Texas Instruments TMS320UC5402PGE-80, TMS320UC5402GGU-80 Datasheet

TMS320UC5402
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
1
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D Advanced Multibus Architecture With Three
Separate 16-Bit Data Memory Buses and One Program Memory Bus
D 40-Bit Arithmetic Logic Unit (ALU),
Including a 40-Bit Barrel Shifter and Two Independent 40-Bit Accumulators
D 17- × 17-Bit Parallel Multiplier Coupled to a
40-Bit Dedicated Adder for Non-Pipelined Single-Cycle Multiply/Accumulate (MAC) Operation
D Compare, Select, and Store Unit (CSSU) for
the Add/Compare Selection of the Viterbi Operator
D Exponent Encoder to Compute an
Exponent Value of a 40-Bit Accumulator Value in a Single Cycle
D T wo Address Generators With Eight
Auxiliary Registers and Two Auxiliary Register Arithmetic Units (ARAUs)
D Data Bus With a Bus-Holder Feature D Extended Addressing Mode for 1M × 16-Bit
Maximum Addressable External Program Space
D 4K x 16-Bit On-Chip ROM D 16K x 16-Bit Dual-Access On-Chip RAM D Single-Instruction-Repeat and
Block-Repeat Operations for Program Code
D Block-Memory-Move Instructions for
Efficient Program and Data Management
D Instructions With a 32-Bit Long Word
Operand
D Instructions With Two- or Three-Operand
Reads
D Arithmetic Instructions With Parallel Store
and Parallel Load
D Conditional Store Instructions D Fast Return From Interrupt D On-Chip Peripherals
– Software-Programmable Wait-State
Generator and Programmable Bank Switching
– On-Chip Phase-Locked Loop (PLL) Clock
Generator With Internal Oscillator or External Clock Source
– Two Multichannel Buffered Serial Ports
(McBSPs)
– Enhanced 8-Bit Parallel Host-Port
Interface (HPI-8) – Two 16-Bit Timers – Six-Channel Direct Memory Access
(DMA) Controller
D Power Consumption Control With IDLE1,
IDLE2, and IDLE3 Instructions With Power-Down Modes
D CLKOUT Off Control to Disable CLKOUT D On-Chip Scan-Based Emulation Logic,
IEEE Std 1149.1† (JTAG) Boundary Scan Logic
D 12.5-ns Single-Cycle Fixed-Point
Instruction Execution Time (80 MIPS)
D 1.8-V Core Power Supply D 1.8-V to 3.6-V I/O Power Supply Enables
Operation With a Single 1.8-V Supply or with Dual Supplies
D Available in a 144-Pin Plastic Thin Quad
Flatpack (TQFP) (PGE Suffix) and a 144-Pin Ball Grid Array (BGA) (GGU Suffix)
description
The TMS320UC5402 fixed-point, digital signal processor (DSP) (hereafter referred to as the ’UC5402 unless otherwise specified) is ideal for low-power, high-performance applications. This processor of fers very low power consumption and the flexibility to support various system voltage configurations. The wide range of I/O voltage enables it to operate with a single 1.8-V power supply or with dual power supplies for mixed voltage systems. This feature eliminates the need for external level-shifting and reduces power consumption in emerging sub-3V systems.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 1999, Texas Instruments Incorporated
IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice.
TMS320UC5402 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
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description (continued)
T exas Instrument DSPs do not require specific power sequencing between the core supply and the I/O supply. However, systems should be designed to ensure that neither supply is powered up for extended periods of time if the other supply is below the proper operating voltage. Excessive exposure to these conditions can adversely affect the long term reliability of the device.
System-level concerns such as bus contention may require supply sequencing to be implemented. In this case, the core supply should be powered up at the same time as, or prior to, the I/O buffers and powered down after the I/O buffers.
The ’UC5402 is based on an advanced modified Harvard architecture that has one program memory bus and three data memory buses. This processor provides an arithmetic logic unit (ALU) with a high degree of parallelism, application-specific hardware logic, on-chip memory , and additional on-chip peripherals. The basis of the operational flexibility and speed of this DSP is a highly specialized instruction set.
NOTE: For detailed information on the architecture of the ’C5000 family of DSPs, see the
TMS320C5000 DSP Family
Functional Overview
(literature number SPRU307).
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TMS320UC5402
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
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CV
HDS1
A18 A17 V
SS
A16 D5 D4 D3 D2 D1 D0 RS X2/CLKIN X1 HD3 CLKOUT V
SS
HPIENA CV
DD
NC TMS TCK TRST TDI TDO EMU1/OFF EMU0 TOUT0 HD2 NC CLKMD3 CLKMD2 CLKMD1 V
SS
DV
DD
NC NC
NC NC
V
SS
DV
DD
A10
HD7
A11 A12 A13 A14 A15
NC HAS V
SS
NC
CV
DD
HCS
HR/W
READY
PS
DS
IS
R/W
MSTRB
IOSTRB
MSC
XF
HOLDA
IAQ
HOLD
BIO
MP/MC
DV
DD V
SS
NC
NC
144
NC
CV
143
142
141A8140A7139A6138A5137A4136
HD6
135A3134A2133A1132A0131DV130
129
128
127
126
125
HD5
124
D15
123
D14
122
D13
121
HD4
120
D12
119
D11
118
117D9116D8115D7114D6113
112
373839404142434445464748495051525354555657585960616263646566676869
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
108 107 106 105 104 103 102 101 100
99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73
NC
NC
HCNTL0SSBCLKR0
BCLKR1
BFSR0
BFSR1
BDR0
HCNTL1
BDR1
BCLKX0
BCLKX1
SS
DD
SS
HD0
BDX0
BDX1
IACK
HBIL
NMI
INT0
INT1
INT2
INT3
DD
HD1
SS
HRDY
HINT/TOUT1
111
V
110
A19
109
707172
NC
NC
D10
NC
DV
DD
CV
HDS2SSV
V
V
DV
V
CV
V
DD
DD
DD
DD
SS
PGE PACKAGE
†‡
(TOP VIEW)
BFSX0
A9
BFSX1
NC
NC
NC = No connection. These pins should be left unconnected.
DVDD is the power supply for the I/O pins while CVDD is the power supply for the core CPU. VSS is the ground for both the I/O pins and the core CPU.
The TMS320UC5402PGE (144-pin TQFP) package is footprint-compatible with the ’LC548 and ’LC/VC549.
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TMS320UC5402 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
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GGU PACKAGE
(BOTTOM VIEW)
A B
D
C
E F
H J
L M
K
N
G
12
3456781012 1113 9
The pin assignments table to follow lists each signal name and BGA ball number for the TMS320UC5402GGU (144-pin BGA) package which is footprint compatible with the ’LC548 and ’LC/VC549.
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TMS320UC5402
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
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Pin Assignments for the TMS320UC5402GGU (144-Pin BGA) Package
SIGNAL
NAME
BGA BALL #
SIGNAL
NAME
BGA BALL #
SIGNAL
NAME
BGA BALL #
SIGNAL
NAME
BGA BALL #
NC A1 NC N13 NC N1 A19 A13 NC B1 NC M13 NC N2 NC A12
V
SS
C2 DV
DD
L12 HCNTL0 M3 V
SS
B11
DV
DD
C1 V
SS
L13 V
SS
N3 DV
DD
A11 A10 D4 CLKMD1 K10 BCLKR0 K4 D6 D10 HD7 D3 CLKMD2 K11 BCLKR1 L4 D7 C10 A11 D2 CLKMD3 K12 BFSR0 M4 D8 B10 A12 D1 NC K13 BFSR1 N4 D9 A10 A13 E4 HD2 J10 BDR0 K5 D10 D9 A14 E3 TOUT0 J11 HCNTL1 L5 D11 C9 A15 E2 EMU0 J12 BDR1 M5 D12 B9
NC E1 EMU1/OFF J13 BCLKX0 N5 HD4 A9 HAS F4 TDO H10 BCLKX1 K6 D13 D8 V
SS
F3 TDI H11 V
SS
L6 D14 C8
NC F2 TRST H12 HINT/TOUT1 M6 D15 B8
CV
DD
F1 TCK H13 CV
DD
N6 HD5 A8
HCS G2 TMS G12 BFSX0 M7 CV
DD
B7
HR/W G1 NC G13 BFSX1 N7 NC A7
READY G3 CV
DD
G11 HRDY L7 HDS1 C7
PS G4 HPIENA G10 DV
DD
K7 V
SS
D7
DS H1 V
SS
F13 V
SS
N8 HDS2 A6
IS H2 CLKOUT F12 HD0 M8 DV
DD
B6
R/W H3 HD3 F11 BDX0 L8 A0 C6
MSTRB H4 X1 F10 BDX1 K8 A1 D6
IOSTRB J1 X2/CLKIN
E13 IACK N9 A2 A5
MSC J2 RS E12 HBIL M9 A3 B5
XF J3 D0 E11 NMI L9 HD6 C5
HOLDA J4 D1 E10 INT0 K9 A4 D5
IAQ K1 D2 D13 INT1 N10 A5 A4
HOLD K2 D3 D12 INT2 M10 A6 B4
BIO K3 D4 D11 INT3 L10 A7 C4
MP/MC L1 D5 C13 CV
DD
N11 A8 A3
DV
DD
L2 A16 C12 HD1 M11 A9 B3
V
SS
L3 V
SS
C11 V
SS
L11 CV
DD
C3 NC M1 A17 B13 NC N12 NC A2 NC M2 A18 B12 NC M12 NC B2
DVDD is the power supply for the I/O pins while CVDD is the power supply for the core CPU. VSS is the ground for both the I/O pins and the core CPU.
If an external clock source is used, the CLKIN signal level should not exceed 1.98 V .
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TMS320UC5402 FIXED-POINT DIGITAL SIGNAL PROCESSOR
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terminal functions
The following table lists each signal, function, and operating mode(s) grouped by function.
Terminal Functions
TERMINAL
TERMINAL
NAME
TYPE
DESCRIPTION
DATA SIGNALS
A19 (MSB) A18 A17 A16 A15 A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 (LSB)
O/Z Parallel address bus A19 [most significant bit (MSB)] through A0 [least significant bit (LSB)]. The lower sixteen
address pins (A0 to A15) are multiplexed to address all external memory (program, data) or I/O, while the upper four address pins (A16 to A19) are only used to address external program space. These pins are placed in the high-impedance state when the hold mode is enabled, or when EMU1/OFF
is low.
D15 (MSB) D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 (LSB)
I/O/Z Parallel data bus D15 (MSB) through D0 (LSB). The sixteen data pins (D0 to D15) are multiplexed to transfer
data between the core CPU and external data/program memory or I/O devices. The data bus is placed in the high-impedance state when not outputting or when RS
or HOLD is asserted. The data bus also goes into the
high-impedance state when EMU1/OFF
is low.
The data bus has bus holders to reduce the static power dissipation caused by floating, unused pins. These bus holders also eliminate the need for external bias resistors on unused pins. When the data bus is not being driven by the ’UC5402, the bus holders keep the pins at the previous logic level. The data bus holders on the ’UC5402 are disabled at reset and can be enabled/disabled via the BH bit of the bank-switching control register (BSCR).
INITIALIZATION, INTERRUPT, AND RESET OPERATIONS
IACK
O/Z
Interrupt acknowledge signal. IACK Indicates receipt of an interrupt and that the program counter is fetching the interrupt vector location designated by A15–A0. IACK
also goes into the high-impedance state when EMU1/OFF
is low.
INT0 INT1 INT2 INT3
I
External user interrupts. INT0–INT3 are prioritized and are maskable by the interrupt mask register (IMR) and the interrupt mode bit. INT0
–INT3 can be polled and reset by way of the interrupt flag register (IFR).
NMI
I
Nonmaskable interrupt. NMI is an external interrupt that cannot be masked by way of the INTM or the IMR. When NMI
is activated, the processor traps to the appropriate vector location.
RS
I
Reset. RS causes the digital signal processor (DSP) to terminate execution and causes a reinitialization of the CPU and peripherals. When RS
is brought to a high level, execution begins at location 0FF80h of program
memory. RS
affects various registers and status bits.
I = input, O = output, Z = high impedance, S = supply
If an external clock source is used, the CLKIN signal level should not exceed 1.98 V .
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TMS320UC5402
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
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Terminal Functions (Continued)
TERMINAL
NAME
DESCRIPTIONTYPE
TERMINAL
NAME
DESCRIPTIONTYPE
INITIALIZATION, INTERRUPT, AND RESET OPERATIONS (CONTINUED)
MP/MC I
Microprocessor/microcomputer mode select. If active low at reset, microcomputer mode is selected, and the internal program ROM is mapped into the upper 4K words of program memory space. If the pin is driven high during reset, microprocessor mode is selected, and the on-chip ROM is removed from program space. This pin is only sampled at reset, and the MP/MC
bit of the processor mode status (PMST) register can override the mode
that is selected at reset.
MULTIPROCESSING SIGNALS
BIO I
Branch control. A branch can be conditionally executed when BIO is active. If low, the processor executes the conditional instruction. For the XC instruction, the BIO
condition is sampled during the decode phase of the
pipeline; all other instructions sample BIO
during the read phase of the pipeline.
XF O/Z
External flag output (latched software-programmable signal). XF is set high by the SSBX XF instruction, set low by the RSBX XF instruction or by loading ST1. XF is used for signaling other processors in multiprocessor configurations or used as a general-purpose output pin. XF goes into the high-impedance state when EMU1/OFF
is low, and is set high at reset.
MEMORY CONTROL SIGNALS
DS PS IS
O/Z
Data, program, and I/O space select signals. DS, PS, and IS are always high unless driven low for accessing a particular external memory space. Active period corresponds to valid address information. DS
, PS, and IS are placed into the high-impedance state in the hold mode; the signals also go into the high-impedance state when EMU1/OFF
is low.
MSTRB O/Z
Memory strobe signal. MSTRB is always high unless low-level asserted to indicate an external bus access to data or program memory. MSTRB
is placed in the high-impedance state in the hold mode; it also goes into the
high-impedance state when EMU1/OFF
is low.
READY I
Data ready. READY indicates that an external device is prepared for a bus transaction to be completed. If the device is not ready (READY is low), the processor waits one cycle and checks READY again. Note that the processor performs ready detection if at least two software wait states are programmed. The READY signal is not sampled until the completion of the software wait states.
R/W O/Z
Read/write signal. R/W indicates transfer direction during communication to an external device. R/W is normally in the read mode (high), unless it is asserted low when the DSP performs a write operation. R/W
is placed in
the high-impedance state in hold mode; it also goes into the high-impedance state when EMU1/OFF
is low.
IOSTRB O/Z
I/O strobe signal. IOSTRB is always high unless low-level asserted to indicate an external bus access to an I/O device. IOSTRB
is placed in the high-impedance state in the hold mode; it also goes into the high-impedance
state when EMU1/OFF
is low.
HOLD I
Hold. HOLD is asserted to request control of the address, data, and control lines. When acknowledged by the ’C54x, these lines go into the high-impedance state.
HOLDA O/Z
Hold acknowledge. HOLDA indicates that the ’UC5402 is in a hold state and that the address, data, and control lines are in the high-impedance state, allowing the external memory interface to be accessed by other devices. HOLDA
also goes into the high-impedance state when EMU1/OFF is low.
MSC O/Z
Microstate complete. MSC indicates completion of all software wait states. When two or more software wait states are enabled, the MSC
pin goes active at the beginning of the first software wait state and goes inactive
high at the beginning of the last software wait state. If connected to the READY input, MSC
forces one external
wait state after the last internal wait state is completed. MSC
also goes into the high-impedance state when
EMU1/OFF
is low.
IAQ O/Z
Instruction acquisition signal. IAQ is asserted (active low) when there is an instruction address on the address bus. IAQ
goes into the high-impedance state whenOFF EMU1/OFF is low.
PLL/TIMER SIGNALS
CLKOUT O/Z
Master clock output signal. CLKOUT cycles at the machine-cycle rate of the CPU. The internal machine cycle is bounded by the rising edges of this signal. CLKOUT also goes into the high-impedance state when EMU1/OFF is low.
I = input, O = output, Z = high impedance, S = supply
If an external clock source is used, the CLKIN signal level should not exceed 1.98 V .
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Terminal Functions (Continued)
TERMINAL
NAME
DESCRIPTIONTYPE
TERMINAL
NAME
DESCRIPTIONTYPE
PLL/TIMER SIGNALS (CONTINUED)
CLKMD1 CLKMD2 CLKMD3
I
Clock mode-select signals. These inputs select the mode that the clock generator is initialized to after reset. The logic levels of CLKMD1–CLKMD3 are latched when the reset pin is low, and the clock mode register is initialized to the selected mode. After reset, the clock mode can be changed through software, but the clock mode-select signals have no effect until the device is reset again.
X2/CLKIN
I Clock/PLL input. If the internal oscillator is not being used, this X2/CLKIN functions as the clock input.
X1 O
Output pin from the internal oscillator for the crystal. If the internal oscillator is not used, X1 should be left unconnected. X1 does not go into the high-impedance state when EMU1/OFF
is low.
TOUT0 O/Z
Timer0 output. TOUT0 signals a pulse when the on-chip timer 0 counts down past zero. The pulse is a CLKOUT cycle wide. TOUT0 also goes into the high-impedance state when EMU1/OFF
is low.
TOUT1 O/Z
Timer1 output. TOUT1 signals a pulse when the on-chip timer1 counts down past zero. The pulse is one CLKOUT cycle wide. The TOUT1 output is multiplexed with the HINT
pin of the HPI and is only available when
the HPI is disabled. TOUT1 also goes into the high-impedance state when EMU1/OFF
is low.
MULTICHANNEL BUFFERED SERIAL PORT SIGNALS
BCLKR0 BCLKR1
I/O/Z Receive clock input. BCLKR serves as the serial shift clock for the buffered serial port receiver.
BDR0 BDR1
I Serial data receive input
BFSR0 BFSR1
I/O/Z Frame synchronization pulse for receive input. The BFSR pulse initiates the receive data process over BDR.
BCLKX0 BCLKX1
I/O/Z
Transmit clock. BCLKX serves as the serial shift clock for the McBSP transmitter . BCLKX can be configured as an input or an output; it is configured as an input following reset. BCLKX enters the high-impedance state when EMU1/OFF
goes low.
BDX0 BDX1
O/Z
Serial data transmit output. BDX is placed in the high-impedance state when not transmitting, when RS is asserted, or when EMU1/OFF
is low.
BFSX0 BFSX1
I/O/Z
Frame synchronization pulse for transmit input/output. The BFSX pulse initiates the transmit data process. BFSX can be configured as an input or an output; it is configured as an input following reset. BFSX goes into the high-impedance state when EMU1/OFF
is low.
MISCELLANEOUS SIGNAL
NC No connection
HOST-PORT INTERFACE SIGNALS
HD0–HD7 I/O/Z
Parallel bidirectional data bus. The HPI data bus is used by a host device bus to exchange information with the HPI registers. These pins can also be used as general-purpose I/O pins. HD0–HD7 is placed in the high-impedance state when not outputting data or when EMU1/OFF
is low. The HPI data bus includes bus holders to reduce the static power dissipation caused by floating, unused pins. When the HPI data bus is not being driven by the ’UC5402, the bus holders keep the pins at the previous logic level. The HPI data bus holders are disabled at reset and can be enabled/disabled via the HBH bit of the BSCR.
HCNTL0 HCNTL1
I
Control. HCNTL0 and HCNTL1 select a host access to one of the three HPI registers. The control inputs have internal pullup resistors that are only enabled when HPIENA = 0.
HBIL I
Byte identification. HBIL identifies the first or second byte of transfer. The HBIL input has an internal pullup resistor that is only enabled when HPIENA = 0.
HCS I
Chip select. HCS is the select input for the HPI and must be driven low during accesses. The chip-select input has an internal pullup resistor that is only enabled when HPIENA = 0.
HDS1 HDS2
I
Data strobe. HDS1 and HDS2 are driven by the host read and write strobes to control transfers. The strobe inputs have internal pullup resistors that are only enabled when HPIENA = 0.
HAS I
Address strobe. Hosts with multiplexed address and data pins require HAS to latch the address in the HPIA register. HAS
has an internal pullup resistor that is only enabled when HPIENA = 0.
I = input, O = output, Z = high impedance, S = supply
If an external clock source is used, the CLKIN signal level should not exceed 1.98 V .
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TMS320UC5402
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
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Terminal Functions (Continued)
TERMINAL
NAME
DESCRIPTIONTYPE
TERMINAL
NAME
DESCRIPTIONTYPE
HOST-PORT INTERFACE SIGNALS (CONTINUED)
HR/W I
Read/write. HR/W controls the direction of an HPI transfer. HR/W has an internal pullup resistor that is only enabled when HPIENA = 0.
HRDY O/Z
Ready. The ready output informs the host when the HPI is ready for the next transfer. HRDY goes into the high-impedance state when EMU1/OFF
is low.
HINT O/Z
Interrupt. This output is used to interrupt the host. When the DSP is in reset, HINT is driven high. HINT can also be configured as the timer 1 output (TOUT1) when the HPI is disabled. The signal goes into the high-impedance state when EMU1/OFF
is low.
HPIENA I
HPI module select. HPIENA must be driven high during reset to enable the HPI. An internal pulldown resistor is always active and the HPIENA pin is sampled on the rising edge of RS
. If HPIENA is left open or is driven low during reset, the HPI module is disabled. Once the HPI is disabled, the HPIENA pin has no effect until the ’UC5402 is reset.
SUPPLY PNS
CV
DD
S +VDD. Dedicated power supply for the core CPU
DV
DD
S +VDD. Dedicated power supply for the I/O pins
V
SS
S Ground
TEST PINS
TCK I
IEEE standard 1149.1 test clock. TCK is normally a free-running clock signal with a 50% duty cycle. The changes on the test access port (TAP) of input signals TMS and TDI are clocked into the TAP controller, instruction register, or selected test data register on the rising edge of TCK. Changes at the T AP output signal (TDO) occur on the falling edge of TCK.
TDI I
IEEE standard 1149.1 test data input pin with internal pullup device. TDI is clocked into the selected register (instruction or data) on a rising edge of TCK.
TDO O/Z
IEEE standard 1149.1 test data output. The contents of the selected register (instruction or data) are shifted out of TDO on the falling edge of TCK. TDO is in the high-impedance state except when the scanning of data is in progress. TDO also goes into the high-impedance state when EMU1/OFF
is low.
TMS I
IEEE standard 1149.1 test mode select. Pin with internal pullup device. This serial control input is clocked into the TAP controller on the rising edge of TCK.
TRST I
IEEE standard 1149.1 test reset. TRST, when high, gives the IEEE standard 1149.1 scan system control of the operations of the device. If TRST
is not connected or is driven low, the device operates in its functional mode,
and the IEEE standard 1149.1 signals are ignored. Pin with internal pulldown device.
EMU0 I/O/Z
Emulator 0 pin. When TRST is driven low, EMU0 must be high for activation of the OFF condition. When TRST is driven high, EMU0 is used as an interrupt to or from the emulator system and is defined as input/output by way of the IEEE standard 1149.1 scan system.
EMU1/OFF I/O/Z
Emulator 1 pin/disable all outputs. When TRST is driven high, EMU1/OFF is used as an interrupt to or from the emulator system and is defined as input/output by way of the IEEE standard 1149.1 scan system. When TRST is driven low, EMU1/OFF is configured as OFF. The EMU1/OFF signal, when active low, puts all output drivers into the high-impedance state. Note that OFF
is used exclusively for testing and emulation purposes (not for
multiprocessing applications). Therefore, for the OFF
feature, the following apply:
TRST
= low EMU0 = high EMU1/OFF
= low
I = input, O = output, Z = high impedance, S = supply
If an external clock source is used, the CLKIN signal level should not exceed 1.98 V .
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memory
The ’UC5402 device provides both on-chip ROM and RAM memories to aid in system performance and integration.
on-chip ROM with bootloader
The ’UC5402 features a 4K-word × 16-bit on-chip maskable ROM. Customers can arrange to have the ROM of the ’UC5402 programmed with contents unique to any particular application. A security option is available to protect a custom ROM. This security option is described in the
TMS320C54x DSP CPU and Peripherals
Reference Set, Volume 1
(literature number SPRU131). Note that only the ROM security option, and not the
ROM/RAM option, is available on the ’UC5402 . A bootloader is available in the standard ’UC5402 on-chip ROM. This bootloader can be used to automatically
transfer user code from an external source to anywhere in the program memory at power up. If the MP/MC pin is sampled low during a hardware reset, execution begins at location FF80h of the on-chip ROM. This location contains a branch instruction to the start of the bootloader program. The standard ’UC5402 bootloader provides different ways to download the code to accomodate various system requirements:
D Parallel from 8-bit or 16-bit-wide EPROM D Parallel from I/O space 8-bit or 16-bit mode D Serial boot from serial ports 8-bit or 16-bit mode D Host-port interface boot
The standard on-chip ROM layout is shown in Table 1.
Table 1. Standard On-Chip ROM Layout
ADDRESS RANGE DESCRIPTION
F000h – F7FFh Reserved
F800h – FBFFh Bootloader FC00h – FCFFh µ-law expansion table FD00h – FDFFh A-law expansion table FE00h – FEFFh Sine look-up table
FF00h – FF7Fh Reserved
FF80h – FFFFh Interrupt vector table
In the ’UC5402 ROM, 128 words are reserved for factory device-testing purposes. Application code to be implemented in on-chip ROM must reserve these 128 words at addresses FF00h–FF7Fh in program space.
on-chip RAM
The ’UC5402 device contains 16K
× 16-bit of on-chip dual-access RAM (DARAM). The DARAM is composed
of two blocks of 8K words each. Each block in the DARAM can support two reads in one cycle, or a read and a write in one cycle. The DARAM is located in the address range 0080h–3FFFh in data space, and can be mapped into program/data space by setting the OVLY bit to 1.
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memory map
Page 0 Program
Hex
Data
On-Chip DARAM
(OVLY = 1)
External
(OVLY = 0)
MP/MC
= 0
(Microcomputer Mode)
MP/MC= 1
(Microprocessor Mode)
0000
007F 0080
FFFF
Reserved
(OVLY = 1)
External
(OVLY = 0)
Interrupts
(External)
FF80
Memory Mapped
Registers
On-Chip DARAM
(16K x 16-bit)
ROM (DROM=1)
or External
(DROM=0)
0080
FFFF
Hex
0000
FF7F
FF00
FEFF
EFFF
F000
FFFF
3FFF
4000
0060
007F
0000
Hex
Page 0 Program
External
External
Scratch-Pad
RAM
Reserved
(DROM=1)
or External
(DROM=0)
005F
Reserved
(OVLY = 1)
External
(OVLY = 0)
007F 0080
3FFF
4000
On-Chip DARAM
(OVLY = 1)
External
(OVLY = 0)
FF00
FEFF
EFFF
F000
External
On-Chip ROM
(4K x 16-bit)
Interrupts (On-Chip)
3FFF
4000
Reserved
FF7F FF80
Figure 1. Memory Map
relocatable interrupt vector table
The reset, interrupt, and trap vectors are addressed in program space. These vectors are soft — meaning that the processor, when taking the trap, loads the program counter (PC) with the trap address and executes the code at the vector location. Four words are reserved at each vector location to accommodate a delayed branch instruction, either two 1-word instructions or one 2-word instruction, which allows branching to the appropriate interrupt service routine with minimal overhead.
At device reset, the reset, interrupt, and trap vectors are mapped to address FF80h in program space. However, these vectors can be remapped to the beginning of any 128-word page in program space after device reset. This is done by loading the interrupt vector pointer (IPTR) bits in the PMST register with the appropriate 128-word page boundary address. After loading IPTR, any user interrupt or trap vector is mapped to the new 128-word page.
NOTE: The hardware reset (RS
) vector cannot be remapped because a hardware reset loads the IPTR
with 1s. Therefore, the reset vector is always fetched at location FF80h in program space.
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extended program memory
The ’UC5402 uses a paged extended memory scheme in program space to allow access of up to 1024K program memory locations. In order to implement this scheme, the ’UC5402 includes several features that are also present on the ’548/’549 devices:
D Twenty address lines, instead of sixteen D An extra memory-mapped register, the XPC register, defines the page selection. This register is
memory-mapped into data space to address 001Eh. At a hardware reset, the XPC is initialized to 0.
D Six extra instructions for addressing extended program space. These six instructions affect the XPC.
FB[D]
pmad (20 bits) – Far branch
FBACC[D]
Accu[19:0] – Far branch to the location specified by the value in accumulator A or
accumulator B
FCALL[D]
pmad (20 bits) – Far call
FCALA[D]
Accu[19:0] – Far call to the location specified by the value in accumulator A or accumulator B
FRET[D]
– Far return
FRETE[D]
– Far return with interrupts enabled
D In addition to these new instructions, two ’54x instructions are extended to use 20 bits in the ’UC5402:
READA data_memory (using 20-bit accumulator address) – WRITA data_memory (using 20-bit accumulator address)
All other instructions, software interrupts, and hardware interrupts do not modify the XPC register and access only memory within the current page.
Program memory in the ’UC5402 is organized into 16 pages that are each 64K in length, as shown in Figure 2.
0 0000
1 0000
1 3FFF
Page 1
Lower
16K}
External
2 0000
2 3FFF
Page 2
Lower
16K}
External
. . . . . .
F 0000
F 3FFF
Page 15
Lower
16K}
External
0 FFFF
Page 0
64K
Words{
1 4000
1 FFFF
Page 1
Upper
48K
External
2 4000
2 FFFF
Page 2
Upper
48K
External
. . .
. . .
F 4000
F FFFF
Page 15
Upper
48K
External
See Figure 1
The lower 16K words of pages 1 through 15 are available only when the OVLY bit is cleared to 0. If the OVLY bit is set to 1, the on-chip RAM is mapped to the lower 16K words of all program space pages.
Figure 2. Extended Program Memory
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on-chip peripherals
The ’UC5402 device has the following peripherals:
D Software-programmable wait-state generator with programmable bank-switching wait states D An enhanced 8-bit host-port interface (HPI-8) D Two multichannel buf fered serial ports (McBSPs) D Two hardware timers D A clock generator with a phase-locked loop (PLL) D A direct memory access (DMA) controller
software-programmable wait-state generator
The software wait-state generator of the ’UC5402 can extend external bus cycles by up to fourteen machine cycles. Devices that require more than fourteen wait states can be interfaced using the hardware READY line. When all external accesses are configured for zero wait states, the internal clocks to the wait-state generator are automatically disabled. Disabling the wait-state generator clocks reduces the power comsumption of the ’UC5402.
The software wait-state register (SWWSR) controls the operation of the wait-state generator. The 15 LSBs of the SWWSR specify the number of wait states (0 to 7) to be inserted for external memory accesses to five separate address ranges. This allows a different number of wait states for each of the five address ranges. Additionally, the software wait-state multiplier (SWSM) bit of the software wait-state control register (SWCR) defines a multiplication factor of 1 or 2 for the number of wait states. At reset, the wait-state generator is initialized to provide seven wait states on all external memory accesses. The SWWSR bit fields are shown in Figure 3 and described in Table 2.
XPA I/O Data Data Program Program
14 12 11 9 8 6 5 3 2 015
R/W-111R/W-0 R/W-111 R/W-111 R/W-111 R/W-111
LEGEND: R=Read, W=Write, 0=V alue after reset
Figure 3. Software Wait-State Register (SWWSR) [Memory-Mapped Register (MMR) Address 0028h]
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software-programmable wait-state generator (continued)
Table 2. Software Wait-State Register (SWWSR) Bit Fields
BIT
RESET
NO. NAME
RESET
VALUE
FUNCTION
15 XPA 0
Extended program address control bit. XP A is used in conjunction with the program space fields (bits 0 through 5) to select the address range for the program space wait states.
14–12 I/O 1
I/O space. The field value (0–7) corresponds to the base number of wait states for I/O space accesses within addresses 0000–FFFFh. The SWSM bit of the SWCR defines a multiplication factor of 1 or 2 for the base number of wait states.
11–9 Data 1
Upper data space. The field value (0–7) corresponds to the base number of wait states for external data space accesses within addresses 8000–FFFFh. The SWSM bit of the SWCR defines a multiplication factor of 1 or 2 for the base number of wait states.
8–6 Data 1
Lower data space. The field value (0–7) corresponds to the base number of wait states for external data space accesses within addresses 0000–7FFFh. The SWSM bit of the SWCR defines a multiplication factor of 1 or 2 for the base number of wait states.
5–3 Program 1
Upper program space. The field value (0–7) corresponds to the base number of wait states for external program space accesses within the following addresses:
- XPA = 0: x8000 – xFFFFh
- XPA = 1: The upper program space bit field has no effect on wait states.
The SWSM bit of the SWCR defines a multiplication factor of 1 or 2 for the base number of wait states.
2–0 Program 1
Program space. The field value (0–7) corresponds to the base number of wait states for external program space accesses within the following addresses:
- XPA = 0: x0000–x7FFFh
- XPA = 1: 00000–FFFFFh
The SWSM bit of the SWCR defines a multiplication factor of 1 or 2 for the base number of wait states.
The software wait-state multiplier bit of the software wait-state control register (SWCR) is used to extend the base number of wait states selected by the SWWSR. The SWCR bit fields are shown in Figure 4 and described in Table 3.
Reserved
115
R/W-0
SWSM
0
R/W-0
LEGEND: R = Read, W = Write
Figure 4. Software Wait-State Control Register (SWCR) [MMR Address 002Bh]
Table 3. Software Wait-State Control Register (SWCR) Bit Fields
BIT
RESET
NO. NAME
RESET
VALUE
FUNCTION
15–1 Reserved 0
These bits are reserved and are unaffected by writes.
0 SWSM 0
Software wait-state multiplier . Used to multiply the number of wait states defined in the SWWSR by a factor of 1 or 2.
- SWSM = 0: wait-state base values are unchanged (multiplied by 1).
- SWSM = 1: wait-state base values are mulitplied by 2 for a maximum of 14 wait states.
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programmable bank-switching wait states
The programmable bank-switching logic of the ’UC5402 is functionally equivalent to that of the ’548/’549 devices. This feature automatically inserts one cycle when accesses cross memory-bank boundaries within program or data memory space. A bank-switching wait state can also be automatically inserted when accesses cross the data space boundary into program space.
The bank-switching control register (BSCR) defines the bank size for bank-switching wait states. Figure 5 shows the BSCR and its bits are described in Table 4.
BNKCMP PS-DS Reserved HBH
12 11 3 2 115
R/W-0R-0R/W-1R/W-1111
BH
EXIO
010
R/W-0R/W-0
LEGEND: R = Read, W = Write
Figure 5. Bank-Switching Control Register (BSCR) [MMR Address 0029h]
Table 4. Bank-Switching Control Register (BSCR) Bit Fields
BIT
RESET
NO. NAME
RESET
VALUE
FUNCTION
15–12 BNKCMP 1111
Bank compare. Determines the external memory-bank size. BNKCMP is used to mask the four MSBs of an address. For example, if BNKCMP = 1111b, the four MSBs (bits 12–15) are compared, resulting in a bank size of 4K words. Bank sizes of 4K words to 64K words are allowed.
11 PS - DS 1
Program read – data read access. Inserts an extra cycle between consecutive accesses of program read and data read or data read and program read. PS-DS = 0 No extra cycles are inserted by this feature. PS-DS = 1 One extra cycle is inserted between consecutive data and program reads.
10–3 Reserved 0 These bits are reserved and are unaffected by writes.
2 HBH 0
HPI Bus holder. Controls the HPI bus holder feature. HBH is cleared to 0 at reset. HBH = 0 The bus holder is disabled. HBH = 1 The bus holder is enabled. When not driven, the HPI data bus (HD[7:0]) is held in the
previous logic level.
1 BH 0
Bus holder. Controls the data bus holder feature. BH is cleared to 0 at reset. BH = 0 The bus holder is disabled. BH = 1 The bus holder is enabled. When not driven, the data bus (D[15:0]) is held in the
previous logic level.
External bus interface off. The EXIO bit controls the external bus-off function.
0 EXIO 0
EXIO = 0 The external bus interface functions as usual. EXIO = 1 The address bus, data bus, and control signals become inactive after completing the
current bus cycle. Note that the DROM, MP/MC, and OVLY bits in the PMST and the HM bit of ST1 cannot be modified when the interface is disabled.
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parallel I/O ports
The ’UC5402 has a total of 64K I/O ports. These ports can be addressed by the PORTR instruction or the PORTW instruction. The IS
signal indicates a read/write operation through an I/O port. The ’UC5402 can interface easily with external devices through the I/O ports while requiring minimal off-chip address-decoding circuits.
enhanced 8-bit host-port interface (HPI-8)
The ’UC5402 host-port interface, also referred to as the HPI-8, is an enhanced version of the standard 8-bit HPI found on earlier ’54x DSPs (’542, ’545, ’548, and ’549). The HPI-8 is an 8-bit parallel port for interprocessor communication. The features of the HPI-8 include:
Standard features:
D Sequential transfers (with autoincrement) or random-access transfers D Host interrupt and ’54x interrupt capability D Multiple data strobes and control pins for interface flexibility
Enhanced features of the ’UC5402 HPI-8:
D Access to entire on-chip RAM through DMA bus D Capability to continue transferring during emulation stop
FFFF
Reserved
4000
3FFF
Hex
0000
005F
0060
On-Chip DARAM
Scratch-Pad
0080
007F
(16K x 16-bit)
RAM
Reserved
McBSP
Registers
001F
0020
0023 0024
Reserved
Figure 6. ’UC5402 HPI-8 and DMA Memory Map
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enhanced 8-bit host-port interface (HPI-8) (continued)
The HPI-8 functions as a slave and enables the host processor to access the on-chip memory of the ’UC5402. A major enhancement to the ’UC5402 HPI over previous versions is that it allows host access to the entire on-chip memory range of the DSP . The host and the DSP both have access to the on-chip RAM at all times and host accesses are always synchronized to the DSP clock. If the host and the DSP contend for access to the same location, the host has priority , and the DSP waits for one HPI-8 cycle. Note that since host accesses are always synchronized to the ’UC5402 clock, an active input clock (CLKIN) is required for HPI-8 accesses during IDLE states, and host accesses are not allowed while the ’UC5402 reset pin is asserted.
The HPI-8 interface consists of an 8-bit bidirectional data bus and various control signals. Sixteen-bit transfers are accomplished in two parts with the HBIL input designating high or low byte. The host communicates with the HPI-8 through three dedicated registers — HPI address register (HPIA), HPI data register (HPID), and an HPI control register (HPIC). The HPIA and HPID registers are only accessible by the host, and the HPIC register is accessible by both the host and the ’UC5402.
multichannel buffered serial ports
The ’UC5402 device includes two high-speed, full-duplex multichannel buffered serial ports (McBSPs) that allow direct interface to other ’C54x/’LC54x DSPs, codecs, and other devices in a system. The McBSPs are based on the standard serial port interface found on other ’54x devices. Like its predecessors, the McBSP provides:
D Full-duplex communication D Double-buffered data registers, which allow a continuous data stream D Independent framing and clocking for receive and transmit
In addition, the McBSP has the following capabilities:
D Direct interface to:
T1/E1 framers – MVIP switching compatible and ST-BUS compliant devices – IOM-2 compliant devices – Serial peripheral interface devices
D Multichannel transmit and receive of up to 128 channels D A wide selection of data sizes including 8, 12, 16, 20, 24, or 32 bits D µ-law and A-law companding D Programmable polarity for both frame synchronization and data clocks D Programmable internal clock and frame generation
The McBSPs consist of separate transmit and receive channels that operate independently. The external interface of each McBSP consists of the following pins:
D BCLKX Transmit reference clock D BDX Transmit data D BFSX Transmit frame synchronization D BCLKR Receive reference clock D BDR Receive data D BFSR Receive frame synchronization
The six pins listed are functionally equivalent to the pins of previous serial port interface pins in the ’C5000 family of DSPs. On the transmitter, transmit frame synchronization and clocking are indicated by the BFSX and BCLKX pins, respectively. The CPU or DMA can initiate transmission of data by writing to the data transmit register (DXR). Data written to DXR is shifted out on the BDX pin through a transmit shift register (XSR). This structure allows DXR to be loaded with the next word to be sent while the transmission of the current word is in progress.
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multichannel buffered serial ports (continued)
On the receiver, receive frame synchronization and clocking are indicated by the BFSR and BCLKR pins, respectively . The CPU or DMA can read received data from the data receive register (DRR). Data received on the BDR pin is shifted into a receive shift register (RSR) and then buffered in the receive buffer register (RBR). If the DRR is empty, the RBR contents are copied into the DRR. If not, the RBR holds the data until the DRR is available. This structure allows storage of the two previous words while the reception of the current word is in progress.
The CPU and DMA can move data to and from the McBSPs and can synchronize transfers based on McBSP interrupts, event signals, and status flags. The DMA is capable of handling data movement between the McBSPs and memory with no intervention from the CPU.
In addition to the standard serial port functions, the McBSP provides programmable clock and frame synchronization generation. Among the programmable functions are:
D Frame synchronization pulse width D Frame period D Frame synchronization delay D Clock reference (internal vs. external) D Clock division D Clock and frame synchronization polarity
The on-chip companding hardware allows compression and expansion of data in either µ-law or A-law format. When companding is used, transmit data is encoded according to specified companding law and received data is decoded to 2s complement format.
The McBSP allows multiple channels to be independently selected for the transmitter and receiver. When multiple channels are selected, each frame represents a time-division multiplexed (TDM) data stream. In using TDM data streams, the CPU may only need to process a few of them. Thus, to save memory and bus bandwidth, multichannel selection allows independent enabling of particular channels for transmission and reception. Up to 32 channels in a stream of up to 128 channels can be enabled.
The clock-stop mode (CLKSTP) in the McBSP provides compatibility with the serial peripheral interface (SPI) protocol. Clock-stop mode works with only single-phase frames and one word per frame. The word sizes supported by the McBSP are programmable for 8-, 12-, 16-, 20-, 24-, or 32-bit operation. When the McBSP is configured to operate in SPI mode, both the transmitter and the receiver operate together as a master or as a slave.
The McBSP is fully static and operates at arbitrarily low clock frequencies. The maximum frequency is CPU clock frequency divided by 2.
hardware timer
The ’UC5402 device features two 16-bit timing circuits with 4-bit prescalers. The main counter of each timer is decremented by one every CLKOUT cycle. Each time the counter decrements to 0, a timer interrupt is generated. The timers can be stopped, restarted, reset, or disabled by specific control bits.
clock generator
The clock generator provides clocks to the ’UC5402 device, and consists of an internal oscillator and a phase-locked loop (PLL) circuit. The clock generator requires a reference clock input, which can be provided by using a crystal resonator with the internal oscillator, or from an external reference clock source. The reference clock input is then divided by two or four (DIV mode) to generate clocks for the ’UC5402 device, or the PLL circuit can be used (PLL mode) to generate the device clock by multiplying the reference clock frequency by a scale factor. This allows the use of a clock source with a lower frequency than that of the CPU.The PLL is an adaptive circuit that, once synchronized, locks onto and tracks an input clock signal.
NOTE: If an external clock source is used, the CLKIN signal level should not exceed 1.98 V.
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clock generator (continued)
When the PLL is initially started, it enters a transitional mode during which the PLL acquires lock with the input signal. Once the PLL is locked, it continues to track and maintain synchronization with the input signal. Then, other internal clock circuitry allows the synthesis of new clock frequencies for use as master clock for the ’UC5402 device.
This clock generator allows system designers to select the clock source. The sources that drive the clock generator are:
D A crystal resonator circuit. The crystal resonator circuit is connected across the X1 and X2/CLKIN pins of
the ’UC5402 to enable the internal oscillator.
D An external clock. The external clock source is directly connected to the X2/CLKIN pin, and X1 is left
unconnected.
NOTE: If an external clock source is used, the CLKIN signal level should not exceed 1.98 V.
The software-programmable PLL features a high level of flexibility, and includes a clock scaler that provides various clock multiplier ratios, capability to directly enable and disable the PLL, and a PLL lock timer that can be used to delay switching to the PLL clocking mode of the device until lock is achieved. Devices that have a built-in software-programmable PLL can be configured in one of two clock modes:
D PLL mode. The input clock (X2/CLKIN) is multiplied by 1 of 31 possible ratios. These ratios are achieved
using the PLL circuitry.
D DIV (divider) mode. The input clock is divided by 2 or 4. Note that when DIV mode is used, the PLL can be
completely disabled to minimize power dissipation.
The software-programmable PLL is controlled using the 16-bit memory-mapped (address 0058h) clock mode register (CLKMD). The CLKMD register is used to define the clock configuration of the PLL clock module. Upon reset, the CLKMD register is initialized with a predetermined value dependent only upon the state of the CLKMD1 – CLKMD3 pins as shown in Table 5.
Table 5. Clock Mode Settings at Reset
CLKMD1 CLKMD2 CLKMD3
CLKMD
CLOCK MODE
CLKMD1
CLKMD2
CLKMD3
RESET VALUE
CLOCK MODE
0 0 0 E007h PLL x 15 0 0 1 9007h PLL x 10
0 1 0 4007h PLL x 5 1 0 0 1007h PLL x 2 1 1 0 F007h PLL x 1 1 1 1 0000h 1/2 (PLL disabled) 1 0 1 F000h 1/4 (PLL disabled) 0 1 1 Reserved (bypass mode)
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DMA controller
The ’UC5402 direct memory access (DMA) controller transfers data between points in the memory map without intervention by the CPU. The DMA controller allows movements of data to and from internal program/data memory or internal peripherals (such as the McBSPs) to occur in the background of CPU operation. The DMA has six independent programmable channels, allowing six different contexts for DMA operation.
features
The DMA has the following features:
D The DMA operates independently of the CPU. D The DMA has six channels. The DMA can keep track of the contexts of six independent block transfers. D The DMA has higher priority than the CPU for internal accesses. D Each channel has independently programmable priorities. D Each channel’s source and destination address registers can have configurable indexes through memory
on each read and write transfer, respectively. The address may remain constant, be postincremented, postdecremented, or be adjusted by a programmable value.
D Each read or write transfer may be initialized by selected events. D Upon completion of a half-block or an entire-block transfer, each DMA channel may send an interrupt to the
CPU.
D The DMA can perform double-word transfers (a 32-bit transfer of two 16-bit words).
DMA memory map
The DMA memory map allows DMA transfers to be unaffected by the status of the MP/MC, DROM, and OVL Y bits. The DMAmemory map is identical to that of the HPI-8 controller shown in Figure 6.
DMA priority level
Each DMA channel can be independently assigned high priority or low priority relative to each other. Multiple DMA channels that are assigned to the same priority level are handled in a round-robin manner.
DMA source/destination address modification
The DMA provides flexible address-indexing modes for easy implementation of data management schemes such as autobuffering and circular buffers. Source and destination addresses can be indexed separately and can be postincremented, postdecremented, or postincremented with a specified index offset.
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DMA in autoinitialization mode
The DMA can automatically reinitialize itself after completion of a block transfer. Some of the DMA registers can be preloaded for the next block transfer through the DMA global reload registers (DMGSA, DMGDA, and DMGCR). Autoinitialization allows:
D Continuous operation: Normally, the CPU would have to reinitialize the DMA immediately after the
completion of the current block transfer; but with the global reload registers, it can reinitialize these values for the next block transfer any time after the current block transfer begins.
D Repetitive operation: The CPU does not preload the global reload register with new values for each block
transfer but only loads them on the first block transfer.
DMA transfer counting
The DMA channel element count register (DMCTRx) and the frame count register (DMFRCx) contain bit fields that represent the number of frames and the number of elements per frame to be transferred.
D Frame count. This 8-bit value defines the total number of frames in the block transfer. The maximum number
of frames per block transfer is 128 (FRAME COUNT= 0ffh). The counter is decremented upon the last read transfer in a frame transfer. Once the last frame is transferred, the selected 8-bit counter is reloaded with the DMA global frame reload register (DMGFR) if the AUTOINIT bit is set to 1. A frame count of 0 (default value) means the block transfer contains a single frame.
D Element count. This 16-bit value defines the number of elements per frame. This counter is decremented
after the read transfer of each element. The maximum number of elements per frame is 65536 (DMCTRn = 0FFFFh). In autoinitialization mode, once the last frame is transferred, the counter is reloaded with the DMA global count reload register (DMGCR).
DMA transfers in double-word mode
Double-word mode allows the DMA to transfer 32-bit words in any index mode. In double-word mode, two consecutive 16-bit transfers are initiated and the source and destination addresses are automatically updated following each transfer. In this mode, each 32-bit word is considered to be one element.
DMA channel index registers
The particular DMA channel index register is selected by way of the SIND and DIND field in the DMA mode control register (DMMCRx). Unlike basic address adjustment, in conjunction with the frame index DMFRI0 and DMFRI1, the DMA allows different adjustment amounts depending on whether or not the element transfer is the last in the current frame. The normal adjustment value (element index) is contained in the element index registers DMIDX0 and DMIDX1. The adjustment value (frame index) for the end of the frame, is determined by the selected DMA frame index register, either DMFRI0 or DMFRI1.
The element index and the frame index affect address adjustment as follows:
D Element index: For all except the last transfer in the frame, the element index determines the amount to be
added to the DMA channel for the source/destination address register (DMSRCx/DMDSTx) as selected by the SIND/DIND bits.
D Frame index: If the transfer is the last in a frame, the frame index is used for address adjustment as selected
by the SIND/DIND bits. This occurs in both single-frame and multi-frame transfer.
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DMA interrupts
The ability of the DMA to interrupt the CPU based on the status of the data transfer is configurable and is determined by the IMOD and DINM bits in the DMA mode control register (DMMCRn). The available modes are shown in Table 6.
Table 6. DMA Interrupts
MODE DINM IMOD INTERRUPT
ABU (non-decrement) 1 0 At full buffer only ABU (non-decrement) 1 1 At half buffer and full buffer Multi-Frame 1 0 At block transfer complete (DMCTRn = DMSEFCn[7:0] = 0) Multi-Frame 1 1 At end of frame and end of block (DMCTRn = 0) Either 0 X No interrupt generated Either 0 X No interrupt generated
DMA controller synchronization events
The transfers associated with each DMA channel can be synchronized to one of several events. The DSYN bit field of the DMA channel x sync select and frame count (DMSFCx) register selects the synchronization event for a channel. The list of possible events and the DSYN values are shown in Table 7.
Table 7. DMA Synchronization Events
DSYN VALUE DMA SYNCHRONIZATION EVENT
0000b No synchronization used 0001b McBSP0 receive event 0010b McBSP0 transmit event
0011–0100b Reserved
0101b McBSP1 receive event
0110b McBSP1 transmit event
0111b–0110b Reserved
1101b Timer0 interrupt 1110b External interrupt 3 1111b Timer1 interrupt
DMA channel interrupt selection
The DMA controller can generate a CPU interrupt for each of the six channels. However, channels 1, 2, and 3 are multiplexed with other interrupt sources. DMA channels 2 and 3 share an interrupt line with the receive and transmit portions of McBSP1 (IMR/IFR bits 10 and 11), and DMA channel 1 shares an interrupt line with timer 1 (IMR/IFR bit 7). When the ’UC5402 is reset, the interrupts from these three DMA channels are deselected. The INTSEL bit field in the DMA channel priority and enable control (DMPREC) register can be used to select these interrupts, as shown in Table 8.
Table 8. DMA Channel Interrupt Selection
INTSEL Value IMR/IFR[7] IMR/IFR[10] IMR/IFR[11]
00b (reset) TINT1 BRINT1 BXINT1
01b TINT1 DMAC2 DMAC3 10b DMAC1 DMAC2 DMAC3
11b Reserved
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memory-mapped registers
The ’UC5402 has 27 memory-mapped CPU registers, which are mapped in data memory space addresses 0h to 1Fh. Table 9 gives a list of the CPU memory-mapped registers (MMRs) available on ’UC5402. The device also has a set of memory-mapped registers associated with peripherals. T able 10, T able 11, and T able 12 show additional peripheral MMRs associated with the ’UC5402.
Table 9. CPU Memory-Mapped Registers
ADDRESS
NAME
DEC HEX
DESCRIPTION
IMR 0 0 Interrupt mask register IFR 1 1 Interrupt flag register – 2–5 2–5 Reserved for testing ST0 6 6 Status register 0 ST1 7 7 Status register 1 AL 8 8 Accumulator A low word (15–0) AH 9 9 Accumulator A high word (31–16) AG 10 A Accumulator A guard bits (39–32) BL 11 B Accumulator B low word (15–0) BH 12 C Accumulator B high word (31–16) BG 13 D Accumulator B guard bits (39–32) TREG 14 E Temporary register TRN 15 F Transition register AR0 16 10 Auxiliary register 0 AR1 17 11 Auxiliary register 1 AR2 18 12 Auxiliary register 2 AR3 19 13 Auxiliary register 3 AR4 20 14 Auxiliary register 4 AR5 21 15 Auxiliary register 5 AR6 22 16 Auxiliary register 6 AR7 23 17 Auxiliary register 7 SP 24 18 Stack pointer register BK 25 19 Circular buffer size register BRC 26 1A Block-repeat counter RSA 27 1B Block-repeat start address REA 28 1C Block-repeat end address PMST 29 1D Processor mode status (PMST) register XPC 30 1E Extended program page register – 31 1F Reserved
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memory-mapped registers (continued)
Table 10. Peripheral Memory-Mapped Registers
NAME ADDRESS DESCRIPTION TYPE
DRR20 20h
McBSP0 data receive register 2 McBSP #0
DRR10 21h
McBSP0 data receive register 1 McBSP #0
DXR20 22h
McBSP0 data transmit register 2 McBSP #0
DXR10 23h
McBSP0 data transmit register 1 McBSP #0
TIM 24h
Timer0 register Timer0
PRD 25h
Timer0 period counter Timer0
TCR 26h
Timer0 control register Timer0 – 27h Reserved SWWSR 28h
Software wait-state register External Bus BSCR 29h
Bank-switching control register External Bus – 2Ah Reserved SWCR 2Bh
Software wait-state control register External Bus HPIC 2Ch
HPI control register HPI – 2Dh–2Fh Reserved TIM1 30h
Timer1 register Timer1 PRD1 31h
Timer1 period counter Timer1 TCR1 32h
Timer1 control register Timer1 – 33h–37h Reserved SPSA0
38h
McBSP0 subbank address register
McBSP #0
SPSD0
39h
McBSP0 subbank data register
McBSP #0 – 3Ah–3Bh Reserved GPIOCR
3Ch
General-purpose I/O pins control register
GPIO
GPIOSR
3Dh
General-purpose I/O pins status register
GPIO – 3Eh–3Fh Reserved DRR21 40h
McBSP1 data receive register 2 McBSP #1
DRR11 41h
McBSP1 data receive register 1 McBSP #1
DXR21 42h
McBSP1 data transmit register 2 McBSP #1
DXR11 43h
McBSP1 data transmit register 1 McBSP #1 – 44h–47h Reserved SPSA1 48h
McBSP1 subbank address register
McBSP #1
SPSD1
49h
McBSP1 subbank data register
McBSP #1 – 4Ah–53h Reserved DMPREC 54h
DMA channel priority and enable control register DMA
DMSA 55h
DMA subbank address register
DMA
DMSDI
56h
DMA subbank data register with autoincrement
DMA
DMSDN
57h
DMA subbank data register
DMA
CLKMD
58h
Clock mode register
PLL
59h–5Fh Reserved
See Table 11 for a detailed description of the McBSP control registers and their subaddresses.
See Table 12 for a detailed description of the DMA subbank addressed registers.
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McBSP control registers and subaddresses
The control registers for the multichannel buffered serial port (McBSP) are accessed using the subbank addressing scheme. This allows a set or subbank of registers to be accessed through a single memory location. The serial port subbank address (SPSA) register is used as a pointer to select a particular register within the subbank. The serial port subbank data (SPSD) register is used to access (read or write) the selected register. Table 11 shows the McBSP control registers and their corresponding subaddresses.
Table 11. McBSP Control Registers and Subaddresses
McBSP0
NAME ADDRESS
McBSP1
NAME ADDRESS
SUB-
ADDRESS
DESCRIPTION
SPCR10
39h
SPCR11
49h
00h
Serial port control register 1
SPCR20
39h
SPCR21
49h
01h
Serial port control register 2
RCR10
39h
RCR11
49h
02h
Receive control register 1
RCR20
39h
RCR21
49h
03h
Receive control register 2
XCR10
39h
XCR11
49h
04h
Transmit control register 1
XCR20
39h
XCR21
49h
05h
Transmit control register 2
SRGR10
39h
SRGR11
49h
06h
Sample rate generator register 1
SRGR20
39h
SRGR21
49h
07h
Sample rate generator register 2
MCR10
39h
MCR11
49h
08h
Multichannel register 1
MCR20
39h
MCR21
49h
09h
Multichannel register 2
RCERA0
39h
RCERA1
49h
0Ah
Receive channel enable register partition A
RCERB0
39h
RCERB1
49h
0Bh
Receive channel enable register partition B
XCERA0
39h
XCERA1
49h
0Ch
Transmit channel enable register partition A
XCERB0
39h
XCERB1
49h
0Dh
Transmit channel enable register partition B
PCR0
39h
PCR1
49h
0Eh
Pin control register
DMA subbank addressed registers
The direct memory access (DMA) controller has several control registers associated with it. The main control register (DMPREC) is a standard memory-mapped register. However, the other registers are accessed using the subbank addressing scheme. This allows a set or subbank of registers to be accessed through a single memory location. The DMA subbank address (DMSA) register is used as a pointer to select a particular register within the subbank, while the DMA subbank data (DMSDN) register or the DMA subbank data register with autoincrement (DMSDI) is used to access (read or write) the selected register.
When the DMSDI register is used to access the subbank, the subbank address is automatically postincremented so that a subsequent access affects the next register within the subbank. This autoincrement feature is intended for efficient, successive accesses to several control registers. If the autoincrement feature is not required, the DMSDN register should be used to access the subbank. T able 12 shows the DMA controller subbank addressed registers and their corresponding subaddresses.
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DMA subbank addressed registers (continued)
Table 12. DMA Subbank Addressed Registers
NAME ADDRESS
SUB-
ADDRESS
DESCRIPTION
DMSRC0 56h/57h 00h DMA channel 0 source address register DMDST0 56h/57h 01h DMA channel 0 destination address register DMCTR0 56h/57h 02h DMA channel 0 element count register DMSFC0 56h/57h 03h DMA channel 0 sync select and frame count register DMMCR0 56h/57h 04h DMA channel 0 transfer mode control register DMSRC1 56h/57h 05h DMA channel 1 source address register DMDST1 56h/57h 06h DMA channel 1 destination address register DMCTR1 56h/57h 07h DMA channel 1 element count register DMSFC1 56h/57h 08h DMA channel 1 sync select and frame count register DMMCR1 56h/57h 09h DMA channel 1 transfer mode control register DMSRC2 56h/57h 0Ah DMA channel 2 source address register DMDST2 56h/57h 0Bh DMA channel 2 destination address register DMCTR2 56h/57h 0Ch DMA channel 2 element count register DMSFC2 56h/57h 0Dh DMA channel 2 sync select and frame count register DMMCR2 56h/57h 0Eh DMA channel 2 transfer mode control register DMSRC3 56h/57h 0Fh DMA channel 3 source address register DMDST3 56h/57h 10h DMA channel 3 destination address register DMCTR3 56h/57h 11h DMA channel 3 element count register DMSFC3 56h/57h 12h DMA channel 3 sync select and frame count register DMMCR3 56h/57h 13h DMA channel 3 transfer mode control register DMSRC4 56h/57h 14h DMA channel 4 source address register DMDST4 56h/57h 15h DMA channel 4 destination address register DMCTR4 56h/57h 16h DMA channel 4 element count register DMSFC4 56h/57h 17h DMA channel 4 sync select and frame count register DMMCR4 56h/57h 18h DMA channel 4 transfer mode control register DMSRC5 56h/57h 19h DMA channel 5 source address register DMDST5 56h/57h 1Ah DMA channel 5 destination address register DMCTR5 56h/57h 1Bh DMA channel 5 element count register DMSFC5 56h/57h 1Ch DMA channel 5 sync select and frame count register DMMCR5 56h/57h 1Dh DMA channel 5 transfer mode control register DMSRCP 56h/57h 1Eh DMA source program page address (common channel) DMDSTP 56h/57h 1Fh DMA destination program page address (common channel) DMIDX0 56h/57h 20h DMA element index address register 0 DMIDX1 56h/57h 21h DMA element index address register 1 DMFRI0 56h/57h 22h DMA frame index register 0 DMFRI1 56h/57h 23h DMA frame index register 1 DMGSA 56h/57h 24h DMA global source address reload register DMGDA 56h/57h 25h DMA global destination address reload register DMGCR 56h/57h 26h DMA global count reload register DMGFR 56h/57h 27h DMA global frame count reload register
Address 56h is used to access DMA subbank data registers with autoincrement (DMSDI) while address 57h is used to access DMA subbank data register without autoincrement (DMSDN).
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interrupts
Vector-relative locations and priorities for all internal and external interrupts are shown in Table 13.
Table 13. Interrupt Locations and Priorities
NAME
LOCATION
DECIMAL HEX
PRIORITY FUNCTION
RS, SINTR 0 00 1 Reset (hardware and software reset) NMI, SINT16 4 04 2 Nonmaskable interrupt SINT17 8 08 Software interrupt #17 SINT18 12 0C Software interrupt #18 SINT19 16 10 Software interrupt #19 SINT20 20 14 Software interrupt #20 SINT21 24 18 Software interrupt #21 SINT22 28 1C Software interrupt #22 SINT23 32 20 Software interrupt #23 SINT24 36 24 Software interrupt #24 SINT25 40 28 Software interrupt #25 SINT26 44 2C Software interrupt #26 SINT27 48 30 Software interrupt #27 SINT28 52 34 Software interrupt #28 SINT29 56 38 Software interrupt #29 SINT30 60 3C Software interrupt #30 INT0, SINT0 64 40 3 External user interrupt #0 INT1, SINT1 68 44 4 External user interrupt #1 INT2, SINT2 72 48 5 External user interrupt #2 TINT0, SINT3 76 4C 6 Timer0 interrupt BRINT0, SINT4 80 50 7 McBSP #0 receive interrupt BXINT0, SINT5 84 54 8 McBSP #0 transmit interrupt DMAC0, SINT7 88 58 9 DMA channel 0 interrupt
TINT1(DMAC1), SINT7 92 5C 10
Timer1 interrupt (default) or DMA channel 1 interrupt. The selection is made in the
DMPREC register. INT3, SINT8 96 60 11 External user interrupt #3 HPINT, SINT9 100 64 12 HPI interrupt
BRINT1(DMAC2), SINT10 104 68 13
McBSP #1 receive interrupt (default) or DMA
channel 2 interrupt. The selection is made in
the DMPREC register.
BXINT1(DMAC3), SINT11 108 6C 14
McBSP #1 transmit interrupt (default) or DMA
channel 3 interrupt. The selection is made in
the DMPREC register. DMAC4,SINT12 112 70 15 DMA channel 4 interrupt DMAC5,SINT13 116 74 16 DMA channel 5 interrupt Reserved 120–127 78–7F Reserved
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interrupts (continued)
The bits of the interrupt flag register (IFR) and interrupt mask register (IMR) are arranged as shown in Figure 7.
15–14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
RES DMAC5 DMAC4 BXINT1
or
DMAC3
BRINT1
or
DMAC2
HPINT INT3 TINT1
or
DMAC1
DMAC0 BXINT0 BRINT0 TINT0 INT2 INT1 INT0
Figure 7. IFR and IMR Registers
Table 14. IFR and IMR Register Bit Fields
BIT
NUMBER NAME
FUNCTION
15–14 Reserved for future expansion
13 DMAC5 DMA channel 5 interrupt flag/mask bit 12 DMAC4
DMA channel 4 interrupt flag/mask bit
11 BXINT1/DMAC3
This bit can be configured as either the McBSP1 transmit interrupt flag/mask bit, or the DMA channel 3 interrupt flag/mask bit. The selection is made in the DMPREC register.
10 BRINT1/DMAC2
This bit can be configured as either the McBSP1 receive interrupt flag/mask bit, or the DMA channel 2 interrupt flag/mask bit. The selection is made in the DMPREC register.
9 HPINT
Host to ’54x interrupt flag/mask
8 INT3
External interrupt 3 flag/mask
7 TINT1/DMAC1
This bit can be configured as either the timer1 interrupt flag/mask bit, or the DMA channel 1 interrupt flag/mask bit. The selection is made in the DMPREC register.
6 DMAC0
DMA channel 0 interrupt flag/mask bit
5 BXINT0
McBSP0 transmit interrupt flag/mask bit
4 BRINT0
McBSP0 receive interrupt flag/mask bit
3 TINT0
Timer 0 interrupt flag/mask bit
2 INT2
External interrupt 2 flag/mask bit
1 INT1
External interrupt 1 flag/mask bit
0 INT0
External interrupt 0 flag/mask bit
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documentation support
Extensive documentation supports all TMS320 family generations of devices from product announcement through applications development. The following types of documentation are available to support the design and use of the ’C5000 family of DSPs:
D
TMS320C5000 DSP Family Functional Overview
(literature number SPRU307)
D Device-specific data sheets (such as this document) D Complete User Guides D Development-support tools D Hardware and software application reports
The five-volume
TMS320C54x DSP Reference Set
(literature number SPRU210) consists of:
D
Volume 1: CPU and Peripherals
(literature number SPRU131)
D
Volume 2: Mnemonic Instruction Set
(literature number SPRU172)
D
Volume 3: Algebraic Instruction Set
(literature number SPRU179)
D
Volume 4: Applications Guide
(literature number SPRU173)
D
Volume 5: Enhanced Peripherals
(literature number SPRU302)
The reference set describes in detail the ’54x TMS320 products currently available and the hardware and software applications, including algorithms, for fixed-point TMS320 devices.
For general background information on DSPs and Texas Instruments (TIt) devices, see the three-volume publication
Digital Signal Processing Applications with the TMS320 Family
(literature numbers SPRA012,
SPRA016, and SPRA017). A series of DSP textbooks is published by Prentice-Hall and John Wiley & Sons to support digital signal
processing research and education. The TMS320 newsletter,
Details on Signal Processing
, is published
quarterly and distributed to update TMS320 customers on product information. Information regarding TI DSP products is also available on the Worldwide Web at
http://www.ti.com
uniform
resource locator (URL).
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TI is a trademark of Texas Instruments Incorporated.
TMS320UC5402 FIXED-POINT DIGITAL SIGNAL PROCESSOR
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absolute maximum ratings over specified temperature range (unless otherwise noted)
Supply voltage I/O range, DVDD‡ –0.3 V to 4.0 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply voltage core range, CV
DD
–0.3 V to 2.0 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, V
I
–0.3 V to 4.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, V
O
–0.3 V to 4.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating case temperature range, T
C
–40°C to 100°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
–55°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to VSS.
recommended operating conditions
MIN NOM MAX UNIT
DVDDDevice supply voltage, I/O 1.71 3.6 V CVDDDevice supply voltage, core 1.71 1.8 1.98 V
V
SS
Supply voltage, GND 0 V
X2/CLKIN 1.35 1.98
DVDD = 1.71 V to 1.89 V
All other inputs 1.35 DVDD + 0.3 X2/CLKIN 1.35 1.98
DVDD = 1.90 V to 2.99 V
All other inputs 1.70 DVDD + 0.3
High-level input
X2/CLKIN 1.35 1.98
V
IH
High level in ut
voltage
DVDD = 3.0 V to 3.6 V
RS, INTn, NMI, BIO, BCLKR0, BCLKR1, BCLKX0, BCLKX1, HCS
, HDS1,
HDS2
, TDI, TMS, CLKMDn
2.2 DVDD + 0.3
V
TCK, TRST 2.5 DVDD + 0.3 All other inputs 2.0 DVDD + 0.3 X2/CLKIN –0.3 0.6
DVDD = 1.71 V to 1.89 V
All other inputs –0.3 0.6 X2/CLKIN –0.3 0.6
V
IL
Low-level input voltage
DVDD = 1.90 V to 3.6 V
RS, INTn, NMI, BIO, BCLKR0, BCLKR1, BCLKX0, BCLKX1, HCS
, HDS1,
HDS2
, TCK, CLKMDn
–0.3 0.6
V
All other inputs –0.3 0.8
I
OH
High-level output current –300 µA
I
OL
Low-level output current 1.5 mA
T
C
Operating case temperature –40 100 °C
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electrical characteristics over recommended operating case temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
V
OH
High-level output voltage
IOH = MAX DVDD – 0.3 V
CLKOUT 0.40
V
OL
Low-level output
D
VDD
= 1.71 to 1.89 V IOL = MAX
All other outputs 0.35
V
OL
voltage
D
VDD
= 1.9 to 3.6 V IOL = MAX All outputs 0.40
I
IZ
Input current for outputs in high
D[15:0], HD[7:0]
Bus holders enabled, DVDD = MAX, VI = VSS to DV
DD
–175 175
µA
I
IZ
out uts in high
impedance
All other inputs
DVDD = MAX, VO = VSS to DV
DD
–5 5
µA
X2/CLKIN –40 40 TRST With internal pulldown –5 300
p
HPIENA With internal pulldown
–5 300
I
I
I
nput current
TMS, TCK, TDI, HPI
}
With internal pullups, HPIENA = 0
(V
I
=
V
SS
to DVDD)
–300 5
µA
All other input-only
All other in ut only
pins
–5 5
I
DDC
Supply current, core CPU
CVDD = 1.8 V, f
clock
= 80 MHz,w
TC = 25°C
35 mA
f
= 80 MHz,w
DVDD = 1.71 to
1.89 V
12
I
DDP
Supply current, pins
f
clock
= 80
MHz
,w
TC = 25°C
DVDD = 1.9 to
3.6 V
27
mA
Supply current,
IDLE2 PLL × 1 mode, 80 MHz input 1.6 mA
I
DD
Su ly current,
standby
IDLE3
Divide-by-two mode, CLKIN stopped 20 µA
C
i
Input capacitance 5 pF
C
o
Output capacitance 5 pF
All values are typical unless otherwise specified.
HPI input signals except for HPIENA.
§
Clock mode: PLL × 1 with external source
Timing parameters provided in this document are measured using the following load circuit on all device output pins.
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PARAMETER MEASUREMENT INFORMATION
Timing parameters provided are measured using the load circuit in Figure 8 on all device output pins.
Tester Pin
Electronics
V
Load
I
OL
C
T
I
OH
Output Under Test
50
Where: I
OL
= 1.5 mA (all outputs)
I
OH
= 300 µA (all outputs)
V
Load
= 0.855 V
C
T
= 40 pF typical load circuit capacitance
Figure 8. 1.8-V Test Load Circuit
internal oscillator with external crystal
The internal oscillator is enabled by connecting a crystal across X1 and X2/CLKIN. The frequency of CLKOUT is a multiple of the oscillator frequency . The multiply ratio is determined by the bit settings in the CLKMD register. The crystal should be in fundamental-mode operation, and parallel resonant, with an effective series resistance of 30 Ω and power dissipation of 1 mW. The circuit shown in Figure 9 represents fundamental-mode operation.
The connection of the required circuit, consisting of the crystal and two load capacitors, is shown in Figure 9. The load capacitors, C
1
and C2, should be chosen such that the equation below is satisfied. CL in the equation
is the load specified for the crystal.
C
L
+
C1C
2
(
C
1
)
C
2
)
recommended operating conditions of internal oscillator with external crystal (see Figure 9)
MIN NOM MAX UNIT
f
clock
Input clock frequency 10 20 MHz
X1 X2/CLKIN
C1 C2
Crystal
Figure 9. Internal Oscillator With External Crystal
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SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
33
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divide-by-two clock option (PLL disabled)
The frequency of the reference clock provided at the X2/CLKIN pin can be divided by a factor of two to generate the internal machine cycle. The selection of the clock mode is described in the clock generator section.
When an external clock source is used, the external frequency injected must conform to specifications listed in the timing requirements table.
NOTE: If an external clock source is used, the CLKIN signal level should not exceed 1.98 V .
switching characteristics over recommended operating conditions [H = 0.5t
c(CO)
]† (see Figure 9,
Figure 10, and the recommended operating conditions table)
PARAMETER MIN TYP MAX UNIT
t
c(CO)
Cycle time, CLKOUT 12.50‡2t
c(CI)
ns
t
d(CIH-CO)
Delay time, X2/CLKIN high to CLKOUT high/low 7 12 20 ns
t
f(CO)
Fall time, CLKOUT 4 ns
t
r(CO)
Rise time, CLKOUT 4 ns
t
w(COL)
Pulse duration, CLKOUT low H–2 H–1 H ns
t
w(COH)
Pulse duration, CLKOUT high H–2 H–1 H ns
This device utilizes a fully static design and therefore can operate with t
c(CI)
approaching . The device is characterized at frequencies
approaching 0 Hz.
It is recommended that the PLL clocking option be used for maximum frequency operation.
timing requirements (see Figure 10)
MIN MAX UNIT
t
c(CI)
Cycle time, X2/CLKIN 6.25
ns
t
f(CI)
Fall time, X2/CLKIN 8 ns
t
r(CI)
Rise time, X2/CLKIN 8 ns
This device utilizes a fully static design and therefore can operate with t
c(CI)
approaching . The device is characterized at frequencies
approaching 0 Hz.
t
r(CO)
t
f(CO)
CLKOUT
X2/CLKIN
t
w(COL)
t
d(CIH-CO)
t
f(CI)
t
r(CI)
t
w(COH)
t
c(CI)
t
c(CO)
Figure 10. External Divide-by-Two Clock Timing
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TMS320UC5402 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
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multiply-by-N clock option
The frequency of the reference clock provided at the X2/CLKIN pin can be multiplied by a factor of N to generate the internal machine cycle. The selection of the clock mode and the value of N is described in the clock generator section.
When an external clock source is used, the external frequency injected must conform to specifications listed in the timing requirements table.
NOTE: If an external clock source is used, the CLKIN signal level should not exceed 1.98 V .
switching characteristics over recommended operating conditions [H = 0.5t
c(CO)
]
(see Figure 9 and Figure 11)
PARAMETER MIN TYP MAX UNIT
t
c(CO)
Cycle time, CLKOUT 12.5 t
c(CI)/N
ns
t
d(CI-CO)
Delay time, X2/CLKIN high/low to CLKOUT high/low 7 10 20 ns
t
f(CO)
Fall time, CLKOUT 4 ns
t
r(CO)
Rise time, CLKOUT 4 ns
t
w(COL)
Pulse duration, CLKOUT low H–2 H–1 H ns
t
w(COH)
Pulse duration, CLKOUT high H–2 H–1 H ns
t
p
Transitory phase, PLL lock up time 30
ms
N = Multiplication factor
timing requirements (see Figure 11)
MIN MAX UNIT
Integer PLL multiplier N (N = 1–15) 12.5N 400N
t
c(CI
)
Cycle time, X2/CLKIN
PLL multiplier N = x.5
12.5N 200N
ns
t
c(CI)
Cycle time, X2/CLKIN
PLL multiplier N = x.25, x.75 12.5N 100N
ns
t
f(CI)
Fall time, X2/CLKIN 8 ns
t
r(CI)
Rise time, X2/CLKIN 8 ns
N = Multiplication factor
t
c(CO)
t
c(CI)
t
w(COH)
t
f(CO)
t
r(CO)
t
f(CI)
X2/CLKIN
CLKOUT
t
d(CI-CO)
t
w(COL)
t
r(CI)
tp
Unstable
Figure 11. External Multiply-by-One Clock Timing
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TMS320UC5402
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
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memory and parallel I/O interface timing
switching characteristics over recommended operating conditions for a
memory read
(MSTRB
= 0)
(see Figure 12)
PARAMETER MIN MAX UNIT
t
d(CLKL-A)
Delay time, CLKOUT low to address valid
0 5 ns
t
d(CLKH-A)
Delay time, CLKOUT high (transition) to address valid
§
–2 5 ns
t
d(CLKL-MSL)
Delay time, CLKOUT l ow to MSTRB low 1 5 ns
t
d(CLKL-MSH)
Delay time, CLKOUT low to MSTRB high 1 5 ns
t
h(CLKL-A)R
Hold time, address valid after CLKOUT low
0 5 ns
t
h(CLKH-A)R
Hold time, address valid after CLKOUT high
§
–2 5 ns
Address, PS
, and DS timings are all included in timings referenced as address.
In the case of a memory read preceded by a memory read
§
In the case of a memory read preceded by a memory write
timing requirements for a
memory read (MSTRB = 0)
[H = 0.5 t
c(CO)
]
(see Figure 12)
MIN MAX UNIT
t
a(A)M
Access time, read data access from address valid 2H–8 ns
t
a(MSTRBL)
Access time, read data access from MSTRB low 2H–8 ns
t
su(D)R
Setup time, read data before CLKOUT low 7 ns
t
h(D)R
Hold time, read data after CLKOUT low –1 ns
t
h(A-D)R
Hold time, read data after address invalid –3 ns
t
h(D)MSTRBH
Hold time, read data after MSTRB high –3 ns
Address, PS
, and DS timings are all included in timings referenced as address.
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TMS320UC5402 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
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memory and parallel I/O interface timing (continued)
PS, DS
R/W
MSTRB
D[15:0]
A[19:0]
CLKOUT
t
h(D)R
t
h(CLKL-A)R
t
d(CLKL-MSH)
t
d(CLKL-A)
t
d(CLKL-MSL)
t
su(D)R
t
a(A)M
t
a(MSTRBL)
t
h(A-D)R
t
h(D)MSTRBH
NOTE A: A[19:16] are always driven low during external data space accesses.
Figure 12. Memory Read (MSTRB = 0)
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TMS320UC5402
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
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memory and parallel I/O interface timing (continued)
switching characteristics over recommended operating conditions for a
memory write
(MSTRB
= 0)
[H = 0.5 t
c(CO)
]† (see Figure 13)
PARAMETER MIN MAX UNIT
t
d(CLKH-A)
Delay time, CLKOUT high to address valid
0 5 ns
t
d(CLKL-A)
Delay time, CLKOUT l ow to addres s valid
§
–2 5 ns
t
d(CLKL-MSL)
Delay time, CLKOUT l ow to MSTRB low 1 5 ns
t
d(CLKL-D)W
Delay time, CLKOUT l ow to data valid 0 15 ns
t
d(CLKL-MSH)
Delay time, CLKOUT l ow to MSTRB high 1 5 ns
t
d(CLKH-RWL)
Delay time, CLKOUT high to R/W low –1 5 ns
t
d(CLKH-RWH)
Delay time, CLKOUT high to R/W high –2 5 ns
t
d(RWL-MSTRBL)
Delay time, R/W low to MSTRB low H – 2 H + 1 ns
t
h(A)W
Hold time, address valid after CLKOUT high
2 4 ns
t
h(D)MSH
Hold time, write data valid after MSTRB high H–3 H+8
§
ns
t
w(SL)MS
Pulse duration, MSTRB low 2H–1 ns
t
su(A)W
Setup time, address valid before MSTRB low 2H–1 ns
t
su(D)MSH
Setup time, write data valid before MSTRB high 2H–8 2H+5
§
ns
t
en(D–RWL)
Enable time, data bus driven after R/W low H–5 ns
t
dis(RWH–D)
Disable time, R/W high to data bus high impedance 0 ns
Address, PS, and DS timings are all included in timings referenced as address.
In the case of a memory write preceded by a memory write
§
In the case of a memory write preceded by an I/O cycle
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TMS320UC5402 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
38
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memory and parallel I/O interface timing (continued)
PS, DS
R/W
MSTRB
D[15:0]
A[19:0]
CLKOUT
t
d(CLKH-RWH)
t
h(A)W
t
d(CLKL-MSH)
t
su(D)MSH
t
d(CLKL-D)W
t
w(SL)MS
t
su(A)W
t
d(CLKL-MSL)
t
h(D)MSH
t
d(CLKL-A)
t
d(CLKH-RWL)
t
d(RWL-MSTRBL)
t
d(CLKH-A)
t
en(D-RWL)
t
dis(RWH-D)
NOTE A: A[19:16] are always driven low during external data space accesses.
Figure 13. Memory Write (MSTRB = 0)
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TMS320UC5402
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
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memory and parallel I/O interface timing (continued)
switching characteristics over recommended operating conditions for a
parallel I/O port read
(IOSTRB
= 0)
(see Figure 14)
PARAMETER MIN MAX UNIT
t
d(CLKL-A)
Delay time, CLKOUT low to address valid 0 5 ns
t
d(CLKH-ISTRBL)
Delay time, CLKOUT h igh to IOSTR B low –2 4 ns
t
d(CLKH-ISTRBH)
Delay time, CLKOUT h igh to IOSTR B high –2 4 ns
t
h(A)IOR
Hold time, address after CLKOUT low 0 5 ns
Address and IS timings are included in timings referenced as address.
timing requirements for a
parallel I/O port read (IOSTRB = 0)
[H = 0.5 t
c(CO)
]† (see Figure 14)
MIN MAX UNIT
t
a(A)IO
Access time, read data access from address valid 3H–9 ns
t
a(ISTRBL)IO
Access time, read data access from IOSTRB low 3H–9 ns
t
su(D)IOR
Setup time, read data before CLKOUT high 7 ns
t
h(D)IOR
Hold time, read data after CLKOUT high –2 ns
t
h(ISTRBH-D)R
Hold time, read data after IOSTRB high –3 ns
Address and IS timings are included in timings referenced as address.
IS
R/W
IOSTRB
D[15:0]
A[19:0]
CLKOUT
t
h(A)IOR
t
d(CLKH-ISTRBH)
t
h(D)IOR
t
su(D)IOR
t
a(A)IO
t
d(CLKH-ISTRBL)
t
d(CLKL-A)
t
a(ISTRBL)IO
t
h(ISTRBH-D)R
NOTE A: A[19:16] are always driven low during I/O accesses.
Figure 14. Parallel I/O Port Read (IOSTRB = 0)
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TMS320UC5402 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
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memory and parallel I/O interface timing (continued)
switching characteristics over recommended operating conditions for a
parallel I/O port write
(IOSTRB
= 0)
[H = 0.5 t
c(CO)
]† (see Figure 15)
PARAMETER MIN MAX UNIT
t
d(CLKL-A)
Delay time, CLKOUT low to address valid 0 5 ns
t
d(CLKH-ISTRBL)
Delay time, CLKOUT h igh to IOSTR B low –2 4 ns
t
d(CLKH-D)IOW
Delay time, CLKOUT h i gh to write data valid H–5 H+14 ns
t
d(CLKH-ISTRBH)
Delay time, CLKOUT h igh to IOSTR B high –2 4 ns
t
d(CLKL-RWL)
Delay time, CLKOUT low to R/W low 0 6 ns
t
d(CLKL-RWH)
Delay time, CLKOUT low to R/W high 0 6 ns
t
h(A)IOW
Hold time, address valid after CLKOUT low 0 5 ns
t
h(D)IOW
Hold time, write data after IOSTRB high H–3 H+9 ns
t
su(D)IOSTRBH
Setup time, write data before IOSTRB high H–9 H+1 ns
t
su(A)IOSTRBL
Setup time, address valid before IOSTRB low H–1 H+1 ns
Address and IS timings are included in timings referenced as address.
IS
R/W
IOSTRB
D[15:0]
A[19:0]
CLKOUT
t
d(CLKH-ISTRBH)
t
h(A)IOW
t
h(D)IOW
t
d(CLKH-D)IOW
t
d(CLKH-ISTRBL)
t
d(CLKL-A)
t
d(CLKL-RWL)
t
d(CLKL-RWH)
t
su(A)IOSTRBL
t
su(D)IOSTRBH
NOTE A: A[19:16] are always driven low during I/O accesses.
Figure 15. Parallel I/O Port Write (IOSTRB = 0)
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TMS320UC5402
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
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ready timing for externally generated wait states
timing requirements for externally generated wait states [H = 0.5 t
c(CO)
]† (see Figure 16, Figure 17,
Figure 18, and Figure 19)
MIN MAX UNIT
t
su(RDY)
Setup time, READY before CLKOUT low 6 ns
t
h(RDY)
Hold time, READY after CLKOUT low 0–1 ns
t
v(RDY)MSTRB
Valid time, READY after MSTRB low
4H–8 ns
t
h(RDY)MSTRB
Hold time, READY after MSTRB low
4H–3 ns
t
v(RDY)IOSTRB
Valid time, READY after IOSTRB low
5H–7 ns
t
h(RDY)IOSTRB
Hold time, READY after IOSTRB low
5H–2 ns
t
v(MSCL)
Valid time, MSC low after CLKOUT low 0 6 ns
t
v(MSCH)
Valid time, MSC high after CLKOUT low –1 5 ns
The hardware wait states can be used only in conjunction with the software wait states to extend the bus cycles. To generate wait states using READY, at least two software wait states must be programmed.
These timings are included for reference only. The critical timings for READY are those referenced to CLKOUT.
MSC
MSTRB
READY
A[19:0]
CLKOUT
t
v(MSCH)
t
v(MSCL)
t
h(RDY)
t
h(RDY)MSTRB
t
v(RDY)MSTRB
Wait State Generated by READY
Wait States
Generated Internally
t
su(RDY)
NOTE A: A[19:16] are always driven low during external data space accesses.
Figure 16. Memory Read With Externally Generated Wait States
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TMS320UC5402 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
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ready timing for externally generated wait states (continued)
MSC
MSTRB
READY
D[15:0]
A[19:0]
CLKOUT
t
v(MSCH)
t
h(RDY)
Wait State Generated by READY
Wait States
Generated Internally
t
h(RDY)MSTRB
t
v(RDY)MSTRB
t
v(MSCL)
t
su(RDY)
NOTE A: A[19:16] are always driven low during external data space accesses.
Figure 17. Memory Write With Externally Generated Wait States
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TMS320UC5402
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
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ready timing for externally generated wait states (continued)
t
su(RDY)
MSC
IOSTRB
READY
A[19:0]
CLKOUT
t
v(MSCH)
t
h(RDY)
Wait State Generated by READY
Wait
States
Generated
Internally
t
v(RDY)IOSTRB
t
v(MSCL)
t
h(RDY)IOSTRB
NOTE A: A[19:16] are always driven low during I/O space accesses.
Figure 18. I/O Read With Externally Generated Wait States
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TMS320UC5402 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
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ready timing for externally generated wait states (continued)
IOSTRB
MSC
READY
D[15:0]
A[19:0]
CLKOUT
t
h(RDY)
Wait State Generated by READY
Wait States
Generated
Internally
t
v(RDY)IOSTRB
t
su(RDY)
t
v(MSCH)
t
v(MSCL)
t
h(RDY)IOSTRB
NOTE A: A[19:16] are always driven low during I/O accesses.
Figure 19. I/O Write With Externally Generated Wait States
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TMS320UC5402
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
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HOLD and HOLDA timings
switching characteristics over recommended operating conditions for memory control signals and HOLDA
, [H = 0.5 t
c(CO)
] (see Figure 20)
PARAMETER MIN MAX UNIT
t
dis(CLKL-A)
Disable time, address, PS, DS, IS high impedance from CLKOUT low 3 ns
t
dis(CLKL-RW)
Disable time, R/W high impedance from CLKOUT low 3 ns
t
dis(CLKL-S)
Disable time, MSTRB, IOSTRB high impedance from CLKOUT low 3 ns
t
en(CLKL-A)
Enable time, address, PS, DS, IS from CLKOUT low 2H+7 ns
t
en(CLKL-RW)
Enable time, R/W enabled from CLKOUT low 2H+7 ns
t
en(CLKL-S)
Enable time, MSTRB, IOSTRB enabled from CLKOUT low 2H+7 ns Valid time, HOLDA low after CLKOUT low
10 7 ns
t
v(HOLDA)
Valid time, HOLDA high after CLKOUT low
1 6 ns
t
w(HOLDA)
Pulse duration, HOLDA low duration 2H ns
timing requirements for memory control signals and HOLDA, [H = 0.5 t
c(CO)
] (see Figure 20)
MIN MAX UNIT
t
w(HOLD)
Pulse duration, HOLD low 4H+16 ns
t
su(HOLD)
Setup time, HOLD low/high before CLKOUT low 7 ns
IOSTRB
MSTRB
R/W
D[15:0]
PS
, DS, IS
A[19:0]
HOLDA
HOLD
CLKOUT
t
en(CLKL-S)
t
en(CLKL-S)
t
en(CLKL-RW)
t
dis(CLKL-S)
t
dis(CLKL-S)
t
dis(CLKL-RW)
t
dis(CLKL-A)
t
v(HOLDA)
t
v(HOLDA)
t
w(HOLDA)
t
w(HOLD)
t
su(HOLD)
t
su(HOLD)
t
en(CLKL-A)
Figure 20. HOLD and HOLDA Timings (HM = 1)
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SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
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reset, BIO, interrupt, and MP/MC timings timing requirements for reset, BIO, interrupt, and MP/MC [H = 0.5 t
c(CO)
] (see Figure 21, Figure 22,
and Figure 23)
MIN MAX UNIT
t
h(RS)
Hold time, RS after CLKOUT low 0 ns
t
h(BIO)
Hold time, BIO after CLKOUT low –2 ns
t
h(INT)
Hold time, INTn, NMI, after CLKOUT low
–3 ns
t
h(MPMC)
Hold time, MP/MC after CLKOUT low 0 ns
t
w(RSL)
Pulse duration, RS low
‡§
4H+5 ns
t
w(BIO)S
Pulse duration, BIO low, synchronous 2H+4 ns
t
w(BIO)A
Pulse duration, BIO low, asynchronous 4H ns
t
w(INTH)S
Pulse duration, INTn, NMI high (synchronous) 2H–1 ns
t
w(INTH)A
Pulse duration, INTn, NMI high (asynchronous) 4H ns
t
w(INTL)S
Pulse duration, INTn, NMI low (synchronous) 2H+1 ns
t
w(INTL)A
Pulse duration, INTn, NMI low (asynchronous) 4H ns
t
w(INTL)WKP
Pulse duration, INTn, NMI low for IDLE2/IDLE3 wakeup 8 ns
t
su(RS)
Setup time, RS before X2/CLKIN low
5 ns
t
su(BIO)
Setup time, BIO before CLKOUT low 7 12 ns
t
su(INT)
Setup time, INTn, NMI, RS before CLKOUT low 8 12 ns
t
su(MPMC)
Setup time, MP/MC before CLKOUT low 10 ns
The external interrupts (INT0–INT3, NMI) are synchronized to the core CPU by way of a two-flip-flop synchronizer which samples these inputs with consecutive falling edges of CLKOUT. The input to the interrupt pins is required to represent a 1-0-0 sequence at the timing that is corresponding to three CLKOUT sampling sequences.
If the PLL mode is selected, then at power-on sequence, or at wakeup from IDLE3, RS
must be held low for at least 50 µs to ensure
synchronization and lock-in of the PLL.
§
Note that RS
may cause a change in clock frequency, therefore changing the value of H.
Divide-by-two mode
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TMS320UC5402
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
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reset, BIO, interrupt, and MP/MC timings (continued)
BIO
CLKOUT
RS
, INTn, NMI
X2/CLKIN
t
h(BIO)
t
h(RS)
t
su(INT)
t
w(BIO)S
t
su(BIO)
t
w(RSL)
t
su(RS)
Figure 21. Reset and BIO Timings
INTn, NMI
CLKOUT
t
h(INT)
t
su(INT)
t
su(INT)
t
w(INTL)A
t
w(INTH)A
Figure 22. Interrupt Timing
MP/MC
RS
CLKOUT
t
su(MPMC)
t
h(MPMC)
Figure 23. MP/MC Timing
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instruction acquisition (IAQ), interrupt acknowledge (IACK), external flag (XF), and TOUT timings
switching characteristics over recommended operating conditions for IAQ and IACK [H = 0.5 t
c(CO)
] (see Figure 24)
PARAMETER MIN MAX UNIT
t
d(CLKL-IAQL)
Delay time, CLKOUT low to IAQ low 1 5 ns
t
d(CLKL-IAQH)
Delay time, CLKOUT low to IAQ high 1 5 ns
t
d(A)IAQ
Delay time, address valid to IAQ low 2 ns
t
d(CLKL-IACKL)
Delay time, CLKOUT low to IACK low 0 5 ns
t
d(CLKL-IACKH)
Delay time , CLKOUT low to IACK high 1 5 ns
t
d(A)IACK
Delay time, address valid to IACK low 2 ns
t
h(A)IAQ
Hold time, IAQ high after address invalid –1 ns
t
h(A)IACK
Hold time, IACK high after address invalid –1 ns
t
w(IAQL)
Pulse duration, IAQ low 2H–1 ns
t
w(IACKL)
Pulse duration, IACK low 2H–1 ns
MSTRB
IACK
IAQ
A[19:0]
CLKOUT
t
d(A)IACK
t
d(A)IAQ
t
w(IACKL)
t
h(A)IACK
t
d(CLKL-IACKL)
t
w(IAQL)
t
h(A)IAQ
t
d(CLKL-IAQL)
t
d(CLKL-IACKH)
t
d(CLKL-IAQH)
Figure 24. IAQ and IACK Timings
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instruction acquisition (IAQ), interrupt acknowledge (IACK), external flag (XF), and TOUT timings (continued)
switching characteristics over recommended operating conditions for XF and TOUT [H = 0.5 t
c(CO)
] (see Figure 25 and Figure 26)
PARAMETER MIN MAX UNIT
Delay time, CLKOUT low to XF high –1 5
t
d(XF)
Delay time, CLKOUT low to XF low –1 5
ns
t
d(TOUTH)
Delay time, CLKOUT low to TOUT high 2 7 ns
t
d(TOUTL)
Delay time, CLKOUT low to TOUT low 1 6 ns
t
w(TOUT)
Pulse duration, TOUT 2H ns
XF
CLKOUT
t
d(XF)
Figure 25. XF Timing
TOUT
CLKOUT
t
w(TOUT)
t
d(TOUTL)
t
d(TOUTH)
Figure 26. TOUT Timing
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multichannel buffered serial port timing
timing requirements for McBSP [H=0.5t
c(CO)
]†(see Figure 27 and Figure 28)
MIN MAX UNIT
t
c(BCKRX)
Cycle time, BCLKR/X BCLKR/X ext 4H ns
t
w(BCKRX)
Pulse duration, BCLKR/X high or BCLKR/X low BCLKR/X ext 2H–1 ns
BCLKR int 9
t
su(BFRH-BCKRL)
Setup time, external BFSR high before BCLKR low
BCLKR ext
0
ns
BCLKR int –1
t
h(BCKRL-BFRH)
Hold time, external BFSR high after BCLKR low
BCLKR ext
5
ns
BCLKR int 10
t
su(BDRV-BCKRL)
Setup time, BDR valid before BCLKR low
BCLKR ext
0
ns
BCLKR int 0
t
h(BCKRL-BDRV)
Hold time, BDR valid after BCLKR low
BCLKR ext
8
ns
BCLKX int 9
t
su(BFXH-BCKXL)
Setup time, external BFSX high before BCLKX low
BCLKX ext
0
ns
BCLKX int 1
t
h(BCKXL-BFXH)
Hold time, external BFSX high after BCLKX low
BCLKX ext
3
ns
t
r(BCKRX)
Rise time, BCLKR/X BCLKR/X ext 8 ns
t
f(BCKRX)
Fall time, BCLKR/X BCLKR/X ext 8 ns
CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, then the timing references of that signal are also inverted.
switching characteristics for McBSP [H=0.5t
c(CO)
]† (see Figure 27 and Figure 28)
PARAMETER MIN MAX UNIT
t
c(BCKRX)
Cycle time, BCLKR/X BCLKR/X int 4H ns
t
w(BCKRXH)
Pulse duration, BCLKR/X high BCLKR/X int D – 1‡D + 1‡ns
t
w(BCKRXL)
Pulse duration, BCLKR/X low BCLKR/X int C – 1‡C + 1‡ns
BCLKR int –2 4 ns
t
d(BCKRH-BFRV)
Delay time, BCLKR high to internal BFSR valid
BCLKR ext
7 13 ns
BCLKX int 0 6
t
d(BCKXH-BFXV)
Delay time, BCLKX high to internal BFSX valid
BCLKX ext
3 14
ns
Disable time, BCLKX high to BDX high impedance following last data
BCLKX int 1 6
t
dis(BCKXH-BDXHZ)
Disable time, BCLKX high to BDX high im edance following last data
bit of transfer
BCLKX ext
7 13
ns
BCLKX int 0 7
t
d(BCKXH-BDXV)
Delay time, BCLKX high to BDX valid
DXENA
§ BCLKX ext 3 14
ns
Delay time, BFSX high to BDX valid
BFSX int 1
2
t
d(BFXH-BDXV)
ONLY applies when in data delay 0 (XDATDLY = 00b) mode
BFSX ext 7 14
ns
CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, then the timing references of that signal are also inverted.
T = BCLKRX period = (1 + CLKGDV) * 2H C = BCLKRX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * 2H when CLKGDV is even D = BCLKRX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * 2H when CLKGDV is even
§
The transmit delay enable (DXENA) and A-bis mode (ABIS) features of the McBSP are not implemented on the TMS320UC5402.
Minimum delay times also represent minimum output hold times.
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FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
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multichannel buffered serial port timing (continued)
Bit(n-1)
(n-2) (n-3)
BCLKR
BFSR (int)
BFSR (ext)
BDR
t
w(BCKRXH)
t
c(BCKRX)
t
w(BCKRXL)
t
d(BCKRH-BFRV)
t
d(BCKRH-BFRV)
t
su(BFRH-BCKRL)
t
h(BCKRL-BFRH)
t
h(BCKRL-BDRV)
t
su(BDRV-BCKRL)
t
r(BCKRX)
t
f(BCKRX)
Figure 27. McBSP Receive Timings
Bit 0 Bit(n-1) (n-2) (n-3)
BCLKX
BFSX (int)
BFSX (ext)
BFSX
BDX
t
c(BCKRX)
t
w(BCKRXH)
t
w(BCKRXL)
t
d(BCKXH-BFXV)
t
su(BFXH-BCKXL)
t
h(BCKXL-BFXH)
t
dis(BCKXH-BDXHZ)
t
d(BFXH-BDXV)
t
d(BCKXH-BDXV)
t
d(BCKXH-BDXV)
(XDATDLY=00b)
t
r(BCKRX)
t
f(BCKRX)
t
d(BCKXH-BFXV)
Figure 28. McBSP Transmit Timings
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multichannel buffered serial port timing (continued)
timing requirements for McBSP general-purpose I/O (see Figure 29)
MIN MAX UNIT
t
su(BGPIO-COH)
Setup time, BGPIOx input mode before CLKOUT high
13 ns
t
h(COH-BGPIO)
Hold time, BGPIOx input mode after CLKOUT high
0 ns
BGPIOx refers to BCLKRx, BFSRx, BDRx, BCLKXx, or BFSXx when configured as a general-purpose input.
switching characteristics for McBSP general-purpose I/O (see Figure 29)
PARAMETER MIN MAX UNIT
t
d(COH-BGPIO)
Delay time, CLKOUT high to BGPIOx output mode
0 7 ns
BGPIOx refers to BCLKRx, BFSRx, BCLKXx, BFSXx, or BDXx when configured as a general-purpose output.
t
su(BGPIO-COH)
t
h(COH-BGPIO)
t
d(COH-BGPIO)
CLKOUT
BGPIOx Input
mode
BGPIOx Output
mode
BGPIOx refers to BCLKRx, BFSRx, BDRx, BCLKXx, or BFSXx when configured as a general-purpose input.
BGPIOx refers to BCLKRx, BFSRx, BCLKXx, BFSXx, or BDXx when configured as a general-purpose output.
Figure 29. McBSP General-Purpose I/O Timings
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TMS320UC5402
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
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multichannel buffered serial port timing (continued)
timing requirements for McBSP as SPI master or slave: [H=0.5t
c(CO)
] CLKSTP = 10b, CLKXP = 0
(see Figure 30)
MASTER SLAVE
MIN MAX MIN MAX
UNIT
t
su(BDRV-BCKXL)
Setup time, BDR valid before BCLKX low 16 2 – 12H ns
t
h(BCKXL-BDRV)
Hold time, BDR valid after BCLKX low 0 5 + 12H ns
t
su(BFXL-BCKXH)
Setup time, BFSX low before BCLKX high 15 ns
t
c(BCKX)
Cycle time, BCLKX 12H 32H ns
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
switching characteristics for McBSP as SPI master or slave: [H=0.5t
c(CO)
] CLKSTP = 10b,
CLKXP = 0
(see Figure 30)
MASTER
SLAVE
PARAMETER
MIN MAX MIN MAX
UNIT
t
h(BCKXL-BFXL)
Hold time, BFSX low after BCLKX low
§
T – 4 T + 5 ns
t
d(BFXL-BCKXH)
Delay time, BFSX low to BCLKX high
C – 6 C + 4 ns
t
d(BCKXH-BDXV)
Delay time, BCLKX high to BDX valid –3 7 6H + 4 10H + 16 ns
t
dis(BCKXL-BDXHZ)
Disable time, BDX high impedance following last data bit from BCLKX low
C – 2 C + 3 ns
t
dis(BFXH-BDXHZ)
Disable time, BDX high impedance following last data bit from BFSX high
2H+ 8 6H + 21 ns
t
d(BFXL-BDXV)
Delay time, BFSX low to BDX valid 4H –3 8H + 21 ns
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
T = BCLKX period = (1 + CLKGDV) * 2H C = BCLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * 2H when CLKGDV is even
§
FSRP = FSXP = 1. As a SPI master, BFSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on BFSX and BFSR is inverted before being used internally. CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
BFSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (BCLKX).
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
BCLKX
BFSX
BDX
BDR
t
su(BDRV-BCLXL)
t
d(BCKXH-BDXV)
t
h(BCKXL-BDRV)
t
dis(BFXH-BDXHZ)
t
dis(BCKXL-BDXHZ)
t
h(BCKXL-BFXL)
t
d(BFXL-BDXV)
t
d(BFXL-BCKXH)
LSB
MSB
t
su(BFXL-BCKXH)
t
c(BCKX)
Figure 30. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0
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TMS320UC5402 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
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multichannel buffered serial port timing (continued)
timing requirements for McBSP as SPI master or slave: [H=0.5t
c(CO)
] CLKSTP = 11b, CLKXP = 0
(see Figure 31)
MASTER SLAVE
MIN MAX MIN MAX
UNIT
t
su(BDRV-BCKXH)
Setup time, BDR valid before BCLKX high 16 2 – 12H ns
t
h(BCKXH-BDRV)
Hold time, BDR valid after BCLKX high 4 5 + 12H ns
t
su(BFXL-BCKXH)
Setup time, BFSX low before BCLKX high 15 ns
t
c(BCKX)
Cycle time, BCLKX 12H 32H ns
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
switching characteristics for McBSP as SPI master or slave: [H=0.5t
c(CO)
] CLKSTP = 11b,
CLKXP = 0
(see Figure 31)
MASTER
SLAVE
PARAMETER
MIN MAX MIN MAX
UNIT
t
h(BCKXL-BFXL)
Hold time, BFSX low after BCLKX low
§
C –4 C + 5 ns
t
d(BFXL-BCKXH)
Delay time, BFSX low to BCLKX high
T – 6 T + 4 ns
t
d(BCKXL-BDXV)
Delay time, BCLKX low to BDX valid 4 7 6H + 4 10H + 16 ns
t
dis(BCKXL-BDXHZ)
Disable time, BDX high impedance following last data bit from BCLKX low
0 6 6H +7 10H + 21 ns
t
d(BFXL-BDXV)
Delay time, BFSX low to BDX valid D – 2 D + 4 4H –3 8H + 21 ns
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
T = BCLKX period = (1 + CLKGDV) * 2H C = BCLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * 2H when CLKGDV is even D = BCLKX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * 2H when CLKGDV is even
§
FSRP = FSXP = 1. As a SPI master, BFSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on BFSX and BFSR is inverted before being used internally. CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
BFSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (BCLKX).
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
BCLKX
BFSX
BDX
BDR
t
d(BFXL-BCKXH)
t
dis(BCKXL-BDXHZ)
t
d(BCKXL-BDXV)
t
h(BCKXH-BDRV)
t
su(BDRV-BCKXH)
t
d(BFXL-BDXV)
t
h(BCKXL-BFXL)
LSB
MSB
t
su(BFXL-BCKXH)
t
c(BCKX)
Figure 31. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0
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TMS320UC5402
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
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multichannel buffered serial port timing (continued)
timing requirements for McBSP as SPI master or slave: [H=0.5t
c(CO)
] CLKSTP = 10b, CLKXP = 1
(see Figure 32)
MASTER SLAVE
MIN MAX MIN MAX
UNIT
t
su(BDRV-BCKXH)
Setup time, BDR valid before BCLKX high 16 2 – 12H ns
t
h(BCKXH-BDRV)
Hold time, BDR valid after BCLKX high 4 5 + 12H ns
t
su(BFXL-BCKXL)
Setup time, BFSX low before BCLKX low 10 ns
t
c(BCKX)
Cycle time, BCLKX 12H 32H ns
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
switching characteristics for McBSP as SPI master or slave: [H=0.5t
c(CO)
] CLKSTP = 10b,
CLKXP = 1
†‡
(see Figure 32)
MASTER SLAVE
PARAMETER
MIN MAX MIN MAX
UNIT
t
h(BCKXH-BFXL)
Hold time, BFSX low after BCLKX high
§
T – 4 T + 5 ns
t
d(BFXL-BCKXL)
Delay time, BFSX low to BCLKX low
D – 6 D + 4 ns
t
d(BCKXL-BDXV)
Delay time, BCLKX low to BDX valid – 3 7 6H + 4 10H + 16 ns
t
dis(BCKXH-BDXHZ)
Disable time, BDX high impedance following last data bit from BCLKX high
D – 2 D + 3 ns
t
dis(BFXH-BDXHZ)
Disable time, BDX high impedance following last data bit from BFSX high
2H + 7 6H + 21 ns
t
d(BFXL-BDXV)
Delay time, BFSX low to BDX valid 4H – 3 8H + 21 ns
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
T = BCLKX period = (1 + CLKGDV) * 2H D = BCLKX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * 2H when CLKGDV is even
§
FSRP = FSXP = 1. As a SPI master, BFSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on BFSX and BFSR is inverted before being used internally. CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
BFSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (BCLKX).
t
su(BFXL-BCKXL)
t
h(BCKXH-BDRV)
t
dis(BFXH-BDXHZ)
t
dis(BCKXH-BDXHZ)
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
BCLKX
BFSX
BDX
BDR
t
d(BFXL-BCKXL)
t
d(BFXL-BDXV)
t
d(BCKXL-BDXV)
t
su(BDRV-BCKXH)
t
h(BCKXH-BFXL)
LSB
MSB
t
c(BCKX)
Figure 32. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1
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multichannel buffered serial port timing (continued)
timing requirements for McBSP as SPI master or slave: [H=0.5t
c(CO)
] CLKSTP = 11b, CLKXP = 1
(see Figure 33)
MASTER SLAVE
MIN MAX MIN MAX
UNIT
t
su(BDRV-BCKXL)
Setup time, BDR valid before BCLKX low 16 – 12H ns
t
h(BCKXL-BDRV)
Hold time, BDR valid after BCLKX low 0 5 + 12H ns
t
su(BFXL-BCKXL)
Setup time, BFSX low before BCLKX low 10 ns
t
c(BCKX)
Cycle time, BCLKX 12H 32H ns
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
switching characteristics for McBSP as SPI master or slave: [H=0.5t
c(CO)
] CLKSTP = 11b,
CLKXP = 1
†‡
(see Figure 33)
MASTER
SLAVE
PARAMETER
MIN MAX MIN MAX
UNIT
t
h(BCKXH-BFXL)
Hold time, BFSX low after BCLKX high
§
D – 4 D + 5 ns
t
d(BFXL-BCKXL)
Delay time, BFSX low to BCLKX low
T – 6 T + 4 ns
t
d(BCKXH-BDXV)
Delay time, BCLKX high to BDX valid – 3 7 6H + 4 10H + 16 ns
t
dis(BCKXH-BDXHZ)
Disable time, BDX high impedance following last data bit from BCLKX high
0 6 6H +7 10H + 21 ns
t
d(BFXL-BDXV)
Delay time, BFSX low to BDX valid C – 2 C + 4 4H – 3 8H + 21 ns
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
T = BCLKX period = (1 + CLKGDV) * 2H C = BCLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * 2H when CLKGDV is even D = BCLKX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * 2H when CLKGDV is even
§
FSRP = FSXP = 1. As a SPI master, BFSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on BFSX and BFSR is inverted before being used internally. CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
BFSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (BCLKX).
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
BCLKX
BFSX
BDX
BDR
t
d(BFXL-BCKXL)
t
su(BDRV-BCKXL)
t
dis(BCKXH-BDXHZ)
t
h(BCKXH-BFXL)
t
d(BCKXH-BDXV)
t
h(BCKXL-BDRV)
t
d(BFXL-BDXV)
LSB
MSB
t
su(BFXL-BCKXL)
t
c(BCKX)
Figure 33. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1
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FIXED-POINT DIGITAL SIGNAL PROCESSOR
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HPI-8 timing
switching characteristics over recommended operating conditions†‡§¶ [H = 0.5t
c(CO)
]
(see Figure 34, Figure 35, Figure 36, and Figure 37)
PARAMETER MIN MAX UNIT
t
en(DSL-HD)
Enable time, HD driven from DS low 5 21 ns
Case 1a: Memory accesses when DMAC is active in 16-bit mode and t
w(DSH)
< 18H
18H + 21
Case 1b: Memory accesses when DMAC is active in 16-bit mode and t
w(DSH)
18H
21
Delay time, DS low to HDx valid for
Case 1c: Memory access when DMAC is active in 32-bit mode and t
w(DSH)
< 26H
26H + 21
t
d(DSL-HDV1)
Delay time, DS low to HDx valid for
first byte of an HPI read
Case 1d: Memory access when DMAC is active in 32-bit mode and t
w(DSH)
26H
21
ns
Case 2a: Memory accesses when DMAC is inactive and t
w(DSH)
< 10H
10H + 21
Case 2b: Memory accesses when DMAC is inactive and t
w(DSH)
10H
21
Case 3: Register accesses 21
t
d(DSL-HDV2)
Delay time, DS low to HDx valid for second byte of an HPI read 21 ns
t
h(DSH-HDV)R
Hold time, HDx valid after DS high, for a HPI read 5 9 ns
t
v(HYH-HDV)
Valid time, HDx valid after HRDY high 17
t
d(DSH-HYL)
Delay time, DS high to HRDY low (see Note 1) 21 ns
Case 1a: Memory accesses when DMAC is active in 16-bit mode
18H + 21 ns
Case 1b: Memory accesses when DMAC is active in 32-bit mode
26H + 21
ns
t
d(DSH-HYH)
Delay time, DS high to HRDY high
Case 2: Memory accesses when DMAC is inactive
10H + 21
Case 3: Write accesses to HPIC register (see Note 2)
6H + 21
ns
t
d(HCS-HRDY)
Delay time, HCS low/high to HRDY low/high
13 ns
t
d(COH-HYH
) Delay time, CLKOUT high to HRDY high 4 ns
t
d(COH-HTX)
Delay time, CLKOUT high to HINT change 5 ns
t
d(COH-GPIO)
Delay time, CLKOUT high to HDx output change. HDx is configured as a general-purpose output.
8 ns
NOTES: 1. The HRDY output is always high when the HCS input is high, regardless of DS timings.
2. This timing applies when writing a one to the DSPINT bit or HINT bit of the HPIC register. All other writes to the HPIC occur asynchronously, and do not cause HRDY to be deasserted.
DS refers to the logical OR of HCS
, HDS1, and HDS2.
HDx refers to any of the HPI data bus pins (HD0, HD1, HD2, etc.).
§
DMAC stands for direct memory access (DMA) controller. The HPI-8 shares the internal DMA bus with the DMAC, thus HPI-8 access times are affected by DMAC activity.
GPIO refers to the HD pins when they are configured as general-purpose input/outputs.
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SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
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HPI-8 timing (continued)
timing requirements†‡§ (see Figure 34, Figure 35, Figure 36, and Figure 37)
MIN MAX UNIT
t
su(HBV-DSL)
Setup time, HBIL valid before DS low 5 ns
t
h(DSL-HBV)
Hold time, HBIL valid after DS low 5 ns
t
su(HSL-DSL)
Setup time, HAS low before DS low 5 ns
t
w(DSL)
Pulse duration, DS low 20 ns
t
w(DSH)
Pulse duration, DS high 10 ns
t
su(HDV-DSH)
Setup time, HDx valid before DS high, HPI write 12 ns
t
h(DSH-HDV)W
Hold time, HDx valid after DS high, HPI write 4 ns
t
su(GPIO-COH)
Setup time, HDx input valid before CLKOUT high, HDx configured as general-purpose input 7 ns
t
h(GPIO-COH)
Hold time, HDx input valid after CLKOUT high, HDx configured as general-purpose input 0 ns
DS refers to the logical OR of HCS, HDS1, and HDS2.
HDx refers to any of the HPI data bus pins (HD0, HD1, HD2, etc.).
§
GPIO refers to the HD pins when they are configured as general-purpose input/outputs.
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TMS320UC5402
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
59
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
HPI-8 timing (continued)
Valid
t
su(HSL-DSL)
Valid
t
su(HBV-DSL)
t
su(HBV-DSL)
HAS
HBIL
t
h(DSL-HBV)
t
h(DSL-HBV)
t
d(DSH-HYH)
t
w(DSL)
t
d(DSL-HDV1)
t
v(HYH-HDV)
Valid Valid
Valid
t
d(COH-HYH)
Valid
t
w(DSH)
t
d(DSH-HYL)
t
h(DSH-HDV)R
t
h(DSH-HDV)W
Valid
t
su(HDV-DSH)
t
d(DSL-HDV2)
t
en(DSL-HD)
HCS
HDS
HRDY
HD READ
Valid
HD WRITE
CLKOUT
Second Byte First Byte Second Byte
HAD
HAD refers to HCNTL0, HCNTL1, and HR/W.
When HAS
is not used (HAS always high)
Figure 34. Using HDS to Control Accesses (HCS Always Low)
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TMS320UC5402 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
60
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
HPI-8 timing (continued)
Second Byte
First Byte
Second Byte
t
d(HCS-HRDY)
HCS
HDS
HRDY
Figure 35. Using HCS to Control Accesses
HINT
CLKOUT
t
d(COH-HTX)
Figure 36. HINT Timing
GPIOx Input Mode
CLKOUT
t
h(GPIO-COH)
GPIOx Output Mode
t
su(GPIO-COH)
t
d(COH-GPIO)
GPIOx refers to HD0, HD1, HD2, ...HD7, when the HD bus is configured for general-purpose input/output (I/O).
Figure 37. GPIOx† Timings
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TMS320UC5402
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
61
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MECHANICAL DATA
PGE (S-PQFP-G144) PLASTIC QUAD FLATPACK
4040147/B 10/94
0,27
72
0,17
37
73
0,13 NOM
0,25
0,75 0,45
0,05 MIN
36
Seating Plane
Gage Plane
108
109
144
SQ
SQ
22,20 21,80
1
19,80
17,50 TYP
20,20
1,35
1,45
1,60 MAX
M
0,08
0°–7°
0,08
0,50
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice. C. Falls within JEDEC MO-136
Thermal Resistance Characteristics
PARAMETER
°C/W
R
ΘJA
56
R
ΘJC
5
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TMS320UC5402 FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS096A – APRIL 1999 – REVISED DECEMBER 1999
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MECHANICAL DATA
GGU (S-PBGA-N144) PLASTIC BALL GRID ARRAY PACKAGE
0,80
0,10
M
0,08
0,80
9,60 TYP
12 1310 118967
N M
K
L
J
H
42 3
F
E
C B
D
A
1
G
5
Seating Plane
4073221/A 11/96
SQ
11,90
12,10
0,95
0,35
0,45
0,45
0,55
0,85
0,08
0,12
1,40 MAX
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice. C. MicroStar BGA configuration
Thermal Resistance Characteristics
PARAMETER
°C/W
R
ΘJA
38
R
ΘJC
5
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MicroStar BGA is a trademark of Texas Instruments Incorporated.
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