receive register 1 McBSP #2 DXR22 32h Data transmit register 2 McBSP #2 DXR12 33h Data transmit register 2 McBSP #2 SPSA2 34h McBSP2 subbank address register McBSP #2 SPSD2 35h McBSP2 subbank data register McBSP #2 – 36–37h Reserved SPSA0 38h McBSP0 subbank address register McBSP #0 SPCD0 39h McBSP0 subbank data register McBSP #0 – 3Ah–3Bh Reserved GPIOCR

General-purpose I/O pins control register

GPIO

GPIOSR

General-purpose I/O pins status register

GPIO – 3E–3F Reserved DRR21 40h Data receive register 1 McBSP #1 DRR11 41h Data receive register 2 McBSP #1 DXR21 42h Data transmit register 1 McBSP #1 DXR11 43h Data transmit register 2 McBSP #1 – 44h–47h Reserved SPSA1 48h McBSP1 subbank address register McBSP #1 SPCD1 49h McBSP1 subbank data register McBSP #1 – 4Ah–53h Reserved DMPREC 54h DMA channel priority and enable control register DMA DMSA 55h DMA subbank address register DMA DMSDI 56h DMA subbank data register with autoincrement DMA DMSDN 57h DMA subbank data registrer DMA CLKMD

58h

Clock mode register

PLL

– 59h–5Fh Reserved

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McBSP control registers and subaddresses

The control registers for the multichannel buffered serial port (McBSP) are accessed using the subbank addressing scheme. This allows a set or subbank of registers to be accessed through a single memory location. The serial port subbank address (SPSA) register is used as a pointer to select a particular register within the subbank. The serial port subbank data (SPSD) register is used to access (read or write) the selected register. Table 15 shows the McBSP control registers and their corresponding subaddresses.

Table 15. McBSP Control Registers and Subaddresses

McBSP0 McBSP1 McBSP2

SUB

NAME ADDRESS NAME ADDRESS NAME ADDRESS

SUB

ADDRESS

DESCRIPTION

SPCR10

39h

SPCR11

49h

SPCR12

35h

00h

Serial port control register 1

SPCR20

39h

SPCR21

49h

SPCR22

35h

01h

Serial port control register 2

RCR10

39h

RCR11

49h

RCR12

35h

02h

Receive control register 1

RCR20

39h

RCR21

49h

RCR22

35h

03h

Receive control register 2

XCR10

39h

XCR11

49h

XCR12

35h

04h

Transmit control register 1

XCR20

39h

XCR21

49h

XCR22

35h

05h

Transmit control register 2

SRGR10

39h

SRGR11

49h

SRGR12

35h

06h

Sample rate generator register 1

SRGR20

39h

SRGR21

49h

SRGR22

35h

07h

Sample rate generator register 2

MCR10

39h

MCR11

49h

MCR12

35h

08h

Multichannel register 1

MCR20

39h

MCR21

49h

MCR22

35h

09h

Multichannel register 2

ÁÁÁ

RCERA0

ÁÁ

39h

ÁÁÁ

RCERA1

ÁÁ

49h

ÁÁÁ

RCERA2

ÁÁ

35h

ÁÁÁ

0Ah

БББББББ

Receive channel enable register partition A

RCERB0

39h

RCERB1

49h

RCERB2

35h

0Bh

Receive channel enable register partition B

ÁÁÁ

XCERA0

ÁÁ

39h

ÁÁÁ

XCERA1

ÁÁ

49h

ÁÁÁ

XCERA2

ÁÁ

35h

ÁÁÁ

0Ch

БББББББ

Transmit channel enable register partition A

XCERB0

39h

XCERB1

49h

XCERB2

35h

0Dh

Transmit channel enable register partition B

PCR0

39h

PCR1

49h

PCR2

35h

0Eh

Pin control register

DMA subbank addressed registers

The direct memory access (DMA) controller has several control registers associated with it. The main control register (DMPREC) is a standard memory mapped register. However, the other registers are accessed using the subbank addressing scheme. This allows a set, or subbank of registers to be accessed through a single memory location. The DMA subbank address (DMSA) register is used as a pointer to select a particular register within the subbank, while the DMA subbank data (DMSDN) register or the DMA subbank data register with autoincrement (DMSDI) is used to access (read or write) the selected register.

When the DMSDI register is used to access the subbank, the subbank address is automatically postincremented so that a subsequent access affects the next register within the subbank. This autoincrement feature is intended for efficient, successive accesses to several control registers. If the auto-increment feature is not required, the DMSDN register should be used to access the subbank. T able 16 shows the DMA controller subbank addressed registers and their corresponding subaddresses.

TMS320VC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

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DMA subbank addressed registers (continued)

Table 16. DMA Subbank Addressed Registers

DMA

SUB

NAME ADDRESS

SUB

ADDRESS

DESCRIPTION

DMSRC0 56h/57h

00h DMA channel 0 source address register

DMDST0 56h/57h

01h DMA channel 0 destination address register

DMCTR0 56h/57h

02h DMA channel 0 element count register

DMSFC0

56h/57h

03h

DMA channel 0 sync select and frame count register

DMMCR0

56h/57h

04h

DMA channel 0 transfer mode control register

DMSRC1

56h/57h

05h

DMA channel 1 source address register

DMDST1

56h/57h

06h

DMA channel 1 destination address register

DMCTR1

56h/57h

07h

DMA channel 1 element count register

DMSFC1

56h/57h

08h

DMA channel 1 sync select and frame count register

DMMCR1

56h/57h

09h

DMA channel 1 transfer mode control register

DMSRC2

56h/57h

0Ah

DMA channel 2 source address register

DMDST2

56h/57h

0Bh

DMA channel 2 destination address register

DMCTR2

56h/57h

0Ch

DMA channel 2 element count register

DMSFC2

56h/57h

0Dh

DMA channel 2 sync select and frame count register

DMMCR2

56h/57h

0Eh

DMA channel 2 transfer mode control register

DMSRC3

56h/57h

0Fh

DMA channel 3 source address register

DMDST3

56h/57h

10h

DMA channel 3 destination address register

DMCTR3

56h/57h

11h

DMA channel 3 element count register

DMSFC3

56h/57h

12h

DMA channel 3 sync select and frame count register

DMMCR3

56h/57h

13h

DMA channel 3 transfer mode control register

DMSRC4

56h/57h

14h

DMA channel 4 source address register

DMDST4

56h/57h

15h

DMA channel 4 destination address register

DMCTR4

56h/57h

16h

DMA channel 4 element count register

DMSFC4

56h/57h

17h

DMA channel 4 sync select and frame count register

DMMCR4

56h/57h

18h

DMA channel 4 transfer mode control register

DMSRC5

56h/57h

19h

DMA channel 5 source address register

DMDST5

56h/57h

1Ah

DMA channel 5 destination address register

DMCTR5

56h/57h

1Bh

DMA channel 5 element count register

DMSFC5

56h/57h

1Ch

DMA channel 5 sync select and frame count register

DMMCR5

56h/57h

1Dh

DMA channel 5 transfer mode control register

DMSRCP

56h/57h

1Eh

DMA source program page address (common channel)

DMDSTP

56h/57h

1Fh

DMA destination program page address (common channel)

DMIDX0

56h/57h

20h

DMA element index address register 0

DMIDX1

56h/57h

21h

DMA element index address register 1

DMFRI0

56h/57h

22h

DMA frame index register 0

DMFRI1

56h/57h

23h

DMA frame index register 1

DMGSA

56h/57h

24h

DMA global source address reload register

DMGDA

56h/57h

25h

DMA global destination address reload register

DMGCR

56h/57h

26h

DMA global count reload register

DMGFR

56h/57h

27h

DMA global frame count reload register

XSRCDP

56h/57h

28h

DMA global extended source register

XDSTDP

56h/57h

29h

DMA global extended destination register

TMS320VC5409

FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

interrupts

Vector-relative locations and priorities for all internal and external interrupts are shown in Table 17.

Table 17. Interrupt Locations and Priorities

NAME

LOCATION

DECIMAL HEX

PRIORITY FUNCTION

RS, SINTR 0 00 1 Reset (hardware and software reset) NMI, SINT16 4 04 2 Nonmaskable interrupt SINT17 8 08 — Software interrupt #17 SINT18 12 0C — Software interrupt #18 SINT19 16 10 — Software interrupt #19 SINT20 20 14 — Software interrupt #20 SINT21 24 18 — Software interrupt #21 SINT22 28 1C — Software interrupt #22 SINT23 32 20 — Software interrupt #23 SINT24 36 24 — Software interrupt #24 SINT25 40 28 — Software interrupt #25 SINT26 44 2C — Software interrupt #26 SINT27 48 30 — Software interrupt #27 SINT28 52 34 — Software interrupt #28 SINT29 56 38 — Software interrupt #29 SINT30 60 3C — Software interrupt #30 INT0, SINT0 64 40 3 External user interrupt #0 INT1, SINT1 68 44 4 External user interrupt #1 INT2, SINT2 72 48 5 External user interrupt #2 TINT, SINT3 76 4C 6 Timer interrupt BRINT0, SINT4 80 50 7 McBSP #0 receive interrupt (default) BXINT0, SINT5 84 54 8 McBSP #0 transmit interrupt (default) BRINT2, SINT7, DMAC0

McBSP #2 receive interrupt (default)

BXINT2, SINT6, DMAC1

McBSP #2 transmit interrupt (default) INT3, SINT8 96 60 11 External user interrupt #3 HINT, SINT9 100 64 12 HPI interrupt BRINT1, SINT10, DMAC2 104 68 13 McBSP #1 receive interrupt (default) BXINT1, SINT11, DMAC3 108 6C 14 McBSP #1 transmit interrupt (default) DMAC4,SINT12 112 70 15 DMA channel 4 interrupt (default) DMAC5,SINT13 116 74 16 DMA channel 5 interrupt (default) Reserved 120–127 78–7F — Reserved

TMS320VC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR

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interrupts (continued)

The bits of the interrupt flag register (IFR) and interrupt mask register (IMR) are arranged as shown in Figure 10. The function of each bit is described in Table 18.

15–14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

RES

DMAC5 DMAC4

BXINT1 DMAC3

BRINT1

DMAC2

HINT INT3

BXINT2 DMAC1

BRINT2 DMAC0

BXINT0 BRINT0 TINT INT2 INT1 INT0

Figure 10. IFR and IMR Registers

Table 18. IFR and IMR Register Bit Fields

BIT

NUMBER NAME

FUNCTION

15–14 – Reserved for future expansion

13 DMAC5 DMA channel 5 interrupt flag/mask bit 12 DMAC4

DMA channel 4 interrupt flag/mask bit

11 BXINT1/DMAC3

McBSP1 transmit interrupt flag/mask bit

10 BRINT1/DMAC2

McBSP1 receive interrupt flag/mask bit

9 HINT

Host to ’54x interrupt flag/mask

8 INT3

External interrupt 3 flag/mask

7 BXINT2/DMAC1

McBSP2 transmit interrupt flag/mask bit

6 BRINT2/DMAC0

McBSP2 receive interrupt flag/mask bit

5 BXINT0

McBSP0 transmit interrupt flag/mask bit

4 BRINT0

McBSP0 receive interrupt flag/mask bit

3 TINT

Timer interrupt flag/mask bit

2 INT2

External interrupt 2 flag/mask bit

1 INT1

External interrupt 1 flag/mask bit

0 INT0

External interrupt 0 flag/mask bit

TMS320VC5409

FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

documentation support

Extensive documentation supports all TMS320 family generations of devices from product announcement through applications development. The following types of documentation are available to support the design and use of the ’C5000 family of DSPs:



TMS320C5000 DSP Family Functional Overview

(literature number SPRU307)

 Device-specific data sheets (such as this document)  Complete User Guides  Development-support tools  Hardware and software application reports

The five-volume

TMS320C54x DSP Reference Set

(literature number SPRU210) consists of:



Volume 1: CPU and Peripherals

(literature number SPRU131)



Volume 2: Mnemonic Instruction Set

(literature number SPRU172)



Volume 3: Algebraic Instruction Set

(literature number SPRU179)



Volume 4: Applications Guide

(literature number SPRU173)



Volume 5: Enhanced Peripherals

(literature number SPRU302)

The reference set describes in detail the TMS320C54x products currently available, and the hardware and software applications, including algorithms, for fixed-point TMS320 devices.

For general background information on DSPs and Texas Instruments (TI) devices, see the three-volume publication

Digital Signal Processing Applications with the TMS320 Family

(literature numbers SPRA012,

SPRA016, and SPRA017). A series of DSP textbooks is published by Prentice-Hall and John Wiley & Sons to support digital signal

processing research and education. The TMS320 newsletter,

Details on Signal Processing

, is published

quarterly and distributed to update TMS320 customers on product information. Information regarding TI DSP products is also available on the Worldwide Web at

http://www.ti.com

uniform

resource locator (URL).

TI is a trademark of Texas Instruments Incorporated.

TMS320VC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

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absolute maximum ratings over specified temperature range (unless otherwise noted)

†

Supply voltage I/O range, DV

‡

–0.3 V to 4.0 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Supply voltage core range, CV

‡

–0.3 V to 2.4 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage range, V

–0.3 V to 4.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output voltage range, V

–0.3 V to 4.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Operating case temperature range, T

–40°C to 100°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature range, T

stg

–55°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

†

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

‡

All voltage values are with respect to VSS.

recommended operating conditions

MIN NOM MAX UNIT

Device supply voltage, I/O

3 3.3 3.6 V

Device supply voltage, core

1.71 1.8 1.98 V

Supply voltage, GND 0 V

RS, INTn, NMI, BIO, BCLKR0, BCLKR1, BCLKR2, BCLKX0, BCLKX1, BCLKX2, HAS

HCS

, HDS1, HDS2, TCK, CLKMDn, DVDD =

3.30.3 V

2.2 DVDD + 0.3

High-level input voltage, I/O

TRST 2.5 DVDD + 0.3

X2/CLKIN 1.4 CVDD + 0.3 All other inputs 2.0 DVDD + 0.3

Low-level input voltage

RS, INTn, NMI, X2/CLKIN, BIO, BCLKR0, BCLKR1, BCLKR2, BCLKX0, BCLKX1, BCLKX2, HAS

, HCS, HDS1, HDS2, TCK,

CLKMDn, DVDD = 3.30.3 V

–0.3 0.6

All other inputs –0.3 0.8

High-level output current –300 µA

Low-level output current 1.5 mA

Operating case temperature –40 100 °C

Texas Instrument DSPs do not require specific power sequencing between the core supply and the I/O supply. However, systems should be designed to ensure that neither supply is powered up for extended periods of time if the other supply is below the proper operating voltage. Excessive exposure to these conditions can adversely affect the long-term reliability of the devices. System-level concerns such as bus contention may require supply sequencing to be implemented. In this case, the core supply should be powered up at the same time as or prior to the I/O buffers, and then powered down after the I/O buffers.

TMS320VC5409

FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

electrical characteristics over recommended operating case temperature range (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT

High-level output voltage

IOH = MAX 2.4 V

Low-level output voltage IOL = MAX 0.4 V

Input current for outputs in high

D[15:0], HD[7:0], A[15:0]

Bus holders enabled, DVDD = MAX, VI = VSS to DV

–200 200

µA

out uts in high

impedance

All other inputs

DVDD = MAX, VO = VSS to DV

–5 5

µA

X2/CLKIN –40 40 TRST With internal pulldown –5 200

Input current

HPIENA, HPI16

With internal pulldown

(VI = V

–5 200

TMS, TCK, TDI, HPI



With internal pullups, HPIENA = 0

(

ISS

to DVDD)

–200 5

All other input-only pins –5 5

DDC

Supply current, core CPU CVDD = 1.8 V , f

clock

= 100 MHz, TC = 25°C

37 mA

DDP

Supply current, pins DVDD = 3.3 V , f

clock

= 100 MHz, TC = 25°C

45 mA

Supply current,

IDLE2 PLL × 2 mode, 50 MHz input 2 mA

Su ly current,

standby

IDLE3

Divide-by-two mode, CLKIN stopped 20 µA

Input capacitance 5 pF

Output capacitance 5 pF

†

All values are typical unless otherwise specified.

‡

HPI input signals except for HPIENA.

Clock mode: PLL × 1 with external source

This value represents the current consumption of the CPU, on-chip memory, and on-chip peripherals. Conditions include: program execution from on-chip RAM, with 50% usage of MAC and 50% usage of NOP instructions. Actual operating current varies with program being executed.

This value was obtained using the following conditions: external memory writes at a rate of 20 million writes per second, CLKOFF=0, full-duplex operation of all three McBSPs at a rate of 10 million bits per second each, and 15-pF loads on all outputs. For more details on how this calculation is performed, refer to the

Calculation of TMS320C54x Power Dissipation Application Report

(literature number SPRA164).

PARAMETER MEASUREMENT INFORMATION

The following load circuit in Figure 11 was used on all outputs pins and I/O pins in input mode. All timing measurements in this data sheet were measured from the ’5409 connection to the following load circuit.

Tester Pin

Electronics

Load

Output Under Test

50 Ω

Where: I

= 1.5 mA (all outputs)

= 300 µA (all outputs)

Load

= 1.5 V

= 40-pF typical load circuit capacitance

Figure 11. 3.3-V Test Load Circuit

TMS320VC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

internal oscillator with external crystal

The internal oscillator is enabled by connecting a crystal across X1 and X2/CLKIN. The frequency of CLKOUT is a multiple of the oscillator frequency . The multiply ratio is determined by the bit settings in the CLKMD register. The crystal should be in fundamental-mode operation, and parallel resonant, with an effective series resistance of 30 Ω and power dissipation of 1 mW.

The connection of the required circuit, consisting of the crystal and two load capacitors, is shown in Figure 12. The load capacitors, C

and C2, should be chosen such that the equation below is satisfied. CL in the equation

is the load specified for the crystal.



C1C

(



)

recommended operating conditions of internal oscillator with external crystal (see Figure 12)

’5409-80, -100

MIN NOM MAX

UNIT

clock

Input clock frequency 10 20 MHz

X1 X2/CLKIN

C1 C2

Crystal

Figure 12. Internal Oscillator With External Crystal

TMS320VC5409

FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

divide-by-two/divide-by-four clock option (PLL disabled)

The frequency of the reference clock provided at the X2/CLKIN pin can be divided by a factor of two or four to generate the internal machine cycle. The selection of the clock mode is described in the clock generator section.

When an external clock source is used, the frequency injected must conform to specifications listed in the timing requirements table.

switching characteristics over recommended operating conditions [H = 0.5t

c(CO)

]† (see Figure 12,

Figure 13, and the recommended operating conditions table)

’5409-80,-100

PARAMETER

MIN TYP MAX

UNIT

c(CO)

Cycle time, CLKOUT 40 2t

c(CI)

†

d(CIH-CO)

Delay time, X2/CLKIN high to CLKOUT high/low 4 10 17 ns

f(CO)

Fall time, CLKOUT 2 ns

r(CO)

Rise time, CLKOUT 2 ns

w(COL)

Pulse duration, CLKOUT low H–2 H–1 H ns

w(COH)

Pulse duration, CLKOUT high H–2 H–1 H ns

†

This device utilizes a fully static design and therefore can operate with t

c(CI)

approaching ∞. The device is characterized at frequencies

approaching 0 Hz.

timing requirements (see Figure 13)

’5409-80,-100

MIN MAX

UNIT

c(CI)

Cycle time, X2/CLKIN 20

†

f(CI)

Fall time, X2/CLKIN 8 ns

r(CI)

Rise time, X2/CLKIN 8 ns tw(CIL) Pulse duration, X2/CLKIN low 5 ns tw(CIH) Pulse duration, X2/CLKIN high 5 ns

†

This device utilizes a fully static design and therefore can operate with t

c(CI)

approaching ∞. The device is characterized at frequencies

approaching 0 Hz.

r(CO)

f(CO)

CLKOUT

X2/CLKIN

w(COL)

d(CIH-CO)

f(CI)

r(CI)

c(CO)

c(CI)

w(COH)

w(CIH)

w(CIL)

Figure 13. External Divide-by-Two Clock Timing

TMS320VC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

multiply-by-N clock option (PLL enabled)

The frequency of the reference clock provided at the X2/CLKIN pin can be multiplied by a factor of N to generate the internal machine cycle. The selection of the clock mode and the value of N is described in the clock generator section.

When an external clock source is used, the external frequency injected must conform to specifications listed in the timing requirements table.

switching characteristics over recommended operating conditions [H = 0.5t

c(CO)

]

(see Figure 12 and Figure 14)

’5409-80 ’5409-100

PARAMETER

MIN TYP MAX MIN TYP MAX

UNIT

c(CO)

Cycle time, CLKOUT 12.5 t

c(CI)

†

10 t

c(CI)

†

d(CI-CO)

Delay time, X2/CLKIN high/low to CLKOUT high/low 4 10 17 4 10 17 ns

f(CO)

Fall time, CLKOUT 2 2 ns

r(CO)

Rise time, CLKOUT 2 2 ns

w(COL)

Pulse duration, CLKOUT low H–3 H–1 H H–2 H–1 H ns

w(COH)

Pulse duration, CLKOUT high H–3 H–1 H H–2 H–1 H ns

Transitory phase, PLL lock up time 30 30

s

†

N = Multiplication factor

timing requirements (see Figure 14)

†

’5409-80,-100

MIN MAX

UNIT

Integer PLL multiplier N (N = 1–15) 20

‡

200

c(CI

)

Cycle time, X2/CLKIN

PLL multiplier N = x.5

‡

100

c(CI)

Cycle time, X2/CLKIN

PLL multiplier N = x.25, x.75 20

‡

f(CI)

Fall time, X2/CLKIN 8 ns

r(CI)

Rise time, X2/CLKIN 8 ns tw(CIL) Pulse duration, X2/CLKIN low 5 ns tw(CIH) Pulse duration, X2/CLKIN high 5 ns

†

N = Multiplication factor

‡

The multiplication factor and minimum X2/CLKIN cycle time should be chosen such that the resulting CLKOUT cycle time is within the specified range (tc(CO))

c(CO)

c(CI)

w(COH)

f(CO)

r(CO)

f(CI)

X2/CLKIN

CLKOUT

d(CI-CO)

w(COL)

r(CI)

Unstable

w(CIH)

w(CIL)

Figure 14. External Multiply-by-One Clock Timing

TMS320VC5409

FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

memory and parallel I/O interface timing

switching characteristics over recommended operating conditions for a memory read (MSTRB

= 0)

†

(see Figure 15)

’5409-80,-100

PARAMETER

MIN MAX

UNIT

d(CLKL-A)

Delay time, CLKOUT low to address valid

‡

0 3 ns

d(CLKH-A)

Delay time, CLKOUT high (transition) to address valid

0 3 ns

d(CLKL-MSL)

Delay time, CLKOUT l ow to MSTRB low 0 3 ns

d(CLKL-MSH)

Delay time, CLKOUT low to MSTRB high 0 3 ns

h(CLKL-A)R

Hold time, address valid after CLKOUT low

‡

0 3 ns

h(CLKH-A)R

Hold time, address valid after CLKOUT high

0 3 ns

†

Address, PS

, and DS timings are all included in timings referenced as address.

‡

In the case of a memory read preceded by a memory read

In the case of a memory read preceded by a memory write

timing requirements for a memory read (MSTRB = 0) [H = 0.5 t

c(CO)

]

†

(see Figure 15)

’5409-80,-100

MIN MAX

UNIT

a(A)M

Access time, read data access from address valid 2H–10

a(MSTRBL)

Access time, read data access from MSTRB low 2H–10

su(D)R

Setup time, read data before CLKOUT low 8 ns

h(D)R

Hold time, read data after CLKOUT low 0 ns

h(A-D)R

Hold time, read data after address invalid 0 ns

h(D)MSTRBH

Hold time, read data after MSTRB high 1 ns

†

Address, PS, and DS timings are all included in timings referenced as address.

This access timing reflects a zero wait-state timing.

TMS320VC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

memory and parallel I/O interface timing (continued)

PS, DS

R/W

MSTRB

D[15:0]

A[22:0]

CLKOUT

h(D)R

h(CLKL-A)R

d(CLKL-MSH)

d(CLKL-A)

d(CLKL-MSL)

su(D)R

a(A)M

a(MSTRBL)

h(A-D)R

h(D)MSTRBH

NOTE A: A[22:16] apply to DMA accesses to extended I/O, DATA, PROGRAM memory. The CPU has access to only extended

PROGRAM memory.

Figure 15. Memory Read (MSTRB = 0)

TMS320VC5409

FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

memory and parallel I/O interface timing (continued)

switching characteristics over recommended operating conditions for a memory write (MSTRB

= 0) [H = 0.5 t

c(CO)

]† (see Figure 16)

’5409-80,-100

PARAMETER

MIN MAX

UNIT

d(CLKH-A)

Delay time, CLKOUT high to address valid

‡

0 3 ns

d(CLKL-A)

Delay time, CLKOUT l ow to addres s valid

0 3 ns

d(CLKL-MSL)

Delay time, CLKOUT l ow to MSTRB low 0 3 ns

d(CLKL-D)W

Delay time, CLKOUT l ow to data valid 0 8 ns

d(CLKL-MSH)

Delay time, CLKOUT l ow to MSTRB high 0 3 ns

d(CLKH-RWL)

Delay time, CLKOUT high to R/W low 0 4 ns

d(CLKH-RWH)

Delay time, CLKOUT high to R/W high 0 4 ns

d(RWL-MSTRBL)

Delay time, R/W low to MSTRB low H – 2 H + 1 ns

h(A)W

Hold time, address valid after CLKOUT high

‡

0 3 ns

h(D)MSH

Hold time, write data valid after MSTRB high H–3 H+6

w(SL)MS

Pulse duration, MSTRB low 2H–2 ns

su(A)W

Setup time, address valid before MSTRB low 2H–2 ns

su(D)MSH

Setup time, write data valid before MSTRB high 2H–6 2H+6

en(D–RWL)

Enable time, data bus driven after R/W low H–5 ns

dis(RWH–D)

Disable time, R/W high to data bus high impedance 0 ns

†

Address, PS, and DS timings are all included in timings referenced as address.

‡

In the case of a memory write preceded by a memory write

In the case of a memory write preceded by an I/O cycle

TMS320VC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

memory and parallel I/O interface timing (continued)

PS, DS

R/W

MSTRB

D[15:0]

A[22:0]

CLKOUT

d(CLKH-RWH)

h(A)W

d(CLKL-MSH)

su(D)MSH

d(CLKL-D)W

w(SL)MS

su(A)W

d(CLKL-MSL)

h(D)MSH

d(CLKL-A)

d(CLKH-RWL)

d(RWL-MSTRBL)

d(CLKH-A)

en(D-RWL)

dis(RWH-D)

NOTE A: A[22:16] apply to DMA accesses to extended I/O, DATA, PROGRAM memory. The CPU has access to only extended

PROGRAM memory.

Figure 16. Memory Write (MSTRB = 0)

TMS320VC5409

FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

memory and parallel I/O interface timing (continued)

switching characteristics over recommended operating conditions for a parallel I/O port read (IOSTRB

= 0)† (see Figure 17)

’5409-80,-100

PARAMETER

MIN MAX

UNIT

d(CLKL-A)

Delay time, CLKOUT low to address valid 0 3 ns

d(CLKH-ISTRBL)

Delay time, CLKOUT h igh to IOSTR B low 0 3 ns

d(CLKH-ISTRBH)

Delay time, CLKOUT h igh to IOSTR B high 0 3 ns

h(A)IOR

Hold time, address after CLKOUT low 0 3 ns

†

Address and IS timings are included in timings referenced as address.

timing requirements for a parallel I/O port read (IOSTRB = 0) [H = 0.5 t

c(CO)

]† (see Figure 17)

’5409-80,-100

MIN MAX

UNIT

a(A)IO

Access time, read data access from address valid

‡

3H–9 ns

a(ISTRBL)IO

Access time, read data access from IOSTRB low

‡

2H–8 ns

su(D)IOR

Setup time, read data before CLKOUT high 8 ns

h(D)IOR

Hold time, read data after CLKOUT high 0 ns

h(ISTRBH-D)R

Hold time, read data after IOSTRB high 0 ns

†

Address and IS timings are included in timings referenced as address.

‡

This access timing reflects a zero wait-state timing.

R/W

IOSTRB

D[15:0]

A[22:0]

CLKOUT

h(A)IOR

d(CLKH-ISTRBH)

h(D)IOR

su(D)IOR

a(A)IO

d(CLKH-ISTRBL)

d(CLKL-A)

a(ISTRBL)IO

h(ISTRBH-D)R

NOTE A: A[22:16] apply to DMA accesses to extended I/O, DATA, PROGRAM memory. The CPU has access to only extended

PROGRAM memory.

Figure 17. Parallel I/O Port Read (IOSTRB = 0)

TMS320VC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

memory and parallel I/O interface timing (continued)

switching characteristics over recommended operating conditions for a

parallel I/O port write

(IOSTRB

= 0)

[H = 0.5 t

c(CO)

]† (see Figure 18)

’5409-80,-100

PARAMETER

MIN MAX

UNIT

d(CLKL-A)

Delay time, CLKOUT low to address valid 0 3 ns

d(CLKH-ISTRBL)

Delay time, CLKOUT h igh to IOSTR B low 0 3 ns

d(CLKH-D)IOW

Delay time, CLKOUT h i gh to write data valid H–5 H+8 ns

d(CLKH-ISTRBH)

Delay time, CLKOUT h igh to IOSTR B high 0 3 ns

d(CLKL-RWL)

Delay time, CLKOUT low to R/W low 0 3 ns

d(CLKL-RWH)

Delay time, CLKOUT low to R/W high 0 3 ns

h(A)IOW

Hold time, address valid after CLKOUT low 0 3 ns

h(D)IOW

Hold time, write data after IOSTRB high H–3 H+7 ns

su(D)IOSTRBH

Setup time, write data before IOSTRB high H–7 H+1 ns

su(A)IOSTRBL

Setup time, address valid before IOSTRB low H–2 H+2 ns

†

Address and IS timings are included in timings referenced as address.

R/W

IOSTRB

D[15:0]

A[22:0]

CLKOUT

d(CLKH-ISTRBH)

h(A)IOW

h(D)IOW

d(CLKH-D)IOW

d(CLKH-ISTRBL)

d(CLKL-A)

d(CLKL-RWL)

d(CLKL-RWH)

su(A)IOSTRBL

su(D)IOSTRBH

NOTE A: A[22:16] apply to DMA accesses to extended I/O, DATA, PROGRAM memory. The CPU has access to only extended

PROGRAM memory.

Figure 18. Parallel I/O Port Write (IOSTRB = 0)

TMS320VC5409

FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

ready timing for externally generated wait states

timing requirements for externally generated wait states [H = 0.5 t

c(CO)

]† (see Figure 19, Figure 20,

Figure 21, and Figure 22)

’5409-80,-100

MIN MAX

UNIT

su(RDY)

Setup time, READY before CLKOUT low 7 ns

h(RDY)

Hold time, READY after CLKOUT low 0 ns

v(RDY)MSTRB

Valid time, READY after MSTRB low

‡

4H–9 ns

h(RDY)MSTRB

Hold time, READY after MSTRB low

‡

4H ns

v(RDY)IOSTRB

Valid time, READY after IOSTRB low

‡

5H–9 ns

h(RDY)IOSTRB

Hold time, READY after IOSTRB low

‡

5H ns

v(MSCL)

Valid time, MSC low after CLKOUT low 0 3 ns

v(MSCH)

Valid time, MSC high after CLKOUT low 0 3 ns

†

The hardware wait states can be used only in conjunction with the software wait states to extend the bus cycles. To generate wait states using READY, at least two software wait states must be programmed.

‡

These timings are included for reference only. The critical timings for READY are those referenced to CLKOUT.

MSC

MSTRB

READY

A[22:0]

CLKOUT

v(MSCH)

v(MSCL)

h(RDY)

h(RDY)MSTRB

v(RDY)MSTRB

Wait State Generated by READY

Wait States

Generated Internally

su(RDY)

NOTE A: A[22:16] apply to DMA accesses to extended I/O, DATA, PROGRAM memory. The CPU has access to only extended

PROGRAM memory.

Figure 19. Memory Read With Externally Generated Wait States

TMS320VC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

ready timing for externally generated wait states (continued)

MSC

MSTRB

READY

D[15:0]

A[22:0]

CLKOUT

v(MSCH)

h(RDY)

Wait State Generated by READY

Wait States

Generated Internally

h(RDY)MSTRB

v(RDY)MSTRB

v(MSCL)

su(RDY)

NOTE A: A[22:16] apply to DMA accesses to extended I/O, DATA, PROGRAM memory. The CPU has access to only extended

PROGRAM memory.

Figure 20. Memory Write With Externally Generated Wait States

TMS320VC5409

FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

ready timing for externally generated wait states (continued)

su(RDY)

MSC

IOSTRB

READY

A[22:0]

CLKOUT

v(MSCH)

h(RDY)

Wait State Generated by READY

Wait

States

Generated

Internally

v(RDY)IOSTRB

v(MSCL)

h(RDY)IOSTRB

NOTE A: A[22:16] apply to DMA accesses to extended I/O, DATA, PROGRAM memory. The CPU has access to only extended

PROGRAM memory.

Figure 21. I/O Read With Externally Generated Wait States

TMS320VC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

ready timing for externally generated wait states (continued)

IOSTRB

MSC

READY

D[15:0]

A[22:0]

CLKOUT

h(RDY)

Wait State Generated by READY

Wait States

Generated

Internally

v(RDY)IOSTRB

su(RDY)

v(MSCH)

v(MSCL)

h(RDY)IOSTRB

NOTE A: A[22:16] apply to DMA accesses to extended I/O, DATA, PROGRAM memory. The CPU has access to only extended

PROGRAM memory.

Figure 22. I/O Write With Externally Generated Wait States

TMS320VC5409

FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

HOLD and HOLDA timings

switching characteristics over recommended operating conditions for memory control signals and HOLDA

, [H = 0.5 t

c(CO)

] (see Figure 23)

’5409-80, -100

PARAMETER

MIN MAX

UNIT

dis(CLKL-A)

Disable time, address, PS, DS, IS high impedance from CLKOUT low 5 ns

dis(CLKL-RW)

Disable time, R/W high impedance from CLKOUT low 5 ns

dis(CLKL-S)

Disable time, MSTRB, IOSTRB high impedance from CLKOUT low 5 ns

en(CLKL-A)

Enable time, address, PS, DS, IS from CLKOUT low 2H+5 ns

en(CLKL-RW)

Enable time, R/W enabled from CLKOUT low 2H+5 ns

en(CLKL-S)

Enable time, MSTRB, IOSTRB enabled from CLKOUT low 1 2H+5 ns Valid time, HOLDA low after CLKOUT low

0 4 ns

v(HOLDA)

Valid time, HOLDA high after CLKOUT low

0 4 ns

w(HOLDA)

Pulse duration, HOLDA low duration 2H–1 ns

timing requirements for memory control signals and HOLD, [H = 0.5 t

c(CO)

] (see Figure 23)

’5409-80, -100

MIN MAX

UNIT

w(HOLD)

Pulse duration, HOLD low 4H+8 ns

su(HOLD)

Setup time, HOLD low/high before CLKOUT low 8 ns

TMS320VC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

HOLD and HOLDA timings (continued)

IOSTRB

MSTRB

R/W

D[15:0]

, DS, IS

A[22:0]

HOLDA

HOLD

CLKOUT

en(CLKL-S)

en(CLKL-RW)

dis(CLKL-S)

dis(CLKL-RW)

dis(CLKL-A)

v(HOLDA)

w(HOLDA)

w(HOLD)

su(HOLD)

en(CLKL-A)

NOTE A: A[22:16] apply to DMA accesses to extended I/O, DATA, PROGRAM memory. The CPU has access to only extended

PROGRAM memory.

Figure 23. HOLD and HOLDA Timings (HM = 1)

TMS320VC5409

FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

reset, BIO, interrupt, and MP/MC timings timing requirements for reset, BIO, interrupt, and MP/MC [H = 0.5 t

c(CO)

] (see Figure 24, Figure 25,

and Figure 26)

’5409-80, -100

MIN MAX

UNIT

h(RS)

Hold time, RS after CLKOUT low 0 ns

h(BIO)

Hold time, BIO after CLKOUT low 0 ns

h(INT)

Hold time, INTn, NMI, after CLKOUT low

†

0 ns

h(MPMC)

Hold time, MP/MC after CLKOUT low 0 ns

w(RSL)

Pulse duration, RS low

‡§

4H+4 ns

w(BIO)S

Pulse duration, BIO low, synchronous 2H+1 ns

w(BIO)A

Pulse duration, BIO low, asynchronous 4H ns

w(INTH)S

Pulse duration, INTn, NMI high (synchronous) 2H+1 ns

w(INTH)A

Pulse duration, INTn, NMI high (asynchronous) 4H ns

w(INTL)S

Pulse duration, INTn, NMI low (synchronous) 2H+1 ns

w(INTL)A

Pulse duration, INTn, NMI low (asynchronous) 4H ns

w(INTL)WKP

Pulse duration, INTn, NMI low for IDLE2/IDLE3 wakeup 8 ns

su(RS)

Setup time, RS before X2/CLKIN low

6 ns

su(BIO)

Setup time, BIO before CLKOUT low 7 10 ns

su(INT)

Setup time, INTn, NMI, RS before CLKOUT low 8 10 ns

su(MPMC)

Setup time, MP/MC before CLKOUT low 8 ns

†

The external interrupts (INT0–INT3, NMI) are synchronized to the core CPU by way of a two-flip-flop synchronizer which samples these inputs with consecutive falling edges of CLKOUT. The input to the interrupt pins is required to represent a 1-0-0 sequence at the timing that is corresponding to three CLKOUT sampling sequences.

‡

If the PLL mode is selected, then at power-on sequence, or at wakeup from IDLE3, RS

must be held low for at least 50 µs to ensure

synchronization and lock-in of the PLL.

Note that RS

may cause a change in clock frequency, therefore changing the value of H.

Divide-by-two mode

TMS320VC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

reset, BIO, interrupt, and MP/MC timings (continued)

BIO

CLKOUT

, INTn, NMI

X2/CLKIN

h(BIO)

h(RS)

su(INT)

w(BIO)S

su(BIO)

w(RSL)

su(RS)

Figure 24. Reset and BIO Timings

INTn, NMI

CLKOUT

h(INT)

su(INT)

w(INTL)A

w(INTH)A

Figure 25. Interrupt Timing

MP/MC

CLKOUT

su(MPMC)

h(MPMC)

Figure 26. MP/MC Timing

TMS320VC5409

FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

instruction acquisition (IAQ), interrupt acknowledge (IACK), external flag (XF), and TOUT timings

switching characteristics over recommended operating conditions for IAQ and IACK [H = 0.5 t

c(CO)

] (see Figure 27)

’5409-80, -100

PARAMETER

MIN MAX

UNIT

d(CLKL-IAQL)

Delay time, CLKOUT low to IAQ low 0 3 ns

d(CLKL-IAQH)

Delay time, CLKOUT low to IAQ high 0 3 ns

d(A)IAQ

Delay time, address valid to IAQ low 1 ns

d(CLKL-IACKL)

Delay time, CLKOUT low to IACK low 0 3 ns

d(CLKL-IACKH)

Delay time , CLKOUT low to IACK high 0 3 ns

d(A)IACK

Delay time, address valid to IACK low 1 ns

h(A)IAQ

Hold time, IAQ high after address invalid – 2 ns

h(A)IACK

Hold time, IACK high after address invalid – 2 ns

w(IAQL)

Pulse duration, IAQ low 2H–2 ns

w(IACKL)

Pulse duration, IACK low 2H–2 ns

MSTRB

IACK

IAQ

A[22:0]

CLKOUT

d(A)IACK

d(A)IAQ

w(IACKL)

h(A)IACK

d(CLKL-IACKL)

w(IAQL)

h(A)IAQ

d(CLKL-IAQL)

d(CLKL-IACKH)

d(CLKL-IAQH)

NOTE A: A[22:16] apply to DMA accesses to extended I/O, DATA, PROGRAM memory. The CPU has access to only extended

PROGRAM memory.

Figure 27. IAQ and IACK Timings

TMS320VC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

instruction acquisition (IAQ), interrupt acknowledge (IACK), external flag (XF), and TOUT timings (continued)

switching characteristics over recommended operating conditions for XF and TOUT [H = 0.5 t

c(CO)

] (see Figure 28 and Figure 29)

’5409-80, -100

PARAMETER

MIN MAX

UNIT

Delay time, CLKOUT low to XF high 0 2

d(XF)

Delay time, CLKOUT low to XF low 0 2

d(TOUTH)

Delay time, CLKOUT low to TOUT high 0 4 ns

d(TOUTL)

Delay time, CLKOUT low to TOUT low 0 4 ns

w(TOUT)

Pulse duration, TOUT 2H ns

CLKOUT

d(XF)

Figure 28. XF Timing

TOUT

CLKOUT

w(TOUT)

d(TOUTL)

d(TOUTH)

Figure 29. TOUT Timing

TMS320VC5409

FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

multichannel buffered serial port timing

timing requirements for the McBSP† [H=0.5t

c(CO)

] (see Figure 30 and Figure 31)

MIN MAX UNIT

c(BCKRX)

Cycle time, BCLKR/X BCLKR/X ext 4H ns

w(BCKRX)

Pulse duration, BCLKR/X or BCLKR/X high BCLKR/X ext 2H–1 ns

BCLKR int 0

h(BCKRL-BFRH)

Hold time, external BFSR high after BCLKR low

BCLKR ext

BCLKR int 0

h(BCKRL-BDRV)

Hold time, BDR valid after BCLKR low

BCLKR ext

BCLKX int 0

h(BCKXL-BFXH)

Hold time, external BFSX high after BCLKX low

BCLKX ext

BCLKR int 7

su(BFRH-BCKRL)

Setup time, external BFSR high before BCLKR low

BCLKR ext

BCLKR int 7

su(BDRV-BCKRL)

Setup time, BDR valid before BCLKR low

BCLKR ext

BCLKX int 7

su(BFXH-BCKXL)

Setup time, external BFSX high before BCLKX low

BCLKX ext

r(BCKRX)

Rise time, BCKR/X BCLKR/X ext 8 ns

f(BCKRX)

Fall time, BCKR/X BCLKR/X ext 8 ns

†

Polarity bits CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, then the timing references of that signal are also inverted.

TMS320VC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

multichannel buffered serial port timing (continued)

switching characteristics for the McBSP

†

[H=0.5t

c(CO)

] (see Figure 30 and Figure 31)

PARAMETER MIN MAX UNIT

c(BCKRX)

Cycle time, BCLKR/X BCLKR/X int 4H ns

w(BCKRXH)

Pulse duration, BCLKR/X high BCLKR/X int D–3‡D+1

‡

w(BCKRXL)

Pulse duration, BCLKR/X low BCLKR/X int C–3‡C+1

‡

d(BCKRH-BFRV)

Delay time, BCLKR high to internal BFSR valid BCLKR int –2 2 ns

BCLKX int 0 6

d(BCKXH-BFXV)

Delay time, BCLKX high to internal BFSX valid

BCLKX ext

4 12

BCLKX int –4 7

dis(BCKXH-BDXHZ)

Disable time, BCLKX high to BDX high impedance following last data bit

BCLKX ext

3 9

Delay time, BCLKX high to BDX valid. This applies to all bits except the first

BCLKX int 0 7

Delay time, BCLKX high to BDX valid. This a lies to all bits exce t the first

bit transmitted.

BCLKX ext 4 12

d(BCKXH-BDXV)

Delay time, BCLKX high to BDX valid.

¶§

BCLKX int 7

Only applies to first bit transmitted when in Data Delay 1 or 2 (XDATDLY=01b or 10b) modes

DXENA = 0

BCLKX ext 12

Enable time, BCLKX high to BDX driven.

¶§

BCLKX int –4

e(BCKXH-BDX)

Only applies to first bit transmitted when in Data Delay 1 or 2 (XDATDLY=01b or 10b) modes

DXENA = 0

BCLKX ext 2

Delay time, BFSX high to BDX valid.

¶§

BFSX int 2

d(BFXH-BDXV)

Only applies to first bit transmitted when in Data Delay 0 (XDATDLY=00b) mode.

DXENA = 0

BFSX ext 12

Enable time, BFSX high to BDX driven.

¶§

BFSX int –1

e(BFXH-BDX)

Only applies to first bit transmitted when in Data Delay 0 (XDATDLY=00b) mode

DXENA = 0

BFSX ext 2

†

Polarity bits CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, then the timing references of that signal are also inverted.

‡

T=BCLKRX period = (1 + CLKGDV) * 2H C=BCLKRX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * 2H when CLKGDV is even D=BCLKRX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * 2H when CLKGDV is even

See the

TMS320C54x Enhanced Peripherals Reference Set, Volume 5

(literature number SPRU302) for a description of the DX enable (DXENA)

and data delay features of the McBSP.

The transmit delay enable (DXENA) and A-bis mode (ABIS) features of the McBSP are not implemented on the TMS320VC5409.

TMS320VC5409

FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

multichannel buffered serial port timing (continued)

(n–2)Bit (n–1)

(n–3)(n–2)Bit (n–1)

(n–4)(n–3)(n–2)Bit (n–1)

h(BCKRL–BDRV)

su(BDRV–BCKRL)

h(BCKRL–BDRV)

su(BDRV–BCKRL)

h(BCKRL–BDRV)

h(BCKRL–BFRH)

su(BFRH–BCKRL)

d(BCKRH–BFRV)

r(BCKRX)

w(BCKRXL)

c(BCKRX)

w(BCKRXH)

(RDATDLY=10b)

BDR

(RDATDLY=01b)

BDR

(RDATDLY=00b)

BDR

BFSR (ext)

BFSR (int)

BCLKR

Figure 30. McBSP Receive Timings

e(BCKXH–BDX)

d(BCKXH–BDXV)

e(BCKXH–BDX)

dis(BCKXH–BDXHZ)

d(BCKXH–BDXV)

d(BDFXH–BDXV)

e(BDFXH–BDX)

(XDATDLY=10b)

BDX

(XDATDLY=01b)

BDX

(XDATDLY=00b)

BDX

(n–2)Bit (n–1)Bit 0

(n–4)Bit (n–1) (n–3)(n–2)

Bit 0

(n–3)(n–2)Bit (n–1)

Bit 0

h(BCKXL–BFXH)

f(BCKRX)

r(BCKRX)

w(BCKRXL)

c(BCKRX)

w(BCKRXH)

BFSX (ext)

BFSX (int)

BCLKX

d(BCKXH–BFXV)

su(BFXH–BCKXL)

Figure 31. McBSP Transmit Timings

TMS320VC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

multichannel buffered serial port timing (continued)

timing requirements for McBSP general-purpose I/O (see Figure 32)

’5409-80, -100

MIN MAX

UNIT

su(BGPIO-COH)

Setup time, BGPIOx input mode before CLKOUT high

†

9 ns

h(COH-BGPIO)

Hold time, BGPIOx input mode after CLKOUT high

†

0 ns

†

BGPIOx refers to BCLKRx, BFSRx, BDRx, BCLKXx, or BFSXx when configured as a general-purpose input.

switching characteristics for McBSP general-purpose I/O (see Figure 32)

’5409-80, -100

PARAMETER

MIN MAX

UNIT

d(COH-BGPIO)

Delay time, CLKOUT high to BGPIOx output mode

‡

–10 10 ns

‡

BGPIOx refers to BCLKRx, BFSRx, BCLKXx, BFSXx, or BDXx when configured as a general-purpose output.

su(BGPIO-COH)

h(COH-BGPIO)

d(COH-BGPIO)

CLKOUT

BGPIOx Input

Mode

†

BGPIOx Output

Mode

‡

†

BGPIOx refers to BCLKRx, BFSRx, BDRx, BCLKXx, or BFSXx when configured as a general-purpose input.

‡

BGPIOx refers to BCLKRx, BFSRx, BCLKXx, BFSXx, or BDXx when configured as a general-purpose output.

Figure 32. McBSP General-Purpose I/O Timings

TMS320VC5409

FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

multichannel buffered serial port timing (continued)

timing requirements for McBSP as SPI master or slave: [H=0.5t

c(CO)

] CLKSTP = 10b, CLKXP = 0

†

(see Figure 33)

’5409-80, -100

MASTER SLAVE

UNIT

MIN MAX MIN MAX

su(BDRV-BCKXL)

Setup time, BDR valid before BCLKX low 10 – 12H ns

h(BCKXL-BDRV)

Hold time, BDR valid after BCLKX low 0 5 + 12H ns

su(BFXL-BCKXH)

Setup time, BFSX low before BCLKX high 10 ns

c(BCKX)

Cycle time, BCLKX 12H 32H ns

†

For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.

switching characteristics for McBSP as SPI master or slave: [H=0.5t

c(CO)

] CLKSTP = 10b,

CLKXP = 0

†

(see Figure 33)

’5409-80, -100

PARAMETER

MASTER

‡

SLAVE

UNIT

MIN MAX MIN MAX

h(BCKXL-BFXL)

Hold time, BFSX low after BCLKX low

T – 4 T + 4 ns

d(BFXL-BCKXH)

Delay time, BFSX low to BCLKX high

C – 5 C + 3 ns

d(BCKXH-BDXV)

Delay time, BCLKX high to BDX valid – 3 7 6H + 5 10H + 14 ns

dis(BCKXL-BDXHZ)

Disable time, BDX high impedance following last data bit from BCLKX low

C – 2 C + 3 ns

dis(BFXH-BDXHZ)

Disable time, BDX high impedance following last data bit from BFSX high

2H+ 3 6H + 17 ns

d(BFXL-BDXV)

Delay time, BFSX low to BDX valid 4H + 2 8H + 17 ns

†

For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.

‡

T = BCLKX period = (1 + CLKGDV) * 2H C = BCLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * 2H when CLKGDV is even

FSRP = FSXP = 1. As a SPI master, BFSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on BFSX and BFSR is inverted before being used internally. CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP

BFSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (BCLKX).

Bit 0 Bit(n-1) (n-2) (n-3) (n-4)

BCLKX

BFSX

BDX

BDR

su(BDRV-BCLXL)

d(BCKXH-BDXV)

h(BCKXL-BDRV)

dis(BFXH-BDXHZ)

dis(BCKXL-BDXHZ)

h(BCKXL-BFXL)

d(BFXL-BDXV)

d(BFXL-BCKXH)

LSB

MSB

su(BFXL-BCKXH)

c(BCKX)

Figure 33. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0

TMS320VC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

multichannel buffered serial port timing (continued)

timing requirements for McBSP as SPI master or slave: [H=0.5t

c(CO)

] CLKSTP = 11b, CLKXP = 0

†

(see Figure 34)

’5409-80, -100

MASTER SLAVE

UNIT

MIN MAX MIN MAX

su(BDRV-BCKXL)

Setup time, BDR valid before BCLKX low 10 – 12H ns

h(BCKXH-BDRV)

Hold time, BDR valid after BCLKX high 0 5 + 12H ns

su(BFXL-BCKXH)

Setup time, BFSX low before BCLKX high 10 ns

c(BCKX)

Cycle time, BCLKX 32H ns

†

For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.

switching characteristics for McBSP as SPI master or slave: [H=0.5t

c(CO)

] CLKSTP = 11b,

CLKXP = 0

†

(see Figure 34)

’5409-80, -100

PARAMETER

MASTER

‡

SLAVE

UNIT

MIN MAX MIN MAX

h(BCKXL-BFXL)

Hold time, BFSX low after BCLKX low

C – 4 C + 4 ns

d(BFXL-BCKXH)

Delay time, BFSX low to BCLKX high

T – 5 T + 3 ns

d(BCKXL-BDXV)

Delay time, BCLKX low to BDX valid – 3 7 6H + 5 10H + 14 ns

dis(BCKXL-BDXHZ)

Disable time, BDX high impedance following last data bit from BCLKX low

– 2 4 6H + 3 10H + 17 ns

d(BFXL-BDXV)

Delay time, BFSX low to BDX valid D – 1 D + 4 4H – 2 8H + 17 ns

†

For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.

‡

T = BCLKX period = (1 + CLKGDV) * 2H C = BCLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * 2H when CLKGDV is even D = BCLKX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * 2H when CLKGDV is even

BFSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (BCLKX).

Bit 0 Bit(n-1) (n-2) (n-3) (n-4)

BCLKX

BFSX

BDX

BDR

d(BFXL-BCKXH)

dis(BCKXL-BDXHZ)

d(BCKXL-BDXV)

h(BCKXH-BDRV)

su(BDRV-BCKXH)

d(BFXL-BDXV)

h(BCKXL-BFXL)

LSB

MSB

su(BFXL-BCKXH)

c(BCKX)

Figure 34. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0

TMS320VC5409

FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

multichannel buffered serial port timing (continued)

timing requirements for McBSP as SPI master or slave: [H=0.5t

c(CO)

] CLKSTP = 10b, CLKXP = 1

†

(see Figure 35)

’5409-80, -100

MASTER SLAVE

UNIT

MIN MAX MIN MAX

su(BDRV-BCKXH)

Setup time, BDR valid before BCLKX high 10 – 12H ns

h(BCKXH-BDRV)

Hold time, BDR valid after BCLKX high 0 5 + 12H ns

su(BFXL-BCKXL)

Setup time, BFSX low before BCLKX low 10 ns

c(BCKX)

Cycle time, BCLKX 32H ns

†

For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.

switching characteristics for McBSP as SPI master or slave: [H=0.5t

c(CO)

] CLKSTP = 10b,

CLKXP = 1

†

(see Figure 35)

’5409-80, -100

PARAMETER

MASTER

‡

SLAVE

UNIT

MIN MAX MIN MAX

h(BCKXH-BFXL)

Hold time, BFSX low after BCLKX high

T – 4 T + 4 ns

d(BFXL-BCKXL)

Delay time, BFSX low to BCLKX low

D – 5 D + 3 ns

d(BCKXL-BDXV)

Delay time, BCLKX low to BDX valid – 3 7 6H + 5 10H + 14 ns

dis(BCKXH-BDXHZ)

Disable time, BDX high impedance following last data bit from BCLKX high

D – 2 D + 3 ns

dis(BFXH-BDXHZ)

Disable time, BDX high impedance following last data bit from BFSX high

2H + 3 6H + 17 ns

d(BFXL-BDXV)

Delay time, BFSX low to BDX valid 4H – 2 8H + 17 ns

†

For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.

‡

T = BCLKX period = (1 + CLKGDV) * 2H D = BCLKX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * 2H when CLKGDV is even

BFSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (BCLKX).

su(BFXL-BCKXL)

h(BCKXH-BDRV)

dis(BFXH-BDXHZ)

dis(BCKXH-BDXHZ)

Bit 0 Bit(n-1) (n-2) (n-3) (n-4)

BCLKX

BFSX

BDX

BDR

d(BFXL-BCKXL)

d(BFXL-BDXV)

d(BCKXL-BDXV)

su(BDRV-BCKXH)

h(BCKXH-BFXL)

LSB

MSB

c(BCKX)

Figure 35. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1

TMS320VC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

multichannel buffered serial port timing (continued)

timing requirements for McBSP as SPI master or slave: [H=0.5t

c(CO)

] CLKSTP = 11b, CLKXP = 1

†

(see Figure 36)

’5409-80, -100

MASTER SLAVE

UNIT

MIN MAX MIN MAX

su(BDRV-BCKXL)

Setup time, BDR valid before BCLKX low 10 – 12H ns

h(BCKXL-BDRV)

Hold time, BDR valid after BCLKX low 0 5 + 12H ns

su(BFXL-BCKXL)

Setup time, BFSX low before BCLKX low 10 ns

c(BCKX)

Cycle time, BCLKX 32H ns

†

For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.

switching characteristics for McBSP as SPI master or slave: [H=0.5t

c(CO)

] CLKSTP = 11b,

CLKXP = 1

†

(see Figure 36)

’5409-80, -100

PARAMETER

MASTER

‡

SLAVE

UNIT

MIN MAX MIN MAX

h(BCKXH-BFXL)

Hold time, BFSX low after BCLKX high

D – 4 D + 4 ns

d(BFXL-BCKXL)

Delay time, BFSX low to BCLKX low

T – 5 T + 3 ns

d(BCKXH-BDXV)

Delay time, BCLKX high to BDX valid – 3 7 6H + 5 10H + 14 ns

dis(BCKXH-BDXHZ)

Disable time, BDX high impedance following last data bit from BCLKX high

– 2 4 6H + 3 10H + 17 ns

d(BFXL-BDXV)

Delay time, BFSX low to BDX valid C – 1 C + 4 4H – 2 8H + 17 ns

†

For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.

‡

BFSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (BCLKX).

Bit 0 Bit(n-1) (n-2) (n-3) (n-4)

BCLKX

BFSX

BDX

BDR

d(BFXL-BCKXL)

su(BDRV-BCKXL)

dis(BCKXH-BDXHZ)

h(BCKXH-BFXL)

d(BCKXH-BDXV)

h(BCKXL-BDRV)

d(BFXL-BDXV)

LSB

MSB

su(BFXL-BCKXL)

c(BCKX)

Figure 36. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1

TMS320VC5409

FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

HPI8 timing

switching characteristics over recommended operating conditions

†‡§¶

[H = 0.5t

c(CO)

]

(see Figure 37, Figure 38, Figure 40, and Figure 41)

’5409-80, -100

PARAMETER

MIN MAX

UNIT

en(DSL-HD)

Enable time, HD driven from DS low 2 19 ns

Case 1a: Memory accesses when DMAC is active in 16-bit mode and t

w(DSH)

< 18H

18H+19 – t

w(DSH)

Case 1b: Memory accesses when DMAC is active in 16-bit mode and t

w(DSH)

≥ 18H

Delay time, DS low to HDx valid for

Case 1c: Memory access when DMAC is active in 32-bit mode and t

w(DSH)

< 26H

26H+19 – t

w(DSH)

d(DSL-HDV1)

Delay time, DS low to HDx valid for

first byte of an HPI read

Case 1d: Memory access when DMAC is active in 32-bit mode and t

w(DSH)

≥ 26H

Case 2a: Memory accesses when DMAC is inactive and t

w(DSH)

< 10H

10H+19 – t

w(DSH)

Case 2b: Memory accesses when DMAC is inactive and t

w(DSH)

≥ 10H

Case 3: Register accesses 19

d(DSL-HDV2)

Delay time, DS low to HDx valid for second byte of an HPI read 19 ns

h(DSH-HDV)R

Hold time, HDx valid after DS high, for a HPI read 3 5 ns

v(HYH-HDV)

Valid time, HDx valid after HRDY high 5

d(DSH-HYL)

Delay time, DS high to HRDY low (see Note 1) 10 ns

Case 1a: Memory accesses when DMAC is active in 16-bit mode

18H+10 ns

Case 1b: Memory accesses when DMAC is active in 32-bit mode

26H+10

d(DSH-HYH)

Delay time, DS high to HRDY high

Case 2: Memory accesses when DMAC is inactive

10H+10

Case 3: Write accesses to HPIC register (see Note 2)

6H+10

d(HCS-HRDY)

Delay time, HCS low/high to HRDY low/high

15 ns

d(COH-HYH

) Delay time, CLKOUT high to HRDY high 2 ns

d(COH-HTX)

Delay time, CLKOUT high to HINT change 5 ns

NOTES: 1. The HRDY output is always high when the HCS input is high, regardless of DS timings.

2. This timing applies when writing a one to the DSPINT bit or HINT bit of the HPIC register. All other writes to the HPIC occur asynchronously, and do not cause HRDY to be deasserted.

†

DS refers to the logical OR of HCS

, HDS1, and HDS2.

‡

HDx refers to any of the HPI data bus pins (HD0, HD1, HD2, etc.).

DMAC stands for direct memory access (DMA) controller. The HPI8 shares the internal DMA bus with the DMAC, thus HPI8 access times are affected by DMAC activity.

GPIO refers to the HD pins when they are configured as general-purpose input/outputs.

TMS320VC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

HPI8 timing (continued)

timing requirements

†‡§

(see Figure 37, Figure 38, Figure 40, and Figure 41)

’5409-80, -100

MIN MAX

UNIT

su(HBV-DSL)

Setup time, HBIL valid before DS low 5 ns

h(DSL-HBV)

Hold time, HBIL valid after DS low 5 ns

su(HSL-DSL)

Setup time, HAS low before DS low 5 ns

w(DSL)

Pulse duration, DS low 20 ns

w(DSH)

Pulse duration, DS high 10 ns

su(HDV-DSH)

Setup time, HDx valid before DS high, HPI write 5 ns

h(DSH-HDV)W

Hold time, HDx valid after DS high, HPI write 5 ns

†

DS refers to the logical OR of HCS, HDS1, and HDS2.

‡

HDx refers to any of the HPI data bus pins (HD0, HD1, HD2, etc.).

GPIO refers to the HD pins when they are configured as general-purpose input/outputs.

TMS320VC5409

FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

HPI8 timing (continued)

Valid

su(HSL-DSL)

Valid

su(HBV-DSL)

‡

HAS

HBIL

h(DSL-HBV)

‡

d(DSH-HYH)

w(DSL)

d(DSL-HDV1)

v(HYH-HDV)

Valid Valid

Valid

d(COH-HYH)

Valid

w(DSH)

d(DSH-HYL)

h(DSH-HDV)R

h(DSH-HDV)W

Valid

su(HDV-DSH)

d(DSL-HDV2)

en(DSL-HD)

HCS

HDS

HRDY

HD READ

Valid

HD WRITE

CLKOUT

Second Byte First Byte Second Byte

HAD

†

HAD refers to HCNTL0, HCNTL1, and HR/W.

‡

When HAS

is not used (HAS always high)

Figure 37. Using HDS to Control Accesses (HCS Always Low)

TMS320VC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

HPI8 timing (continued)

Second Byte

First Byte

Second Byte

d(HCS-HRDY)

HCS

HDS

HRDY

Figure 38. Using HCS to Control Accesses

CLKOUT

HRDY

d(COH–HYH)

Figure 39. HRDY Relative to CLKOUT

HINT

CLKOUT

d(COH-HTX)

Figure 40. HINT Timing

TMS320VC5409

FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

timing requirements for GPIO (see Figure 41)

MIN MAX UNIT

su(GPIO-COH)

Setup time, GPIOx input valid before CLKOUT high, GPIOx configured as general-purpose input.

7 ns

h(GPIO-COH)

Hold time, GPIOx input valid after CLKOUT high, GPIOx configured as general-purpose input.

0 ns

switching characteristics for GPIO (see Figure 41)

PARAMETER MIN MAX UNIT

d(COH-GPIO)

Delay time, CLKOUT high to GPIOx output change. GPIOx configured as general-purpose output.

0 6 ns

GPIOx Input Mode

†

CLKOUT

h(GPIO-COH)

GPIOx Output Mode

†

su(GPIO-COH)

d(COH-GPIO)

†

GPIOx refers to HD0, HD1, HD2, ...HD7, when the HD bus is configured for general-purpose input/output (I/O).

Figure 41. GPIOx† Timings

TMS320VC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

HPI16 timing

switching characteristics over recommended operating conditions

†‡§

[H = 0.5t

c(CO)

]

(see Figure 42 and Figure 43)

PARAMETER MIN MAX UNIT

en(DSL-HD)

Enable time, Dx driven from DS low 6 19 ns

Case 1a: Memory accesses when DMAC is active in 16-bit mode and t

w(DSH)

< 18H

18H+19 – t

w(DSH)

Delay time, DS low to Dx valid for an

Case 1b: Memory accesses when DMAC is active in 16-bit mode and t

w(DSH)

≥ 18H

d(DSL-HDV1)

HPI read

Case 2a: Memory accesses when DMAC is inactive and t

w(DSH)

< 10H

10H+19 – t

w(DSH)

Case 2b: Memory accesses when DMAC is inactive and t

w(DSH)

≥ 10H

Case 3: Register accesses 19

h(DSH-HDV)R

Hold time, Dx valid after DS rising edge, read

1 8 ns

(HYH-HDV)

Valid time, Dx valid before HRDY rising edge

0 6 ns

d(DSH-HYL)

Delay time, DS or HCS high to HRDY low

‡

10 ns

Delay time, DS high to HRDY high

Case 1: Memory access when DMAC is active in 16-bit mode

18H+10

d(DSH-HYH)

Delay time, DS high to HRDY high

(writes and autoincrement reads)

Case 2: Memory access when DMAC is inactive

10H+10

d(DSL-HYL)

Delay time, HDS or HCS low/high to HRDY low/high 10 ns

d(COH–HYH)

Delay time, CLKOUT high to HRDY high 2 ns

NOTE: The HRDY output is always high when the HCS input is high, regardless of DS timings. †

DS refers to the logical OR of HCS

, HDS1, or HDS2.

‡

Dx refers to any of the DPI data bus pins (D0, D1, D2, etc.).

DMAC stands for direct memory access (DMA) controller. The HPI16 shares the internal DMA bus with the DMAC, thus HPI16 access times are affected by DMAC activity.

GPIO refers to the HD pins when they are configured as general-purpose input/outputs.

TMS320VC5409

FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

HPI16 timing (continued)

timing requirements

†‡§

[H = 0.5t

c(CO)

] (see Note 1, Figure 42, and Figure 43)

MIN MAX UNIT

su(HBV-DSL)

Setup time, HAD valid before DS falling edge

†‡

5 ns

h(DSL-HBV)

Hold time, HAD valid after DS falling edge

†‡

5 ns

su(HAV-DSL)

Setup time, HAD valid before DS falling edge

†

–4H+3 ns

h(DSH-HAV)

Hold time, address valid after DS rising edge

†

1 ns

su(HDV-DSH)

Setup time, Dx valid before DS high (HPI write) 3 ns

h(DSH-HDV)W

Hold time, Dx valid after DS high (HPI write) 2 ns

w(DSL)

Pulse duration, DS low

‡

20 ns

w(DSH)

Pulse duration, DS high

‡

10 ns

Cycle time, DS rising edge to next DS rising edge

‡

Nonmultiplexed mode (no increment) with no DMA activity.

12H ns

c(DSH-DSH)

(Minimum timings represent WRITEs while maximum timings represent READs)

Nonmultiplexed mode (no increment) with 16-bit DMA activity.

20H ns

†

DS refers to the logical OR of HCS and HDS1 and HDS2.

‡

Dx refers to any of the HPI data bus pins (D0, D1, D2, etc.).

GPIO refers to the HD pins when they are configured as general-purpose input/outputs.

TMS320VC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

HPI16 timing (continued)

d(DSL–HYH)

v(HYH–HDV)

h(DSH–HDV)R

d(DSL–HDV1)

en(DSL–HD)

h(DSH–HAV)

su(HAV–DSL)

h(DSL–HBV)

w(DSL)

su(HBV–DSL)

w(DSH)

c(DSH–DSH)

HRDY

HA[15:0]

HR/W

HDS

HCS

Data ValidData Valid

Valid AddressValid Address

(A[15:0])

D[15:0]

Figure 42. Nonmultiplexed Read Timings

TMS320VC5409

FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

HPI16 timing (continued)

HRDY

D[15:0]

HA[15:0]

HR/W

HDS

HCS

Data ValidData Valid

h(DSH–HDV)W

su(HDV–DSH)

Valid AddressValid Address

h(DSH–HAV)

h(DSL–HBV)

w(DSL)

su(HBV–DSL)

w(DSH)

c(DSH–DSH)

su(HAV–DSH)

d(DSH–HYH)

d(DSL–HYL)

A[15:0]

Figure 43. Nonmultiplexed Write Timings

TMS320VC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

MECHANICAL DATA

PGE (S-PQFP-G144) PLASTIC QUAD FLATPACK

4040147/C 10/96

0,27

0,17

0,13 NOM

0,25

0,75 0,45

0,05 MIN

Seating Plane

Gage Plane

108

109

144

22,20 21,80

19,80

17,50 TYP

20,20

1,35

1,45

1,60 MAX

0,08

0°–7°

0,08

0,50

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Falls within JEDEC MS-026

Thermal Resistance Characteristics

PARAMETER

°C/W

ΘJA

ΘJC

TMS320VC5409

FIXED-POINT DIGITAL SIGNAL PROCESSOR

SPRS082C – APRIL 1999 – REVISED MARCH 2000

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443

MECHANICAL DATA

GGU (S-PBGA-N144) PLASTIC BALL GRID ARRAY PACKAGE

0,80

0,10

0,08

0,80

9,60 TYP

12 1310 118967

42 3

C B

Seating Plane

4073221/A 11/96

11,90

12,10

0,95

0,35

0,45

0,55

0,85

0,08

0,12

1,40 MAX

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. MicroStar BGA configuration

Thermal Resistance Characteristics

PARAMETER

°C/W

ΘJA

ΘJC

MicroStar BGA is a trademark of Texas Instruments Incorporated.

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Texas Instruments TMX320VC5409PGE100, TMX320VC5409GGU100, TMS320VC5409GGU100, TMS320VC5409GGU-80, TMS320VC5409PGE100 Datasheet

Specifications and Main Features

Frequently Asked Questions

User Manual