Texas Instruments TMS320UC5409PGE-80, TMS320UC5409GGU-80 Datasheet

TMS320UC5409
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
1
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
D
Advanced Multibus Architecture With Three Separate 16-Bit Data Memory Buses and One Program Memory Bus
D
40-Bit Arithmetic Logic Unit (ALU), Including a 40-Bit Barrel Shifter and Two Independent 40-Bit Accumulators
D
17- × 17-Bit Parallel Multiplier Coupled to a 40-Bit Dedicated Adder for Non-Pipelined Single-Cycle Multiply/Accumulate (MAC) Operation
D
Compare, Select, and Store Unit (CSSU) for the Add/Compare Selection of the Viterbi Operator
D
Exponent Encoder to Compute an Exponent Value of a 40-Bit Accumulator Value in a Single Cycle
D
T wo Address Generators With Eight Auxiliary Registers and Two Auxiliary Register Arithmetic Units (ARAUs)
D
Data Bus With a Bus-Holder Feature
D
Extended Addressing Mode for 8M × 16-Bit Maximum Addressable External Program Space
D
16K x 16-Bit On-Chip ROM
D
32K x 16-Bit Dual-Access On-Chip RAM
D
Single-Instruction-Repeat and Block-Repeat Operations for Program Code
D
Block-Memory-Move Instructions for Better Program and Data Management
D
Instructions With a 32-Bit Long Word Operand
D
Instructions With Two- or Three-Operand Reads
D
Arithmetic Instructions With Parallel Store and Parallel Load
D
Conditional Store Instructions
D
Fast Return From Interrupt
D
On-Chip Peripherals – Software-Programmable Wait-State
Generator and Programmable Bank Switching
– On-Chip Phase-Locked Loop (PLL) Clock
Generator With Internal Oscillator or External Clock Source
– Three Multichannel Buffered Serial Ports
(McBSPs)
– Enhanced 8-Bit Parallel Host-Port
Interface With 16-Bit Data/Addressing – One 16-Bit Timer – Six-Channel Direct Memory Access
(DMA) Controller
D
Power Consumption Control With IDLE1, IDLE2, and IDLE3 Instructions With Power-Down Modes
D
CLKOUT Off Control to Disable CLKOUT
D
On-Chip Scan-Based Emulation Logic, IEEE Std 1149.1† (JTAG) Boundary Scan Logic
D
12.5-ns Single-Cycle Fixed-Point Instruction Execution Time (80 MIPS)
D
1.8-V Core Power Supply
D
1.8-V to 3.6-V I/O Power Supply Enables Operation With a SIngle 1.8-V Supply or With Dual Power Supplies
D
Available in a 144-Pin Plastic Thin Quad Flatpack (TQFP) (PGE Suffix) and a 144-Pin Ball Grid Array (BGA) (GGU Suffix)
description
The TMS320UC5409 fixed-point, digital signal processor (DSP) (hereafter referred to as the ’UC5409 unless otherwise specified) is ideal for low-power, high-performance applications. This processor of fers very low power consumption and the flexibility to support various system voltage configurations. The wide range of I/O voltage enables it to operate with a single 1.8-V power supply or with dual power supplies for mixed voltage systems. This feature eliminates the need for external level-shifting and reduces power consumption in emerging sub-3V systems.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
ADVANCE INFORMATION
Copyright 1999, Texas Instruments Incorporated
IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and other specifications are subject to change without notice.
TMS320UC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
2
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
description (continued)
The TMS320UC5409 fixed-point, digital signal processor (DSP) (hereafter referred to as the ’UC5409 unless otherwise specified) is based on an advanced modified Harvard architecture that has one program memory bus and three data memory buses. This processor provides an arithmetic logic unit (ALU) with a high degree of parallelism, application-specific hardware logic, on-chip memory , and additional on-chip peripherals. The basis of the operational flexibility and speed of this DSP is a highly specialized instruction set.
For detailed information on the architecture of the ’C5000 family of DSPs, see the
TMS320C5000 DSP Family
Functional Overview
(literature number SPRU307).
CV
HDS1
A18 A17 V
SS
A16 D5 D4 D3 D2 D1 D0 RS X2/CLKIN X1 HD3 CLKOUT V
SS
HPIENA CV
DD
V
SS
TMS TCK TRST TDI TDO EMU1/OFF EMU0 TOUT HD2 HPI16 CLKMD3 CLKMD2 CLKMD1 V
SS
DV
DD
BDX1 BFSX1
V
SS
A22
V
SS
DV
DD
A10
HD7
A11 A12 A13 A14 A15
CV
DD
HAS V
SS
V
SS
CV
DD
HCS
HR/W
READY
PS DS
IS
R/W
MSTRB
IOSTRB
MSC
XF
HOLDA
IAQ
HOLD
BIO
MP/MC
DV
DD
V
SS
BDR1
BFSR1
144
A21
CV
143
142
141A8140A7139A6138A5137A4136
HD6
135A3134A2133A1132A0131DV130
129
128
127
126
125
HD5
124
D15
123
D14
122
D13
121
HD4
120
D12
119
D11
118
117D9116D8115D7114D6113
112
373839404142434445464748495051525354555657585960616263646566676869
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
108 107 106 105 104 103 102 101 100
99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73
BCLKR1
HCNTL0SSBCLKR0
BCLKR2
BFSR0
BFSR2
BDR0
HCNTL1
BDR2
BCLKX0
BCLKX2
SS
DD
SS
HD0
BDX0
BDX2
IACK
HBIL
NMI
INT0
INT1
INT2
INT3
DD
HD1
SS
HRDY
HINT
111
V
110
A19
109
707172
BCLKX1
D10
A20
DV
DD
CV
HDS2SSV
V
V
DV
V
CV
V
DD
DD
DD
DD
SS
TMS320UC5409 PGE PACKAGE
†‡
(TOP VIEW)
BFSX0
A9
BFSX2
SS
V
V
SS
SS
V
SS
V
NC = No internal connection
DVDD is the power supply for the I/O pins while CVDD is the power supply for the core CPU. VSS is the ground for both the I/O pins and the core CPU.
ADVANCE INFORMATION
TMS320UC5409
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
3
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
TMS320UC5409 GGU PACKAGE
(BOTTOM VIEW)
A B
D
C
E F
H J
L M
K
N
G
12
3456781012 1113 9
The pin assignments table to follow lists each signal quadrant and BGA ball number for the TMS320UC5409GGU (144-pin BGA package).
ADVANCE INFORMATION
TMS320UC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
4
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
Pin Assignments TMS320UC5409GGU (144-Pin BGA Package)
SIGNAL
QUADRANT 1
BGA BALL #
SIGNAL
QUADRANT 2
BGA BALL #
SIGNAL
QUADRANT 3
BGA BALL #
SIGNAL
QUADRANT 4
BGA BALL #
V
SS
A1 BFSX1 N13 V
SS
N1 A19 A13 A22 B1 BDX1 M13 BCLKR1 N2 A20 A12 V
SS
C2 DV
DD
L12 HCNTL0 M3 V
SS
B11
DV
DD
C1 V
SS
L13 V
SS
N3 DV
DD
A11 A10 D4 CLKMD1 K10 BCLKR0 K4 D6 D10 HD7 D3 CLKMD2 K11 BCLKR2 L4 D7 C10
A11 D2 CLKMD3 K12 BFSR0 M4 D8 B10 A12 D1 HPI16 K13 BFSR2 N4 D9 A10 A13 E4 HD2 J10 BDR0 K5 D10 D9 A14 E3 TOUT J11 HCNTL1 L5 D11 C9 A15 E2 EMU0 J12 BDR2 M5 D12 B9
CV
DD
E1 EMU1/OFF J13 BCLKX0 N5 HD4 A9 HAS F4 TDO H10 BCLKX2 K6 D13 D8 V
SS
F3 TDI H11 V
SS
L6 D14 C8
V
SS
F2 TRST H12 HINT M6 D15 B8
CV
DD
F1 TCK H13 CV
DD
N6 HD5 A8
HCS G2 TMS G12 BFSX0 M7 CV
DD
B7
HR/W G1 V
SS
G13 BFSX2 N7 V
SS
A7
READY G3 CV
DD
G11 HRDY L7 HDS1 C7
PS G4 HPIENA G10 DV
DD
K7 V
SS
D7
DS H1 V
SS
F13 V
SS
N8 HDS2 A6
IS H2 CLKOUT F12 HD0 M8 DV
DD
B6
R/W H3 HD3 F11 BDX0 L8 A0 C6
MSTRB H4 X1 F10 BDX2 K8 A1 D6
IOSTRB J1 X2/CLKIN E13 IACK N9 A2 A5
MSC J2 RS E12 HBIL M9 A3 B5
XF J3 D0 E11 NMI L9 HD6 C5
HOLDA J4 D1 E10 INT0 K9 A4 D5
IAQ K1 D2 D13 INT1 N10 A5 A4
HOLD K2 D3 D12 INT2 M10 A6 B4
BIO K3 D4 D11 INT3 L10 A7 C4
MP/MC L1 D5 C13 CV
DD
N11 A8 A3
DV
DD
L2 A16 C12 HD1 M11 A9 B3
V
SS
L3 V
SS
C11 V
SS
L11 CV
DD
C3
BDR1 M1 A17 B13 BCLKX1 N12 A21 A2
BFSR1 M2 A18 B12 V
SS
M12 V
SS
B2
DVDD is the power supply for the I/O pins while CVDD is the power supply for the core CPU. VSS is the ground for both the I/O pins and the core CPU.
ADVANCE INFORMATION
TMS320UC5409
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
5
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
terminal functions
The following table lists each signal, function, and operating mode(s) grouped by function.
Terminal Functions
TERMINAL
NAME
I/O
DESCRIPTION
DATA SIGNALS
A22 (MSB) A21 A20 A19 A18 A17
O/Z
Parallel address bus A22 [most significant bit (MSB)] through A0 [least significant bit (LSB)]. The lower sixteen address pins (A0 to A15) are multiplexed to address all external memory (program, data) or I/O while the upper seven address pins (A16 to A22) are only used to address external program space. These pins are placed in the high-impedance state when the hold mode is enabled, or when OFF
is low.
A16
A15 A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 (LSB)
A15 (MSB) A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 (LSB)
I
These pins can be used to address internal memory via the HPI when the HPI16 pin is high (A0 – A15).
D15 (MSB) D14 D13 D12 D11 D10 D9 D8
I/O/Z
D15 (MSB) D14 D13 D12 D11 D10 D9 D8
I/O Parallel data bus D15 (MSB) through D0 (LSB). The sixteen data pins (D0 to D15) are
multiplexed to transfer data between the core CPU and external data/program memory or I/O devices. The data bus is placed in the high-impedance state when not outputting or when RS
or HOLD is asserted. The data bus also goes into the
high-impedance state when OFF
is low.
The data bus has bus holders to reduce the static power dissipation caused by
floating, unused pins. These bus holders also eliminate the need for external bias D7 D6 D5 D4 D3 D2 D1 D0 (LSB)
D7 D6 D5 D4 D3 D2 D1 D0 (LSB)
resistors on unused pins. When the data bus is not being driven by the ’UC5409, the
bus holders keep the pins at the previous logic level. The data bus holders on the
’UC5409 are disabled at reset and can be enabled/disabled via the BH bit of the
bank-switching control register (BSCR).
INITIALIZATION, INTERRUPT, AND RESET OPERATIONS
IACK
O/Z
Interrupt acknowledge signal. IACK indicates receipt of an interrupt and that the program counter is fetching the interrupt vector location designated by A15–A0. IACK
also goes into the high-impedance state when OFF is low.
INT0 INT1 INT2 INT3
I
External user interrupts. INT0–INT3 are prioritized and are maskable by the interrupt mask register and the interrupt mode bit. INT0
–INT3 can be polled and reset by way of the interrupt flag register.
NMI
I
Nonmaskable interrupt. NMI is an external interrupt that cannot be masked by way of the INTM or the IMR. When NMI
is activated, the processor traps to the appropriate vector location.
I = Input, O = Output, Z = High-impedance, S = Supply
ADVANCE INFORMATION
TMS320UC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
6
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
Terminal Functions (Continued)
TERMINAL
NAME
DESCRIPTIONI/O
TERMINAL
NAME
DESCRIPTIONI/O
INITIALIZATION, INTERRUPT, AND RESET OPERATIONS (CONTINUED)
RS
I
Reset. RS causes the digital signal processor (DSP) to terminate execution and causes a reinitialization of the CPU and peripherals. When RS
is brought to a high level, execution begins at location 0FF80h of program memory. RS
affects various registers and status bits.
MP/MC I
Microprocessor/microcomputer mode select. If active low at reset, microcomputer mode is selected, and the internal program ROM is mapped into the upper program memory space. If the pin is driven high during reset, microprocessor mode is selected, and the on-chip ROM is removed from program space. MP/MC
is only sampled at reset, and the
MP/MC
bit of the PMST register can override the mode that is selected at reset.
MULTIPROCESSING SIGNALS
BIO I
Branch control. A branch can be conditionally executed when BIO is active. If low, the processor executes the conditional instruction. For the XC instruction, the BIO
condition is sampled during the decode phase of the pipeline;
all other instructions sample BIO
during the read phase of the pipeline.
XF O/Z
External flag output (latched software-programmable signal). XF is set high by the SSBX XF instruction, set low by the RSBX XF instruction or by loading ST1. XF is used for signaling other processors in multiprocessor configurations or used as a general-purpose output pin. XF goes into the high-impedance state when OFF
is low, and is set high
at reset.
MEMORY CONTROL SIGNALS
DS PS IS
O/Z
Data, program, and I/O space select signals. DS, PS, and IS are always high unless driven low for accessing a particular external memory space. Active period corresponds to valid address information. DS
, PS, and IS are placed
into the high-impedance state in the hold mode; the signals also go into the high-impedance state when OFF
is low.
MSTRB O/Z
Memory strobe signal. MSTRB is always high unless low-level asserted to indicate an external bus access to data or program memory. MSTRB
is placed in the high-impedance state in the hold mode; it also goes into the
high-impedance state when OFF
is low.
READY I
Data ready. READY indicates that an external device is prepared for a bus transaction to be completed. If the device is not ready (READY is low), the processor waits one cycle and checks READY again. Note that the processor performs ready detection if at least two software wait states are programmed. The READY signal is not sampled until the completion of the software wait states.
R/W O/Z
Read/write signal. R/W indicates transfer direction during communication to an external device. R/W is normally in the read mode (high), unless it is asserted low when the DSP performs a write operation. R/W
is placed in the
high-impedance state in hold mode; it also goes into the high-impedance state when OFF
is low.
IOSTRB O/Z
I/O strobe signal. IOSTRB is always high unless low-level asserted to indicate an external bus access to an I/O device. IOSTRB
is placed in the high-impedance state in the hold mode; it also goes into the high-impedance state when OFF
is low.
HOLD I
Hold. HOLD is asserted to request control of the address, data, and control lines. When acknowledged by the ’C54x, these lines go into the high-impedance state.
HOLDA O/Z
Hold acknowledge. HOLDA indicates that the ’UC5409 is in a hold state and that the address, data, and control lines are in the high-impedance state, allowing the external memory interface to be accessed by other devices. HOLDA also goes into the high-impedance state when OFF is low.
MSC O/Z
Microstate complete. MSC indicates completion of all software wait states. When two or more software wait states are enabled, the MSC
pin goes low during the last of these wait states. If connected to the READY input, MSC forces
one external wait state after the last internal wait state is completed. MSC
also goes into the high-impedance state
when OFF
is low.
IAQ O/Z
Instruction acquisition signal. IAQ is asserted (active low) when there is an instruction address on the address bus. IAQ
goes into the high-impedance state when OFF is low.
OSCILLATOR/TIMER SIGNALS
CLKOUT O/Z
Master clock output signal. CLKOUT cycles at the machine-cycle rate of the CPU. The internal machine cycle is bounded by rising edges of this signal. CLKOUT also goes into the high-impedance state when OFF
is low.
I = Input, O = Output, Z = High-impedance, S = Supply
ADVANCE INFORMATION
TMS320UC5409
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
7
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
Terminal Functions (Continued)
TERMINAL
NAME
DESCRIPTIONI/O
TERMINAL
NAME
DESCRIPTIONI/O
OSCILLATOR/TIMER SIGNALS (CONTINUED)
CLKMD1 CLKMD2 CLKMD3
I
Clock mode select signals. These inputs select the mode that the clock generator is initialized to after reset. The logic levels of CLKMD1–CLKMD3 are latched when the reset pin is low, and the clock mode register is initialized to the selected mode. After reset, the clock mode can be changed through software, but the clock mode select signals have no effect until the device is reset again.
X2/CLKIN I Clock/oscillator input. If the internal oscillator is not being used, X2/CLKIN functions as the clock input. X1 O
Output pin from the internal oscillator for the crystal. If the internal oscillator is not used, X1 should be left unconnected. X1 does not go into the high-impedance state when OFF
is low.
TOUT O/Z
Timer output. TOUT signals a pulse when the on-chip timer counts down past zero. The pulse is one CLKOUT cycle wide. TOUT also goes into the high-impedance state when OFF
is low.
MULTICHANNEL BUFFERED SERIAL PORT SIGNALS
BCLKR0 BCLKR1 BCLKR2
I/O/Z Receive clock input. BCLKR serves as the serial shift clock for the buffered serial port receiver.
BDR0 BDR1 BDR2
I Serial data receive input
BFSR0 BFSR1 BFSR2
I/O/Z Frame synchronization pulse for receive input. The BFSR pulse initiates the receive data process over BDR.
BCLKX0 BCLKX1 BCLKX2
I/O/Z
Transmit clock. BCLKX serves as the serial shift clock for the McBSP transmitter. BCLKX can be configured as an input or an output; it is configured as an input following reset. BCLKX enters the high-impedance state when OFF
goes
low.
BDX0 BDX1 BDX2
O/Z
Serial data transmit output. BDX is placed in the high-impedance state when not transmitting, when RS is asserted, or when OFF
is low.
BFSX0 BFSX1 BFSX2
I/O/Z
Frame synchronization pulse for transmit input/output. The BFSX pulse initiates the transmit data process. BFSX can be configured as an input or an output; it is configured as an input following reset. BFSX goes into the high-impedance state when OFF
is low.
HOST-PORT INTERFACE SIGNALS
A0 – A15 I These pins can be used to address internal memory via the HPI when the HPI16 pin is high.
D0 – D15 I/O
These pins can be used to read/write internal memory via the HPI when the HPI16 pin is high. The sixteen data pins, D0 to D15, are multiplexed to transfer data between the core CPU and external data/program memory, I/O devices, or HPI in 16-bit mode. The data bus is placed in the high-impedance state when not outputting or when RS
or HOLD
is asserted. The data bus also goes into the high-inmpedance state when OFF is low.
The data bus includes bus holders to reduce the static power dissipation caused by floating, unused pins. The bus holders also eliminate the need for external bias resistors on unused pins. When the data bus is not being driven by the ’UC5409, the bus holders keep the pins at the logic level that was most recently driven. The data bus holders of the ’UC5409 are disabled at reset, and can be enabled/disabled via the BH bit of the BSCR.
HD0 – HD7 I/O/Z
Parallel bidirectional data bus. These pins can also be used as general-purpose I/O pins when the HPI16 pin is high. HD0–HD7 is placed in the high-impedance state when not outputting data or when OFF
is low. The HPI data bus includes bus holders to reduce the static power dissipation caused by floating, unused pins. When the HPI data bus is not being driven by the ’UC5409, the bus holders keep the pins at the logic level that was most recently driven. The HPI data bus holders are disabled at reset and can be enabled/disabled via the HBH bit of the BSCR.
I = Input, O = Output, Z = High-impedance, S = Supply
ADVANCE INFORMATION
TMS320UC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
8
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
Terminal Functions (Continued)
TERMINAL
NAME
DESCRIPTIONI/O
TERMINAL
NAME
DESCRIPTIONI/O
HOST-PORT INTERFACE SIGNALS (CONTINUED)
HCNTL0 HCNTL1
I
Control. HCNTL0 and HCNTL1 select a host access to one of the three HPI registers. The control inputs have internal pullup resistors that are only enabled when HPIENA = 0.
HBIL I
Byte identification. HBIL identifies the first or second byte of transfer. The HBIL input has an internal pullup resistor that is only enabled when HPIENA = 0.
HCS I
Chip select. HCS is the select input for the HPI and must be driven low during accesses. The chip-select input has an internal pullup resistor that is only enabled when HPIENA = 0.
HDS1 HDS2
I
Data strobe. HDS1 and HDS2 are driven by the host read and write strobes to control transfers. The strobe inputs have internal pullup resistors that are only enabled when HPIENA = 0.
HAS I
Address strobe. Hosts with multiplexed address and data pins require HAS to latch the address in the HPIA register. HAS
has an internal pullup resistor that is only enabled when HPIENA = 0.
HR/W I
Read/write. HR/W controls the direction of an HPI transfer. R/W has an internal pullup resistor that is only enabled when HPIENA = 0.
HRDY O/Z
Ready. The ready output informs the host when the HPI is ready for the next transfer. HRDY goes into the high-impedance state when OFF
is low.
HINT O/Z
Interrupt. This output is used to interrupt the host. When the DSP is in reset, HINT is driven high. The signal goes into the high-impedance state when OFF
is low.
HPIENA I
HPI module select. HPIENA must be driven high during reset to enable the HPI. An internal pulldown resistor is always active and the HPIENA pin is sampled on the rising edge of RS
. If HPIENA is left open or is driven low during reset,
the HPI module is disabled. Once the HPI is disabled, the HPIENA pin has no effect until the ’UC5409 is reset.
HPI16 I
HPI 16-bit select pin. HPI16 = 1 selects the non-multiplexed mode. The non-multiplexed mode allows hosts with separate address/data buses to access the HPI address range via the 16 address pins (A0–A15). The 16-bit data is also accessible through pins D0 through D15. Host-to-DSP and DSP-to-Host interrupts are not supported. There are no HPIC and HPIA registers in the non-multiplexed mode since HCNTRL0 and HCNTRL1 signals are available.
SUPPLY PNS
CV
DD
S +VDD. Dedicated 1.8-V power supply for the core CPU
DV
DD
S +VDD. Dedicated 3.3-V power supply for the I/O pins
V
SS
S Ground
TEST PINS
TCK I
IEEE standard 1149.1 test clock. TCK is normally a free-running clock signal with a 50% duty cycle. The changes on the test access port (TAP) of input signals TMS and TDI are clocked into the TAP controller , instruction register, or selected test data register on the rising edge of TCK. Changes at the TAP output signal (TDO) occur on the falling edge of TCK.
TDI I
IEEE standard 1149.1 test data input pin with internal pullup device. TDI is clocked into the selected register (instruction or data) on a rising edge of TCK.
TDO O/Z
IEEE standard 1149.1 test data output. The contents of the selected register (instruction or data) are shifted out of TDO on the falling edge of TCK. TDO is in the high-impedance state except when the scanning of data is in progress. TDO also goes into the high-impedance state when OFF
is low.
TMS I
IEEE standard 1149.1 test mode select. Pin with internal pullup device. This serial control input is clocked into the TAP controller on the rising edge of TCK.
TRST I
IEEE standard 1149.1 test reset. TRST, when high, gives the IEEE standard 1149.1 scan system control of the operations of the device. If TRST
is not connected or is driven low, the device operates in its functional mode, and
the IEEE standard 1149.1 signals are ignored. Pin with internal pulldown device.
I = Input, O = Output, Z = High-impedance, S = Supply
ADVANCE INFORMATION
TMS320UC5409
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
9
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
Terminal Functions (Continued)
TERMINAL
NAME
DESCRIPTIONI/O
TERMINAL
NAME
DESCRIPTIONI/O
TEST PINS (CONTINUED)
EMU0 I/O/Z
Emulator 0 pin. When TRST is driven low, EMU0 must be high for activation of the OFF condition. When TRST is driven high, EMU0 is used as an interrupt to or from the emulator system and is defined as input/output by way of the IEEE standard 1149.1 scan system.
EMU1/OFF I/O/Z
Emulator 1 pin/disable all outputs. When TRST is driven high, EMU1/OFF is used as an interrupt to or from the emulator system and is defined as input/output by way of the IEEE standard 1149.1 scan system. When TRST
is
driven low, EMU1/OFF
is configured as OFF . The EMU1/OFF signal, when active low , puts all output drivers into the
high-impedance state. Note that OFF
is used exclusively for testing and emulation purposes (not for multiprocessing
applications). Therefore, for the OFF
feature, the following apply:
TRST
= low EMU0 = high EMU1/OFF
= low
I = Input, O = Output, Z = High-impedance, S = Supply
memory
The ’UC5409 device provides both on-chip ROM and RAM memories to aid in system performance and integration.
on-chip ROM with bootloader
The ’5409 features a 16K-word × 16-bit on-chip maskable ROM. Customers can arrange to have the ROM of the ’5409 programmed with contents unique to any particular application. A security option is available to protect a custom ROM. This security option is described in the
TMS320C54x DSP CPU and Peripherals Reference Set,
Volume 1
(literature number SPRU131). Note that only the ROM security option, and not the ROM/RAM option,
is available on the ’5409 . A bootloader is available in the standard ’5409 on-chip ROM. This bootloader can be used to automatically
transfer user code from an external source to anywhere in the program memory at power up. If the MP/MC pin is sampled low during a hardware reset, execution begins at location FF80h of the on-chip ROM. This location contains a branch instruction to the start of the bootloader program. The standard ’5409 bootloader provides different ways to download the code to accomodate various system requirements:
D
Parallel from 8-bit or 16-bit-wide EPROM
D
Parallel from I/O space 8-bit or 16-bit mode
D
Serial boot from serial ports 8-bit or 16-bit mode
D
Host-port interface boot
D
SPI serial EEPROM 8-bit boot mode
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on-chip ROM with bootloader (continued)
The standard on-chip ROM layout is shown in Table 1.
Table 1. Standard On-Chip ROM Layout
ADDRESS RANGE DESCRIPTION
0x0000h – 0xBFFFh External program space 0xC000h – 0xF7FFh Reserved 0xF800h – 0xFBFFh Bootloader
0xFC00h – 0xFEFFh Reserved
0xFF00h – 0xFF7Fh Reserved
0xFF80h – 0xFFFFh Interrupt vector table
In the ’VC5409 ROM, 128 words are reserved for factory device-testing purposes. Application code to be implemented in on-chip ROM must reserve these 128 words at addresses FF00h–FF7Fh in program space.
on-chip RAM
The ’UC5409 device contains 32K × 16-bit of on-chip dual-access RAM (DARAM). The DARAM is composed of four blocks of 8K words each. Each block in the DARAM can support two reads in one cycle, or a read and a write in one cycle. The DARAM is located in the address range 0080h–7FFFh in data space, and can be mapped into program/data space by setting the OVLY bit to one.
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memory map
Page 0 Program
Hex
Data
On-Chip DARAM
(OVLY = 1)
External
(OVLY = 0)
MP/MC
= 0
(Microcomputer Mode)
MP/MC= 1
(Microprocessor Mode)
0000
007F 0080
FFFF
Reserved
(OVLY = 1)
External
(OVLY = 0)
Interrupts (External)
FF80
Memory-
Mapped
Registers
On-Chip DARAM
(32K words)
ROM
(DROM=1)
or External
(DROM=0)
0080
FFFF
Hex
0000
FF7F
FF00
FEFF
BFFF
C000
FFFF
0060
007F
0000
Hex
Page 0 Program
External
External
Scratch-Pad
RAM
Reserved
(DROM=1)
or External
(DROM=0)
005F
Reserved
(OVLY = 1)
External
(OVLY = 0)
007F 0080
On-Chip DARAM
(OVLY = 1)
External
(OVLY = 0)
FF80
FEFF
BFFF
C000
External
On-Chip ROM
(16K Words)
Interrupts (On-Chip)
7FFF
7FFF
7FFF
8000
8000
8000
FF00 FF7F
Reserved
Figure 1. Memory Map
relocatable interrupt vector table
The reset, interrupt, and trap vectors are addressed in program space. These vectors are soft — meaning that the processor, when taking the trap, loads the program counter (PC) with the trap address and executes the code at the vector location. Four words are reserved at each vector location to accommodate a delayed branch instruction, either two 1-word instructions or one 2-word instruction, which allows branching to the appropriate interrupt service routine with minimal overhead.
At device reset, the reset, interrupt, and trap vectors are mapped to address FF80h in program space. However, these vectors can be remapped to the beginning of any 128-word page in program space after device reset. This is done by loading the interrupt vector pointer (IPTR) bits in the PMST register with the appropriate 128-word page boundary address. After loading IPTR, any user interrupt or trap vector is mapped to the new 128-word page.
NOTE: The hardware reset (RS
) vector cannot be remapped because a hardware reset loads the IPTR
with 1s. Therefore, the reset vector is always fetched at location FF80h in program space.
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extended program memory
The ’UC5409 uses a paged extended memory scheme in program space to allow access of up to 8M program memory locations. In order to implement this scheme, the ’UC5409 includes several features that are also present on the ’548/’549 devices:
D
Twenty-three address lines, instead of sixteen
D
An extra memory-mapped register, the XPC register defines the page selection. This register is memory-mapped into data space to address 001Eh. At a hardware reset, the XPC is initialized to 0.
D
Six extra instructions for addressing extended program space. These six instructions affect the XPC. –
FB[D]
pmad (23 bits) – Far branch
FBACC[D]
Accu[22:0] – Far branch to the location specified by the value in accumulator A or
accumulator B
FCALL[D]
pmad (23 bits) – Far call
FCALA[D]
Accu[22:0] – Far call to the location specified by the value in accumulator A or accumulator B
FRET[D]
– Far return
FRETE[D]
– Far return with interrupts enabled
D
In addition to these new instructions, two ’54x instructions are extended to use 23 bits in the ’UC5409: – READA data_memory (using 23-bit accumulator address) – WRITA data_memory (using 23-bit accumulator address)
All other instructions, software interrupts, and hardware interrupts do not modify the XPC register and access only memory within the current page.
Program memory in the ’UC5409 is organized into 127 pages that are each 64K in length, as shown in Figure 2.
00 0000
Internal
32K
Page 0
1 0000
1 7FFF
Page 1 Lower
32K
External
2 0000
2 7FFF
Page 2
Lower
32K
External
. . .
. . .
7F 0000
7F 7FFF
Page 127
Lower
32K
External
0 FFFF
32K
External
1 8000
1 FFFF
Page 1
Upper
32K
External
2 8000
2 FFFF
Page 2
Upper
32K
External
. . .
. . .
7F 8000
7F FFFF
Page 127
Upper
32K
External
The lower 32K words of pages 1 through 126 are available only when the OVLY bit is cleared to 0. If the OVLY bit is set to 1, the on-chip RAM is mapped to the lower 32K words of all program space pages.
Figure 2. Extended Program Memory
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on-chip peripherals
The ’UC5409 device has the following peripherals:
D
Software-programmable wait-state generator with programmable bank-switching wait states
D
An enhanced 8-bit host-port interface (HPI8/16) with 16-bit data/addressing
D
Three multichannel buffered serial ports (McBSPs)
D
One hardware timer
D
A clock generator with a phase-locked loop (PLL)
D
A direct memory access (DMA) controller
software-programmable wait-state generator
The software wait-state generator of the ’UC5409 is similar to that of the ’5410 and it can extend external bus cycles by up to fourteen machine cycles. Devices that require more than fourteen wait states can be interfaced using the hardware READY line. When all external accesses are configured for zero wait states, the internal clocks to the wait-state generator are automatically disabled. Disabling the wait-state generator clocks reduces the power comsumption of the ’UC5409.
The software wait-state register (SWWSR) controls the operation of the wait-state generator. The 14 LSBs of the SWWSR specify the number of wait states (0 to 7) to be inserted for external memory accesses to five separate address ranges. This allows a different number of wait states for each of the five address ranges. Additionally, the software wait-state multiplier (SWSM) bit of the system configuration register (SCR) defines a multiplication factor of 1 or 2 for the number of wait states. At reset, the wait-state generator is initialized to provide seven wait states on all external memory accesses. The SWWSR bit fields are shown in Figure 3 and described in Table 2.
XPA I/O Data Data Program Program
14 12 11 9 8 6 5 3 2 015
R/W-111R/W-0 R/W-111 R/W-111 R/W-111 R/W-111
LEGEND: R = Read, W = Write
Figure 3. Software Wait-State Register (SWWSR) [Memory-Mapped Register (MMR) Address 0028h]
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software-programmable wait-state generator (continued)
Table 2. Software Wait-State Register (SWWSR) Bit Fields
BIT
RESET
NO. NAME
VALUE
FUNCTION
15 XPA 0
Extended program address control bit. XP A is used in conjunction with the program space fields (bits 0 through 5) to select the address range for program space wait states.
14–12 I/O 1
I/O space. The field value (0–7) corresponds to the base number of wait states for I/O space accesses within addresses 0000–FFFFh. The SWSM bit of the SWCR defines a multiplication factor of 1 or 2 for the base number of wait states.
11–9 Data 1
Upper data space. The field value (0–7) corresponds to the base number of wait states for external data space accesses within addresses 8000–FFFFh. The SWSM bit of the SWCR defines a multiplication factor of 1 or 2 for the base number of wait states.
8–6 Data 1
Lower data space. The field value (0–7) corresponds to the base number of wait states for external data space accesses within addresses 0000–7FFFh. The SWSM bit of the SWCR defines a multiplication factor of 1 or 2 for the base number of wait states.
5–3 Program 1
Upper program space. The field value (0–7) corresponds to the base number of wait states for external program space accesses within the following addresses:
-
XPA = 0: x8000 – xFFFFh
-
XPA = 1: The upper program space bit field has no ef fect on wait states.
The SWSM bit of the SWCR defines a multiplication factor of 1 or 2 for the base number of wait states.
2–0 Program 1
Program space. The field value (0–7) corresponds to the base number of wait states for external program space accesses within the following addresses:
-
XPA = 0: x0000–x7FFFh
-
XPA = 1: 00000–FFFFFh
The SWSM bit of the SWCR defines a multiplication factor of 1 or 2 for the base number of wait states.
The software wait-state multiplier bit of the software wait-state configuration register is used to extend the base number of wait states selected by the SWWSR. The SWCR bit fields are shown in Figure 4 and described in Table 3.
Reserved
115
R/W-0
SWSM
0
R/W-0
LEGEND: R = Read, W = Write
Figure 4. Software Wait-State Configuration Register (SWCR) [MMR Address 002Bh]
Table 3. Software Wait-State Configuration Register (SWCR) Bit Fields
PIN
RESET
NO. NAME
VALUE
FUNCTION
15–1 Reserved 0
These bits are reserved and are unaffected by writes.
0 SWSM 0
Software wait-state multiplier . Used to multiply the number of wait states defined in the SWWSR by a factor of 1 or 2.
-
SWSM = 0: wait-state base values are unchanged (multiplied by 1).
-
SWSM = 1: wait-state base values are multiplied by 2 for a maximum of 14 wait states.
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programmable bank-switching wait states
The programmable bank-switching logic of the ’UC5409 is functionally equivalent to that of the ’548/’549 devices. This feature automatically inserts one cycle when accesses cross memory-bank boundaries within program or data memory space. A bank-switching wait state can also be automatically inserted when accesses cross the data space boundary into program space.
The bank-switching control register (BSCR) defines the bank size for bank-switching wait-states. Figure 5 shows the BSCR and its bits are described in Table 4.
BNKCMP PS-DS Reserved HBH
12 11 3 2 115
R/W-0R-0R/W-1R/W-1111
BH
EXIO
010
R/W-0R/W-0
LEGEND: R = Read, W = Write
Figure 5. Bank-Switching Control Register (BSCR) [MMR Address 0029h]
Table 4. Bank-Switching Control Register Fields
BIT
RESET
NO. NAME
VALUE
FUNCTION
15–12 BNKCMP 1111
Bank compare. BNKCMP determines the external memory-bank size. BNKCMP is used to mask the four MSBs of an address. For example, if BNKCMP = 11 11b, the four MSBs (bits 12–15) are compared, resulting in a bank size of 4K words. Bank sizes of 4K words to 64K words are allowed.
11 PS - DS 1
Program read – data read access. PS-DS inserts an extra cycle between consecutive accesses of program read and data read or data read and program read. PS-DS = 0 No extra cycles are inserted by this feature. PS-DS = 1 One extra cycle is inserted between consecutive data and program reads.
10–3 Reserved 0 These bits are reserved and are unaffected by writes.
2 HBH 0
HPI bus holder. HBH controls the HPI bus holder feature. HBH is cleared to 0 at reset. HBH = 0 The bus holder is disabled. HBH = 1 The bus holder is enabled. When not driven, the HPI data bus (HD[7:0]) is held in the
previous logic level.
1 BH 0
Bus holder. BH controls the data bus holder feature. BH is cleared to 0 at reset. BH = 0 The bus holder is disabled. BH = 1 The bus holder is enabled. When not driven, the data bus (D[15:0]) is held in the
previous logic level.
External bus interface off. The EXIO bit controls the external bus-off function.
0 EXIO 0
EXIO
= 0
The external bus interface functions as usual
.
EXIO = 1 The address bus, data bus, and control signals become inactive after completing the
current bus cycle. Note that the
DROM, MP/MC
, and
OVLY bits in the PMST
and the
HM
bit of ST1 cannot be modified when the interface is disabled.
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parallel I/O ports
The ’UC5409 has a total of 64K I/O ports. These ports can be addressed by the PORTR instruction or the PORTW instruction. The IS
signal indicates a read/write operation through an I/O port. The ’UC5409 can interface easily with external devices through the I/O ports while requiring minimal off-chip address-decoding circuits.
enhanced 8-bit host-port interface (HPI8/16)
The ’UC5409 host-port interface, also referred to as the HPI8/16, is an enhanced version of the standard 8-bit HPI found on earlier ’54x DSPs (’542, ’545, ’548, and ’549). The HPI8/16 is an 8-bit parallel port for interprocessor communication. The features of the HPI8/16 include:
Standard features:
D
Sequential transfers (with autoincrement) or random-access transfers
D
Host interrupt and ’54x interrupt capability
D
Multiple data strobes and control pins for interface flexibility
Enhanced features of the ’UC5409 HPI8/16:
D
Access to entire on-chip RAM through DMA bus
D
Capability to continue transferring during emulation stop
D
Capability to transfer 16-bit address and 16-bit data (non-multiplexed mode)
The HPI8/16 functions as a slave and enables the host processor to access the on-chip memory of the ’UC5409. A major enhancement to the ’UC5409 HPI over previous versions is that it allows host access to the entire on-chip memory range of the DSP. The HPI8/16 does not have access to external memory. The host and the DSP both have access to the on-chip RAM at all times and host accesses are always synchronized to the DSP clock. If the host and the DSP contend for access to the same location, the host has priority , and the DSP waits for one HPI8/16 cycle. Note that since host accesses are always synchronized to the ’UC5409 clock, an active input clock (CLKIN) is required for HPI8/16 accesses during IDLE states, and host accesses are not allowed while the ’UC5409 reset pin is asserted.
In standard 8-bit mode, the HPI8/16 interface consists of an 8-bit bidirectional data bus and various control signals. Sixteen-bit transfers are accomplished in two parts with the HBIL input designating high or low byte. The host communicates with the HPI8/16 through three dedicated registers — HPI address register (HPIA), HPI data register (HPID), and an HPI control register (HPIC). The HPIA and HPID registers are only accessible by the host, and the HPIC register is accessible by both the host and the ’UC5409.
In 16-bit nonmultiplexed mode (HPI16=1), the HPI8/16 can read and write to internal memory via the external address and data pins, A0 – A15 and D0–D15, respectively. HD0–HD7 can be configured as general-purpose input/output (GPIO). The HPI16 non-multiplexed mode does not support the use of the HPID and HPIA registers. Host-to-DSP and DSP-to-host interrupts are also not supported. See Figure 6 for the HPI memory map.
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enhanced 8-bit host-port interface (HPI8/16) (continued)
0000h 005Fh
Reserved
0060h
007Fh
Scratch-Pad
RAM
0080h
7FFFh
On-Chip RAM
(32K x 16 Bits)
8000h
FFFFh
Reserved
Figure 6. ’UC5409 HPI Memory Map
HPI nonmultiplexed mode
In
nonmultiplexed
mode, a host with separate address/data buses can access the HPI16 data register (HPID) via the HD 16-bit bidirectional data bus, and the address register (HPIA) via the 16-bit HA address bus. The host initiates the access with the strobe signals (HDS1
, HDS2, HCS) and controls the direction of the access with the HR/W signal. The HPI16 can stall host accesses via the HRDY signal. Note that the HPIC register is not available in
nonmultiplexed
mode since there are no HCNTL signals available. All host accesses initiate a DMA
read or write access. Figure 7 shows a block diagram of the HPI16 in
nonmultiplexed
mode.
HPID[15:0]
HAS
HDS1, HDS2, HCS
DMA
Internal
Memory
PPD[15:0]
DATA[15:0]
Address[15:0]
R/W
Data Strobes
READY
HPI16
HRDY
’54xx
CPU
V
CC
HCNTL0 HCNTL1
HR/W
HINT
HBIL
HOST
Figure 7. Host-Port Interface — Nonmultiplexed Mode
host access control
Host accesses are controlled by the data strobes (HDS1 and HDS2), along with chip select (HCS), in exactly the same fashion as documented in the
HPI nonmultiplexed mode
section.
host access type
In
nonmultiplexed
mode, only one access type (HPID read/write) is available since the HPIA register is not
needed because of direct address inputs, and since the HCNTL pins are not available for access-type selection.
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HPI16 control register (HPIC)
In
nonmultiplexed
mode, the HPIC register is not accessible via the host. This precludes DSP-to-host or host-to-DSP interrupts, data prefetch via the FETCH bit, and HRDY polling. Extended addressing capability still exists (even without the XHPIA bit) because the HA bus is 16 bits wide.
HPI16 address register (HPIA)
In
nonmultiplexed
mode, the HPIA register is not needed because direct address inputs A[15:0] are used as HA[15:0]. The DMA address comes directly from the HA pins. Note that the HA bus is still always latched at the end of the host access (on the rising edge of HDS = HDS1 XNOR HDS2) in order to ensure a valid address during the DMA write access.
host data prefetch
Since the HPIA register is not used in
nonmultiplexed
mode, the prefetch mechanism is not supported. Random
address accesses in
nonmultiplexed
mode are still faster than those in
multiplexed
mode because of the
separate address and data buses.
host ready logic (HRDY)
Hardware HRDY logic operation in
nonmultiplexed
mode is the same as that in
multiplexed
mode. HRDY
operation during prefetches and HRDY/FETCH bit interaction are not supported with
nonmultiplexed
mode.
host/DSP interrupts
Host-to-DSP and DSP-to-host interrupts are not supported by HPI16 in
nonmultiplexed
mode.
other HPI system considerations
operation during IDLE2
The HPI can continue to operate during IDLE1 or IDLE2 by using special clock management logic that turns on relevant clocks to perform a synchronous memory access, and then turns the clocks back off to save power . The DSP CPU does not wake up from the IDLE mode during this process.
multichannel buffered serial ports
The ’UC5409 device has three high-speed, full-duplex multichannel buffered serial ports (McBSPs) that allow direct interface to other ’C54x/’LC54x devices, codecs, and other devices in a system. The McBSPs are based on the standard serial port interface found on other ’54x devices. Like its predecessors, the McBSP provides:
D
Full-duplex communication
D
Double-buffer data registers, which allow a continuous data stream
D
Independent framing and clocking for receive and transmit
In addition, the McBSP has the following capabilities:
D
Direct interface to: – T1/E1 framers – MVIP switching-compatible and ST-BUS compliant devices – IOM-2 compliant devices – AC97-compliant devices – Serial peripheral interface (SPIt) devices
D
Multichannel transmit and receive of up to 128 channels
D
A wide selection of data sizes including 8, 12, 16, 20, 24, or 32 bits
D
µ-law and A-law companding
D
Programmable polarity for both frame synchronization and data clocks
D
Programmable internal clock and frame generation
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multichannel buffered serial ports (continued)
The McBSPs consist of separate transmit and receive channels that operate independently. The external interface of each McBSP consists of the following pins:
D
BCLKX Transmit reference clock
D
BDX Transmit data
D
BFSX Transmit frame synchronization
D
BCLKR Receive reference clock
D
BDR Receive data
D
BFSR Receive frame synchronization
The six pins listed are functionally equivalent to the pins of previous serial port interface pins in the ’C5000 family of DSPs. On the transmitter, transmit frame synchronization and clocking are indicated by the BFSX and BCLKX pins, respectively. The CPU or DMA can initiate transmission of data by writing to the data transmit register (DXR). Data written to DXR is shifted out on the BDX pin through a transmit shift register (XSR). This structure allows DXR to be loaded with the next word to be sent while the transmission of the current word is in progress.
On the receiver, receive frame synchronization and clocking are indicated by the BFSR and BCLKR pins, respectively . The CPU or DMA can read received data from the data receive register (DRR). Data received on the BDR pin is shifted into a receive shift register (RSR) and then buffered in the receive buffer register (RBR). If the DRR is empty, the RBR contents are copied into the DRR. If not, the RBR holds the data until the DRR is available. This structure allows storage of the two previous words while the reception of the current word is in progress.
The CPU and DMA can move data to and from the McBSPs and can synchronize transfers based on McBSP interrupts, event signals, and status flags. The DMA is capable of handling data movement between the McBSPs and memory with no intervention from the CPU.
In addition to the standard serial port functions, the McBSP provides programmable clock and frame sync generation. Among the programmable functions are:
D
Frame synchronization pulse width
D
Frame period
D
Frame synchronization delay
D
Clock reference (internal vs. external)
D
Clock division
D
Clock and frame sync polarity
The on-chip companding hardware allows compression and expansion of data in either µ-law or A-law format. When companding is used, transmit data is encoded according to specified companding law and received data is decoded to 2s complement format.
The McBSP allows the multiple channels to be independently selected for the transmitter and receiver. When multiple channels are selected, each frame represents a time-division multiplexed (TDM) data stream. In using TDM data streams, the CPU may only need to process a few of them. Thus, to save memory and bus bandwidth, multichannel selection allows independent enabling of particular channels for transmission and reception. Up to 32 channels in a stream of up to 128 channels can be enabled.
The clock-stop mode (CLKSTP) in the McBSP provides compatibility with the serial peripheral interface (SPI) protocol. Clock-stop mode works with only single-phase frames and one word per frame. The word sizes supported by the McBSP are programmable for 8-, 12-, 16-, 20-, 24-, or 32-bit operation. When the McBSP is configured to operate in SPI mode, both the transmitter and the receiver operate together as a master or as a slave.
The McBSP is fully static and operates at arbitrarily low clock frequencies. The maximum frequency is CPU clock frequency divided by 2.
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sample rate generator external clock options
Although the CLKS pin is not available on the ’5409 PGE and GGU packages, the ’5409 is capable of synchronization to external clock sources. CLKX or CLKR can be used by the sample rate generator for external synchronization. The sample rate clock mode extended (SCLKME) bit field is located in the PCR to accomodate this option.
15 14 13 12 11 10 9 8
Reserved XIOEN RIOEN FSXM FSRM CLKXM CLKRM
RW RW RW RW RW RW RW
76543210
SCLKME CLKS STAT DX STAT DR STAT FSXP FSRP CLKXP CLKRP
RW RW RW RW RW RW RW RW
Legend: R = Read, W = Write
Figure 8. Pin Control Register (PCR)
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sample rate generator external clock options (continued)
Table 5. Pin Control Register (PCR) Bit Field Description
BIT NAME FUNCTION
15 – 14 Reserved Reserved. Pins are not used.
13 XIOEN
Transmit/Receive general-purpose I/O mode ONLY when XRST=0 in the SPCR(1/2)
XIOEN = 0 DX pin is not a general-purpose output. FSX and CLKX are not general-purpose I/Os. XIOEN = 1 DX pin is a general-purpose output. FSX and CLKX are general-purpose I/Os. These
serial port pins do not perform serial port operations.
12 RIOEN
Transmit/Receive general-purpose I/O mode ONLY when RRST=0 in the SPCR(1/2)
RIOEN = 0 DR and CLKS pins are not general-purpose inputs. FSR and CLKR are not
general-purpose I/Os.
RIOEN = 1 DR and CLKS pins are general-purpose inputs. FSR and CLKR are general-purpose
I/Os. These serial port pins do not perform serial port operations. The CLKS pin is affected by a combination of RRST
and RIOEN signals of the receiver.
11 FSXM
Transmit frame synchronization mode
FSRM = 0 Frame synchronization signal derived from an external source. FSRM = 1 Frame synchronization is determined by the sample rate generator frame
synchronization mode bit (FSGM) in the SRGR2.
10 FSRM
Receive frame synchronization mode
FSRM = 0 Frame synchronization pulses generated by an external device. FSR is an input pin. FSRM = 1 Frame synchronization generated internally by the sample rate generator . FSR is an
output pin except when GSYNC=1 in the SRGR.
9 CLKRM
Receiver clock mode
Case 1: Digital loop-back mode is not set (CLB=0) in SPCR1.
CLKRM = 0 Receive clock (CLKR) is an input pin driven by an external clock. CLKRM= 1 CLKR is an output pin and is driven by the internal sample rate generator
Case 2: Digital loop-back mode set (CLB=1) in SPCR1
CLKRM = 0 Receive clock (
Not
the CLKR pin) is driven by transmit clock (CLKX), which is based
on CLKXM bit in the PCR. CLKR pin is in high-impedance mode.
CLKRM= 1 CLKR is an output pin and is driven by the transmit clock. The transmit clock is derived
based on the CLKXM bit in the PCR.
8 CLKXM
Transmitter clock mode
CLKXM = 0 Receiver/transmitter clock is driven by an external clock with CLK(R/X) as an input
pin
CLKXM= 1 CLK(R/X) is an output pin and is driven by the internal sample rate generator
During SPI mode (CLKSTP is a non-zero value):
CLKXM = 0 McBSP is a slave and clock (CLKX) is driven by the SPI master in the system. CLKR
is internally driven by CLKX.
CLKXM= 1 McBSP is a master and generates the clock (CLKX) to drive its receive clock (CLKR)
and the shift clock of the SPI-compliant slaves in the system.
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Table 5. Pin Control Register (PCR) Bit Field Description (Continued)
BIT FUNCTIONNAME
7 SCLKME
Sample rate clock mode extended
SCLKME = 0 External clock via CLKS or CPU clock is used as a reference by the sample rate
generator.
SCLKME = 1 External clock via CLKR or CLKX clock is used as a reference by the sample rate
generator.
6
CLKS
STAT
CLKS pin status. CLKS STAT reflects value on CLKS pin when selected as a general-purpose input.
5 DX STAT DX pin status. DX STA T reflects value on DX pin when it is selected as a general-purpose output. 4 DR STAT DR pin status. DR STAT reflects value on DR pin when it is selected as a general-purpose input.
FSXP
Receive/Transmit frame synchronization polarity.
3
2
FSRP
FS(R/X)P = 0 Frame synchronization pulse FS(R/X) is active high FS(R/X)P = 1 Frame synchronization pulse FS(R/X) is active low
1 CLKXP
Transmit clock polarity
CLKXP = 0 Transmit data sampled on rising edge of CLKR CLKXP = 1 T ransmit data sampled on falling edge of CLKR
0 CLKRP
Receive clock polarity
CLKRP = 0 Receive data sampled on falling edge of CLKR CLKRP = 1 Receive data sampled on rising edge of CLKR
The ’5409 sample rate generator has four clock input options that are only available when both the PCR and SRGR2 are used. Table 6 shows the sample rate generator clock input options.
Table 6. Sample Rate Generator Clock Input Options
MODE
SCLKME
(PCR.7)
CLKSM
(SRGR2.13)
CLKS pin 0 0
CPU 0 1 CLKR pin 1 0 CLKX pin 1 1
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
GSYNC CLKSP CLKSM
FSGM
FPER
RW RW RW RW RW
Legend: R = Read, W = Write
Figure 9. Sample Rate Generator Register 2 (SRGR2)
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sample rate generator external clock options (continued)
Table 7. Sample Rate Generator Register 2 (SRGR2) Bit Field Descriptions
BIT NAME FUNCTION
15 GSYNC
Sample rate gnereator clock synchronization. Only used when the external clock (CLKS) drives the sample rate generator clock (CLKSM=0)
GSYNC = 0 The sample rate generator clock (CLKG) is free-running. GSYNC = 1 The sample rate generator clock (CLKG) is running. But CLKG is resynchronized and
frame sync signal (FSG) is generated only after detecting the receive frame synchronization signal (FSR). Also, frame period (FPER) is a don’t care because the period is dictated by the external frame sync pulse.
14 CLKSP
CLKS polarity clock edge select. Only used when the external clock (CLKS) drives the sample rate generator clock (CLKSM=0).
CLKSP = 0 Rising edge of CLKS generates CLKG and FSG. CLKSP = 1 Falling edge of CLKS generates CLKG and FSG.
13 CLKSM
McBSP sample rate generator clock mode
SCLKME = 0 CLKSM = 0 Sample rate generator clock derived from the CLKS pin (in PCR) CLKSM = 1 Sample rate generator clock derived from CPU clock
SCLKME = 1 CLKSM = 0 Sample rate generator clock derived from CLKR pin (in PCR) CLKSM = 1 Smaple rate generator clock derived from CLKX pin
12 FSGM
Sample rate generator transmit frame synchronization mode. Used when FSXM=1 in the PCR.
FSGM = 0 Transmit frame sync signal (FSX) due to DXR(1/2) copy FSGN = 1 Transmit frame sync signal driven by the sample rate generator frame sync signal
(FSG)
11 – 0 FPER
Frame period. This determines when the next frame sycn signal should become active. Range: up to 212; 1 to 4096 CLKG periods.
hardware timer
The ’UC5409 device features one 16-bit timing circuit with a 4-bit prescaler. The main counter of each timer is decremented by one every CLKOUT cycle. Each time the counter decrements to 0, a timer interrupt is generated. The timer can be stopped, restarted, reset, or disabled by specific control bits.
clock generator
The clock generator provides clocks to the ’UC5409 device, and consists of an internal oscillator and a phase-locked loop (PLL) circuit. The clock generator requires a reference clock input, which can be provided by using a crystal resonator with the internal oscillator, or from an external clock source. The reference clock input is then divided by two (DIV mode) to generate clocks for the ’UC5409 device, or the PLL circuit can be used (PLL mode) to generate the device clock by multiplying the reference clock frequency by a scale factor, allowing use of a clock source with a lower frequency than that of the CPU.The PLL is an adaptive circuit that, once synchronized, locks onto and tracks an input clock signal.
When the PLL is initially started, it enters a transitional mode during which the PLL acquires lock with the input signal. Once the PLL is locked, it continues to track and maintain synchronization with the input signal. Then, other internal clock circuitry allows the synthesis of new clock frequencies for use as master clock for the ’UC5409 device.
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clock generator (continued)
This clock generator allows system designers to select the clock source. The sources that drive the clock generator are:
D
A crystal resonator circuit. The crystal resonator circuit is connected across the X1 and X2/CLKIN pins of the ’UC5409 to enable the internal oscillator.
D
An external clock. The external clock source is directly connected to the X2/CLKIN pin, and X1 is left unconnected.
The software-programmable PLL features a high level of flexibility, and includes a clock scaler that provides various clock multiplier ratios, capability to directly enable and disable the PLL, and a PLL lock timer that can be used to delay switching to PLL clocking mode of the device until lock is achieved. Devices that have a built-in software-programmable PLL can be configured in one of two clock modes:
D
PLL mode. The input clock (X2/CLKIN) is multiplied by 1 of 31 possible ratios. These ratios are achieved using the PLL circuitry.
D
DIV (divider) mode. The input clock is divided by 2 or 4. Note that when DIV mode is used, the PLL can be completely disabled in order to minimize power dissipation.
The software-programmable PLL is controlled using the 16-bit memory-mapped (address 0058h) clock mode register (CLKMD). The CLKMD register is used to define the clock configuration of the PLL clock module. Upon reset, the CLKMD register is initialized with a predetermined value dependent only upon the state of the CLKMD1 – CLKMD3 pins as shown in Table 8.
Table 8. Clock Mode Settings at Reset
CLKMD1 CLKMD2 CLKMD3
CLKMD
CLOCK MODE
RESET VALUE
0 0 0 E007h PLL x 15 0 0 1 9007h PLL x 10
0 1 0 4007h PLL x 5 1 0 0 1007h PLL x 2 1 1 0 F007h PLL x 1 1 1 1 0000h 1/2 (PLL disabled) 1 0 1 F000h 1/4 (PLL disabled) 0 1 1 Reserved (Bypass mode)
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DMA controller
The ’UC5409 direct memory access (DMA) controller transfers data between points in the memory map without intervention by the CPU. The DMA controller allows movements of data to and from internal program/data memory, internal peripherals (such as the McBSPs), and external program/data memory to occur in the background of CPU operation. The DMA has six independent programmable channels allowing six different contexts for DMA operation.
features
The DMA has the following features:
D
The DMA has external memory access.
D
The DMA operates independently of the CPU.
D
The DMA has six channels. The DMA can keep track of the contexts of six independent block transfers.
D
The DMA has higher priority than the CPU for internal accesses.
D
Each channel has independently programmable priorities.
D
Each channel’s source and destination address registers can have configurable indexes through memory on each read and write transfer, respectively. The address may remain constant, be post-incremented, post-decremented, or be adjusted by a programmable value.
D
Each read or write transfer may be initialized by selected events. (Internally only)
D
Each DMA channel is capable of sending interrupts to the CPU.
D
The DMA can perform double-word transfers (a 32-bit transfer of two 16-bit words). (Internally only)
DMA external access
The ’UC5409 DMA supports external accesses to extended program, data memory , and extended I/O memory.
D
Only two channels are available for external accesses. (One for external reads/one for external writes.)
D
Single-word transfers are supported for external accesses.
D
The DMA does not support transfers from peripherals to external memory.
D
The DMA does not support transfers from external memory to the peripherals.
DMA external transfer
Unlike the ’5410, the ’5409 DMA mode control register (DMMCRx) has two additional bits; DLAXS (DMMCRn[5]) and SLAXS (DMMCRn[11]). These new bits specify the on/off-chip memory for the source and destination of the program/data/IO spaces.
D
When DLAXS is set to 0 (default), the DMA does not perform an external access for the destination. When DLAXS is set to 1, the DMA performs an external access to the destination location.
D
When SLAXS is set to 0 (default), the DMA does not perform an external access for the source. When DLAXS is set to 1, the DMA performs an external access from the source location.
Two new registers are added to the ’5409 DMA to support DMA accesses to/from DMA extended data memory , page 1 to page 127.
D
The DMA extended source data page register (XSRCDP[6:0]) is located at subbank address 028h.
D
The DMA extended destination data page register (XDSTDP[6:0]) is located at subbank address 029h.
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DMA memory map
The DMA memory map, as shown in Figure 10, allows DMA transfers to be unaffected by the status of the MP/MC, DROM, and OVLY bits.
Program
Data
Program
FFFF
0021
0060
002F 0030
Reserved
C000
017FFF
018000
0037 0038
xxFFFF
003F 0040
FFFF
Hex
010000
Hex
0000
BFFF
External
01FFFF
xx0000
Hex
Program
Page 0
Page 5, 6, ...
Page n
External
DARAM Internal
32K
Hex
0000
007F
0080
External
On-Chip
ROM
Reserved
001F
0023 0024
0033 0034
0035 0036
0039
003A
0049
7FFF
8000
004A 004B
003B 003C
005F
004C
DRR20 DRR10 DXR20
DXR10
Reserved
DRR22 DRR12 DXR22
DXR12
Reserved
RCERA2
XCERA2
Reserved
DRR21 DRR11
DXR21 DXR11
Reserved
RCERA0 XCERA0
Reserved
Scratch-
Pad RAM
DARAM
External
0080
007F
0044
0043
0042
0041
0022
0020
0031 0032
Reserved
RCERA1 XCERA1
Data
xx0000
Page 1, 2, ... 127
External
I/O
0000
External
Hex Hex
xxFFFF FFFF
7FFF
8000
Page 0, 1, ... 127
NOTE A: n = 1, 2, 3, or 4
Figure 10. TMS320UC5409 DMA Memory Map
DMA priority level
Each DMA channel can be independently assigned high priority or low priority relative to each other. Multiple DMA channels that are assigned to the same priority level are handled in a round-robin manner.
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DMA source/destination address modification
The DMA provides flexible address-indexing modes for easy implementation of data management schemes such as autobuffering and circular buffers. Source and destination addresses can be indexed separately and can be post-incremented, post-decremented, or post-incremented with a specified index offset.
DMA in autoinitialization mode
The DMA can automatically reinitialize itself after completion of a block transfer. Some of the DMA registers can be preloaded for the next block transfer through the DMA global reload registers (DMGSA, DMGDA, and DMGCR). Autoinitialization allows:
D
Continuous operation: Normally, the CPU would have to reinitialize the DMA immediately after the completion of the current block transfer; but with the global reload registers, it can reinitialize these values for the next block transfer any time after the current block transfer begins.
D
Repetitive operation: The CPU does not preload the global reload register with new values for each block transfer but only loads them on the first block transfer.
DMA transfer counting
The DMA channel element count register (DMCTRx) and the frame count register (DMFRCx) contain bit fields that represent the number of frames and the number of elements per frame to be transferred.
D
Frame count. This 8-bit value defines the total number of frames in the block transfer. The maximum number of frames per block transfer is 128 (FRAME COUNT= 0ffh). The counter is decremented upon the last read transfer in a frame transfer. Once the last frame is transferred, the selected 8-bit counter is reloaded with the DMA global frame reload register (DMGFR) if the AUTOINIT bit is set to 1. A frame count of 0 (default value) means the block transfer contains a single frame.
D
Element count. This 16-bit value defines the number of elements per frame. This counter is decremented after the read transfer of each element. The maximum number of elements per frame is 65536 (DMCTRn = 0FFFFh). In autoinitialization mode, once the last frame is transferred, the counter is reloaded with the DMA global count reload register (DMGCR).
DMA transfers in double-word mode (Internal Only)
Double-word mode allows the DMA to transfer 32-bit words in any index mode. In double-word mode, two consecutive 16-bit transfers are initiated and the source and destination addresses are automatically updated following each transfer. In this mode, each 32-bit word is considered to be one element.
DMA channel index registers
The particular DMA channel index register is selected by way of the SIND and DIND field in the DMA mode control register (DMMCRx). Unlike basic address adjustment, in conjunction with the frame index DMFRI0 and DMFRI1, the DMA allows different adjustment amounts depending on whether or not the element transfer is the last in the current frame. The normal adjustment value (element index) is contained in the element index registers DMIDX0 and DMIDX1. The adjustment value (frame index) for the end of the frame is determined by the selected DMA frame index register (either DMFRI0 or DMFRI1).
The element index and the frame index affect address adjustment as follows:
D
Element index: For all except the last transfer in the frame, the element index determines the amount to be added to the DMA channel for the source/destination address register (DMSRCx/DMDSTx) as selected by the SIND/DIND bits.
D
Frame index: If the transfer is the last in a frame, the frame index is used for address adjustment as selected by the SIND/DIND bits. This occurs in both single-frame and multi-frame transfer.
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DMA interrupts
The ability of the DMA to interrupt the CPU based on the status of the data transfer is configurable and is determined by the IMOD and DINM bits in the DMA channel mode control register (DMMCRn). The available modes are shown in Table 9.
Table 9. DMA Interrupts
MODE DINM IMOD INTERRUPT
ABU (non-decrement) 1 0 At full buffer only ABU (non-decrement) 1 1 At half buffer and full buffer Multi-Frame 1 0 At block-transfer complete (DMCTRn = DMSEFCn[7:0] = 0) Multi-Frame 1 1 At end of frame and end of block (DMCTRn = 0) Either 0 X No interrupt generated Either 0 X No interrupt generated
DMA controller synchronization events
The transfers associated with each DMA channel can be synchronized to one of several events. The DSYN bit field of the DMSEFCn register selects the synchronization event for a channel. The list of possible events and the DSYN values are shown in Table 10.
Table 10. DMA Synchronization Events
DSYN VALUE DMA SYNCHRONIZATION EVENT
0000b No synchronization used 0001b McBSP0 receive event 0010b McBSP0 transmit event 0011b McBSP2 receive event 0100b McBSP2 transmit event 0101b McBSP1 receive event 0110b McBSP1 transmit event 0111b Reserved 1000b Reserved 1001b Reserved 1010b Reserved 1011b Reserved 1100b Reserved 1101b Timer interrupt event 1110b External interrupt 3
1111b Reserved
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DMA channel interrupt selection
The DMA controller can generate a CPU interrupt for each of the six channels. However, due to a limit on the number of internal CPU interrupt inputs, channels 0, 1, 2, and 3 are multiplexed with other interrupt sources. DMA channels 0, 1, 2, and 3 share an interrupt line with the receive and transmit portions of the McBSP. When the ’UC5409 is reset, the interrupts from these three DMA channels are deselected. The INTSEL bit field in the DMPREC register can be used to select these interrupts, as shown in Table 11.
Table 11. DMA Channel Interrupt Selection
INTSEL Value IMR/IFR[6] IMR/IFR[7] IMR/IFR[10] IMR/IFR[11]
00b (reset) BRINT2 BXINT2 BRINT1 BXINT1
01b BRINT2 BXINT2 DMAC2 DMAC3 10b DMAC0 DMAC1 DMAC2 DMAC3
11b Reserved
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memory-mapped registers
The ’UC5409 has 27 memory-mapped CPU registers, which are mapped in data memory space addresses 0h to 1Fh. The device also has a set of memory-mapped registers associated with peripherals. Table 12 gives a list of CPU memory-mapped registers (MMRs) available on ’UC5409. Table 13 shows additional peripheral MMRs associated with the ’UC5409.
Table 12. CPU Memory-Mapped Registers
ADDRESS
NAME
DEC HEX
DESCRIPTION
IMR 0 0 Interrupt mask register IFR 1 1 Interrupt flag register – 2–5 2–5 Reserved for testing ST0 6 6 Status register 0 ST1 7 7 Status register 1 AL 8 8 Accumulator A low word (15–0) AH 9 9 Accumulator A high word (31–16) AG 10 A Accumulator A guard bits (39–32) BL 11 B Accumulator B low word (15–0) BH 12 C Accumulator B high word (31–16) BG 13 D Accumulator B guard bits (39–32) TREG 14 E Temporary register TRN 15 F Transition register AR0 16 10 Auxiliary register 0 AR1 17 11 Auxiliary register 1 AR2 18 12 Auxiliary register 2 AR3 19 13 Auxiliary register 3 AR4 20 14 Auxiliary register 4 AR5 21 15 Auxiliary register 5 AR6 22 16 Auxiliary register 6 AR7 23 17 Auxiliary register 7 SP 24 18 Stack pointer register BK 25 19 Circular buffer size register BRC 26 1A Block repeat counter RSA 27 1B Block repeat start address REA 28 1C Block repeat end address PMST 29 1D Processor mode status (PMST) register XPC 30 1E Extended program page register – 31 1F Reserved
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memory-mapped registers (continued)
Table 13. Peripheral Memory-Mapped Registers
NAME ADDRESS DESCRIPTION TYPE
DRR20 20h Data receive register 2 McBSP #0 DRR10 21h Data receive register 1 McBSP #0 DXR20 22h Data transmit register 2 McBSP #0 DXR10 23h Data transmit register 1 McBSP #0 TIM 24h Timer register Timer PRD 25h Timer period counter Timer TCR 26h Timer control register Timer – 27h Reserved SWWSR 28h Software wait-state register External Bus BSCR 29h Bank-switching control register External Bus – 2Ah Reserved SWCR 2Bh Software wait-state control register External Bus HPIC 2Ch HPI control register HPI – 2Dh–2Fh Reserved DRR22 30h Data receive register 2 McBSP #2 DRR12 31h Data receive register 1 McBSP #2 DXR22 32h Data transmit register 2 McBSP #2 DXR12 33h Data transmit register 2 McBSP #2 SPSA2 34h McBSP2 subbank address register McBSP #2 SPSD2 35h McBSP2 subbank data register McBSP #2 – 36–37h Reserved SPSA0 38h McBSP0 subbank address register McBSP #0 SPCD0 39h McBSP0 subbank data register McBSP #0 – 3Ah–3Bh Reserved GPIOCR
3C
General-purpose I/O pins control register
GPIO
GPIOSR
3D
General-purpose I/O pins status register
GPIO – 3E–3F Reserved DRR21 40h Data receive register 1 McBSP #1 DRR11 41h Data receive register 2 McBSP #1 DXR21 42h Data transmit register 1 McBSP #1 DXR11 43h Data transmit register 2 McBSP #1 – 44h–47h Reserved SPSA1 48h McBSP1 subbank address register McBSP #1 SPCD1 49h McBSP1 subbank data register McBSP #1 – 4Ah–53h Reserved DMPREC 54h DMA channel priority and enable control register DMA DMSA 55h DMA subbank address register DMA DMSDI 56h DMA subbank data register with autoincrement DMA DMSDN 57h DMA subbank data registrer DMA CLKMD
58h
Clock mode register
PLL
59h–5Fh Reserved
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McBSP control registers and subaddresses
The control registers for the multichannel buffered serial port (McBSP) are accessed using the subbank addressing scheme. This allows a set or subbank of registers to be accessed through a single memory location. The serial port subbank address (SPSA) register is used as a pointer to select a particular register within the subbank. The serial port subbank data (SPSD) register is used to access (read or write) the selected register. Table 14 shows the McBSP control registers and their corresponding subaddresses.
Table 14. McBSP Control Registers and Subaddresses
McBSP0 McBSP1
NAME ADDRESS NAME ADDRESS
SUB
ADDRESS
DESCRIPTION
SPCR10
39h
SPCR11
49h
00h
Serial port control register 1
SPCR20
39h
SPCR21
49h
01h
Serial port control register 2
RCR10
39h
RCR11
49h
02h
Receive control register 1
RCR20
39h
RCR21
49h
03h
Receive control register 2
XCR10
39h
XCR11
49h
04h
Transmit control register 1
XCR20
39h
XCR21
49h
05h
Transmit control register 2
SRGR10
39h
SRGR11
49h
06h
Sample rate generator register 1
SRGR20
39h
SRGR21
49h
07h
Sample rate generator register 2
MCR10
39h
MCR11
49h
08h
Multichannel register 1
MCR20
39h
MCR21
49h
09h
Multichannel register 2
RCERA0
39h
RCERA1
49h
0Ah
Receive channel enable register partition A
RCERB0
39h
RCERB1
49h
0Bh
Receive channel enable register partition B
XCERA0
39h
XCERA1
49h
0Ch
Transmit channel enable register partition A
XCERB0
39h
XCERB1
49h
0Dh
Transmit channel enable register partition B
PCR0
39h
PCR1
49h
0Eh
Pin control register
DMA subbank addressed registers
The direct memory access (DMA) controller has several control registers associated with it. The main control register (DMPREC) is a standard memory mapped register. However, the other registers are accessed using the subbank addressing scheme. This allows a set, or subbank of registers to be accessed through a single memory location. The DMA subbank address (DMSA) register is used as a pointer to select a particular register within the subbank, while the DMA subbank data (DMSDN) register or the DMA subbank data register with autoincrement (DMSDI) is used to access (read or write) the selected register.
When the DMSDI register is used to access the subbank, the subbank address is automatically postincremented so that a subsequent access affects the next register within the subbank. This autoincrement feature is intended for efficient, successive accesses to several control registers. If the autoincrement feature is not required, the DMSDN register should be used to access the subbank. T able 15 shows the DMA controller subbank addressed registers and their corresponding subaddresses.
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DMA subbank addressed registers (continued)
Table 15. DMA Subbank Addressed Registers
DMA
NAME ADDRESS
SUB
ADDRESS
DESCRIPTION
DMSRC0 56h/57h
00h DMA channel 0 source address register
DMDST0 56h/57h
01h DMA channel 0 destination address register
DMCTR0 56h/57h
02h DMA channel 0 element count register
DMSFC0
56h/57h
03h
DMA channel 0 sync select and frame count register
DMMCR0
56h/57h
04h
DMA channel 0 transfer mode control register
DMSRC1
56h/57h
05h
DMA channel 1 source address register
DMDST1
56h/57h
06h
DMA channel 1 destination address register
DMCTR1
56h/57h
07h
DMA channel 1 element count register
DMSFC1
56h/57h
08h
DMA channel 1 sync select and frame count register
DMMCR1
56h/57h
09h
DMA channel 1 transfer mode control register
DMSRC2
56h/57h
0Ah
DMA channel 2 source address register
DMDST2
56h/57h
0Bh
DMA channel 2 destination address register
DMCTR2
56h/57h
0Ch
DMA channel 2 element count register
DMSFC2
56h/57h
0Dh
DMA channel 2 sync select and frame count register
DMMCR2
56h/57h
0Eh
DMA channel 2 transfer mode control register
DMSRC3
56h/57h
0Fh
DMA channel 3 source address register
DMDST3
56h/57h
10h
DMA channel 3 destination address register
DMCTR3
56h/57h
11h
DMA channel 3 element count register
DMSFC3
56h/57h
12h
DMA channel 3 sync select and frame count register
DMMCR3
56h/57h
13h
DMA channel 3 transfer mode control register
DMSRC4
56h/57h
14h
DMA channel 4 source address register
DMDST4
56h/57h
15h
DMA channel 4 destination address register
DMCTR4
56h/57h
16h
DMA channel 4 element count register
DMSFC4
56h/57h
17h
DMA channel 4 sync select and frame count register
DMMCR4
56h/57h
18h
DMA channel 4 transfer mode control register
DMSRC5
56h/57h
19h
DMA channel 5 source address register
DMDST5
56h/57h
1Ah
DMA channel 5 destination address register
DMCTR5
56h/57h
1Bh
DMA channel 5 element count register
DMSFC5
56h/57h
1Ch
DMA channel 5 sync select and frame count register
DMMCR5
56h/57h
1Dh
DMA channel 5 transfer mode control register
DMSRCP
56h/57h
1Eh
DMA source program page address (common channel)
DMDSTP
56h/57h
1Fh
DMA destination program page address (common channel)
DMIDX0
56h/57h
20h
DMA element index address register 0
DMIDX1
56h/57h
21h
DMA element index address register 1
DMFRI0
56h/57h
22h
DMA frame index register 0
DMFRI1
56h/57h
23h
DMA frame index register 1
DMGSA
56h/57h
24h
DMA global source address reload register
DMGDA
56h/57h
25h
DMA global destination address reload register
DMGCR
56h/57h
26h
DMA global count reload register
DMGFR
56h/57h
27h
DMA global frame count reload register
ADVANCE INFORMATION
TMS320UC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
34
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
interrupts
Vector-relative locations and priorities for all internal and external interrupts are shown in Table 16.
Table 16. Interrupt Locations and Priorities
NAME
LOCATION
DECIMAL HEX
PRIORITY FUNCTION
RS, SINTR 0 00 1 Reset (hardware and software reset) NMI, SINT16 4 04 2 Nonmaskable interrupt SINT17 8 08 Software interrupt #17 SINT18 12 0C Software interrupt #18 SINT19 16 10 Software interrupt #19 SINT20 20 14 Software interrupt #20 SINT21 24 18 Software interrupt #21 SINT22 28 1C Software interrupt #22 SINT23 32 20 Software interrupt #23 SINT24 36 24 Software interrupt #24 SINT25 40 28 Software interrupt #25 SINT26 44 2C Software interrupt #26 SINT27 48 30 Software interrupt #27 SINT28 52 34 Software interrupt #28 SINT29 56 38 Software interrupt #29 SINT30 60 3C Software interrupt #30 INT0, SINT0 64 40 3 External user interrupt #0 INT1, SINT1 68 44 4 External user interrupt #1 INT2, SINT2 72 48 5 External user interrupt #2 TINT, SINT3 76 4C 6 Timer interrupt BRINT0, SINT4 80 50 7 McBSP #0 receive interrupt (default) BXINT0, SINT5 84 54 8 McBSP #0 transmit interrupt (default) BRINT2, SINT7, DMAC0
88
58
9
McBSP #2 receive interrupt (default)
BXINT2, SINT6, DMAC1
92
5C
10
McBSP #2 transmit interrupt (default) INT3, SINT8 96 60 11 External user interrupt #3 HINT, SINT9 100 64 12 HPI interrupt BRINT1, SINT10, DMAC2 104 68 13 McBSP #1 receive interrupt (default) BXINT1, SINT11, DMAC3 108 6C 14 McBSP #1 transmit interrupt (default) DMAC4,SINT12 112 70 15 DMA channel 4 interrupt (default) DMAC5,SINT13 116 74 16 DMA channel 5 interrupt (default) Reserved 120–127 78–7F Reserved
ADVANCE INFORMATION
TMS320UC5409
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
35
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
interrupts (continued)
The bits of the interrupt flag register (IFR) and interrupt mask register (IMR) are arranged as shown in Figure 1 1. The function of each bit is described in Table 17.
15–14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
RES
DMAC5 DMAC4
BXINT1 DMAC3
BRINT1 DMAC2
HINT INT3
BXINT2 DMAC1
BRINT2 DMAC0
BXINT0 BRINT0 TINT INT2 INT1 INT0
Figure 11. IFR and IMR Registers
Table 17. IFR and IMR Register Bit Fields
BIT
NUMBER NAME
FUNCTION
15–14 Reserved for future expansion
13 DMAC5 DMA channel 5 interrupt flag/mask bit 12 DMAC4
DMA channel 4 interrupt flag/mask bit
11 BXINT1/DMAC3
McBSP1 transmit interrupt flag/mask bit
10 BRINT1/DMAC2
McBSP1 receive interrupt flag/mask bit
9 HINT
Host to ’54x interrupt flag/mask
8 INT3
External interrupt 3 flag/mask
7 BXINT2/DMAC1
McBSP2 transmit interrupt flag/mask bit
6 BRINT2/DMAC0
McBSP2 receive interrupt flag/mask bit
5 BXINT0
McBSP0 transmit interrupt flag/mask bit
4 BRINT0
McBSP0 receive interrupt flag/mask bit
3 TINT
Timer interrupt flag/mask bit
2 INT2
External interrupt 2 flag/mask bit
1 INT1
External interrupt 1 flag/mask bit
0 INT0
External interrupt 0 flag/mask bit
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TMS320UC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
36
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
documentation support
Extensive documentation supports all TMS320 family generations of devices from product announcement through applications development. The following types of documentation are available to support the design and use of the ’C5000 family of DSPs:
D
TMS320C5000 DSP Family Functional Overview
(literature number SPRU307)
D
Device-specific data sheets (such as this document)
D
Complete User Guides
D
Development-support tools
D
Hardware and software application reports
The four-volume
TMS320C54x DSP Reference Set
(literature number SPRU210) consists of:
D
Volume 1: CPU and Peripherals
(literature number SPRU131)
D
Volume 2: Mnemonic Instruction Set
(literature number SPRU172)
D
Volume 3: Algebraic Instruction Set
(literature number SPRU179)
D
Volume 4: Applications Guide
(literature number SPRU173)
The reference set describes in detail the TMS320C54x products currently available, and the hardware and software applications, including algorithms, for fixed-point TMS320 devices.
For general background information on DSPs and Texas Instruments (TIt) devices, see the three-volume publication
Digital Signal Processing Applications with the TMS320 Family
(literature numbers SPRA012,
SPRA016, and SPRA017). A series of DSP textbooks is published by Prentice-Hall and John Wiley & Sons to support digital signal
processing research and education. The TMS320 newsletter,
Details on Signal Processing
, is published
quarterly and distributed to update TMS320 customers on product information. Information regarding TI DSP products is also available on the Worldwide Web at
http://www.ti.com
uniform
resource locator (URL).
ADVANCE INFORMATION
TI is a trademark of Texas Instruments Incorporated.
TMS320UC5409
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
37
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
absolute maximum ratings over specified temperature range (unless otherwise noted)
Supply voltage I/O range, DVDD‡ –0.3 V to 4.0 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply voltage core range, CV
DD
–0.3 V to 2.0 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, V
I
–0.3 V to 4.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, V
O
–0.3 V to 4.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating case temperature range, T
C
–40°C to 100°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
–55°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to VSS.
recommended operating conditions
MIN NOM MAX UNIT
DV
DD
Device supply voltage, I/O 1.71 3.6 V
CV
DD
Device supply voltage, core 1.71 1.8 1.98 V
V
SS
Supply voltage, GND 0 V
V
IH
High-level input voltage, I/O
RS, INTn, NMI, X2/CLKIN, BIO, BCLKR0, BCLKR1, BCLKX0, BCLKX1, HCS
, HDS1,
HDS2
, TCK, CLKMDn, DVDD = 3.3"0.3 V
2.2 DVDD + 0.3 V
All other inputs 2.0 DVDD + 0.3
V
IL
Low-level input voltage
RS, INTn, NMI, X2/CLKIN, BIO, BCLKR0, BCLKR1, BCLKX0, BCLKX1, HCS
, HDS1,
HDS2
, TCK, CLKMDn, DVDD = 3.3"0.3 V
–0.3 0.6
V
All other inputs –0.3 0.8
I
OH
High-level output current –300 µA
I
OL
Low-level output current 1.5 mA
T
C
Operating case temperature –40 100 °C
ADVANCE INFORMATION
TMS320UC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
38
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
electrical characteristics over recommended operating case temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
V
OH
High-level output voltage
IOH = MAX 2.4 V
V
OL
Low-level output voltage IOL = MAX 0.4 V
I
IZ
Input current for outputs in high
D[15:0], HD[7:0]
Bus holders enabled, DVDD = MAX, VI = VSS to DV
DD
–175 175
µA
IZ
impedance
All other inputs
DVDD = MAX, VO = VSS to DV
DD
–5 5
µ
X2/CLKIN –40 40 TRST With internal pulldown –5 300
Input current
HPIENA
With internal pulldown
(VI = V
SS
–5 300
I
I
TMS, TCK, TDI, HPI
}
With internal pullups, HPIENA = 0
to DVDD)
–300 5
µA
p
p
All other input-only pins
5
5
I
DDC
Supply current, core CPU CVDD = 1.8 V, f
clock
= 40 MHz,w TC = 25°C 45 mA
I
DDP
Supply current, pins DVDD = 3.3 V, f
clock
= 40 MHz,w TC = 25°C 30 mA
Supply current,
IDLE2 PLL × 1 mode, 40 MHz input 5 mA
I
DD
y
standby
IDLE3
Divide-by-two mode, CLKIN stopped 5 µA
C
i
Input capacitance 5 pF
C
o
Output capacitance 5 pF
All values are typical unless otherwise specified.
HPI input signals except for HPIENA.
§
Clock mode: PLL × 1 with external source
PARAMETER MEASUREMENT INFORMATION
Tester Pin
Electronics
V
Load
I
OL
C
T
I
OH
Output Under Test
50
Where: I
OL
= 1.5 mA (all outputs)
I
OH
= 300 µA (all outputs)
V
Load
= 1.5 V
C
T
= 40 pF typical load circuit capacitance
Figure 12. 3.3-V Test Load Circuit
ADVANCE INFORMATION
TMS320UC5409
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
39
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
internal oscillator with external crystal
The internal oscillator is enabled by connecting a crystal across X1 and X2/CLKIN. The frequency of CLKOUT is a multiple of the oscillator frequency . The multiply ratio is determined by the bit settings in the CLKMD register. The crystal should be in fundamental-mode operation, and parallel resonant, with an effective series resistance of 30 Ω and power dissipation of 1 mW. The circuit shown in Figure 13 represents fundamental-mode operation.
recommended operating conditions of internal oscillator with external crystal (see Figure 13)
MIN NOM MAX UNIT
f
clock
Input clock frequency 10 20 MHz
C1, C2 10 pF
X1 X2/CLKIN
C1 C2
Crystal
Figure 13. Internal Oscillator With External Crystal
ADVANCE INFORMATION
TMS320UC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
40
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
divide-by-two clock option
The frequency of the external reference clock provided at the X2/CLKIN pin can be divided by a factor of two to generate the internal machine cycle. The selection of the clock mode is described in the clock generator section.
The external frequency injected must conform to specifications listed in the timing requirements table.
switching characteristics over recommended operating conditions [H = 0.5t
c(CO)
]† (see Figure 13,
Figure 14, and the recommended operating conditions table)
PARAMETER MIN TYP MAX UNIT
t
c(CO)
Cycle time, CLKOUT 10‡2t
c(CI)
ns
t
d(CIH-CO)
Delay time, X2/CLKIN high to CLKOUT high/low 3 6 10 ns
t
f(CO)
Fall time, CLKOUT 2 ns
t
r(CO)
Rise time, CLKOUT 2 ns
t
w(COL)
Pulse duration, CLKOUT low H–2 H–1 H ns
t
w(COH)
Pulse duration, CLKOUT high H–2 H–1 H ns
This device utilizes a fully static design and therefore can operate with t
c(CI)
approaching . The device is characterized at frequencies
approaching 0 Hz.
It is recommended that the PLL clocking option be used for maximum frequency operation.
timing requirements (see Figure 14)
MIN MAX UNIT
t
c(CI)
Cycle time, X2/CLKIN 5
ns
t
f(CI)
Fall time, X2/CLKIN 1 ns
t
r(CI)
Rise time, X2/CLKIN 1 ns
This device utilizes a fully static design and therefore can operate with t
c(CI)
approaching . The device is characterized at frequencies
approaching 0 Hz.
t
r(CO)
t
f(CO)
CLKOUT
X2/CLKIN
t
w(COL)
t
d(CIH-CO)
t
f(CI)
t
r(CI)
t
c(CO)
t
c(CI)
t
w(COH)
Figure 14. External Divide-by-Two Clock Timing
ADVANCE INFORMATION
TMS320UC5409
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
41
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
multiply-by-N clock option
The frequency of the external reference clock provided at the X2/CLKIN pin can be multiplied by a factor of N to generate the internal machine cycle. The selection of the clock mode and the value of N is described in the clock generator section.
The external frequency injected must conform to specifications listed in the timing requirements table.
switching characteristics over recommended operating conditions [H = 0.5t
c(CO)
]
(see Figure 13 and Figure 15)
PARAMETER MIN TYP MAX UNIT
t
c(CO)
Cycle time, CLKOUT 10 t
c(CI)/N
ns
t
d(CI-CO)
Delay time, X2/CLKIN high/low to CLKOUT high/low 4 10 16 ns
t
f(CO)
Fall time, CLKOUT 2 ns
t
r(CO)
Rise time, CLKOUT 2 ns
t
w(COL)
Pulse duration, CLKOUT low H–2 H–1 H ns
t
w(COH)
Pulse duration, CLKOUT high H–2 H–1 H ns
t
p
Transitory phase, PLL lock up time
m
s
N = Multiplication factor
timing requirements (see Figure 15)
MIN MAX UNIT
Integer PLL multiplier N (N = 1–15) 10N 200N
t
c(CI)
Cycle time, X2/CLKIN
PLL multiplier N = x.5
10N 200N
ns
()
PLL multiplier N = x.25, x.75 10N 100N
t
f(CI)
Fall time, X2/CLKIN 8 ns
t
r(CI)
Rise time, X2/CLKIN 8 ns
N = Multiplication factor
t
c(CO)
t
c(CI)
t
w(COH)
t
f(CO)
t
r(CO)
t
f(CI)
X2/CLKIN
CLKOUT
t
d(CI-CO)
t
w(COL)
t
r(CI)
tp
Unstable
Figure 15. External Multiply-by-One Clock Timing
ADVANCE INFORMATION
TMS320UC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
42
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
memory and parallel I/O interface timing
switching characteristics over recommended operating conditions for a
memory read
(MSTRB
= 0)
(see Figure 16)
PARAMETER MIN MAX UNIT
t
d(CLKL-A)
Delay time, CLKOUT low to address valid
0 3 ns
t
d(CLKH-A)
Delay time, CLKOUT high (transition) to address valid
§
0 3 ns
t
d(CLKL-MSL)
Delay time, CLKOUT l ow to MSTRB low 0 3 ns
t
d(CLKL-MSH)
Delay time, CLKOUT low to MSTRB high 0 3 ns
t
h(CLKL-A)R
Hold time, address valid after CLKOUT low
0 3 ns
t
h(CLKH-A)R
Hold time, address valid after CLKOUT high
§
0 3 ns
Address, PS
, and DS timings are all included in timings referenced as address.
In the case of a memory read preceded by a memory read
§
In the case of a memory read preceded by a memory write
timing requirements for a
memory read (MSTRB = 0)
[H = 0.5 t
c(CO)
]
(see Figure 16)
MIN MAX UNIT
t
a(A)M
Access time, read data access from address valid 2H–10 ns
t
a(MSTRBL)
Access time, read data access from MSTRB low 2H–10 ns
t
su(D)R
Setup time, read data before CLKOUT low 4 ns
t
h(D)R
Hold time, read data after CLKOUT low 0 ns
t
h(A-D)R
Hold time, read data after address invalid 0 ns
t
h(D)MSTRBH
Hold time, read data after MSTRB high 0 ns
Address, PS
, and DS timings are all included in timings referenced as address.
ADVANCE INFORMATION
TMS320UC5409
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
43
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
memory and parallel I/O interface timing (continued)
PS, DS
R/W
MSTRB
D[15:0]
A[19:0]
CLKOUT
t
h(D)R
t
h(CLKL-A)R
t
d(CLKL-MSH)
t
d(CLKL-A)
t
d(CLKL-MSL)
t
su(D)R
t
a(A)M
t
a(MSTRBL)
t
h(A-D)R
t
h(D)MSTRBH
Figure 16. Memory Read (MSTRB = 0)
ADVANCE INFORMATION
TMS320UC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
44
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
memory and parallel I/O interface timing (continued)
switching characteristics over recommended operating conditions for a
memory write
(MSTRB
= 0)
[H = 0.5 t
c(CO)
]† (see Figure 17)
PARAMETER MIN MAX UNIT
t
d(CLKH-A)
Delay time, CLKOUT high to address valid
0 3 ns
t
d(CLKL-A)
Delay time, CLKOUT l ow to addres s valid
§
0 3 ns
t
d(CLKL-MSL)
Delay time, CLKOUT l ow to MSTRB low 0 3 ns
t
d(CLKL-D)W
Delay time, CLKOUT l ow to data valid 0 5 ns
t
d(CLKL-MSH)
Delay time, CLKOUT l ow to MSTRB high – 2 3 ns
t
d(CLKH-RWL)
Delay time, CLKOUT high to R/W low – 2 3 ns
t
d(CLKH-RWH)
Delay time, CLKOUT high to R/W high – 2 3 ns
t
d(RWL-MSTRBL)
Delay time, R/W low to MSTRB low H – 2 H + 2 ns
t
h(A)W
Hold time, address valid after CLKOUT high
0 3 ns
t
h(D)MSH
Hold time, write data valid after MSTRB high H–3 H+3
§
ns
t
w(SL)MS
Pulse duration, MSTRB low 2H–4 ns
t
su(A)W
Setup time, address valid before MSTRB low 2H–4 ns
t
su(D)MSH
Setup time, write data valid before MSTRB high 2H–5 2H+5
§
ns
t
en(D–RWL)
Enable time, data bus driven after R/W low H–5 ns
t
dis(RWH–D)
Disable time, R/W high to data bus high impedance 0 ns
Address, PS, and DS timings are all included in timings referenced as address.
In the case of a memory write preceded by a memory write
§
In the case of a memory write preceded by an I/O cycle
ADVANCE INFORMATION
TMS320UC5409
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
45
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
memory and parallel I/O interface timing (continued)
PS, DS
R/W
MSTRB
D[15:0]
A[19:0]
CLKOUT
t
d(CLKH-RWH)
t
h(A)W
t
d(CLKL-MSH)
t
su(D)MSH
t
d(CLKL-D)W
t
w(SL)MS
t
su(A)W
t
d(CLKL-MSL)
t
h(D)MSH
t
d(CLKL-A)
t
d(CLKH-RWL)
t
d(RWL-MSTRBL)
t
d(CLKH-A)
t
en(D-RWL)
t
dis(RWH-D)
Figure 17. Memory Write (MSTRB = 0)
ADVANCE INFORMATION
TMS320UC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
46
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
memory and parallel I/O interface timing (continued)
switching characteristics over recommended operating conditions for a
parallel I/O port read
(IOSTRB
= 0)
(see Figure 18)
PARAMETER MIN MAX UNIT
t
d(CLKL-A)
Delay time, CLKOUT low to address valid 0 3 ns
t
d(CLKH-ISTRBL)
Delay time, CLKOUT h igh to IOSTR B low 0 3 ns
t
d(CLKH-ISTRBH)
Delay time, CLKOUT h igh to IOSTR B high 0 3 ns
t
h(A)IOR
Hold time, address after CLKOUT low 0 3 ns
Address and IS timings are included in timings referenced as address.
timing requirements for a
parallel I/O port read (IOSTRB = 0)
[H = 0.5 t
c(CO)
]† (see Figure 18)
MIN MAX UNIT
t
a(A)IO
Access time, read data access from address valid 3H–10 ns
t
a(ISTRBL)IO
Access time, read data access from IOSTRB low 2H–10 ns
t
su(D)IOR
Setup time, read data before CLKOUT high 4 ns
t
h(D)IOR
Hold time, read data after CLKOUT high 0 ns
t
h(ISTRBH-D)R
Hold time, read data after IOSTRB high 0 ns
Address and IS timings are included in timings referenced as address.
IS
R/W
IOSTRB
D[15:0]
A[19:0]
CLKOUT
t
h(A)IOR
t
d(CLKH-ISTRBH)
t
h(D)IOR
t
su(D)IOR
t
a(A)IO
t
d(CLKH-ISTRBL)
t
d(CLKL-A)
t
a(ISTRBL)IO
t
h(ISTRBH-D)R
Figure 18. Parallel I/O Port Read (IOSTRB = 0)
ADVANCE INFORMATION
TMS320UC5409
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
47
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
memory and parallel I/O interface timing (continued)
switching characteristics over recommended operating conditions for a
parallel I/O port write
(IOSTRB
= 0)
[H = 0.5 t
c(CO)
]† (see Figure 19)
PARAMETER MIN MAX UNIT
t
d(CLKL-A)
Delay time, CLKOUT low to address valid 0 3 ns
t
d(CLKH-ISTRBL)
Delay time, CLKOUT h igh to IOSTR B low 0 3 ns
t
d(CLKH-D)IOW
Delay time, CLKOUT h i gh to write data valid H–5 H+3 ns
t
d(CLKH-ISTRBH)
Delay time, CLKOUT h igh to IOSTR B high 0 3 ns
t
d(CLKL-RWL)
Delay time, CLKOUT low to R/W low 0 3 ns
t
d(CLKL-RWH)
Delay time, CLKOUT low to R/W high 0 3 ns
t
h(A)IOW
Hold time, address valid after CLKOUT low 0 3 ns
t
h(D)IOW
Hold time, write data after IOSTRB high H–3 H+3 ns
t
su(D)IOSTRBH
Setup time, write data before IOSTRB high H–3 H+1 ns
t
su(A)IOSTRBL
Setup time, address valid before IOSTRB low H–3 H+3 ns
Address and IS timings are included in timings referenced as address.
IS
R/W
IOSTRB
D[15:0]
A[19:0]
CLKOUT
t
d(CLKH-ISTRBH)
t
h(A)IOW
t
h(D)IOW
t
d(CLKH-D)IOW
t
d(CLKH-ISTRBL)
t
d(CLKL-A)
t
d(CLKL-RWL)
t
d(CLKL-RWH)
t
su(A)IOSTRBL
t
su(D)IOSTRBH
Figure 19. Parallel I/O Port Write (IOSTRB = 0)
ADVANCE INFORMATION
TMS320UC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
48
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
ready timing for externally generated wait states
timing requirements for externally generated wait states [H = 0.5 t
c(CO)
]† (see Figure 20, Figure 21,
Figure 22, and Figure 23)
MIN MAX UNIT
t
su(RDY)
Setup time, READY before CLKOUT low 5 ns
t
h(RDY)
Hold time, READY after CLKOUT low 0 ns
t
v(RDY)MSTRB
Valid time, READY after MSTRB low
4H–8 ns
t
h(RDY)MSTRB
Hold time, READY after MSTRB low
4H ns
t
v(RDY)IOSTRB
Valid time, READY after IOSTRB low
5H–8 ns
t
h(RDY)IOSTRB
Hold time, READY after IOSTRB low
5H ns
t
v(MSCL)
Valid time, MSC low after CLKOUT low 0 3 ns
t
v(MSCH)
Valid time, MSC high after CLKOUT low 0 3 ns
The hardware wait states can be used only in conjunction with the software wait states to extend the bus cycles. To generate wait states using READY, at least two software wait states must be programmed.
These timings are included for reference only. The critical timings for READY are those referenced to CLKOUT.
MSC
MSTRB
READY
A[19:0]
CLKOUT
t
v(MSCH)
t
v(MSCL)
t
h(RDY)
t
h(RDY)MSTRB
t
v(RDY)MSTRB
Wait State
Generated by READY
Wait States
Generated Internally
t
su(RDY)
Figure 20. Memory Read With Externally Generated Wait States
ADVANCE INFORMATION
TMS320UC5409
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
49
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
ready timing for externally generated wait states (continued)
MSC
MSTRB
READY
D[15:0]
A[19:0]
CLKOUT
t
v(MSCH)
t
h(RDY)
Wait State Generated by READY
Wait States
Generated Internally
t
h(RDY)MSTRB
t
v(RDY)MSTRB
t
v(MSCL)
t
su(RDY)
Figure 21. Memory Write With Externally Generated Wait States
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TMS320UC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
50
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
ready timing for externally generated wait states (continued)
t
su(RDY)
MSC
IOSTRB
READY
A[19:0]
CLKOUT
t
v(MSCH)
t
h(RDY)
Wait State Generated by READY
Wait
States
Generated
Internally
t
v(RDY)IOSTRB
t
v(MSCL)
t
h(RDY)IOSTRB
Figure 22. I/O Read With Externally Generated Wait States
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TMS320UC5409
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
51
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
ready timing for externally generated wait states (continued)
IOSTRB
MSC
READY
D[15:0]
A[19:0]
CLKOUT
t
h(RDY)
Wait State Generated by READY
Wait States
Generated
Internally
t
v(RDY)IOSTRB
t
su(RDY)
t
v(MSCH)
t
v(MSCL)
t
h(RDY)IOSTRB
Figure 23. I/O Write With Externally Generated Wait States
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TMS320UC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
52
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
HOLD and HOLDA timings
switching characteristics over recommended operating conditions for memory control signals and HOLDA
, [H = 0.5 t
c(CO)
] (see Figure 24)
PARAMETER MIN MAX UNIT
t
dis(CLKL-A)
Disable time, address, PS, DS, IS high impedance from CLKOUT low 5 ns
t
dis(CLKL-RW)
Disable time, R/W high impedance from CLKOUT low 5 ns
t
dis(CLKL-S)
Disable time, MSTRB, IOSTRB high impedance from CLKOUT low 5 ns
t
en(CLKL-A)
Enable time, address, PS, DS, IS from CLKOUT low 2H+5 ns
t
en(CLKL-RW)
Enable time, R/W enabled from CLKOUT low 2H+5 ns
t
en(CLKL-S)
Enable time, MSTRB, IOSTRB enabled from CLKOUT low 2 2H+5 ns Valid time, HOLDA low after CLKOUT low
0 5 ns
t
v(HOLDA)
Valid time, HOLDA high after CLKOUT low
– 2 3 ns
t
w(HOLDA)
Pulse duration, HOLDA low duration 2H–3 ns
timing requirements for memory control signals and HOLDA, [H = 0.5 t
c(CO)
] (see Figure 24)
MIN MAX UNIT
t
w(HOLD)
Pulse duration, HOLD low 4H+10 ns
t
su(HOLD)
Setup time, HOLD low/high before CLKOUT low 10 ns
IOSTRB
MSTRB
R/W
D[15:0]
PS
, DS, IS
A[19:0]
HOLDA
HOLD
CLKOUT
t
en(CLKL-S)
t
en(CLKL-S)
t
en(CLKL-RW)
t
dis(CLKL-S)
t
dis(CLKL-S)
t
dis(CLKL-RW)
t
dis(CLKL-A)
t
v(HOLDA)
t
v(HOLDA)
t
w(HOLDA)
t
w(HOLD)
t
su(HOLD)
t
su(HOLD)
t
en(CLKL-A)
Figure 24. HOLD and HOLDA Timings (HM = 1)
ADVANCE INFORMATION
TMS320UC5409
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
53
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
reset, BIO, interrupt, and MP/MC timings timing requirements for reset, BIO, interrupt, and MP/MC [H = 0.5 t
c(CO)
] (see Figure 25, Figure 26,
and Figure 27)
MIN
MAX
UNIT
t
h(RS)
Hold time, RS after CLKOUT low 0 ns
t
h(BIO)
Hold time, BIO after CLKOUT low 0 ns
t
h(INT)
Hold time, INTn, NMI, after CLKOUT low
0 ns
t
h(MPMC)
Hold time, MP/MC after CLKOUT low 0 ns
t
w(RSL)
Pulse duration, RS low
‡§
4H+5 ns
t
w(BIO)S
Pulse duration, BIO low, synchronous 2H+5 ns
t
w(BIO)A
Pulse duration, BIO low, asynchronous 4H ns
t
w(INTH)S
Pulse duration, INTn, NMI high (synchronous) 2H+7 ns
t
w(INTH)A
Pulse duration, INTn, NMI high (asynchronous) 4H ns
t
w(INTL)S
Pulse duration, INTn, NMI low (synchronous) 2H+7 ns
t
w(INTL)A
Pulse duration, INTn, NMI low (asynchronous) 4H ns
t
w(INTL)WKP
Pulse duration, INTn, NMI low for IDLE2/IDLE3 wakeup 8 ns
t
su(RS)
Setup time, RS before X2/CLKIN low
5 ns
t
su(BIO)
Setup time, BIO before CLKOUT low 8 10 ns
t
su(INT)
Setup time, INTn, NMI, RS before CLKOUT low 8 10 ns
t
su(MPMC)
Setup time, MP/MC before CLKOUT low 8 ns
The external interrupts (INT0–INT3, NMI) are synchronized to the core CPU by way of a two-flip-flop synchronizer which samples these inputs with consecutive falling edges of CLKOUT. The input to the interrupt pins is required to represent a 1-0-0 sequence at the timing that is corresponding to three CLKOUT sampling sequences.
If the PLL mode is selected, then at power-on sequence, or at wakeup from IDLE3, RS
must be held low for at least 50 µs to ensure
synchronization and lock-in of the PLL.
§
Note that RS
may cause a change in clock frequency, therefore changing the value of H.
Divide-by-two mode
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TMS320UC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
54
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
reset, BIO, interrupt, and MP/MC timings (continued)
BIO
CLKOUT
RS
, INTn, NMI
X2/CLKIN
t
h(BIO)
t
h(RS)
t
su(INT)
t
w(BIO)S
t
su(BIO)
t
w(RSL)
t
su(RS)
Figure 25. Reset and BIO Timings
INTn, NMI
CLKOUT
t
h(INT)
t
su(INT)
t
su(INT)
t
w(INTL)A
t
w(INTH)A
Figure 26. Interrupt Timing
MP/MC
RS
CLKOUT
t
su(MPMC)
t
h(MPMC)
Figure 27. MP/MC Timing
ADVANCE INFORMATION
TMS320UC5409
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
55
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
instruction acquisition (IAQ), interrupt acknowledge (IACK), external flag (XF), and TOUT timings
switching characteristics over recommended operating conditions for IAQ and IACK [H = 0.5 t
c(CO)
] (see Figure 28)
PARAMETER MIN MAX UNIT
t
d(CLKL-IAQL)
Delay time, CLKOUT low to IAQ low 0 3 ns
t
d(CLKL-IAQH)
Delay time, CLKOUT low to IAQ high 0 3 ns
t
d(A)IAQ
Delay time, address valid to IAQ low 4 ns
t
d(CLKL-IACKL)
Delay time, CLKOUT low to IACK low 0 3 ns
t
d(CLKL-IACKH)
Delay time , CLKOUT low to IACK high 0 3 ns
t
d(A)IACK
Delay time, address valid to IACK low 3 ns
t
h(A)IAQ
Hold time, IAQ high after address invalid 0 ns
t
h(A)IACK
Hold time, IACK high after address invalid 0 ns
t
w(IAQL)
Pulse duration, IAQ low 2H–5 ns
t
w(IACKL)
Pulse duration, IACK low 2H–5 ns
MSTRB
IACK
IAQ
A[19:0]
CLKOUT
t
d(A)IACK
t
d(A)IAQ
t
w(IACKL)
t
h(A)IACK
t
d(CLKL-IACKL)
t
w(IAQL)
t
h(A)IAQ
t
d(CLKL-IAQL)
t
d(CLKL-IACKH)
t
d(CLKL-IAQH)
Figure 28. IAQ and IACK Timings
ADVANCE INFORMATION
TMS320UC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
56
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
instruction acquisition (IAQ), interrupt acknowledge (IACK), external flag (XF), and TOUT timings (continued)
switching characteristics over recommended operating conditions for XF and TOUT [H = 0.5 t
c(CO)
] (see Figure 29 and Figure 30)
PARAMETER MIN MAX UNIT
Delay time, CLKOUT low to XF high 0 3
t
d(XF)
Delay time, CLKOUT low to XF low 0 3
ns
t
d(TOUTH)
Delay time, CLKOUT low to TOUT high 0 3 ns
t
d(TOUTL)
Delay time, CLKOUT low to TOUT low 0 3 ns
t
w(TOUT)
Pulse duration, TOUT 2H–10 ns
XF
CLKOUT
t
d(XF)
Figure 29. XF Timing
TOUT
CLKOUT
t
w(TOUT)
t
d(TOUTL)
t
d(TOUTH)
Figure 30. TOUT Timing
ADVANCE INFORMATION
TMS320UC5409
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
57
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
multichannel buffered serial port timing
timing requirements for McBSP [H=0.5t
c(CO)
]†(see Figure 31 and Figure 32)
MIN MAX UNIT
t
c(BCKRX)
Cycle time, BCLKR/X BCLKR/X ext 4H ns
t
w(BCKRX)
Pulse duration, BCLKR/X high or BCLKR/X low BCLKR/X ext 2H–1 ns
p
BCLKR int 8
t
su(BFRH-BCKRL)
Setup time, external BFSR high before BCLKR lo
w
BCLKR ext
1
ns
BCLKR int 0
t
h(BCKRL-BFRH)
Hold time, external BFSR high after BCLKR lo
w
BCLKR ext
3
ns
p
BCLKR int 5
t
su(BDRV-BCKRL)
Setup time, BDR valid before BCLKR lo
w
BCLKR ext
0
ns
BCLKR int 0
t
h(BCKRL-BDRV)
Hold time, BDR valid after BCLKR lo
w
BCLKR ext
4
ns
p
BCLKX int 7
t
su(BFXH-BCKXL)
Setup time, external BFSX high before BCLKX lo
w
BCLKX ext
0
ns
BCLKX int 0
t
h(BCKXL-BFXH)
Hold time, external BFSX high after BCLKX lo
w
BCLKX ext
3
ns
t
r(BCKRX)
Rise time, BCKR/X BCLKR/X ext 8 ns
t
f(BCKRX)
Fall time, BCKR/X BCLKR/X ext 8 ns
CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, then the timing references of that signal are also inverted.
switching characteristics for McBSP [H=0.5t
c(CO)
]† (see Figure 31 and Figure 32)
PARAMETER MIN MAX UNIT
t
c(BCKRX)
Cycle time, BCLKR/X BCLKR/X int 4H ns
t
w(BCKRXH)
Pulse duration, BCLKR/X high BCLKR/X int D – 2‡D + 2
ns
t
w(BCKRXL)
Pulse duration, BCLKR/X low BCLKR/X int C – 2‡C + 2
ns
BCLKR int –2 2 ns
t
d(BCKRH-BFRV)
Delay time, BCLKR high to internal BFSR valid
BCLKR ext 3 9 ns BCLKX int 0 4
t
d(BCKXH-BFXV)
Delay time, BCLKX high to internal BFSX valid
BCLKX ext 8 11
ns
Disable time, BCLKX high to BDX high impedance following last data
BCLKX int –1 4
t
dis(BCKXH-BDXHZ)
,g g g
bit of transfer
BCLKX ext
3 9
ns
BCLKX int 0
§
7
t
d(BCKXH-BDXV)
Delay time, BCLKX high to BDX valid
BCLKX ext 3 11
ns
Delay time, BFSX high to BDX valid
BFSX int –1
§
3
t
d(BFXH-BDXV)
y, g
ONLY applies when in data delay 0 (XDATDLY = 00b) mode
BFSX ext 3 13
ns
CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, then the timing references of that signal are also inverted.
T = BCLKRX period = (1 + CLKGDV) * 2H C = BCLKRX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * 2H when CLKGDV is even D = BCLKRX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * 2H when CLKGDV is even
§
Minimum delay times also represent minimum output hold times.
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TMS320UC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
58
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
multichannel buffered serial port timing (continued)
(n–2)Bit (n–1)
(n–3)(n–2)Bit (n–1)
(n–4)(n–3)(n–2)Bit (n–1)
t
h(BCKRL–BDRV)
t
su(BDRV–BCKRL)
t
h(BCKRL–BDRV)
t
su(BDRV–BCKRL)
t
su(BDRV–BCKRL)
t
h(BCKRL–BDRV)
t
h(BCKRL–BFRH)
tsu(BFRH–BCKRL)
t
d(BCKRH–BFRV)
t
d(BCKRH–BFRV)
t
r(BCKRX)
t
r(BCKRX)
t
w(BCKRXL)
t
c(BCKRX)
t
w(BCKRXH)
(RDATDLY=10b)
BDR
(RDATDLY=01b)
BDR
(RDATDLY=00b)
BDR
BFSR (ext)
BFSR (int)
BCLKR
Figure 31. McBSP Receive Timings
t
e(BCKXH–BDX)
t
d(BCKXH–BDXV)
t
d(BCKXH–BDXV)
t
e(BCKXH–BDX)
t
dis(BCKXH–BDXHZ)
t
d(BCKXH–BDXV)
t
d(BDFXH–BDXV)
t
e(BDFXH–BDX)
(XDATDLY=10b)
BDX
(XDATDLY=01b)
BDX
(XDATDLY=00b)
BDX
(n–2)Bit (n–1)Bit 0
(n–4)Bit (n–1) (n–3)(n–2)
Bit 0
(n–3)(n–2)Bit (n–1)
Bit 0
t
h(BCKXL–BFXH)
t
f(BCKRX)
t
r(BCKRX)
t
w(BCKRXL)
t
c(BCKRX)
t
w(BCKRXH)
BFSX (ext)
BFSX (int)
BCLKX
t
d(BCKXH–BFXV)
t
d(BCKXH–BFXV)
t
su(BFXH–BCKXL)
Figure 32. McBSP Transmit Timings
ADVANCE INFORMATION
TMS320UC5409
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
59
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
multichannel buffered serial port timing (continued)
timing requirements for McBSP general-purpose I/O (see Figure 33)
MIN MAX UNIT
t
su(BGPIO-COH)
Setup time, BGPIOx input mode before CLKOUT high
9 ns
t
h(COH-BGPIO)
Hold time, BGPIOx input mode after CLKOUT high
0 ns
BGPIOx refers to BCLKRx, BFSRx, BDRx, BCLKXx, or BFSXx when configured as a general-purpose input.
switching characteristics for McBSP general-purpose I/O (see Figure 33)
PARAMETER MIN MAX UNIT
t
d(COH-BGPIO)
Delay time, CLKOUT high to BGPIOx output mode
0 5 ns
BGPIOx refers to BCLKRx, BFSRx, BCLKXx, BFSXx, or BDXx when configured as a general-purpose output.
t
su(BGPIO-COH)
t
h(COH-BGPIO)
t
d(COH-BGPIO)
CLKOUT
BGPIOx Input
Mode
BGPIOx Output
Mode
BGPIOx refers to BCLKRx, BFSRx, BDRx, BCLKXx, or BFSXx when configured as a general-purpose input.
BGPIOx refers to BCLKRx, BFSRx, BCLKXx, BFSXx, or BDXx when configured as a general-purpose output.
Figure 33. McBSP General-Purpose I/O Timings
ADVANCE INFORMATION
TMS320UC5409 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
60
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
multichannel buffered serial port timing (continued)
timing requirements for McBSP as SPI master or slave: [H=0.5t
c(CO)
] CLKSTP = 10b, CLKXP = 0
(see Figure 34)
MASTER SLAVE
MIN MAX MIN MAX
UNIT
t
su(BDRV-BCKXL)
Setup time, BDR valid before BCLKX low 9 – 12H ns
t
h(BCKXL-BDRV)
Hold time, BDR valid after BCLKX low 0 5 + 12H ns
t
su(BFXL-BCKXL)
Setup time, BFSX low before BCLKX low 10 ns
t
c(BCKX)
Cycle time, BCLKX 32H ns
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
switching characteristics for McBSP as SPI master or slave: [H=0.5t
c(CO)
] CLKSTP = 10b,
CLKXP = 0
(see Figure 34)
MASTER
SLAVE
PARAMETER
MIN MAX MIN MAX
UNIT
t
h(BCKXL-BFXL)
Hold time, BFSX low after BCLKX low
§
T – 3 T + 4 ns
t
d(BFXL-BCKXH)
Delay time, BFSX low to BCLKX high
C – 5 C + 3 ns
t
d(BCKXH-BDXV)
Delay time, BCLKX high to BDX valid –2 4 6H +54 10H + 15 ns
t
dis(BCKXL-BDXHZ)
Disable time, BDX high impedance following last data bit from BCLKX low
C – 2 C + 3 ns
t
dis(BFXH-BDXHZ)
Disable time, BDX high impedance following last data bit from BFSX high
2H+ 4 6H + 17 ns
t
d(BFXL-BDXV)
Delay time, BFSX low to BDX valid 4H + 2 8H + 17 ns
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
T = BCLKX period = (1 + CLKGDV) * 2H C = BCLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * 2H when CLKGDV is even
§
FSRP = FSXP = 1. As a SPI master, BFSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on BFSX and BFSR is inverted before being used internally. CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
BFSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (BCLKX).
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
BCLKX
BFSX
BDX
BDR
t
su(BDRV-BCLXL)
t
d(BCKXH-BDXV)
t
h(BCKXL-BDRV)
t
dis(BFXH-BDXHZ)
t
dis(BCKXL-BDXHZ)
t
h(BCKXL-BFXL)
t
d(BFXL-BDXV)
t
d(BFXL-BCKXH)
LSB
MSB
Figure 34. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0
ADVANCE INFORMATION
TMS320UC5409
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS101A – APRIL 1999 – REVISED AUGUST 1999
61
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
multichannel buffered serial port timing (continued)
timing requirements for McBSP as SPI master or slave: [H=0.5t
c(CO)
] CLKSTP = 11b, CLKXP = 0
(see Figure 35)
MASTER SLAVE
MIN MAX MIN MAX
UNIT
t
su(BDRV-BCKXL)
Setup time, BDR valid before BCLKX low 12 2 – 12H ns
t
h(BCKXH-BDRV)
Hold time, BDR valid after BCLKX high 4 5 + 12H ns
t
su(BFXL-BCKXH)
Setup time, BFSX low before BCLKX high 10 ns
t
c(BCKX)
Cycle time, BCLKX 32H ns
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
switching characteristics for McBSP as SPI master or slave: [H=0.5t
c(CO)
] CLKSTP = 11b,
CLKXP = 0
(see Figure 35)
MASTER
SLAVE
PARAMETER
MIN MAX MIN MAX
UNIT
t
h(BCKXL-BFXL)
Hold time, BFSX low after BCLKX low
§
C – 3 C +43 ns
t
d(BFXL-BCKXH)
Delay time, BFSX low to BCLKX high
T – 5 T + 3 ns
t
d(BCKXL-BDXV)
Delay time, BCLKX low to BDX valid –2 6 6H + 5 10H + 15 ns
t
dis(BCKXL-BDXHZ)
Disable time, BDX high impedance following last data bit from BCLKX low
–2 4 6H + 3 10H + 17 ns
t
d(BFXL-BDXV)
Delay time, BFSX low to BDX valid D – 2 D + 4 4H – 2 8H + 17 ns
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
T = BCLKX period = (1 + CLKGDV) * 2H C = BCLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * 2H when CLKGDV is even D = BCLKX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * 2H when CLKGDV is even
§
FSRP = FSXP = 1. As a SPI master, BFSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on BFSX and BFSR is inverted before being used internally. CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
BFSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (BCLKX).
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
BCLKX
BFSX
BDX
BDR
t
d(BFXL-BCKXH)
t
dis(BCKXL-BDXHZ)
t
d(BCKXL-BDXV)
t
h(BCKXH-BDRV)
t
su(BDRV-BCKXL)
t
d(BFXL-BDXV)
t
h(BCKXL-BFXL)
LSB
MSB
Figure 35. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0
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multichannel buffered serial port timing (continued)
timing requirements for McBSP as SPI master or slave: [H=0.5t
c(CO)
] CLKSTP = 10b, CLKXP = 1
(see Figure 36)
MASTER SLAVE
MIN MAX MIN MAX
UNIT
t
su(BDRV-BCKXH)
Setup time, BDR valid before BCLKX high 12 2 – 12H ns
t
h(BCKXH-BDRV)
Hold time, BDR valid after BCLKX high 4 5 + 12H ns
t
su(BFXL-BCKXL)
Setup time, BFSX low before BCLKX low 10 ns
t
c(BCKX)
Cycle time, BCLKX 32H ns
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
switching characteristics for McBSP as SPI master or slave: [H=0.5t
c(CO)
] CLKSTP = 10b,
CLKXP = 1
(see Figure 36)
MASTER
SLAVE
PARAMETER
MIN MAX MIN MAX
UNIT
t
h(BCKXH-BFXL)
Hold time, BFSX low after BCLKX high
§
T – 3 T + 4 ns
t
d(BFXL-BCKXL)
Delay time, BFSX low to BCLKX low
D – 5 D + 3 ns
t
d(BCKXL-BDXV)
Delay time, BCLKX low to BDX valid –2 6 6H + 5 10H + 15 ns
t
dis(BCKXH-BDXHZ)
Disable time, BDX high impedance following last data bit from BCLKX high
D – 2 D + 3 ns
t
dis(BFXH-BDXHZ)
Disable time, BDX high impedance following last data bit from BFSX high
2H + 3 6H + 17 ns
t
d(BFXL-BDXV)
Delay time, BFSX low to BDX valid 4H – 2 8H + 17 ns
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
T = BCLKX period = (1 + CLKGDV) * 2H D = BCLKX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * 2H when CLKGDV is even
§
FSRP = FSXP = 1. As a SPI master, BFSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on BFSX and BFSR is inverted before being used internally. CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
BFSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (BCLKX).
t
h(BCKXH-BDRV)
t
dis(BFXH-BDXHZ)
t
dis(BCKXH-BDXHZ)
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
BCLKX
BFSX
BDX
BDR
t
d(BFXL-BCKXL)
t
d(BFXL-BDXV)
t
d(BCKXL-BDXV)
t
su(BDRV-BCKXH)
t
h(BCKXH-BFXL)
LSB
MSB
Figure 36. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1
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multichannel buffered serial port timing (continued)
timing requirements for McBSP as SPI master or slave: [H=0.5t
c(CO)
] CLKSTP = 11b, CLKXP = 1
(see Figure 37)
MASTER SLAVE
MIN MAX MIN MAX
UNIT
t
su(BDRV-BCKXL)
Setup time, BDR valid before BCLKX low 9 – 12H ns
t
h(BCKXL-BDRV)
Hold time, BDR valid after BCLKX low 0 5 + 12H ns
t
su(BFXL-BCKXL)
Setup time, BFSX low before BCLKX low 10 ns
t
c(BCKX)
Cycle time, BCLKX 32H ns
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
switching characteristics for McBSP as SPI master or slave: [H=0.5t
c(CO)
] CLKSTP = 11b,
CLKXP = 1
(see Figure 37)
MASTER
SLAVE
PARAMETER
MIN MAX MIN MAX
UNIT
t
h(BCKXH-BFXL)
Hold time, BFSX low after BCLKX high
§
D – 3 D + 4 ns
t
d(BFXL-BCKXL)
Delay time, BFSX low to BCLKX low
T – 5 T + 3 ns
t
d(BCKXH-BDXV)
Delay time, BCLKX high to BDX valid –2 6 6H + 5 10H + 15 ns
t
dis(BCKXH-BDXHZ)
Disable time, BDX high impedance following last data bit from BCLKX high
–2 4 6H + 3 10H + 17 ns
t
d(BFXL-BDXV)
Delay time, BFSX low to BDX valid C – 2 C + 4 4H – 2 8H + 17 ns
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
T = BCLKX period = (1 + CLKGDV) * 2H C = BCLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * 2H when CLKGDV is even D = BCLKX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * 2H when CLKGDV is even
§
FSRP = FSXP = 1. As a SPI master, BFSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on BFSX and BFSR is inverted before being used internally. CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
BFSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (BCLKX).
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
BCLKX
BFSX
BDX
BDR
t
d(BFXL-BCKXL)
t
su(BDRV-BCKXL)
t
dis(BCKXH-BDXHZ)
t
h(BCKXH-BFXL)
t
d(BCKXH-BDXV)
t
h(BCKXL-BDRV)
t
d(BFXL-BDXV)
LSB
MSB
Figure 37. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1
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HPI8 timing
switching characteristics over recommended operating conditions†‡§¶ [H = 0.5t
c(CO)
]
(see Figure 38, Figure 39, Figure 40, and Figure 41)
PARAMETER MIN MAX UNIT
t
en(DSL-HD)
Enable time, HD driven from DS low 2 17 ns
Case 1a: Memory accesses when DMAC is active in 16-bit mode and t
w(DSH)
< 18H
18H+18 – t
w(DSH)
Case 1b: Memory accesses when DMAC is active in 16-bit mode and t
w(DSH)
18H
18
Delay time, DS low to HDx valid for
Case 1c: Memory access when DMAC is active in 32-bit mode and t
w(DSH)
< 26H
26H+18 – t
w(DSH)
t
d(DSL-HDV1)
y
first byte of an HPI read
Case 1d: Memory access when DMAC is active in 32-bit mode and t
w(DSH)
26H
18
ns
Case 2a: Memory accesses when DMAC is inactive and t
w(DSH)
< 10H
10H+18 – t
w(DSH)
Case 2b: Memory accesses when DMAC is inactive and t
w(DSH)
10H
18
Case 3: Register accesses 18
t
d(DSL-HDV2)
Delay time, DS low to HDx valid for second byte of an HPI read 18 ns
t
h(DSH-HDV)R
Hold time, HDx valid after DS high, for a HPI read 3 5 ns
t
v(HYH-HDV)
Valid time, HDx valid after HRDY high 5
t
d(DSH-HYL)
Delay time, DS high to HRDY low (see Note 1) 10 ns
Case 1a: Memory accesses when DMAC is active in 16-bit mode
18H+10 ns
Case 1b: Memory accesses when DMAC is active in 32-bit mode
26H+10
ns
t
d(DSH-HYH)
Del
ay time, DS high to
HRDY high
Case 2: Memory accesses when DMAC is inactive
10H+10
Case 3: Write accesses to HPIC register (see Note 2)
6H+10
ns
t
d(HCS-HRDY)
Delay time, HCS low/high to HRDY low/high
8 ns
t
d(COH-HYH
) Delay time, CLKOUT high to HRDY high 8 ns
t
d(COH-HTX)
Delay time, CLKOUT high to HINT change 10 ns
t
d(COH-GPIO)
Delay time, CLKOUT high to HDx output change. HDx is configured as a general-purpose output.
6 ns
NOTES: 1. The HRDY output is always high when the HCS input is high, regardless of DS timings.
2. This timing applies when writing a one to the DSPINT bit or HINT bit of the HPIC register. All other writes to the HPIC occur asynchronoulsy, and do not cause HRDY to be deasserted.
DS refers to the logical OR of HCS
, HDS1, and HDS2.
HDx refers to any of the HPI data bus pins (HD0, HD1, HD2, etc.).
§
DMAC stands for direct memory access (DMA) controller. The HPI8 shares the internal DMA bus with the DMAC, thus HPI8 access times are affected by DMAC activity.
GPIO refers to the HD pins when they are configured as general-purpose input/outputs.
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HPI8 timing (continued)
timing requirements†‡§ (see Figure 38, Figure 39, Figure 40, and Figure 41)
MIN MAX UNIT
t
su(HBV-DSL)
Setup time, HBIL valid before DS low 10 ns
t
h(DSL-HBV)
Hold time, HBIL valid after DS low 5 ns
t
su(HSL-DSL)
Setup time, HAS low before DS low 5 ns
t
w(DSL)
Pulse duration, DS low 20 ns
t
w(DSH)
Pulse duration, DS high 10 ns
t
su(HDV-DSH)
Setup time, HDx valid before DS high, HPI write 5 ns
t
h(DSH-HDV)W
Hold time, HDx valid after DS high, HPI write 3 ns
t
su(GPIO-COH)
Setup time, HDx input valid before CLKOUT high, HDx configured as general-purpose input 3 ns
t
h(GPIO-COH)
Hold time, HDx input valid after CLKOUT high, HDx configured as general-purpose input 0 ns
DS refers to the logical OR of HCS, HDS1, and HDS2.
HDx refers to any of the HPI data bus pins (HD0, HD1, HD2, etc.).
§
GPIO refers to the HD pins when they are configured as general-purpose input/outputs.
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HPI8 timing (continued)
Valid
t
su(HSL-DSL)
Valid
t
su(HBV-DSL)
t
su(HBV-DSL)
HAS
HBIL
t
h(DSL-HBV)
t
h(DSL-HBV)
t
d(DSH-HYH)
t
w(DSL)
t
d(DSL-HDV1)
t
v(HYH-HDV)
Valid Valid
Valid
t
d(COH-HYH)
Valid
t
w(DSH)
t
d(DSH-HYL)
t
h(DSH-HDV)R
t
h(DSH-HDV)W
Valid
t
su(HDV-DSH)
t
d(DSL-HDV2)
t
en(DSL-HD)
HCS
HDS
HRDY
HD READ
Valid
HD WRITE
CLKOUT
Second Byte First Byte Second Byte
HAD
HAD refers to HCNTL0, HCNTL1, and HR/W.
When HAS
is not used (HAS always high)
Figure 38. Using HDS to Control Accesses (HCS Always Low)
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HPI8 timing (continued)
Second Byte
First Byte
Second Byte
t
d(HCS-HRDY)
HCS
HDS
HRDY
Figure 39. Using HCS to Control Accesses
HINT
CLKOUT
t
d(COH-HTX)
Figure 40. HINT Timing
GPIOx Input Mode
CLKOUT
t
h(GPIO-COH)
GPIOx Output Mode
t
su(GPIO-COH)
t
d(COH-GPIO)
GPIOx refers to HD0, HD1, HD2, ...HD7, when the HD bus is configured for general-purpose input/output (I/O).
Figure 41. GPIOx† Timings
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HPI16 timing
switching characteristics over recommended operating conditions
†‡§
[H = 0.5t
c(CO)
]
(see Figure 42 and Figure 43)
PARAMETER MIN MAX UNIT
t
en(DSL-HD)
Enable time, Dx driven from DS low 7 17 ns
Case 1a: Memory accesses when DMAC is active in 16-bit mode and t
w(DSH)
< 18H
18H+22 – t
w(DSH)
Delay time, DS low to Dx valid for an
Case 1b: Memory accesses when DMAC is active in 16-bit mode and t
w(DSH)
18H
22
t
d(DSL-HDV1)
HPI read
Case 2a: Memory accesses when DMAC is inactive and t
w(DSH)
< 10H
10H+22 – t
w(DSH)
ns
Case 2b: Memory accesses when DMAC is inactive and t
w(DSH)
10H
22
Case 3: Register accesses 22
t
h(DSH-HDV)R
Hold time, Dx valid after DS rising edge, read
§
1 8 ns
t
su(HDV-HYH)
Setup time, Dx valid before HRDY rising edge
ns
t
d(DSH-HYL)
Delay time, DS or HCS high to HRDY low
10 ns
Delay time, DS high to HRDY high
§
Case 1: Memory access when DMAC is active in 16-bit mode
18H+10
t
d(DSH-HYH)
y, g g
(writes and autoincrement reads)
Case 2: Memory access when DMAC is inactive
10H+10
ns
t
d(DSL-HYL)
Delay time, HDS or HCS low/high to HRDY low/high 8 ns
t
d(COH–HTH)
Delay time, CLKOUT high to HRDY high 8 ns
t
d(COH–GPIO)
Delay time, CLKOUT rising edge to HDx output change. HDx is configured as a general-purpose output.
6 ns
NOTE: The HRDY output is always high when the HCS input is high, regardless of DS timings. †
DS refers to the logical OR of HCS
, HDS1, or HDS2.
Dx refers to any of the DPI data bus pins (D0, D1, D2, etc.).
§
DMAC stands for direct memory access (DMA) controller. The HPI16 shares the internal DMA bus with the DMAC, thus HPI16 access times are affected by DMAC activity.
GPIO refers to the HD pins when they are configured as general-purpose input/outputs.
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HPI16 timing (continued)
timing requirements
†‡§
[H = 0.5t
c(CO)
] (see Note 1, Figure 42, and Figure 43)
MIN UNIT
t
su(HBV-DSL)
Setup time, HAD valid before DS falling edge
†‡
10 ns
t
h(DSL-HBV)
Hold time, HAD valid after DS falling edge
†‡
5 ns
t
su(HAV-DSL)
Setup time, HAD valid before DS falling edge
ns
t
h(DSH-HAV)
Hold time, address valid after DS rising edge
ns
t
su(HDV-DSH)
Setup time, Dx valid before DS high (HPI write) ns
t
h(DSH-HDV)W
Hold time, Dx valid aftere DS high (HPI write) 3 ns
t
w(DSL)
Pulse duration, DS low
20 ns
t
w(DSH)
Pulse duration, DS high
10 ns
t
su(GPIO-COH)
Setup time, Dx input valid before CLKOUT high, HDx configured as general-purpose input 2 ns
t
h(GPIO-COH)
Hold time, Dx input valid after CLKOUT high, HDx configured as general-purpose input 0 ns Cycle time, DS rising edge to next DS rising
edge
Nonmultiplexed mode (no increment) with no DMA activity.
ns
t
c(DSH-DSH)
(Minimum timings represent WRITEs while maximum timings represent READs)
Nonmultiplexed mode (no increment) with 16-bit DMA activity.
ns
DS refers to the logical OR of HCS and HDS1 and HDS2.
.Dx refers to any of the HPI data bus pins (D0, D1, D2, etc.).
§
GPIO refers tothe HD pins when they are configured as general-purpose input/outputs.
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HPI16 timing (continued)
t
d(DSL–HYH
)
t
su(HDV–HYH)
t
h(DSH–HDV)R
t
d(DSL–HDV1)
t
d(DSL–HD)
t
h(DSH–HAV)
t
su(HAV–DSL)
t
h(DSL–HBV)
t
w(DSL)
t
su(HBV–DSL)
t
w(DSH)
t
c(DSH–DSH)
HRDY
HA[15:0]
HR/W
HDS
HCS
Data ValidData Valid
Valid AddressValid Address
(A[15:0])
D[15:0]
Figure 42. Nonmultiplexed Read Timings
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HPI16 timing (continued)
HRDY
D[15:0]
HA[15:0]
HR/W
HDS
HCS
t
d(DSH–HYL)
t
d(DSH–HYH)
Data ValidData Valid
t
h(DSH–HDV)W
t
su(HDV–DSH)
Valid AddressValid Address
t
h(DSH–HAV)
t
h(DSL–HBV)
t
w(DSL)
t
su(HBV–DSL)
t
w(DSH)
t
su(HAV–DSL)
(A[15:0])
t
c(DSH–DSH)
Figure 43. Nonmultiplexed Write Timings
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MECHANICAL DATA
PGE (S-PQFP-G144) PLASTIC QUAD FLATPACK
4040147/C 10/96
0,27
72
0,17
37
73
0,13 NOM
0,25
0,75 0,45
0,05 MIN
36
Seating Plane
Gage Plane
108
109
144
SQ
SQ
22,20 21,80
1
19,80
17,50 TYP
20,20
1,35
1,45
1,60 MAX
M
0,08
0°–7°
0,08
0,50
NOTES: B. All linear dimensions are in millimeters.
C. This drawing is subject to change without notice. D. Falls within JEDEC MO-136
Thermal Resistance Characteristics
PARAMETER
°C/W
R
ΘJA
56
R
ΘJC
5
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MECHANICAL DATA
GGU (S-PBGA-N144) PLASTIC BALL GRID ARRAY PACKAGE
0,80
0,10
M
0,08
0,80
9,60 TYP
12 1310 118967
N
M
K
L
J
H
42 3
F
E
C B
D
A
1
G
5
Seating Plane
4073221/A 11/96
SQ
11,90
12,10
0,95
0,35
0,45
0,45
0,55
0,85
0,08
0,12
1,40 MAX
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. MicroStar BGA configuration
Thermal Resistance Characteristics
PARAMETER
°C/W
R
ΘJA
38
R
ΘJC
5
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MicroStar BGA is a trademark of Texas Instruments Incorporated.
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