PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty . Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
ProductsApplications
Amplifiersamplifier.ti.comAudiowww.ti.com/audio
Data Convertersdataconverter.ti.comAutomotivewww.ti.com/automotive
DSPdsp.ti.comBroadbandwww.ti.com/broadband
Interfaceinterface.ti.comDigital Controlwww.ti.com/digitalcontrol
Logiclogic.ti.comMilitarywww.ti.com/military
Power Mgmtpower.ti.comOptical Networkingwww.ti.com/opticalnetwork
Microcontrollersmicrocontroller.ti.comSecuritywww.ti.com/security
Telephonywww.ti.com/telephony
Video & Imagingwww.ti.com/video
Wirelesswww.ti.com/wireless
Mailing Address:Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright 2004, Texas Instruments Incorporated
Revision History
REVISION HISTORY
This data sheet revision history highlights the technical changes made to the SPRS007C device-specific data
sheet to make it an SPRS007D revision.
Scope: This document has been reviewed for technical accuracy; the technical content is up-to-date as of the
specified release date with the following changes.
PAGE(S)
NO.
21Added “This pin must be tied directly to DVDD to enable HPI.” to the HPIENA description and “This pin must be tied directly to
38Added the following to Section 3.9: “Since the Timer1 output is multiplexed externally with the HINT output, the HPI must be
42Changed the parenthetical statement “(such as the McBSPs)” in Section 3.12. to read “(such as the McBSPs, but not the
48Added the following footnote to Table 3−12: “Note that the UART DMA synchronization event is usable as a synchronization
59Changed Figure 3−23, bit 15 from “Reserved” to “TOUT1”.
60Added the following paragraph to Section 3.14.2: “Bit 15 of the GPIOCR is also used as the Timer1 output enable bit, TOUT1.
71Changed the I
DV
to enable HPI16 mode.” to the HPI16 description in Table 2−2. Also deleted “Internally pulled low.” from the HPI16
DD
description.
disabled (HPIENA input pin = 0) if the Timer1 output is to be used. The Timer1 output also has a dedicated enable bit in the
General Purpose I/O Control Register (GPIOCR) located at data memory address 003Ch. If the external Timer1 output is to
be used, in addition to disabling the HPI, the TOUT1 bit in the GPIOCR must also be set to 1.”
UART)”
event only, and is not usable for transferring data to or from the UART. The DMA cannot be used to transfer data to or from
the UART.”
The TOUT1 bit enables or disables the Timer1 output on the HINT
available externally; if TOUT1 = 1, the Timer1 output is driven on the HINT
only available when the HPI is disabled (HPIENA input pin = 0).”
parameter from “60” to “42” in the Electrical Characteristics Over Recommended Operating Case
Temperature Range table.
DDC
ADDITIONS/CHANGES/DELETIONS
/TOUT1 pin. If TOUT1 = 0, the Timer1 output is not
IDLE2, and IDLE3 Instructions With
Power-Down Modes
DCLKOUT Off Control to Disable CLKOUT
DOn-Chip Scan-Based Emulation Logic,
IEEE Std 1149.1
Logic
†
(JTAG) Boundary Scan
D144-Pin Ball Grid Array (BGA)
(GGU Suffix)
D144-Pin Low-Profile Quad Flatpack (LQFP)
(PGE Suffix)
D8.33-ns Single-Cycle Fixed-Point
Instruction Execution Time (120 MIPS)
D3.3-V I/O Supply Voltage
D1.5-V Core Supply Voltage
†
IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
All trademarks are the property of their respective owners.
November 2001 − Revised April 2004SPRS007D
13
Introduction
2Introduction
This data manual discusses features and specifications of the TMS320VC5407 and TMS320VC5404
(hereafter referred to as the 5407/5404 unless otherwise specified) digital signal processors (DSPs). The 5407
and 5404 are essentially the same device except for differences in their memory maps.
This section lists the pin assignments and describes the function of each pin. This data manual also provides
a detailed description section, electrical specifications, parameter measurement information, and mechanical
data about the available packaging.
NOTE: This data manual is designed to be used in conjunction with the TMS320C54x DSP Functional
Overview (literature number SPRU307).
2.1Description
The 5407/5404 are based on an advanced modified Harvard architecture that has one program memory bus
and three data memory buses. These processors provide an arithmetic logic unit (ALU) with a high degree
of parallelism, application-specific hardware logic, on-chip memory, and additional on-chip peripherals. The
basis of the operational flexibility and speed of these DSPs is a highly specialized instruction set.
Separate program and data spaces allow simultaneous access to program instructions and data, providing
a high degree of parallelism. Two read operations and one write operation can be performed in a single cycle.
Instructions with parallel store and application-specific instructions can fully utilize this architecture. In
addition, data can be transferred between data and program spaces. Such parallelism supports a powerful
set of arithmetic, logic, and bit-manipulation operations that can all be performed in a single machine cycle.
These DSPs also include the control mechanisms to manage interrupts, repeated operations, and function
calls.
2.2Pin Assignments
Figure 2−1 illustrates the ball locations for the 144-pin ball grid array (BGA) package and is used in conjunction
with Table 2−1 to locate signal names and ball grid numbers. Figure 2−2 provides the pin assignments for the
144-pin low-profile quad flatpack (LQFP) package.
Table 2−1 lists each signal name and BGA ball number for the 144-pin TMS320VC5407/
TMS320VC5404GGU package. Table 2−2 lists each terminal name, terminal function, and operating modes
for the TMS320VC5407/TMS320VC5404.
MicroStar BGA is a trademark of Texas Instruments.
November 2001 − Revised April 2004SPRS007D
15
Introduction
†
SIGNAL
QUADRANT 4
SIGNAL
QUADRANT 1
V
SS
Table 2−1. Terminal Assignments for the 144-Pin BGA Package
SIGNAL
BGA BALL #
QUADRANT 2
BGA BALL #
A1BCLKRX2N13V
SIGNAL
QUADRANT 3
SS
BGA BALL #
N1A19A13
A22B1BDX2M13TXN2A20A12
V
DV
SS
DD
C2DV
C1V
SS
DD
L12HCNTL0M3V
L13V
SS
N3DV
SS
DD
A10D4CLKMD1K10BCLKR0K4D6D10
HD7D3CLKMD2K11BCLKR1L4D7C10
A11D2CLKMD3K12BFSR0M4D8B10
A12D1HPI16K13BFSR1N4D9A10
A13E4HD2J10BDR0K5D10D9
A14E3TOUTJ11HCNTL1L5D11C9
A15E2EMU0J12BDR1M5D12B9
CV
DD
E1EMU1/OFFJ13BCLKX0N5HD4A9
HASF4TDOH10BCLKX1K6D13D8
V
SS
V
SS
CV
DD
HCSG2TMSG12BFSX0M7CV
HR/WG1V
READYG3CV
PSG4HPIENAG10DV
DSH1V
ISH2CLKOUTF12HD0M8DV
F3TDIH11V
SS
L6D14C8
F2TRSTH12HINT/TOUT1M6D15B8
F1TCKH13CVDDN6HD5A8
DD
SS
DD
SS
G13BFSX1N7V
SS
G11HRDYL7HDS1C7
K7V
SS
N8HDS2A6
DD
F13V
DD
SS
R/WH3HD3F11BDX0L8A0C6
MSTRBH4X1F10BDX1K8A1D6
IOSTRBJ1X2/CLKINE13IACKN9A2A5
MSCJ2RSE12HBILM9A3B5
XFJ3D0E11NMIL9HD6C5
HOLDAJ4D1E10INT0K9A4D5
IAQK1D2D13INT1N10A5A4
HOLDK2D3D12INT2M10A6B4
BIOK3D4D11INT3L10A7C4
MP/MCL1D5C13CV
DV
DD
V
SS
L2A16C12HD1M11A9B3
L3V
SS
C11V
DD
SS
N11A8A3
L11CV
DD
BDR2M1A17B13RXN12A21A2
BFSRX2M2A18B12V
SS
M12V
SS
BGA BALL #
B11
A11
B7
A7
D7
B6
C3
B2
†
DVDD is the power supply for the I/O pins while CVDD is the power supply for the core CPU. VSS is the ground for both the I/O pins and the
core CPU.
16
November 2001 − Revised April 2004SPRS007D
2.2.2 Pin Assignments for the PGE Package
The TMS320VC5407/TMS320VC5404PGE 144-pin low-profile quad flatpack (LQFP) pin assignments are
shown in Figure 2−2.
IACKO/ZInterrupt acknowledge signal. IACK Indicates receipt of an interrupt and that the program counter is fetching
INT0
INT1
INT2
INT3
NMIINonmaskable interrupt. NMI is an external interrupt that cannot be masked by way of the INTM or the IMR.
†
I = Input, O = Output, Z = High-impedance, S = Supply
†
I/O
EXTERNAL MEMORY INTERFACE PINS
O/ZParallel address bus A22 (MSB) through A0 (LSB). The lower sixteen address pins—A0 to A15—are
I/O/ZD15 (MSB)
multiplexed to address all external memory (program, data) or I/O, while the upper seven address
pins—A22 to A16—are only used to address external program space. These pins are placed in the
high-impedance state when the hold mode is enabled, or when OFF
the interrupt vector location designated by A15–0. IACK
is low.
IExternal user interrupt inputs. INT0−3 are prioritized and maskable via the interrupt mask register and
interrupt mode bit. The status of these pins can be polled by way of the interrupt flag register.
When NMI
IThese pins can be used to address internal memory via the HPI when the HPI16 pin
is high.
I/OParallel data bus D15 (MSB) through D0 (LSB). The sixteen data pins, D0 to D15,
are multiplexed to transfer data between the core CPU and external data/program
memory, I/O devices, or HPI in 16-bit mode. The data bus is placed in the
high-impedance state when not outputting or when RS
data bus also goes into the high-impedance state when OFF
The data bus includes bus holders to reduce the static power dissipation caused by
floating, unused pins. The bus holders also eliminate the need for external bias
resistors on unused pins. When the data bus is not being driven by the DSP, the bus
holders keep the pins at the logic level that was most recently driven. The data bus
holders of the DSP are disabled at reset, and can be enabled/disabled via the BH bit
of the BSCR.
INITIALIZATION, INTERRUPT, AND RESET PINS
is activated, the processor traps to the appropriate vector location.
DESCRIPTION
is low.
or HOLD is asserted. The
is low.
also goes into the high-impedance state when OFF
18
November 2001 − Revised April 2004SPRS007D
Introduction
Table 2−2. Signal Descriptions (Continued)
TERMINAL
NAME
RSIReset input. RS causes the DSP to terminate execution and causes a re-initialization of the CPU and
MP/MCIMicroprocessor/microcomputer mode select pin. If active low at reset, microcomputer mode is selected, and
BIOIBranch control input. A branch can be conditionally executed when BIO is active. If low, the processor
XFO/ZExternal flag output (latched software-programmable signal). XF is set high by the SSBX XF instruction, set
DS
PS
IS
MSTRBO/ZMemory strobe signal. MSTRB is always high unless low-level asserted to indicate an external bus access
READYIData ready input. READY indicates that an external device is prepared for a bus transaction to be
R/WO/ZRead/write signal. R/W indicates transfer direction during communication to an external device. Normally in
IOSTRBO/ZI/O strobe signal. IOSTRB is always high unless low level asserted to indicate an external bus access to an
HOLDIHold input. HOLD is asserted to request control of the address, data, and control lines. When
HOLDAO/ZHold acknowledge signal. HOLDA indicates that the DSP is in a hold state and that the address, data, and
MSCO/ZMicrostate complete. MSC indicates completion of all software wait states. When two or more software wait
IAQO/ZInstruction acquisition signal. IAQ is asserted (active low) when there is an instruction address on the
†
I = Input, O = Output, Z = High-impedance, S = Supply
†
INITIALIZATION, INTERRUPT, AND RESET PINS (CONTINUED)
peripherals. When RS
affects various registers and status bits.
RS
the internal program ROM is mapped into the upper 16K words of program memory space. If the pin is
driven high during reset, microprocessor mode is selected, and the on-chip ROM is removed from program
space. This pin is only sampled at reset, and the MP/MC
that is selected at reset.
MULTIPROCESSING AND GENERAL PURPOSE PINS
executes the conditional instruction. The BIO
for XC instruction, and all other instructions sample BIO
low by RSBX XF instruction or by loading ST1. XF is used for signaling other processors in multiprocessor
configurations or as a general-purpose output pin. XF goes into the high-impedance state when OFF is low,
and is set high at reset.
O/ZData, program, and I/O space select signals. DS, PS, and IS are always high unless driven low for
accessing a particular external memory space. Active period corresponds to valid address information.
Placed into a high-impedance state in hold mode. DS, PS, and IS also go into the high-impedance state
when OFF
to data or program memory. Placed in high-impedance state in hold mode. MSTRB also goes into the
high-impedance state when OFF is low.
completed. If the device is not ready (READY is low), the processor waits one cycle and checks READY
again. Note that the processor performs ready detection if at least two software wait states are
programmed. The READY signal is not sampled until the completion of the software wait states.
read mode (high), unless asserted low when the DSP performs a write operation. Placed in high-impedance
state in hold mode. R/W also goes into the high-impedance state when OFF is low.
I/O device. Placed in high-impedance state in hold mode. IOSTRB
when OFF
acknowledged by the C54x DSP, these lines go into high-impedance state.
control lines are in a high-impedance state, allowing the external memory interface to be accessed by other
devices. HOLDA also goes into the high-impedance state when is OFF low.
states are enabled, the MSC
inactive (high) at the beginning of the last software wait state. If connected to the ready input, MSC
one external wait state after the last internal wait state is completed. MSC
impedance state when OFF
address bus and goes into the high-impedance state when OFF
is low.
is low.
is brought to a high level, execution begins at location 0FF80h of program memory.
MEMORY CONTROL PINS
pin goes active at the beginning of the first software wait state, and goes
is low.
DESCRIPTIONI/O
bit of the PMST register can override the mode
condition is sampled during the decode phase of the pipeline
during the read phase of the pipeline.
also goes into the high-impedance state
also goes into the high
is low.
forces
C54x is a trademark of Texas Instruments.
November 2001 − Revised April 2004SPRS007D
19
Introduction
Table 2−2. Signal Descriptions (Continued)
TERMINAL
NAME
CLKOUTO/ZMaster clock output signal. CLKOUT cycles at the machine-cycle rate of the CPU. The internal machine
CLKMD1
CLKMD2
CLKMD3
X2/CLKINIInput pin to internal oscillator from the crystal. If the internal oscillator is not being used, an external clock
X1OOutput pin from the internal oscillator for the crystal. If the internal oscillator is not used, X1 should be left
TOUTOTimer output. TOUT signals a pulse when the on-chip timer counts down past zero. The pulse is a CLKOUT
TOUT1I/O/ZTimer1 output. TOUT1 signals a pulse when the on-chip timer1 counts down past zero. The pulse is a
BCLKR0
BCLKR1
BCLKRX2
BDR0
BDR1
BDR2
BFSR0
BFSR1
BFSRX2
BCLKX0
BCLKX1
†
OSCILLATOR/TIMER PINS
cycle is bounded by the rising edges of this signal. CLKOUT also goes into the high-impedance state when
OFF
is low.
IClock mode external/internal input signals. CLKMD1−CLKMD3 allows you to select and configure different
clock modes such as crystal, external clock, various PLL factors.
source can be applied to this pin. The internal machine cycle time is determined by the clock operating
mode pins (CLKMD1, CLKMD2 and CLKMD3).
unconnected. X1 does not go into the high-impedance state when OFF
see Section 3.10 for additional information.)
cycle wide. TOUT also goes into the high-impedance state when OFF
CLKOUT cycle wide. The TOUT1 output is multiplexed with the HINT
available when the HPI is disabled.
MULTICHANNEL BUFFERED SERIAL PORT PINS
I/O/ZReceive clock input. BCLKR serves as the serial shift clock for the buffered serial port receiver. BCLKRX2
I/O/ZFrame synchronization pulse for receive input. The BFSR pulse initiates the receive data process over
I/O/ZTransmit clock. BCLKX serves as the serial shift clock for the buffered serial port transmitter. The BCLKX
is McBSP2 transmit AND receive clock.
ISerial data receive input.
BDR. BFSRX2 is McBSP2 transmit AND receive frame sync.
pins are configured as inputs after reset. BCLKX goes into the high-impedance state when OFF
DESCRIPTIONI/O
is low. (This is revision depended,
is low.
pin of the HPI, and TOUT1 is only
is low.
BDX0
BDX1
BDX2
BFSX0
BFSX1
TXOUART asynchronous serial transmit data output.
RXIUART asynchronous serial receive data input.
†
I = Input, O = Output, Z = High-impedance, S = Supply
20
O/ZSerial data transmit output. BDX is placed in the high-impedance state when not transmitting, when RS is
I/O/ZFrame synchronization pulse for transmit output. The BFSX pulse initiates the transmit data process over
asserted or when OFF
BDX. The BFSX pins are configured as inputs after reset. BFSX goes into the high-impedance state when
OFF
is low.
is low.
UART
November 2001 − Revised April 2004SPRS007D
Introduction
Table 2−2. Signal Descriptions (Continued)
TERMINAL
NAME
A0−A15IThese pins can be used to address internal memory via the HPI when the HPI16 pin is HIGH.
D0−D15I/OThese pins can be used to read/write internal memory via the HPI when the HPI16 pin is high. The sixteen
HD0−HD7I/O/ZParallel bi-directional data bus. These pins can also be used as general-purpose I/O pins when the HPI16 pin
HCNTL0
HCNTL1
HBILIByte identification input. Identifies first or second byte of transfer. (Pullup only enabled when HPIENA=0, invalid
HCSIChip select input. This pin is the select input for the HPI, and must be driven low during accesses.
HDS1
HDS2
HASIAddress strobe input. Address strobe input. Hosts with multiplexed address and data pins require this input,
HR/WIRead/write input. This input controls the direction of an HPI transfer. (Pullup only enabled when HPIENA=0)
HRDYO/ZReady output. The ready output informs the host when the HPI is ready for the next transfer. HRDY goes into
HINTO/ZInterrupt output. This output is used to interrupt the host. When the DSP is in reset, this signal is driven
HPIENAIHPI enable input. This pin must be tied directly to DVDD to enable the HPI. An internal pulldown resistor is
HPI16IHPI 16-bit Select Pin. This pin must be tied directly to DVDD to enable HPI16 mode. This input pin has an
†
I = Input, O = Output, Z = High-impedance, S = Supply
†
HOST PORT INTERFACE PINS
data pins, D0 to D15, are multiplexed to transfer data between the core CPU and external data/program
memory, I/O devices, or HPI in 16-bit mode. The data bus is placed in the high-impedance state when not
outputting or when RS
OFF
is low.
The data bus includes bus holders to reduce the static power dissipation caused by floating, unused pins.
The bus holders also eliminate the need for external bias resistors on unused pins. When the data bus is
not being driven by the DSP, the bus holders keep the pins at the logic level that was most recently driven.
The data bus holders of the DSP are disabled at reset, and can be enabled/disabled via the BH bit of the
BSCR.
is high. HD0−HD7 is placed in the high-impedance state when not outputting data or when OFF
HPI data bus includes bus holders to reduce the static power dissipation caused by floating, unused pins. When
the HPI data bus is not being driven by the DSP, the bus holders keep the pins at the logic level that was most
recently driven. The HPI data bus holders are disabled at reset, and can be enabled/disabled via the HBH bit
of the BSCR.
IControl inputs. These inputs select a host access to one of the three HPI registers. (Pullup only enabled when
HPIENA=0, HPI16=1)
when HPI16=1)
(Pullup only enabled when HPIENA=0, or HPI16=1)
IData strobe inputs. These pins are driven by the host read and write strobes to control transfers.
(Pullup only enabled when HPIENA=0)
to latch the address in the HPIA register. (Pull-up only enabled when HPIENA=0)
the high-impedance state when OFF
high
. HINT can also be used for timer 1 output (TOUT1), when the HPI is disabled. The signal goes into the
high-impedance state when OFF
always active and the HPIENA pin is sampled on the rising edge of RS
during reset, the HPI module is disabled. Once the HPI is disabled, the HPIENA pin has no effect until the DSP
is reset.
internal pulldown resistor which is always active. If HPI16 is left open or driven low, HPI16 mode is disabled.
The non-multiplexed mode allows hosts with separate address/data buses to access the HPI address range
via the 16 address pins A0−A15. 16-bit Data is also accessible through pins D0−D15. HOST-to-DSP and
DSP-to-HOST interrupts are not supported. There are no HPIC and HPIA registers in the non-multiplexed
mode since there are HCNTRL0,1 signals available.
or HOLD is asserted. The data bus also goes into the high-impedance state when
is low.
is low. (invalid when HPI16=1)
DESCRIPTIONI/O
is low. The
. If HPIENA is left open or driven low
November 2001 − Revised April 2004SPRS007D
21
Introduction
Table 2−2. Signal Descriptions (Continued)
TERMINAL
NAME
CV
DD
DV
DD
V
SS
TCKIIEEE standard 1149.1 test clock. TCK is normally a free-running clock signal with a 50% duty cycle. The
TDIIIEEE standard 1149.1 test data input, pin with internal pullup device. TDI is clocked into the selected register
TDOO/ZIEEE standard 1149.1 test data output. The contents of the selected register (instruction or data) are shifted
TMSIIEEE standard 1149.1 test mode select. Pin with internal pullup device. This serial control input is clocked into
TRSTIIEEE standard 1149.1 test reset. TRST, when high, gives the IEEE standard 1149.1 scan system control of
EMU0I/O/ZEmulator 0 pin. When TRST is driven low, EMU0 must be high for activation of the OFF condition. When TRST
EMU1/OFFI/O/ZEmulator 1 pin/disable all outputs. When TRST is driven high, EMU1/OFF is used as an interrupt to or from
†
I = Input, O = Output, Z = High-impedance, S = Supply
†
DESCRIPTIONI/O
SUPPLY PINS
S+VDD. Dedicated 1.5V power supply for the core CPU.
S+VDD. Dedicated 3.3V power supply for I/O pins.
SGround.
changes on test access port (TAP) of input signals TMS and TDI are clocked into the TAP controller, instruction
register, or selected test data register on the rising edge of TCK. Changes at the TAP output signal (TDO) occur
on the falling edge of TCK.
(instruction or data) on a rising edge of TCK.
out of TDO on the falling edge of TCK. TDO is in the high-impedance state except when scanning of data is
in progress. TDO also goes into the high-impedance state when OFF is low.
the test access port (TAP) controller on the rising edge of TCK.
the operations of the device. If TRST
is not connected or driven low, the device operates in its functional
mode, and the IEEE standard 1149.1 signals are ignored. Pin with internal pulldown device.
is driven high, EMU0 is used as an interrupt to or from the emulator system and is defined as input/output by
way of IEEE standard 1149.1 scan system. Should be pulled up to DV
with a separate 4.7-kΩ resistor.
DD
the emulator system and is defined as input/output via IEEE standard 1149.1 scan system. When TRST
driven low, EMU1/OFF
into the high-impedance state. Note that OFF
multiprocessing applications). Thus, for the OFF
EMU0=high, EMU1/OFF
is configured as OFF. The EMU1/OFF signal, when active low, puts all output drivers
is used exclusively for testing and emulation purposes (not for
feature, the following conditions apply: TRST=low,
= low. Should be pulled up to DVDD with a separate 4.7-kΩ resistor.
is
22
November 2001 − Revised April 2004SPRS007D
3Functional Overview
The following functional overview is based on the block diagram in Figure 3−1.
The 5407/5404 device provides both on-chip ROM and RAM memories to aid in system performance and
integration.
3.1.1 Data Memory
XIO
16HPI
Enhanced XIO
16 HPI
xDMA
logic
RHEAbus
RHEA bus
MBus
MBus
Clocks
McBSP1
McBSP2
UART
TIMER
APLL
JTAG
The data memory space addresses up to 64K of 16-bit words. The device automatically accesses the on-chip
RAM when addressing within its bounds. When an address is generated outside the RAM bounds, the device
automatically generates an external access.
The advantages of operating from on-chip memory are as follows:
•Higher performance because no wait states are required
•Higher performance because of better flow within the pipeline of the central arithmetic logic unit (CALU)
•Lower cost than external memory
•Lower power than external memory
The advantage of operating from off-chip memory is the ability to access a larger address space.
November 2001 − Revised April 2004SPRS007D
23
Functional Overview
3.1.2 Program Memory
Software can configure their memory cells to reside inside or outside of the program address map. When the
cells are mapped into program space, the device automatically accesses them when their addresses are
within bounds. When the program-address generation (PAGEN) logic generates an address outside its
bounds, the device automatically generates an external access. The advantages of operating from on-chip
memory are as follows:
•Higher performance because no wait states are required
•Lower cost than external memory
•Lower power than external memory
The advantage of operating from off-chip memory is the ability to access a larger address space.
3.1.3 Extended Program Memory
The 5407/5404 uses a paged extended memory scheme in program space to allow access of up to 8192K
of program memory. In order to implement this scheme, the 5407/5404 includes several features which are
also present on C548/549/5410:
•Twenty-three address lines, instead of sixteen
•An extra memory-mapped register, the XPC
•Six extra instructions for addressing extended program space
Program memory in the 5407/5404 is organized into 128 pages that are each 64K in length.
The value of the XPC register defines the page selection. This register is memory-mapped into data space
to address 001Eh. At a hardware reset, the XPC is initialized to 0.
3.2On-Chip ROM With Bootloader
The 5407 features a 128K-word× 16-bit on-chip maskable ROM that is mapped into program memory space,
but 16K words of which can also optionally be mapped into data memory. The 5404 features a 64K-word
16-bit on-chip maskable ROM that is mapped into program memory space.
Customers can also arrange to have the ROM of the 5407/5404 programmed with contents unique to any
particular application.
A bootloader is available in the standard 5407/5404 on-chip ROM. This bootloader can be used to
automatically transfer user code from an external source to anywhere in the program memory at power up.
If MP/MC
on-chip ROM. This location contains a branch instruction to the start of the bootloader program.
The standard 5407/5404 devices provide different ways to download the code to accommodate various
system requirements:
•Parallel from 8-bit or 16-bit-wide EPROM
•Parallel from I/O space, 8-bit or 16-bit mode
•Serial boot from serial ports, 8-bit or 16-bit mode
•UART boot mode
•Host-port interface boot
•Warm boot
of the device is sampled low during a hardware reset, execution begins at location FF80h of the
×
24
November 2001 − Revised April 2004SPRS007D
The standard on-chip ROM layout is shown in Table 3−1.
ADDRESS RANGEDESCRIPTION
C000h−D4FFhROM tables for the GSM EFR speech codec
D500h−F7FFhReserved
F800h−FBFFhBootloader
FC00h−FCFFhµ-Law expansion table
FD00h−FDFFhA-Law expansion table
FE00h−FEFFhSine look-up table
FF00h−FF7FhReserved
FF80h−FFFFhInterrupt vector table
†
In the 5407/5404 ROM, 128 words are reserved for factory device-testing purposes. Application
code to be implemented in on-chip ROM must reserve these 128 words at addresses
FF00h−FF7Fh in program space.
3.3On-Chip RAM
The 5407 device contains 40K-words× 16-bit of on-chip dual-access RAM (DARAM), while the 5404 device
contains 16K-words x 16-bit of DARAM.
The DARAM is composed of five blocks of 8K words each. Each block in the DARAM can support two reads
in one cycle, or a read and a write in one cycle. The five blocks of DARAM on the 5407 are located in the
address range 0080h−9FFFh in data space, and can be mapped into program/data space by setting the OVLY
bit to one.
Table 3−1. Standard On-Chip ROM Layout
†
Functional Overview
†
On the 5404, the two blocks of DARAM are located at 0080h−3FFFh in data space and can also be mapped
into data space by setting OVLY to one.
3.4On-Chip Memory Security
The 5407/5404 device provides maskable options to protect the contents of on-chip memories. When the
ROM protect option is selected, no externally originating instruction can access the on-chip ROM; when the
RAM protect option is selected, HPI RAM is protected; HPI writes are not restricted, but HPI reads are
restricted to 2000h − 3FFFh.
November 2001 − Revised April 2004SPRS007D
25
Functional Overview
3.5Memory Maps
3.5.1 5407 Memory Map
Page 0 Program
Hex
0000
007F
0080
9FFF
A000
FF7F
FF80
FFFF
Reserved
(OVLY = 1)
External
(OVLY = 0)
On-Chip
DARAM0−4
(OVLY = 1)
External
(OVLY = 0)
External
Interrupts
(External)
MP/MC
(Microprocessor Mode)
Page 0 Program
= 1
Hex
0000
007F
0080
5FFF
6000
FEFF
FF00
FF7F
FF80
FFFF
Reserved
(OVLY = 1)
External
(OVLY = 0)
On-Chip
DARAM0−2
(OVLY = 1)
External
(OVLY = 0)
On-Chip ROM
(40K x 16-bit)
Reserved
Interrupts
(On-Chip)
= 0
MP/MC
(Microcomputer Mode)
Hex
0000
005F
0060
007F
0080
9FFF
A000
BFFF
C000
FFFF
Memory-Mapped
Figure 3−2. 5407 Program and Data Memory Map
Data
Registers
Scratch-Pad
RAM
On-Chip
DARAM0−4
(40K x 16-bit)
External
On-Chip
PDROM0−1
(DROM=1)
or
External
(DROM=0)
Hex
010000
017FFF
018000
01FFFF
†
The lower 32K words of pages 1 through 127 are only available when the OVLY bit is cleared to 0. If the OVLY bit is set to 1, the on-chip memory
is mapped to the lower 32K words of all program space pages.
Program
External
On-Chip
ROM
Page 1
XPC=1
†
Hex
020000
027FFF
028000
02FFFF
Program
External
On-Chip
ROM
Page 2
XPC=2
†
Hex
030000
038000
03DFFF
03E000
03FFFF
Program
External
On-Chip
ROM
External
Page 3
XPC=3
†
Hex
040000
047FFF037FFF
048000
04FFFF
Program
External
External
Page 4
XPC=4
†
......
Hex
7F0000
7F7FFF
7F8000
7FFFFF
Program
External
External
Page 127
XPC=7Fh
†
Figure 3−3. 5407 Extended Program Memory Map
26
November 2001 − Revised April 2004SPRS007D
3.5.2 5404 Memory Map
Page 0 Program
Hex
0000
007F
0080
3FFF
4000
9FFF
A000
FF7F
FF80
FFFF
Reserved
(OVLY = 1)
External
(OVLY = 0)
On-Chip
DARAM0−1
(OVLY = 1)
External
(OVLY = 0)
Reserved
(OVLY = 1)
External
(OVLY = 0)
External
Interrupts
(External)
MP/MC
(Microprocessor Mode)
Page 0 Program
= 1
Hex
0000
007F
0080
3FFF
4000
5FFF
6000
7FFF
8000
FEFF
FF00
FF7F
FF80
FFFF
Reserved
(OVLY = 1)
External
(OVLY = 0)
On-Chip
DARAM0−1
(OVLY = 1)
External
(OVLY = 0)
Reserved
(OVLY = 1)
External
(OVLY = 0)
Reserved
On-Chip ROM
(32K x 16-bit)
Reserved
Interrupts
(On-Chip)
MP/MC
(Microcomputer Mode)
= 0
Hex
0000
005F
0060
007F
0080
3FFF
4000
9FFF
A000
BFFF
C000
FFFF
Memory-Mapped
Figure 3−4. 5404 Program and Data Memory Map
Data
Registers
Scratch-Pad
RAM
On-Chip
DARAM0−1
(32K x 16-bit)
Reserved
External
PDROM0−1
(DROM = 1)
or
External
(DROM = 0)
Functional Overview
November 2001 − Revised April 2004SPRS007D
27
Functional Overview
Hex
010000
013FFF
014000
017FFF
018000
01FFFF
†
The lower 16K words of pages 1 through 127 are only available when the OVLY bit is cleared to 0. If the OVLY bit is set to 1, the on-chip memory
is mapped to the lower 16K words of all program space pages.
Program
External
Reserved
(OVLY = 1)
External
(OVLY = 0)
On-Chip
ROM
Page 1
XPC=1
†
Hex
020000
023FFF
024000
027FFF
028000
02FFFF
Program
External
Reserved
(OVLY = 1)
(OVLY = 0)
Reserved
†
External
Page 2
XPC=2
Hex
030000
034000
037FFF
038000
03DFFF
03E000
03FFFF
Program
External
Reserved
(OVLY = 1)
External
(OVLY = 0)
Reserved
External
Page 3
XPC=3
Hex
040000
†
043FFF033FFF
044000
047FFF
048000
04FFFF
Program
External
Reserved
(OVLY = 1)
External
(OVLY = 0)
External
Page 4
XPC=4
†
......
Hex
7F0000
7F3FFF
7F4000
7F7FFF
7F8000
7FFFFF
Program
External
Reserved
(OVLY = 1)
External
(OVLY = 0)
External
Page 127
XPC=7Fh
†
Figure 3−5. 5404 Extended Program Memory Map
3.5.3 Relocatable Interrupt Vector Table
The reset, interrupt, and trap vectors are addressed in program space. These vectors are soft — meaning that
the processor, when taking the trap, loads the program counter (PC) with the trap address and executes the
code at the vector location. Four words, either two 1-word instructions or one 2-word instruction, are reserved
at each vector location to accommodate a delayed branch instruction which allows branching to the
appropriate interrupt service routine without the overhead.
At device reset, the reset, interrupt, and trap vectors are mapped to address FF80h in program space.
However, these vectors can be remapped to the beginning of any 128-word page in program space after
device reset. This is done by loading the interrupt vector pointer (IPTR) bits in the PMST register with the
appropriate 128-word page boundary address. After loading IPTR, any user interrupt or trap vector is mapped
to the new 128-word page.
NOTE: The hardware reset (RS
with 1s. Therefore, the reset vector is always fetched at location FF80h in program space.
) vector cannot be remapped because the hardware reset loads the IPTR
28
November 2001 − Revised April 2004SPRS007D
15
RESET
Functional Overview
IPTR
R/W-1FF
7
IPTRMP/MCOVLYAVISDROMCLKOFFSMULSST
LEGEND: R = Read, W = Write, n = value after reset
654321 0
MP/MC PinR/W-0R/W-0R/W-0R/W-0R/W-0R/W-0
Figure 3−6. Processor Mode Status (PMST) Register
Table 3−2. Processor Mode Status (PMST) Register Bit Fields
BIT
NO.NAME
15−7IPTR1FFh
6MP/MC
5OVLY0
4AVIS0
3DROM0
2CLKOFF0
1SMULN/A
0SSTN/A
RESET
VALUE
MP/MC
pin
FUNCTION
Interrupt vector pointer. The 9-bit IPTR field points to the 128-word program page where the interrupt
vectors reside. The interrupt vectors can be remapped to RAM for boot-loaded operations. At reset, these
bits are all set to 1; the reset vector always resides at address FF80h in program memory space. The
RESET instruction does not affect this field.
Microprocessor/microcomputer mode. MP/MC enables/disables the on-chip ROM to be addressable in
program memory space.
- MP/MC
- MP/MC
MP/MC
pin is not sampled again until the next reset. The RESET instruction does not affect this bit. This bit can
also be set or cleared by software.
RAM overlay. OVLY enables on-chip dual-access data RAM blocks to be mapped into program space.
The values for the OVLY bit are:
- OVLY = 0: The on-chip RAM is addressable in data space but not in program space.
- OVLY = 1: The on-chip RAM is mapped into program space and data space. Data page 0 (addresses
Address visibility mode. AVIS enables/disables the internal program address to be visible at the
address pins.
- AVIS = 0: The external address lines do not change with the internal program address. Control and
- AVIS = 1: This mode allows the internal program address to appear at the pins of the 5407/5404 so
Data ROM. DROM enables on-chip ROM to be mapped into data space. The DROM bit values are:
- DROM = 0: The on-chip ROM is not mapped into data space.
- DROM = 1: A portion of the on-chip ROM is not mapped into data space.
The SWSM bit of the SWCR defines a multiplication factor of 1 or 2 for the base number of wait states.
CLOCKOUT off. When the CLKOFF bit is 1, the output of CLKOUT is disabled and remains at a high
level.
Saturation on multiplication. When SMUL = 1, saturation of a multiplication result occurs before
performing the accumulation in a MAC of MAS instruction. The SMUL bit applies only when OVM = 1
and FRCT = 1.
Saturation on store. When SST = 1, saturation of the data from the accumulator is enabled before
storing in memory. The saturation is performed after the shift operation.
= 0: The on-chip ROM is enabled and addressable.
= 1: The on-chip ROM is not available.
is set to the value corresponding to the logic level on the MP/MC pin when sampled at reset. This
0h to 7Fh), however, is not mapped into program space.
data lines are not affected and the address bus is driven with the last address on the bus.
that the internal program address can be traced. Also, it allows the interrupt vector to be decoded
in conjunction with IACK
when the interrupt vectors reside on on-chip memory.
November 2001 − Revised April 2004SPRS007D
29
Functional Overview
3.6On-Chip Peripherals
The 5407/5404 device has the following peripherals:
•Software-programmable wait-state generator
•Programmable bank-switching
•A host-port interface (HPI8/16)
•Three multichannel buffered serial ports (McBSPs)
•Two hardware timers
•A clock generator with a multiple phase-locked loop (PLL)
•Enhanced external parallel interface (XIO2)
•A DMA controller (DMA)
•A UART with an integrated baud rate generator
3.6.1 Software-Programmable Wait-State Generator
The software wait-state generator of the 5407/5404 can extend external bus cycles by up to fourteen machine
cycles. Devices that require more than fourteen wait states can be interfaced using the hardware READY line.
When all external accesses are configured for zero wait states, the internal clocks to the wait-state generator
are automatically disabled. Disabling the wait-state generator clocks reduces the power consumption of
the 5407/5404.
The software wait-state register (SWWSR) controls the operation of the wait-state generator. The 14 LSBs
of the SWWSR specify the number of wait states (0 to 7) to be inserted for external memory accesses to five
separate address ranges. This allows a different number of wait states for each of the five address ranges.
Additionally, the software wait-state multiplier (SWSM) bit of the software wait-state control register (SWCR)
defines a multiplication factor of 1 or 2 for the number of wait states. At reset, the wait-state generator is
initialized to provide seven wait states on all external memory accesses. The SWWSR bit fields are shown
in Figure 3−7 and described in Table 3−3.
15
XPAI/ODATADATA
R/W-0R/W-111R/W-111
DATAPROGRAMPROGRAM
R/W-111R/W-111R/W-111
LEGEND: R = Read, W = Write, n = value after reset